Modular immersion server and cooling control method thereof

Abstract

The present application relates to computer, especially the technical field of server, specifically relates to modular immersion server and its cooling control method.The full immersion liquid cooling system in the related art is to immerse the server or all card components in the cooling liquid in the same sealed space, because the heat dissipation of different card components is very different, the heat capacity of the cooling liquid is difficult to be efficiently utilized, and the circulation efficiency of the cooling liquid is insufficient.The present application separately configures immersion liquid cooling modules for different card components, so that the circuit board is completely immersed in the cooling liquid, and each module is independent, realizing the distributed full immersion liquid cooling effect characterized by modules.Low-temperature cooling liquid enters the sealed cavities of each immersion liquid cooling module, is heated and then discharged in the sealed cavities.The cooling control system controls the temperature and flow of each immersion liquid cooling module in real time, can fully utilize the heat capacity of the cooling liquid, and can greatly reduce the circulation power consumption of the cooling liquid.

Description

Technical Field

[0001] This invention relates to the field of computer technology, particularly server technology, and more specifically, to a modular immersion server and its cooling control method. Background Technology

[0002] Traditional server liquid cooling technologies are mainly divided into cold plate liquid cooling, single-phase full immersion liquid cooling, and phase change full immersion liquid cooling. Cold plate liquid cooling involves directly attaching a customized cooling plate to the heat-generating components. However, this "partial attachment" cooling method cannot cover heat-generating areas other than the core components, making it difficult to guarantee efficient cooling. Single-phase full immersion liquid cooling and phase change full immersion liquid cooling, on the other hand, completely immerse the server in coolant within a sealed enclosure, achieving overall server cooling and are widely used.

[0003] However, both single-phase full immersion liquid cooling and phase change full immersion liquid cooling technologies require ultra-large centralized enclosures (typically occupying 10-20 square meters) and complex piping networks running through the data center (pipeline lengths can reach hundreds of meters). Coolant is distributed to each rack through the main pipeline, then flows through the enclosure where the server is located, absorbs heat, and then flows back to the heat exchanger for heat exchange, forming a global circulation. Relying on large enclosures and complex piping networks, these technologies have stringent requirements for data center space and poor adaptability. Deployment requires multiple stages, including piping laying, enclosure installation, sealing testing, and system debugging, with a cycle of 1-3 months. When a single server fails, the entire supply and return liquid pipeline must be shut down or the entire liquid cooling system must be suspended before the server can be disassembled for repair, with maintenance time exceeding 2 hours. This severely impacts the operation of data centers, financial transaction systems, and other businesses with extremely high continuity requirements, resulting in poor maintenance convenience. Summary of the Invention

[0004] The purpose of this invention is to provide a modular immersion server and its cooling control method to improve the technical problems of long deployment cycle, poor adaptability and ease of operation and maintenance of the existing full immersion liquid cooling technology.

[0005] The modular immersion server provided by this invention includes a housing and at least one immersion liquid cooling module located within the housing. Each immersion liquid cooling module has a separate circuit board and a separate sealed cavity. Each sealed cavity is provided with an inlet and an outlet for connecting to a liquid cooling circulation system. The liquid cooling circulation system is configured to introduce coolant from the inlet and discharge it from the outlet, thereby forming a flowing coolant within the sealed cavity. The circuit board is immersed in the coolant within the sealed cavity. The immersion liquid cooling module includes at least one of a computing power board module and a motherboard board module.

[0006] In one possible implementation, the computing board module has a separate computing board and a separate computing board sealed cavity, wherein the computing board and the electronic components mounted thereon are immersed in the coolant in the computing board sealed cavity.

[0007] The computing power board module has a computing power board module coolant distributor and a computing power board module coolant manifold. The computing power board module coolant distributor has multiple outlets, and the computing power board module coolant manifold has multiple inlets. The outlets of the computing power board module coolant distributor and the inlets of the computing power board module coolant manifold are respectively connected to the sealed cavity of the computing power board. The inlets of the computing power board module coolant distributor and the outlets of the computing power board module coolant manifold are respectively used to connect to the liquid cooling circulation system.

[0008] In one possible implementation, the motherboard module has a separate motherboard board and a separate motherboard board sealed cavity, wherein the motherboard board and the electronic components mounted thereon are immersed in the coolant within the motherboard board sealed cavity.

[0009] The motherboard module includes a motherboard module coolant distributor and a motherboard module coolant manifold. The motherboard module coolant distributor has multiple outlets, and the motherboard module coolant manifold has multiple inlets. The outlets of the motherboard module coolant distributor and the inlets of the motherboard module coolant manifold lead to the sealed cavity of the motherboard module, and the inlets of the motherboard module coolant distributor and the outlets of the motherboard module coolant manifold are respectively used to connect to the liquid cooling circulation system.

[0010] As one possible implementation, the modular immersion server further includes a separate storage module, which has a memory and a separate storage sealed cavity. The memory is immersed in coolant within the storage sealed cavity, and the storage sealed cavity is provided with independent coolant inlet and outlet.

[0011] As one possible implementation, the modular immersion server further includes a separate power board module, which has a separate power board and a separate power board sealed cavity. The power board and the electronic components mounted thereon are immersed in the coolant within the power board sealed cavity.

[0012] The power board module has a power board module coolant distributor and a power board module coolant manifold. The power board module coolant distributor has multiple outlets, and the power board module coolant manifold has multiple inlets. The outlets of the power board module coolant distributor and the inlets of the power board module coolant manifold are respectively connected to the sealed cavity of the power board. The inlets of the power board module coolant distributor and the outlets of the power board module coolant manifold are respectively used to connect to the liquid cooling circulation system.

[0013] In one possible implementation, the housing has several module mounting positions, each of which is used to independently install the computing power board module, the motherboard board module, the storage module and / or the power supply board module. Each module can be connected to and disassembled with fluid to its corresponding module mounting position.

[0014] As one possible implementation, the modular immersion server further includes a main pipeline and multiple independent module branches, with the sealed cavity of each immersion liquid cooling module connected to the main pipeline through the module branch.

[0015] Each of the module branches is equipped with a flow regulating valve, which is used to regulate the flow of the corresponding module branch.

[0016] As one possible implementation, temperature sensors are provided on the immersion liquid cooling module, the module branches, and the main pipeline, and the temperature sensors are electrically connected to the central controller; And / or, each of the immersion liquid cooling modules is equipped with a liquid level sensor, and the liquid level sensor is electrically connected to the central controller; And / or, the module branch is equipped with a flow meter, which is electrically connected to the central controller and is used to collect the flow value of the module branch.

[0017] As one possible implementation, the modular immersion server further includes a display module, a keyboard, and a touchpad. The display module is embedded and fixed to the front panel of the housing and is used to display the cooling status of various parts of the server. The keyboard and the touchpad are used to adjust the information displayed by the display module and configure server parameters.

[0018] The present invention provides a cooling control method for a modular immersion server, used for cooling control of the aforementioned modular immersion server, the method comprising: Acquire the temperature, liquid level, and heating rate of each immersion liquid cooling module, as well as the flow rate and flow change rate of each module branch; If at least one of the temperature value, the liquid level value, the heating rate, the flow rate, and the flow rate change rate exceeds the corresponding threshold range, the fault location will be determined in real time, and the fault will be eliminated or the faulty module will be replaced in a timely manner.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention features a modular design for the immersion server, enabling individual cooling of each immersion liquid cooling module within the server. This allows for independent closed-loop liquid cooling for a single server, eliminating reliance on large enclosures and complex piping networks, offering high flexibility and adaptability, and allowing the server to be installed in a rack-mount structure. During maintenance, only the faulty module needs to be disassembled and replaced, without disassembling the entire server, greatly improving ease of maintenance; and a single server failure will not affect the operation of other servers or the cluster. Furthermore, in the event of a localized leak, only the affected server is impacted, allowing for rapid response and avoiding widespread equipment damage caused by leaks in centralized systems.

[0020] This invention immerses the circuit boards and electronic components of each immersion liquid cooling module in the coolant within the corresponding sealed cavity, thereby achieving close contact between the coolant and the circuit boards and electronic components within the immersion liquid cooling module. This fully immersion liquid cooling method enables zero-distance thermal coupling, which can improve the heat exchange efficiency between the coolant and the electronic components, thereby enhancing the cooling effect.

[0021] It should be noted that modules with different functions (such as computing power board modules and motherboard modules) have different structures and power consumption. Furthermore, the power consumption of electronic components with the same function integrated on different circuit boards is not entirely the same. Setting up separate circuit boards and separate sealed cavities in each immersion liquid cooling module allows different circuit boards to be immersed in coolant in different sealed cavities. This not only provides the possibility for differentiated flow distribution and improves the cooling effect of each immersion liquid cooling module, but also facilitates structural layout. The computing power board module and motherboard module are key heat-generating structures in the server. Cooling these modules can ensure the heat dissipation efficiency of the modular immersion server. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a modular immersion server provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the overall structure of the modular immersion server provided in an embodiment of the present invention; Figure 3a and Figure 3b This is a schematic diagram of the internal structure of a modular immersion server provided in an embodiment of the present invention; Figure 4a and Figure 4b This is a schematic diagram of the internal structure of another modular immersion server provided in an embodiment of the present invention; Figure 5 This is a schematic flowchart illustrating the cooling control method for a modular immersion server provided in an embodiment of the present invention.

[0024] Explanation of reference numerals in the attached figures: 100 - Immersion liquid cooling module; 110 - Computing power board module; 111 - Computing power board module coolant distributor; 112 - Inlet pipe; 113 - Return pipe; 114 - Computing power board module sealed housing; 115 - Heat sink; 116 - Computing power board; 120 - Motherboard module; 121 - Motherboard module coolant distributor; 122 - Motherboard module coolant manifold; 123 - Jet radiator; 124 - Motherboard module sealed housing; 125 - CPU; 130 - Power supply module; 200 - Module branch; 210 - Flow regulating valve; 220 - Computing power board module branch; 230 - Motherboard board module branch; 240 - Power supply board module branch; 300 - Housing; 310 - Front panel; 400 - Display Module; 500-keyboard; 600-Touchpad. Detailed Implementation

[0025] This invention breaks through the traditional centralized liquid cooling design, taking "single-unit independent closed-loop liquid cooling" as the core architecture, using single-phase refrigerant as the heat transfer carrier, and integrating key technologies such as fully modular disassembly, precise distribution of three-stage flow channels, and intelligent temperature control to form a single-phase modular fully immersed liquid cooling system.

[0026] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings.

[0028] See Figure 1 , Figure 2 , Figure 3a and Figure 4a One embodiment of the present invention provides a modular immersion server, comprising a housing 300 and at least one immersion liquid cooling module 100 located within the housing 300. Each immersion liquid cooling module 100 has a separate circuit board and a separate sealed cavity. Each sealed cavity is provided with an inlet and an outlet for connecting to a liquid cooling circulation system. The liquid cooling circulation system is configured to introduce coolant through the inlet and discharge it through the outlet, thereby forming a flowing coolant within the sealed cavity. The circuit board is immersed in the coolant within the sealed cavity. The immersion liquid cooling module 100 includes at least one of a computing power board module 110 and a motherboard board module 120. "At least one" can refer to one, two, or more modules; similarly, "at least one" can refer to one or both. That is, at least one immersion liquid cooling module 100 can be a module with the same function, such as at least one computing power board module 110 or at least one motherboard board module 120; or it can be a module with different functions, such as at least one computing power board module 110 and at least one motherboard board module 120. In addition, the "liquid cooling circulation system" includes both the system that drives the coolant to circulate back and forth, and the system that injects new coolant into the sealed cavity and completely drains and discards the old coolant.

[0029] During operation, a liquid cooling circulation system is used to inject low-temperature coolant into the sealed cavity of each immersion liquid cooling module 100. The coolant entering the sealed cavity of each immersion liquid cooling module 100 can absorb the heat emitted by the electronic components on the circuit board inside. After absorbing heat and rising in temperature, the coolant in the sealed cavity can be discharged by the liquid cooling circulation system. Thus, the coolant can carry away the heat emitted by the electronic components on the circuit board, achieving the cooling and heat dissipation effect of each immersion liquid cooling module 100.

[0030] In other words, this embodiment features a modular design for the immersion server. Based on this, it enables individual cooling of each immersion liquid cooling module 100 within the server. This allows for independent closed-loop liquid cooling of a single server, eliminating reliance on large enclosures and complex piping networks. The footprint is only 1 / 5 to 1 / 10 of centralized systems. It can be deployed in edge computing nodes (such as 5G base station edge rooms, portable outdoor server rooms, adaptable to ambient temperatures of -10℃ to 45℃), small data centers (such as enterprise-level server rooms), financial data centers, and other spatial scenarios. No special server room modifications are required; only conventional power supply (220V / 380V) and ventilation are needed. It offers strong flexibility and adaptability, and the server can also be installed in a rack structure. The independent liquid output of a single unit is relatively small (generally 5~10L), eliminating the risk of large-scale centralized liquid storage. During deployment, there is no need for complex piping laying, enclosure installation, or other steps; it can be debugged and put into operation immediately, shortening the deployment cycle from 1-3 months to 1-3 days. During fault maintenance, only the faulty module needs to be disassembled and replaced individually, without disassembling the entire server. Maintenance time can be reduced from over 2 hours to less than 30 minutes, greatly improving the convenience of operation and maintenance. Moreover, the failure of a single server will not affect the operation of other servers or the cluster, with business interruption time being almost zero, and equipment availability increasing to over 99.9%. In addition, when a local leakage occurs, it only affects a single server, allowing for rapid handling and avoiding large-scale equipment damage caused by leakage in a centralized system.

[0031] In this embodiment, the circuit boards and electronic components of each immersion liquid cooling module 100 are respectively immersed in the coolant in the corresponding sealed cavity. This can achieve close contact between the coolant in the immersion liquid cooling module 100 and the circuit board and electronic components. This full immersion liquid cooling method can achieve zero-distance thermal coupling, with a thermal resistance as low as 0.05K / W, which is more than 60% lower than the thermal resistance of traditional heat dissipation methods. This can improve the heat exchange efficiency between the coolant and the electronic components, thereby improving the cooling effect.

[0032] It should be noted that modules with different functions (such as computing power board module 110 and motherboard board module 120) have different structures and power consumption, and the power consumption of electronic components with the same function integrated on different circuit boards is not exactly the same. In this embodiment, each immersion liquid cooling module 100 is provided with a separate circuit board and a separate sealed cavity, so that different circuit boards are immersed in coolant in different sealed cavities. This not only provides the possibility of differentiated flow distribution and improves the cooling effect of each immersion liquid cooling module 100, but also facilitates structural layout. In addition, computing power board module 110 and motherboard board module 120 are key heat-generating structures in the server. The power consumption of the GPU can reach 300~2000W, and the power consumption of the CPU can reach 300~2000W. Individual cooling of the above modules can ensure the heat dissipation efficiency of the modular immersion server.

[0033] The aforementioned computing power board module 110 is a hardware device focused on providing high-performance computing capabilities, with its core comprising various computing power boards and supporting components. The computing power boards cover a variety of AI chip boards, such as GPUs (Graphics Processing Units), NPUs (Neural Processing Units), TPUs (Tensor Processing Units), MCUs (Microcontroller Units), NVIDIA GB200, and FPGAs (Field-Programmable Gate Arrays). Supporting components include power supply modules, heat dissipation modules, and interface circuits, which ensure stable and efficient operation of the boards and adapt to different deployment environments and computing needs.

[0034] The aforementioned motherboard module 120 serves as the core carrier of the computer hardware system, acting as a "bridge" connecting various hardware devices. It primarily contains key components supporting hardware operation, specifically including the following structures: a CPU socket for securing the CPU and facilitating signal transmission between the CPU and other motherboard components; memory slots for installing memory modules, providing the CPU with high-speed data caching and temporary data storage space; a chipset for data transmission management, I / O interface control, system resource allocation, power and consumption management, and coordinating communication between the CPU, memory, graphics card, and other hardware; a BIOS chip for providing the lowest-level, most direct hardware control, responsible for power-on self-test (POST), system boot, and hardware parameter configuration; PCIe expansion slots for installing graphics cards, sound cards, network cards, computing cards, and other expansion hardware, enabling high-speed data transmission between these devices and the motherboard's core components via the PCIe bus; and I / O interfaces for connecting and exchanging data between the server and external devices (such as mice, keyboards, monitors, printers, etc.).

[0035] In fact, each immersion liquid cooling module 100 has a separate heat dissipation interface, electrical interface and mechanical fixing structure.

[0036] See Figure 3a , Figure 3b , Figure 4a and Figure 4bThe aforementioned computing board module 110 has a separate computing board 116 and a separate computing board sealed cavity. The computing board 116 and the electronic components mounted thereon are immersed in the coolant within the computing board sealed cavity. The computing board module 110 also has a computing board module coolant distributor 111 and a computing board module coolant manifold (not shown in the figure). The computing board module coolant distributor 111 has multiple coolant outlets, and the computing board module coolant manifold has multiple inlets. The coolant outlets of the computing board module coolant distributor 111 and the coolant inlets of the computing board module coolant manifold are respectively connected to the computing board sealed cavity, and the coolant inlets of the computing board module coolant distributor 111 and the coolant outlets of the computing board module coolant manifold are connected to the liquid cooling circulation system. In this way, the liquid cooling circulation system can divert coolant from different locations into the sealed cavity of the computing board 116 via the computing board module coolant distributor 111. After the coolant absorbs heat dissipated by the GPU and other electronic components on the computing board 116 and becomes warm, it can flow back to the liquid cooling circulation system via the computing board module coolant manifold, thereby cooling the computing board 116. It should be noted that the arrangement of the computing board module coolant distributor 111 and the computing board module coolant manifold can make the temperature distribution of the coolant in the sealed cavity of the computing board more uniform, thus improving the cooling efficiency. Preferably, the computing board module coolant distributor 111 and the computing board module coolant manifold are respectively located on opposite sides of the computing board module 110.

[0037] A channel distributor can be selected as the coolant distributor 111 for the aforementioned computing board module. The orifice diameter of different regions of the channel distributor is positively correlated with the power of the electronic components in the corresponding regions of the computing board 116. That is, regions of the channel distributor corresponding to high-power electronic components can be configured with larger-diameter coolant outlets to obtain more coolant and ensure cooling effect; while regions of the channel distributor corresponding to low-power electronic components can be configured with smaller-diameter coolant outlets to obtain less coolant and reduce waste. This achieves a differentiated distribution effect, balancing the cooling effect of each electronic component on the computing board 116 with the flow resistance of the coolant in the corresponding regions of the sealed cavity, which is beneficial for improving the cooling efficiency of the computing board 116. For example, the orifice diameter for regions corresponding to high-power electronic components can be selected as 0.8-1mm, and the orifice diameter for regions corresponding to low-power electronic components can be selected as 0.3-0.5mm.

[0038] Each computing board module 110 includes a computing board module sealing housing 114, an inlet pipe 112, and a return pipe 113. The computing board module sealing housing 114 forms the aforementioned computing board sealing cavity, which contains heat sinks 115. The outlet of the inlet pipe 112 is connected to the inlet of the computing board module coolant distributor 111, and the inlet of the return pipe 113 extends into the computing board module sealing housing 114. The heat sink 115 is fixed to the computing board 116 with screws. One side of the heat sink 115 is a flat, heat-conducting contact surface facing the computing board, and the other side is a horizontal grid fin, which is a high thermal conductivity metal cold plate (copper or aluminum alloy). The coolant injected into the inlet pipe 112 can be distributed and accelerated by the computing board module coolant distributor 111, guided to the heat sink, and flushed on the fin surface to promote laminar flow. After efficient heat absorption, it flows out through the return pipe. The thickness of the horizontal grid fins of the heat sink 115 is about 2mm. The spacing is negatively correlated with the power of the corresponding electronic components. That is, the horizontal grid fins of the heat sink 115 are more densely distributed in the area corresponding to the electronic components with higher power, while the horizontal grid fins of the heat sink 115 are more sparsely distributed in the area corresponding to the electronic components with lower power. The differentiated flow distribution effect is more significant, which is conducive to improving the cooling efficiency of the cooling fluid on the computing board module 110.

[0039] The cooling fluid distributor 111 of the computing board module can be fixed to the corresponding inlet pipe 112 via a snap-fit ​​connection or a threaded connection (such as using an M5×10 stainless steel thread with a PTFE sealing gasket). The threaded connection method, achieved by rotating and tightening, secures the cooling fluid distributor 111 to the inlet pipe 112, providing superior sealing performance and withstanding higher fluid pressures (≤3 bar). It achieves the same sealing effect and fixing strength as the snap-fit ​​method, ensuring precise distribution of coolant according to the designed orifice diameter, and is suitable for high-pressure, high-flow-rate special applications.

[0040] See also Figure 3a , Figure 3b , Figure 4a and Figure 4bThe aforementioned motherboard module 120 has a separate motherboard board and a separate motherboard board sealed cavity. The motherboard board and the electronic components integrated thereon are immersed in coolant within the motherboard board sealed cavity. The motherboard module 120 has a motherboard module coolant distributor 121 and a motherboard module coolant manifold 122. The motherboard module coolant distributor 121 has multiple outlets, and the motherboard module coolant manifold 122 has multiple inlets. The outlets of the motherboard module coolant distributor 121 and the inlets of the motherboard module coolant manifold 122 are respectively connected to the motherboard board sealed cavity, and the inlets of the motherboard module coolant distributor 121 and the outlets of the motherboard module coolant manifold 122 are respectively connected to the liquid cooling circulation system. In this way, the liquid cooling circulation system can divert the coolant through the motherboard module coolant distributor 121 and inject it into the sealed cavity of the motherboard from different locations. After the coolant absorbs the heat dissipated by electronic components such as the CPU 125 on the motherboard and becomes warm, it can flow back to the liquid cooling circulation system through the motherboard module coolant manifold 122, thereby cooling the motherboard module 120. It should be noted that the arrangement of the motherboard module coolant distributor 121 and the motherboard module coolant manifold 122 can make the temperature distribution of the coolant in the sealed cavity of the motherboard more uniform and improve the cooling efficiency. Preferably, the motherboard module coolant distributor 121 and the motherboard module coolant manifold 122 are respectively located on opposite sides of the motherboard module 120.

[0041] Preferably, the outlet of the motherboard module coolant distributor 121 is set lower than the inlet of the motherboard module coolant manifold 122. The density of coolant is positively correlated with temperature, and the lower the density of coolant, the higher it will rise. Therefore, the temperature of coolant will rise with the height of its position, that is, the temperature of coolant at the top is higher. Setting the motherboard module coolant manifold 122 at a slightly higher position can preferentially discharge the relatively high-temperature coolant in the sealed cavity of the motherboard, which is beneficial to improving the utilization rate of coolant by the motherboard and improving cooling efficiency.

[0042] A jet heatsink 123 can also be installed in the motherboard module 120 to cool electronic components (such as the CPU 125), thereby improving the cooling speed. In fact, the CPU 125 on the motherboard is connected to the circuit board, and the power consumption of other components on the circuit board is only 5~20W, far lower than the power consumption of the CPU 125 (300~2000W). Therefore, adding a jet heatsink 123 to the CPU 125 ensures its cooling effect, and avoids coolant redundancy in other areas, allowing for full utilization of cooling resources (resource utilization rate can reach over 85%), resulting in high overall cooling efficiency.

[0043] The motherboard module 120 also includes a sealed housing 124, a jet heatsink 123, and a coolant distributor 121 connected to corresponding module branches 200 via a T-junction. The bottom of the jet heatsink 123 is fixed to the top of the motherboard. The jet heatsink is equipped with 16-32 millimeter-level nozzles (0.3mm orifice diameter); the motherboard surface has a uniform cooling surface. After the coolant is injected, one path flows through the jet heatsink 123 to directionally cool the CPU 125, while the other path flows out through the motherboard module coolant distributor 121 to cover the motherboard, achieving a combination of local and global heat dissipation. The motherboard module coolant manifold 122 receives the overflow from the jet heatsink 123 and the coolant flowing through the cooling surface before discharging it.

[0044] As an alternative, the jet heatsink 123 can be side-mounted to an L-shaped aluminum alloy bracket using M4 bolts. This bracket can be fixed to the inner wall of the motherboard module sealing housing 124, and its angle can be adjusted up, down, left, and right. Specifically, the side-mounting of the jet heatsink 123 facilitates its maintenance and replacement, making it suitable for scenarios with special motherboard layouts.

[0045] The motherboard uses the ATX standard form factor and includes interfaces such as PCIe 4.0 and SATA III, supporting replacement of motherboards of different brands and models.

[0046] This embodiment also includes a separate storage module, which has a memory and a separate storage sealed cavity. The memory is immersed in the coolant in the storage sealed cavity, thus achieving full immersion liquid cooling of the storage module and improving the heat exchange efficiency between the coolant and the memory. The structure and power consumption of the storage module are different from those of the aforementioned computing board module 110 and motherboard board module 120. It is provided with a separate storage sealed cavity, and has independent coolant inlet and coolant outlet. This allows for the implementation of a separate cooling strategy for the storage module, which is beneficial to improving the cooling effect of the storage module.

[0047] This embodiment also includes a separate power supply board module 130. The power supply board module 130 has a separate power supply board and a separate power supply board sealing cavity. The power supply board and the electronic components mounted on it are immersed in the coolant within the power supply board sealing cavity. This allows for direct contact between the coolant within the sealing cavity and the power supply board and the electronic components mounted on it, thereby improving the heat exchange efficiency between the coolant and the electronic components on the power supply board, and consequently, enhancing the cooling effect of the coolant on the power supply board module 130. It should be noted that the power supply board module 130 is one of the key heat-generating structures in the server. Immersing it for cooling ensures the overall heat dissipation efficiency. Furthermore, the structure and power consumption of the power supply board module 130 differ from those of the aforementioned computing board module 110 and motherboard board module 120. Providing it with a separate power supply board sealing cavity allows for a separate cooling strategy for the power supply board module 130, which is beneficial for improving its cooling effect.

[0048] The power supply module 130 includes a power supply module coolant distributor and a power supply module coolant manifold. The power supply module coolant distributor has multiple outlets, and the power supply module coolant manifold has multiple inlets. The outlets of the power supply module coolant distributor and the inlets of the power supply module coolant manifold are respectively connected to the sealed cavity of the power supply module, and the inlets of the power supply module coolant distributor and the outlets of the power supply module coolant manifold are respectively connected to the liquid cooling circulation system. In this way, the liquid cooling circulation system can divert coolant from the power supply module coolant distributor and inject it into the sealed cavity of the power supply module from different locations. After the coolant absorbs heat dissipated by the electronic components on the power supply module and heats up, it can flow back to the liquid cooling circulation system through the power supply module coolant manifold, thus cooling the power supply module. It should be noted that the design of the motherboard module coolant distributor and the power supply module coolant manifold allows for a more uniform temperature distribution of the coolant within the sealed cavity of the power supply module, improving cooling efficiency. Preferably, the power board module coolant distributor and the power board module coolant manifold are respectively located on opposite sides of the power board module 130.

[0049] The power supply board module 130 has an output power of 500-2500W. It can also be equipped with a speed-regulating centrifugal water pump to adjust the flow rate of coolant entering the sealed cavity of the power supply board, meeting the requirements for all-weather high-load operation. In this embodiment, the power supply board module 130 is located below the motherboard board module 120.

[0050] Preferably, a plurality of module mounting positions can be provided on the housing 300. Each module mounting position is used to independently install the computing power board module 110, the motherboard board module 120, the storage module, and / or the power supply board module 130. The aforementioned immersion liquid-cooled modules (computing power board module 110, motherboard board module 120, storage module, and power supply board module 130) and their corresponding module mounting positions can be connected and disassembled with liquid. In practical applications, modules can be selected as needed, and the selected modules can be installed in their corresponding module mounting positions, thereby improving flexibility. In fact, in this embodiment, the plurality of module mounting positions for installing the computing power board module 110 are arranged side by side, that is, the plurality of computing power board modules 110 are installed side by side; in a specific embodiment, the number of module mounting positions for installing the computing power board module 110 can be set to 8, that is, supporting the expansion of 1 to 8 computing power boards.

[0051] In this embodiment, a main pipeline and multiple independent module branches 200 can also be provided. The sealed cavities of each immersion liquid cooling module are connected to the main pipeline through the module branches 200, forming a three-level flow channel system of "main pipeline-branch pipeline-component end". In this way, the coolant entering the main pipeline can be distributed to each module branch 200 and then flow into the sealed cavity of the immersion liquid cooling module through the module branch 200, thereby achieving cooling and heat dissipation for each immersion liquid cooling module 100. The diameter of the main pipeline can be selected as DN20, and the diameter of the module branch 200 can be selected as DN10~DN15.

[0052] See Figure 3a and Figure 4a As one possible implementation, the module branch 200 can be configured into three groups, corresponding to the computing power board module 110, the motherboard board module 120, and the power supply board module 130, respectively. Each group includes one liquid inlet branch and one liquid return branch located on both sides inside the housing 300. The three liquid inlet branches are distributed vertically, and the three liquid return branches are also distributed vertically, and are respectively fixed to the server housing 300 by bolts. Specifically, the module branch 200 corresponding to the computing power board module 110 can be defined as computing power board module branch 220, the module branch 200 corresponding to the motherboard board module 120 can be defined as motherboard board module branch 230, and the module branch 200 corresponding to the power supply board module 130 can be defined as power supply board module branch 240. Among them, the motherboard board module branch 230 can also be used to communicate with the sealed cavity of the immersion liquid cooling module of other modules (such as storage modules). After a module is installed in any module mounting position, the sealing cavity of that module can be connected to the corresponding module branch 220 through the corresponding inlet and outlet pipes.

[0053] Specifically, the power board module 130 may also be equipped with a quick connector (supporting hot-swappable replacement) for quick docking with the power board module branch 230.

[0054] A flow regulating valve 210 can be installed at each module branch 200. The flow regulating valve 210 can be used to regulate the flow of the corresponding module branch 200. When the coolant flow of a certain module branch 200 is too large (e.g., when the electronic components in the corresponding immersion liquid cooling module 100 are operating at low power), the opening of the flow regulating valve 210 can be reduced to decrease the coolant flow through the corresponding immersion liquid cooling module 100. When the coolant flow of a certain module branch 200 is too small (e.g., when the corresponding immersion liquid cooling module 100 has instantaneous high power headlights), the opening of the flow regulating valve 210 can be increased to increase the coolant flow through the corresponding immersion liquid cooling module 100. Thus, the coolant flow of each module branch 200 can be matched with the heat dissipation of its corresponding immersion liquid cooling module 100. Furthermore, if a certain immersion liquid cooling module 100 or a certain module branch 200 malfunctions, the flow regulating valve 210 corresponding to the immersion liquid cooling module 100 or module branch 200 can be controlled to shut off, thereby cutting off the coolant passage of the branch, which facilitates the subsequent disassembly or replacement of the immersion liquid cooling module 100 or module branch 200.

[0055] Of course, a main flow regulating valve can be installed on the main pipeline. The opening of the main flow regulating valve can be adjusted according to the overall load of the machine to dynamically adjust the total flow of coolant. The adjustment range of the main flow regulating valve can be set to 0-5L / min.

[0056] A circulating pump and heat exchanger can also be installed. The circulating pump is connected to the main pipeline, and the heat exchanger is placed between the main pipeline and the circulating pump. The circulating pump enables the coolant to circulate among the main pipeline, heat exchanger, module branch 200, and submerged liquid-cooled module 100. After absorbing heat and heating up, the coolant flows back to the heat exchanger through the main pipeline, where it is cooled down by heat exchange. After cooling down, it re-enters the sealed cavity of the submerged liquid-cooled module 100 through the main pipeline and module branch 200 to absorb the heat dissipated by the submerged liquid-cooled module 100. In this way, the coolant can complete the "heat absorption-return-heat release" cycle within a single unit. Of course, a circulating pump can also be omitted, and natural convection can be used to achieve the circulation of the coolant.

[0057] The fully immersion centralized liquid cooling system in related technologies requires a large circulating pump with a power exceeding 5kW to drive hundreds of liters of coolant through a complex piping network. Even when the equipment is under low load (such as server utilization below 30%), the circulating pump still needs to maintain high power operation, resulting in ineffective energy consumption exceeding 40%. The circulating pump in this embodiment is a micro circulating pump, with a power of only 300-500W, which is 90% lower than the power of a large circulating pump exceeding 5kW. In addition, under low load (server utilization ≤30%), the circulating pump speed can be dynamically reduced, further saving energy by more than 30%, and saving approximately 2,000-3,000 yuan in electricity costs per server per year.

[0058] The aforementioned heat exchanger can be a compact type, with a volume of less than 0.05 m³, which helps to reduce the space occupied. Specifically, the heat exchanger can be a plate-fin heat exchanger, using chilled water from an industrial chiller as the cooling medium. After absorbing heat (temperature rise of 5-8℃), the coolant flows into the heat exchanger and dissipates the heat through forced convection. The heat exchange efficiency reaches 300 W / (m²·K), and it can transfer 2-4 kW of heat per unit time, ensuring that the temperature of the core components remains stable below 65℃ when the server is running at full load, with a temperature control accuracy of ±1℃. As an alternative, a shell-and-tube heat exchanger can be used instead of a plate-and-fin heat exchanger. The shell-and-tube heat exchanger can be configured with a shell diameter of 50 mm, 16 tubes, and a tube length of 200 mm. The shell-and-tube heat exchanger achieves heat dissipation through heat exchange between the coolant inside the tubes and the air outside the tubes, with a heat exchange efficiency of 180 W / (m²·K). It has a more robust structure, stronger impact resistance, and better sealing performance, making it suitable for harsh environments with high vibration and dust levels (such as outdoor computer rooms and industrial settings).

[0059] Preferably, temperature sensors can be installed in the immersion liquid cooling module 100, module branch 200, and main pipeline to sense the temperature values ​​in the immersion liquid cooling module 100, module branch 200, and main pipeline; the temperature sensors are electrically connected to the central controller so that the central controller can adjust the coolant flow rate at the corresponding location according to the temperature value sensed by the temperature sensor.

[0060] If the temperature of a certain immersion liquid cooling module 100 or a certain module branch 200 reaches the temperature threshold, the opening of the corresponding flow regulating valve 210 is increased to increase the flow rate of coolant entering the corresponding position, thereby increasing the cooling and cooling speed. This allows the temperature at the corresponding position to drop below the first temperature threshold as quickly as possible. In other words, by controlling energy consumption on demand, ineffective losses are reduced, and overheating of certain immersion liquid cooling modules 100 or module branches 200 is less likely to occur, ensuring operational reliability. At the same time, it also reduces the risk of resource waste in certain immersion liquid cooling modules 100 or module branches 200, which is beneficial to improving the utilization rate of heat dissipation resources.

[0061] Preferably, the temperature sensor is placed in 8 to 12 key heat-generating components such as the CPU, GPU, and power supply IGBT devices. The accuracy of the temperature sensor can be selected as ±0.1℃.

[0062] Furthermore, a liquid level sensor can be installed in each immersion liquid cooling module 100 to sense the liquid level in the sealed cavity of each immersion liquid cooling module 100. The liquid level sensor is electrically connected to the central controller so that the central controller can adjust the coolant flow rate in the sealed cavity of the corresponding immersion liquid cooling module 100 according to the liquid level value sensed by the liquid level sensor. For example, the central controller can adjust the opening of the flow regulating valve 210 according to the liquid level value sensed by the liquid level sensor, and can also select to adjust the speed of the circulating pump.

[0063] Specifically, if the liquid level of a certain immersion liquid cooling module 100 is lower than the liquid level threshold, and the coolant cannot immerse all the electronic components inside the corresponding immersion liquid cooling module 100, then the flow rate of the coolant entering the immersion liquid cooling module 100 is increased so that the liquid level of the coolant inside the immersion liquid cooling module 100 rises to above the liquid level threshold as soon as possible, immersing all the electronic components inside the corresponding immersion liquid cooling module 100 and ensuring the cooling effect on all electronic components; specifically, the opening of the flow regulating valve 210 on the corresponding module branch 200 can be increased to increase the amount of coolant injected into the immersion liquid cooling module 100, so that the liquid level inside the immersion liquid cooling module 100 can rise; at the same time, the speed of the circulating pump can also be increased.

[0064] Preferably, flow meters can be installed on each module branch 200 to sense the flow rate within each module branch 200. The flow meters are electrically connected to the central controller, allowing the central controller to adjust the coolant flow rate within the corresponding module branch 200 based on the flow rate sensed by the flow meters. For example, the central controller can adjust the opening of the corresponding flow regulating valve 210 based on the flow rate sensed by the flow meters, and can also select and adjust the rotational speed of the circulating pump. It should be noted that the flow rate sensed by the flow meters can indirectly reflect the flow rate within the corresponding immersion liquid cooling module 100. Furthermore, the data detected by the flow meters can be displayed on a screen for relevant personnel to understand the flow rate of the module branches and the immersion liquid cooling module.

[0065] Specifically, if the flow rate of a certain module branch 200 reaches the flow rate threshold, the flow rate of coolant entering the module branch 200 is reduced to lower the flow rate of coolant in the module branch 200 below the flow rate threshold, thus avoiding malfunctions due to excessive pressure. At the same time, the speed of the circulating pump can be adaptively reduced (e.g., reduced by 10%-15%). Specifically, the opening of the flow regulating valve 210 on the corresponding module branch 200 can be reduced to decrease the flow rate of coolant flowing through the module branch 200. Simultaneously, the speed of the circulating pump can also be reduced to maintain stable system pressure.

[0066] Pressure sensors can also be installed on each module branch 200 to sense the pressure value within each module branch 200. These pressure sensors are electrically connected to the central controller, allowing the central controller to adjust the coolant flow rate of the corresponding module branch based on the pressure value sensed by the sensor. For example, the central controller can adjust the opening of the corresponding flow regulating valve 210 based on the flow rate value sensed by the pressure sensor, and can also select and adjust the speed of the circulating pump. Furthermore, the data values ​​detected by the pressure sensors can be displayed on a screen for relevant personnel to understand the pressure status of the module branch.

[0067] The flow meter mentioned above can be an electromagnetic flow meter.

[0068] Specifically, the accuracy of the aforementioned flow meters can be selected as ±0.2%. Each temperature sensor and each flow meter interacts with the central controller in real time via an industrial-grade CAN bus (or Ethernet) (transmission delay ≤10ms), achieving comprehensive monitoring.

[0069] The central controller can use an STM32 series microcontroller, which has a built-in three-dimensional control model for temperature, pressure and flow, and achieves precise control through PID algorithm.

[0070] Each of the aforementioned immersion liquid cooling modules 100 can be installed within the housing 300 using either bolt or snap-fit ​​connections. The snap-fit ​​connection utilizes a spring-loaded latch and a locking slot; during installation, simply push the immersion liquid cooling module 100 into place for automatic locking, and during disassembly, press the unlock button to remove it. This method achieves both stable installation and quick disassembly of the immersion liquid cooling module 100, offering greater convenience and suitability for scenarios requiring higher installation efficiency.

[0071] Preferably, quick-release buckles and guide rails can be provided on the side of the computing board module 110, so that installation and disassembly can be completed by hand.

[0072] Related technologies use low-boiling-point (typically 56.2℃) phase change coolants (such as specific types of fluorinated liquids) as coolants. Heat is transferred away through vaporization during boiling. The volume expansion rate of the coolant during boiling can reach 10-20 times, causing a sudden increase in pressure within the pipeline (up to 10 bar). This easily leads to loosening of pipe joints, aging and damage to seals, and ultimately, coolant leakage. Therefore, stringent requirements are placed on the sealing structure. Furthermore, complex sealing structures (such as dynamic seals and multi-layer composite seals) are difficult to maintain, with annual maintenance costs exceeding 20% ​​of the total equipment cost. Repeated phase changes cause the decomposition of additives in the coolant, producing flocculent deposits. Combined with the scouring and corrosion of the pipeline by the gas-liquid two-phase flow, this easily clogs the flow channels, causing localized heat dissipation failure. The performance degradation cycle of phase change coolants is only 1-2 years, requiring regular replacement, with a single replacement cost exceeding 100,000 yuan.

[0073] In this embodiment, a single-phase coolant is used, circulating entirely in liquid form within a closed-loop pipeline. This avoids pressure fluctuations caused by phase change (system pressure remains stable at 0.5-1.5 bar), solving the pressure shock problem of phase change liquid cooling and reducing the probability of leakage by over 80%. It is suitable for the 24 / 7 continuous operation requirements of servers, increasing the mean time between failures (MTBF) to over 100,000 hours. The sealing structure can be simplified to a single-layer static seal, which is simple and reliable, reducing the frequency of seal maintenance and replacement by over 70% and lowering annual maintenance costs by 40%-50%. Single-phase coolant produces no additive decomposition or corrosive debris, reducing the incidence of pipeline blockage by over 90% and significantly improving operational stability. The single-phase coolant has stable physicochemical properties and a service life of 3-5 years, extending the replacement cycle by 1.5-2 times compared to phase change coolants (1-2 years), reducing the cost per replacement by 60%.

[0074] Preferably, fluorinated liquid can be used as the coolant, as it has strong insulation properties and cooling capacity. A high-precision filter with a filtration accuracy of 1μm can also be installed in the coolant flow pipeline, which helps to further extend the service life of the coolant, extend the replacement cycle, and reduce maintenance costs.

[0075] In this embodiment, the thermal resistance can be reduced by more than 60% compared to traditional centralized liquid cooling, and the heat transfer efficiency per unit time reaches 1-2kW, which can easily meet the heat dissipation requirements of high heat flux density scenarios such as AI computing and high-density computing clusters. The temperature of core components can be stably controlled within 65℃, which is 10℃ lower than related technologies (around 75℃), with a temperature control accuracy of ±1℃, and the temperature fluctuation of local high-power components is ≤2℃.

[0076] Referring to Figure 3, in this embodiment, a display module 400 may also be provided, which is embedded and fixed to the front panel 310 of the housing 300 to display the cooling status of various parts of the server, thus enabling local visualization. Simultaneously, a matching keyboard 500 and touchpad 600 may also be provided to adjust the information displayed by the display module 400 and configure server parameters.

[0077] Specifically, the display module 400 can be configured with a 7-inch LCD screen. The display module 400 adopts an industrial-grade integrated design, with its core structure consisting of five main parts: a mechanical fixing structure, a display body module, a drive control module, an interface transmission module, and a power supply module. These modules work together to achieve stable installation and reliable display functionality. The core working logic of the display screen is to convert the server's digital signals (desktop system signals, temperature, pressure, and current data signals) into a visual image. Through the collaborative work of the BMC chip (Baseboard Management Controller) and the drive control module, stable display and switching between dual interfaces are achieved. This is specifically divided into two core processes: the display signal transmission link and the temperature, pressure, and current data acquisition-rendering link. The display screen can present a 3D visual interface, displaying real-time status; it supports access from PCs and mobile devices.

[0078] The central controller and display module 400 can work collaboratively. The central controller is responsible for the entire process control, including data acquisition, threshold judgment, execution adjustment, and status feedback. Its core principle is to precisely control the temperature, pressure, and flow parameters of key server components within safe threshold ranges through a closed-loop feedback mechanism. The display module 400 is responsible for presenting real-time data on temperature, pressure, and flow, as well as the control interface. Preferably, standardized cluster interfaces (such as Ethernet interfaces and RS485 interfaces) can be set on the modular immersion server, thereby supporting multi-machine parallel expansion. Through the cluster management protocol (TCP / IP protocol, transmission rate ≥100Mbps), coolant flow coordination and unified temperature control can be achieved. It can flexibly build computing power cooling systems from a single machine to clusters of hundreds of machines (adapted to large data centers, AI training clusters, and other large-scale computing scenarios), realizing multi-scenario adaptation, multi-system linkage, and flexible expansion, breaking through the limitations of traditional fully immersion centralized servers, which have single-scenario adaptability and difficult expansion. The modular immersion server is compatible with existing IT architectures, which helps reduce users' deployment and integration costs. When deployed as a single unit, wiring, refrigerant filling, and debugging can be completed within 15 minutes of opening the packaging, allowing for rapid deployment. In multi-unit cluster deployments, units can be connected in parallel via a main pipeline, sharing a heat exchanger or operating independently. Expansion requires only standard interface connections, without system reconstruction. Ethernet transmission connects sensors to the central controller via an RJ45 interface, offering longer transmission distances (up to 100 meters) and supporting the expansion of more sensor nodes (≥256 sensors can be connected on a single bus). It also achieves millisecond-level data interaction (latency ≤10ms), adapting to the data transmission needs of multiple modules and sensors in large-scale cluster deployments.

[0079] Furthermore, by connecting two adjacent immersion liquid cooling modules 100 (e.g., two adjacent computing board modules 110) using standardized connectors, different immersion liquid cooling modules 100 can be combined and replaced, adapting to diverse needs ranging from light computing (e.g., office servers) to high-density computing power (e.g., AI training clusters). The standardized connectors preferably employ M3 bolts and snap-fit ​​interfaces, allowing for easy module assembly and disassembly without the need for specialized tools.

[0080] Correspondingly, the interfaces of the main pipeline and the module branch 200 can all adopt a unified standard structure, which is convenient to adapt to components of different brands, models and power, without being limited to a single brand, with stronger compatibility, more flexible procurement, and reduced expansion and component replacement costs.

[0081] This embodiment adopts a standard 19-inch rack-mount structure (6U in height, 482.6mm in width, and 1100mm in depth), which is perfectly compatible with mainstream data center racks.

[0082] Servers can be fixed to the rack using bolts or guide rails (load capacity ≥100kg, sliding resistance ≤5N). Guide rail fixing involves the server's side rails engaging with the rack's guide rails, allowing the server to be pushed into the rack and locked in place. Installation and disassembly do not require removing bolts, making the operation faster and facilitating the server's forward and backward movement and maintenance. This is suitable for scenarios requiring frequent server repositioning (such as data center renovations and equipment relocation).

[0083] Preferably, the pipelines in this embodiment are all made of corrosion-resistant stainless steel (304 stainless steel), and the inner wall is polished (roughness Ra≤0.8μm) to reduce fluid resistance.

[0084] Figure 5 A schematic flowchart illustrating a cooling control method for a modular immersion server according to an embodiment of the present invention. This method is used to control the cooling of a modular immersion server provided in any of the above embodiments, and includes: S102, acquire the temperature value, liquid level value, heating rate, flow rate value and flow rate change rate of each immersion liquid cooling module; S104 If at least one of the temperature value, liquid level value, heating rate, flow rate value, or flow rate change rate exceeds the corresponding threshold range, the fault location will be determined in real time, and the fault will be eliminated or the faulty module will be replaced in a timely manner.

[0085] "At least one" can refer to one, two, or more.

[0086] The cooling control method provided in this embodiment has the same technical features as the modular immersion server provided in the above embodiment, so it can also solve the same technical problems and achieve the same technical effects.

[0087] In addition, this embodiment can also detect and locate server faults, making it easier to discover and eliminate faults in a timely manner, which helps to improve the operational reliability of the server.

[0088] In this embodiment, the pressure value and pressure change rate of the module branch 200 can also be obtained. If the pressure value in a certain module branch 200 exceeds the corresponding threshold range, it can also be determined that a fault has occurred, thereby determining the fault location in real time and eliminating the fault or replacing the faulty module in a timely manner.

[0089] Specifically, referring to Figure 3, after confirming the occurrence of a fault, it can be further determined whether the fault type is a modular immersion server crash or a liquid cooling circulation system shutdown. If not, the fault level is classified as a minor fault, the location of the fault is determined, and the faulty immersion liquid cooling module 100 or module branch 200 is removed or replaced. Other immersion liquid cooling modules 100 and module branches 200 operate normally, i.e., the server is partially isolated and operated. If so, the fault level is classified as a serious fault, and the modular immersion server is shut down urgently.

[0090] In addition, alarm processing can be initiated after a fault occurs. Alarm methods can include at least one of the following: audible and visual alarms, pop-up alerts, and information notifications. Alarm levels can be set to three levels: local audible and visual alarm (volume ≥ 80dB, light flashing frequency 2Hz), maintenance platform pop-up alert (response time ≤ 3s), and SMS / email notification (delay ≤ 10s). "At least one" can refer to one, two, or three of these methods.

[0091] After a fault is identified, the system can record the temperature, pressure, and flow rate for the 30 seconds preceding the fault, creating a timestamped log for later maintenance. Furthermore, it can generate hourly / daily / monthly trend curves for temperature, pressure, and flow rate, allowing for rapid fault location via heatmaps, with an average fault location time of ≤5 minutes.

[0092] It supports remote operation and maintenance (remote monitoring, fault diagnosis, and parameter adjustment via 4G / 5G and Ethernet) and automated operation and maintenance (integrating tools such as Ansible and Jenkins to achieve full automation of service deployment, configuration updates, and log analysis).

[0093] Data export is supported (Excel format). The cooling control method provided in this embodiment can achieve a three-in-one intelligent temperature control effect of "full-area monitoring - dynamic adjustment - fault protection".

[0094] An embodiment of the present invention also provides a computer-readable storage medium storing a computer program. When executed by a processor, the computer program implements the various processes of the above-described embodiment of the cooling control method for a modular immersion server, and achieves the same technical effect. To avoid repetition, it will not be described again here. The computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc.

[0095] Of course, those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by computer-controlled devices. The program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the above method embodiments. The storage medium can be a memory, a disk, an optical disk, etc.

[0096] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

[0097] In the description of this invention, it should be noted that the terms "upper," "lower," "front," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0098] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0099] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0100] Finally, it should be noted that the above-described embodiments are merely specific implementations of the present invention, used to illustrate the technical solutions of the present invention, and not to limit it. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the technical scope disclosed in the present invention, or make equivalent substitutions for some of the technical features; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A modular immersion server, characterized in that, The device includes a housing and at least one immersion liquid cooling module located within the housing. Each immersion liquid cooling module has a separate circuit board and a separate sealed cavity, with the circuit board immersed in coolant within the sealed cavity. Each sealed cavity is provided with an inlet and an outlet for connecting to a liquid cooling circulation system. The liquid cooling circulation system is configured to introduce coolant from the inlet and discharge it from the outlet, thereby creating a flowing coolant within the sealed cavity. The immersion liquid cooling module includes at least one of a computing power board module and a motherboard board module.

2. The modular immersion server according to claim 1, characterized in that, The computing power board module has a separate computing power board and a separate computing power board sealed cavity. The computing power board and the electronic components installed on it are all immersed in the coolant in the computing power board sealed cavity. The computing power board module has a computing power board module coolant distributor and a computing power board module coolant manifold. The computing power board module coolant distributor has multiple outlets, and the computing power board module coolant manifold has multiple inlets. The outlets of the computing power board module coolant distributor and the inlets of the computing power board module coolant manifold are respectively connected to the sealed cavity of the computing power board. The inlets of the computing power board module coolant distributor and the outlets of the computing power board module coolant manifold are respectively used to connect to the liquid cooling circulation system.

3. The modular immersion server according to claim 1, characterized in that, The motherboard module has a separate motherboard and a separate motherboard sealing cavity. The motherboard and the electronic components installed on it are all immersed in the coolant in the motherboard sealing cavity. The motherboard module includes a motherboard module coolant distributor and a motherboard module coolant manifold. The motherboard module coolant distributor has multiple outlets, and the motherboard module coolant manifold has multiple inlets. The outlets of the motherboard module coolant distributor and the inlets of the motherboard module coolant manifold lead to the sealed cavity of the motherboard module, and the inlets of the motherboard module coolant distributor and the outlets of the motherboard module coolant manifold are respectively used to connect to the liquid cooling circulation system.

4. The modular immersion server according to claim 1, characterized in that, The modular immersion server also includes a separate storage module, which has a memory and a separate sealed storage cavity. The memory is immersed in coolant within the sealed storage cavity, and the sealed storage cavity has independent coolant inlet and outlet.

5. The modular immersion server according to claim 1, characterized in that, The modular immersion server also includes a separate power board module, which has a separate power board and a separate power board sealed cavity. The power board and the electronic components installed thereon are all immersed in the coolant in the power board sealed cavity. The power board module has a power board module coolant distributor and a power board module coolant manifold. The power board module coolant distributor has multiple outlets, and the power board module coolant manifold has multiple inlets. The outlets of the power board module coolant distributor and the inlets of the power board module coolant manifold are respectively connected to the sealed cavity of the power board. The inlets of the power board module coolant distributor and the outlets of the power board module coolant manifold are respectively used to connect to the liquid cooling circulation system.

6. The modular immersion server according to claim 1, characterized in that, The housing has several module mounting positions, each of which is used to independently install the computing power board module, the motherboard board module, the storage module and / or the power supply board module. Each module can be connected to and disassembled with fluid through the corresponding module mounting position.

7. The modular immersion server according to claim 1, characterized in that, The modular immersion server also includes a main pipeline and multiple independent module branches, and the sealed cavity of each immersion liquid cooling module is connected to the main pipeline through the module branch; Each of the module branches is equipped with a flow regulating valve, which is used to regulate the flow of the corresponding module branch.

8. The modular immersion server according to claim 7, characterized in that, Temperature sensors are installed in the immersion liquid cooling module, the module branch, and the main pipeline, and the temperature sensors are electrically connected to the central controller. And / or, each of the immersion liquid cooling modules is equipped with a liquid level sensor, and the liquid level sensor is electrically connected to the central controller; And / or, the module branch is equipped with a flow meter, which is electrically connected to the central controller and is used to collect the flow value of the module branch.

9. The modular immersion server according to any one of claims 1-8, characterized in that, The modular immersion server also includes a display module, a keyboard, and a touchpad. The display module is embedded and fixed to the front panel of the housing and is used to display the cooling status of various parts of the server. The keyboard and the touchpad are used to adjust the information displayed by the display module and configure the server parameters.

10. A cooling control method for a modular immersion server, characterized in that, The method for cooling control of the modular immersion server according to any one of claims 1-9 includes: Acquire the temperature, liquid level, and heating rate of each immersion liquid cooling module, as well as the flow rate and flow change rate of each module branch; If at least one of the temperature value, the liquid level value, the heating rate, the flow rate, and the flow rate change rate exceeds the corresponding threshold range, the fault location will be determined in real time, and the fault will be eliminated or the faulty module will be replaced in a timely manner.

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