Circuit board and method of manufacturing the same

Abstract

This invention discloses a circuit board and its manufacturing method. The circuit board includes a core region and a redistribution region. The core region includes a glass plate, two first metal layers, multiple metal cylinders, two first protective layers, and two dry films. The two first protective layers are disposed on a portion of a first surface, a first metal layer, a portion of a second surface, and the cylinder walls of the metal cylinders. The two dry films cover the first protective layers. The redistribution region connects to the core region and includes a second metal layer, a second protective layer, a first organic film, a third metal layer, a third protective layer, and a second organic film. The second metal layer is disposed on a portion of the dry film. The second protective layer is disposed on the second metal layer and a portion of the dry film. The first organic film covers the second protective layer. The third metal layer is disposed on a portion of the first organic film. The third protective layer is disposed on the third metal layer and a portion of the first organic film.

Description

Technical Field

[0001] This invention relates to a circuit board, and more particularly to a circuit board that can reduce or avoid warping and protect circuits, and a method for manufacturing the same. Background Technology

[0002] Existing circuit boards using glass substrates are prone to reliability issues such as warpage or back cracking due to stress generated by the multiple circuit layers. The causes of this stress include high stress from purely dry film stacking, poor flatness from purely wet film stacking, lack of via filling capability, and difficulty in covering subsequent metal layers. Furthermore, the circuit layers of existing glass substrate circuit boards are mostly fine lines that are worn down by oxidation during thermal cycling, and there is even a risk of peeling. Summary of the Invention

[0003] At least one embodiment of the present invention provides a circuit board and a method for manufacturing the same, which helps to improve the warping, open solder joints, line stripping and line oxidation of the circuit board.

[0004] At least one embodiment of the present invention provides a circuit board including a core region and a redistribution region. The core region includes a glass plate, two first metal layers, a plurality of metal cylinders, two first protective layers, and two dry films. The glass plate has a first surface and a second surface opposite the first surface, and a plurality of through holes, each of which extends from the first surface to the second surface. The two first metal layers are respectively disposed on a portion of the first surface and a portion of the second surface. The metal cylinders are disposed on the walls of each of the through holes, each of which has a cylinder wall. The two first protective layers are disposed on a portion of the first surface, the first metal layers, a portion of the second surface, and the cylinder wall. The two dry films cover the first protective layers and have a plurality of first grooves, each of which extends from the dry film toward the first protective layer until the first metal layer is exposed. The redistribution region connects to the core region and includes a second metal layer, a second protective layer, a first organic film, a third metal layer, a third protective layer, and a second organic film. The second metal layer is disposed on a portion of the dry film and the first grooves. The second protective layer is disposed on the second metal layer and a portion of the dry film. A first organic film covers a second protective layer and has a third surface and a plurality of second grooves, each of which extends from the third surface toward the second protective layer until a second metal layer is exposed. A third metal layer is disposed on a portion of the first organic film and the second grooves. A third protective layer is disposed on the third metal layer and a portion of the first organic film. A second organic film covers the third protective layer and has a fourth surface and a plurality of third grooves, each of which extends from the fourth surface toward the third protective layer until a third metal layer is exposed.

[0005] In at least one embodiment of the present invention, the circuit board further includes a fourth metal layer, a first connector, a second connector, a motherboard, and a plurality of electronic components. The fourth metal layer is disposed on a portion of the redistribution area. The first connector covers the fourth metal layer located on a first surface. The second connector covers the fourth metal layer located on a second surface. The motherboard is disposed on the fourth metal layer located on the second surface, wherein the second connector is located between the motherboard and the fourth metal layer located on the second surface. The electronic components are disposed on the fourth metal layer located on the first surface, wherein the first connector is located between the electronic components and the fourth metal layer located on the first surface.

[0006] In at least one embodiment of the present invention, the aforementioned dry film fills the through-hole.

[0007] In at least one embodiment of the present invention, the thickness of the dry film is 10 micrometers to 50 micrometers.

[0008] In at least one embodiment of the present invention, the diameter of the second groove is less than or equal to the diameter of the first groove.

[0009] In at least one embodiment of the present invention, the Young's modulus of the first organic membrane is smaller than that of the second organic membrane.

[0010] In at least one embodiment of the present invention, the thickness of the first protective layer, the thickness of the second protective layer and the thickness of the third protective layer are 10 nm to 500 nm.

[0011] In at least one embodiment of the present invention, the circuit board further includes two redistribution areas connected to the core area, wherein the core area is located between the two redistribution areas.

[0012] At least one embodiment of the present invention provides a method for manufacturing a circuit board, including forming a core region and forming a redistribution region. The step of forming the core region includes providing a glass plate having a first surface and a second surface opposite the first surface, and a plurality of through holes, wherein each of these through holes extends from the first surface to the second surface; forming two first metal layers on portions of the first surface and portions of the second surface; forming a plurality of metal cylinders on the wall of each of these through holes, wherein each of these metal cylinders has a cylinder wall; forming two first protective layers on portions of the first surface, the first metal layers, portions of the second surface, and the cylinder wall; covering the first protective layers with two dry films; and forming a plurality of first grooves on the dry films, and removing portions of the first protective layers located on the first metal layers until the first metal layers within the first grooves are exposed. The redistribution region connects to the core region. The steps of forming the redistribution area include forming a second metal layer in a portion of the dry film and the first grooves; forming a second protective layer in the second metal layer and the portion of the dry film; covering the second protective layer with a first organic film, wherein the first organic film has a third surface; forming a plurality of second grooves in the first organic film, wherein each of the second grooves extends from the third surface toward the second protective layer until the second metal layer is exposed; forming a third metal layer in a portion of the first organic film and the second grooves; forming a third protective layer in the third metal layer and the portion of the first organic film; covering the second organic film in the third protective layer, wherein the second organic film has a fourth surface; and forming a plurality of third grooves in the second organic film, wherein each of the third grooves extends from the fourth surface toward the third protective layer until the third metal layer is exposed.

[0013] In at least one embodiment of the present invention, the method of manufacturing the circuit board further includes forming a fourth metal layer on a portion of the redistribution area; covering a first connector on the fourth metal layer located on a first surface; covering a second connector on the fourth metal layer located on a second surface; connecting a motherboard to the fourth metal layer located on the second surface, wherein the second connector is located between the motherboard and the fourth metal layer located on the second surface; and connecting a plurality of electronic components to the fourth metal layer located on the first surface, wherein the first connector is located between the electronic components and the fourth metal layer located on the first surface.

[0014] In at least one embodiment of the present invention, the method for manufacturing the circuit board described above, wherein the step of forming a first metal layer includes covering a patterned photoresist on a first surface and a second surface of a glass plate; forming an initial first metal layer on a portion of the first surface and a portion of the second surface; and removing the patterned photoresist.

[0015] Based on the above, the aforementioned circuit board and its manufacturing method utilize a dry film disposed in the core area and a first organic film and a second organic film mixed and stacked in the redistribution area to reduce stress between multiple layers and maintain flatness, which helps to improve the warpage and solder joints of the aforementioned circuit board. Furthermore, the use of a first protective layer, a second protective layer, and a third protective layer disposed between the metal layer and the dielectric layer (e.g., dry film, first organic film, or second organic film) helps to improve the stripping and oxidation of the circuit board. Attached Figure Description

[0016] To make the above and other features, advantages and embodiments of this disclosure more apparent and understandable, the detailed description of the accompanying drawings is as follows:

[0017] Figure 1 This is a cross-sectional schematic diagram of a circuit board according to at least one embodiment of the present invention.

[0018] Figures 2A to 2G This is a cross-sectional schematic diagram of a method for manufacturing a circuit board according to at least one embodiment of the present invention.

[0019] In the attached figures, the following labels are used:

[0020] 100: Circuit board

[0021] 200: Core Area

[0022] 210: Glass plate

[0023] 211: First Surface

[0024] 212: Second Surface

[0025] 215: Through hole

[0026] 215W: Hole wall

[0027] 220: First metal layer

[0028] 230: Metal cylinder

[0029] 230W: Cylinder wall

[0030] 240: First protective layer

[0031] 250: Dry film

[0032] 251: First Groove

[0033] 260: Patterned photoresist

[0034] 300: Rewiring Area

[0035] 310: Second metal layer

[0036] 320: Second protective layer

[0037] 330: First organic membrane

[0038] 332: Second groove

[0039] 333: Third Surface

[0040] 340: Third metal layer

[0041] 350: Third protective layer

[0042] 360: Second organic membrane

[0043] 363: Third Groove

[0044] 364: The Fourth Surface

[0045] 510: First connector

[0046] 520: Second connector

[0047] 530: Motherboard

[0048] 540: Fourth metal layer

[0049] 550: Electronic Components

[0050] 560: Solder resist layer Detailed Implementation

[0051] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0052] In the following text, to clearly present the technical features of this application, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings or the size and shape of the elements, but should cover the size, shape, and deviations from both caused by actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the drawings of this application are mainly for illustration and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the scope of the claims in this application.

[0053] It should be understood that although the terms "first," "second," "third," etc., in this disclosure may be used to describe various components, elements, areas, layers, parts, and / or segments, these components, elements, areas, layers, parts, and / or segments should not be limited by these terms. These terms are used only to distinguish one component, element, area, layer, part, or segment from another. Therefore, the first component, element, area, layer, part, or segment described below may be referred to as the second component, element, area, layer, part, or segment without departing from the teachings of this disclosure.

[0054] Figure 1 This is a schematic cross-sectional view of a circuit board 100 according to at least one embodiment of the present invention. Please refer to... Figure 1 The circuit board 100 includes a core area 200 and a redistribution area 300. The circuit board 100 also includes two redistribution areas 300. The two redistribution areas 300 connect to the core area 200, and the core area 200 is located between the two redistribution areas 300, which allows for a more balanced stress in the overall structure of the circuit board 100.

[0055] The core area 200 includes a glass plate 210, two first metal layers 220, multiple metal cylinders 230, two first protective layers 240, and two dry films 250. The glass plate 210 has a first surface 211 and a second surface 212 opposite to the first surface 211. The glass plate 210 is composed of alkali glass, alkali-free glass, borosilicate, quartz, or fused silica, etc. The thickness of the glass plate 210 can be between 0.5 mm and 2.0 mm. The glass plate 210 can be rectangular or circular. The glass plate 210 also includes multiple through holes 215, each of which extends from the first surface 211 to the second surface 212.

[0056] The inner diameter of the through-hole 215 can be between 20 micrometers and 200 micrometers. The spacing between the through-holes 215 can be between 50 micrometers and 500 micrometers, and the size is not limited to these dimensions and can be varied according to requirements. The shape of the through-hole 215 is not limited to a cylinder and can be polygonal, etc.

[0057] Two first metal layers 220 are respectively disposed on a portion of the first surface 211 and a portion of the second surface 212. Metal cylinders 230 are disposed on the wall 215W of each of the through holes 215, wherein each of the metal cylinders 230 has a cylinder wall 230W. Two first protective layers 240 are disposed on a portion of the first surface 211, the first metal layers 220, a portion of the second surface 212, and the cylinder wall 230W. The metal material of the first metal layers 220 and the metal cylinders 230 can be at least one of copper, aluminum, silver, and gold.

[0058] Between the first metal layer 220 and the glass plate 210, a seed layer and an adhesive layer may be included to improve adhesion. The seed layer may be at least one of copper, molybdenum, titanium, and aluminum, and may be more than one material, not limited thereto. The adhesive layer may be a metal or a metal oxide, and the metal may be, for example, at least one of palladium, tin, and titanium, and the metal oxide may be, for example, titanium dioxide, not limited thereto.

[0059] Two dry films 250 cover the first protective layer 240 and have a plurality of first grooves 251, each of which extends from the dry film 250 toward the first protective layer 240 until the first metal layer 220 is exposed. The dry films 250 fill vias 215. The pore size of the first grooves 251 within the dry films 250 is between 20 micrometers and 100 micrometers. The thickness of the dry films 250 is from 10 micrometers to 50 micrometers, and is not limited thereto. The number of layers of the dry films 250 can be from one to three.

[0060] Dry film 250 is a dry film, and its dielectric material can be at least one of the following, such as photosensitive polyimide (PSPI) or Ajinomoto built-up film (ABF), but is not limited to this.

[0061] The dry film 250 contains carbon, oxygen, and a small amount of nitrogen. The elemental composition of the dry film 250 can be determined using energy-dispersive X-ray spectroscopy (EDX). Subsequently, Fourier-transform infrared spectroscopy (FTIR) is used to further analyze the functional groups of the dry film 250. The functional groups of the dry film 250 include at least one of the following: olefinic, esteric, and amino groups.

[0062] The redistribution area 300 connects to the core area 200 and includes a second metal layer 310, a second protective layer 320, a first organic film 330, a third metal layer 340, a third protective layer 350, and a second organic film 360. The second metal layer 310 is disposed on a portion of the dry film 250 and these first grooves 251. The second protective layer 320 is disposed on the second metal layer 310 and a portion of the dry film 250.

[0063] A first organic film 330 covers a second protective layer 320 and has a third surface 333 and a plurality of second grooves 332, each of which extends from the third surface 333 toward the second protective layer 320 until a second metal layer 310 is exposed. A third metal layer 340 is disposed on a portion of the first organic film 330 and the second grooves 332. A third protective layer 350 is disposed on the third metal layer 340 and a portion of the first organic film 330. The thicknesses of the first protective layer 340, the second protective layer 320, and the third protective layer 350 are from 10 nm to 500 nm.

[0064] The second organic film 360 covers the third protective layer 350 and has a fourth surface 364 and a plurality of third grooves 363, each of which extends from the fourth surface 364 toward the third protective layer 350 until the third metal layer 340 is exposed. The second organic film 360 and the first organic film 330 may be made of the same material or different materials; they may both be dry films or both be wet films, or even a combination of dry and wet films. The dielectric constant (Dk) of the dry and wet films may be between 2 and 4. The dielectric loss (Df) of the dry and wet films may be between 0.0001 and 0.05.

[0065] The dielectric material of the wet-film can be a photo-imageable dielectric (PID), such as photosensitive polyimide (PSPI). The dielectric material of the wet-film can also be at least one of PI (polyimide), epoxy resin, and PBO (polybenzoxazole).

[0066] Wet membranes can also be analyzed using EDX for elemental analysis. The elements in wet membranes include nitrogen and oxygen. Due to additives such as silica gel and glass microparticles, trace amounts of chlorine or sulfur may remain. Wet membranes can also be analyzed in detail using FTIR for functional group analysis. The functional groups in wet membranes include hydroxyl and ether groups. The thickness of wet membranes can range from 1 micrometer to 10 micrometers, and is not limited to this range. The number of layers in a wet membrane can range from 1 to 10, and is not limited to this range. The Young's modulus of a wet membrane is lower than that of a dry membrane.

[0067] When the first organic film 330 is a wet film and the second organic film 360 is a dry film, the Young's modulus of the first organic film 330 is less than that of the second organic film 360. The aperture of the second groove 332 in the first organic film 330 is less than or equal to the aperture of the third groove 363 in the second organic film 360. The thickness of the second metal layer 310 in the first organic film 330 is less than the thickness of the third metal layer 340 in the second organic film 360. Therefore, the circuit layer formed by the second metal layer 310 in the first organic film 330 (which is a wet film) can be used as a signal layer. The circuit layer formed by the third metal layer 340 in the second organic film 360 (which is a dry film) can be used as a power layer. The metal materials of the second metal layer 310 and the third metal layer 340 can be at least one of copper, aluminum, silver, gold, and nickel, and are not limited thereto.

[0068] Following on the above, the thickness of the second metal layer 310 is between 0.5 micrometers and 5 micrometers. The line width and space of the second metal layer 310 can be 0.5 micrometers / 0.5 micrometers, but is not limited to this. The thickness of the third metal layer 340 is between 5 micrometers and 30 micrometers. The line width and space of the third metal layer 340 can be 5 micrometers / 5 micrometers, but is not limited to this. In other words, the thickness and line width / space of the metal layer in the wet membrane are less than those in the dry membrane.

[0069] However, when the first organic membrane 330 is a dry membrane and the second organic membrane 360 ​​is a wet membrane, the opposite is true. In this case, the thickness of the first organic membrane 330 can be between 10 micrometers and 50 micrometers, and is not limited to this. The thickness of the second organic membrane 360 ​​can be between 1 micrometer and 10 micrometers, and is not limited to this.

[0070] The first protective layer 240, the second protective layer 320, and the third protective layer 350 are composed of inorganic materials, which can be at least one of alumina, silicon oxynitride, silicon oxide, and silicon nitride. The first protective layer 240 is located on the first metal layer 220, the second protective layer 320 is located on the second metal layer 310, and the third protective layer 350 is located on the third metal layer 340. These materials can respectively prevent oxidation, peeling, and even delamination and cracking between interfaces of the circuit layer formed by the first metal layer 220, the second metal layer 310, and the third metal layer 340, and prevent the circuit layer from being worn down due to thermal cycling oxidation.

[0071] The circuit board 100 also includes a fourth metal layer 540, a first connector 510, a second connector 520, and a solder resist layer 560. The fourth metal layer 540 is disposed on a portion of the redistribution area 300. The solder resist layer 560 covers the portion of the redistribution area 300.

[0072] The first connector 510 covers the fourth metal layer 540 located on the first surface 211. The material of the first connector 510 can be at least one of copper, tin, silver, and lead, and is not limited thereto. The shape of the first connector 510 can be a bump, a sphere, or a combination of bumps and spheres. The size of the first connector 510 can be between 10 micrometers and 50 micrometers, and is not limited thereto. The spacing between the first connectors 510 can be between 20 micrometers and 100 micrometers, and is not limited thereto.

[0073] The second connector 520 covers the fourth metal layer 540 located on the second surface 212. The material of the second connector 520 can be one or more of copper, tin, and silver, and is not limited thereto. The shape of the second connector 520 can be spherical. The size of the second connector 520 can be between 50 micrometers and 150 micrometers, and is not limited thereto. The spacing between the second connectors 520 can be between 30 micrometers and 500 micrometers, and is not limited thereto.

[0074] Figures 2A to 2G This is a cross-sectional schematic diagram of a method for manufacturing a circuit board 100 according to at least one embodiment of the present invention. The method for manufacturing the circuit board 100 includes forming a core region 200 and forming a redistribution region 300. For the steps of forming the core region 200, please refer to [link to relevant documentation]. Figures 2A to 2C For the steps to form the redistribution area 300, please refer to [link / reference needed]. Figures 2D to 2E .and Figures 2F to 2G Connect components.

[0075] First, form the core area 200. Please refer to [link / reference]. Figure 2A A glass plate 210 is provided, having a first surface 211 and a second surface 212 opposite to the first surface 211, and a plurality of through holes 215, wherein each of the through holes 215 extends from the first surface 211 to the second surface 212.

[0076] Next, please refer to Figure 2B Two first metal layers 220 are formed on a portion of the first surface 211 and a portion of the second surface 212. Next, a plurality of metal cylinders 230 are formed on the hole wall 215W of each of these through holes 215, wherein each of these metal cylinders 230 has a cylinder wall 230W.

[0077] For the steps of forming the first metal layer 220, please refer to [link / reference]. Figures 2A to 2B First, patterned photoresist 260 is applied to the first surface 211 and the second surface 212 of the glass plate 210. Next, please refer to... Figure 2B An initial first metal layer (not shown) is formed on a portion of the first surface 211 and a portion of the second surface 212. Then, the patterned photoresist 260 is removed.

[0078] Next, please refer to Figure 2CTwo first protective layers 240 are formed on a portion of the first surface 211, the first metal layer 220, a portion of the second surface 212, and the cylinder wall 230W. Next, two dry films 250 are applied to the first protective layers 240. The method of applying the two dry films 250 to the first protective layers 240 includes one of hot-press bonding, vacuum bonding, and roll-to-roll bonding. Next, a plurality of first grooves 251 are formed on the dry films 250, and a portion of the first protective layer 240 located on the first metal layer 220 is removed until the first metal layer 220 within the first grooves 251 is exposed. The method of forming the plurality of first grooves 251 on the dry films 250 can be laser drilling or exposure development. The method of removing the portion of the first protective layer 240 located on the first metal layer 220 until the first metal layer 220 within the first grooves 251 is dry etching.

[0079] Next, redistribution area 300 is formed. Please refer to [link / reference]. Figure 2D A second metal layer 310 is formed in the portion of the dry film 250 and the first grooves 251. Next, a second protective layer 320 is formed in the second metal layer 310 and the portion of the dry film 250. Then, a first organic film 330 is covered on the second protective layer 320, wherein the first organic film 330 has a third surface 333.

[0080] Next, a plurality of second grooves 332 are formed in the first organic film 330, each of the second grooves 332 extending from the third surface 333 toward the second protective layer 320 until the second metal layer 310 is exposed. The portion of the second protective layer 320 located in the second metal layer 310 is removed until the second metal layer 310 within the second grooves 332 by dry etching. Next, a third metal layer 340 is formed in a portion of the first organic film 330 and within the second grooves 332. Next, a third protective layer 350 is formed in the third metal layer 340 and a portion of the first organic film 330.

[0081] Next, please refer to Figure 2E A second organic film 360 is then covered by a third protective layer 350, wherein the second organic film 360 has a fourth surface 364. Next, a plurality of third grooves 363 are formed on the second organic film 360, each of these third grooves 363 extending from the fourth surface 364 toward the third protective layer 350 until the third metal layer 340 is exposed. The formation of the plurality of second grooves 332 on the first organic film 330 and the formation of the plurality of third grooves 363 on the second organic film 360 can be achieved by laser drilling or exposure development. The removal of a portion of the third protective layer 350 located in the third metal layer 340 until the third metal layer 340 within the third groove 363 is achieved by dry etching.

[0082] Forming the first protective layer 240 (e.g.) Figure 2CAs shown), the second protective layer 320 (as shown) Figure 2D The method of the third protective layer 350 (as shown) can be atomic layer deposition (ALD), physical vapor deposition (PVD) or chemical vapor deposition (CVD).

[0083] Next, connect the components; please refer to [link / reference]. Figure 2F A fourth metal layer 540 is formed on a portion of the redistribution area 300. A first metal layer 220 is formed (e.g., ...). Figure 2C As shown), the second metal layer 310 (as shown) Figure 2D As shown), the third metal layer 340 and the fourth metal layer 540 can be electroplated. Before electroplating, a seed layer can be applied, or a patterned photoresist 260 (such as...) can be used. Figure 2A (As shown) Define the circuit patterns of the first metal layer 220, the second metal layer 310, the third metal layer 340, and the fourth metal layer 540. After electroplating, remove the patterned photoresist 260 and etch the seed layer.

[0084] Next, a solder resist layer 560 is applied to a portion of the redistribution area 300. The solder resist layer 560 can be applied to the redistribution area 300 by coating or lamination, and laser drilling or exposure development is used to expose the fourth metal layer 540. Next, a first connector 510 is applied to the fourth metal layer 540 located on the first surface 211. In other words, the first connector 510 is applied to the fourth metal layer 540 located on the redistribution area 300 on the first surface 211. Next, a second connector 520 is applied to the fourth metal layer 540 located on the second surface 212. In other words, the second connector 520 is applied to the fourth metal layer 540 located on the redistribution area 300 on the second surface 212. The first connector 510 and the second connector 520 can be applied by electroplating, screen printing, or using a ball-mounting machine.

[0085] Next, please refer to Figure 2E The motherboard 530 is connected to the fourth metal layer 540 located on the second surface 212, wherein the second connector 520 is located between the motherboard 530 and the fourth metal layer 540 located on the second surface 212. In other words, the motherboard 530 is connected to the fourth metal layer 540 of the redistribution area 300 located on the second surface 212, wherein the second connector 520 is located between the motherboard 530 and the fourth metal layer 540 of the redistribution area 300 located on the second surface 212.

[0086] Next, multiple electronic components 550 are connected to a fourth metal layer 540 located on the first surface 211, wherein a first connector 510 is located between these electronic components 550 and the fourth metal layer 540 located on the first surface 211. In other words, multiple electronic components 550 are connected to the fourth metal layer 540 of the redistribution area 300 located on the first surface 211, wherein a first connector 510 is located between these electronic components 550 and the fourth metal layer 540 of the redistribution area 300 located on the first surface 211.

[0087] In a broader sense, the circuit board 100 may also include a motherboard 530 and a plurality of electronic components 550. The motherboard 530 is disposed on a fourth metal layer 540 located on the second surface 212, wherein the second connector 520 is located between the motherboard 530 and the fourth metal layer 540 located on the second surface 212. In other words, the motherboard 530 is disposed on the fourth metal layer 540 of the redistribution area 300 located on the second surface 212, wherein the second connector 520 is located between the motherboard 530 and the fourth metal layer 540 of the redistribution area 300 located on the second surface 212.

[0088] These electronic components 550 are disposed on a fourth metal layer 540 located on the first surface 211, wherein a first connector 510 is located between these electronic components 550 and the fourth metal layer 540 located on the first surface 211. In other words, these electronic components 550 are disposed on the fourth metal layer 540 of the redistribution area 300 on the first surface 211, wherein a first connector 510 is located between these electronic components 550 and the fourth metal layer 540 of the redistribution area 300 located on the first surface 211.

[0089] The motherboard 530 can be a carrier for electronic components, such as a PCB (main printed circuit board). Electronic components 550 can be active components such as chips, memory, capacitors, and power supplies. Electronic components 550 can also be passive components such as resistors, capacitors, and inductors.

[0090] In summary, the circuit board and its manufacturing method according to at least one embodiment of the present invention utilize a dry film disposed in the core area, which can completely fill the through-holes and maintain the flatness of the substrate. A first organic film and a second organic film are also used in the redistribution area, with dry or wet films mixed and stacked, reducing stress between multiple layers and maintaining the flatness of the circuit board, which helps to improve the warpage and solder joints of the circuit board. Furthermore, the use of a first protective layer, a second protective layer, and a third protective layer disposed between the circuit layer (made of a metal layer) and the dielectric layer (e.g., dry film, first organic film, or second organic film) helps to improve the stripping and oxidation of the circuit board, thereby affecting the stability of electrical performance.

[0091] While this application has disclosed various embodiments above, it is not intended to limit this application. The above outlines components of several embodiments to facilitate a better understanding of the inventive embodiments by those skilled in the art. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments of this invention to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent processes and structures do not depart from the spirit and scope of this invention, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of this invention. Therefore, the scope of protection of this application shall be determined by the appended claims.

Claims

1. A circuit board, characterized in that, include: One core area, including: A glass plate having a first surface and a second surface opposite the first surface, and a plurality of through holes, wherein each of the plurality of through holes extends from the first surface to the second surface; Two first metal layers are respectively disposed on a portion of the first surface and a portion of the second surface; Multiple metal cylinders are disposed on one wall of each of the multiple through holes, wherein each of the multiple metal cylinders has a cylinder wall; Two first protective layers are disposed on a portion of the first surface, the first metal layer, a portion of the second surface, and the cylinder wall; and Two dry films, covering the first protective layer, and having a plurality of first grooves, each of which extends from the dry film toward the first protective layer until the first metal layer is exposed; and A single cabling area, connecting the core area, includes: A second metal layer is disposed on a portion of the dry film and the plurality of first grooves; A second protective layer is disposed between the second metal layer and a portion of the dry film; A first organic film covers the second protective layer and has a third surface and a plurality of second grooves, wherein each of the plurality of second grooves extends from the third surface toward the second protective layer until the second metal layer is exposed; A third metal layer is disposed on a portion of the first organic film and the plurality of second grooves; A third protective layer is disposed between the third metal layer and a portion of the first organic film; and A second organic film covers the third protective layer and has a fourth surface and a plurality of third grooves, wherein each of the plurality of third grooves extends from the fourth surface toward the third protective layer until the third metal layer is exposed.

2. The circuit board as described in claim 1, characterized in that, Also includes: A fourth metal layer is disposed on a portion of the redistribution area; A first connector covers the fourth metal layer located on the first surface; A second connector covers the fourth metal layer located on the second surface; A mother plate is disposed on the fourth metal layer located on the second surface, wherein the second connector is located between the mother plate and the fourth metal layer located on the second surface; as well as Multiple electronic components are disposed on the fourth metal layer located on the first surface, wherein the first connector is located between the multiple electronic components and the fourth metal layer located on the first surface.

3. The circuit board as described in claim 1, characterized in that, The dry film therein fills the through-hole.

4. The circuit board as described in claim 3, characterized in that, The thickness of the dry film is 10 micrometers to 50 micrometers.

5. The circuit board as described in claim 1, characterized in that, The diameter of the second groove is less than or equal to the diameter of the first groove.

6. The circuit board as described in claim 1, characterized in that, The Young's modulus of the first organic membrane is smaller than that of the second organic membrane.

7. The circuit board as described in claim 1, characterized in that, The thicknesses of the first protective layer, the second protective layer, and the third protective layer are between 10 nm and 500 nm.

8. The circuit board as described in claim 1, characterized in that, Also includes: The two redistribution areas connect the core area, wherein the core area is located between the two redistribution areas.

9. A method for manufacturing a circuit board, characterized in that, include: Forming a core region, wherein the steps of forming the core region include: A glass plate is provided having a first surface, a second surface opposite to the first surface, and a plurality of through holes, wherein each of the plurality of through holes extends from the first surface to the second surface; Two first metal layers are formed on a portion of the first surface and a portion of the second surface, respectively; A plurality of metal cylinders are formed on one wall of each of the plurality of through holes, wherein each of the plurality of metal cylinders has a cylinder wall; Two first protective layers are formed on a portion of the first surface, the first metal layer, a portion of the second surface, and the cylinder wall; Covering the first protective layer with two dry films; and A plurality of first grooves are formed in the dry film, and a portion of the first protective layer located on the first metal layer is removed until the first metal layer within the first grooves is exposed; and A rewiring area is formed, wherein the rewiring area is connected to the core area; The step of forming the redistribution area includes: A second metal layer is formed in a portion of the dry film and the plurality of first grooves; A second protective layer is formed on the second metal layer and a portion of the dry film; A first organic film is covered on the second protective layer, wherein the first organic film has a third surface; A plurality of second grooves are formed in the first organic film, wherein each of the plurality of second grooves extends from the third surface toward the second protective layer until the second metal layer is exposed; A third metal layer is formed in a portion of the first organic film and the plurality of second grooves; A third protective layer is formed on the third metal layer and a portion of the first organic film; A second organic film is coated onto the third protective layer, wherein the second organic film has a fourth surface; and A plurality of third grooves are formed in the second organic film, wherein each of the plurality of third grooves extends from the fourth surface toward the third protective layer until the third metal layer is exposed.

10. The method for manufacturing a circuit board as described in claim 9, characterized in that, Also includes: A fourth metal layer is formed on a portion of the redistribution area; A first connector is placed on the fourth metal layer located on the first surface; A second connector is placed over the fourth metal layer located on the second surface; A mother plate is connected to the fourth metal layer located on the second surface, wherein the second connector is located between the mother plate and the fourth metal layer located on the second surface; as well as A plurality of electronic components are connected to a fourth metal layer located on the first surface, wherein the first connector is located between the plurality of electronic components and the fourth metal layer located on the first surface.

11. The method for manufacturing a circuit board as described in claim 9, characterized in that, The step of forming the first metal layer includes: A patterned photoresist is applied to the first and second surfaces of the glass plate; An initial first metal layer is formed on a portion of the first surface and a portion of the second surface; and Remove the patterned photoresist.

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