Active cooling thermally actuated memory alloy controller and vehicle seat pneumatic system
By introducing an airflow source into the pneumatic system to actively dissipate heat from the thermally actuated shape memory alloy wire and circuit board, the problems of functional failure and shortened lifespan caused by low heat dissipation efficiency are solved, achieving effective temperature control and lifespan extension.
CN122373323APending Publication Date: 2026-07-10AEW TECHNOLOGY GROUP CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- AEW TECHNOLOGY GROUP CO LTD
- Filing Date
- 2026-06-01
- Publication Date
- 2026-07-10
AI Technical Summary
Technical Problem
In existing technologies, shape memory alloy wires and related components suffer from low heat dissipation efficiency in pneumatic systems, leading to continuous temperature increases, functional failures, and shortened lifespans.
Method used
By placing an airflow source, such as a fan, inside the controller housing, airflow is guided through the thermally actuated shape memory alloy wire and circuit board to achieve active heat dissipation and reduce temperature.
Benefits of technology
It effectively improves the heat dissipation efficiency of thermally actuated memory alloy wire and circuit board, avoids functional failure caused by high temperature, and extends service life.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122373323A_ABST
Abstract
This application discloses an active cooling thermo-mechanical memory alloy controller and a vehicle seat pneumatic system, including a controller housing with at least one first port and at least one second port; a valve body structure disposed inside the controller housing for charging and decharging pneumatic components, the valve body structure having a valve core and a thermo-mechanical memory alloy wire that drives the valve core to move; an airflow source disposed inside the controller housing, which guides airflow from the first port into the controller housing during operation, and flows through the thermo-mechanical memory alloy wire to dissipate heat from the thermo-mechanical memory alloy wire; by activating the airflow source, airflow is guided to circulate between the first and second ports to dissipate heat from the thermo-mechanical memory alloy wire, effectively improving the heat dissipation efficiency of the thermo-mechanical memory alloy wire, preventing the thermo-mechanical memory alloy wire from failing or being damaged due to excessive temperature, expanding its application scenarios, and extending its service life.
Need to check novelty before this filing date? Find Prior Art