Hollow sheet metal fin and method of processing the same

By employing an array or staggered distribution of protruding microchannel structures in hollow thin-film metal heat sinks, combined with photochemical etching and laser welding processes, the problems of low heat dissipation efficiency and complex processing of memory modules have been solved, achieving efficient and stable heat dissipation and high-precision manufacturing.

CN122373320APending Publication Date: 2026-07-10SUZHOU COOL CORE TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUZHOU COOL CORE TECH CO LTD
Filing Date
2026-05-16
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

In existing technologies, memory modules have low heat dissipation efficiency and complex processing, making it difficult to meet the requirements of high-efficiency heat dissipation. The laminar flow state of finned heat sinks results in limited contact area, low processing precision, and cumbersome and time-consuming processes.

Method used

The design incorporates hollow, thin-film metal heat sinks, employing arrayed or staggered protrusions to form microchannel structures. Combined with photochemical etching and laser welding processes, this achieves integrated molding of complex microstructures, ensuring high precision and sealing.

Benefits of technology

It improves heat dissipation efficiency, enhances structural strength, ensures the sealing and stability of the heat sink, simplifies the processing flow, and improves production efficiency and product consistency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to a hollow thin-film metal heat sink and its processing method, comprising a heat sink body, a heat dissipation cavity, and protrusions. The heat sink body is an elongated, hollow, thin-walled structure. The heat dissipation cavity is disposed within the heat sink body to allow the cooling fluid to flow from one side to the other. Multiple protrusions are arranged in an array or staggered distribution within the heat dissipation cavity, forming numerous interconnected microchannel structures that disperse or converge the cooling fluid. This microchannel structure increases the contact area between the cooling fluid and the heat sink body and breaks the laminar flow state, improving heat exchange efficiency. This invention processes the heat sink body by combining etching and laser welding sealing, which not only improves the processing efficiency and precision of the protrusion structure in the heat sink body but also ensures the sealing reliability and long-term stability of the heat sink body, facilitating efficient and stable heat dissipation for memory modules.
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Description

Technical Field

[0001] This invention relates to the technical field of liquid cooling heat dissipation, and in particular to a hollow thin-film metal heat sink and its processing method. Background Technology

[0002] Data centers utilize a large number of memory modules during operation. As memory power consumption and density increase, heat dissipation of data center memory modules is becoming a key factor affecting server stability and energy efficiency.

[0003] Currently, when cooling memory modules, a simple finned heatsink is typically used. The coolant flows along the cooling channels formed by multiple fins, and the coolant exchanges heat with the fin surface to achieve the cooling effect.

[0004] However, when the heat dissipation fluid flows in the fin channels, it is easy to form a laminar flow state, resulting in a limited contact area between the fluid and the inner wall of the heat sink and low heat exchange efficiency. Moreover, during the processing, the fins are mainly milled one by one using machining equipment, and then brazed and sealed after the channels are milled. This processing method is not only cumbersome and time-consuming, but also has low processing accuracy, making it difficult to achieve integrated molding of complex microstructures. As a result, the processed heat sinks cannot meet the high-efficiency heat dissipation requirements of memory modules. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide a hollow thin-film metal heat sink and its processing method.

[0006] The primary objective of this application is to provide a hollow, thin-film metal heat sink, employing the following technical solution: A hollow thin-film metal heat sink, comprising: The heat sink body is a long, hollow, thin-walled structure. A heat dissipation cavity is disposed within the heat sink body to allow heat dissipation liquid to flow from one side to the other. The protruding pillars are numerous and are arranged in an array or staggered in the heat dissipation cavity, forming numerous interconnected microchannel structures within the heat dissipation cavity to disperse or converge the heat dissipation fluid.

[0007] By adopting the above technical solution, the microchannel structure formed by the protruding pillars not only increases the contact area between the heat dissipation liquid and the heat sink body, but also breaks the laminar flow state, allowing the heat dissipation liquid to be fully dispersed or mixed inside the heat dissipation cavity, thereby improving heat exchange efficiency. At the same time, the protruding pillars can enhance the structural strength of the heat sink body and prevent deformation of the thin-walled structure.

[0008] The present invention is further configured such that: one end of the heat sink body is provided with an inlet for the heat dissipation liquid to flow into the heat dissipation cavity, and the other end of the heat sink body is provided with an outlet for the heat dissipation liquid to flow out of the heat dissipation cavity.

[0009] By adopting the above technical solution, the inlet and outlet work together to form a directional flow channel in the heat dissipation cavity, ensuring smooth circulation of the heat dissipation liquid, avoiding backflow or stagnation, and ensuring the continuity and stability of heat dissipation.

[0010] The present invention is further configured such that: a strip-shaped ridge is provided on the heat sink body and on the inner side of the water inlet and the water outlet.

[0011] By adopting the above technical solution, the strip-shaped ridges can improve the local stiffness of the heat sink body in the inlet and outlet areas, suppress thin-wall vibration and fatigue deformation caused by fluid impact, and guide the heat dissipation liquid to enter or disperse out of the heat dissipation cavity evenly along a predetermined path.

[0012] The present invention is further configured such that: a steering block is provided on the water inlet side of the heat sink body and near the heat dissipation cavity, and the steering block is integrally formed with the heat sink body.

[0013] By adopting the above technical solution, the steering block can initially guide the heat dissipation liquid flowing into the heat dissipation cavity, so that the heat dissipation liquid changes from flowing horizontally along the length of the heat dissipation fin body to spreading vertically along the width of the heat dissipation fin body, so as to guide the heat dissipation liquid flowing in from the inlet to spread rapidly throughout the heat dissipation cavity and improve the heat dissipation effect.

[0014] The present invention is further configured such that: a plurality of continuously distributed flow guiding blocks are provided along the edge of the heat dissipation cavity in the heat sink body, and the flow guiding blocks are integrally formed with the heat sink body.

[0015] By adopting the above technical solution, the guide block is set along the edge of the heat dissipation cavity, which can guide the heat dissipation fluid to flow from the edge of the heat dissipation cavity to the central area, avoid the heat dissipation fluid from forming stagnant eddies at the edge of the cavity, and further optimize the uniformity of the flow field distribution.

[0016] The second objective of this application is to provide a method for processing a hollow thin-film metal heat sink, which includes the following steps: S1. Based on the length and width of the metal heat sink, cut out the base plate and cover plate with a pre-processing allowance, and then flatten the base plate and cover plate. S2. Select one side surface of the base plate for etching treatment, and process the flow channel groove and the integrally etched protrusion structure on the base plate. S3. Install the base plate and cover plate into the welding mold and fix them so that the base plate and cover plate are laser welded into an integral sealing structure to obtain a sealing plate with a sealing cavity. S4. Shape and grind the sealing plate to make its flatness tolerance less than 0.1mm.

[0017] S5. Based on the design dimensions of the metal heat sink, the sealing plate is machined to remove excess material and obtain the heat sink body.

[0018] By adopting the above technical solution, which combines etching with laser welding sealing, we can not only improve the processing efficiency and precision of the protruding column structure in the heat sink body and effectively improve the surface quality and structural consistency of the inner wall of the heat dissipation cavity, but also ensure the sealing reliability and long-term stability of the heat sink body, so as to enable the heat sink body to dissipate heat from the memory module efficiently and stably.

[0019] The present invention is further configured such that: in S2, the base plate is etched using a photochemical etching process to form a flow channel with a depth of 0.5-3mm on the base plate, and a protruding post, and / or a deflector block, and / or a flow guide block are integrally etched with the flow channel.

[0020] By adopting the above technical solution, the flow channel groove and protrusion structure on the base plate are integrally etched and formed by photochemical etching process. This not only achieves high-precision, micro-sized processing, but also maintains the thin and light characteristics of the sheet structure, and improves the structural integrity and connection strength of the base plate.

[0021] The present invention is further configured such that, in S3, it also includes: S3-1. Based on the location of the protruding post on the base plate, use a quasi-continuous laser welding machine to perform laser through welding on one side of the cover plate, so that the cover plate and the protruding post on the base plate are welded and fixed. S3-2. The periphery of the cover plate and the base plate are welded together by a continuous laser welding machine to seal the cover plate and the base plate and obtain a sealing plate with a sealed cavity.

[0022] By adopting the above technical solution, the protrusion is first welded and fixed to the cover plate, which can enhance the structural stability inside the heat dissipation cavity and avoid the deformation of the protrusion caused by fluid impact; continuous welding around the perimeter can ensure the sealing of the cavity and prevent the leakage of heat dissipation liquid, thus taking into account both structural strength and sealing performance.

[0023] The present invention is further configured such that, in S5, the heat sink body is obtained through the following steps: S5-1. Fix the sealing plate that has passed the flatness test on the tooling fixture of the CNC machining center, and perform cutting processing on both ends of the sealing plate to form the water inlet and water outlet at both ends of the heat sink body. S5-2. Based on the design dimensions of the heat sink body, remove the machining allowance reserved in step S1 and machine the outline of the heat sink body. S5-3. Machining the groove structure on the surface of the heat sink body to obtain the heat sink body.

[0024] By adopting the above technical solutions, the high-precision cutting of the CNC machining center ensures the dimensional and positional accuracy of the inlet and outlet, guarantees compatibility with external pipelines, and the step-by-step machining of the outer contour and surface groove structure can reduce machining stress and improve product dimensional stability.

[0025] The present invention is further configured such that, after obtaining the heat sink body, it also includes the following steps: S6. Block the outlet of the heat sink body and continuously introduce air into the inlet of the heat sink body to test the air tightness of the heat sink body. S7: After the airtightness test is passed, the heat sink body is ultrasonically cleaned to remove impurities.

[0026] By adopting the above technical solutions, airtightness testing is used to screen out unqualified products with poor welding seals to avoid leakage during use. Ultrasonic cleaning is used to effectively remove residual oil, metal shavings and other impurities from the processing process, prevent blockage of microchannels, and ensure heat dissipation and service life.

[0027] In summary, the beneficial technical effects of the present invention are as follows: 1. This solution sets up multiple arrayed or staggered protrusions inside the heat dissipation cavity. Each protrusion works together to form a complex microchannel structure inside the heat sink body. The microchannel structure formed by the protrusions increases the contact area between the heat dissipation liquid and the heat sink body, and breaks the laminar flow state, so that the heat dissipation liquid is fully dispersed or mixed inside the heat dissipation cavity, thereby improving the heat exchange efficiency. At the same time, the protrusions can enhance the structural strength of the heat sink body and prevent the deformation of the thin-walled structure. 2. In processing the heat sink body, this solution first uses an etching process to integrally etch the flow channel grooves and protrusions on the base plate to achieve integrated molding of complex microstructures with high precision and no mechanical stress. Then, a laser welding process is used to weld the cover plate to the base plate to ensure that the heat sink has extremely high sealing performance, structural strength and flatness after welding. This solution uses a combination of photochemical etching and laser welding to not only achieve integrated molding of the microstructure inside the heat sink body, but also to mass-produce complex thin-walled hollow heat sinks with high yield and high efficiency. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the heat sink body in this application.

[0029] Figure 2 This is a schematic diagram of the internal structure of the heat sink body in Embodiment 1 of this application.

[0030] Figure 3 This is a schematic diagram of the internal structure of the heat sink body in Embodiment 2 of this application.

[0031] Figure 4 This is a diagram illustrating the processing of the heat sink body in Embodiment 3 of this application.

[0032] Figure 5 This is a schematic diagram of the structure of the base plate in Embodiment 3 of this application.

[0033] In the diagram, 100 is the heat sink body; 101 is the heat dissipation cavity; 102 is the protruding post; 103 is the water inlet; 104 is the water outlet; 105 is the strip ridge; 106 is the deflector block; 107 is the flow guide block; 200 is the base plate; 201 is the flow channel; 300 is the cover plate; and 400 is the sealing plate. Detailed Implementation

[0034] The present invention will be further described in detail below with reference to the accompanying drawings. Example 1

[0035] Reference Figure 1 and Figure 2 The present invention discloses a hollow thin-film metal heat sink, comprising: The heat sink body 100 is a long, hollow, thin-walled structure with a thickness of 4-6 mm. One side surface of the heat sink body 100 is attached to the memory module with thermally conductive adhesive or thermally conductive pad to dissipate heat from the memory module. Heat dissipation cavity 101 is disposed in the heat sink body 100 so that heat dissipation liquid can flow from one side to the other side, so that heat dissipation liquid and heat sink body 100 can continuously exchange heat, thereby making heat sink body 100; The protruding pillars 102 are multiple and are arranged in an array or staggered in the heat dissipation cavity 101, forming numerous microchannel structures that disperse or converge the heat dissipation fluid and are interconnected within the heat dissipation cavity 101.

[0036] In the specific implementation process, the heat sink body 100 is made of metal materials, preferably stainless steel or copper alloy materials. These two materials have high thermal conductivity and good processing performance, so that the heat sink body 100 can be heated and conduct heat.

[0037] In this design, multiple arrayed or staggered protrusions 102 are arranged inside the heat dissipation cavity 101. Each protrusion 102 cooperates with the others to create a complex microchannel structure within the heat sink body 100. Compared to traditional finned flow channels, this microchannel structure design maximizes the use of the narrow and limited space within the heat sink body 100, enhances the turbulence effect of the heat dissipation fluid within the heat dissipation cavity 101, expands the effective heat exchange area during the heat dissipation process, and improves heat dissipation efficiency.

[0038] One end of the heat sink body 100 is provided with an inlet 103 for the heat dissipation liquid to flow into the heat dissipation cavity 101, and the other end of the heat sink body 100 is provided with an outlet 104 for the heat dissipation liquid to flow out of the heat dissipation cavity 101.

[0039] During the heat dissipation process, deionized water is used as the heat dissipation liquid. The heat dissipation liquid flows into the heat dissipation cavity 101 through the inlet 103. The heat dissipation liquid is continuously dispersed or converged by the protrusions 102, and the surface of the protrusions 102 is in large-area contact with the heat dissipation fluid to exchange heat. The heat sink body 100 dissipates heat from the memory module. Afterward, the heat dissipation liquid gradually converges on the outlet side of the heat dissipation cavity 101 and is discharged outward through the outlet 104.

[0040] In further implementation, to increase the maximum flow rate of the heat dissipation cavity 101 within a certain time, it is necessary to ensure that the hollow thin-plate heat dissipation fin body 100 has sufficient inlet and outlet water area. The inlet 103 and outlet 104 have a narrow rectangular cross-section. Strip-shaped ridges 105 are provided on the heat dissipation fin body 100 and on the inner side of the inlet 103 and outlet 104, and these ridges are distributed along the center line of the inlet 103 or outlet 104. The strip-shaped ridges 105 structurally reinforce the heat dissipation fin body 100 at the inlet 103 or outlet 104, preventing bulging due to fluid impact. Simultaneously, the strip-shaped ridges 105 at the inlet 103 also divert the heat dissipation fluid flowing into the heat dissipation cavity 101, improving the dispersion effect of the heat dissipation fluid after entering the heat dissipation cavity 101. Example 2

[0041] Reference Figure 1 and Figure 3 The present invention discloses a hollow thin-film metal heat sink, comprising: The heat sink body 100 is a long, hollow, thin-walled structure. A heat dissipation cavity 101 is disposed within the heat sink body 100 to allow heat dissipation liquid to flow from one side to the other. The protruding pillars 102 are multiple and are arranged in an array or staggered in the heat dissipation cavity 101, forming numerous microchannel structures that disperse or converge the heat dissipation fluid and are interconnected within the heat dissipation cavity 101.

[0042] One end of the heat sink body 100 is provided with an inlet 103 for the heat dissipation liquid to flow into the heat dissipation cavity 101, and the other end of the heat sink body 100 is provided with an outlet 104 for the heat dissipation liquid to flow out of the heat dissipation cavity 101.

[0043] A strip ridge 105 is provided on the heat sink body 100 and on the inner side of the water inlet 103 and / or the water outlet 104. The strip ridge 105 is elongated, rhomboid or elliptical, which can enhance the structural rigidity of the heat sink body 100 and guide the heat dissipation fluid to diffuse evenly along a preset path.

[0044] Based on the above, a deflector block 106 is provided on the water inlet side of the heat sink body 100 near the heat dissipation cavity 101. The deflector block 106 is integrally formed with the heat sink body 100. The deflector block 106 has a rectangular or semi-circular structure and is located on the side near the water inlet. It can deflect and guide the heat dissipation fluid flowing into the heat dissipation cavity 101, and cooperate with the protrusion 102 to improve the disturbance and dispersion effect on the heat dissipation fluid, so that the fluid covers the surface of the protrusion 102 more evenly, thereby significantly enhancing the heat exchange efficiency.

[0045] In a further implementation, a plurality of continuously distributed flow guide blocks 107 are provided along the edge of the heat dissipation cavity 101 in the heat sink body 100, and the flow guide blocks 107 are integrally formed with the heat sink body 100. The flow guide blocks 107 have a trapezoidal or semi-circular structure and are evenly distributed at the edge of the heat dissipation cavity 101. Their function is to guide the heat dissipation fluid from the edge of the heat dissipation cavity 101 to the central area, avoid the formation of stagnant eddies in the heat dissipation fluid at the edge of the cavity, and further optimize the uniformity of the flow field distribution. Example 3

[0046] Reference Figure 4 and Figure 5 A method for processing a hollow thin-film metal heat sink, used to process the hollow thin-film metal heat sink of Example 1 or Example 2, includes the following steps: S1. Based on the length and width of the metal heat sink, cut out the base plate 200 and cover plate 300 with a pre-processing allowance, and then flatten the base plate 200 and cover plate 300. S2. Select one side surface of the base plate 200 for etching treatment, and process the flow channel 201 and the integrally etched protrusion structure on the base plate 200. S3. The base plate 200 and the cover plate 300 are installed in the welding mold and fixed, so that the base plate 200 and the cover plate 300 are laser welded into an integral sealing structure to obtain a sealing plate 400 with a sealing cavity. S4. The sealing plate 400 is shaped and ground to make the flatness tolerance of the sealing plate 400 less than 0.1mm.

[0047] S5. Based on the design dimensions of the metal heat sink, the sealing plate 400 is machined to remove excess material, thereby obtaining the heat sink body 100.

[0048] In this solution, the flow channel groove and the raised structure are integrally etched on the base plate 200 through an etching process. Compared with traditional machining, this method not only has higher processing efficiency, but also ensures that the geometric accuracy and positional relationship of structures such as the heat dissipation cavity 101, the protrusion 102, the turning block 106, and the flow guide block 107 in the final heat sink body 100 are highly consistent. This achieves the integrated molding of micron-level linewidth and complex curved surface structure, and avoids warping deformation of the base plate 200 during large-area machining, greatly improving the consistency and reliability of heat dissipation performance.

[0049] The contact surfaces of the base plate 200 and the cover plate 300 are welded and sealed by laser welding process to produce a sealing plate 400 with a sealing cavity. The sealing plate 400 is then machined to obtain the heat sink body 100. The entire manufacturing process avoids the cumulative error and interface thermal resistance caused by traditional multi-process splicing, and significantly improves the structural integrity, heat conduction path continuity and overall rigidity of the heat sink body 100.

[0050] After obtaining the heat sink body 100, the following steps are also included: S6. Block the outlet 104 of the heat sink body 100 and continuously introduce air into the inlet 103 of the heat sink body 100 to perform an airtightness test on the heat sink body 100.

[0051] S7: After the airtightness test is passed, the heat sink body 100 is ultrasonically cleaned to remove impurities and obtain a clean heat sink body 100.

[0052] In S2, the base plate 200 is etched using a photochemical etching process to form a flow channel 201 with a depth of 0.5-3mm on the base plate 200, and to obtain protrusions 102, and / or turning blocks 106, and / or flow guide blocks 107 integrally etched with the flow channel 201.

[0053] Specifically, photoresist is first applied to one side of the substrate 200. After exposure and development, an etching pattern is formed. Then, FeCl3 etching solution is used to etch the substrate 200 to form a channel 201 with a depth of 2mm. The protrusion 102, the turning block 106 or the guide block 107 are integrally etched with the channel 201. After etching, the photoresist is removed and the substrate is cleaned and dried.

[0054] S3 also includes: S3-1. Based on the location of the protruding post 102 on the base plate 200, laser welding is performed on one side of the cover plate 300 using a quasi-continuous laser welding machine to weld and fix the cover plate 300 to the protruding post 102 on the base plate 200.

[0055] In the specific welding process, single-point laser welding is performed between the protrusion 102 and the cover plate 300. It is possible to select all protrusions 102 to be laser welded to the cover plate 300, or selective welding can be performed on protrusions 102 in different areas according to the difference in heat flux density distribution.

[0056] S3-2. The periphery of the cover plate 300 and the base plate 200 are welded together by a continuous laser welding machine to seal the cover plate 300 and the base plate 200, and to obtain a sealing plate 400 with a sealing cavity.

[0057] In S3-2, by performing full-circumference laser welding sealing on the cover plate 300 and the base plate 200, it can be ensured that the flow channel 201 is completely sealed by the cover plate 300, and a sealing plate 400 with a sealing cavity is obtained, thereby ensuring that the final heat sink body 100 has excellent flow channel sealing and structural stability.

[0058] In S5, the heat sink body 100 is obtained through the following steps: S5-1. Fix the sealing plate 400, which has passed the flatness test, on the tooling fixture of the CNC machining center, and perform cutting processing on both ends of the sealing plate 400 to process the water inlet 103 and water outlet 104 at both ends of the heat sink body 100.

[0059] S5-2. Based on the design dimensions of the heat sink body 100, remove the machining allowance reserved in step S1 and machine the outline of the heat sink body 100.

[0060] S5-3. Machining the groove structure on the surface of the heat sink body 100 to obtain the heat sink body 100.

[0061] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A hollow thin-film metal heat sink, characterized in that, include: The heat sink body (100) is a long, hollow, thin-walled structure. A heat dissipation cavity (101) is provided inside the heat sink body (100) to allow the heat dissipation liquid to flow from one side to the other. The protruding pillars (102) are multiple and are arranged in an array or staggered in the heat dissipation cavity (101), forming numerous microchannel structures that disperse or converge the heat dissipation fluid and are interconnected within the heat dissipation cavity (101).

2. The hollow thin-film metal heat sink according to claim 1, characterized in that: One end of the heat sink body (100) is provided with an inlet (103) for the heat dissipation liquid to flow into the heat dissipation cavity (101), and the other end of the heat sink body (100) is provided with an outlet (104) for the heat dissipation liquid to flow out of the heat dissipation cavity (101).

3. The hollow thin-film metal heat sink according to claim 2, characterized in that: A strip-shaped rib (105) is provided on the heat sink body (100) and on the inner side of the water inlet (103) and the water outlet (104).

4. The hollow thin-film metal heat sink according to claim 1, characterized in that: A steering block (106) is provided on the water inlet side of the heat sink body (100) near the heat dissipation cavity (101), and the steering block (106) is integrally formed with the heat sink body (100).

5. The hollow thin-film metal heat sink according to claim 1, characterized in that: The heat sink body (100) has a plurality of continuously distributed flow guide blocks (107) arranged along the edge of the heat dissipation cavity (101), and the flow guide blocks (107) are integrally formed with the heat sink body (100).

6. A method for processing a hollow thin-film metal heat sink, characterized in that, The method for processing the hollow thin-film metal heat sink according to any one of claims 1 to 5 includes the following steps: S1. Based on the length and width of the metal heat sink, cut out the base plate (200) and cover plate (300) with a pre-reserved processing allowance, and then flatten the base plate (200) and cover plate (300); S2. Select one side surface of the base plate (200) for etching treatment, and process the flow channel groove (201) and the integrally etched protrusion structure on the base plate (200); S3. The base plate (200) and the cover plate (300) are installed in the welding mold and fixed so that the base plate (200) and the cover plate (300) are laser welded into an integral sealing structure to obtain a sealing plate (400) with a sealing cavity. S4. The sealing plate (400) is shaped and ground to make the flatness tolerance of the sealing plate (400) less than 0.1mm; S5. According to the design dimensions of the metal heat sink, the sealing plate (400) is machined to remove excess material and obtain the heat sink body (100).

7. The processing method of the hollow thin-film metal heat sink according to claim 6, characterized in that: In S2, the base plate (200) is etched using a photochemical etching process to form a flow channel (201) with a depth of 0.5-3mm on the base plate (200), and to obtain a protrusion (102) integrally etched with the flow channel (201), and / or a turning block (106), and / or a flow guide block (107).

8. The processing method of the hollow thin-film metal heat sink according to claim 6, characterized in that: S3 also includes: S3-1. Based on the location of the protruding post (102) on the base plate (200), laser welding is performed on one side of the cover plate (300) using a quasi-continuous laser welding machine to weld and fix the cover plate (300) to the protruding post (102) on the base plate (200). S3-2. The periphery of the cover plate (300) and the base plate (200) are welded together by a continuous laser welding machine to seal the cover plate (300) and the base plate (200) and obtain a sealing plate (400) with a sealing cavity.

9. The processing method of the hollow thin-film metal heat sink according to claim 6, characterized in that: In S5, the heat sink body (100) is obtained through the following steps: S5-1. Fix the sealing plate (400) that has passed the flatness test on the tooling fixture of the CNC machining center, and cut the two ends of the sealing plate (400) to form the water inlet (103) and water outlet (104) at both ends of the heat sink body (100). S5-2. Based on the design dimensions of the heat sink body (100), remove the machining allowance reserved in step S1 and machine the outline of the heat sink body (100). S5-3. Machining the groove structure on the surface of the heat sink body (100) to obtain the heat sink body (100).

10. The processing method of the hollow thin-film metal heat sink according to claim 6, characterized in that: After obtaining the heat sink body (100), the following steps are also included: S6. Block the outlet (104) of the heat sink body (100) and continuously introduce air into the inlet (103) of the heat sink body (100) to perform an airtightness test on the heat sink body (100). S7: After the airtightness test is passed, the heat sink body (100) is ultrasonically cleaned to remove impurities.