A modular vertical liquid cooling device suitable for multi-IGBT parallel power module

Abstract

This invention discloses a modular vertical liquid cooling device suitable for multi-IGBT parallel power modules, comprising multiple liquid cooling plate units, an integrated flow equalization and manifold, piping connection components, and a frame assembly. The multiple liquid cooling plate units are arranged side-by-side, each unit housing a corresponding IGBT module. The integrated flow equalization and manifold internally has a main supply flow channel and a main return flow channel, connected to each liquid cooling plate unit via multiple branch interfaces. The flow cross-sectional area of ​​the main supply flow channel gradually decreases along the coolant flow direction, while the flow cross-sectional area of ​​the main return flow channel gradually increases along the return flow convergence direction. This adjusts the local pressure distribution and flow rate allocation at different branch interfaces, making the inlet and outlet pressure differences between the multiple liquid cooling plate units more consistent, thereby improving uneven flow distribution across multiple branches. Within the internal flow channels of the liquid cooling plate units, in the middle flow channel section corresponding to the power chip arrangement area inside the IGBT module, turbulence-inducing columns are provided to enhance local heat transfer in the concentrated heat-generating areas of the chips. The device also improves the ease of assembly, maintenance, and expansion of the liquid cooling system for multi-IGBT parallel power modules through modular liquid cooling plate units, detachable piping connection components, and frame clamping structures.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology for power electronic equipment, specifically relating to a modular vertical liquid cooling device suitable for multi-IGBT parallel power modules such as wind power converters. Background Technology

[0002] In wind power converters, single-phase power branches typically need to withstand large operating currents. In engineering applications, multiple IGBT modules are often connected in parallel to increase power capacity. When multiple IGBT modules are running in parallel, the consistency of heat dissipation conditions among the modules directly affects the module temperature distribution and the reliability of parallel operation.

[0003] In existing liquid cooling structures, multiple parallel liquid cooling plates typically use a main pipe for liquid distribution or a common liquid supply structure for coolant distribution. When the coolant flows in the main flow channel, uneven flow distribution can easily occur between branches at different locations due to pressure drop along the flow path, local resistance, and differences in branch positions. This can lead to temperature differences between different IGBT modules, affecting the stability of parallel operation.

[0004] Furthermore, existing liquid cooling structures typically require the removal of the entire cooling assembly during maintenance, which is detrimental to the rapid maintenance, expansion, and partial replacement of multi-power module systems. Therefore, there is a need for a modular vertical liquid cooling device suitable for multiple IGBT parallel power modules to improve the consistency of coolant distribution among parallel IGBT modules and enhance assembly and maintenance convenience. Summary of the Invention

[0005] This invention aims to overcome the shortcomings of existing technologies and provide a modular vertical liquid cooling device suitable for multiple IGBT parallel power modules. The device uses multiple relatively independent liquid cooling plate units to install multiple IGBT modules respectively, and uses a single integrated flow sharing and manifold for centralized liquid supply and return, thus forming a modular liquid cooling structure that is easy to add, remove, replace, and maintain. Simultaneously, the opposite variable cross-sections of the main supply and return flow channels within the integrated flow sharing and manifold improve the consistency of flow distribution among the multiple liquid cooling plate units. Furthermore, a flow-deflecting column can be installed in the central flow channel section within the liquid cooling plate unit, corresponding to the power chip arrangement area inside the IGBT module, to locally enhance heat transfer in the concentrated heat-generating areas of the chips.

[0006] To achieve the above objectives, the present invention provides the following technical solution.

[0007] A modular vertical liquid cooling device suitable for multi-IGBT parallel power modules includes a liquid cooling plate assembly, an integrated current sharing and current collection plate, a pipeline connection assembly, and a frame assembly.

[0008] The liquid-cooled plate assembly includes multiple liquid-cooled plate units arranged side by side, each of which is used to install a corresponding IGBT module. Each liquid-cooled plate unit adopts a relatively independent structural configuration and is connected to the integrated current sharing and current collection plate through a pipeline connection assembly, so that each IGBT module has a relatively independent cooling branch, which facilitates addition, removal, replacement and maintenance according to different power requirements.

[0009] The integrated flow equalization and manifold is disposed on one side of the liquid-cooled plate assembly. The integrated flow equalization and manifold internally comprises a main supply flow channel and a main return flow channel. The main supply flow channel is connected to the inlet ports of multiple liquid-cooled plate units via multiple supply branch interfaces, and the main return flow channel is connected to the return ports of multiple liquid-cooled plate units via multiple return branch interfaces. The flow cross-sectional area of ​​the main supply flow channel gradually decreases along the coolant flow direction, while the flow cross-sectional area of ​​the main return flow channel gradually increases along the return flow convergence direction to compensate for pressure changes along the flow path and to regulate the local pressure distribution and flow distribution among the multiple liquid-cooled plate units.

[0010] In one embodiment, the main supply flow channel and the main return flow channel can be configured as a stepped variable cross-section flow channel, a conical variable cross-section flow channel, or a partially variable cross-section flow channel, depending on the number of branches, coolant flow rate, allowable pressure drop, and target flow distribution requirements. Multiple supply branch interfaces and multiple return branch interfaces are grouped together, with each group of supply and return branch interfaces corresponding to the inlet and return interfaces of a liquid-cooled plate unit.

[0011] The liquid-cooled plate unit includes a flow channel substrate and a sealing cover. An internal cooling flow channel is disposed within the flow channel substrate, and the sealing cover covers the flow channel substrate, forming a sealed cooling cavity with it. A liquid inlet and a liquid return interface are disposed at the lower part of the flow channel substrate. The liquid inlet is connected to a liquid supply branch interface via a pipe connection assembly, and the liquid return interface is connected to a liquid return branch interface via a pipe connection assembly. Further, the internal cooling flow channel includes a central flow channel section corresponding to the power chip arrangement area inside the IGBT module, and multiple flow-disrupting pillars are disposed within the central flow channel section.

[0012] The integrated flow equalization manifold has a boss-type external pipeline interface at its end, which is used to connect to external liquid supply pipelines and external liquid return pipelines. The boss-type external pipeline interface can be integrally formed with the integrated flow equalization manifold, or it can be fixed to the end of the integrated flow equalization manifold using a welded pipeline connector.

[0013] The piping connection assembly includes pipe fittings, connecting hoses, and clamps. The pipe fittings can be elbows, straight-through fittings, pagoda fittings, quick-connect fittings, or other detachable connection structures, depending on the installation space. The connecting hose connects the liquid-cooled plate unit to the integrated flow equalization manifold, and the clamps are fitted onto the outside of the connecting hose and tighten it.

[0014] The frame assembly includes a support frame and a clamping plate. The liquid-cooled plate unit is installed within the support frame, and the clamping plate is connected to the support frame and clamps the liquid-cooled plate unit. An auxiliary clamping component may also be provided at the lower part of the liquid-cooled plate unit or near the integrated flow equalization and distribution plate to compensate for assembly errors and improve the installation stability of the liquid-cooled plate unit.

[0015] The beneficial effects of this invention are as follows: By installing multiple IGBT modules on multiple independent liquid-cooled plate units respectively, and having the same integrated flow equalization and return plate for centralized liquid supply and return, the centralized liquid supply requirements of multiple IGBT parallel power modules and the independent maintenance requirements of a single liquid-cooled plate unit can be met; by using the opposite variable cross-section design of the main liquid supply channel and the main liquid return channel, the local pressure distribution at different branch interfaces can be adjusted, making the inlet and outlet pressure difference between multiple liquid-cooled plate units more consistent, thereby helping to reduce the flow deviation between different branches; by setting turbulence columns in the middle flow channel section corresponding to the power chip arrangement area inside the IGBT module, the local fluid disturbance and heat exchange effect at the corresponding position of the concentrated heat generation area of ​​the chip can be enhanced, thereby helping to reduce the local temperature peak; at the same time, the modular liquid-cooled plate unit structure, detachable pipeline connection components, and frame clamping structure help to improve the convenience of system assembly, maintenance, and expansion. Attached Figure Description

[0016] Figure 1 This is a front view of the modular vertical liquid cooling device of the present invention.

[0017] Figure 2 This is a rear view of the modular vertical liquid cooling device of the present invention.

[0018] Figure 3 This is a partially exploded view of the modular vertical liquid cooling device of the present invention;

[0019] Figure 4 This is a structural diagram of the internal flow equalization channel of the integrated flow equalization collector plate of the present invention.

[0020] Figure 5 This is a partial view of the installation of the frame assembly and liquid cooling plate unit of the present invention.

[0021] Figure 6 This is a partial enlarged view of the L-shaped adjusting pressure block of the present invention.

[0022] Figure 7 This is a schematic diagram of the liquid cooling plate unit structure of the present invention.

[0023] In the diagram: 100-Liquid cooling plate unit, 110-Sealing cover plate, 120-Flow channel base plate, 121-Liquid inlet port, 123-Breakthrough column, 124-Internal flow channel, 125-Liquid return port, 200-Integrated flow equalization manifold, 210-Main liquid supply channel, 211-Liquid supply branch port, 220-Main liquid return channel, 221-Liquid return branch port, 230-Boss-type external pipeline port, 231-External liquid inlet boss, 232-External liquid return boss, 300- Frame assembly, 310-Bearing frame, 311-Limiting step, 312-Bottom support, 320-Pressure plate, 330-Connecting bolt, 400-Pipe connection assembly, 410-Pipe fitting, 411-First pipe fitting, 412-Second pipe fitting, 420-Connecting hose, 440-Clamp, 510-L-shaped adjusting block, 511-Oblong adjusting hole, 520-Fasting screw, 600-IGBT module substrate. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the following embodiments are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0025] Reference Figure 1 and Figure 2 As shown, this embodiment provides a modular vertical liquid cooling device 10 suitable for multi-IGBT parallel power modules, including multiple liquid cooling plate units 100, an integrated flow equalization and manifold 200, a frame assembly 300, and a pipe connection assembly 400. The multiple liquid cooling plate units 100 are installed within the frame assembly 300, the integrated flow equalization and manifold 200 is disposed on one side of the multiple liquid cooling plate units 100, and the pipe connection assembly 400 connects the integrated flow equalization and manifold 200 and the multiple liquid cooling plate units 100 to realize the distribution and return of coolant among the liquid cooling plate units 100.

[0026] Reference Figures 1 to 3 As shown, multiple liquid-cooled plate units 100 are arranged side by side, and each liquid-cooled plate unit 100 corresponds to an IGBT module substrate 600. Each liquid-cooled plate unit 110 adopts a relatively independent structure and is connected to an integrated current sharing and current collector plate 200 through a pipeline connection assembly 400, thereby enabling rapid addition, removal, replacement, and maintenance according to different power levels and heat dissipation requirements. In this embodiment, three liquid-cooled plate units 110 are arranged side by side; in other embodiments, the number of liquid-cooled plate units 110 can also be set to two, four, or more according to actual needs.

[0027] Reference Figure 3 and Figure 7As shown, the liquid cooling plate unit 100 includes a flow channel substrate 120 and a sealing cover plate 110. An internal flow channel 124 is provided within the flow channel substrate 120, and the sealing cover plate 110 covers the surface of the flow channel substrate 120, forming a sealed cooling cavity with the flow channel substrate 120. The flow channel substrate 120 can be made of aluminum alloy material and the internal flow channel 124 can be formed by CNC machining. The sealing cover plate 110 can be fixedly connected to the flow channel substrate 120 by welding, brazing, or sealing connection.

[0028] The lower part of the flow channel substrate 120 is provided with a liquid inlet 121 and a liquid return 125. The coolant enters the internal flow channel 124 through the liquid inlet 121, absorbs the heat transferred from the IGBT module substrate 600 to the liquid cooling plate unit 100 during the flow process, and is then discharged through the liquid return 125. The specific shape, width, depth, and number of the internal flow channels 124 can be set according to the heat source power, installation size, allowable pressure drop, and coolant flow rate of the IGBT module.

[0029] Furthermore, multiple flow-disrupting pillars 123 are provided in the internal flow channel 124. These pillars are preferably arranged in the middle flow channel section corresponding to the power chip arrangement area inside the IGBT module; that is, the multiple flow-disrupting pillars 123 are located within the projection area of ​​the power chip arrangement area on the flow channel substrate 120. Since the IGBT chips and freewheeling diode chips inside the IGBT module are typically arranged in an array, their corresponding area is the main heat-receiving area of ​​the liquid cooling plate unit 100. By providing flow-disrupting pillars 123 in the flow channel section corresponding to this area, the disturbance and heat transfer effect of the coolant in the local high heat flux density area can be enhanced, thereby helping to reduce the temperature peak at the corresponding location of the concentrated heat-generating area of ​​the chip.

[0030] In one embodiment, multiple baffle columns 123 are spaced apart within the central flow channel section along the coolant flow direction; in other embodiments, the baffle columns 123 may be arranged in a single row, multiple rows, or an array, depending on the position, number, and heat flux density distribution of the power chips inside the IGBT module. The baffle columns 123 may be cylindrical, elliptical, or other columnar structures, and their specific dimensions and spacing may be set according to the width, depth, coolant flow rate, and allowable pressure drop of the internal flow channel 124.

[0031] Reference Figures 2 to 4 As shown, the integrated flow equalization manifold 200 is an integral plate structure, with a main liquid supply channel 210 and a main liquid return channel 220 inside. The main liquid supply channel 210 is connected to the liquid inlet interface 121 of each liquid cooling plate unit 100 through multiple liquid supply branch interfaces 211; the main liquid return channel 220 is connected to the liquid return interface 125 of each liquid cooling plate unit 100 through multiple liquid return branch interfaces 221.

[0032] In this embodiment, the main supply flow channel 210 and the main return flow channel 220 adopt opposite variable cross-section flow equalization structures. Specifically, the flow cross-sectional area of ​​the main supply flow channel 210 gradually decreases along the coolant flow direction, while the flow cross-sectional area of ​​the main return flow channel 220 gradually increases along the return flow collection direction. This structure compensates for pressure variations along the flow path of the coolant, making the pressure difference between each supply branch interface 211 and the corresponding return branch interface 221 more consistent, thereby reducing flow deviations between different liquid cooling plate units 100.

[0033] In other embodiments, the main liquid supply channel 210 and the main liquid return channel 220 may also adopt a stepped variable cross-section, a tapered variable cross-section, or a locally variable cross-section structure; the opening size, spacing, and local resistance of each branch interface may also be adjusted according to the number of liquid cooling plate units 100, the coolant flow rate, the allowable pressure drop, and the heat dissipation power to achieve flow uniformity design under different operating conditions.

[0034] The end of the integrated flow equalization manifold 200 can be provided with a boss-type external pipeline interface 230. The boss-type external pipeline interface 230 includes an external liquid inlet boss 231 and an external liquid return boss 232, which are used to connect to external liquid supply pipelines and external liquid return pipelines, respectively. The boss-type external pipeline interface 230 can be integrally formed with the integrated flow equalization manifold 200, or it can be fixed to the end of the integrated flow equalization manifold 200 by means of a welded pipeline connector.

[0035] Reference Figure 2 and Figure 3 As shown, the pipeline connection assembly 400 includes a pipe connector 410, a connecting hose 420, and a clamp 440. The pipe connector 410 may include a first pipe connector 411 and a second pipe connector 412. The first pipe connector 411 and the second pipe connector 412 can be respectively disposed at the corresponding interfaces of the liquid-cooled plate unit 100 and the integrated flow equalization manifold 200, or can adopt an elbow structure, a straight-through structure, or other detachable connection structure depending on the installation space. The connecting hose 420 connects between the first pipe connector 411 and the second pipe connector 412. The clamp 440 is sleeved on the outside of the connecting hose 420 and presses the connecting hose 420 to improve the reliability of the hose connection.

[0036] Reference Figure 1 , Figure 3 and Figure 5As shown, the frame assembly 300 includes a support frame 310 and a clamping plate 320. The support frame 310 supports the liquid-cooled plate unit 100 and limits its installation. The support frame 310 is provided with a limiting step 311 and a bottom support portion 312. The limiting step 311 limits the displacement of the liquid-cooled plate unit 100 in the front-rear direction, and the bottom support portion 312 supports the liquid-cooled plate unit 100. The clamping plate 320 is connected to the support frame 310 by connecting bolts 330 and clamps the corresponding pressure-bearing parts of the liquid-cooled plate unit 100.

[0037] Reference Figure 2 , Figure 3 and Figure 6 As shown, this embodiment also includes an auxiliary clamping assembly. The auxiliary clamping assembly includes an L-shaped adjusting block 510 and a fastening screw 520. The L-shaped adjusting block 510 is located at the lower part of the liquid cooling plate unit 100 or near the integrated flow equalization and distribution plate 200, and has an elongated adjusting hole 511 on it. The fastening screw 520 passes through the elongated adjusting hole 511 and connects to the corresponding installation position to adjust the position of the L-shaped adjusting block 510, thereby further improving the clamping stability of the liquid cooling plate unit 100 and compensating for assembly errors.

[0038] In this embodiment, when the coolant is working, it enters the main supply channel 210 of the integrated flow equalization manifold 200 through an external supply pipeline, and then enters each liquid cooling plate unit 100 through multiple supply branch interfaces 211. After flowing in the internal flow channel 124 and absorbing the heat transferred from the IGBT module substrate 600 to the liquid cooling plate unit 100, the coolant enters the main return channel 220 through the return interface 125 and the return branch interface 221, and is finally discharged through the external return pipeline.

[0039] By using the opposite variable cross-section design of the main supply channel 210 and the main return channel 220, the local pressure distribution at different branch interfaces can be adjusted, making the inlet and outlet pressure difference between multiple liquid cooling plate units 100 more consistent, thereby reducing the flow deviation between different branches. The specific channel cross-sectional dimensions can be designed according to the number of liquid cooling plate units, coolant flow rate, allowable pressure drop, and heat dissipation power.

[0040] Finally, it should be noted that those skilled in the art can adjust or equivalently replace the number of liquid cooling plate units, the form of internal flow channels, the size of the integrated flow equalization and collection plate, the pipe connection method, the shape and arrangement of the turbulence columns, and the form of the mounting frame without departing from the concept of the present invention, and all such adjustments should fall within the protection scope of the present invention.

Claims

1. A modular vertical liquid cooling device suitable for multi-IGBT parallel power modules, comprising multiple side-by-side liquid cooling plate units (100), an integrated current sharing and current collection plate (200), a pipeline connection assembly (400), and a frame assembly (300); each of the liquid cooling plate units (100) is used to mount a corresponding IGBT module substrate (600); the integrated current sharing and current collection plate (200) is disposed on one side of the multiple liquid cooling plate units (100) and is connected to the multiple liquid cooling plate units (100) through the pipeline connection assembly (400); characterized in that: The integrated flow equalization and distribution plate (200) is internally provided with a main liquid supply channel (210) and a main liquid return channel (220). The main liquid supply channel (210) is connected to the liquid inlet ports (121) of multiple liquid cooling plate units (100) through multiple liquid supply branch interfaces (211), and the main liquid return channel (220) is connected to the liquid return ports (125) of multiple liquid cooling plate units (100) through multiple liquid return branch interfaces (221). The flow cross-sectional area of ​​the flow channel (210) decreases gradually along the coolant flow direction, while the flow cross-sectional area of ​​the return flow channel (220) increases gradually along the return flow collection direction to compensate for pressure changes along the flow channel and adjust the local pressure distribution and flow distribution between corresponding branches of different liquid cooling plate units (100). The liquid cooling plate unit (100) adopts an independent structure and is detachably connected to the integrated flow equalization and distribution plate (200) through the pipeline connection assembly (400).

2. The modular vertical liquid cooling device according to claim 1, characterized in that, The main liquid supply channel (210) and the main liquid return channel (220) are respectively one of a stepped variable cross-section channel, a conical variable cross-section channel, or a locally variable cross-section channel, or are formed by a combination of the above-mentioned variable cross-section structures.

3. The modular vertical liquid cooling device according to claim 1, characterized in that, The multiple liquid supply branch interfaces (211) and the multiple liquid return branch interfaces (221) are respectively grouped and corresponding. Each group of liquid supply branch interfaces (211) and liquid return branch interfaces (221) is connected to the liquid inlet interface (121) and liquid return interface (125) of a liquid cooling plate unit (100).

4. The modular vertical liquid cooling device according to claim 1, characterized in that, The liquid cooling plate unit (100) includes a flow channel substrate (120) and a sealing cover plate (110). An internal flow channel (124) is provided in the flow channel substrate (120). The sealing cover plate (110) covers the flow channel substrate (120) and forms a closed cooling cavity with the flow channel substrate (120).

5. The modular vertical liquid cooling device according to claim 4, characterized in that, The flow channel substrate (120) is provided with a liquid inlet (121) and a liquid return (125) at its lower part. The liquid inlet (121) is connected to the liquid supply branch interface (211) through the pipeline connection assembly (400), and the liquid return (125) is connected to the liquid return branch interface (221) through the pipeline connection assembly (400).

6. The modular vertical liquid cooling device according to claim 4, characterized in that, The internal flow channel (124) includes a central flow channel section corresponding to the power chip arrangement area inside the IGBT module, and multiple turbulence columns (123) are provided in the central flow channel section.

7. The modular vertical liquid cooling device according to claim 6, characterized in that, Multiple flow-dissipating columns (123) are located within the projection area of ​​the power chip arrangement area inside the IGBT module on the flow channel substrate (120) and are arranged at intervals along the coolant flow direction of the middle flow channel section.

8. The modular vertical liquid cooling device according to claim 1, characterized in that, The pipeline connection assembly (400) includes a pipe fitting (410), a connecting hose (420), and a clamp (440). The connecting hose (420) is connected between the liquid cooling plate unit (100) and the integrated flow equalization and distribution plate (200). The clamp (440) is used to press the connecting hose (420) against the outside of the pipe fitting (410).

9. The modular vertical liquid cooling device according to claim 1, characterized in that, The frame assembly (300) includes a support frame (310) and a clamping plate (320). The liquid cooling plate unit (100) is installed inside the support frame (310). The support frame (310) is provided with a limiting step (311) and a bottom support (312). The limiting step (311) is used to limit the displacement of the liquid cooling plate unit (100) in the front-back direction. The bottom support (312) is used to support the liquid cooling plate unit (100). The clamping plate (320) is connected to the support frame (310) and clamps the liquid cooling plate unit (100).

10. The modular vertical liquid cooling device according to claim 1, characterized in that, It also includes an auxiliary clamping assembly (500), which includes an L-shaped adjusting block (510) and a fastening screw (520). The L-shaped adjusting block (510) is located at the lower part of the liquid cooling plate unit (100) or near the integrated flow equalization and distribution plate (200). The L-shaped adjusting block (510) is provided with an elongated adjusting hole (511).

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