Wafer flat edge wafer selection integrated jig

Abstract

This invention discloses an integrated wafer edge selection fixture, belonging to the technical field of semiconductor device manufacturing equipment. The integrated wafer edge selection fixture includes a support base, a rolling mechanism, a wafer flattening mechanism, a wafer selection mechanism, and a longitudinal and transverse dual-guide mechanism. The wafer flattening mechanism is driven by the rolling mechanism, contacts the wafer edge, and drives the wafer to rotate, causing the wafer's flat edge to rotate to a predetermined orientation. After flattening, the longitudinal and transverse dual-guide mechanism guides the wafer selection mechanism's movement in various directions, enabling the wafer selection mechanism to select the target wafer from the wafer cassette. Based on this, by mechanically flattening, a specific wafer is accurately positioned and selected. The wafer edge flattening function and the wafer selection function are integrated into the same fixture, avoiding the problems of separate edge flattening equipment and wafer selection operation in existing technologies, and the large footprint. This allows for rapid selection of single or multiple wafers, greatly improving selection efficiency, while preventing damage to the wafer during the selection process.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing equipment technology, and specifically relates to an integrated fixture for wafer flat-edge selection. Background Technology

[0002] In semiconductor manufacturing processes, wafers require precise positioning and alignment during processing. Particularly in microscopic and visual inspection stages, wafers within a wafer cassette need to be edge-flattened or randomly extracted for inspection and verification. Wafer edge flattening refers to aligning the edges of all wafers within the cassette to a uniform orientation, enabling subsequent processing equipment to accurately identify the wafer's orientation and perform processing. Wafer selection refers to selecting one or more wafers from the cassette for inspection, verification, or random sampling.

[0003] Currently, wafer edge trimming is mostly accomplished using a single manual edge trimmer or an automated sorting machine. A single manual edge trimmer can typically only trim a single wafer, resulting in low efficiency. While automated sorting machines can perform batch edge trimming, they have a large footprint, high equipment costs, and complex operation, posing significant cost and usage barriers for small-batch production or laboratory environments.

[0004] Currently, wafer selection is mostly done manually, with operators using vacuum pens to directly remove wafers from wafer cassettes. A standard wafer cassette typically holds 25 wafers, with a center-to-center distance of approximately 4.763 mm between each wafer—a very small gap. During the vacuum pen's action, improper operation or contact between the pen and adjacent wafers can easily cause friction, scratching the wafer surface and severely impacting product quality. This risk of scratching is further increased, especially when frequent sampling is required.

[0005] Furthermore, edge trimming and wafer selection are often separated: edge trimming requires specialized equipment, while wafer selection requires a vacuum pen or other tools. This separate operation not only increases the equipment's footprint but also adds steps and time costs, reducing production efficiency. Simultaneously, operators switching between different devices increases operational complexity and the risk of errors. Summary of the Invention

[0006] In view of the above analysis, the present invention aims to provide an integrated wafer flat-edge selection fixture to solve one or more of the above-mentioned problems existing in the prior art.

[0007] The objective of this invention is achieved as follows: An integrated wafer flat-edge selection fixture includes: Support and fixation base; A rolling mechanism is provided on the supporting fixed base; The flat wafer mechanism is connected to the rolling mechanism for contacting the wafer edge and driving the wafer to rotate, so that the flat edge of the wafer rotates to a predetermined orientation. A wafer selection mechanism, integrated on the supporting and fixing base, is used to select a target wafer from the wafer cassette. A longitudinal and transverse dual guide mechanism is provided on the supporting fixed base to guide the movement of the selection mechanism in all directions.

[0008] The wafer edge selection integrated fixture of this application includes a support base, a rolling mechanism, a wafer flattening mechanism, a wafer selection mechanism, and a longitudinal and transverse dual-guide mechanism. The wafer flattening mechanism is driven by the rolling mechanism, contacts the wafer edge, and drives the wafer to rotate, causing the wafer edge to rotate to a predetermined orientation. After wafer flattening, the longitudinal and transverse dual-guide mechanism guides the movement of the wafer selection mechanism in various directions, enabling the wafer selection mechanism to select the target wafer from the wafer cassette. Based on this, by mechanically flattening and accurately positioning and selecting specific wafers, rapid selection of single or multiple wafers can be achieved, greatly improving selection efficiency while preventing damage to the wafers during the selection process.

[0009] In one preferred embodiment, the flat plate mechanism includes: Flat-edge rubber rollers are used to contact the edge of the wafer and drive the wafer to rotate through friction.

[0010] In one preferred embodiment, the rolling mechanism includes: The roller is connected to the flat-edge rubber roller and drives the flat-edge rubber roller to rotate.

[0011] In one preferred embodiment, the flat plate mechanism further includes: A flat-edge arm guide is used to lock the rotation of the wafer when the flat edge of the wafer is rotated to the position of the flat-edge arm guide, so as to achieve a uniform orientation of the flat edge.

[0012] As one preferred embodiment, the longitudinal and transverse dual-guide mechanism includes: A transverse guide rail is used to guide the selection mechanism to move laterally in the horizontal plane; A longitudinal guide rail is used to guide the selection mechanism to move longitudinally in the horizontal plane.

[0013] In one preferred embodiment, the selection mechanism further includes: A transverse marking guide rail is provided on the support and fixing base; wherein, the transverse marking guide rail is marked with a wafer alignment mark, which is used to locate the position of the wafer to be selected.

[0014] In one preferred embodiment, the selection mechanism includes: At least one top wafer handle is used to select the corresponding wafer; As one preferred embodiment, it also includes: A lifting mechanism is used to control the lifting and lowering of the top plate handle.

[0015] A lifting locking mechanism is used to lock the lifting state after the lifting mechanism has completed lifting.

[0016] In one preferred embodiment, the support and fixing base is provided with: A positioning structure that matches the bottom of the wafer cassette is used to fix the wafer cassette to the support base.

[0017] As one preferred embodiment, it also includes: The first electric drive module is used to control the rolling mechanism. The second electric drive module is used to control the movement of the chip selection mechanism and the longitudinal and transverse dual guide mechanism. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this specification or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings. Figure 1 This is a schematic diagram of the integrated wafer flat-edge selection fixture structure according to an embodiment of the application; Figure 2 This is a schematic diagram of the flat edge of a wafer; Figure 3 This is a schematic diagram of wafer selection. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] To facilitate understanding of the embodiments of this application, further explanation and description will be provided below with reference to the accompanying drawings and specific embodiments. These embodiments do not constitute a limitation on the embodiments of this application. In the drawings, the dimensions and relative dimensions of components may be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be implemented differently, a specific process sequence may be performed in a different order than that described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Furthermore, the same reference numerals denote the same components.

[0021] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “(the)” are also intended to include the plural forms. Furthermore, when the terms “comprising” and / or “including” and variations thereof are used in this specification, it indicates the presence of the stated features, integrals, steps, operations, parts, components, and / or groups thereof, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, parts, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than as terms of degree, thus explaining the inherent biases in measurements, calculated values, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0022] This application provides an integrated wafer flat-edge selection fixture.

[0023] Figure 1 This is a schematic diagram of a wafer flat-edge selection integrated fixture structure according to an embodiment of the application, as shown below. Figure 1 As shown, an embodiment of the wafer flat-edge selection integrated fixture includes: Support and fixed base 100; A rolling mechanism 101 is disposed on the supporting and fixing base 100; The flat wafer mechanism 102 is connected to the rolling mechanism 101 for contacting the edge of the wafer and driving the wafer to rotate, so that the flat edge of the wafer rotates to a predetermined orientation. The wafer selection mechanism 103 is integrated on the support and fixing base 100 and is used to select a target wafer from the wafer cassette. The longitudinal and transverse dual guide mechanism 104 is disposed on the support and fixed base 100 and is used to guide the movement of the selection mechanism 103 in all directions.

[0024] The support base 100 serves as the support structure for the entire fixture and is made of metal or composite materials, providing sufficient strength and stability. Preferably, the upper surface of the support base 100 is provided with a positioning structure that matches the bottom of the wafer cassette. In one embodiment, the positioning structure is a positioning groove, used to precisely fix the wafer cassette onto the support base 100, preventing displacement of the wafer cassette during operation.

[0025] Preferably, the positioning structure on the supporting base 100 is a positioning pin, and the bottom of the wafer cassette has a positioning hole that matches the positioning pin. The precise positioning and fixing of the wafer cassette is achieved through the cooperation of the positioning pin and the positioning hole. This positioning method offers high positioning accuracy and convenient assembly / disassembly.

[0026] The rolling mechanism 101 is mounted on the supporting base 100 and drives the flattening mechanism 102 to flatten the sheet by rolling. In one embodiment, the rolling mechanism 101 is manually driven and includes a handwheel and rollers. The operator drives the drive shaft to rotate by turning the handwheel, which in turn drives the rollers connected to the drive shaft to rotate.

[0027] Preferably, the rolling mechanism 101 is electrically driven, including a motor and a reducer. The operator starts the motor via an electric switch, and the motor drives the rollers to rotate through the reducer, thereby driving the flattening mechanism 102. The electric drive method further saves manpower, improves the efficiency of flattening operations, and is suitable for batch flattening operations.

[0028] Driven by the rolling mechanism 101, the flattening mechanism 102 completes the flattening of each wafer in the wafer cassette by rolling.

[0029] Preferably, the flat plate mechanism 102 includes: Flat-edge rubber rollers are used to contact the edge of the wafer and drive the wafer to rotate through friction.

[0030] The flat-edge rubber roller is made of a material with good friction coefficient and wear resistance, which can generate sufficient friction with the wafer edge to drive the wafer rotation. Preferably, the flat-edge rubber roller is made of polyurethane. In another embodiment, the flat-edge rubber roller is made of silicone rubber, which has better wear resistance and a more suitable friction coefficient, and can reduce wear on the wafer edge while ensuring driving force.

[0031] Preferably, the flat plate mechanism 102 further includes: A flat-edge arm guide is disposed on one side of a flat-edge rubber roller. It is used to lock the rotation of the wafer when the flat edge of the wafer is rotated to the position of the flat-edge arm guide, so as to achieve a uniform orientation of the flat edge.

[0032] Preferably, Figure 2 This is a schematic diagram of the flat edge of a wafer, as shown below. Figure 2 As shown, the flat-edge arm guide is a mechanical limiting device that mechanically locks the wafer's rotation when the wafer's flat edge rotates to the position of the flat-edge arm guide. During operation, the wafer cassette containing the wafers to be processed is placed on the support base 100 and fixed by the positioning slot. Then, the operator adjusts the position of the flattening mechanism 102 using the longitudinal and transverse double guide mechanism 104, aligning it with the first wafer in the wafer cassette. Next, the height of the flattening mechanism 102 is adjusted so that the flat-edge roller contacts the edge of the wafer. The operator turns the handwheel, driving the rolling mechanism 101 to rotate. The roller drives the flat-edge roller 11 to rotate, and the flat-edge roller drives the wafer to rotate in the opposite direction through friction. When the wafer rotates until its flat edge is aligned with the flat-edge arm guide, the wafer stops rotating, and the flat edge of the wafer is now aligned to a uniform orientation. The above steps are repeated to complete the flattening operation of all wafers in the wafer cassette, ensuring that the flat edges of all wafers face the same direction.

[0033] Preferably, the dual guide mechanism 104 is disposed on the supporting and fixed base 100, including a transverse guide rail and a longitudinal guide rail. The wafer flattening mechanism 102 is mounted on the dual guide mechanism 104 and can move in both the transverse and longitudinal directions to adjust the position of the wafer flattening mechanism 102 relative to the wafers within the wafer cassette. The transverse guide rail is used to guide the wafer flattening mechanism 102 to move along the length direction of the wafer cassette to accommodate wafers in different positions; the longitudinal guide rail is used to guide the wafer flattening mechanism 102 to move along the width direction of the wafer cassette to accommodate wafer cassettes or wafers of different sizes.

[0034] Preferably, the film selection mechanism 103 includes: At least one top wafer handle is used to select the corresponding wafer; A transverse marking guide rail is provided on the support and fixing base 100; wherein the transverse marking guide rail is marked with a wafer alignment mark for positioning to the position of the wafer to be selected.

[0035] The wafer selection mechanism 103 is integrated into the support base 100 and is located below the wafer cassette mounting position during use. The wafer selection mechanism 103 includes a transverse marking guide rail and a top wafer handle that can slide along the transverse marking guide rail.

[0036] Preferably, it further includes: The lifting mechanism 105 is used to control the lifting of the top plate handle.

[0037] A lifting locking mechanism is used to lock the lifting state of the lifting mechanism 105 after it has completed lifting.

[0038] Preferably, the lifting mechanism 105 is mounted on the supporting base 100 and is connected to the wafer flattening mechanism 102 in a time-sharing manner. It can also be used to adjust the height of the wafer flattening mechanism 102. Preferably, the lifting structure includes a lifting handle and a lifting screw. By rotating the lifting handle, the operator drives the lifting screw to rotate, causing the wafer flattening mechanism 102 to move up and down in the vertical direction, enabling it to contact wafers at different layers within the wafer cassette.

[0039] The horizontal marking guide rail is set along the length of the supporting and fixing base 100, consistent with the arrangement direction of the wafers inside the wafer cassette. Wafer alignment marks are located on the side of the horizontal guide rail, their positions corresponding one-to-one with the center positions of each wafer inside the wafer cassette, facilitating precise positioning by the operator. The lower end of the top wafer handle slides into the horizontal guide rail, while the upper end forms the top wafer section, used to lift the wafer upwards.

[0040] The lifting and locking mechanism includes a locking element, which is used to lock the lifting state of the top plate handle after it has completed its position positioning, so as to prevent the top plate handle from accidentally retracting during the lifting process.

[0041] Figure 3 This is a schematic diagram of wafer selection, such as... Figure 3 As shown, during wafer selection, based on the position of the wafer to be selected in the wafer cassette, the top wafer handle is slid along the horizontal marked guide rail to the corresponding wafer alignment mark position, ensuring the top part of the top wafer handle is accurately positioned directly below the target wafer. Then, the operator activates the lifting locking mechanism and pushes the top wafer handle upwards, causing it to rise and push the target wafer out of its slot in the wafer cassette, making it protrude from the other wafers. The operator can then easily retrieve the wafer for testing or verification. After retrieval, the top wafer handle is pulled down to lock the lifting locking mechanism, and the top wafer handle returns to its original position.

[0042] Preferably, multiple top wafer handles can be provided, each sliding independently and positioned at its respective target wafer position. Driven by the lifting mechanism 105, they are simultaneously lifted upwards to achieve simultaneous selection of multiple wafers.

[0043] The lifting mechanism 105 is connected to the top plate handle and the flat plate mechanism 102 in a time-sharing manner, and can drive either the top plate handle or the flat plate mechanism 102 to rise.

[0044] Preferably, the lifting and locking mechanism includes a spring latch and a slot. When the top plate handle is raised to its final position, the spring latch automatically engages with the slot, locking the position of the top plate handle. When it is necessary to lower the top plate handle, pressing the release button of the spring latch causes the top plate handle to automatically return to its original position under the action of the return spring. This further simplifies the operation and improves ease of use.

[0045] Preferably, the bottom of the support base 100 is provided with an anti-slip pad to increase the friction between the fixture and the work surface, prevent the fixture from sliding during operation, and improve operational stability.

[0046] Preferably, the wafer flat-edge selection integrated fixture in this application embodiment further includes: The first electric drive module is used to control the rolling mechanism 101. The second electric drive module is used to control the movement of the chip selection mechanism 103 and the longitudinal and transverse dual guide mechanism 104.

[0047] By configuring the first and second electric drive modules, the wafer flattening and selection processes are electrically controlled, facilitating the integration of wafer flattening and selection integrated fixtures into the wafer production line. This enables the automation and standardization of the production line, improving operational efficiency. Simultaneously, the wafer flattening and selection functions prevent frictional scratches between wafers, enhancing inspection efficiency.

[0048] Preferably, the first electric drive module and the second electric drive module can be drive modules based on stepper motors and electronic control modules, which convert the rotation of the stepper motor into the rolling of the rolling mechanism 101 and the linear movement of the selection mechanism 103 and the longitudinal and transverse double guide mechanism 104.

[0049] The wafer edge flattening and selection integrated fixture of this application integrates wafer edge flattening and wafer selection functions into a single fixture, avoiding the problems of separate edge flattening equipment and wafer selection operation, and large footprint in existing technologies. It is particularly suitable for laboratories or production workshops with limited space. Furthermore, the method of using a top-lifting mechanism to lift the wafer from the bottom of the wafer cassette avoids the friction and scratches caused by contact between the vacuum pick-up pen and adjacent wafers in existing technologies. The top-lifting mechanism only contacts the bottom edge of the wafer, preventing damage to the wafer surface and effectively protecting wafer quality.

[0050] The wafer edge selection integrated fixture of this application includes a support base 100, a rolling mechanism 101, a wafer flattening mechanism 102, a wafer selection mechanism 103, and a longitudinal and transverse dual-guide mechanism 104. The wafer flattening mechanism 102 is drivenly connected to the rolling mechanism 101, contacts the wafer edge, and drives the wafer to rotate, causing the wafer's flat edge to rotate to a predetermined orientation. After flattening, the longitudinal and transverse dual-guide mechanism 104 guides the movement of the wafer selection mechanism 103 in various directions, enabling the wafer selection mechanism 103 to select the target wafer from the wafer cassette. Based on this, by mechanically flattening and accurately positioning and selecting specific wafers, rapid selection of single or multiple wafers can be achieved, greatly improving selection efficiency while preventing damage to the wafers during the selection process.

[0051] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art can make various improvements and modifications without departing from the spirit and principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

[0052] The following points should be noted regarding this application: (1) The accompanying drawings of the embodiments of this application only involve the structures involved in the embodiments of this application. Other structures can be referred to the general design.

[0053] (2) For clarity, the thickness and dimensions of layers or structures are enlarged in the accompanying drawings used to describe embodiments of the invention. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element, or there may be intermediate elements present.

[0054] (3) Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other to obtain new embodiments. The above are only specific implementations of this application, but the protection scope of this application is not limited thereto, and the protection scope of this application shall be determined by the protection scope of the claims.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

[0057] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this application. It should be understood that the above description is only a specific embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An integrated wafer flat-edge selection fixture, characterized in that, include: Support and fixation base; A rolling mechanism is provided on the supporting fixed base; The flat wafer mechanism is connected to the rolling mechanism for contacting the wafer edge and driving the wafer to rotate, so that the flat edge of the wafer rotates to a predetermined orientation. A wafer selection mechanism, integrated on the supporting and fixing base, is used to select a target wafer from the wafer cassette. A longitudinal and transverse dual guide mechanism is provided on the supporting fixed base to guide the movement of the selection mechanism in all directions.

2. The wafer flat-edge selection integrated fixture according to claim 1, characterized in that, The flat plate mechanism includes: Flat-edge rubber rollers are used to contact the edge of the wafer and drive the wafer to rotate through friction.

3. The wafer flat-edge selection integrated fixture according to claim 2, characterized in that, The rolling mechanism includes: The roller is connected to the flat-edge rubber roller and drives the flat-edge rubber roller to rotate.

4. The wafer flat-edge selection integrated fixture according to claim 1, characterized in that, The planar mechanism also includes: A flat-edge arm guide is used to lock the rotation of the wafer when the flat edge of the wafer is rotated to the position of the flat-edge arm guide, so as to achieve a uniform orientation of the flat edge.

5. The wafer flat-edge selection integrated fixture according to claim 1, characterized in that, The longitudinal and transverse dual-guide mechanism includes: A transverse guide rail is used to guide the selection mechanism to move laterally in the horizontal plane; A longitudinal guide rail is used to guide the selection mechanism to move longitudinally in the horizontal plane.

6. The wafer flat-edge selection integrated fixture according to claim 1, characterized in that, The film selection mechanism includes: A transverse marking guide rail is provided on the support and fixing base; wherein, the transverse marking guide rail is marked with a wafer alignment mark, which is used to locate the position of the wafer to be selected.

7. The wafer flat-edge selection integrated fixture according to claim 1 or 6, characterized in that, The film selection mechanism includes: At least one top handle is used to select the corresponding wafer.

8. The wafer flat-edge selection integrated fixture according to claim 7, characterized in that, Also includes: A lifting mechanism is used to control the lifting and lowering of the top plate handle; A lifting locking mechanism is used to lock the lifting state after the lifting mechanism has completed lifting.

9. The wafer flat-edge selection integrated fixture according to claim 1, characterized in that, The supporting and fixing base is provided with: A positioning structure that matches the bottom of the wafer cassette is used to fix the wafer cassette to the support base.

10. The wafer flat-edge selection integrated fixture according to claim 1, characterized in that, Also includes: The first electric drive module is used to control the rolling mechanism. The second electric drive module is used to control the movement of the chip selection mechanism and the longitudinal and transverse dual guide mechanism.

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