Die mounting apparatus, die mounting method, and method for manufacturing semiconductor device

Abstract

The present application provides a die mounting device, a die mounting method, and a semiconductor device manufacturing method, and provides a technology capable of improving the precision of the facing and joining of a die and a substrate. The die mounting device is provided with a mounting head, a control unit, and a mounting table on which a substrate is placed. The mounting head is configured to have a fixed member and a movable member. The movable member has a collet that adsorbs a die at a lower end and is swingably arranged relative to the fixed member. The center of rotation of the movable member is located at the lower surface of the die. The control unit is configured to control the mounting head to profile the lower surface of the die to the upper surface of the substrate held on the mounting table each time the die is placed on the substrate.

Description

Technical Field

[0001] This disclosure relates to a die placement apparatus, for example, applicable to a die placement machine equipped with a placement head having a tilt adjustment mechanism. Background Technology

[0002] As a step in the manufacturing process of semiconductor devices, at a die mounter, a die picked up by a mount head is mounted onto a substrate. The mount head descends to allow the die to fall onto the substrate, and a load is applied to the die to bond it to the substrate (see, for example, Patent Document 1).

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2024-46799 Summary of the Invention

[0004] The technical problem that the invention aims to solve The problem this disclosure aims to solve is to provide a technique that improves the face-to-face alignment accuracy of the die and substrate. Other problems to be solved and new features will become clear from the description and accompanying drawings in this specification.

[0005] Technical solutions for solving the problem The representative technical solutions in this disclosure are summarized below.

[0006] That is, the die placement apparatus includes a placement head, a control unit, and a placement stage for placing a substrate. The placement head is configured to include a fixing member and a movable member. The movable member has a clamp at its lower end for holding the die and is oscillating relative to the fixing member. The rotation center of the movable member is located on the lower surface of the die. The control unit is configured to control the placement head so that, each time the die is placed on the substrate, the lower surface of the die conforms to the upper surface of the substrate held on the placement stage.

[0007] Invention Effects Using this disclosure can improve the face-to-face alignment accuracy of the die and the substrate. Attached Figure Description

[0008] Figure 1 This is a diagram used to illustrate the structure of a die mounting device.

[0009] Figure 2 This is a diagram used to illustrate the structure of a die mounting device.

[0010] Figure 3 This is a diagram used to illustrate the manufacturing process of semiconductor devices.

[0011] Figure 4 This is a diagram used to illustrate the structure of the mounting head.

[0012] Figure 5 (a) ~ Figure 5 (d) is a diagram used to illustrate the tilt adjustment of the placement head.

[0013] Figure 6 (a) ~ Figure 6 (d) is a diagram used to illustrate the structure and operation of other types of mounting heads.

[0014] Explanation of reference numerals in the attached figures 41. Plating head; 411. First component (fixed component); 412. Second component (movable component, second movable component); 414. Fourth component (movable component, first movable component); 46. Plating loading table; 80. Control unit. Detailed Implementation

[0015] The embodiments are described below using the accompanying drawings. It should be noted that in the following description, the same reference numerals are used to refer to the same constituent elements, and repeated descriptions are sometimes omitted. Furthermore, for clarity, the drawings sometimes schematically represent the width, thickness, and shape of each part compared to the actual form. Additionally, the dimensional relationships and ratios of the elements may not be consistent across multiple drawings.

[0016] (Structure of the bare die mounting device) Figure 1 This is a schematic top view showing a structural example of a die placement machine as an example of a die placement apparatus. Figure 2 This is to explain from Figure 1 A diagram showing the approximate structure when viewed from the direction of the middle arrow A.

[0017] like Figure 1 as well as Figure 2 As shown, the die placement machine 1, in general terms, includes a wafer supply unit 10, a pick-up unit 20, an intermediate stage unit 30, a placement unit 40, a transport unit 50, a substrate supply unit 60, a substrate removal unit 70, and a control unit 80. The Y2-Y1 direction (Y direction) is the front-to-back direction of the die placement machine 1, the X2-X1 direction (X direction) is the left-to-right direction, and the Z1-Z2 direction (Z direction) is the up-down direction. The wafer supply unit 10 is located at the front of the die placement machine 1, and the placement unit 40 is located at the rear. Here, the X, Y, and Z directions are orthogonal to each other. The X direction is also called the first direction, and the Y direction is also called the second direction.

[0018] like Figure 1 As shown, the wafer supply unit 10 includes a wafer cassette lift 11, a wafer holding stage 12, and a stripping unit 13.

[0019] The wafer cassette lift 11 moves the wafer cassette (not shown) containing multiple wafer rings (WRs) vertically to the wafer transport height. A wafer correction slot (not shown) calibrates the wafer rings (WRs) supplied from the wafer cassette lift 11. A wafer extractor (not shown) removes the wafer rings (WRs) from the wafer cassette and supplies them to the wafer holding stage 12, or removes the wafer rings (WRs) from the wafer holding stage 12 and stores them in the wafer cassette.

[0020] A wafer W, which has been diced into multiple dies D, is bonded (attached) to a dicing tape DT. The dicing tape DT is held on a wafer ring WR. The wafer W is, for example, a semiconductor wafer, and the dies D are semiconductor chips. A film-like adhesive material called die bonder (DAF) is bonded between the wafer W and the dicing tape DT. The adhesive material is hardened by heating.

[0021] The wafer holding stage 12 moves along the X and Y directions. This moves the wafer ring WR so that the picked-up die D is positioned at a predetermined location in the stripping unit 13. Additionally, the wafer holding stage 12 rotates the wafer ring WR in the XY plane using a drive unit (not shown). The stripping unit 13 moves vertically. The stripping unit 13 peels the die D from the cutting tape DT.

[0022] like Figure 1 as well as Figure 2 As shown, the pickup unit 20 includes a pickup head 21, a pickup head stage 23, and a wafer identification camera 24. The pickup head 21 is provided with a clamp (adsorption and holding member) 22 that holds the stripped die D at its front end. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The pickup head stage 23 moves the pickup head 21 along the Y direction. The pickup head stage 23 is provided with drive units (not shown) for raising, lowering, rotating, and moving the pickup head 21 along the X direction. The wafer identification camera 24 identifies the pickup position of the die D picked up from the wafer W or performs a visual inspection of the die D.

[0023] like Figure 1 as well as Figure 2 As shown, the intermediate stage 30 includes an intermediate stage 31 for placing a bare die D, and a stage recognition camera 34 for identifying the bare die D on the intermediate stage 31. The intermediate stage 31 has suction holes for adsorbing the placed bare die D. The placed bare die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a stage for placing the bare die D and a stage for picking up the bare die D.

[0024] like Figure 1 as well as Figure 2As shown, the mounting unit 40 includes a mounting head 41, a mounting head stage 43, a substrate recognition camera 44, and a mounting loading stage 46. The mounting head 41 is provided with a collet 42 for holding the bare die D at its front end. The mounting head stage 43 moves the mounting head 41 along the Y direction. The mounting head stage 43 is provided with drive units (not shown) for raising, lowering, rotating, and moving the mounting head 41 along the X direction. The substrate recognition camera 44 captures images of the substrate S and identifies the mounting position. When the bare die D is placed on the substrate S, the mounting loading stage 46 rises to support the substrate S from below. The mounting loading stage 46 has a suction port (not shown) for vacuum suction of the substrate S, enabling it to hold the substrate S in place. The mounting loading stage 46 has a heating unit (not shown) for heating the substrate S.

[0025] Here, the substrate S may include, for example, a wiring substrate, a lead frame, and a glass substrate. Multiple product areas are formed on the substrate S. These product areas ultimately form a package. Hereinafter, the product areas will be referred to as package areas P. Additionally, a location identification mark (not shown) for package area P is formed on the substrate S.

[0026] Using this structure, the pick-up position and posture are corrected based on the shooting data of the stage recognition camera 34, and the placement head 41 picks up the bare die D from the intermediate stage 31. Then, the placement head 41 performs placement on the packaging area P of the substrate S based on the shooting data of the substrate recognition camera 44, or performs placement in a form of stacking on the bare die that has already been placed on the packaging area P of the substrate S.

[0027] like Figure 1 As shown, the transport unit 50 has a transport claw 51 for gripping and transporting the substrate S, and a transport channel 52 for moving the substrate S. For example, a ball screw (not shown) provided along the transport channel 52 drives a nut (not shown) on the transport claw 51, thereby moving the substrate S in the X1 direction. With this structure, the substrate S is moved from the substrate supply unit 60 along the transport channel 52 to the mounting position, and after mounting, it is moved to the substrate removal unit 70 and delivered there.

[0028] The substrate supply unit 60 takes the substrate S, which is stored in a transport fixture (not shown) and moves it into the transport unit 50. The substrate removal unit 70 stores the substrate S, which is transported by the transport unit 50, in the transport fixture.

[0029] like Figure 1As shown, the control unit 80 is configured as a computer having a CPU (Central Processing Unit) 81, a storage device 82, and an input / output device 83. The control unit 80 is also called a control device or a controller. The storage device 82 has a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a is composed of RAM (Random Access Memory) storing processing programs, etc. The auxiliary storage device 82b is composed of HDD (Hard Disk Drive), SSD (Solid State Drive), etc., storing control data, image data, etc., required for control. The processing program is a process formula that records the processing steps, conditions, etc.

[0030] The input / output device 83 includes an image reading device 83a, a motor control device 83b, and an I / O signal control device 83c. The image reading device 83a reads image data from an optical system such as a substrate recognition camera 44. The motor control device 83b controls the drive units of the XY stage (not shown), pick-up head stage 23, and placement head stage 43 of the wafer supply unit 10. The I / O signal control device 83c reads signals from various sensors or outputs electrical signals to control devices (such as the drive unit of the contouring mechanism described later).

[0031] (Bare die mounting method) Figure 3 It means that it was used. Figure 1 The flowchart shows the semiconductor device manufacturing method of the bare die placement machine.

[0032] like Figure 3 As shown, a die mounting method (semiconductor device manufacturing method) is described as a step in the semiconductor device manufacturing process using a die mounting machine 1. In the following description, the control unit 80 controls the operation of each component constituting the die mounting machine 1.

[0033] (Wafer loading: Process S1) A wafer cassette (not shown) containing wafer rings (WR) is fed into a wafer cassette lift 11. The wafer rings (WR) are removed from the wafer cassette and supplied (transferred) to the wafer holding stage 12.

[0034] (Substrate handling: Process S2) A transport fixture (not shown) containing a substrate S is inserted into the substrate supply unit 60. In the substrate supply unit 60, the substrate S stored in the transport fixture is removed from the transport fixture. Then, the substrate S is supplied (carried in) to the mounting unit 40 by means of the transport unit 50.

[0035] (Pick-up: Process S3) After process S1, the wafer holding stage 12 is moved to pick up the desired die D from the self-cutting tape DT. The die D is photographed using the wafer recognition camera 24 to obtain image data. Image processing is performed on the image data to calculate the deviation (X, Y, θ directions) of the die D on the wafer holding stage 12 from the die position reference point of the die placement machine 1. Furthermore, the die position reference point is maintained by using a predetermined position of the wafer holding stage 12 as the initial setting of the device. Visual inspection of the die D is performed by image processing of the image data.

[0036] The bare sheet D is peeled off from the self-cutting tape DT using the peeling unit 13 and the pickup head 21. The bare sheet D peeled off from the self-cutting tape DT is attracted and held by the clamp 22 provided on the pickup head 21 and is transported and placed on the intermediate platform 31.

[0037] The die D on the intermediate stage 31 is captured by the stage recognition camera 34, and image data is obtained. Image processing is performed on the image data to calculate the deviation (X, Y, θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die placement machine 1. Furthermore, the die position reference point is maintained by using a predetermined position of the intermediate stage 31 as the initial setting of the device. Visual inspection of the die D is performed by image processing of the image data.

[0038] The die D is transported to the pick-up head 21 of the intermediate stage 31 and returned to the wafer supply section 10. Following the above steps, the next die D is peeled off from the dicing tape DT, and then the same steps are followed to peel off the dies D one by one from the dicing tape DT.

[0039] (Place-on assembly: Process S4) The substrate S is transported to the mounting stage 46 using the transport unit 50. The substrate recognition camera 44 captures an image of the substrate S placed on the mounting stage 46, obtaining image data. Image processing is performed on the image data to calculate the deviation (X, Y, θ directions) of the substrate S from the substrate position reference point of the die mounter 1. Furthermore, the substrate position reference point is maintained by using a predetermined position of the mounting unit 40 as the initial setting of the device. Visual inspection of the substrate S is performed by image processing of the image data.

[0040] Based on the deviation of the die D on the intermediate stage 31 calculated in process S3, the adsorption position of the mounting head 41 is corrected, and the die D is adsorbed using the clamp 42. Using the mounting head 41 that adsorbs the die D from the intermediate stage 31, the die D is mounted onto a predetermined location on the substrate S supported on the mounting stage 46. Here, the predetermined location on the substrate S is either the packaging area P of the substrate S, or the area where the die D is already placed and mounted in a superimposed manner, or the mounting area of ​​the die D in a stacked mounting process. The substrate recognition camera 44 captures an image of the die D mounted on the substrate S, obtaining image data. By performing image processing on the image data, checks are performed to ensure the die D is mounted in the desired position (relative position check between the die D and the substrate S) and an appearance inspection is performed.

[0041] The mounting head 41, which mounts the die D onto the substrate S, returns to the intermediate stage 31. Following the steps described above, the next die D is picked up from the intermediate stage 31 and mounted onto the substrate S. This operation is repeated until all package areas P of the die D are mounted onto the substrate S.

[0042] (Removing the substrate: Process S5) The substrate S, with the bare die D mounted on it, is transported from the mounting section 40 to the substrate removal section 70 via the transport section 50. The substrate S is removed from the substrate removal section 70 and stored in the transport fixture, and then removed from the substrate removal machine 1. The transport fixture containing the substrate S is then removed from the bare die mounting machine 1.

[0043] As described above, the die D is mounted on the substrate S and removed from the die mounter 1. Then, for example, with respect to the substrate S on which the die D is mounted, a transport fixture containing the substrate S is transported to the wire bonding process, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to the molding process, where the die D and the Au wires are sealed with molding resin (not shown), thereby completing the semiconductor packaging.

[0044] (Structure of the mounting head) Figure 4 This is a diagram showing the main structural components of the mounting head.

[0045] The placement head 41 is configured opposite to the placement table 46 and can move relative to the placement table 46 in both the horizontal and vertical directions. To achieve this movement of the placement head 41, a placement head stage 43 with a Z-drive unit is provided. The drive of the placement head stage 43 is controlled by a control unit 80.

[0046] A collet 42 is provided at the front end of the placement head 41, and the bare die D can be attracted and held at the collet surface 42a, which is the front end face of the collet 42. For this purpose, an attraction hole (not shown) for attracting and holding the bare die D is formed at the front end of the collet 42, and the attraction hole is connected to a vacuum source (not shown) via an air pipe 47.

[0047] [1] The mounting stage 46 is capable of attracting and holding the substrate S. A heater (not shown) for heating the substrate S is installed inside the mounting stage 46. The heating and attracting of the mounting stage 46 are controlled by the control unit 80. The mounting stage 46 can move in the vertical direction.

[0048] After the mounting head 41 uses the collet surface 42a to attract and hold the bare die D, it places the bare die D onto the surface of the substrate S and applies pressure and heat to mount the bare die D onto the substrate S. At this time, it is necessary to maintain the parallelism between the substrate S and the bare die D bonded to the substrate S with high precision.

[0049] The mounting head 41 in this embodiment is equipped with a tilt adjustment mechanism consisting of a rotation adjustment mechanism for the X-axis and a contouring mechanism for the Y-axis. The rotation adjustment mechanism, for example, during mechanical adjustments of the device, uses elongated holes and tightening screws to tilt the mounting head by rotating it about an axis extending in the X-direction and about an axis extending in the Y-direction. The contouring mechanism, for example, uses a pneumatic component with a built-in spherical air hydrostatic bearing for tilt adjustment. This improves the parallelism of the die D relative to the substrate S. For example, tilt adjustment is performed by the rotation adjustment mechanism during the pre-production preparation stage (adjustment). For example, tilt adjustment is performed by the contouring mechanism during adjustment and during production (operation).

[0050] The mounting head 41 has a first component 411, a second component 412 movable relative to the first component 411, a third component 413, and a retainer (not shown). The first component 411 and the second component 412 constitute a contouring mechanism.

[0051] The upper part of the first component 411 is fixed to the third component 413 in an adjustable manner. The first component 411 has a through hole along the Y-axis, into which a pin 413a is inserted, allowing the first component 411 to rotate. It is fixed using an elongated hole 413b in the third component 413 and a screw in the first component 411, allowing for rotational adjustment of the first component 411 around the Y-axis. Figure 4 The diagram only shows the rotation adjustment mechanism around the Y-axis, but the rotation adjustment mechanism around the X-axis has the same structure. If the tilt of the first member 411 does not increase, the rotation adjustment mechanism may not be necessary.

[0052] The bottom surface 411a of the first member 411 is formed as a concave spherical surface. Additionally, an air passage (not shown) for supplying or drawing air is formed in the first member 411. This air passage extends from the side surface of the first member 411 to the bottom surface 411a. An air pipe 48 for fluidly connecting this air passage to the drive unit (not shown) of the contouring mechanism is connected to the side surface of the first member 411. The first member 411 is referred to as the fixed member.

[0053] The second member 412 is held in a manner that allows it to swing three-dimensionally relative to the first member 411. A collet 42 is provided at the lower end of the second member 412, and the second member 412 can swing together with the collet surface 42a. Furthermore, the upper surface 412a of the second member 412 is formed as a convex spherical surface corresponding to the concave spherical surface of the bottom surface 411a of the first member 411. The holding member holds the second member 412 in a manner that does not hinder its swinging. The second member 412 is referred to as a movable member.

[0054] The second component 412 is configured such that its rotation center C is located on the lower surface of the die D held by the collet 42. Therefore, the convex spherical surface of the upper surface 412a of the second component 412 is a hemisphere or a sphere smaller than a hemisphere. The spherical surface of the bottom surface 411a of the first component 411 is also a sphere smaller than a hemisphere. Within the movable range of the second component 412, the spherical surface of the upper surface 412a of the second component 412 is the same size as the spherical surface of the bottom surface 411a of the first component 411. When the die D is placed on the substrate S, the rotation center C of the second component 412 is located at the center (Cs) of each packaging area P on the upper surface of the substrate S.

[0055] The contouring mechanism ejects compressed air from the bottom surface 411a of the first member 411, thereby separating the second member 412 from the first member 411 and supporting the second member 412 in a non-contact state. This significantly reduces the sliding resistance of the second member 412, enabling precise rotational movement with minimal force. Furthermore, by stopping the supply of compressed air and evacuating the second member 412, it is fixed in a predetermined posture. Hereinafter, the state in which compressed air is ejected, allowing the second member 412 to swing, is referred to as the released state, and the state in which the second member 412 is evacuated, restricting its swing, is referred to as the fixed state.

[0056] The release and stationary states of the contouring mechanism are switched by the drive unit (not shown) of the contouring mechanism. The drive unit of the contouring mechanism is connected to a compressor for supplying compressed air, a vacuum source for evacuation, etc. In addition, the drive unit of the contouring mechanism is controlled by the control unit 80.

[0057] The release and fixed states of the contouring mechanism can be switched via electrostatic chucks, piezoelectric elements, magnetism, device control, or mechanical mechanisms. Regarding the guide, since it can freely adjust the mating concave and convex hemispherical surfaces, its rotation direction (around the Z-axis) is also free, and a rotation-inhibiting mechanism such as an anti-rotation device is also provided.

[0058] In addition, the end face (lower surface) of the bare die D held on the collet surface 42a or the collet surface 42a will be referred to as the first surface, and the upper surface (mounting surface Sa) of the substrate S held by the mounting stage 46 or the upper surface (stage surface 46a) of the mounting stage 46 will be referred to as the second surface.

[0059] (Tilt adjustment of the placement head) Figure 5 (a) is a diagram showing the state of the mounting head after tilt adjustment. Figure 5 (b) is a diagram showing the state of the placement head before placement during operation. Figure 5 (c) is a diagram showing the state of the placement head during placement. Figure 5 (d) is a diagram showing the state of the placement head after placement during operation. Figure 5 (a) ~ Figure 5 In (d), the illustration is omitted. Figure 4 It is part of the structure of the placement head.

[0060] (During adjustment) When performing mechanical adjustments to the device, such as during startup or placement head replacement, tilt adjustments should be made. Figure 5 In (a), the lower surface Da of the bare die D is designated as the first surface, and the platform surface 46a of the mounting stage 46 is designated as the second surface. Typically, the device exhibits deviations in the tilt of its axes and surfaces. Due to such deviations, the first surface is sometimes tilted relative to the second surface. Figure 5 In example (a), the platform surface 46a, which serves as the second surface, is inclined relative to the horizontal plane.

[0061] First, for example, the tilt of the first component 411 can be adjusted manually by using a rotation adjustment mechanism to rotate it around the X-axis and the Y-axis, so that the rotation center (C1) of the first component 411, the rotation center (C) of the second component 412, and the center (Cm) of the platform surface 46a of the mounting table 46 are aligned in a straight line (coaxial). If the tilt of the first component 411 does not increase, the adjustment by the rotation adjustment mechanism may not be necessary.

[0062] Next, the placement head 41 is lowered using the control unit 80. Upon landing on the placement table 46, the contouring mechanism is released, and the lower surface Da of the die D comes into contact with the table surface 46a. In the released state, the second member 412 can swing with a small force. Therefore, the second member 412 swings until the entire lower surface Da of the die D contacts the table surface 46a and becomes parallel to it. Then, at the moment of parallelism, the contouring mechanism is switched to a fixed state. By restricting the swing of the second member 412, the parallelism of the lower surface Da of the die D relative to the table surface 46a can be maintained with high precision. Finally, the contouring mechanism raises the placement head 41 in the fixed state.

[0063] (During operation) Each time the bare die D, held at the mounting head 41, is placed (mounted) onto the substrate S, a tilt adjustment is performed during operation (mounting). Figure 5 (b) ~ Figure 5 In (d), the lower surface Da of the bare die D is designated as the first surface, and the mounting surface Sa is designated as the second surface.

[0064] During adjustment, even if the second surface aligns with the first surface, during operation, the mounting surface Sa, which is the second surface, and the lower surface Da, which is the bare plate D, which is the first surface, may not always be parallel, resulting in some deviation. Figure 5 The inclination of the mounting surface Sa in (b) and Figure 5 The tilt of the second face during the adjustment shown in (a) is different. Figure 5 The inclination of the lower surface Da of the bare sheet D shown in (b) is related to... Figure 5 The tilt of the first face is the same during the adjustment shown in (a).

[0065] First, utilizing the control unit 80 self Figure 5 The state shown in (b) causes the mounting head 41 to descend.

[0066] Next, as Figure 5 As shown in (c), when the mounting head 41 lands on the substrate S, the contouring mechanism is released, and then the lower surface Da of the die D abuts against the mounting surface Sa. The second member 412 swings until the entire lower surface Da of the die D contacts the mounting surface Sa and the lower surface Da of the die D becomes parallel to the mounting surface Sa. Then, at the moment when they are parallel, the contouring mechanism is switched to a fixed state. By restricting the swing of the second member 412, the parallelism of the lower surface Da of the die D relative to the mounting surface Sa can be maintained with high precision.

[0067] Finally, as Figure 5 As shown in (d), after the bare die D is mounted on the substrate S, the conformal mechanism raises the mounting head 41 in a fixed state.

[0068] If the tilt is fixed during adjustment and no further adjustment is made, and the entire mounting stage 46 is not in the same plane, the tilt may deviate due to the unevenness of the individual substrates S, depending on the mounting stage 46 and the mounting position of the substrates S. Additionally, the tilt may also deviate over time due to thermal expansion caused by temperature changes, uneven quality of the production workpieces during flow, or environmental influences (sometimes resulting in areas of inconsistent tilt).

[0069] Even after adjustment, the lower surface Da of the die D is tilted and aligned with the mounting surface Sa each time it is installed. Therefore, including the unevenness of the stage surface and the unevenness of the substrate S, almost complete face-to-face alignment can be achieved, and face-to-face alignment can be achieved at every mounting position.

[0070] (Other forms of mounting heads) (Construction of the mounting head) Figure 6 (a) is a front view showing the construction of other types of mounting heads. Figure 6 (b) is a left view showing the construction of other types of mounting heads.

[0071] Figure 4 The contouring mechanism of the mounting head shown is composed of concave and convex hemispherical surfaces. This type of contouring mechanism replaces the concave and convex spherical surfaces with superimposed cylindrical surfaces that intersect along the X and Y axes. In other words, this type of contouring mechanism is formed by stacking a second component 412, a fourth component 414, and a first component 411. The second component 412 has a convex cylindrical surface with the mounting surface (the lower surface of the adsorbed die) as its rotational axis. The fourth component 414 has a concave cylindrical surface with the same diameter as the second component 412 and a convex cylindrical surface with a rotational axis orthogonal to the second component 412. The first component 411 has a concave cylindrical surface with the same diameter as the fourth component 414. The rotational axes of all these components are located on the mounting surface (on the same horizontal plane). Note that orthogonality does not mean exactly 90 degrees; it includes device tolerances.

[0072] like Figure 6 (a) and Figure 6 As shown in (b), the mounting head 41 has a first member 411, a second member 412 movable relative to a fourth member 414, a third member 413, a fourth member 414 movable relative to the first member 411, and a retainer (not shown). The first member 411, the second member 412, and the fourth member 414 constitute a contouring mechanism.

[0073] The upper part of the first component 411 is fixed to the third component 413. Figure 4Similarly, the upper part of the first component 411 can also be fixed to the third component 413 at an adjustable angle.

[0074] The bottom surface 411a of the first member 411 is formed as a concave cylindrical surface. Additionally, an air passage (not shown) for supplying or drawing air is formed in the first member 411. This air passage extends from the side surface of the first member 411 to the bottom surface 411a. An air pipe 48 for fluidly connecting this air passage to the drive unit (not shown) of the contouring mechanism is connected to the side surface of the first member 411.

[0075] The fourth member 414 is held in a manner that allows it to swing in two dimensions relative to the first member 411. Furthermore, the upper surface 414a of the fourth member 414 is formed as a convex cylindrical surface corresponding to the concave cylindrical surface of the bottom surface 411a of the first member 411. The retainer holds the fourth member 414 in a manner that does not impede its swinging. The fourth member 414 is referred to as the first movable member.

[0076] The fourth member 414 is configured such that its rotation center is located on the lower surface of the bare sheet D held by the collet 42. Therefore, the convex cylindrical surface of the upper surface 414a of the fourth member 414 is a cylindrical surface smaller than a semi-cylindrical surface. The concave cylindrical surface of the bottom surface 411a of the first member 411 is also a cylindrical surface smaller than a semi-cylindrical surface. Within the movable range of the fourth member 414, the cylindrical surface of the convex cylindrical surface of the upper surface 414a is the same size as the cylindrical surface of the concave cylindrical surface of the bottom surface 411a of the first member 411.

[0077] The bottom surface 414b of the fourth component 414 is formed as a concave cylindrical surface. Additionally, an air passage (not shown) for supplying or drawing air is formed in the fourth component 414. This air passage extends from the side surface of the fourth component 414 to the bottom surface 414b. An air pipe 49 for fluidly connecting this air passage to the drive unit (not shown) of the contouring mechanism is connected to the side surface of the fourth component 414.

[0078] The second member 412 is held in a manner that allows it to swing two-dimensionally relative to the fourth member 414. A collet 42 is provided at the lower end of the second member 412, and the second member 412 can swing together with the collet surface 42a. Furthermore, the upper surface 412a of the second member 412 is formed as a convex cylindrical surface corresponding to the concave cylindrical surface of the bottom surface 414b of the fourth member 414. The holding member holds the second member 412 in a manner that does not hinder its swinging. The second member 412 is referred to as the second movable member.

[0079] The second member 412 is configured such that its rotation center is located on the lower surface of the bare sheet D held by the collet 42. Therefore, the convex cylindrical surface of the upper surface 412a of the second member 412 is a semi-cylindrical surface or a cylindrical surface smaller than a semi-cylindrical surface. The concave cylindrical surface of the bottom surface 414b of the fourth member 414 is also a cylindrical surface smaller than a semi-cylindrical surface. Within the movable range of the second member 412, the cylindrical surface of the convex cylindrical surface of the upper surface 412a of the second member 412 is the same size as the cylindrical surface of the concave cylindrical surface of the bottom surface 414b of the fourth member 414.

[0080] Preferably, for example, positioning guides are provided in each retainer to prevent deviation along the axial direction at the mating portion of each cylindrical surface, so as to prevent center deviation.

[0081] (The operation of the tilting mechanism) Figure 6 (c) is a front view showing the state of the mounting head after tilt adjustment. Figure 6 (d) is a left view showing the state of the mounting head after tilt adjustment. Additionally, Figure 6 (c) only illustrates the inclination of the mounting surface Sa about the Y-axis relative to the horizontal plane. Figure 6 (d) only illustrates the inclination of the mounting surface Sa about the X-axis relative to the horizontal plane.

[0082] The contouring mechanism ejects compressed air from the bottom surface 411a of the first component 411, thereby separating the fourth component 414 from the first component 411 and supporting the fourth component 414 in a non-contact state. Similarly, the contouring mechanism ejects compressed air from the bottom surface 414b of the fourth component 414, thereby separating the second component 412 from the first component 411 and supporting the second component 412 in a non-contact state. Furthermore, by stopping the supply of compressed air and evacuating the fourth component 414, the fourth component 414 is fixed in a predetermined posture. Likewise, by stopping the supply of compressed air and evacuating the second component 412, the second component 412 is fixed in a predetermined posture.

[0083] The placement head 41 is lowered using the control unit 80. When the placement head 41 lands on the substrate S, the contouring mechanism is released, and the lower surface Da of the die D comes into contact with the mounting surface Sa. In the released state, the second member 412 and the fourth member 414 swing until the entire lower surface Da of the die D contacts the mounting surface Sa and the lower surface Da of the die D becomes parallel to the mounting surface Sa. Then, at the moment when they are parallel, the contouring mechanism is switched to a fixed state. By restricting the swing of the second member 412 and the fourth member 414, the parallelism of the lower surface Da of the die D relative to the mounting surface Sa can be maintained with high precision. Then, the contouring mechanism raises the placement head 41 in the fixed state.

[0084] (Tilt adjustment of the placement head) When the upper part of the first component 411 is fixed to the third component 413 in an angle-adjustable manner (in the case of having a rotation adjustment mechanism), and... Figure 5 Similarly, the placement head shown in (a) can also be tilted during mechanical adjustments of the device, such as when the device is started or the placement head is replaced.

[0085] and Figure 5 (b) ~ Figure 5 Similarly, in step (d), each time the bare die D held in the mounting head 41 is placed (mounted) on the substrate S, the tilt adjustment is performed during operation.

[0086] In addition to having the same effects as the embodiments, this form also has at least one of the following effects.

[0087] (a) The contouring mechanism must be a non-wobbly structure. It is easier to make a non-wobbly concave-convex semi-cylindrical surface than a non-wobbly concave-convex hemispherical surface.

[0088] (b) Since orthogonal cylindrical surfaces are used for face-to-face contact, the direction of θ rotation (around the Z-axis) can be fixed without unevenness. The direction of θ rotation is not free, so a mechanism to suppress the amount of θ rotation is not required.

[0089] The above description, based on the embodiments, details the disclosure made by the present discloser. However, this disclosure is not limited to the above embodiments and various modifications are possible. Furthermore, the above-described forms can be appropriately combined.

[0090] For example, in one embodiment, an example is described where the contouring mechanism is located on the placement head side (clamp side). The contouring mechanism can also be located on the placement table side.

[0091] In the embodiments, an example using a die bond film is described. This disclosure is not limited to this; a pre-forming section for applying adhesive can also be provided on the substrate without using a die bond film. The pre-forming section includes a pre-forming head for applying a paste-like adhesive and a pre-forming worktable for driving the pre-forming head in the vertical and horizontal directions.

[0092] In one embodiment, a die mounting machine is described that uses a pick-up head to pick up a die from a wafer supply unit and place it on an intermediate stage, and uses a mounting head to mount the die placed on the intermediate stage onto a substrate. This disclosure is not limited thereto, and can be applied to die mounting apparatuses that pick up dies from a wafer supply unit.

[0093] For example, it can also be applied to die mounters that do not have intermediate stage and pick-up head, and use a mounting head to mount the bare dies from the wafer supply section onto the substrate.

[0094] In addition, it can be applied to flip chip mounting machines that do not have an intermediate stage, pick up bare dies from the wafer supply section, flip the pick-up head up and down to hand the bare dies over to the mounting head, and use the mounting head to mount them onto the substrate.

Claims

1. A bare die mounting apparatus, wherein, The bare die mounting device includes: The mounting head is configured to have a fixed member and a movable member. The movable member has a clip at its lower end for adsorbing bare wafers and is oscillating relative to the fixed member. The rotation center of the movable member is located on the lower surface of the bare wafer. A mounting stage for placing substrates; and The control unit is configured to control the placement head to make the lower surface of the bare die conform to the upper surface of the substrate held on the placement stage each time the bare die is placed on the substrate.

2. The die mounting apparatus according to claim 1, wherein, The mounting head is configured to switch between a released state, in which the movable component can swing, and a fixed state, in which the swing of the movable component is restricted.

3. The die mounting apparatus according to claim 2, wherein, The control unit is configured to switch between the release state and the stationary state by ejecting compressed air and creating a vacuum.

4. The die mounting apparatus according to claim 1, wherein, The fixed member has a concave spherical surface on its lower surface, and the movable member has a convex spherical surface on its upper surface.

5. The die mounting apparatus according to claim 1, wherein, The movable member has a first movable member that is oscillating relative to the fixed member, and a second movable member that is oscillating relative to the first movable member. The mounting head is configured such that the rotation center axis of the first movable member is orthogonal to the rotation center axis of the second movable member.

6. The die mounting apparatus according to claim 5, wherein, The mounting head is configured such that the rotation center axis of the first movable member and the rotation center axis of the second movable member are located in the same horizontal plane.

7. The die mounting apparatus according to claim 5, wherein, The fixing member has a concave cylindrical surface on its lower surface. The first movable member has a convex cylindrical surface on its upper surface and a concave cylindrical surface on its lower surface. The second movable member has a convex cylindrical surface on its upper surface.

8. The die mounting apparatus according to claim 1, wherein, The mounting head also includes a rotation adjustment mechanism for the fixing component.

9. The die mounting apparatus according to claim 8, wherein, The rotation adjustment mechanism is configured to adjust the rotation of the fixed member about an axis extending in a first direction along the horizontal direction and about an axis extending in a second direction, which is orthogonal to the first direction in the horizontal direction.

10. A die mounting method, wherein the die mounting method is performed using the die mounting apparatus according to any one of claims 1 to 9, wherein, The bare die mounting method includes the following steps: The mounting head holding the bare die is lowered; Before or immediately after the die is about to land on the substrate, the movable member is allowed to swing, and the mounting head presses the die to achieve face-to-face mating between the die and the substrate. Limiting the swing of the movable member to allow the mounting head to mount the bare die; and This causes the mounting head to rise.

11. A method for manufacturing a semiconductor device, wherein, The method for manufacturing the semiconductor device includes the die mounting method as described in claim 10.

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