An omnidirectional heat conduction plate structure
By using a combination of staggered partitions and thermistors in an omnidirectional vapor chamber, adaptive working fluid distribution and heat management are achieved, solving the problem of uneven working fluid distribution in multi-chip modules in traditional vapor chambers, and improving temperature uniformity performance and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGZHOU YIBOX TECH CO LTD
- Filing Date
- 2026-06-05
- Publication Date
- 2026-07-10
AI Technical Summary
Traditional vapor chambers in multi-chip modules suffer from uneven distribution of working fluid due to local hot spots, resulting in dryness in high-temperature areas and condensation retention in low-temperature areas, leading to decreased temperature uniformity. Existing technologies increase system complexity and failure risk.
The omnidirectional heat exchanger structure, which uses alternating horizontal and vertical baffles, combined with a thermistor to achieve passive control, automatically adjusts the opening and closing of the connecting holes according to the temperature difference of the sub-cavities, and prioritizes the flow of condensate to the low-temperature zone, forming a dual circulation of steam for positive heat transfer and liquid for reverse replenishment.
It significantly improves the temperature uniformity and reliability under multi-point heat sources, avoids the complexity of electronically controlled valves, has a simple structure, low cost, and strong anti-interference ability, and realizes rapid heat diffusion and uniform transfer.
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Figure CN122360198A_ABST