Circuit board and manufacturing method thereof

By introducing a core area and a redistribution area design into the circuit board, and utilizing a combination of dry film-filled vias and a protective layer, the problems of circuit board warping and circuit oxidation are solved, thereby improving the reliability and stability of the circuit board.

CN122373239APending Publication Date: 2026-07-10AU OPTRONICS CORP
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Patent Information

Application Number
CN202610671130.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-12-23
Filing Date
2026-05-15
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing circuit boards using glass plates suffer from reliability issues such as warping and back cracking due to stress caused by multiple circuit layers. Furthermore, the circuit layers are prone to wear and tear due to thermal cycling oxidation, posing a risk of circuit stripping.

Method used

The circuit board design includes a core area and a redistribution area. The core area consists of a glass plate, a metal layer, a protective layer, and a dry film, while the redistribution area consists of an organic film and a metal layer. By filling the vias with dry film and combining the stacked structure of the protective layer and the organic film, the stress between multiple layers is reduced, and warping and circuit oxidation are prevented.

Benefits of technology

It effectively improves the warping and stripping problems of circuit boards, enhances the flatness and electrical stability of circuit boards, and prevents the circuit layers from being worn down due to thermal cycling oxidation.

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Abstract

The invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises a core area and a redistribution area. The core area comprises a glass plate, two first metal layers, a plurality of metal cylinders, two first protective layers and two dry films. The two first protection layers are arranged on a part of the first surface, the first metal layer, a part of the second surface and the cylinder walls of the metal cylinders. The two dry films cover the first protective layer. The rewiring area is connected with the core area and comprises a second metal layer, a second protection layer, a first organic film, a third metal layer, a third protection layer and a second organic film. The second metal layer is arranged on part of the dry film. The second protective layer is disposed on the second metal layer and a part of the dry film. The first organic film covers the second protective layer. The third metal layer is disposed on a portion of the first organic film. The third protective layer is disposed on the third metal layer and a part of the first organic film.
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