sensor module

Abstract

A sensor module includes: a base and a cover that constitute a case; a sensor substrate disposed in the case and on which a first sensor is mounted; two or more fixing members that fix the sensor substrate to the base; and a filling member that covers the sensor substrate and the two or more fixing members and is filled between the sensor substrate and the case.

Description

Technical Field

[0001] This invention relates to sensor modules. Background Technology

[0002] A sensor module equipped with an inertial sensor is known, wherein the inertial sensor detects the inertia based on a predetermined detection axis.

[0003] For example, Patent Document 1 describes a sensor unit comprising: a sensor module configured to include a substrate on which an inertial sensor is mounted and an inner housing on which the substrate is mounted; and an outer housing for housing the sensor module. A recess is formed in the inner housing, and in a top view taken from the thickness direction of the substrate, the inertial sensor is disposed in the area overlapping the recess. A filling member fills the space formed by the substrate and the recess, and the sensor module is joined to the bottom wall of the outer housing via a joining member.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent document 1: Japanese Patent Application Publication No. 2017-20829.

[0007] The technical problem that the invention aims to solve

[0008] When the substrate with the inertial sensor is fixed to the inner housing as described above via the filling component, there is a concern that the substrate may be warped due to external environmental factors such as heat and humidity. Summary of the Invention

[0009] One aspect of the sensor module involved in this invention comprises: The base and the cover together constitute a box. A sensor substrate is disposed inside the housing and is equipped with a first sensor; Two or more fixing components are used to fix the sensor substrate to the base; A filling component covers the sensor substrate and the two or more fixing components, and fills the space between the sensor substrate and the housing. Attached Figure Description

[0010] Figure 1 This is a schematic perspective view of the sensor module involved in this embodiment.

[0011] Figure 2 This is a schematic perspective view of the sensor module involved in this embodiment.

[0012] Figure 3 This is a schematic perspective view of the sensor module involved in this embodiment.

[0013] Figure 4 This is a schematic perspective view of the sensor module involved in this embodiment.

[0014] Figure 5 This is a schematic top view illustrating the sensor module involved in this embodiment.

[0015] Figure 6 This is a schematic bottom view of the sensor module involved in this embodiment.

[0016] Figure 7 This is a schematic cross-sectional view of the sensor module involved in this embodiment.

[0017] Figure 8 This is a schematic cross-sectional view of the sensor module involved in this embodiment.

[0018] Figure 9 This is a perspective view schematically illustrating a variation of the sensor module involved in this embodiment.

[0019] Explanation of reference numerals in the attached figures

[0020] 10. Housing; 11. Base; 11a. Opening; 12. Bottom; 12a. First surface; 12b. Second surface; 13. Screw hole; 14. Through-hole; 15. Side wall; 16. 17. Screw hole; 18. Cover; 19. Screw; 20. Sensor substrate; 21. First surface; 22. Second surface; 23. First side surface; 24. Second side surface; 25. Protrusion; 26. Notch; 27. Screw hole; 28. Third side surface; 29. ​​Protrusion; 30. Fixing component; 30a. First Fixed component; 30b, second fixed component; 30c, third fixed component; 30d, fourth fixed component; 40, connector; 50x, first X-axis angular velocity sensor; 51x, second X-axis angular velocity sensor; 52y, first Y-axis angular velocity sensor; 53y, second Y-axis angular velocity sensor; 54z, first Z-axis angular velocity sensor; 55z, second Z-axis angular velocity sensor; 60, circuit element; 70, accelerometer; 80, filling component; 100, 200, sensor module. Detailed Implementation

[0021] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the embodiments described below are not intended to unduly limit the scope of the invention as defined in the claims. Furthermore, not all of the configurations described below are essential elements of the present invention.

[0022] 1. Sensor Module

[0023] 1.1. Composition

[0024] First, the sensor module involved in this embodiment will be described with reference to the accompanying drawings. Figures 1-4 This is a schematic perspective view of the sensor module 100 involved in this embodiment. Figure 5 This is a schematic top view of the sensor module 100 involved in this embodiment. Figure 6 This is a schematic bottom view of the sensor module 100 involved in this embodiment. Figure 7 as well as Figure 8 This is a schematic cross-sectional view of the sensor module 100 according to this embodiment. It should be noted that... Figures 1 to 8 The diagram illustrates the X-axis, Y-axis, and Z-axis as three mutually orthogonal axes.

[0025] Sensor module 100 is an inertial measurement unit (IMU) for detecting the posture and movement of mounted objects such as cars and robots. The mounted object is not limited to moving bodies such as cars and robots; for example, it can also be a structure such as a bridge, overpass, or railway. When sensor module 100 is installed on a building, it can be used as a structural health monitoring system to check the building's structural integrity.

[0026] like Figures 1 to 8 As shown, for example, the sensor module 100 includes: a housing 10, a sensor substrate 20, a fixing component 30, a connector 40, a first X-axis angular velocity sensor 50x, a second X-axis angular velocity sensor 51x, a first Y-axis angular velocity sensor 52y, a second Y-axis angular velocity sensor 53y, a first Z-axis angular velocity sensor 54z, a second Z-axis angular velocity sensor 55z, a circuit element 60, an acceleration sensor 70, and a filling component 80.

[0027] It should be noted that, for convenience, in Figure 2 The illustration of the cover 18 of the box 10 is omitted. Figure 3 The illustrations of the cover 18 and the filling component 80 are omitted. Figure 4 The diagram omits the components of the housing 10 except for the base 11. Figure 5 The illustrations of the cover 18 and the filling component 80 are omitted. Figure 6 The sensor substrate 20 and other components other than those mounted on the sensor substrate 20 are omitted from the illustration.

[0028] The housing 10 houses the sensor substrate 20. The housing 10 is made of, for example, aluminum. Therefore, the housing 10 has high rigidity. The surface of the housing 10 can be anodized. Therefore, the housing 10 has insulation properties. It should be noted that the material of the housing 10 is not particularly limited; for example, it can be made of metals such as titanium, magnesium, and stainless steel, ceramics such as alumina and titanium dioxide, or resin.

[0029] like Figure 1 As shown, for example, the box 10 has a box-like shape. For example, the box 10 has a generally rectangular shape. The box 10 has a base 11 and a cover 18. The base 11 and the cover 18 constitute the box 10.

[0030] like Figure 3 As shown, the base 11 has an opening 11a where the sensor substrate 20 is located. In the illustrated example, the opening 11a is open in the +Z axis direction. The base 11 has a concave shape.

[0031] like Figure 4 As shown, the base 11 has a bottom 12 and sidewalls 15. Screw holes 13 for fixing the sensor substrate 20 to the base 11 are formed in the bottom 12. Multiple screw holes 13 are formed. Furthermore, a through portion 14 is formed in the bottom 12, and a connector 40 mounted on the sensor substrate 20 is disposed in the through portion 14. The sidewalls 15 stand upright from the edge of the bottom 12. Screw holes 16 for fixing the cover 18 to the base 11 are formed on the upper surface of the sidewalls 15. In the illustrated example, viewed from the Z-axis direction, one screw hole 16 is formed at each diagonal of the base 11. Furthermore, screw holes 17 for fixing the sensor module 100 to the mounted object are formed on the upper surface of the sidewalls 15. In the illustrated example, viewed from the Z-axis direction, one screw hole 17 is formed at each diagonal of the base 11. The diagonals with screw holes 17 are different from the diagonals with screw holes 16. The diameter of screw hole 17 is, for example, larger than the diameters of screw holes 13 and 16. It should be noted that the bottom 12 includes: a first surface 12a, on which screw holes 13 are formed and where the sensor substrate 20 is disposed; and a second surface 12b, which is recessed in the -Z axis direction compared to the first surface 12a. That is, the bottom 12 has a first surface 12a and a second surface 12b with different depths. Figure 7 As shown, a second Z-axis angular velocity sensor 55z and other components are disposed between the second surface 12b of the bottom 12 and the second surface 22 of the sensor substrate 20.

[0032] The cover 18 is mounted on the side wall 15 of the base 11. For example... Figure 1 As shown, the cover 18 has, for example, a plate-like shape. The cover 18 seals the opening 11a of the base 11. The cover 18 is positioned opposite the sensor substrate 20 via a filling member 80. In the illustrated example, the cover 18 is secured to the base 11 by screws 19. The screws 19 are inserted... Figure 4The screw hole 16 is shown. Viewed from the Z-axis direction, the screw 19 is located diagonally opposite the cover 18. This allows the cover 18 to be securely fixed to the base 11. It should be noted that the connection method between the cover 18 and the base 11 is not particularly limited; it can be welding or bonding based on the filling component 80.

[0033] like Figure 3 As shown, the sensor substrate 20 is disposed within the housing 10. Viewed from the Z-axis direction, the sensor substrate 20 has a generally rectangular shape. The sensor substrate 20 is, for example, a circuit board. The sensor substrate 20 is, for example, a multilayer glass epoxy board (a glass epoxy board is a substrate obtained by impregnating epoxy resin into glass fiber cloth) or a multilayer ceramic substrate.

[0034] like Figure 5 as well as Figure 6 As shown, the sensor substrate 20 has a first surface 21, a second surface 22, a first side surface 23, and a second side surface 24. The first surface 21 and the second surface 22 are adjacent to each other. In the illustrated example, the first surface 21 faces the +Z axis direction. The second surface 22 faces the -Z axis direction. The first side surface 23 and the second side surface 24 connect the first surface 21 and the second surface 22. The second side surface 24 faces a direction orthogonal to the first side surface 23. In the illustrated example, the first side surface 23 faces the -X axis direction. The second side surface 24 faces the +Y axis direction.

[0035] The sensor substrate 20 has a protrusion 25 connecting a first side surface 23 and a second side surface 24. The protrusion 25 protrudes further in the -X-axis direction than the first side surface 23. Furthermore, the protrusion 25 protrudes further in the +Y-axis direction than the second side surface 24. Figure 5 As shown, viewed from the Z-axis direction, the protrusion 25 is located diagonally opposite on the sensor substrate 20 along direction D1. In the illustrated example, direction D1 is inclined at 45° relative to both the X-axis and Y-axis directions. Furthermore, the protrusion 25 contacts the first surface 12a of the bottom 12 of the base 11. A screw hole 27 is provided in the protrusion 25. A screw hole 13 is provided on the first surface 12a of the bottom 12 of the base 11, where the protrusion 25 contacts.

[0036] Viewed from the Z-axis, the sensor substrate 20 has a notch 26 diagonally opposite to the direction D2, which intersects direction D1. In the illustrated example, direction D2 is orthogonal to direction D1. One notch 26 is provided diagonally opposite to the direction D2 of the sensor substrate 20. The notch 26 is provided, for example, along direction D1. The notch 26 is located near the screw hole 17. The side of the sensor substrate 20 forming the notch 26 faces the screw hole 17.

[0037] like Figure 6As shown, screw holes 27 for fixing the sensor substrate 20 to the base 11 are formed on the sensor substrate 20. The screw holes 27 are connected to the base 11... Figure 4 The base 11 shown has screw holes 13 that are interconnected. Multiple screw holes 27 are formed. One of the multiple screw holes 27 is formed in the protrusion 25. Figure 6 In the example shown, when viewed from the Z-axis direction, the screw hole 27 is located diagonally on direction D1 and diagonally on direction D2 of the sensor substrate 20.

[0038] The fixing member 30 secures the sensor substrate 20 to the base 11. The fixing member 30 passes through the sensor substrate 20. The fixing member 30 is inserted into the screw hole 27 formed in the sensor substrate 20 and the screw hole 13 formed in the base 11. The fixing member 30 is, for example, a screw. The fixing member 30 threads the sensor substrate 20 onto the base 11.

[0039] The fixing component 30 is provided with multiple screw holes 13, 27 corresponding to the multiple screw holes 13, 27. Figure 5 In the example shown, four fixing components 30 are provided, namely, a first fixing component 30a, a second fixing component 30b, a third fixing component 30c, and a fourth fixing component 30d. Viewed from the Z-axis, the first fixing component 30a and the second fixing component 30b are arranged diagonally on direction D1 of the sensor substrate 20. The first fixing component 30a is inserted into the screw hole 27 formed in the protrusion 25. Viewed from the Z-axis, the third fixing component 30c and the fourth fixing component 30d are arranged diagonally on direction D2 of the sensor substrate 20. It should be noted that the number of fixing components 30 can be two or more, and there is no particular limitation.

[0040] like Figure 7 As shown, connector 40 is disposed on the second surface 22 of sensor substrate 20. Connector 40 is, for example, a plug-type connector. Connector 40 is exposed to the outside of sensor module 100 via a through portion 14 formed in base 11. Thus, electrical connection between sensor module 100 and external device (not shown) is facilitated.

[0041] like Figure 5 as well as Figure 6As shown, a first X-axis angular velocity sensor 50x, a second X-axis angular velocity sensor 51x, a first Y-axis angular velocity sensor 52y, a second Y-axis angular velocity sensor 53y, a first Z-axis angular velocity sensor 54z, and a second Z-axis angular velocity sensor 55z are mounted on a sensor substrate 20. The angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z are encapsulated surface mount components. Therefore, they possess higher mechanical strength compared to mounting components with exposed components. Furthermore, mounting the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z to the sensor substrate 20 is facilitated.

[0042] The first X-axis angular velocity sensor 50x, the second X-axis angular velocity sensor 51x, the first Y-axis angular velocity sensor 52y, the second Y-axis angular velocity sensor 53y, the first Z-axis angular velocity sensor 54z, and the second Z-axis angular velocity sensor 55z, for example, have sensor elements composed of crystal resonant elements. The angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z are basically identical in configuration, except that their vibration frequencies differ to suppress mutual interference. The detection axes are arranged in a mutually orthogonal orientation toward the X-axis, Y-axis, and Z-axis. It should be noted that the sensor elements may not be crystal resonant elements, but may also be silicon MEMS (Micro Electro Mechanical Systems) resonant elements. It should also be noted that the vibration frequencies of the sensor elements of the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z may all be different, or some may be the same. For example, the vibration frequency of the sensor element of the first X-axis angular velocity sensor 50x may be different from that of the second X-axis angular velocity sensor 51x, the vibration frequency of the sensor element of the first Y-axis angular velocity sensor 52y may be different from that of the second Y-axis angular velocity sensor 53y, and the vibration frequency of the sensor element of the first Z-axis angular velocity sensor 54z may be different from that of the second Z-axis angular velocity sensor 55z. Alternatively, the vibration frequencies of the sensor elements of angular velocity sensors 50x and 54z may be the same.

[0043] A first X-axis angular velocity sensor 50x and a second X-axis angular velocity sensor 51x are disposed on a first side surface 23 of the sensor substrate 20. In the first side surface 23, the X-axis angular velocity sensors 50x and 51x are arranged in the Y-axis direction. The X-axis angular velocity sensors 50x and 51x are located between the sensor substrate 20 and the side wall 15 of the base 11. The X-axis angular velocity sensors 50x and 51x are spaced apart from the side wall 15. Figure 7As shown, the X-axis angular velocity sensors 50x and 51x are longer in the Z-axis direction than the sensor substrate 20 and protrude from the top and bottom sides of the sensor substrate 20. The X-axis angular velocity sensors 50x and 51x detect the angular velocity around the X-axis.

[0044] like Figure 5 as well as Figure 6 As shown, a first Y-axis angular velocity sensor 52y and a second Y-axis angular velocity sensor 53y are disposed on the second side surface 24 of the sensor substrate 20. In the second side surface 24, the Y-axis angular velocity sensors 52y and 53y are arranged in the X-axis direction. The Y-axis angular velocity sensors 52y and 53y are located between the sensor substrate 20 and the sidewall 15 of the base 11. The Y-axis angular velocity sensors 52y and 53y are spaced apart from the sidewall 15. The Y-axis angular velocity sensors 52y and 53y are longer than the sensor substrate 20 in the Z-axis direction and protrude from the upper and lower sides of the sensor substrate 20. The Y-axis angular velocity sensors 52y and 53y detect the angular velocity about the Y-axis.

[0045] like Figure 5 As shown, a first Z-axis angular velocity sensor 54z is disposed on the first surface 21 of the sensor substrate 20. The first Z-axis angular velocity sensor 54z is located between the sensor substrate 20 and the cover 18. The first Z-axis angular velocity sensor 54z is spaced apart from the cover 18. Figure 6 As shown, a second Z-axis angular velocity sensor 55z is disposed on the second surface 22 of the sensor substrate 20. The second Z-axis angular velocity sensor 55z is located between the sensor substrate 20 and the bottom 12 of the base 11. The second Z-axis angular velocity sensor 55z is spaced apart from the bottom 12. Viewed from the Z-axis direction, the Z-axis angular velocity sensors 54z and 55z overlap each other, for example. The Z-axis angular velocity sensors 54z and 55z detect the angular velocity about the Z-axis.

[0046] like Figure 5 As shown, circuit element 60 is mounted on sensor substrate 20. Circuit element 60 is disposed on the first surface 21 of sensor substrate 20. Circuit element 60 is electrically connected to angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z via sensor substrate 20. Circuit element 60 is, for example, a Microcontroller Unit (MCU). Circuit element 60 uniformly controls the various parts of sensor module 100. Specifically, circuit element 60 has control circuitry for driving angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z, and interface circuitry for communicating with external devices.

[0047] The control circuit of circuit element 60 independently controls the driving of angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z, and independently detects the angular velocities around the X-axis, Y-axis, and Z-axis based on the detection signals output from the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z. The control circuit averages the detection signals output from the first X-axis angular velocity sensor 50x and the second X-axis angular velocity sensor 51x to detect the angular velocity around the X-axis. Similarly, the control circuit averages the detection signals output from the first Y-axis angular velocity sensor 52y and the second Y-axis angular velocity sensor 53y to detect the angular velocity around the Y-axis. Finally, the control circuit averages the detection signals output from the first Z-axis angular velocity sensor 54z and the second Z-axis angular velocity sensor 55z to detect the angular velocity around the Z-axis.

[0048] The interface circuit of circuit element 60 transmits and receives signals, and can receive commands from external devices or output the detected angular velocity and acceleration to external devices. The communication method used as the interface circuit is not particularly limited; for example, SPI (Serial Peripheral Interface) communication can be used. SPI communication is a suitable method for connecting multiple sensors. Because SPI communication can output all signals related to angular velocity and acceleration from a single pin, it can reduce the number of pins in sensor module 100.

[0049] An accelerometer 70 is mounted on a sensor substrate 20. Multiple accelerometers 70 may be provided. In the illustrated example, four accelerometers 70 are provided. Two of the four accelerometers 70 are disposed on the first surface 21 of the sensor substrate 20. The other two accelerometers 70 are disposed on the second surface 22 of the sensor substrate 20.

[0050] Accelerometer 70 is a 3-axis accelerometer capable of independently detecting acceleration in the X-axis, Y-axis, and Z-axis directions. Multiple accelerometers 70 each have three sensor elements packaged and housed within the package. These three sensor elements are, for example, sensor elements for detecting acceleration in the X-axis, Y-axis, and Z-axis directions, respectively. The three sensor elements are, for example, MEMS vibration elements. The accelerometer 70 is electrically connected to the sensor substrate 20 via connection terminals disposed in the package.

[0051] It should be noted that, in addition to the aforementioned angular velocity sensors 50x, 51x, 52y, 53y, 54z, 55z, circuit element 60, and acceleration sensor 70, multiple electronic components may also be mounted on the sensor substrate 20.

[0052] like Figure 2 as well as Figure 7 As shown, the filling component 80 is housed within the housing 10. The filling component 80 fills the opening 11a of the base 11. The filling component 80 fills the space between the sensor substrate 20 and the housing 10. The filling component 80 is located between the first surface 21 of the sensor substrate 20 and the cover 18, between the second surface 22 of the sensor substrate 20 and the bottom 12 of the base 11, and between the side surface of the sensor substrate 20 and the side wall 15 of the base 11. In the filling component 80, the thickness of the portion between the first surface 21 and the cover 18 can be the same as the thickness of the portion between the second surface 22 and the bottom 12.

[0053] The filling component 80 is located between the first X-axis angular velocity sensor 50x and the side wall 15, between the second X-axis angular velocity sensor 51x and the side wall 15, between the first Y-axis angular velocity sensor 52y and the side wall 15, between the second Y-axis angular velocity sensor 53y and the side wall 15, between the first Z-axis angular velocity sensor 54z and the cover 18, and between the second Z-axis angular velocity sensor 55z and the bottom 12.

[0054] The filling component 80 covers the sensor substrate 20. The filling component 80 also covers the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z. Specifically, the filling component 80 covers the entire first X-axis angular velocity sensor 50x, the entire second X-axis angular velocity sensor 51x, the entire first Y-axis angular velocity sensor 52y, the entire second Y-axis angular velocity sensor 53y, the entire first Z-axis angular velocity sensor 54z, and the entire second Z-axis angular velocity sensor 55z. In other words, the filling component 80 covers the angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z without gaps. The filling component 80 covers the entire area of ​​the first X-axis angular velocity sensor 50x except for the area mounted on the sensor substrate 20. Similarly, the filling component 80 covers the entire area of ​​the angular velocity sensors 51x, 52y, 53y, 54z, and 55z except for their mounting areas. The filling component 80 also covers the circuit element 60 and the acceleration sensor 70.

[0055] like Figure 2 as well as Figure 8 As shown, the filling member 80 covers the fixing member 30. Specifically, the filling member 80 covers the entire fixing member 30. In other words, the filling member 80 covers the fixing member 30 without any gaps. Figure 8In the example shown, the filling component 80 covers the entire area of ​​the fixing component 30 except for the area where the fixing component 30 contacts the sensor substrate 20 and the area where the fixing component 30 contacts the base 11.

[0056] The filler component 80 is, for example, a potting material. The filler component 80 is, for example, made of a rigid material with low hygroscopicity and a small coefficient of thermal expansion. Specifically, the filler component 80 is made of a thermosetting epoxy resin adhesive material. The hardness of the filler component 80 is, for example, measured to be 80D or higher, preferably 90D or higher, using a type D hardness tester according to JIS 7215-1986. It should be noted that the filler component 80 can also be a filler component obtained by containing various fillers in the epoxy resin adhesive material. Therefore, the hardness and coefficient of thermal expansion of the filler component 80 can be easily adjusted by using fillers.

[0057] 1.2. Manufacturing Method

[0058] As a method for manufacturing the sensor module 100, firstly, as Figure 4 As shown, prepare base 11. Next, as... Figure 3 As shown, the sensor substrate 20, which houses angular velocity sensors 50x, 51x, 52y, 53y, 54z, and 55z, is fixed to the base 11 by the fixing component 30. Next, as... Figure 2 As shown, the filling component 80 is filled into the opening 11a of the base 11 to embed the sensor substrate 20 and the fixing component 30. Next, the filling component 80 is cured by heat treatment. Since the sensor substrate 20 is fixed to the base 11 by multiple fixing components 30, deformation of the sensor substrate 20 caused by stress during the curing of the filling component 80 can be reduced. Next, as... Figure 1 As shown, the cover 18 is fixed to the base 11 by screws 19.

[0059] Through the above processes, sensor module 100 can be manufactured.

[0060] 1.3. Effects

[0061] The sensor module 100 includes: a base 11 and a cover 18, forming a housing 10; a sensor substrate 20 disposed within the housing 10, and equipped with a first Z-axis angular velocity sensor 54z serving as the first sensor; two or more fixing members 30 that fix the sensor substrate 20 to the base 11; and a filling member 80 that covers the sensor substrate 20 and the two or more fixing members 30, and fills the space between the sensor substrate 20 and the housing 10. Therefore, compared to a case where the fixing members are not covered by the filling member, the sensor module 100 reduces the possibility of deformation of the sensor substrate 20 due to the external environment. Furthermore, it reduces the possibility of the fixing members 30 loosening due to impacts, etc.

[0062] In the sensor module 100, the base 11 has an opening 11a in the +Z axis direction, which is a first direction. This opening is where the sensor substrate 20 is located. The cover 18 seals the opening 11a and is positioned opposite the sensor substrate 20 via a filling member 80. Therefore, in the sensor module 100, the structure of the housing 10 can be simplified, for example, the area of ​​the sensor substrate 20 can be increased. As a result, the number of sensors mounted on the sensor substrate 20 can be increased.

[0063] Viewed from the +Z axis direction, in the sensor module 100, two or more fixing members 30 are arranged diagonally on the direction D1, which is the second direction of the sensor substrate 20. Therefore, in the sensor module 100, the fixing members 30 can securely fix the sensor substrate 20 to the base 11.

[0064] In the sensor module 100, the sensor substrate 20 has a notch 26 at a diagonal angle to the direction D2, which is a third direction intersecting the direction D1. Therefore, in the sensor module 100, screw holes 17 for mounting the sensor module 100 to a mounting body can be provided near the notch 26.

[0065] In the sensor module 100, the sensor substrate 20 has: a first side surface 23 facing the -X-axis direction as a fourth direction; a second side surface 24 facing the +Y-axis direction as a fifth direction; and a protrusion 25 connecting the first side surface 23 and the second side surface 24, protruding further towards the -X-axis direction than the first side surface 23 and further towards the +Y-axis direction than the second side surface 24. A first X-axis angular velocity sensor 50x, serving as a second sensor, is disposed on the first side surface 23, and a first Y-axis angular velocity sensor 52y, serving as a third sensor, is disposed on the second side surface 24. Therefore, in the sensor module 100, the protrusion 25 ensures that there is space between the first side surface 23 and the base 11, and between the second side surface 24 and the base 11. Then, the first X-axis angular velocity sensor 50x can be disposed in the space between the first side surface 23 and the base 11, and the first Y-axis angular velocity sensor 52y can be disposed in the space between the second side surface 24 and the base 11.

[0066] In sensor module 100, the entire first X-axis angular velocity sensor 50x, the entire first Y-axis angular velocity sensor 52y, and the entire first Z-axis angular velocity sensor 54z are covered by filling components 80. Therefore, in sensor module 100, the stress caused by the filling components 80 in the angular velocity sensors 50x, 52y, and 54z can be homogenized. This, in turn, enables the homogenization of the characteristics of the angular velocity sensors 50x, 52y, and 54z. For example, if one angular velocity sensor is completely covered by the filling components, while another angular velocity sensor is only about half-covered, the stress caused by the filling components in the two angle sensors will be different, resulting in differences in their characteristics.

[0067] In the sensor module 100, the sensor substrate 20 has a first surface 21 and a second surface 22 that are adjacent to each other. A first Z-axis angular velocity sensor 54z is disposed on the first surface 21, and a second Z-axis angular velocity sensor 55z, which serves as a fourth sensor, is disposed on the second surface 22. Therefore, compared to the case where only one Z-axis angular velocity sensor is provided, the detection accuracy can be improved in the sensor module 100.

[0068] In the sensor module 100, a second X-axis angular velocity sensor 51x, serving as the fifth sensor, is disposed on the first side 23, and a second Y-axis angular velocity sensor 53y, serving as the sixth sensor, is disposed on the second side 24. Therefore, compared to the case where only one X-axis angular velocity sensor and one Y-axis angular velocity sensor are provided in the sensor module 100, the detection accuracy can be improved. For example, compared to the case where only one X-axis angular velocity sensor, one Y-axis angular velocity sensor, and one Z-axis angular velocity sensor are provided, if two X-axis angular velocity sensors, two Y-axis angular velocity sensors, and two Z-axis angular velocity sensors are provided, the noise characteristics can be improved to 1 / ( 2) times.

[0069] 2. Modifications of the sensor module

[0070] Next, the sensor module involved in the modified example of this embodiment will be described with reference to the accompanying drawings. Figure 9 This is a schematic perspective view of the sensor module 200 according to a variation of this embodiment. It should be noted that, for convenience, in... Figure 9 The illustrations of the housing 10, the fixing component 30, and the filling component 80 are omitted in the text.

[0071] In the following, in the sensor module 200 of the modified example of this embodiment, the same reference numerals will be added to the components that have the same function as the constituent components of the sensor module 100 of this embodiment described above, and detailed descriptions thereof will be omitted.

[0072] like Figure 5 As shown, in the sensor module 100 described above, the second Y-axis angular velocity sensor 53y is disposed on the second side 24 of the sensor substrate 20.

[0073] In contrast, such as Figure 9 As shown, in sensor module 200, a second Y-axis angular velocity sensor 53y is disposed on the third side 28 of sensor substrate 20. The third side 28 of sensor substrate 20 faces the opposite direction to the second side 24. In the illustrated example, the third side 28 faces the -Y-axis direction.

[0074] The sensor substrate 20 has a protrusion 29 between the first X-axis angular velocity sensor 50x and the second X-axis angular velocity sensor 51x. The protrusion 29 protrudes further in the -X-axis direction than the X-axis angular velocity sensors 50x and 51x. The protrusion 29 contacts the sidewall 15 of the base 11. The protrusion 29 ensures that there is space between the first side surface 23 and the sidewall 15, and the X-axis angular velocity sensors 50x and 51x can be arranged in this space.

[0075] The sensor module 200 includes: a first side 23 facing the -X-axis direction (a fourth direction); a second side 24 facing the +Y-axis direction (a fifth direction); and a third side 28 facing the -Y-axis direction (a sixth direction). A first X-axis angular velocity sensor 50x (as a second sensor) and a second X-axis angular velocity sensor 51x (as a third sensor) are disposed on the first side 23; a first Y-axis angular velocity sensor 52y (as a fourth sensor) is disposed on the second side 24; and a second Y-axis angular velocity sensor 53y (as a fifth sensor) is disposed on the third side 28. Therefore, compared to a case where only one X-axis angular velocity sensor and one Y-axis angular velocity sensor are provided in the sensor module 200, the detection accuracy can be improved.

[0076] The above-described embodiments and modifications are merely examples and are not limited to these. For example, appropriate combinations of the various embodiments and modifications are also possible.

[0077] This invention includes configurations that are substantially the same as those described in the embodiments, such as configurations with the same function, method, and result, or configurations with the same purpose and effect. Additionally, this invention includes configurations that replace non-essential parts of the configurations described in the embodiments. Furthermore, this invention includes configurations that perform the same function and effect as those described in the embodiments, or configurations that can achieve the same purpose. Additionally, this invention includes configurations that incorporate commonly known general knowledge into the configurations described in the embodiments.

[0078] The following is derived based on the above implementation methods and variations.

[0079] One type of sensor module has the following features: The base and the cover together constitute a box. A sensor substrate is disposed inside the housing and is equipped with a first sensor; Two or more fixing components are used to fix the sensor substrate to the base; A filling component covers the sensor substrate and the two or more fixing components, and fills the space between the sensor substrate and the housing.

[0080] This sensor module can reduce the possibility of sensor substrate deformation.

[0081] In one embodiment of the sensor module, it could also be: The base has an opening in a first direction, and this opening is the opening where the sensor substrate is located. The cover seals the opening and is positioned opposite the sensor substrate via the filling member.

[0082] This sensor module enables the simplification of the enclosure structure.

[0083] In one embodiment of the sensor module, it could also be: Viewed from the first direction, the two or more fixing components are arranged diagonally in the second direction of the sensor substrate.

[0084] According to this sensor module, the sensor substrate can be firmly fixed to the base by a fixing component.

[0085] In one embodiment of the sensor module, it could also be: The sensor substrate has a notch at a diagonal angle in a third direction that intersects the second direction.

[0086] According to this sensor module, screw holes can be provided near the notch for mounting the sensor module to the object being mounted.

[0087] In one embodiment of the sensor module, it could also be: The sensor substrate has: The first side faces a fourth direction orthogonal to the first direction; The second side faces a fifth direction orthogonal to the first direction and the fourth direction; The protrusion, connecting the first side and the second side, protrudes further in the fourth direction than the first side and further in the fifth direction than the second side. A second sensor is configured on the first side. A third sensor is disposed on the second side.

[0088] According to the sensor module, the protrusion ensures that there is space between the first side and the base, and between the second side and the base.

[0089] In one embodiment of the sensor module, it could also be: The entire first sensor, the entire second sensor, and the entire third sensor are covered by the filling component.

[0090] According to this sensor module, it is possible to achieve uniformity of stress caused by the filling component in the first sensor, the second sensor and the third sensor.

[0091] In one embodiment of the sensor module, it could also be: The sensor substrate has a first surface and a second surface that are inside and outside of each other. The first sensor is disposed on the first surface. A fourth sensor is disposed on the second surface.

[0092] This sensor module can improve detection accuracy.

[0093] In one embodiment of the sensor module, it could also be: A fifth sensor is configured on the first side. A sixth sensor is configured on the second side.

[0094] This sensor module can improve detection accuracy.

[0095] In one embodiment of the sensor module, it could also be: The sensor substrate has: The first side faces a fourth direction orthogonal to the first direction; The second side faces a fifth direction orthogonal to the first direction and the fourth direction; The third side faces a sixth direction, which is opposite to the fifth direction. A second sensor and a third sensor are configured on the first side. A fourth sensor is configured on the second side. A fifth sensor is disposed on the third side.

[0096] This sensor module can improve detection accuracy.

Claims

1. A sensor module, comprising: The base and the cover together constitute a box. A sensor substrate is disposed inside the housing and is equipped with a first sensor; Two or more fixing components are used to fix the sensor substrate to the base; A filling component covers the sensor substrate and the two or more fixing components, and fills the space between the sensor substrate and the housing.

2. The sensor module according to claim 1, wherein, The base has an opening in a first direction, and this opening is the opening where the sensor substrate is located. The cover seals the opening and is positioned opposite the sensor substrate via the filling member.

3. The sensor module according to claim 2, wherein, Viewed from the first direction, the two or more fixing components are arranged diagonally in the second direction of the sensor substrate.

4. The sensor module according to claim 3, wherein, The sensor substrate has a notch at a diagonal angle in a third direction that intersects the second direction.

5. The sensor module according to claim 2, wherein, The sensor substrate has: The first side faces a fourth direction orthogonal to the first direction; The second side faces a fifth direction orthogonal to the first direction and the fourth direction; The protrusion, connecting the first side and the second side, protrudes further in the fourth direction than the first side and further in the fifth direction than the second side. A second sensor is configured on the first side. A third sensor is disposed on the second side.

6. The sensor module according to claim 5, wherein, The entire first sensor, the entire second sensor, and the entire third sensor are covered by the filling component.

7. The sensor module according to claim 5, characterized in that, The sensor substrate has a first surface and a second surface that are inside and outside of each other. The first sensor is disposed on the first surface. A fourth sensor is disposed on the second surface.

8. The sensor module according to claim 7, wherein, A fifth sensor is configured on the first side. A sixth sensor is configured on the second side.

9. The sensor module according to claim 2, wherein, The sensor substrate has: The first side faces a fourth direction orthogonal to the first direction; The second side faces the first direction and the fifth direction orthogonal to the fourth direction; The third side faces a sixth direction, which is opposite to the fifth direction. A second sensor and a third sensor are configured on the first side. A fourth sensor is configured on the second side. A fifth sensor is disposed on the third side.

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