Multi-mode cooling control method and system for a solid-state microwave source

Abstract

This invention relates to the field of solid-state microwave source thermal management technology, specifically a multi-mode cooling control method and system for solid-state microwave sources. The invention acquires multi-dimensional operating parameters of the solid-state microwave source in real time, constructs a nonlinear coupling model of microwave power and junction temperature, and outputs the thermal load state using a power-temperature transfer function matrix. Then, it obtains predictive information for cooling control through unsteady-state heat conduction differential equations, proactively acquiring information such as junction temperature change trends and instantaneous thermal overshoot judgment values. This avoids the delay defects of traditional cooling responses, improves the foresight of thermal management, and ensures stable operation of the solid-state microwave source. Furthermore, based on the predictive information for cooling control, it performs matching analysis to output a cooling strategy library, classifies the thermal load level according to the estimated cooling power demand, and achieves multi-mode adaptive switching between air cooling, liquid cooling, and phase change cooling. Simultaneously, it dynamically adjusts the cooling mode according to the thermal gradient distribution, optimizing cooling resource utilization and reducing energy waste.

Description

Technical Field

[0001] This invention relates to the field of solid-state microwave source thermal management technology, specifically to a multi-mode cooling control method and system for solid-state microwave sources. Background Technology

[0002] Solid-state microwave sources are core components in microwave technology applications. Compared to traditional vacuum microwave sources, they offer advantages such as smaller size, higher reliability, adjustable power, and easier integration. They are crucial hardware supports for fields like communications, radar detection, industrial microwave heating, and radio frequency ablation. Their operational stability directly determines the operating efficiency and lifespan of downstream equipment and is a vital foundation for the miniaturization and domestic production of high-end microwave equipment. To address the issue of adapting heat dissipation across all operating conditions for their core heat-generating units (power amplifiers, microwave oscillators, etc.), a single cooling method cannot simultaneously meet the energy-saving requirements of low power and low heat consumption while simultaneously meeting the high-efficiency heat exchange requirements of high power or overload conditions. Multi-mode cooling integrates the advantages of air cooling, liquid cooling, and phase change cooling, allowing for on-demand matching of heat exchange capacity and avoiding the inefficiencies or energy waste associated with single-mode cooling.

[0003] Currently, traditional cooling control suffers from response delays, is prone to heat accumulation effects, and is susceptible to instantaneous thermal overshoot in high-power pulse operation modes. Furthermore, the cooling system cannot dynamically adjust the cooling intensity distribution according to changes in the thermal field of the solid-state microwave source, resulting in uneven distribution of cooling resources, low cooling efficiency, serious energy waste, and low energy utilization. Summary of the Invention

[0004] This invention provides a multi-mode cooling control method and system for a solid-state microwave source to solve the above-mentioned technical problems.

[0005] The first aspect of this invention provides a multi-mode cooling control method for a solid-state microwave source, comprising:

[0006] Q1: Real-time acquisition of multi-dimensional operating parameters of solid-state microwave sources; multi-dimensional operating parameters include the microwave output power spectrum, output impedance and junction temperature parameters of the core heating unit of the solid-state microwave source, as well as the operating parameters of the solid-state microwave source and the cooling operation parameters of the cooling system.

[0007] Q2: Based on multi-dimensional operating parameters, thermal load state analysis is performed to obtain predictive information for cooling control, specifically:

[0008] As a further improvement of the present invention, the multi-dimensional operating condition parameters are extracted and preprocessed to obtain standardized heat load analysis parameters, the specific analysis content of which is as follows:

[0009] The core heating unit of the solid-state microwave source is divided into N independent heat dissipation regions according to its physical location, and its heat dissipation region number is obtained, denoted as i=1, 2, ..., N, where N is the total number of heat dissipation regions. The multi-dimensional operating parameters of each heat dissipation region are identified to obtain the microwave output power spectrum, output impedance, and junction temperature parameters. Based on the original acquired microwave output impedance signal, the complex impedance parameters that dynamically change with angular frequency are extracted. Based on the junction temperature parameters, the real-time junction temperature of each core heating unit is obtained. The power signal of the microwave output power spectrum is subjected to Fourier transform, and the peak power duty cycle is extracted as the power spectrum feature value to capture the instantaneous power fluctuation law under high power pulse conditions. Based on the junction temperature parameters, the real-time heat flux density of each heat dissipation region is obtained, and the dynamic thermal resistance is calculated by combining the real-time heat flux density with the real-time excitation input dynamic thermal resistance calculation formula.

[0010] The complex impedance parameters, real-time junction temperature, power spectrum characteristic value, and dynamic thermal resistance are normalized and mapped to the interval [0, 1], and denoted as microwave output complex impedance, real-time junction temperature value, microwave output power spectrum characteristic value, and dynamic thermal resistance value, respectively. The parameters are then aggregated to obtain the heat load analysis parameters.

[0011] As a further improvement of this invention, the thermal load analysis parameters are input into the constructed nonlinear coupling model of microwave power and junction temperature, as well as the microwave power and temperature transfer function matrix, to obtain the thermal load state. The specific analysis content is as follows:

[0012] A nonlinear coupling model of microwave power and junction temperature was constructed based on the thermal load analysis parameters of the heat dissipation area.

[0013] Construction of microwave power and temperature transfer function matrix: Linearize the coupled model of all heat dissipation regions in the rated operating point domain to construct an N-order transfer function matrix, which is then denoted as microwave power and temperature transfer function matrix, where N is the total number of heat dissipation regions; each element in the microwave power and temperature transfer function matrix is ​​the Lapss transform value of the real-time junction temperature of the heat dissipation region.

[0014] The thermal load analysis parameters of each heat dissipation area are input into the nonlinear coupling model of microwave power and junction temperature, as well as the microwave power and temperature transfer function matrix, to solve the thermal load state of each heat dissipation area, including the heat generation rate and the predicted heat flux density.

[0015] As a further improvement of the present invention, the unsteady-state heat conduction differential equation established by the thermal load state input is solved to obtain predictive information for cooling control, specifically as follows:

[0016] Based on the material density, specific heat capacity at constant pressure, and thermal conductivity of the semiconductor material of the solid-state microwave source heating unit obtained from the database, an unsteady-state heat conduction differential equation was constructed.

[0017] The unsteady heat conduction differential equation is used to solve the thermal load state to obtain the cooling control prediction information corresponding to the set look-ahead prediction time. This information includes the junction temperature change trend value, instantaneous thermal overshoot judgment value, thermal gradient distribution value, and cooling power demand estimate.

[0018] Furthermore, the unsteady-state heat conduction differential equation is used to predict and analyze the thermal load state. The specific analysis content is as follows:

[0019] The heat generation rate and predicted heat flux density are obtained based on the thermal load condition;

[0020] Based on the predicted heat flux density, the predicted heat junction temperature value at the time corresponding to the future forward prediction time of the current heat dissipation area and the real-time heat junction temperature value at the current time are obtained, and the junction temperature change trend value is calculated by inputting the junction temperature change trend calculation formula.

[0021] Based on the predicted heat flux density, the maximum predicted junction temperature of the current heat dissipation area at the corresponding time of the future forward prediction duration is obtained, as well as the rated junction temperature value set by the heat-generating unit device. Then, the instantaneous thermal overshoot judgment value is calculated by inputting both into the instantaneous thermal overshoot judgment calculation formula.

[0022] The second partial derivative of the real-time junction temperature of the current heat dissipation area in the two-dimensional plane is obtained based on the predicted heat flux density, and the heat gradient distribution value is calculated by inputting it into the heat gradient distribution calculation formula.

[0023] The estimated cooling power demand is obtained by inputting the heat generation rate and the set heat exchange efficiency coefficient of the cooling system into the cooling power demand estimation formula.

[0024] Q3: Input the predicted information into the set cooling strategy library for matching and output of cooling strategy;

[0025] As a further improvement of the present invention, the cooling control prediction information is input into a set cooling strategy library for matching and output of a cooling strategy, specifically as follows:

[0026] The cooling strategy includes at least the following: For junction temperature change trends, adjust the dynamic response rate of cooling intensity based on the sign and absolute value of the value; for instantaneous thermal overshoot, use a threshold-triggered pre-cooling mechanism to set a safety threshold; when the value exceeds the safety threshold, it is determined to be a high-risk thermal overshoot condition, and the backup cooling module is immediately activated; for thermal gradient distribution values, when the thermal gradient distribution value is large, use a non-uniform cooling mode to prioritize the allocation of cooling resources to areas with concentrated thermal gradients; when the thermal gradient distribution value is small, switch to a uniform cooling mode to evenly distribute the cooling power to each heat dissipation area.

[0027] Estimated cooling power demand The load classification result is obtained by dividing the heat load based on this value, which includes a low heat load zone, a medium heat load zone, and a high heat load zone, i.e., the low heat load zone. , Based on the set rated cooling power threshold, the cooling strategy prioritizes air cooling to meet basic heat dissipation requirements and maximize energy savings; medium heat load area The cooling strategy employs a combined air-cooling and liquid-cooling approach, allocating the power of the two types of cooling units according to the estimated ratio; high heat load areas The cooling strategy is a multi-mode collaborative cooling mode.

[0028] Q4: Based on the cooling strategy, perform adaptive cooling power allocation analysis to obtain adaptive cooling commands, and then execute the cooling.

[0029] A second aspect of the present invention provides a multi-mode cooling control system for a solid-state microwave source, comprising a multi-dimensional sensing module, a control analysis and calculation module, and a cooling execution module.

[0030] The multidimensional sensing module includes a power spectrum sensor, an impedance sensor, a high-response temperature sensor, and an operating condition sensor, which are used to collect microwave output power spectrum, output impedance, junction temperature parameters, and operating condition parameters, respectively; and the microwave output power spectrum, output impedance, and junction temperature parameters are combined to obtain the multidimensional operating condition parameters of the solid-state microwave source.

[0031] The control analysis and calculation module includes a heat load state analysis unit and an adaptive cooling power allocation analysis unit. The heat load state analysis unit is used to perform analysis and output predicted information and cooling strategies for cooling control; the adaptive cooling analysis unit is used to perform adaptive cooling power allocation analysis to obtain adaptive cooling commands.

[0032] As a further improvement to the present invention, adaptive power allocation analysis is provided, and its specific analysis content is as follows:

[0033] Based on the predicted information for cooling control, the estimated cooling power demand, instantaneous thermal overshoot judgment value, and thermal gradient distribution value of each heat dissipation area are extracted; the ratio obtained by comparing the instantaneous thermal overshoot judgment value with the set rated junction temperature value of the heat-generating unit device is marked as the instantaneous thermal overshoot risk coefficient; the ratio obtained by comparing the thermal gradient distribution value with the calibrated maximum thermal gradient threshold is marked as the thermal gradient adaptation coefficient.

[0034] The multi-mode cooling units included in the cooling execution module are obtained, and the cooling units corresponding to each mode of the multi-mode cooling units are denoted as follows: u = 1, 2, ..., U, where u is the cooling unit number corresponding to the cooling unit, and U is the total number of modes of the cooling unit; obtain the power adjustment range of each mode cooling unit and mark it as... .

[0035] The normalized values ​​of the estimated cooling power demand, the instantaneous thermal overshoot risk coefficient, and the thermal gradient adaptation coefficient are input into the set matching degree fusion formula to calculate the matching degree of heat dissipation region i to cooling unit u.

[0036] The system obtains the load classification results of the cooling strategy, namely, low heat load zone, medium heat load zone, and high heat load zone. When the heat dissipation area is in the low heat load zone, the adaptive cooling command calls the corresponding cooling strategy to prioritize the air cooling mode and generates the corresponding cooling control command, that is, adjusts the output power of the air cooling unit based on the matching degree, while the output power of the liquid cooling unit and the phase change cooling unit are both zero. When the heat dissipation area is in the medium heat load zone, the adaptive cooling command calls the corresponding cooling strategy to adopt the air cooling and liquid cooling co-processing mode and generates the corresponding cooling control command, that is, adjusts the output power of the air cooling unit and the liquid cooling unit based on the matching degree, while the output power of the phase change cooling unit is both zero. When the heat dissipation area is in the high heat load zone, the adaptive cooling command calls the corresponding cooling strategy to the multi-mode co-processing cooling mode and generates the corresponding cooling control command, that is, adjusts the output power of the air cooling unit, the liquid cooling unit, and the phase change cooling unit based on the matching degree.

[0037] The cooling execution module includes a multi-mode cooling unit and a cooling execution control unit. The cooling execution control unit receives adaptive cooling commands and distributes them to the multi-mode cooling unit. The multi-mode cooling unit includes at least an air-cooling unit, a liquid-cooling unit, and a phase-change cooling unit, and is used to receive adaptive cooling commands and perform cooling regulation execution.

[0038] The beneficial effects of the technical solution provided by this invention compared with the prior art are as follows:

[0039] 1. This invention collects multi-dimensional operating parameters of a solid-state microwave source in real time, and constructs a nonlinear coupling model of microwave power and junction temperature and a power-temperature transfer function matrix to output the thermal load state. Then, by combining the unsteady-state heat conduction differential equation, it obtains predictive information for cooling control, and obtains information such as junction temperature change trend and instantaneous thermal overshoot judgment value in advance. This avoids the defects of traditional cooling response delay, improves the foresight of thermal management, and ensures the stable operation of the solid-state microwave source.

[0040] 2. This invention uses predicted information for cooling control to perform matching analysis and output a cooling strategy library. It divides the heat load level according to the estimated cooling power demand and realizes multi-mode adaptive switching of air cooling, liquid cooling and phase change cooling. At the same time, it dynamically adjusts the cooling mode according to the heat gradient distribution, optimizes the utilization rate of cooling resources and reduces energy waste. Attached Figure Description

[0041] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. The following drawings are not deliberately drawn to scale according to the actual size, but are intended to show the main idea of ​​this application.

[0042] Figure 1 This is a flowchart of a multi-mode cooling control method for a solid-state microwave source according to the present invention.

[0043] Figure 2 This is a block diagram illustrating the principle of a multi-mode cooling control system for a solid-state microwave source according to the present invention. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] For ease of understanding, the specific process of the embodiments of the present invention is described below. Please refer to [link / reference]. Figure 1 In one embodiment of the present invention, a multi-mode cooling control method for a solid-state microwave source includes:

[0046] Q1: Multi-dimensional status data acquisition: Real-time acquisition of multi-dimensional operating parameters of the solid-state microwave source, including the microwave output power spectrum, output impedance and junction temperature parameters of the core heating unit of the solid-state microwave source, as well as the operating parameters of the solid-state microwave source and the cooling operation parameters of the cooling system.

[0047] Q2: Thermal Load State Analysis: Based on multi-dimensional operating parameters, thermal load state analysis is performed to obtain predictive information for cooling control. The specific analysis content is as follows:

[0048] Q21: Extraction of thermal load analysis parameters: The multi-dimensional operating condition parameters are extracted and preprocessed to obtain standardized thermal load analysis parameters, which include microwave output complex impedance, real-time junction temperature value, microwave output power spectrum characteristic value, and dynamic thermal resistance value.

[0049] The standardized heat load analysis parameters are obtained by extracting and preprocessing the multidimensional operating condition parameters. The specific analysis content is as follows:

[0050] Multidimensional operating parameters are identified to obtain the microwave output power spectrum, output impedance, and junction temperature parameters. Based on the raw microwave output impedance signal, the complex impedance parameters that dynamically change with angular frequency are extracted, i.e., through their expression. Calculate the output complex impedance parameters ,in, Angular frequency, These represent the active resistance and reactive resistance, respectively, where j is the imaginary unit. It is a standardized unit in the microwave / RF engineering field that characterizes the imaginary part of a complex number. It is used to define the imaginary dimension of complex impedance and to fully describe the high-frequency electrical characteristics of microwave devices.

[0051] Based on the junction temperature parameters, the real-time junction temperature of each core heating unit is obtained. The core heating unit of the solid-state microwave source is divided into N independent heat dissipation regions according to its physical location, and its heat dissipation region number is obtained, denoted as i=1,2,…,N, where N is the total number of heat dissipation regions. Then, the real-time junction temperature of the core heating unit is marked as… t is the acquisition time, used to represent the real-time thermal state of the semiconductor junction region of each device.

[0052] Fourier transform is performed on the power signal of the microwave output power spectrum, and the peak power duty cycle is extracted as the power spectrum feature value to capture the instantaneous power fluctuation pattern under high power pulse conditions.

[0053] The real-time heat flux density of each heat dissipation area is obtained based on the junction temperature parameter. The real-time heat flux density is then compared with the real-time excitation input dynamic thermal resistance calculation formula. The dynamic thermal resistance was calculated. ;in, To collect the real-time heat flux density of the i-th heat dissipation region at time t, The ambient temperature is stored in the database.

[0054] The complex impedance parameter, real-time junction temperature, power spectrum characteristic value and dynamic thermal resistance are normalized and mapped to the interval [0, 1], and are respectively denoted as microwave output complex impedance ZK, real-time junction temperature JW, microwave output power spectrum characteristic value PG and dynamic thermal resistance RT.

[0055] Q22: Thermal Load State Prediction: By inputting the thermal load analysis parameters into the constructed nonlinear coupling model of microwave power and junction temperature, as well as the microwave power and temperature transfer function matrix, the thermal load state is obtained. The specific analysis content is as follows:

[0056] Construction of a nonlinear coupling model between microwave power and junction temperature: ,in, This is expressed as the magnitude of the complex impedance of the microwave output; The set electrical-to-thermal conversion coefficient is determined by the characteristics of the semiconductor material of the solid-state microwave source device, and the value range is set to [0.65, 0.95] through experimental calibration; The thermal inertia coefficient is determined by the thermal diffusivity of the solid-state microwave source device packaging material and is used to reflect the delay effect of junction temperature change caused by heat accumulation. The junction temperature change rate represents the dynamic fluctuation trend of the junction temperature in each heat dissipation region. The junction temperature of the core device in the above model consists of three parts: the ambient reference temperature, the temperature rise corresponding to the heat generated by the electrical characteristic conversion, and the junction temperature delay caused by thermal inertia. By introducing microwave output complex impedance and dynamic thermal resistance, deep nonlinear coupling of electrical and thermal characteristics is achieved.

[0057] Microwave power and temperature transfer function matrix construction: Linearize the coupled model of all heat dissipation areas in the rated operating point domain to construct an N-order transfer function matrix, where N is the total number of heat dissipation areas; The force transmission function of a single element in the matrix is: , The Lapss transform value of the real-time junction temperature of heat dissipation region n; is the Laplace transform value of the microwave output power spectrum characteristic value of the heat dissipation region m, where m and n can be the same region; s is the experimentally calibrated complex frequency; Let be the gain coefficient of the power in heat dissipation region m with respect to the junction temperature in heat dissipation region n. Let be the time constant of the power of heat dissipation region m with respect to the junction temperature of heat dissipation region n, both of which are experimentally calibrated constants. The above matrix represents the influence of the power of a heat dissipation region on the junction temperature of that region; when m=n, it represents the self-influence of this region; when m≠n, it represents the mutual influence of adjacent regions. The Laplace transform values ​​refer to the complex frequency domain expression obtained after performing a one-dimensional one-sided Laplace transform on the time-domain physical quantities (real-time junction temperature and microwave output power spectrum characteristic values) of the core heating element of the solid-state microwave source. The sole purpose of the transformation is to convert the differential equation in the time domain into an algebraic equation in the complex frequency domain, for example... ,in, These are the Laplace operator and the natural constant, respectively.

[0058] The thermal load analysis parameters of each heat dissipation area are input into the nonlinear coupling model of microwave power and junction temperature, as well as the microwave power and temperature transfer function matrix, to solve for the thermal load state of each heat dissipation area, including the heat generation rate and the predicted heat flux density. The heat generation rate is solved using the formula... The heat generation rate of heat dissipation region i was calculated. This represents the total heat generated per unit time within the corresponding region; the predicted heat flux density is calculated using the formula... The predicted heat flux density of heat dissipation region i is calculated, where, Let be the effective heat dissipation area of ​​heat dissipation region i, and let be the hardware structure parameters installed in this region in the database.

[0059] Q23: Generation of Predictive Information for Cooling Control: The unsteady-state heat conduction differential equation established by inputting the thermal load state is solved to obtain predictive information for cooling control, which includes junction temperature change trend value, instantaneous thermal overshoot judgment value, thermal gradient distribution value, and estimated cooling power demand. The specific solution process is as follows:

[0060] The unsteady-state heat conduction differential equation was established by obtaining the material density, specific heat capacity at constant pressure, and thermal conductivity of the semiconductor material of the solid-state microwave source heating unit from a database. ,in, These are material density, specific heat capacity at constant pressure, and thermal conductivity, respectively. The Laplace operator is used to calculate the real-time junction temperature value of the heat dissipation region i, representing the junction temperature spatial gradient.

[0061] The Laplace operator described above is a two-dimensional planar Laplace operator, suitable for two-dimensional planar thermal field analysis of the core heating element of a solid-state microwave source. Its mathematical expression is: ,in , , are the second-order partial derivatives of the real-time junction temperature value of heat dissipation region i in the x and y two-dimensional planes, respectively. Their meaning is the spatial second-order rate of change of the real-time junction temperature value of the i-th heat dissipation region of the solid-state microwave source core heating unit in the x and y two-dimensional planes. A positive value indicates that the junction temperature of this region is diffused to the surrounding area as part of the thermal field; a negative value indicates that the junction temperature of the surrounding area as part of the thermal field is concentrated in this region; and a zero value indicates that the thermal field is uniform.

[0062] The thermal load state, i.e., the heat generation rate and the predicted heat flux density, are input into the unsteady-state heat conduction differential equation and solved to obtain the predicted information for cooling control corresponding to the set look-ahead prediction time. The specific solution process is as follows:

[0063] Junction temperature change trend value: through The junction temperature change trend value was calculated. ;in, To predict the duration in advance, These are the current heat dissipation areas and their future... The predicted junction temperature at time t and the real-time junction temperature at time t. A positive value indicates an increase in junction temperature, and a larger absolute value corresponds to a higher risk of heat accumulation.

[0064] Instantaneous thermal overshoot judgment value: Pass The instantaneous thermal overshoot judgment value was calculated. ; For the current heat dissipation area in the future The predicted maximum junction temperature at any given time; This is the rated junction temperature of the heat-generating unit. A positive value indicates a risk of instantaneous thermal overshoot, which necessitates the initiation of look-ahead cooling.

[0065] Thermal gradient distribution values: via The thermal gradient distribution value was calculated. .

[0066] Estimated cooling power demand: through Calculate the estimated cooling power demand. ;in, This is the set heat transfer efficiency coefficient of the cooling system. This value represents the future efficiency of the current heat dissipation area. The minimum cooling power required inside.

[0067] Q3: Cooling strategy generation: Input the predicted information of cooling control into the set cooling strategy library for matching and output of cooling strategy.

[0068] The aforementioned cooling strategies include at least: targeting the junction temperature change trend value The dynamic response rate of the cooling intensity is adjusted based on the sign and absolute value of its value. For example, when When the junction temperature is >0 (showing an upward trend), the cooling power supply rate of the corresponding heat dissipation area is increased in stages according to the absolute value. The larger the absolute value, the more significant the increase in cooling power, in order to suppress the heat accumulation effect; when When the junction temperature is ≤0 (stable or decreasing), gradually reduce the cooling power or maintain the basic cooling level to avoid energy waste caused by excessive cooling.

[0069] For instantaneous thermal overshoot judgment value A threshold-triggered pre-cooling mechanism is used to set a safety threshold. When the temperature exceeds the safety threshold, it is determined to be a high-risk thermal overshoot condition. The backup cooling module is immediately activated, such as the thermoelectric cooler array operating at full load, the flow rate of dielectric fluid coolant is enhanced, and the cooling intensity of the corresponding heat dissipation area is increased in advance.

[0070] For thermal gradient distribution values ,when When the values ​​are large, i.e., when there are significant differences in junction temperature space, a non-uniform cooling mode is adopted, prioritizing the allocation of cooling resources to areas with concentrated thermal gradients to reduce the junction temperature differences between regions; when When the value is small, that is, when the junction temperature distribution is uniform, switch to uniform cooling mode to evenly distribute the cooling power of each heat dissipation area.

[0071] Estimated cooling power demand The load classification result is obtained by dividing the heat load based on this value, which includes a low heat load zone, a medium heat load zone, and a high heat load zone, i.e., the low heat load zone. ( (Based on the set rated cooling power threshold), the cooling strategy prioritizes air cooling to meet basic heat dissipation requirements and maximize energy savings; medium heat load area The cooling strategy employs a combined air-cooling and liquid-cooling approach, allocating the power of the two types of cooling units according to the estimated ratio; high heat load areas The cooling strategy is a multi-mode collaborative cooling mode.

[0072] Q4: Adaptive cooling power allocation: Based on the cooling strategy, adaptive cooling power allocation analysis is performed to obtain adaptive cooling commands, and cooling is executed.

[0073] Please see Figure 2 The present invention also provides a multi-mode cooling control system for a solid-state microwave source, comprising: a multi-dimensional sensing module, a control analysis and calculation module, and a cooling execution module.

[0074] The multidimensional sensing module includes at least a power spectrum sensor, an impedance sensor, and a high-response temperature sensor, which are used to collect microwave output power spectrum, output impedance, and junction temperature parameters, respectively; and the microwave output power spectrum, output impedance, and junction temperature parameters are combined to obtain the multidimensional operating parameters of the solid-state microwave source.

[0075] The control analysis and calculation module includes a heat load state analysis unit and an adaptive cooling power allocation analysis unit. The heat load state analysis unit is used to perform analysis and output predicted information and cooling strategies for cooling control; the adaptive cooling analysis unit is used to perform adaptive cooling power allocation analysis to obtain adaptive cooling commands.

[0076] Adaptive power allocation analysis, the specific analysis content of which is as follows:

[0077] Based on the predicted information for cooling control, the estimated cooling power demand, instantaneous thermal overshoot judgment value, and thermal gradient distribution value for each heat dissipation area are extracted. The ratio obtained by comparing the instantaneous thermal overshoot judgment value with the set rated junction temperature value of the heat-generating unit device is marked as the instantaneous thermal overshoot risk coefficient, i.e., by formula... The instantaneous thermal overshoot risk coefficient was calculated. The ratio obtained by comparing the thermal gradient distribution value with the calibrated maximum thermal gradient threshold is marked as the thermal gradient fit coefficient, i.e., it is obtained by using the formula... The thermal gradient fit coefficient was calculated. ,in This is the maximum thermal gradient threshold, and its value is determined by the heat dissipation characteristics of the device.

[0078] The multi-mode cooling units included in the cooling execution module are obtained, and the cooling units corresponding to each mode of the multi-mode cooling units are denoted as follows: u = 1, 2, ..., U, where u is the cooling unit number corresponding to the cooling unit, and U is the total number of modes of the cooling unit. For example... The air-cooled unit represents heat dissipation region i; the power adjustment range of each modal cooling unit is obtained and marked as follows. .

[0079] The normalized values ​​of the estimated cooling power demand, the instantaneous thermal overshoot risk coefficient, and the thermal gradient adaptation coefficient are input into the set matching degree fusion formula. The matching degree between heat dissipation region i and cooling unit u is calculated. ;in These are all set matching and fusion weights, and their values ​​were determined experimentally. ; The rated power of the cooling unit u, for example .

[0080] The system obtains the load classification results of the cooling strategy, namely, low heat load zone, medium heat load zone, and high heat load zone. When the heat dissipation area is in the low heat load zone, the adaptive cooling command calls the corresponding cooling strategy to prioritize the air cooling mode and generates the corresponding cooling control command, that is, adjusts the output power of the air cooling unit based on the matching degree, while the output power of the liquid cooling unit and the phase change cooling unit are both zero. When the heat dissipation area is in the medium heat load zone, the adaptive cooling command calls the corresponding cooling strategy to adopt the air cooling and liquid cooling co-processing mode and generates the corresponding cooling control command, that is, adjusts the output power of the air cooling unit and the liquid cooling unit based on the matching degree, while the output power of the phase change cooling unit is both zero. When the heat dissipation area is in the high heat load zone, the adaptive cooling command calls the corresponding cooling strategy to the multi-mode co-processing cooling mode and generates the corresponding cooling control command, that is, adjusts the output power of the air cooling unit, the liquid cooling unit, and the phase change cooling unit based on the matching degree.

[0081] For example, when a heat dissipation area is in a low heat load zone, the cooling strategy prioritizes air cooling. If the air cooling unit u's matching degree... If so, the unit will be controlled to operate in low-load mode; if If the liquid cooling unit and phase change cooling unit are both in shutdown mode, basic cooling will be maintained; when the other heat dissipation area is in the medium heat load zone, the cooling strategy will be to adopt a combined air cooling and liquid cooling mode. If the air cooling subunit is well matched... Liquid-cooled subunit matching degree If both subunits operate in low-load mode, the phase change cooling unit will be shut down; the 0.5 and 0.3 mentioned above are the set power and matching degree thresholds.

[0082] The cooling execution module includes a multi-mode cooling unit and a cooling execution control unit; the cooling execution control unit is used to receive adaptive cooling commands and distribute them to the multi-mode cooling unit; the multi-mode cooling unit includes at least an air-cooling unit, a liquid-cooling unit and a phase-change cooling unit, and is used to receive adaptive cooling commands and perform cooling regulation execution.

[0083] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-mode cooling control method for a solid-state microwave source, characterized in that, include: Q1: Real-time acquisition of multi-dimensional operating parameters of solid-state microwave sources; Q2: Based on multi-dimensional operating parameters, thermal load state analysis is performed to obtain predictive information for cooling control, specifically: Standardized heat load analysis parameters are obtained by extracting and preprocessing multidimensional operating condition parameters. The thermal load analysis parameters are input into the constructed nonlinear coupling model of microwave power and junction temperature, as well as the microwave power and temperature transfer function matrix, to obtain the thermal load state. The unsteady-state heat conduction differential equation established by inputting thermal load conditions is solved to obtain predictive information for cooling control. Q3: Output cooling strategies based on matching analysis using predictive information for cooling control; Q4: Based on the cooling strategy, perform adaptive cooling power allocation analysis to obtain adaptive cooling commands, and then execute the cooling.

2. The multi-mode cooling control method for a solid-state microwave source according to claim 1, characterized in that, The multi-dimensional operating parameters include the microwave output power spectrum, output impedance, and junction temperature parameters of the core heating unit of the solid-state microwave source, as well as the operating parameters of the solid-state microwave source and the cooling operation parameters of the cooling system.

3. The multi-mode cooling control method for a solid-state microwave source according to claim 1, characterized in that, The standardized heat load analysis parameters are obtained by extracting and preprocessing the multi-dimensional operating condition parameters. The specific analysis content is as follows: The core heating unit of the solid-state microwave source is divided into N independent heat dissipation regions according to its physical location, and its heat dissipation region number is obtained, denoted as i=1, 2, ..., N. The multi-dimensional operating parameters of each heat dissipation region are identified to obtain the microwave output power spectrum, output impedance, and junction temperature parameters. Based on the original acquired microwave output impedance signal, the complex impedance parameters that dynamically change with the angular frequency are extracted. Based on the junction temperature parameters, the real-time junction temperature of each core heating unit is obtained. The power signal of the microwave output power spectrum is subjected to Fourier transform, and the peak power duty cycle is extracted as the power spectrum feature value to capture the instantaneous power fluctuation law under high power pulse conditions. Based on the junction temperature parameters, the real-time heat flux density of each heat dissipation region is obtained, and the dynamic thermal resistance is calculated by combining the real-time heat flux density with the real-time excitation input dynamic thermal resistance calculation formula. The complex impedance parameters, real-time junction temperature, power spectrum characteristic value, and dynamic thermal resistance are normalized and mapped to the interval [0, 1], and denoted as microwave output complex impedance, real-time junction temperature value, microwave output power spectrum characteristic value, and dynamic thermal resistance value, respectively. The parameters are then aggregated to obtain the heat load analysis parameters.

4. The multi-mode cooling control method for a solid-state microwave source according to claim 1, characterized in that, The thermal load analysis parameters are input into the constructed nonlinear coupling model of microwave power and junction temperature, as well as the microwave power and temperature transfer function matrix, to obtain the thermal load state. The specific analysis content is as follows: A nonlinear coupling model of microwave power and junction temperature was constructed based on the thermal load analysis parameters of the heat dissipation area. Construction of microwave power and temperature transfer function matrix: Linearize the coupled model of all heat dissipation regions in the rated operating point domain to construct an N-order transfer function matrix, which is then denoted as microwave power and temperature transfer function matrix, where N is the total number of heat dissipation regions; each element in the microwave power and temperature transfer function matrix is ​​the Lapss transform value of the real-time junction temperature of the heat dissipation region. The thermal load analysis parameters of each heat dissipation area are input into the nonlinear coupling model of microwave power and junction temperature, as well as the microwave power and temperature transfer function matrix, to solve the thermal load state of each heat dissipation area, including the heat generation rate and the predicted heat flux density.

5. The multi-mode cooling control method for a solid-state microwave source according to claim 1, characterized in that, The unsteady-state heat conduction differential equation established by the thermal load state input is solved to obtain predictive information for cooling control. The specific analysis is as follows: Based on the material density, specific heat capacity at constant pressure, and thermal conductivity of the semiconductor material of the solid-state microwave source heating unit obtained from the database, an unsteady-state heat conduction differential equation was constructed. The unsteady heat conduction differential equation is used to solve the thermal load state to obtain the cooling control prediction information corresponding to the set look-ahead prediction time. This information includes the junction temperature change trend value, instantaneous thermal overshoot judgment value, thermal gradient distribution value, and cooling power demand estimate.

6. The multi-mode cooling control method for a solid-state microwave source according to claim 5, characterized in that, The unsteady-state heat conduction differential equation is used to predict and analyze the thermal load state. The specific analysis content is as follows: The heat generation rate and predicted heat flux density are obtained based on the thermal load condition; Based on the predicted heat flux density, the predicted junction temperature value of the current heat dissipation area at the corresponding time of the future forward prediction period and the real-time junction temperature value at the current time are obtained, and the junction temperature change trend value is calculated by inputting the junction temperature change trend calculation formula. Based on the predicted heat flux density, the maximum predicted junction temperature of the current heat dissipation area at the corresponding time of the future forward prediction duration is obtained, as well as the rated junction temperature value set by the heat-generating unit device. Then, the instantaneous thermal overshoot judgment value is calculated by inputting both into the instantaneous thermal overshoot judgment calculation formula. The second partial derivative of the real-time junction temperature of the current heat dissipation area in the two-dimensional plane is obtained based on the predicted heat flux density, and the heat gradient distribution value is calculated by inputting it into the heat gradient distribution calculation formula. The estimated cooling power demand is obtained by inputting the heat generation rate and the set heat exchange efficiency coefficient of the cooling system into the cooling power demand estimation formula.

7. The multi-mode cooling control method for a solid-state microwave source according to claim 6, characterized in that, The cooling strategy output based on the predicted information for cooling control is specifically as follows: The cooling strategy includes at least the following: For junction temperature change trends, adjust the dynamic response rate of cooling intensity based on the sign and absolute value of the value; for instantaneous thermal overshoot, use a threshold-triggered pre-cooling mechanism to set a safety threshold; when the value exceeds the safety threshold, it is determined to be a high-risk thermal overshoot condition, and the backup cooling module is immediately activated; for thermal gradient distribution values, when the thermal gradient distribution value is large, use a non-uniform cooling mode to prioritize the allocation of cooling resources to areas with concentrated thermal gradients; when the thermal gradient distribution value is small, switch to a uniform cooling mode to evenly distribute the cooling power to each heat dissipation area. Estimated cooling power demand The estimated cooling power demand is used to divide the heat load into three categories: low heat load, medium heat load, and high heat load. The low heat load category is determined by classifying the heat load into three zones: low heat load, medium heat load, and high heat load. The cooling strategy prioritizes air cooling to meet basic heat dissipation requirements and maximize energy savings; medium heat load area The cooling strategy employs a combined air-cooling and liquid-cooling approach, allocating the power of the two types of cooling units according to the estimated ratio; high heat load areas The cooling strategy is a multi-mode collaborative cooling mode; The set rated cooling power threshold.

8. A multi-mode cooling control system for a solid-state microwave source, characterized in that, It includes a multi-dimensional sensing module, a control analysis and calculation module, and a cooling execution module, so that the multi-mode cooling control system of the solid-state microwave source executes the multi-mode cooling control method of the solid-state microwave source as described in any one of claims 1-7.

9. A multi-mode cooling control system for a solid-state microwave source according to claim 8, characterized in that, The multidimensional sensing module includes a power spectrum sensor, an impedance sensor, a high-response temperature sensor, and an operating condition sensor, which are used to collect microwave output power spectrum, output impedance, junction temperature parameters, and operating condition parameters, respectively; and to obtain the multidimensional operating condition parameters of the solid-state microwave source by combining the microwave output power spectrum, output impedance, and junction temperature parameters. The control analysis and calculation module includes a heat load state analysis unit and an adaptive cooling power allocation analysis unit. The heat load state analysis unit is used to perform analysis and output predictive information and cooling strategies for cooling control; the adaptive cooling analysis unit is used to perform adaptive cooling power allocation analysis to obtain adaptive cooling commands. The cooling execution module includes a multi-mode cooling unit and a cooling execution control unit; the cooling execution control unit is used to receive adaptive cooling commands and distribute them to the multi-mode cooling unit; the multi-mode cooling unit includes at least an air-cooling unit, a liquid-cooling unit and a phase-change cooling unit, and is used to receive adaptive cooling commands and perform cooling regulation execution.

10. A multi-mode cooling control system for a solid-state microwave source according to claim 9, characterized in that, The adaptive power allocation analysis includes the following specific analysis content: Based on the predicted information for cooling control, the estimated cooling power demand, instantaneous thermal overshoot judgment value, and thermal gradient distribution value of each heat dissipation area are extracted; the ratio obtained by comparing the instantaneous thermal overshoot judgment value with the set rated junction temperature value of the heat-generating unit device is marked as the instantaneous thermal overshoot risk coefficient; the ratio obtained by comparing the thermal gradient distribution value with the calibrated maximum thermal gradient threshold is marked as the thermal gradient adaptation coefficient. The multi-mode cooling units included in the cooling execution module are obtained, and the cooling units corresponding to each mode of the multi-mode cooling units are denoted as follows: u = 1, 2, ..., U, where u is the cooling unit number corresponding to the cooling unit, and U is the total number of modes of the cooling unit; obtain the power adjustment range of each mode cooling unit and mark it as... ; The normalized values ​​of the estimated cooling power demand, the instantaneous thermal overshoot risk coefficient, and the thermal gradient adaptation coefficient are input into the set matching degree fusion formula to calculate the matching degree of heat dissipation region i to cooling unit u. The system obtains the load classification results of the cooling strategy, namely, low heat load zone, medium heat load zone, and high heat load zone. When the heat dissipation area is in the low heat load zone, the adaptive cooling command calls the corresponding cooling strategy to prioritize the air cooling mode and generates the corresponding cooling control command, that is, adjusts the output power of the air cooling unit based on the matching degree, while the output power of the liquid cooling unit and the phase change cooling unit are both zero. When the heat dissipation area is in the medium heat load zone, the adaptive cooling command calls the corresponding cooling strategy to adopt the air cooling and liquid cooling co-processing mode and generates the corresponding cooling control command, that is, adjusts the output power of the air cooling unit and the liquid cooling unit based on the matching degree, while the output power of the phase change cooling unit is both zero. When the heat dissipation area is in the high heat load zone, the adaptive cooling command calls the corresponding cooling strategy to the multi-mode co-processing cooling mode and generates the corresponding cooling control command, that is, adjusts the output power of the air cooling unit, the liquid cooling unit, and the phase change cooling unit based on the matching degree.

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