A liquid-cooled mobile phone case integrated with semiconductor refrigeration

Abstract

This invention discloses a liquid-cooled phone case integrating semiconductor cooling, comprising a main body that fits snugly around a phone. A cooling module is located at the top of the main body, with an air inlet on its outer shell. An air outlet is located at the top of the main body. Piezoelectric ceramic buttons are located on the sides of the main body, and charging contacts are located at the bottom. This liquid-cooled phone case integrates air cooling, liquid cooling, and semiconductor cooling for triple heat dissipation. It features high overall integration, a magnetically attached structure for close contact with the phone, and intelligent functions such as self-test initialization, low-power sleep mode, and fault alarm. It boasts advantages such as high heat dissipation efficiency, long-lasting cooling effect, low energy consumption, good compatibility, and convenient operation, making it suitable for the high-load heat dissipation needs of various smartphones and highly practical.

Description

Technical Field

[0001] This invention relates to the field of mobile phone heat dissipation accessories technology, and in particular to a liquid-cooled mobile phone case with integrated semiconductor cooling. Background Technology

[0002] Liquid-cooled phone cases are a type of mobile phone heat dissipation and protection accessory. Mobile phone heat dissipation accessories are support devices that help cool down mobile terminal devices. As smartphone performance continues to improve, the problem of overheating under high load is becoming increasingly prominent, seriously affecting the user experience, operating performance, and even hardware lifespan. With the continuous development of technology, people have increasingly higher requirements for the heat dissipation efficiency, portability, and compatibility of mobile phone heat dissipation accessories.

[0003] Existing mobile phone cooling accessories have certain drawbacks in use. First, traditional air-cooled mobile phone cooling cases rely solely on fans for heat dissipation, which has limited cooling efficiency and cannot meet the high-load cooling requirements of mobile phones. Second, conventional semiconductor cooling accessories mostly use an external and continuously activated cooling chip control method. Due to limited heat dissipation space, heat can easily accumulate on the heating surface, resulting in rapid attenuation of cooling effect and significant power consumption. In addition, some cooling accessories have low structural integration, are inconvenient to disassemble and assemble, and have poor fit with the mobile phone, which has certain adverse effects on actual use. To address these issues, we propose a liquid-cooled mobile phone case with integrated semiconductor cooling. Summary of the Invention

[0004] Technical problem solved: To address the shortcomings of existing technologies, this invention provides a liquid-cooled phone case integrating semiconductor cooling, which integrates air cooling, liquid cooling, and semiconductor cooling for triple heat dissipation. It features a highly integrated overall structure, adheres tightly to the phone via a magnetic structure, and also possesses intelligent functions such as self-test initialization, low-power sleep mode, and fault alarm. It boasts advantages such as high heat dissipation efficiency, long-lasting cooling effect, low energy consumption, good adaptability, and convenient operation, making it suitable for the high-load heat dissipation needs of various smartphones. It is highly practical and can effectively solve the problems mentioned in the background technology.

[0005] Technical Solution: To achieve the above objectives, the technical solution adopted by this invention is as follows: a liquid-cooled phone case with integrated semiconductor cooling, comprising a phone case body that fits snugly around a phone body. A cooling module is located at the top of the phone case body, with a fan inlet on the outer shell of the cooling module and an air outlet at the top of the phone case body. A piezoelectric ceramic button is located on the inner side of the phone case body, and charging contacts are located at the bottom of the phone case body. The air-cooling module and a semi-circular cooling mechanism are also located on the inner side of the phone case body. The device includes a semiconductor cooling chip module and a card slot. The air-cooled module includes a fan dust filter, a rear fan mount, a fan body, and a front fan mount. The semiconductor cooling chip module is equipped with a semiconductor cooling chip and a heat sink. The upper half of the main body of the phone case is attached to the inner side of a piezoelectric ceramic sheet. The inner surface of the main body of the phone case is assembled with a magnetic ring groove, a magnetic ring, a PCB circuit board, a battery, a liquid cooling film, and a heat-conducting cover. The magnetic ring is engaged inside the magnetic ring groove. The heat-conducting cover is located on the surface of the liquid cooling film. A transparent display window is provided on the card slot. The PCB circuit board is equipped with a temperature sensor module, a piezoelectric ceramic sheet detection module, a membrane keypad module, a touch sensing module, a low battery monitoring module, a Hall switch module, a voltage-controlled drive module, a processor module, a fan drive module, a piezoelectric micropump module, a TEC drive module, an indicator light module, a fan module, a liquid-cooled film module, a TEC module, a power supply module, a charging adapter module, a battery charging module, a battery protection module, and a battery module.

[0006] As a preferred technical solution of this application, a camera module is provided on the upper part of the main body of the mobile phone case, the rear fan base and the front fan base are assembled to form the fan body and are fixed by two sets of retaining rings for shock absorption, the fan dustproof mesh is positioned at the rear end of the rear fan base for locking, and the transparent display window is locked inside the slot for positioning.

[0007] As a preferred technical solution of this application, the piezoelectric ceramic sheet is attached to the inner side of the main body of the mobile phone case and is limited by the slot. The semiconductor cooling chip module and the semiconductor cooling sheet are electrically connected, and the semiconductor cooling chip module and the semiconductor cooling sheet conduct heat through the heat sink.

[0008] As a preferred technical solution of this application, the magnetic ring is engaged with the inner side of the magnetic ring groove and fixed to the inner side of the mobile phone case body, the semiconductor cooling chip module, the PCB circuit board and the battery are electrically connected, and the liquid cooling film and the heat-conducting cover are bonded and fixed together.

[0009] As a preferred technical solution of this application, the power module includes a 5V power supply and two sets of 3.3V power supplies, both of which are connected to the battery module. One set of 3.3V power supplies is connected to the processor module, and the other set of 3.3V power supplies is connected to the piezoelectric micropump module and the TEC drive module. The 5V power supply is connected to the fan drive module. The output terminal of the charging adapter module is connected to the input terminal of the battery charging module. The output terminal of the battery charging module is connected to the input terminal of the battery protection module, and the output terminal of the battery protection module is connected to the input terminal of the battery module.

[0010] As a preferred technical solution of this application, the output terminals of the temperature sensor module, piezoelectric ceramic sheet detection module, membrane keypad module, touch sensing module, low battery monitoring module, Hall switch module, and voltage-controlled drive module are all connected to the input terminal of the processor module.

[0011] As a preferred technical solution of this application, the output terminal of the processor module is connected to the input terminal of the fan drive module, the piezoelectric micropump module, and the TEC drive module; the output terminal of the fan drive module is connected to the input terminal of the fan module; the output terminal of the piezoelectric micropump module is connected to the input terminal of the liquid cooling diaphragm; and the output terminal of the TEC drive module is connected to the input terminal of the TEC module.

[0012] Beneficial effects: Compared with the prior art, the present invention provides a liquid-cooled phone case with integrated semiconductor cooling, which has the following beneficial effects: This liquid-cooled phone case with integrated semiconductor cooling integrates air cooling, liquid cooling and semiconductor cooling triple heat dissipation methods. The overall structure has a high degree of integration. It fits tightly with the phone through a magnetic structure. It also has intelligent functions such as self-test initialization, low power sleep, and fault alarm. It has the advantages of high heat dissipation efficiency, long-lasting cooling effect, low power consumption, good adaptability and convenient operation. It is suitable for the high load heat dissipation needs of various smartphones and has strong practicality. High heat dissipation efficiency and long-lasting cooling effect: This invention integrates three heat dissipation methods: air cooling, liquid cooling, and semiconductor cooling. It achieves AI-level temperature control through the processor module, and sequentially activates the fan (low / medium / high) and liquid cooling (low / medium / high) according to the phone's temperature threshold. When the temperature reaches the high threshold, TEC semiconductor cooling is activated. At the same time, an intermittent temperature control method is designed for the TEC module to avoid heat accumulation on the heating surface. This solves the problem of cooling effect decay of traditional semiconductor cooling heat dissipation components and ensures continuous cooling.

[0013] Low energy consumption and long battery life: On the one hand, AI-based graded temperature control activates the corresponding heat dissipation module only when the corresponding temperature threshold is reached, avoiding unnecessary energy consumption; on the other hand, the intelligent intermittent temperature control method of the TEC module significantly reduces power consumption while ensuring cooling effect. Combined with the low battery monitoring module and low power sleep mode, the battery life of the heat sink is further improved.

[0014] High structural integration and good adaptability: This invention integrates the air-cooling module, liquid-cooling module, semiconductor refrigeration module, circuit control module, and power supply module into the main body of the phone case. The magnetic ring and magnetic ring groove interlocking structure achieve a tight fit with the phone. At the same time, the transparent display window and the structural design that adapts to the camera module ensure the normal use of the phone's original functions. The layout of the side piezoelectric ceramic sheet button and the bottom charging contacts improves the convenience of use.

[0015] Intelligent control and excellent user experience: With the processor module as the control core, it integrates various sensing and control modules such as temperature sensor, touch sensor, Hall switch, and membrane keypad to realize intelligent functions such as self-test initialization, AI temperature control, fault alarm, and low-power sleep mode. When low battery, Hall sensor invalid, or touch sensor invalid is detected, it automatically enters low-power mode. The indicator module displays the working status in real time. It is simple to operate and highly intelligent.

[0016] With strong structural stability and reasonable assembly, the components are assembled through snap-fit, slot limiting, and bonding. The rear fan mount and the front fan mount are fixed to the fan body with retaining rings to reduce vibration. The circuit board protective shell protects the PCB circuit board. The heat-conducting cover plate improves the heat conduction efficiency of the liquid cooling film and the phone. The overall structure is reasonably assembled and has strong stability, making it suitable for practical application. The entire phone heat dissipation case has a simple structure, is easy to operate, and has a high degree of integration and intelligence. The heat dissipation effect and user experience are greatly improved compared to traditional methods, making it suitable for the high-load heat dissipation needs of various smartphones. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a liquid-cooled mobile phone case with integrated semiconductor cooling according to the present invention.

[0018] Figure 2 This is a schematic diagram of the overall front end structure of a liquid-cooled mobile phone case with integrated semiconductor cooling according to the present invention.

[0019] Figure 3 This is a schematic diagram of the inner structure of a liquid-cooled mobile phone case with integrated semiconductor cooling according to the present invention.

[0020] Figure 4 This is a schematic diagram showing the disassembled structure of a liquid-cooled mobile phone casing with integrated semiconductor cooling according to the present invention.

[0021] Figure 5 This is a schematic diagram of the hardware framework structure of a liquid-cooled mobile phone case with integrated semiconductor cooling according to the present invention.

[0022] Figure 6 This is a structural schematic diagram of one of the software flowcharts of a liquid-cooled mobile phone case integrating semiconductor cooling according to the present invention.

[0023] Figure 7 This is a schematic diagram of the second software flowchart of a liquid-cooled mobile phone case with integrated semiconductor cooling according to the present invention.

[0024] In the image: 1. Phone case body; 2. Camera module; 3. Air-cooling module; 4. Piezoelectric ceramic button; 5. Phone body; 6. Semiconductor cooling chip module; 7. SIM card slot; 8. Magnetic ring slot; 9. Charging contacts; 10. Fan dust filter; 11. Piezoelectric ceramic sheet; 12. Rear fan mount; 13. Fan body; 14. Semiconductor cooling chip; 15. Heat sink; 16. Front fan mount; 17. Transparent display window; 18. Magnetic ring; 19. PCB circuit board; 20. Battery; 21. Thermal conductive cover; 22. Liquid cooling film; 23. Air outlet; 24. Air inlet. Detailed Implementation

[0025] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of the present invention, but not all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0026] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] like Figure 1-7As shown, a liquid-cooled mobile phone case integrating semiconductor cooling includes a main body 1, which fits around a mobile phone body 5. The main body 1 features a top-mounted air-cooling module 3 with an air inlet 24 on its outer shell, an air outlet 23 at the top of the main body 1, a piezoelectric ceramic button 4 on the side of the main body 1, a charging contact 9 at the bottom of the main body 1, and a slot 7 on the inner side of the main body 1 for the air-cooling module 3, a semiconductor cooling chip module 6, and a liquid-cooled transparent display window component. The air-cooling module 3 includes a fan for cooling. Dust net 10, rear fan mount 12, fan body 13 and front fan mount 16, the upper half of the phone case body is attached with piezoelectric ceramic sheet 11, semiconductor cooling sheet 14 cooling surface is attached to liquid cooling film 22, heating surface is attached to heat sink 15, the inner surface of the phone case body 1 is assembled with magnetic ring groove 8, magnetic ring 18, PCB circuit board 19, temperature sensor chip, battery 20, liquid cooling film 22 and heat conduction cover plate 21 are soldered on PCB circuit board 19, the temperature sensor chip can automatically start or stop when sensing temperature, and a transparent display window 17 is provided on the slot 7 of the transparent component of liquid cooling display window; The upper part of the main body 1 of the phone case is provided with a camera module 2. The rear fan mount 12 and the front fan mount 16 are assembled with the fan body 13 and fixed by two sets of retaining rings for shock absorption. The fan dustproof mesh 10 is positioned at the rear end of the rear fan mount 12 and is engaged. The transparent display window 17 is engaged inside the slot 7 for positioning.

[0029] The piezoelectric ceramic sheet 11 is attached to the inside of the phone case and is limited by the slot. The semiconductor cooling chip module 6 is electrically connected to the semiconductor cooling chip 14. The cooling surface of the semiconductor cooling chip 14 is attached to the liquid cooling film 22, and the heating surface of the semiconductor cooling chip 14 conducts heat through the heat sink 15.

[0030] The magnetic ring 18 is engaged with the inner side of the magnetic ring groove 8 and fixed to the inner side of the main body 1 of the mobile phone case. The semiconductor cooling chip module 6, the PCB circuit board 19 and the battery 20 are electrically connected. The liquid cooling film 22 and the heat-conducting cover plate 21 are bonded and fixed together.

[0031] The PCB circuit board 19 houses a temperature sensor module, a piezoelectric ceramic sheet detection module, a membrane keypad module, a touch sensing module, a low battery monitoring module, a Hall switch module, a voltage-controlled drive module, a processor module, a fan drive module, a piezoelectric micropump module, a TEC drive module, an indicator light module, a fan module, a liquid-cooled film module, a TEC module, a power supply module, a charging adapter module, a battery charging module, a battery protection module, and a battery module. The power supply module includes a 5V power supply and two sets of 3.3V power supplies, both connected to the battery module. One set of 3.3V power supplies connects to the processor module, and the other set connects to the piezoelectric micropump module and the TEC drive module. The 5V power supply connects to the fan drive module. The charging adapter module... The output of the block is connected to the input of the battery charging module. The output of the battery charging module is connected to the input of the battery protection module. The output of the battery protection module is connected to the input of the battery module. The outputs of the temperature sensor module, piezoelectric ceramic sheet detection module, membrane keypad module, touch sensing module, low battery monitoring module, Hall switch module, and voltage-controlled drive module are all connected to the input of the processor module. The output of the processor module is connected to the input of the fan drive module, piezoelectric micropump module, and TEC drive module. The output of the fan drive module is connected to the input of the fan module. The output of the piezoelectric micropump module is connected to the input of the liquid cooling diaphragm. The output of the TEC drive module is connected to the input of the TEC module.

[0032] Working principle: The integrated semiconductor cooling liquid-cooled phone case of this invention uses the phone case body as a supporting carrier, integrating a heat dissipation structure with an air-cooling module, liquid-cooling components, and a semiconductor cooling chip as the core, as well as a control and power supply structure with a PCB circuit board as the core. During operation, it consists of three stages: initialization self-test, AI-level temperature control, and intelligent protection and sleep mode. Initialization self-test: After the heat sink is powered on, the processor module controls each module to perform self-test initialization. If an interrupt signal is detected, it is determined to be a temperature interruption, low battery, Hall effect valid, voltage control interruption, touch valid, button interruption, etc. In the case of non-temperature interruption, the indicator light module alarms and controls the device to enter low power sleep mode. Only when temperature interruption occurs will the AI ​​temperature control program be entered.

[0033] AI-based graded temperature control: The processor module uses a temperature sensor module to monitor the temperature of the phone and the heat dissipation module in real time. First, it determines whether the temperature is higher than the first temperature threshold. If it is, AI-PID-1 is activated to control the fan to run at a low speed. If the temperature continues to rise to the second temperature threshold, AI-PID-2 is activated to control the liquid cooling to run at a low speed, while the fan speed is increased to medium speed. If the temperature rises to the third temperature threshold, AI-PID-3 is activated to control the liquid cooling to run at medium speed, while the fan speed is increased to high speed. If the temperature reaches the fourth high threshold, the liquid cooling to high speed and the TEC module to cool are activated. At the same time, the processor module monitors the temperature of the cooling and heating surfaces of the TEC module in real time and uses an intermittent temperature control method. When the temperature of the cooling surface stops decreasing and the temperature of the heating surface is about to rise, the TEC module is turned off and restarted after the temperatures of the cooling and heating surfaces are equalized to avoid heat buildup.

[0034] Intelligent protection and sleep mode: The low battery monitoring module detects the battery level in real time. When low battery is detected, the processor module controls the heat dissipation modules to stop working and enters a low-power sleep mode. The Hall switch module and touch sensing module also trigger low-power sleep mode when they detect that the device is not in contact with the phone or there is no operation. The charging contacts charge the battery through the charging adapter module, battery charging module and battery protection module to ensure the stability and safety of power supply.

[0035] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A liquid-cooled mobile phone case with integrated semiconductor cooling, comprising a mobile phone case body (1), wherein the mobile phone case body (1) encloses the mobile phone body (5) for locking, characterized in that: The top of the main body (1) of the mobile phone case is provided with a cooling module (3), the outer shell of the cooling module (3) is provided with an air inlet (24), the top of the main body (1) of the mobile phone case is provided with an air outlet (23), the side of the main body (1) of the mobile phone case is provided with a piezoelectric ceramic sheet button (4), the bottom of the main body (1) of the mobile phone case is provided with a charging contact (9), the inner side of the main body (1) of the mobile phone case is provided with a slot (7) for the cooling module (3), the semiconductor cooling chip module (6) and the liquid cooling display window transparent component, the cooling module (3) includes a fan dustproof mesh (10), a rear fan base (12), and a fan main The body (13) and the front fan base (16) are attached to the upper inner side of the main body (1) of the mobile phone case. A piezoelectric ceramic sheet (11) and a semiconductor cooling sheet (14) are attached to the liquid cooling film (22). A heat sink (15) is attached to the semiconductor cooling sheet. A magnetic ring groove (8), a magnetic ring (18), and a PCB circuit board (19) are assembled on the inner surface of the main body (1). A temperature sensor chip, a battery (20), a liquid cooling film (22), and a heat-conducting cover plate (21) are soldered on the PCB circuit board (19). A transparent display window (17) is provided on the slot (7) of the transparent component of the liquid cooling display window. The PCB circuit board (19) is equipped with a temperature sensor module, a piezoelectric ceramic sheet detection module, a membrane keypad module, a touch sensing module, a low battery monitoring module, a Hall switch module, a voltage-controlled drive module, a processor module, a fan drive module, a piezoelectric micropump module, a TEC drive module, an indicator light module, a fan module, a liquid-cooled film module, a TEC module, a power supply module, a charging adapter module, a battery charging module, a battery protection module, and a battery module.

2. The liquid-cooled phone case with integrated semiconductor cooling according to claim 1, characterized in that: The upper part of the main body (1) of the mobile phone case is provided with a camera module (2). The rear fan seat (12) and the front fan seat (16) are assembled with the fan body (13) and fixed by two sets of retaining rings for shock absorption. The fan dustproof net (10) is positioned at the rear end of the rear fan seat (12) for locking. The transparent display window (17) is locked inside the slot (7) for positioning.

3. The liquid-cooled mobile phone case with integrated semiconductor cooling according to claim 1, characterized in that: The piezoelectric ceramic sheet (11) is attached to the inside of the main body (1) of the mobile phone case and is limited by the slot. The semiconductor cooling chip module (6) and the semiconductor cooling chip (14) are electrically connected. The semiconductor cooling chip module (6) and the semiconductor cooling chip (14) conduct heat through the heat sink (15).

4. The liquid-cooled phone case with integrated semiconductor cooling according to claim 1, characterized in that: The magnetic ring (18) is engaged with the inner side of the magnetic ring groove (8) and fixed to the inner side of the mobile phone case body (1). The semiconductor cooling chip module (6), PCB circuit board (19) and battery (20) are electrically connected. The liquid cooling film (22) and heat-conducting cover plate (21) are bonded and fixed together.

5. A liquid-cooled phone case with integrated semiconductor cooling according to claim 1, characterized in that: The magnetic ring (18) is engaged inside the magnetic ring groove (8), and the heat-conducting cover plate (21) is located on the surface of the liquid cooling film (22).

6. A liquid-cooled phone case with integrated semiconductor cooling according to claim 1, characterized in that: The power module includes a 5V power supply and two sets of 3.3V power supplies, both of which are connected to the battery module. One set of 3.3V power supplies is connected to the processor module, and the other set of 3.3V power supplies is connected to the piezoelectric micropump module and the TEC drive module. The 5V power supply is connected to the fan drive module. The output terminal of the charging adapter module is connected to the input terminal of the battery charging module. The output terminal of the battery charging module is connected to the input terminal of the battery protection module, and the output terminal of the battery protection module is connected to the input terminal of the battery module.

7. A liquid-cooled mobile phone case with integrated semiconductor cooling according to claim 1, characterized in that: The outputs of the temperature sensor module, piezoelectric ceramic sheet detection module, membrane keypad module, touch sensing module, low battery monitoring module, Hall switch module, and voltage-controlled drive module are all connected to the input of the processor module.

8. A liquid-cooled phone case with integrated semiconductor cooling according to claim 1, characterized in that: The output of the processor module is connected to the input of the fan drive module, the piezoelectric micropump module, and the TEC drive module. The output of the fan drive module is connected to the input of the fan module. The output of the piezoelectric micropump module is connected to the input of the liquid cooling diaphragm. The output of the TEC drive module is connected to the input of the TEC module.

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