Wafer surface defect detection device

Abstract

This invention relates to the field of wafer defect detection technology, and discloses a wafer surface defect detection device, comprising a detection stage fixed within an outer enclosed housing. A detection frame is mounted on the top of the detection stage, and a vision camera is installed on the detection frame. A moving module is mounted on the detection stage, and a wafer transfer unit is mounted on the moving module. The wafer transfer unit includes a transfer frame, and a lower support is rotatably connected to the transfer frame. This invention's wafer transfer mechanism uses a support ring as the bottom support structure for the wafer. The wafer is placed entirely on top of the support ring, with bottom support achieved solely through the support ring. No clamping structures are used, avoiding wafer chipping or scratches caused by excessive clamping force or improper clamping position. Simultaneously, a foolproof operation can be performed during wafer transfer to prevent subsequent detection failures or wafer damage due to incorrect wafer orientation.

Description

Technical Field

[0001] This invention belongs to the field of wafer defect detection technology, and specifically relates to a wafer surface defect detection device. Background Technology

[0002] Wafers are the core basic components of semiconductor devices, and their surface defects directly affect the performance and yield of semiconductor devices. Therefore, wafer surface defect detection is a key process in semiconductor manufacturing. Wafer surface defect detection equipment is widely used in semiconductor manufacturing, electronic component production and other industries. It is mainly used to perform automated defect detection on wafers of 8 / 12-inch and other specifications, so as to achieve accurate identification and analysis of wafer surface defects.

[0003] Existing wafer surface defect inspection devices typically use adsorption for transport. During adsorption, the nozzle acts directly on the top surface of the wafer. To prevent obstruction of the inspection process, the adsorption must be released. Throughout the inspection process, the wafer, lacking restraint, may become skewed during the equipment's feeding action. The wafer is also prone to displacement due to equipment vibration, module movement, and other factors, further reducing the accuracy of defect inspection and failing to meet the high precision requirements of semiconductor manufacturing. On the other hand, using a clamping structure to fix and transport the wafer is prone to chipping and scratching due to improper clamping force control or clamping position deviation, and cannot meet the requirement of low loss. Therefore, a wafer surface defect inspection device needs to be designed. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer surface defect detection device with a simple structure and reasonable design in order to solve the above-mentioned problems.

[0005] The present invention achieves the above objectives through the following technical solutions: A wafer surface defect inspection device includes an inspection stage fixed inside an outer enclosure. An inspection frame is mounted on the top of the inspection stage, and a vision camera is installed on the inspection frame. A moving module is mounted on the inspection stage, and a wafer transfer unit is mounted on the moving module. The wafer transfer unit includes a transfer frame, a lower support rotatably connected to the transfer frame, and side supports evenly distributed on the lower support. The tops of the side supports are all fixed to a support ring, and a foolproof adjustment mechanism is provided at the bottom of the support ring. A follow-up limiting mechanism is provided on the support ring, and the follow-up limiting mechanism includes a mounting frame evenly fixed to the bottom of the support ring. A longitudinal limiting frame is fixed on the mounting frame, and a limiting slide is provided on the longitudinal limiting frame. A limiting post and an adjusting post are slidably connected in the limiting slide, and both the limiting post and the adjusting post are rotatably connected to a side limiting plate. A connecting frame slidably connected to the side support is fixedly sleeved on the limiting post, and the connecting frame is connected to a lifting mechanism. An adsorption treatment mechanism to prevent wafer misalignment during inspection is provided on the lower support.

[0006] As a further optimization of the present invention, the error-proof adjustment mechanism includes a support member uniformly fixed at the bottom of the support ring, and a photoelectric sensor is fixed on the support member.

[0007] As a further optimization of the present invention, the bottom of the lower support is fixedly connected to the output end of the geared motor, and the geared motor is fixed on the transfer frame.

[0008] As a further optimization of the present invention, the lifting mechanism includes an outer support fixed on the connecting frame, the outer support being rotatably connected to the lifting frame, the lifting frame being slidably connected to the guide rod at the top of the transfer frame, the lifting frame being slidably connected in the lifting slot, the lifting slot being opened on the guide plate, and the guide plate being fixed on the second electric slide rail.

[0009] As a further optimization of the present invention, the lifting slot includes a loading section, a translation section, a feeding section and a detection section arranged in parallel. The translation section and the detection section have the same height. The loading section is located below the translation section and is connected to the translation section. The feeding section is located above the translation section. The translation section and the feeding section are connected to each other through a first inclined groove. The feeding section and the detection section are connected to each other through a second inclined groove.

[0010] As a further optimization of the present invention, the top of one side of the side limiting plate is provided with a parallel surface that abuts against the side edge of the wafer, and the side limiting plate is provided with an inclined surface that connects to the parallel surface.

[0011] As a further optimization of the present invention, the limiting slide includes a vertical section located on the upper part of the longitudinal limiting frame and an inclined section connected to the vertical section.

[0012] As a further optimization of the present invention, the adsorption treatment mechanism includes a lower sleeve fixed at the center of the top of the lower support, a piston frame slidably connected in a through groove opened in the side wall of the lower sleeve, a pressure frame fixed on the piston frame, a pressure block fixed on the connecting frame above the pressure frame, a sealing plate on the inner wall of the lower sleeve and a return spring provided between the piston frame and the sealing plate, an air inlet opened in the side wall of the lower sleeve, an outer sealing ring fixed to the piston frame slidably connected in the outer wall of the lower sleeve, and a flexible suction nozzle fixed in the top of the lower sleeve.

[0013] As a further optimization of the present invention, the mobile module includes a first electric slide rail fixed on the testing table, the moving end of the first electric slide rail fixed to the bottom of a second electric slide rail, the second electric slide rail slidably connected to the testing table, and the transfer frame fixed on the moving end of the second electric slide rail.

[0014] As a further optimization of the present invention, an electrical control box is fixed on the outer enclosure, a control module is provided inside the electrical control box, a flip door is rotatably connected to the outer enclosure, and an operation panel connected to the control module is provided on the outer enclosure.

[0015] The beneficial effects of this invention are as follows: 1. The wafer transfer mechanism of the present invention uses a support ring as the bottom support structure for the wafer. The wafer is placed on top of the support ring throughout the entire process, and the bottom support is achieved solely through the support ring. No clamping structure is set up to avoid wafer chipping or scratching caused by excessive clamping force or improper clamping position. At the same time, during the wafer transfer process, when the lifting frame enters the translation section, the side limit plate is disengaged from the wafer height. The photoelectric sensor of the error-proof adjustment mechanism can detect the light signal blockage at the four corners of the wafer, identify the error-proof gap of the wafer, and determine whether the wafer detection posture is correct. If the detection posture is abnormal, the reduction motor can drive the lower support and the wafer to rotate and adjust, realizing error-proof operation during the transfer process and avoiding subsequent detection failure due to incorrect wafer posture.

[0016] 2. Before the error-proof operation of this invention, the lifting frame enters the first inclined groove from the loading section of the lifting slot and slides upward. The adjusting column moves along the inclined section of the limiting slide, pushing the side limiting plate to flip and approach the wafer until the parallel surface of the side limiting plate is perpendicular to the horizontal plane, thus initially positioning the wafer and keeping it concentric with the support ring. This ensures that the four corners of the wafer accurately correspond to the detection positions of the photoelectric sensor, avoiding deviations in the photoelectric sensor detection signal due to wafer eccentricity and ensuring the accuracy of error-proof detection. After the error-proof operation is completed, the lifting frame enters the second inclined groove and moves downward. The side limiting plate moves downward simultaneously, and its inclined surface contacts the edge of the wafer, performing secondary positioning of the wafer. This corrects any slight positional shifts that may occur during the error-proof adjustment process, ensuring that the wafer is precisely in the center position of the support ring, thus guaranteeing the accuracy of subsequent detection.

[0017] 3. When the lifting frame of the present invention moves down along the second inclined groove, it drives the connecting frame and the pressure block to move down synchronously. The pressure block abuts against and pushes the pressure frame of the adsorption processing mechanism, driving the piston frame and the outer sealing ring to move down. When the outer sealing ring completely blocks the air inlet of the lower sleeve, the piston frame, the lower sleeve and the flexible suction nozzle form a sealed space under the sealing of the wafer. The piston frame continues to move down, increasing the volume of the sealed space and generating a slight negative pressure. The flexible suction nozzle adsorbs and fixes the wafer in the center of the support ring. During the movement to the detection section and subsequent detection process, this slight negative pressure continues to act, which can effectively prevent the wafer from shifting position due to factors such as fine adjustment of the moving module and slight vibration of the equipment, ensuring the accurate position of the wafer image captured by the vision camera, thereby improving the accuracy and precision of defect detection. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the outer enclosed shell in this invention; Figure 3 This is an assembly diagram of the moving module and the wafer transfer unit in this invention; Figure 4 This is a schematic diagram of the wafer transfer unit in this invention; Figure 5 This is a schematic diagram of the lifting mechanism in this invention; Figure 6 This is a schematic diagram of the follower limiting mechanism in this invention; Figure 7 This is a schematic diagram of the adsorption treatment mechanism in this invention; Figure 8 This is a schematic diagram of the lifting slot structure in this invention; Figure 9 This is a schematic diagram of the installation position of the flexible suction nozzle in this invention.

[0019] In the diagram: 1. Inspection table; 2. Outer enclosure; 3. Moving module; 4. Wafer transfer unit; 5. Inspection rack; 6. Vision camera; 7. Electrical control box; 8. Flip-up door; 9. Operation panel; 31. First electric slide rail; 32. Second electric slide rail; 41. Transfer rack; 42. Lower support; 43. Foolproof adjustment mechanism; 44. Side support; 45. Support ring; 46. Follow-up limiting mechanism; 47. Adsorption processing mechanism; 431. Support component; 432. Photoelectric sensor; 433. Gear motor; 461. Mounting bracket; 462. Longitudinal limiting bracket; 463. Limiting slide; 464. Limiting post; 465. Adjusting post; 466. Side Limiting plate; 467. Connecting frame; 468. Lifting mechanism; 471. Lower sleeve; 472. Piston frame; 473. Pressing frame; 474. Pressing block; 475. Return spring; 476. Air inlet; 477. Outer sealing ring; 478. Flexible suction nozzle; 4631. Vertical section; 4632. Inclined section; 4661. Parallel surface; 4662. Inclined surface; 4681. Outer support; 4682. Lifting frame; 4683. Lifting slot; 4684. Guide plate; 4801. Loading section; 4802. Translation section; 4803. Feeding section; 4804. Detection section; 4805. First inclined chute; 4806. Second inclined chute. Detailed Implementation

[0020] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0021] Example: Please refer to Figures 1-9A wafer surface defect detection device includes a detection platform 1, which is fixed inside an outer enclosure 2. An electrical control box 7 is fixed on the outer enclosure 2, and a control module is installed inside the electrical control box 7. A flip door 8 is rotatably connected to the outer enclosure 2, and an operation panel 9 connected to the control module is also provided on the outer enclosure 2. A detection frame 5 is installed on the top of the detection platform 1, and a vision camera 6 is mounted on the detection frame 5. The vision camera 6 captures images of the wafer surface and transmits the image signals to the control module for defect identification and analysis. (The vision camera 6 is prior art and will not be described in detail here.) A moving module is also provided on the detection platform 1. 3. The control module is electrically connected to the vision camera 6, the moving module 3, and the operation panel 9 respectively. It issues commands through the operation panel 9 to control the coordinated operation of each component. The control module can also process the image data captured by the vision camera 6 to perform defect identification. The outer enclosure 2 encloses the core components such as the inspection table 1, the moving module 3, and the inspection frame 5 inside, forming an independent inspection space. This can effectively isolate external contaminants, ensure a clean inspection environment, prevent operators from contacting the internal moving parts of the equipment, prevent mechanical injury, and reduce the interference of external light and vibration on the imaging of the vision camera 6, thereby improving the accuracy of defect detection.

[0022] Please see Figures 2-4 The moving module 3 includes a first electric slide rail 31 fixed on the inspection table 1. The moving end of the first electric slide rail 31 is fixed to the bottom of the second electric slide rail 32. The second electric slide rail 32 is slidably connected to the inspection table 1. (The first electric slide rail 31 and the second electric slide rail 32 are both existing technologies and will not be described in detail here.) The transfer frame 41 is fixed on the moving end of the second electric slide rail 32. The moving module 3 is equipped with a wafer transfer unit 4. The moving module 3 serves as the moving carrier of the wafer transfer unit 4 and is used to drive the wafer transfer unit 4 to achieve precise movement in the X and Y directions, transferring the wafer from the loading and unloading station to the inspection station. At the same time, the position of the wafer at the inspection station can be adjusted to ensure that the wafer is precisely aligned with the vision camera 6.

[0023] Please see Figures 1-8The wafer transfer unit 4 includes a transfer frame 41 fixed on the moving end of the second electric slide rail 32. A lower support 42 is rotatably connected to the transfer frame 41. An adsorption processing mechanism 47 is provided on the lower support 42 to prevent the wafer from tilting during testing. Side supports 44 are evenly arranged on the lower support 42. The top of each side support 44 is fixed to a support ring 45. The support ring 45 serves as the direct support component for the wafer, and the top is used to place the wafer. During testing, the adsorption processing mechanism 47 can provide a slight negative pressure to adsorb and fix the wafer on the support ring 45, preventing the wafer from tilting due to the movement of the moving module 3 or slight vibration of the equipment during testing. The bottom adsorption fixing method does not obstruct the effective detection area on the wafer surface. This does not affect the imaging of the vision camera 6 and ensures the accuracy of defect detection. The bottom of the support ring 45 is provided with a foolproof adjustment mechanism 43. The foolproof adjustment mechanism 43 includes a support member 431 that is evenly fixed at the bottom of the support ring 45. A photoelectric sensor 432 is fixed on the support member 431. After the wafer to be inspected is placed on the top of the support ring 45, the photoelectric sensor 432 supported by the support member 431 is located below the four corners of the wafer. The wafer's orientation can be determined by the obstruction of the light signal. The bottom of the lower support 42 is fixedly connected to the output end of the geared motor 433 through a flange. The geared motor 433 is fixed on the transfer frame 41. The support ring 45 is provided with a follow-up limit mechanism 46.

[0024] Please see Figures 3-7 The follow-up limiting mechanism 46 includes a mounting frame 461 evenly fixed to the bottom of the support ring 45. A longitudinal limiting frame 462 is fixed on the mounting frame 461. A limiting slide 463 is provided on the longitudinal limiting frame 462. The limiting slide 463 includes a vertical section 4631 located on the upper part of the longitudinal limiting frame 462 and an inclined section 4632 connected to the vertical section 4631. A limiting post 464 and an adjusting post 465 are slidably connected in the limiting slide 463. Both the limiting post 464 and the adjusting post 465 are rotatably connected to the side limiting plate 466. A parallel surface 4661 that abuts against the side edge of the wafer is provided on one side of the side limiting plate 466. An inclined surface 4662 connected to the parallel surface 4661 is fitted with a connecting frame 467 on a limiting post 464. The connecting frame 467 is slidably connected to the guide rails on both sides of the side support 44 via a slider. The connecting frame 467 is connected to the lifting mechanism 468. The lifting mechanism 468 includes an outer support 4681 fixed on the connecting frame 467. The outer support 4681 is rotatably connected to the lifting frame 4682 via a bearing. The lifting frame 4682 is slidably connected to the guide rod at the top of the transfer frame 41. The lifting frame 4682 is slidably connected to the lifting slot 4683. The lifting slot 4683 is opened on the guide plate 4684. The guide plate 4684 is fixed on the second electric slide rail 32.

[0025] Please see Figures 3-8The lifting chute 4683 includes a parallel feeding section 4801, a translation section 4802, a feeding section 4803, and a detection section 4804. The translation section 4802 and the detection section 4804 are at the same height. The feeding section 4801 is positioned below the translation section 4802 and is interconnected with it. The feeding section 4803 is positioned above the translation section 4802. The translation section 4802 and the feeding section 4803 are interconnected via a first inclined chute 4805. The feeding section 4803 and the detection section 4804 are interconnected via a second inclined chute 4806. When the lifting frame 4682 is in the position of the feeding section 4801, the limiting post 464 is in the vertical section 4631. At the bottom, the adjusting column 465 is at the very bottom of the inclined section 4632. The side limiting plate 466 flips outward under the combined action of the adjusting column 465 and the limiting column 464, avoiding obstructing the space above the support ring 45 and facilitating loading. Subsequently, the wafer to be inspected is placed on the support ring 45 by the loading equipment. Then, the transfer frame 41 and the lifting frame 4682 are moved along the guide plate 4684 by the second electric slide rail 32, so that the lifting frame 4682 gradually enters the translation section 4802, and then enters the first inclined groove 4805 and slides upward. During the upward sliding process, the adjusting column 465 moves obliquely upward along the inclined section 4632, which can push the side limiting plate 466 to flip gradually. Approaching the wafer until the adjusting column 465 enters the vertical section 4631, the parallel surface 4661 of the side limiting plate 466 is perpendicular to the horizontal plane and limits the wafer from the edge, making the wafer concentric with the support ring 45, and positioning the photoelectric sensor 432 below the four corners of the wafer. The wafer's posture can be determined by the obstruction of the light signal. When the lifting frame 4682 completely disengages from the translation section 4802, the parallel surface 4661 completely disengages from the height position of the wafer, performing a foolproof operation. The photoelectric sensor 432 detects the foolproof notch on the wafer to identify the wafer's placement status, and the rotation of the lower support 42 driven by the reduction motor 433 adjusts the wafer's detection posture, facilitating defect detection by the vision camera 6. After the frame 4682 enters the second inclined groove 4806, it begins to move the lifting frame 4682 downward. During this process, the side limiting plate 466 moves downward and the wafer is repositioned through the axially arranged inclined surface 4662 until the parallel surface 4661 is attached to the side wall of the wafer. At this time, the wafer is in the center position of the support ring 45, eliminating the wafer position deviation during the foolproof operation. At the same time, the wafer position is fixed by the adsorption processing mechanism 47. As the adjustment column 465 continues to move downward, it will enter the inclined section 4632, causing the entire side limiting plate 466 to flip outward. When the lifting frame 4682 moves to the detection section 4804, the space above the wafer is completely exposed. The wafer position is adjusted by the moving module 3 and defect detection is performed in conjunction with the vision camera 6.

[0026] Please see Figures 6-7 and Figure 9The adsorption treatment mechanism 47 includes a lower sleeve 471 fixed at the top center of the lower support 42. A piston frame 472 is slidably connected in a through groove at the bottom of the side wall of the lower sleeve 471. A pressure frame 473 is fixed on the piston frame 472. A pressure block 474 is fixed on the connecting frame 467 above the pressure frame 473. The piston frame 472 slides through a sealing plate on the inner wall of the lower sleeve 471. A return spring 475 is provided between the piston frame 472 and the sealing plate. An air inlet 476 is provided on the side wall of the lower sleeve 471. An outer sealing ring 477, which is fixed to the piston frame 472, is slidably connected to the outer wall of the lower sleeve 471. A flexible suction nozzle 478 is fixed on the top of the lower sleeve 471. When the pressure block 474 does not contact the pressure frame 473, the return spring 475 will maintain the position of the piston frame 472. At this time, the outer sealing ring 477 is above the air inlet 476 and does not block the air inlet 476. As the lifting frame 4682 moves down along the second inclined groove 4806, the pressure block 474 gradually moves down and abuts against the pressure frame 473. The pressure frame 473 acts on the piston frame 472, stretching the return spring 475 while driving the outer sealing ring 477 down. When the outer sealing ring 477 completely blocks the air inlet 476, the piston frame 472, the lower sleeve 471, and the flexible suction nozzle 478 are in a sealed state under the sealing of the wafer. The piston frame 472 continues to move down, and the internal volume increases, which will generate a slight negative pressure at the position of the flexible suction nozzle 478, adsorbing the wafer at the center position of the support ring 45 to ensure the detection effect. After the detection is completed, the lifting frame 4682 returns to its original position under the action of the second electric slide rail 32 until the lifting frame 4682 moves to the loading section 4801. The position of the outer sealing ring 477 is below the air inlet 476, and the flexible suction nozzle 478 will not adsorb the wafer, making it convenient for unloading.

[0027] It should be noted that, before use, the lifting frame 4682 of this wafer surface defect detection device is positioned at the loading section 4801 of the lifting slot 4683. At this time, the limiting post 464 is at the bottom of the vertical section 4631 of the limiting slide 463, and the adjusting post 465 is at the bottom of the inclined section 4632. The side limiting plate 466 flips outward under the combined action of the limiting post 464 and the adjusting post 465, completely avoiding the space above the support ring 45, thus providing sufficient operating space for wafer loading. The photoelectric sensor 432 of the foolproof adjustment mechanism 43 is fixed to the support. At position 431, the device is in a power-on standby state, with the geared motor 433 stationary and the lower support 42 and support ring 45 maintaining a horizontal orientation. Then, the wafer to be inspected is placed on top of the support ring 45 using a loading device. The support ring 45, as the direct support component for the wafer, supports the wafer only through its edge area, ensuring that the effective inspection area on the wafer surface is not obstructed and that subsequent imaging by the vision camera 6 is not affected. At this time, the side limiting plate 466 is in an outward-flipped state, preventing it from obstructing the support ring 45, ensuring smooth loading, and avoiding collisions or scratches between the wafer and the side limiting plate 466. After the material is loaded, the control module sends a command to start the second electric slide rail 32. The second electric slide rail 32 drives the transfer frame 41 and the lifting frame 4682 to move slowly along the guide plate 4684, so that the lifting frame 4682 gradually enters the translation section 4802 from the loading section 4801 of the lifting slot 4683, and then enters the first inclined slot 4805 and slides upward. During the upward sliding of the lifting frame 4682, the outer support 4681 rises synchronously, and the outer support 4681 drives the connecting frame 467 along the side support. The guide rails on both sides of 44 slide upwards, and the connecting frame 467 drives the limiting column 464 and the adjusting column 465 to move synchronously. The adjusting column 465 moves obliquely upwards along the inclined section 4632 of the limiting slide 463, pushing the side limiting plate 466 to gradually flip and approach the wafer until the adjusting column 465 enters the vertical section 4631. At this time, the parallel surface 4661 of the side limiting plate 466 is perpendicular to the horizontal plane, and it initially limits the wafer from the edge, so that the wafer and the support ring 45 remain concentric, and the initial positioning is completed. When the lifting frame 4682 is completely disengaged from the translation section 4802, the parallel surface 4661 of the side limit plate 466 is disengaged from the height position of the wafer, and the equipment enters the error-proof detection stage. At this time, the photoelectric sensor 432 is located below the four corners of the wafer. By detecting the obstruction of the light signal, it identifies the error-proof notch of the wafer, thereby determining the placement posture of the wafer, and transmits the detection signal to the control module in real time. If the control module determines that the wafer posture is abnormal, it sends a command to the reduction motor 433. The reduction motor 433 starts, and its output end drives the lower support 42 to rotate slowly through the flange. The lower support 42 drives the side support 44, support ring 45 and wafer to rotate synchronously until the photoelectric sensor 432 detects that the light signal meets the preset standard, and determines that the wafer's inspection posture is correct. The control module then sends a command. The command is sent to stop the reduction motor 433, and the wafer attitude adjustment is completed, ensuring that the wafer orientation and position meet the detection requirements and ensuring the detection accuracy of the vision camera 6. After the detection attitude adjustment is completed, the second electric slide rail 32 continues to drive the lifting frame 4682 to move, so that it enters the second inclined groove 4806 of the lifting slot 4683, and begins to drive the lifting frame 4682 to move down. During the downward movement of the lifting frame 4682, the side limit plate 466 moves down synchronously. The inclined surface 4662 arranged axially on the side limit plate 466 contacts the edge of the wafer, and performs secondary positioning of the wafer, gradually correcting the wafer position until the parallel surface 4661 is tightly attached to the side wall of the wafer. At this time, the wafer is in the center position of the support ring 45, completely eliminating the wafer position deviation that may occur during the foolproof operation. Simultaneously, the lifting frame 4682 moves downward, causing the connecting frame 467 to move downward synchronously. The pressure block 474 on the connecting frame 467 gradually moves downward and abuts against the pressure frame 473 of the adsorption processing mechanism 47. The pressure frame 473 drives the piston frame 472 to move downward, stretching the return spring 475 and simultaneously driving the outer sealing ring 477 to move downward synchronously. When the outer sealing ring 477 completely blocks the air inlet 476 on the side wall of the lower sleeve 471, the piston frame 472, the lower sleeve 471, and the flexible suction nozzle 478 form a sealed space under the sealing of the wafer. The piston frame 472 continues to move downward, increasing the internal volume of the sealed space and generating micro-volume at the position of the flexible suction nozzle 478. Negative pressure is applied to adsorb and fix the wafer at the center of the support ring 45, further ensuring the stability of the wafer during subsequent transport and inspection. The micro-negative pressure adsorption method does not block the effective inspection area on the wafer surface and does not affect the imaging of the vision camera 6. The lifting frame 4682 continues to move down along the second inclined groove 4806, and the adjusting column 465 enters the inclined section 4632 of the limiting slide 463 again, driving the entire side limiting plate 466 to flip outward until the lifting frame 4682 is completely moved to the inspection section 4804 of the lifting groove 4683. At this time, the side limiting plate 466 is completely detached from the wafer, and the space above the wafer is fully exposed, preparing for subsequent defect inspection. After the wafer is adsorbed and fixed, the first electric slide rail 31 drives the second electric slide rail 32 to move along the X direction. The second electric slide rail 32 drives the transfer frame 41 and the entire wafer transfer unit 4 to move along the Y direction, accurately transferring the wafer to the inspection station. This ensures that the wafer and the vision camera 6 on the inspection frame 5 are precisely aligned. After alignment, the control module instructs the vision camera 6 to start. The vision camera 6 captures an image of the wafer surface and transmits the image signal to the control module. The control module processes the image data and adjusts the position of the wafer relative to the vision camera 6 in conjunction with the first electric slide rail 31 and the second electric slide rail 32, so that the vision camera 6 can complete the defect identification and analysis of the entire surface of the wafer. During the inspection process, the adsorption processing mechanism 47 continuously provides a micro negative pressure to ensure the wafer position is stable. After the wafer defect detection is completed, the control module sends a command, and the second electric slide rail 32 drives the lifting frame 4682 to return to its reverse position, gradually passing through the detection section 4804, the second inclined groove 4806 and the translation section 4802, and finally returning to the loading section 4801. At this time, the outer sealing ring 477 is located below the air inlet 476, the air inlet 476 is open, the negative pressure in the sealed space is released, and the flexible suction nozzle 478 no longer adsorbs the wafer; at the same time, the limiting post 464 and the adjusting post 465 return to their initial positions, the side limiting plate 466 flips outward again to avoid the space above the support ring 45, and the wafer that has been inspected is taken out, completing one inspection cycle. After that, the equipment automatically resets to the initial state, waiting for the loading and inspection of the next wafer to be inspected, and repeats all the above work processes.

[0028] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A wafer surface defect detection device, comprising a detection stage (1), characterized in that: The testing platform (1) is fixed inside the outer enclosure (2). A testing frame (5) is provided on the top of the testing platform (1). A vision camera (6) is installed on the testing frame (5). A moving module (3) is provided on the testing platform (1). A wafer transfer unit (4) is provided on the moving module (3). The wafer transfer unit (4) includes a transfer frame (41). A lower support (42) is rotatably connected to the transfer frame (41). Side supports (44) are evenly provided on the lower support (42). The tops of the side supports (44) are all fixed on the support ring (45). A foolproof adjustment mechanism (43) is provided at the bottom of the support ring (45). A follow-up limiting mechanism (46) is provided on the support ring (45). 46) Includes a mounting frame (461) evenly fixed at the bottom of the support ring (45), a longitudinal limiting frame (462) fixed on the mounting frame (461), a limiting slide (463) opened on the longitudinal limiting frame (462), a limiting column (464) and an adjusting column (465) slidably connected in the limiting slide (463), the limiting column (464) and the adjusting column (465) are rotatably connected to the side limiting plate (466), a connecting frame (467) slidably connected to the side support (44) is fixedly sleeved on the limiting column (464), and the connecting frame (467) is connected to the lifting mechanism (468); an adsorption processing mechanism (47) is provided on the lower support (42) to prevent the wafer position from deflecting during detection.

2. The wafer surface defect detection device according to claim 1, characterized in that: The error-proof adjustment mechanism (43) includes a support member (431) evenly fixed at the bottom of the support ring (45), and a photoelectric sensor (432) is fixed on the support member (431).

3. The wafer surface defect detection device according to claim 1, characterized in that: The bottom of the lower support (42) is fixedly connected to the output end of the geared motor (433), and the geared motor (433) is fixed on the transfer frame (41).

4. The wafer surface defect detection device according to claim 1, characterized in that: The lifting mechanism (468) includes an outer support (4681) fixed on a connecting frame (467), the outer support (4681) being rotatably connected to a lifting frame (4682), the lifting frame (4682) being slidably connected to a guide rod on the top of a transfer frame (41), the lifting frame (4682) being slidably connected in a lifting slot (4683), the lifting slot (4683) being opened on a guide plate (4684), and the guide plate (4684) being fixed on a second electric slide rail (32).

5. The wafer surface defect detection device according to claim 4, characterized in that: The lifting slot (4683) includes a loading section (4801), a translation section (4802), a feeding section (4803), and a detection section (4804) arranged in parallel. The translation section (4802) and the detection section (4804) are at the same height. The loading section (4801) is positioned below the translation section (4802) and is interconnected with the translation section (4802). The feeding section (4803) is positioned above the translation section (4802). The translation section (4802) and the feeding section (4803) are interconnected through a first inclined chute (4805). The feeding section (4803) and the detection section (4804) are interconnected through a second inclined chute (4806).

6. The wafer surface defect detection device according to claim 1, characterized in that: The side limiting plate (466) has a parallel surface (4661) on one side top that abuts against the side edge of the wafer, and the side limiting plate (466) has an inclined surface (4662) that is connected to the parallel surface (4661).

7. The wafer surface defect detection device according to claim 1, characterized in that: The limiting slide (463) includes a vertical section (4631) located on the upper part of the longitudinal limiting frame (462) and an inclined section (4632) connected to the vertical section (4631).

8. The wafer surface defect detection device according to claim 1, characterized in that: The adsorption treatment mechanism (47) includes a lower sleeve (471) fixed at the top center of the lower support (42). A piston frame (472) is slidably connected in a through groove opened on the side wall of the lower sleeve (471). A pressure frame (473) is fixed on the piston frame (472). A pressure block (474) is fixed on the connecting frame (467) above the pressure frame (473). The piston frame (472) is slidably connected to the sealing plate on the inner wall of the lower sleeve (471). A return spring (475) is provided between the piston frame (472) and the sealing plate. An air inlet (476) is opened on the side wall of the lower sleeve (471). An outer sealing ring (477) fixed to the piston frame (472) is slidably connected on the outer wall of the lower sleeve (471). A flexible suction nozzle (478) is fixed on the top of the lower sleeve (471).

9. A wafer surface defect detection device according to claim 4, characterized in that: The mobile module (3) includes a first electric slide rail (31) fixed on the testing table (1), the moving end of the first electric slide rail (31) is fixed to the bottom of the second electric slide rail (32), the second electric slide rail (32) is slidably connected to the testing table (1), and the transfer frame (41) is fixed on the moving end of the second electric slide rail (32).

10. A wafer surface defect detection device according to claim 1, characterized in that: An electrical control box (7) is fixed on the outer enclosure (2), and a control module is installed inside the electrical control box (7). A flip door (8) is rotatably connected to the outer enclosure (2), and an operation panel (9) connected to the control module is installed on the outer enclosure (2).

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