An optimization method and device for heat dissipation of a flat plate micro heat pipe array, electronic equipment and storage medium

Abstract

This invention discloses an optimization method, apparatus, electronic device, and storage medium for heat dissipation of a flat-plate micro heat pipe array. The optimization method includes: establishing a thermal management model with the flat-plate micro heat pipe array as the core; performing phase change heat simulation on the micro heat pipe unit using a multiphase flow numerical model based on the VOF method; analyzing the energy efficiency optimization effect of the UDC cabin based on the flat-plate micro heat pipe array thermal management model; and determining the optimal flat-plate micro heat pipe array heat dissipation scheme based on the evaluation results. The method provided by this invention can achieve comprehensive optimization of the thermal resistance, energy efficiency, and cost of different flat-plate micro heat pipe array heat dissipation schemes.

Description

Technical Field

[0001] This invention belongs to the field of data center thermal management technology, specifically relating to an optimized method, device, electronic equipment, and storage medium for heat dissipation of a flat micro heat pipe array. Background Technology

[0002] With the acceleration of global digitalization, the scale and number of data centers continue to grow, making them a core component of the global digital economy, responsible for processing, storing, and distributing massive amounts of data. The rapid growth of economic models such as internet services, cloud computing, and the Internet of Things (IoT) has led to an exponential increase in the scale and number of data centers, bringing with it energy consumption and related environmental problems. The proportion of energy consumption by data centers in global total electricity consumption is rising year by year, becoming a significant part of global energy consumption, exacerbating carbon emissions, and hindering the progress of global sustainable development goals.

[0003] Underwater Data Center Capsules (UDCs), as an emerging data center construction model, utilize the ocean as a massive cold source for natural cooling, reducing reliance on cooling towers and air conditioning systems and offering advantages in reducing cooling energy consumption. Power Usage Effectiveness (PUE) is currently a key standard for measuring the operational efficiency of data centers, as shown in the following formula:

[0004] .

[0005] The formula above shows that the PUE value is not related to the total energy consumption of IT equipment, but only to auxiliary systems, such as the energy consumption of the cooling system and the power supply and distribution system. The PUE value is always greater than 1, and the higher the energy consumption of other auxiliary systems, the higher the PUE value. According to existing data, the UDC cabin accounts for a large proportion of energy consumption in cooling and temperature reduction, accounting for about 40% of the total energy consumption of IT equipment, indicating significant potential for improvement.

[0006] Therefore, an optimized method is needed to dissipate heat from the UDC cabin using a flat micro heat pipe array, which can select the optimal heat dissipation solution. Summary of the Invention

[0007] To overcome the shortcomings of the prior art, the present invention provides an optimized method, apparatus, electronic device and storage medium for heat dissipation of a flat micro heat pipe array.

[0008] According to one aspect of the present invention, an optimized method for heat dissipation of a flat micro heat pipe array is provided, the optimized method comprising: Establish a thermal management model with a flat micro heat pipe array as the core; A multiphase flow numerical model based on the VOF method was used to simulate the phase change heat transfer of the micro heat pipe unit in the flat micro heat pipe array. Based on the aforementioned flat-plate micro heat pipe array thermal management model, the energy efficiency optimization effect of the UDC cabin is analyzed, and the optimal flat-plate micro heat pipe array heat dissipation scheme is determined according to the evaluation results.

[0009] Furthermore, according to the optimization method for heat dissipation of a flat micro heat pipe array provided in the embodiments of the present invention, the establishment of a thermal management model with the flat micro heat pipe array as the core includes: Design of a flat micro heat pipe array model based on the heat transfer mechanism of the flat micro heat pipe array; Server heat dissipation module design based on flat micro heat pipe array model, server size and rack internal space.

[0010] Furthermore, according to the optimization method for heat dissipation of a flat micro heat pipe array provided in the embodiments of the present invention, the design of the flat micro heat pipe array model based on the heat transfer mechanism of the flat micro heat pipe array includes: Selection of working fluid for flat micro heat pipes; Selection of flat micro heat pipe tubing materials; Design of a flat micro heat pipe liquid absorption core structure.

[0011] Furthermore, according to the optimized heat dissipation method of the flat micro heat pipe array provided in the embodiments of the present invention, the server heat dissipation module design includes: structural matching design of heat conduction plate, flat micro heat pipe array, heat insulation pad, finned plate and seawater pipe; and modular layout design based on server size and rack internal space.

[0012] Furthermore, according to the optimization method for heat dissipation of a flat micro heat pipe array provided in the embodiments of the present invention, the step of performing phase change heat simulation of the flat micro heat pipe array using a multiphase flow numerical model based on the VOF method includes: Perform structural modeling and mesh generation for the micro heat pipe unit model; Model setup and data analysis were performed based on structural modeling and mesh generation of a micro heat pipe unit model. Optimization analysis of the heat transfer performance of the micro heat pipe unit model was conducted.

[0013] Furthermore, according to the optimization method for heat dissipation of a flat micro heat pipe array provided in the embodiments of the present invention, the structural modeling and mesh generation based on the micro heat pipe unit model for model setting and data analysis includes: Define the model materials; Establish a multiphase flow model; Setting boundary conditions; Based on the model, finite volume simulation assumptions are made; Simulation analysis is performed based on the model.

[0014] Furthermore, according to the optimization method for heat dissipation of a flat micro heat pipe array provided in the embodiments of the present invention, the step of analyzing the energy efficiency optimization effect of the UDC cabin based on the thermal management model of the flat micro heat pipe array, and determining the optimal heat dissipation scheme of the flat micro heat pipe array based on the evaluation results, includes: Establish energy efficiency optimization evaluation criteria, which include equivalent heat transfer thermal resistance, energy utilization efficiency, and total cost of ownership. Equivalent heat transfer thermal resistance evaluation and analysis were performed. Conduct energy utilization efficiency evaluation and analysis; Conduct a total cost of ownership (TOO) evaluation and analysis; Conduct a comprehensive evaluation analysis based on TOPSIS; The optimal heat dissipation scheme for the flat micro heat pipe array was determined based on the evaluation results.

[0015] According to another aspect of the present invention, an analytical apparatus for heat dissipation using a flat micro heat pipe array is provided, the analytical apparatus comprising: The model building module is used to build a thermal management model for a flat micro heat pipe array; The numerical simulation module is used to perform numerical simulations on the micro heat pipe unit model of the flat micro heat pipe array thermal management model. The energy efficiency optimization effect analysis module is used to analyze the energy efficiency optimization effect of the UDC cabin based on the flat micro heat pipe array thermal management model. The scheme determination module is used to determine the optimal heat dissipation scheme for the flat micro heat pipe array based on the analysis results.

[0016] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising: at least one processor; and a memory communicatively connected to said at least one processor; The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform an optimized method for heat dissipation of a flat micro heat pipe array as described in any one of the present invention.

[0017] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein a computer program is stored therein, wherein the computer program is configured to execute, at runtime, the optimized method steps for heat dissipation of a flat micro heat pipe array as described in any one of the present invention.

[0018] The beneficial effects of the present invention are as follows: The heat dissipation optimization method for flat micro heat pipe arrays provided in the embodiments of the present invention establishes a thermal management model with flat micro heat pipe arrays as the core and performs numerical simulation of the phase change heat transfer process of micro heat pipe units, which can evaluate the heat transfer performance under different structural parameters and operating conditions; furthermore, it combines equivalent thermal resistance, PUE and TCO to comprehensively evaluate the candidate heat dissipation schemes for UDC cabins, thereby improving the accuracy of heat dissipation scheme selection and the overall energy efficiency level. Attached Figure Description

[0019] The technical solution and other beneficial effects of the present invention will become apparent from the following detailed description of specific embodiments of the invention, in conjunction with the accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the optimized heat dissipation method for the flat micro heat pipe array provided in this embodiment.

[0021] Figure 2 This is a schematic diagram of the flat micro heat pipe structure provided in this embodiment.

[0022] Figure 3 This is a schematic diagram of the heat-conducting plate and heat-insulating pad structure provided in this embodiment.

[0023] Figure 4 This is a schematic diagram of the cross-sectional structure of the micro heat pipe unit provided in this embodiment.

[0024] Figure 5 This is a schematic diagram illustrating the boundary condition settings for the model provided in this embodiment.

[0025] Figure 6 This is a schematic diagram of the temperature distribution of the basic model provided in this embodiment.

[0026] Figure 7 This is a schematic diagram of the pressure distribution of the basic model provided in this embodiment.

[0027] Figure 8 The phase transition cloud diagram is the basic model provided in this embodiment. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0029] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] The following disclosure provides many different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0031] The embodiments of the present invention will now be further described in conjunction with the accompanying drawings and specific implementation details.

[0032] A flat plate micro heat pipe array is a heat dissipation structure formed by integrating multiple flat plate micro heat pipes or multiple micro heat pipe units in a predetermined manner; a micro heat pipe unit is the smallest heat transfer analysis unit used for numerical simulation. Figure 1 This is a schematic diagram of the optimized heat dissipation method for the flat micro heat pipe array provided in this embodiment.

[0033] like Figure 1 As shown, the optimization method includes: Establish a thermal management model with a flat micro heat pipe array as the core; Phase change heat transfer simulation of the micro heat pipe unit was performed using a multiphase flow numerical model based on the VOF method. Based on the aforementioned flat-plate micro heat pipe array thermal management model, the energy efficiency optimization effect of the UDC cabin is analyzed, and the optimal flat-plate micro heat pipe array heat dissipation scheme is determined according to the evaluation results.

[0034] Specifically, establishing the thermal management model for the flat micro heat pipe array includes: Design of a flat micro heat pipe array model based on the heat transfer mechanism of the flat micro heat pipe array; Server heat dissipation module design based on flat micro heat pipe array model, server size and rack internal space.

[0035] The heat transfer mechanism of a flat-plate micro heat pipe array (MHPA) includes: the working fluid absorbs heat in the evaporation section until it evaporates and vaporizes; the vaporized working fluid carries heat through the adiabatic section to the condensation section, where it exchanges heat with the low-temperature pipe wall, achieving a cooling effect. The heat transfer capacity of MHPA is limited by factors such as the structure of the micro heat pipe material, the properties of the working fluid, and the flow process inside the pipe. Under these limitations, heat transfer cannot continue indefinitely; when heat transfer stops, the heat transfer capacity reaches a limit, known as the heat transfer limit. The heat transfer limit is a crucial factor affecting the heat transfer capacity of a heat pipe, mainly encompassing five categories: viscous heat transfer limit, sonic heat transfer limit, carryover heat transfer limit, capillary heat transfer limit, and boiling heat transfer limit.

[0036] Therefore, the design of a flat plate micro heat pipe array model based on the heat transfer mechanism of the flat plate micro heat pipe array mainly includes: Selection of working fluid for flat micro heat pipes; Selection of flat micro heat pipe tubing materials; Design of a flat micro heat pipe liquid absorption core structure.

[0037] Specifically, the selection of the working fluid for the flat micro heat pipe includes consideration of factors such as the ambient temperature and steam temperature during heat pipe operation, ensuring that a phase change can occur within this temperature range. The steam temperature... It can be calculated using the thermal balance method.

[0038] The heat balance equations for the evaporator section and the condenser section of the heat pipe are as follows: ; ; in, For the total heat transfer of the heat pipe, , These are the heat transfer areas of the evaporation section and the condensation section, respectively. , These represent the heat transfer coefficients of the evaporation section and the condensation section, respectively. , These represent the pipe wall temperatures of the evaporation section and the condensation section, respectively. This refers to the steam temperature.

[0039] Based on the balance of the heat pipe, the steam temperature Further calculations and solutions are given by the following formula: ; ; In the formula, n=1 indicates that the thermal resistance at both ends of the heat pipe is equal. Under normal circumstances, the working fluid in the heat pipe is mainly an organic fluid, and the n=2~3 of this type of working fluid.

[0040] In this embodiment, it is assumed that the maximum operating temperature of the UDC chamber is 75°C, the gas temperature inside the sealed pressure-bearing shell is approximately 25°C, and the working fluid of the flat micro heat pipe is a certain organic working fluid. In this embodiment, the saturation operating temperature of the micro heat pipe unit can be calculated to be approximately 37.5°C according to the above formula. Finally, a suitable flat micro heat pipe working fluid is selected based on the operating temperature range of commonly used working fluids. In this embodiment, methanol is used as an example of a working fluid. Methanol can be replaced with other materials that meet the selection conditions of the flat micro heat pipe working fluid provided in this embodiment; wherein, the applicable temperature range of methanol is -20°C to 65°C. Specifically, the methanol example is suitable for the scenario of "hot end wall temperature ≤ 65°C"; if the hot end wall temperature of the UDC chamber may exceed 65°C, a working fluid with a higher boiling point and compatibility (such as ethanol / acetone, etc.) should be used, and the "vapor temperature" should be maintained. "It falls within its effective phase transition range."

[0041] The selection of the flat micro heat pipe material is based on the chosen working fluid, primarily selecting materials with excellent thermophysical properties that will not chemically react with the selected working fluid. In this embodiment, aluminum is used as the material for the flat micro heat pipe, but aluminum can be replaced with other suitable materials. In this embodiment, aluminum has excellent thermophysical properties and will not chemically react with methanol, making it commonly used in the manufacture of electronic heat dissipation devices, and its cost is relatively low.

[0042] The wick is a capillary structure attached to the inner wall of the heat pipe, used to enhance capillary forces and improve the capillary heat transfer limit, thereby enhancing the heat transfer performance of the heat pipe. The effective capillary radius in the wick... The smaller the groove size, the greater the capillary force it can provide, and the better the heat transfer performance of the heat pipe. Therefore, in the design of the flat micro heat pipe wick structure, an axial groove wick is selected. This type of wick offers diverse processing options, with mainstream microgroove structures including rectangular grooves, triangular grooves, and trapezoidal grooves. It is suitable for heat transfer in medium and low temperature environments and has the dual advantages of low thermal resistance and low flow resistance.

[0043] In this embodiment, a heat pipe using a grooved wick type wick significantly reduces the carryover limit during heat transfer while effectively improving the capillary limit. To eliminate the contact thermal resistance between the wick and the micro heat pipe unit, an integrated molding process is chosen, using etching technology to fuse the wick structure with the pipe wall, achieving an extreme reduction in thermal resistance. Because the wick and pipe wall are integrally molded, the wick material can be consistent with the pipe wall material, thus simplifying material selection; in this embodiment, aluminum is selected as the wick material for the MHPA.

[0044] Specifically, the server heat dissipation module design includes: structural matching design of heat conduction plate, flat micro heat pipe array, heat insulation pad, finned plate and seawater pipe; and modular layout design based on server size and rack internal space.

[0045] In the structural design of the heat-conducting plate, insulation gasket, finned plate, and seawater pipeline, considering the difficulty of manufacturing and processing a single pipe, a series of micro heat pipe units of the same size are arranged in parallel and integrated into a flat plate pipe segment, which is a flat plate micro heat pipe array. A schematic diagram of the structure is shown below. Figure 2 As shown in the diagram, the blue section represents the condensation section, the gray section represents the adiabatic section, and the red section represents the evaporation section, which together constitute a complete flat-plate micro heat pipe array.

[0046] The micro heat pipe units are relatively small in size, and are designed as a parallel flat micro heat pipe array based on the concept of integration. To ensure uniform heating of the server surface and reduce the probability of local hot spots, this embodiment places a flat copper heat-conducting plate on the top of the server rack to reduce the impact of high-temperature points on the server's operational safety.

[0047] like Figure 3 The diagram shows the structural schematic of the heat-conducting plate and the heat-insulating gasket provided in this embodiment. Due to the special flat structure of the flat micro heat pipe array, in order to avoid the condensing section being heated by the heat source and the evaporating section being affected by the cold source, it is necessary to consider heat insulation treatment on the surfaces of the condensing section near the hot surface and the evaporating section near the cold source. Therefore, a heat-insulating gasket is designed and attached to the upper end of the evaporating section and the lower end of the condensing section respectively to ensure the normal operation of the micro heat pipe unit.

[0048] Considering that the heat transfer path, involving heat conduction between the server and the cabin air followed by convection with seawater, significantly weakens the low-temperature advantage of seawater, this embodiment uses seawater as the coolant. Heat from the server is transferred to the finned plates via a heat-conducting plate and a flat micro heat pipe array, and seawater circulation is used for liquid cooling of the finned plates. Airflow within the server cabin assists in convective heat dissipation, thus forming a heat dissipation method centered on the flat micro heat pipe array, combined with auxiliary convection and liquid cooling. Therefore, this embodiment incorporates components such as finned plates of matching dimensions, seawater pipes, and a top-mounted outer shell.

[0049] In this embodiment, the numerical simulation of the micro heat pipe unit model of the flat micro heat pipe array thermal management model includes: Perform structural modeling and mesh generation for the micro heat pipe unit model; Model setup and data analysis were performed based on structural modeling and mesh generation of a micro heat pipe unit model. Optimization analysis of the heat transfer performance of the micro heat pipe unit model was conducted.

[0050] Specifically, for the heat exchange equipment designed for UDC server heat generation, to accommodate the circular cross-section cabin structure and simplify the model, a single micro heat pipe is extracted from the array as a representative unit to establish a physical model, and a finite volume analysis is performed on it. The model is treated as axisymmetric under the premise of satisfying geometric and boundary condition simplification assumptions. Therefore, a single micro heat pipe is extracted from the array as a micro heat pipe unit to establish a physical model, and subsequent finite volume analysis is carried out. The model cross-sectional structure is as follows... Figure 4 As shown.

[0051] In this embodiment, the physical parameter design of the micro heat pipe unit model is illustrated using a specific set of parameters: the micro heat pipe unit is designed to be 200mm long, with an evaporation section of 80mm, a condensation section of 80mm, and an adiabatic section of 40mm. The cross-sectional dimensions of the model are shown in the table below:

[0052] Since the UDC hull does not undergo surface maintenance under normal operating conditions, it is assumed that the server remains operational year-round. The server heat dissipation power calculation follows the formula below: ; In the formula, To use coefficients simultaneously, For installation coefficient, For load factor, For ventilation and heat preservation coefficient, This refers to the total installed power of the equipment. Among them, the simultaneous use coefficient is 0.5~1.0, the installation coefficient is 0.7~0.9, the load coefficient is 0.4~0.5, and the ventilation and insulation coefficient is 0.6~0.7.

[0053] The mesh generation of the micro heat pipe element model can be performed using simulation software based on the finite volume method. This embodiment uses ANSYS Design Modeler, a built-in feature of ANSYS Fluent software, as an example. Due to the simple structure and regular geometry of the micro heat pipe element, the automatic hexahedral mesh generation in ANSYS Meshing, a built-in feature of ANSYS Fluent software, is chosen. Specifically, this embodiment uses an element size of 0.25 mm as an example. A total of 257,767 nodes and 193,600 elements are ultimately generated. In this embodiment, two levels of mesh refinement independence checks have been performed (…). (Critical temperature change <1%), based on which a 0.25mm mesh was selected.

[0054] In this embodiment, the structural modeling and mesh generation based on the micro heat pipe unit model, along with model setup and data analysis, includes: Define the model materials; Establish a multiphase flow model; Setting boundary conditions; Based on the model, finite volume simulation assumptions are made; Simulation analysis is performed based on the model.

[0055] Specifically, defining the model materials includes: The method provided in this embodiment for selecting the working fluid and pipe material for the micro heat pipe unit is illustrated using aluminum as the pipe material and methanol fluid, methanol vapor, and air as the working fluid material for the micro heat pipe unit. The ANSYS Fluent software already has definitions for aluminum and air in its material library, so the material models in the software are used directly. Since methanol is not available in the material library, its physical properties need to be defined. In this embodiment, to simplify calculations, the thermophysical properties of both liquid and gaseous methanol are assumed to be constants at the temperature corresponding to saturated methanol vapor under a pressure of 101.35 kPa, remaining unchanged throughout the phase transition process. In this embodiment, to reduce computational load, a constant property approximation is used, suitable for… Narrow temperature range; should be activated if outside the range. - Depends on property tables or UDFs.

[0056] The establishment of the multiphase flow model includes: In the ANSYS Fluent software settings, select the VOF (Volume of Fluid) multiphase flow model. To reduce the frequency of errors during the calculation process, select implicit discretization and add implicit volume forces.

[0057] This model was used to calculate a heat transfer process involving two phase changes: evaporation and condensation. The mass, energy, and momentum equations were solved. Since the phase change process includes mass transfer, energy and mass conversion were solved by adding source terms to the conservation equations.

[0058] The continuity equation is: ; Momentum equation: ; Energy equation: ; ; In the above formula, It is the gas phase density. It is a velocity vector. It's pressure. It is a tensor. It is the thermal conductivity. It is an energy source term. It is the gas phase volume fraction. It is a quality source item. It is a momentum source term. It is dynamic viscosity. It is internal energy.

[0059] Because the fabrication process of micro heat pipe units cannot achieve a vacuum environment, a small amount of air is present within the unit. Initially, the unit is assumed to contain three phases: air as the main phase, and methanol in gas and liquid phases as secondary phases. Considering only the surface tension between the methanol liquid and gas phases, its formula is defined as follows: ; in, Surface tension; Absolute temperature; It is the critical temperature; Determined from the physical properties table of the working medium (methanol).

[0060] During model initialization, it is assumed that the volume fraction of methanol in the liquid phase is (100-ε)%, the volume fraction of methanol in the gas phase is 0, and the volume fraction of air phase is ε.

[0061] The boundary conditions are set as follows: Based on the structural design of the server heat dissipation module, the boundary conditions of the unit model are set as follows: Figure 5 As shown.

[0062] Considering that one side of the evaporation section of the micro heat pipe array is in direct contact with the server, while the other three sides are not in contact with the heat source, they are named "Evaporation Section 1" and "Evaporation Section 2" respectively. "Evaporation Section 1" is set to a constant heat flux density, with a value of 2442 W / m². 2 "Evaporation Section 2" is set as "the coupling boundary that thermally couples with adjacent components".

[0063] Considering that one side of the condensation section of the micro heat pipe array is in direct contact with the finned plate, while the other three sides are not in contact with the heat dissipation boundary, they are named "Condensation Section 1" and "Condensation Section 2" respectively. "Condensation Section 1" is in contact with the heat exchange surface of the finned plate. Considering that the hot end temperature of the finned plate can be approximated as constant, it is set as an isothermal wall surface, and the wall temperature is taken as the hot end temperature of the finned plate. "Condensation Section 2" is also set as "the coupling boundary that thermally couples with adjacent components".

[0064] In this embodiment, the boundary conditions of the physical model are set as follows: Energy equation: ; Boundary conditions: (1) Evaporation section: ; (2) Adiabatic section: ; (3) Condensation section: ; In the formula, Thermal conductivity, As a volumetric heat source, For isobaric specific heat, For phase transition source terms, For external direction, The external convective heat transfer coefficient is... The ambient temperature.

[0065] Based on the data in this embodiment, the total thermal resistance of the micro heat pipe unit model in this embodiment is: ; In the formula, It is the total thermal resistance of the micro heat pipe unit model. It is the average temperature difference between the evaporation section and the condensation section. The input power for a single micro heat pipe unit is 125W in this embodiment.

[0066] It should be noted that 2442W / m² is the set value of the local boundary heat flux density of the evaporation section, and 125W is the total input power of a single micro heat pipe unit under the corresponding operating conditions. The two are related through the heat-receiving area of ​​the evaporation section.

[0067] The assumptions made in the finite volume simulation based on the model include: The main working fluid in the simulation is methanol. The phase change process involves complex heat and mass transfer phenomena and phase change reflux phenomena. In this embodiment, the VOF model is selected. To simplify the numerical simulation calculation, the following finite volume simulation assumptions are made: (1) Since the heat transfer process of each heat pipe in MHPA is roughly similar, only a single heat pipe unit is selected for simulation experiment research.

[0068] (2) The thermophysical properties of liquid methanol and gaseous methanol do not change with temperature and are set as constants.

[0069] (3) Ignore the effect of capillary force on the heat transfer process of the working fluid in the liquid wick channel structure.

[0070] (4) In the initial state, assume that the volume fraction of methanol in the liquid phase is (100-ε)%, the volume fraction of methanol in the gas phase is 0, and the volume fraction of air phase is ε.

[0071] (5) In numerical simulation analysis, the heat-conducting part of the wall of the micro heat pipe unit should be considered.

[0072] (6) Assume that the flow of methanol in the gas-liquid phase is continuous and that the methanol in the unit tube is always saturated vapor.

[0073] The simulation analysis based on the model includes: Under the aforementioned initial conditions, a preliminary simulation of the basic model was conducted to observe the heat transfer process inside the tube.

[0074] Observe the final temperature contour map after 10 seconds of calculation, as shown below. Figure 6 As shown, a clear temperature stratification can be observed, with the highest temperature reaching 339.55K, while the lowest temperature range remains around 295K, and the temperature field has basically stabilized. This figure visually illustrates the temperature change pattern during heat transfer and phase change: heat is input through the evaporation section, transferred through the adiabatic section, and released in the condensation section, with the temperature gradually decreasing along the length of the heat pipe.

[0075] The pressure distribution cloud map under this condition is as follows: Figure 7 As shown.

[0076] As can be seen from the figure, the pressure inside the pipe shows a certain gradual distribution pattern. Overall, the pressure distribution is relatively uniform, with no obvious pressure abrupt change points or abnormal areas, and a stable pressure gradient exists.

[0077] Using the XY horizontal plane as the base plane, the volume fraction cloud map of the liquid phase at the intermediate interface of the micro heat pipe unit is taken. The liquid phase volume fraction cloud map is then arranged in chronological order to form the phase transition cloud map of the basic model, as shown below. Figure 8 As shown.

[0078] The phase change process within the micro heat pipe unit can be analyzed using the diagram above. The appearance of a volume fraction gap on the uppermost surface of the liquid working fluid indicates the start of a phase change, meaning the production of a gaseous working fluid. As the phase change continues, the gaseous working fluid diffuses towards the condensation section under the pressure difference within the micro heat pipe unit. Due to the boundary conditions set in the condensation section, the gaseous working fluid rapidly condenses into a liquid phase on the inner wall, ultimately forming a stable gas-liquid cycle.

[0079] In this embodiment, the optimization analysis of the heat transfer performance of the micro heat pipe unit model includes: Optimization scheme creation: The liquid filling rate of the micro heat pipe unit was changed, with initial liquid filling rates of 5%, 20%, 40%, 60%, and 80% respectively, and multiple sets of simulation experiments were conducted. At least one of the following was used as the optimization objective: heat flux of the evaporation section, average temperature difference between the evaporation and condensation sections, and total thermal resistance. Different liquid filling rate schemes were compared, and the optimal liquid filling rate scheme corresponding to the objective function was determined.

[0080] In this embodiment, the energy efficiency optimization effect analysis of the UDC cabin based on the flat micro heat pipe array thermal management model includes: Establish energy efficiency optimization evaluation criteria, which include equivalent heat transfer thermal resistance, energy utilization efficiency, and total cost of ownership. Equivalent heat transfer thermal resistance evaluation and analysis were performed. Conduct energy utilization efficiency evaluation and analysis; Conduct a total cost of ownership (TOO) evaluation and analysis; A comprehensive evaluation analysis based on TOPSIS was conducted.

[0081] Specifically, the energy efficiency optimization evaluation criteria established include three key criteria: equivalent thermal resistance (Req), UDC energy utilization efficiency (PUE), and total cost of ownership (TCO) of the data center. These criteria characterize the energy efficiency optimization effect from the perspectives of thermal management efficiency, energy utilization efficiency, and the economic dimension of the data center's entire lifecycle.

[0082] Among them, the equivalent thermal resistance (Req) is a core physical indicator for measuring thermal management efficiency, reflecting the resistance to heat transfer within a data center. The lower the thermal resistance, the higher the heat transfer efficiency, meaning the data center can maintain equipment operating temperatures with lower energy consumption.

[0083] Power Usage Effectiveness (PUE): A globally recognized core energy efficiency indicator. The ideal value is 1 (only IT equipment consumes power), while the actual value is usually 1.2 to 2.0. When the PUE value decreases infinitely until it approaches 1, it proves that the non-IT equipment in the data center generates almost no energy consumption and has extremely high energy efficiency.

[0084] Total Cost of Ownership (TCO): This parameter assesses the economic viability of a project throughout its entire lifecycle, comprehensively considering two important metrics for data centers: CapEx and OpEx, namely construction costs and operating costs. Focusing solely on construction costs may lead to one-sided decision-making, emphasizing only the high initial investment while ignoring the significant long-term energy savings brought about by high-efficiency technologies.

[0085] The equivalent heat transfer thermal resistance evaluation analysis includes: A control heat dissipation scheme with different heat dissipation structure parameters or different cooling methods was set up to establish a heat transfer model for the control group and obtain the equivalent thermal resistance of the control group. At the same time, the scheme in this embodiment was used as the experimental group, and a heat transfer model was established to obtain the equivalent thermal resistance of this embodiment.

[0086] The energy utilization efficiency evaluation and analysis includes: Data center energy efficiency is typically measured by Power Usage Effectiveness (PUE), which is the ratio of total data center energy consumption to IT equipment energy consumption, reflecting the degree of efficient energy utilization. Total data center energy consumption includes energy consumption from IT equipment, cooling systems, power supply and distribution systems, lighting, and security. In this embodiment, since the UDC (Underground Data Center) operates in an ocean environment, the energy consumption for lighting and security is negligible, and the power supply and distribution energy consumption is attributed to the subsea voltage distribution station's energy consumption system and is not included in the UDC's energy consumption calculation. Therefore, the data center energy efficiency in this embodiment is simplified as follows:

[0087] This allows us to analyze the PUE values ​​of different schemes and select the optimal PUE scheme.

[0088] The total cost of ownership (TOC) evaluation analysis includes: Evaluating whether a system is suitable for commercial use requires considering multiple factors, among which economic efficiency is an indispensable indicator. Therefore, different candidate solutions need to be evaluated from an economic decision-making perspective. In this embodiment, the Total Cost of Ownership (TCO) evaluation method is adopted to comprehensively calculate the TCO of different solutions from the dimensions of construction cost (CapEx) and operating cost (OpEx).

[0089] Construction costs (CapEx) are the expenses required in the early stages of UDC construction, which mainly include equipment procurement costs, labor installation costs, and material procurement costs.

[0090] Operating costs (OpEx) mainly include operating expenses and maintenance costs.

[0091] Therefore, the total cost of ownership of different options is evaluated by combining the construction cost (CapEx) and the operating cost (OpEx).

[0092] The comprehensive evaluation analysis based on TOPSIS includes: The Top-Optimal Solution Analysis (TOPSIS) is a comprehensive evaluation method that ranks evaluation objects by measuring the distance between them and the optimal and worst solutions, thus achieving the effect of approximating the optimal solution. In this embodiment, the TOPSIS model can be used to comprehensively evaluate the energy efficiency of the UDC cabin before and after installing the server cooling module.

[0093] This includes model building.

[0094] First, a decision matrix needs to be established. Assuming there are n objects to be evaluated and m evaluation indicators, the decision matrix of the UDC energy efficiency to be evaluated for the evaluation indicators is constructed as follows: ; In the formula, It is the score of the i-th object to be evaluated on the j-th indicator.

[0095] Next, a normalized matrix needs to be constructed. By normalizing matrix X, the normalized matrix Y can be obtained (Y = ...). )as follows: ; After constructing the standardized matrix, the differences between the evaluated object and the optimal and worst values ​​are calculated. The Euclidean distance between each evaluated object and the optimal and worst values ​​can then be calculated using the following formula: ; In the formula, It is the weight of the j-th evaluation indicator. , These are the maximum and minimum values ​​of the j-th column of matrix Y, respectively. The larger the value, the further the object i being evaluated is from the optimal solution; The larger the value, the further i is from the worst solution. The ideal evaluation object should be... While keeping the value as small as possible The value should be as large as possible.

[0096] To quantify the trade-off between the evaluation object and the worst-case value, the degree of closeness between the evaluation object and the best value is defined as: ; In the formula It represents the relative closeness of each evaluated object to the optimal and worst values. Mathematical analysis of the above formula, based on the definition, yields... satisfy ,and The closer to 1, The smaller the value, the closer it is to the Euclidean distance of the optimal value.

[0097] The heat dissipation optimization method for flat micro heat pipe arrays provided in this invention establishes a thermal management model with the flat micro heat pipe array as the core and performs numerical simulation of the phase change heat transfer process of the micro heat pipe unit. This allows for the evaluation of heat transfer performance under different structural parameters and operating conditions. Furthermore, by combining equivalent thermal resistance, power consumption (PUE), and total energy consumption (TCO), the method comprehensively evaluates candidate heat dissipation schemes for the UDC cabin, thereby improving the accuracy of heat dissipation scheme selection and overall energy efficiency.

[0098] In another embodiment, an analytical device for heat dissipation using a flat micro heat pipe array is provided, the analytical device comprising: The model building module is used to build a thermal management model for a flat micro heat pipe array; The numerical simulation module is used to perform numerical simulations on the micro heat pipe unit model of the flat micro heat pipe array thermal management model. The energy efficiency optimization effect analysis module is used to analyze the energy efficiency optimization effect of the UDC cabin based on the flat micro heat pipe array thermal management model. The scheme determination module is used to determine the optimal heat dissipation scheme for the flat micro heat pipe array based on the analysis results.

[0099] In another embodiment, an electronic device is provided, the electronic device comprising: at least one processor; and, A memory that is communicatively connected to the at least one processor; The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform an optimized method for heat dissipation of a flat micro heat pipe array as described in any one of the present invention.

[0100] Furthermore, as an executable solution, the electronic device can be a desktop computer, laptop computer, handheld computer, or cloud server, etc. The electronic device may include, but is not limited to, processors, memory, input / output devices, network access devices, and buses. Those skilled in the art will understand that the above-described electronic device structure is merely an example and does not constitute a limitation on the electronic device. It may include more or fewer components than described above, or combine certain components, or different components. For example, the terminal device for analyzing the heat dissipation of the flat micro heat pipe array may also include input / output devices, network access devices, buses, etc. This embodiment of the invention does not limit this aspect.

[0101] Furthermore, as an executable solution, the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices. The general-purpose processor can be a microprocessor or any conventional processor. This processor is the control center of the electronic device, connecting various parts of the terminal device for analyzing the heat dissipation of the flat-panel micro heat pipe array using various interfaces and lines.

[0102] The memory can be used to store the computer programs and / or modules. The processor, by running or executing the computer programs and / or modules stored in the memory and calling the data stored in the memory, realizes various functions of the terminal device for analyzing the heat dissipation of the flat micro heat pipe array. The memory may mainly include a program storage area and a data storage area. The program storage area may store the operating system and at least one application program required for a function. The data storage area may store model data, simulation data, and evaluation result data generated during the implementation of this invention. In addition, the memory may include high-speed random access memory and non-volatile memory, such as hard disk, memory, plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card (FC), at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0103] In another embodiment, a computer-readable storage medium is provided, wherein a computer program is stored therein, wherein the computer program is configured to execute, at runtime, the optimized method steps for heat dissipation of the flat micro heat pipe array as described in any one of the present invention.

[0104] If the module / unit integrated into the terminal device for analyzing the heat dissipation of the aforementioned flat-panel micro heat pipe array is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of the present invention can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM), a random access memory (RAM), and a software distribution medium, etc.

[0105] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the present invention. Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0106] The above provides a detailed description of the optimized method, apparatus, electronic device, and storage medium for heat dissipation of the flat micro heat pipe array provided in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of the present invention. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optimized method for heat dissipation using a flat micro heat pipe array, characterized in that, The optimization method includes: Establish a thermal management model with a flat micro heat pipe array as the core; A multiphase flow numerical model based on the VOF method was used to simulate the phase change heat transfer of the micro heat pipe unit in the flat micro heat pipe array. Based on the thermal management model of the aforementioned flat-plate micro heat pipe array, the energy efficiency optimization effect of the submarine data center cabin is analyzed, and the optimal heat dissipation scheme of the flat-plate micro heat pipe array is determined according to the evaluation results.

2. The optimized heat dissipation method for a flat micro heat pipe array according to claim 1, characterized in that, The establishment of a thermal management model based on a flat micro heat pipe array includes: Design of a flat micro heat pipe array model based on the heat transfer mechanism of the flat micro heat pipe array; Server heat dissipation module design based on flat micro heat pipe array model, server size and rack internal space.

3. The optimized heat dissipation method for a flat micro heat pipe array according to claim 2, characterized in that, The design of the flat micro heat pipe array model based on the heat transfer mechanism of the flat micro heat pipe array includes: Selection of working fluid for flat micro heat pipes; Selection of flat micro heat pipe tubing materials; Design of a flat micro heat pipe liquid absorption core structure.

4. The optimized heat dissipation method for a flat micro heat pipe array according to claim 2, characterized in that, The server heat dissipation module design includes: structural matching design of heat conduction plate, flat micro heat pipe array, heat insulation pad, finned plate and seawater pipe; and modular layout design based on server size and rack internal space.

5. The optimized method for heat dissipation of a flat micro heat pipe array according to claim 1 or 2, characterized in that, The phase change heat transfer simulation of the flat micro heat pipe array using a multiphase flow numerical model based on the VOF method includes: Perform structural modeling and mesh generation for the micro heat pipe unit model; Model setup and data analysis were performed based on structural modeling and mesh generation of a micro heat pipe unit model. Optimization analysis of the heat transfer performance of the micro heat pipe unit model was conducted.

6. The optimized heat dissipation method for a flat micro heat pipe array according to claim 5, characterized in that, The structural modeling and mesh generation based on the micro heat pipe unit model, along with model setup and data analysis, includes: Define the model materials; Establish a multiphase flow model; Setting boundary conditions; Based on the model, finite volume simulation assumptions are made; Simulation analysis is performed based on the model.

7. The optimized method for heat dissipation of a flat micro heat pipe array according to claim 1 or 2, characterized in that, The analysis of the energy efficiency optimization effect of the subsea data center cabin based on the thermal management model of the flat plate micro heat pipe array, and the determination of the optimal heat dissipation scheme of the flat plate micro heat pipe array based on the evaluation results, includes: Establish energy efficiency optimization evaluation criteria, which include equivalent heat transfer thermal resistance, energy utilization efficiency, and total cost of ownership. Equivalent heat transfer thermal resistance evaluation and analysis were performed. Conduct energy utilization efficiency evaluation and analysis; Conduct a total cost of ownership (TOO) evaluation and analysis; Conduct a comprehensive evaluation analysis based on TOPSIS; The optimal heat dissipation scheme for the flat micro heat pipe array was determined based on the evaluation results.

8. An analytical device for heat dissipation using a flat micro heat pipe array, characterized in that, The analytical device includes: The model building module is used to build a thermal management model for a flat micro heat pipe array; The numerical simulation module is used to perform numerical simulations on the micro heat pipe unit model of the flat micro heat pipe array thermal management model. The energy efficiency optimization effect analysis module is used to analyze the energy efficiency optimization effect of the submarine data center cabin based on the flat micro heat pipe array thermal management model. The scheme determination module is used to determine the optimal heat dissipation scheme for the flat micro heat pipe array based on the analysis results.

9. An electronic device, characterized in that, The electronic device includes: at least one processor; and a memory communicatively connected to the at least one processor; The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the optimized method for heat dissipation of the flat micro heat pipe array as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The storage medium stores a computer program, wherein the computer program is configured to execute the optimized method steps for heat dissipation of the flat micro heat pipe array according to any one of claims 1 to 7 when it is run.

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