Multi-layer embossing with stress relief features

Abstract

Multilayer packaging articles may include embossing formed on each layer. The packaging article may be formed from multiple webs. Embossing devices may locally deform one web layer into another stacked web layer to form an embossing. The web may include features that allow the web material to deform with little or no tearing of the web material.

Description

Background Technology

[0001] Packaging materials are widely used to protect small to medium-sized items shipped in e-commerce and other applications. They are typically placed inside shipping boxes or other containers containing the items and can be used to cushion or insulate them during transport.

[0002] Many common packaging materials, such as inflatable mattresses or pillows, are made from plastic materials, such as polyethylene. However, paper-based packaging materials are gaining popularity due to paper's environmentally friendly properties, such as its recyclability. However, the use of paper-based packaging materials can present challenges. For example, paper is more easily torn than plastic film, which may limit the ability to shape or otherwise process paper-based raw materials into packaging articles with sufficient bulk to provide satisfactory cushioning or insulation. Summary of the Invention

[0003] In one aspect of the disclosed technology, a web for use with an embossing apparatus includes a first substrate layer and an adhesive element disposed on the first substrate layer. The first substrate layer includes a plurality of weakened regions, each weakened region having one or more cuts formed therein, the one or more cuts being asymmetrically arranged around the center of the weakened region and configured to facilitate displacement of the weakened region by a die of the embossing apparatus to form an embossing on the first substrate layer.

[0004] In another aspect of the disclosed technology, the web includes: a second substrate layer stacked on a first substrate layer and having a plurality of weakened regions, each weakened region having one or more cutouts formed therein, the one or more cutouts being asymmetrically arranged around the center of the weakened region on the second substrate layer. An adhesive element is disposed between the first and second substrate layers and configured to secure the first substrate layer to the second substrate layer; each weakened region on the second substrate layer covers an associated weakened region on the first substrate layer; and the weakened regions on the first and second substrate layers are configured to facilitate displacement of the weakened regions when a mold presses a weakened region of the first substrate layer into an associated weakened region of the second substrate layer to form an embossing on the first and second substrate layers.

[0005] In another aspect of the disclosed technology, at least one of the first substrate layer and the second substrate layer comprises paper.

[0006] In another aspect of the disclosed technology, at least one of the first substrate layer and the second substrate layer comprises ordinary kraft paper.

[0007] In another aspect of the disclosed technology, at least one of the first substrate layer and the second substrate layer includes stretchable paper.

[0008] In another aspect of the disclosed technology, one or more cuts in each weakened region of the first substrate layer and the second substrate layer include helical cuts.

[0009] In another aspect of the disclosed technology, each of the spiral cuts in the first substrate bends around the center of the spiral cut in the first substrate along a first direction, and each of the spiral cuts in the second substrate bends around the center of the spiral cut in the second substrate layer along a second direction opposite to the first direction.

[0010] In another aspect of the disclosed technology, one or more cuts in each weakened region of the first substrate layer include helical cuts, and one or more cuts in each weakened region of the second substrate layer include a plurality of intersecting linear cuts.

[0011] In another aspect of the disclosed technology, the first substrate layer and the second substrate layer are formed from C-shaped folded sheets.

[0012] In another aspect of the disclosed technology, the bonding element includes a thermally activatable material. The thermally activatable material may include a thermally sealable material or a hot-melt adhesive. Furthermore, the thermally sealable material may include a polymer dispersion coating or a thermoplastic material.

[0013] In another aspect of the disclosed technology, the cut includes a perforated line extending across the weakened region.

[0014] In another aspect of the disclosed technology, the web used in conjunction with the embossing device forms a packaging article.

[0015] In another aspect of the disclosed technology, a system for forming a packaged article includes: a supply device comprising a first substrate layer, a second substrate layer stacked on the first substrate layer, and an adhesive element disposed between the first and second substrate layers and configured to secure the first substrate layer to the second substrate layer. At least one of the first and second substrate layers includes a plurality of weakened regions, each weakened region having one or more cuts formed therein, the cuts being asymmetrically arranged around the center of the weakened region. The system also includes an embossing device comprising a die configured to press the first substrate layer into the second substrate layer at the weakened regions to form an embossing on the first and second substrate layers. The cuts in at least one of the first and second substrate layers are configured to facilitate displacement of the weakened regions as the die presses the first substrate layer into the second substrate layer at the weakened regions.

[0016] In another aspect of the disclosed technology, a weakened region is formed in a first substrate layer and a second substrate layer, a mold is configured to press the weakened region of the first substrate layer into an associated weakened region of the second substrate layer to form an embossing, and the weakened region is configured to facilitate displacement of the weakened region when the mold presses the weakened region of the first substrate layer into the associated weakened region of the second substrate layer to form an embossing.

[0017] In another aspect of the disclosed technology, the cut is configured to act as a stress-relieving feature that minimizes or prevents tearing of the first substrate layer or the second substrate layer when the mold presses the first substrate layer into the second substrate layer at a weakened region and / or during embossing.

[0018] In another aspect of the disclosed technology, the mold is configured to heat the thermally activated material.

[0019] In another aspect of the disclosed technology, the mold includes a first roller and a second roller, the first roller having a plurality of protrusions and the second roller having a plurality of recesses formed therein, the first roller and the second roller being configured such that each of the protrusions aligns with and enters a corresponding recess when the first roller and the second roller rotate synchronously, and the protrusions being configured to press the first substrate layer into the second substrate layer at a weakened region to form embossing when the first substrate layer and the second substrate layer pass between the first roller and the second roller.

[0020] In another aspect of the disclosed technology, the system includes an applicator configured to apply an adhesive element to at least one of the first and second substrate layers before the first and second substrate layers reach the mold.

[0021] In another aspect of the disclosed technology, a packaging article unit includes: an adhesive element; a first substrate layer having an embossed pattern; and a second substrate layer having an embossed pattern, the embossing on the second substrate layer being positioned within the embossing on the first substrate layer and secured to the embossing on the first substrate layer by the adhesive element. The embossing on at least one of the first and second substrate layers has one or more cuts therein, the cuts being asymmetrically arranged around the center of the embossing. The one or more cuts in the packaging article may be generally helical. Furthermore, the first and second substrate layers may be formed from C-shaped folded sheets.

[0022] In another aspect of the disclosed technology, a method for forming a web for use with a molded component includes: providing a supply device including a first substrate layer, a second substrate layer stacked on the first substrate layer, and an adhesive element disposed between the first substrate layer and the second substrate layer and configured to secure the first substrate layer to the second substrate layer, at least one of the first substrate layer and the second substrate layer including a plurality of weakened regions, each weakened region having one or more cuts formed therein, the cuts being asymmetrically arranged around the center of the weakened region; providing an embossing device configured to receive the first substrate layer and the second substrate layer and including a mold; and using the mold to press the first substrate layer into the second substrate layer at the weakened regions to form embossing on the first substrate layer and the second substrate layer.

[0023] In another aspect of the disclosed technology, weakened regions are formed in a first substrate layer and a second substrate layer, and the method further includes using a mold to press the weakened regions of the first substrate layer into associated weakened regions of the second substrate layer to form embossing.

[0024] In another aspect of the disclosed technology, the bonding element includes a thermally activatable material, and the method further includes heating the thermally activatable material.

[0025] In another aspect of the disclosed technology, the method includes heating the thermally activatable material while pressing the first substrate layer into the second substrate layer at the weakened region.

[0026] In another aspect of the disclosed technology, the method includes heating the thermally activatable material before it reaches the mold.

[0027] In another aspect of the disclosed technology, a system for forming packaged articles includes: a supply device comprising: a first substrate layer including a plurality of weakened regions, each weakened region having one or more cutouts formed therein; and a second substrate layer stacked on the first substrate layer and including a plurality of removable patches, each patch configured to align with a corresponding weakened region on the first substrate; and an embossing device including a die configured to press the patches into the corresponding weakened regions on the first substrate to form an embossing on the first substrate. The cutouts in the first substrate layer are configured to facilitate displacement of the weakened regions as the die presses the patches into the corresponding weakened regions.

[0028] In another aspect of the disclosed technology, a web for use with an embossing device includes: a first substrate layer including a plurality of weakened regions, each weakened region having one or more cutouts formed therein; and a second substrate layer stacked on the first substrate layer and including a plurality of removable patches, each patch being configured to align with a corresponding weakened region on the first substrate. Attached Figure Description

[0029] The following figures illustrate specific embodiments of this disclosure and therefore do not limit the scope of this disclosure. Embodiments of this disclosure will be described below in conjunction with the accompanying drawings, wherein the same numerals denote the same elements.

[0030] Figure 1 This is a perspective view of an embossing system used to produce embossed packaging products from webs;

[0031] Figure 2 yes Figure 1 The bottom perspective view of the packaged product shown;

[0032] Figure 3 yes Figure 1 The top view of the web in its unassembled state;

[0033] Figure 4 yes Figure 1 The side view of the embossing device of the system shown;

[0034] Figure 5 yes Figure 1 and Figure 3 An enlarged view of the weakened area of ​​the web shown;

[0035] Figure 6 yes Figure 1 and Figure 3 Enlarged view of the weakened area in the alternative embodiment of the web shown;

[0036] Figure 7 yes Figure 1 and Figure 3 An enlarged view of the weakened region in another alternative embodiment of the web shown;

[0037] Figure 8 yes Figure 1 and Figure 3 An enlarged view of the weakened region in another alternative embodiment of the web shown;

[0038] Figures 9 to 12 yes Figure 4 Side view of an alternative embodiment of the embossing device shown;

[0039] Figure 13 It is used with Figure 12A perspective view of the web used with the embossing device in its unassembled state; and Detailed Implementation

[0040] The inventive concept is described with reference to the accompanying drawings, wherein the same reference numerals denote the same parts and components in the various views. Several aspects of the inventive concept are described below with reference to exemplary applications. It should be understood that numerous specific details, relationships, and methods are set forth to provide a comprehensive understanding of the inventive concept. However, those skilled in the art will readily recognize that the inventive concept can be practiced without one or more specific details or by other methods. In other instances, well-known structures or operations are not shown in detail to avoid obscuring the inventive concept.

[0041] Packaging containers can include parcel packaging and other containers for packaging items. Packaging containers are configured to contain and hold items during transport or storage, typically enclosing them. Parcel packaging is configured for transporting and / or storing products, such as for storage in warehouses or on retail shelves and displays. Examples of parcel packaging include flexible transport containers, such as envelopes, which can have varying degrees of flexibility and are typically used for transporting or mailing smaller or relatively flat items, with the walls of the envelope conforming to the sides of these items. Flexible transport containers (such as envelopes) can be padded or unpadded, can be made of materials such as paper and flexible cardboard, can be configured with or without side walls or corner braces, and can include larger envelopes (such as mail bags). Examples of parcel packaging also include bags, such as paper bags or polyethylene bags, which may have self-sealing capabilities and are typically used to transport small to medium-sized items; boxes, which may be formed from cardboard, hardboard, wood or plastic, and typically have a rigid or semi-rigid structure suitable for holding medium to large and heavier items; and transport tubes or tubular mail bags, typically used to transport documents and paper products.

[0042] Figure 1 and Figure 2 Packaging article 10 is shown. Packaging article 10 has multiple raised areas formed thereon, in the form of embossing 42. Packaging article 10 can be placed inside boxes or other types of transport containers to cushion and protect items stored or transported within the transport container. In some applications, packaging article 10 can be used to thermally insulate stored or transported items. These applications are shown for illustrative purposes only. Packaging article 10 can be used in other applications and in other ways.

[0043] Figure 3 A web 31 in a pre-assembled state, which can be formed into a packaged article 10, is shown. The web 31 can also be seen in... Figure 4 The web 31 includes a first layer 12, a second layer 14, and an adhesive element 16. The first layer 12 covers the second layer 14, and as shown... Figure 4 As can be seen, the adhesive element is arranged between the first layer 12 and the second layer 14. In... Figure 1 and Figure 2 In the fully formed packaging article 10 shown, the first layer 12 is secured to the second layer 14 by an adhesive element 16. The packaging article 10 may have a width of, for example, about 15 inches. Alternative embodiments of the packaging article 10 may have a width greater than or less than 15 inches.

[0044] The bonding element 16 can be a heat-activated material, such as a heat-activated thermoplastic adhesive. For example, the bonding element 16 can be a hot melt adhesive, a heat-sealing material, or a polymer dispersion. Alternatively, other types of heat-activated materials can also be used.

[0045] In other alternative embodiments, the adhesive element 16 may be a pressure-sensitive adhesive, a coagulant, or another type of adhesive element that does not require activation by applying heat to it.

[0046] In some applications, the adhesive element 16 may be activated during the manufacture of the web 31. In other applications, the adhesive element 16 may be activated at some point after the web 31 has been manufactured. The adhesive element 16 is configured to remain stable after being applied to the first layer 12 and / or the second layer 14, thereby allowing the web 31 to be stored without sealing or otherwise isolating it from the surrounding environment. For example, this may allow the web 31 to be manufactured at one location and then transported unsealed to the end user for conversion into packaged articles 10 at the user's facility, as described below. In some applications, the web 31 may be placed in a polyethylene bag or other suitable container immediately or shortly after manufacture to help stabilize the adhesive element 16.

[0047] Unless otherwise specified herein, the term "stability" should be understood in its ordinary and conventional sense, as recognized by those skilled in the art, and may also include the ability to maintain one or more properties over a predetermined period of use (e.g., within the manufacturer-approved service life). For example, physical or chemical properties remain substantially constant at room temperature over the predetermined period of use. "Substantially constant," unless otherwise indicated, means within approximately 10% of the stated value of the indicator. In other words, chemical reactivity may be insignificant and / or the tendency to undergo physical changes is minimal over the predetermined period of use.

[0048] Stability can be measured according to one or more standards known to those skilled in the art, such as the known ASTM and ISO standards. Stability can also be defined by one or more physical or chemical properties, such as the ability to maintain one or more physical or chemical properties over a period of "use duration". Properties can include, but are not limited to, capillary action, chemical reactivity (e.g., solubility in water and substrates), rheological properties, peel strength, heat sealability, shear strength and tensile strength, tackiness, viscosity, elasticity, hardness, phase, crystal structure, chemical structure, and chemical composition. For example, peel strength falling within the range of about 0.2 lb / in to about 10 lb / in and viscosity falling within the range of about 1,000 cP to about 5,000 cP under non-drying conditions are envisioned.

[0049] Stability may also include the ability to maintain one or more properties required to form a bond of predetermined strength. The bond of predetermined strength can be measured according to one or more standards known to those skilled in the art, such as ASTM or ISO. For example, standards related to adhesives or adhesive properties (including but not limited to heat sealing, shear strength, tensile strength, and peel strength) can be used as a measure of the predetermined bond strength.

[0050] Furthermore, adhesive stability can be defined by its ability to maintain relevant physical and chemical properties (such as those previously discussed) after the adhesive has been exposed to certain conditions (e.g., ambient environment) for a period of time. Ambient environment can be defined, for example, a temperature ranging from about -25°F to about 95°F and a relative humidity ranging from about 20% to about 95%.

[0051] In the context of a thermally activated material configured to form a bond between two opposing substrates, "duration of use" can refer to the period from the manufacture of the material to its activation to form a bond. For example, in the context of adhesive element 16, the duration of use can include the time between applying adhesive element 16 to the first and second layers 12, 14 and shipping adhesive element 16 to the end user and activating it (heating it). This duration of use is sometimes referred to as "shelf life".

[0052] The duration of use can depend on environmental conditions and other external factors, and is typically specified within a range of one or more environmental conditions such as temperature and humidity.

[0053] Return to reference Figure 3The adhesive element 16 can be configured to maintain one or more selected material properties necessary for the thermally activated material to form a bond with a predetermined percentage of strength (e.g., 70%, 75%, 80%, 85%, 90%, 95%) after activation. It should be noted that the adhesive element 16 can be configured to retain one or more selected properties after being applied to layers 12 and / or 14. Furthermore, the adhesive element 16 can be configured to form such a bond after exposure to the environment for a period of time (e.g., 12 hours, 48 ​​hours, one month, two years, five years, ten years, or various other usage durations). For example, the adhesive element 16 can be applied to layers 12 and / or 14 at a first time point and then activated at a later time point, wherein the duration of the time between the application of the adhesive element 16 and the application of the adhesive element 16 maintains, for example, peel strength or other material properties above a target threshold. This configuration allows the adhesive element 16 to be applied to layers 12 and / or 14 at a first location and activated at a second location. In some embodiments, the adhesive element 16 may be applied to layers 12, 14 at a first location, and then layers 12, 14 may be embossed at a second location and the adhesive element may be activated.

[0054] Adhesive elements formed from thermoplastic materials can be advantageous compared to those formed from thermosetting materials because thermoplastic materials do not solidify when heat is applied, thus allowing the adhesive element to be thermally activated multiple times, for example, during formation and during sealing. Furthermore, thermoplastic materials do not undergo chemical degradation or combustion upon reheating.

[0055] In some embodiments, the bonding element 16 may comprise a thermoplastic material. In such embodiments, the bonding element 16 may be first heated and cooled when applied to layers 12 and / or 14, and then heated a second time when bonding and / or embossing the first and second layers 12, 14.

[0056] Hot melt adhesives are thermoplastic polymers that are solid at room temperature. They melt when heated to an activation temperature above their softening point and then re-cure as they lose heat at a temperature below their freezing point (which may be the same as or different from the activation temperature), gaining strength as they re-cure. Most hot melt adhesives do not undergo any chemical reactions, such as crosslinking or carrier removal (e.g., water evaporation), during their melting and re-curing. Therefore, hot melt adhesives can often be reactivated after initial application to a substrate, i.e., remelted and re-cured.

[0057] Hot melt adhesives can be in a low-tack state after being applied to the surfaces to be bonded, in which state they have low tack or no tack within a lower temperature range. Hot melt adhesives are applied thermally and then cool and cure during the conversion process. Hot melt adhesives are reactivated by reheating them to an activation temperature within a lower temperature range. For example, in some embodiments, this lower application temperature range is below about 140°F. In other embodiments, for example, the lower temperature range is below about 120°F, below about 125°F, or below about 130°F.

[0058] Reheating the hot melt adhesive to its activation temperature causes it to melt. The subsequent cooling of the hot melt adhesive, combined with the application of pressure, causes it to bond with the opposing surfaces, thereby forming a seal between the surfaces.

[0059] Heat sealing is typically achieved by sealing one thermoplastic material onto the same or similar thermoplastic material. The thermoplastic heat-sealing material is usually applied to two substrates to be fixed together. When fixing the substrates, the thermoplastic materials are subjected to heat and pressure sufficient to weld the heat-sealing material on the opposing substrates together, thereby securing the substrates together.

[0060] In some embodiments, the material used to form the adhesive element 16 may include one or more polymers, including emulsion polymers. The one or more polymers may include one or more of ethylene vinyl acetate, polyvinyl acetate, polyvinyl alcohol, polyvinyl acetate copolymers, polyvinyl alcohol copolymers, dextrin-stabilized polyvinyl acetate, vinyl acetate copolymers, ethylene copolymers, vinyl acrylates, styrene acrylates, acrylates, styrene-butyl rubber, polyurethane, polyolefins, and biodegradable materials (e.g., cellulose and starch). For example, the heat-sealing material may be polyvinyl alcohol (PVOH), which is coated on the surface of the first layer 12 and / or the surface of the second layer 14. In some applications, the PVOH may be coated with polyethylene (PE) or polylactic acid (PLA) to prevent the PVOH from sticking together or absorbing moisture and causing sticking.

[0061] In some embodiments, the bonding element 16 may include a polyolefin-based dispersion. The polyolefin dispersion may include polyethylene and / or polypropylene, thermoplastic polymers, polymer stabilizers including at least one polar polymer, water, and / or other suitable polyolefin dispersions. Suitable polyolefin dispersions may include, for example, HYPOD™ from Dow Chemical, or other suitable polyolefin dispersions.

[0062] In some embodiments, the adhesive element 16 may be water-based. The water-based adhesive element 16 may comprise a water-based polymer. The use of the water-based adhesive element 16 can improve the recyclability of the packaging article 10 because the water-based adhesive element 16 can be easily dissolved and separated from the pulp during recycling.

[0063] Adhesive materials include those that cause one surface to adhere to an opposing surface by contact with the same or complementary adhesive substance to form a bond between the two surfaces. Adhesives are insufficient to adhere to other substances, or in some cases, adhere very weakly compared to the bond formed by their adhesion to each other.

[0064] The first and second layers 12, 14 can be formed from paper sheets. The paper can be, for example, conventional kraft paper having a basis weight of, for example, about 65 grams per square meter to about 122 grams per square meter. Alternatively, the paper can have other basis weights. In other alternative embodiments, the paper can be stretchable paper.

[0065] As used herein, the term "paper" can include, for example, materials composed of cellulose fibers, biodegradable materials, and recyclable components derived from a variety of sources, such as wood, cotton, pulp, rags, grass, plant matter, or other plant materials. It can also include synthetic fibers or composite materials. Paper can also include additives, synthetic polymers, or special coatings to enhance properties such as strength, opacity, or water resistance. The paper can also include paper-like materials that mimic the properties of conventional paper but are made from alternative sources or through novel manufacturing processes.

[0066] The first and second layers 12, 14 may include polymers, such as polyolefins, polyethylene, polypropylene, polyester, etc.; paper, such as paperboard, kraft paper, fiberboard, pulp-based paper, recycled paper, newsprint, and coated paper, such as paper coated with wax, plastic, water-resistant materials, and / or stain-resistant materials; cellulose; foil; polymers or synthetic materials; biodegradable materials; and / or other suitable materials of appropriate thickness, weight, and size. The first and second layers 12, 14 may also include recyclable materials, such as recyclable paper or plastic.

[0067] refer to Figure 3 The first layer 12 has a plurality of weakened regions 20 formed therein. Similarly, the second layer 14 has a plurality of weakened regions 21 formed therein. The first layer 12 and the second layer 14 are configured such that when the first layer 12 is overlaid on the second layer 14, each weakened region 20 is aligned with a corresponding weakened region 21. Each of the aligned weakened regions 20, 21 forms a pair of weakened regions 26.

[0068] The weakened regions 20 and 21 can be aligned with each other by overlaying the first layer 12 onto the second layer 14. In some embodiments, the two sheets can be stacked to form the first layer 12 and the underlying second layer 14. In an alternative embodiment, a single sheet can be folded in a C-shape along a fold line to form the first layer 12 and the underlying second layer 14.

[0069] Each of the weakened regions 20, 21 may have at least one cut 24 therein. The cut 24 helps define the weakened region 20, 21 and can serve as a stress-relief feature that helps to move the weakened region 20, 21 out of the plane of the first or second layer 12, 14, thereby forming embossing 42 while leaving the first and second layers 12, 14 with little or no tearing. Each cut 24 may extend through the entire thickness of the first and second layers 12, 14. In an alternative embodiment, the cut 24 may be an indentation line extending through a thickness less than the entire thickness of the first and second layers 12, 14. In other alternative embodiments, the cut 24 may be a perforation. In other alternative embodiments, the cut 24 may be a thinned region on the first or second layer 12, 14. In other alternative embodiments, the cut 24 may be a dotted puncture, a through-hole, an opening, etc.

[0070] like Figures 5 to 7 As shown, the cut 24 can have a spiral shape. Figure 5 In one embodiment, a spiral cut 24 is formed in each weakened region 20, 21. Figure 6 In one embodiment, two non-intersecting helical cuts 24 are formed in each weakened region 20, 21. Figure 7 In one embodiment, two helical cuts 24 intersecting at their inner ends are formed in each weakened region 20, 21. In an alternative embodiment, the cuts 24 may have a shape other than a helix. For example, Figure 8 Multiple linear cuts 24a formed in the second layer 14a are shown. Figure 8 In the illustrated embodiment, the plurality of linear cuts 24a may form one or more trapezoidal lobes.

[0071] like Figure 5 As shown, the spiral cuts 24 in each pair of weakened regions 20, 21 can be offset at an angle to each other. For example, the spiral cuts 24 in each pair of weakened regions 20, 21 can extend in opposite directions. In an alternative embodiment, the cuts 24 in each pair of weakened regions 20, 21 can extend in the same direction.

[0072] In some embodiments, the weakened regions 20, 21 are aligned such that at least one cut in each weakened region 20, 21 is aligned with each other in a specific manner. For example, cuts 24 may be reverse mirror images of each other. For example, in embodiments including helical cuts 24, weakened region 20 may include a helical cut 24 that starts from the origin and extends from the origin along a first direction to form a helix. Similarly, weakened region 21 may include a helical cut 24 that starts from the origin and extends from the origin along a second direction to form a helix. The first direction may be opposite or substantially opposite to the second direction, such that the corresponding helical cuts 24 of the corresponding weakened regions 20, 21 are reverse mirror images. In embodiments where layers 12 and 14 are stacked on top of each other by C-shaped folds, the helical cuts 24 on the first side of the fold line may extend along the first direction, and the helical cuts 24 on the second side of the fold line may extend along the second direction.

[0073] In an alternative embodiment, each cut 24 in the corresponding weakened regions 20, 21 may have the same configuration (e.g., a spiral cut 24 or multiple linear cuts 24a), but may be offset linearly or angularly from each other when the first layer 12 and the second layer 14 are stacked on top of each other. In an embodiment where the first and second layers 12 and 14 are stacked on top of each other by a C-shaped fold, the cuts 24 may be asymmetrically distributed on both sides of the fold line, such that the cuts 24 in the corresponding weakened regions 20, 21 are offset from each other after folding along the fold line.

[0074] In alternative embodiments, the cuts 24 corresponding to the weakened regions 20 and 21 can have different configurations. For example, weakened region 20 can have cuts configured as a plurality of linear cuts 24a, and weakened region 21 can have cuts configured as spiral cuts 24, such as... Figure 8 As shown. In embodiments where layers 12 and 14 are stacked on top of each other by C-shaped folds, the cuts may be distributed symmetrically or asymmetrically on both sides of the fold line.

[0075] The cutout 24 in the first layer 12 can serve as a stress-relieving feature to allow the weakened region 20 on the first layer 12 to move out of the initial plane of the first layer 12, while ensuring that adjacent portions of the first layer 12 are almost un-torn or un-torn. Similarly, the cutout 24 in the second layer 14 can serve as a stress-relieving feature to allow the weakened region 21 on the second layer 14 to move out of the initial plane of the second layer 14, while ensuring that adjacent portions of the second layer 14 are almost un-torn or un-torn. The initial plane of the first and second layers 12, 14 refers to the plane within which the first and second layers 12, 14 were respectively in a flat state before the weakened regions 20, 21 were displaced.

[0076] During the formation of the packaged article 10, the weakened region 20 of each pair of 26 weakened regions 20, 21d is moved out of the initial plane of the first layer 12 and shifted toward and into the corresponding weakened region 21. The weakened regions 20, 21 are moved out of the initial plane of the second layer 14 together, such that the weakened region 20 is nested within the weakened region 21, and the shifted pair of 26 weakened regions 20, 21 forms an embossing 42 on the second layer 14. Thus, the first layer and the second layer 12, 14 are subjected to embossing, and each of the embossed patterns 42 formed therefrom comprises two layers consisting of the weakened regions 20 of the first layer 12 and the corresponding weakened regions 21 of the second layer 14.

[0077] Figure 2 The bottom side of the fully formed packaged article 10 is shown. (See image.) Figure 2 As can be seen, the cuts 24 in the first and second layers 12, 14 have allowed the material forming the first and second layers to expand in the embossing area, thereby causing discontinuities within the embossing 42, including gaps 49 extending through the first and second layers 12, 14.

[0078] like Figure 1 and Figure 2 As shown, all the embossing 42 extends in the same direction from the initial plane of the first and second layers 12. In an alternative embodiment of the packaging article 10, some (e.g., half) of the embossing 42 may extend along... Figure 1 and Figure 2 The embossing 42 extends in the direction shown, and the remaining embossing 42 may extend in the opposite direction. In other alternative embodiments, the embossing 42 may be arranged in rows extending diagonally across the packaged article.

[0079] The bonding element 16 can be heated while the weakened regions 20, 21 are being displaced. Heating the bonding element 16 activates a thermally activated material, which, in conjunction with the pressure associated with pressing the weakened region 20 into the weakened region 21, causes the bonding element 16 to form an adhesive that holds the weakened regions 20, 21 (and the first and second layers 12, 14) together. Heat can be applied to the bonding element 16 by rollers, dies, or other means used to displace the weakened regions 20, 21; that is, the rollers or dies can be heated rollers or heated dies. Alternatively or additionally, heat can be applied by a heating device such as a blower, infrared heater, etc. In some embodiments, the bonding element 16 can be preheated prior to the embossing step.

[0080] The temperature to which the bonding element 16 is heated, the pressure applied to the weakened regions 20, 21, and the residence time (i.e. the time for which pressure and heat are applied) depend on the application and can vary depending on many factors, such as the thickness and chemical properties of the bonding element 16, the thickness of the first and second layers 12, 14, the type and properties of the paper or other materials forming the first and second layers 12, 14, etc.

[0081] Heat-sealing the first and second layers 12 and 14 together increases the rigidity of the packaged product 10. Additionally, simultaneous heating and embossing of the weakened regions 20 and 21 enhances the strength and structural integrity of the embossed pattern 42.

[0082] Figure 4 An apparatus 29 for forming a packaged article 10 is shown. The apparatus 29 may be part of a system 30, which includes the apparatus 29, a web 31, and a compact single-unit embossing machine 39, wherein the apparatus is incorporated into the single-unit embossing machine. Figure 1 The diagram shows a working unit embossing machine 39. Alternatively, the device 29 can be used in applications where the device 29 is not incorporated into the working unit embossing machine 39.

[0083] The work unit embossing machine 39 can be located at the end user's facility, allowing the packaged articles 10 to be produced from the web 31 as needed (i.e., when the user requires packaged articles 10). As described above, the web 31 can be transported to the end user in a compact configuration, with the embossing 42 not yet formed and the bonding elements 16 in an inactive state. For example, the web 31 can be configured as a roll or fan-fold configuration during transport and storage.

[0084] The work unit embossing machine 39 has a relatively compact construction, which allows it to be placed on a table 8 or other work surface (table 8 is shown in FIG. 17). The work unit embossing machine 39 is configured to receive the web 31 and, while simultaneously heating the bonding element 16 to activate it, thereby forming a bond that secures the first and second layers 12, 14 to each other, form embossing 42 in the first and second layers 12, 14. For example, the work unit embossing machine 39 can be positioned in the area where the transport container is loaded before being transported. A packer (i.e., an individual worker loading the container) can use a foot pedal or other suitable device to activate the work unit embossing machine 39, causing it to produce a packaged article 10 of the desired length, from which the packer can cut or otherwise separate the packaged article 10 of the desired length from the remainder already produced by the work unit embossing machine 39. In some embodiments, such as Figure 1As shown, the finished packaging article 10 may have perforations 43 formed therein to allow a length of packaging article 10 to be separated from the remainder of the packaging article discharged from the work unit embossing machine 39. Alternatively, a supply of packaging article 10 may be produced at the end-user's facility prior to the packaging operation, and the packer may utilize this supply as needed.

[0085] Packers can wrap the packaging article 10 when the object is being packaged. Packers can wrap the object with multiple layers of packaging article 10 (as shown in Figure 17, which illustrates an alternative embodiment of the packaging article 10) to help provide maximum protection for the object. Alternatively or additionally, packers can line the shipping container with the packaging article 10, such as... Figure 1 The description.

[0086] The apparatus 29 includes a die in the form of a first roller 32 and a second roller 34. The web 31 includes first and second layers 12, 14, wherein weakened regions 20, 21 have been formed but not yet removed from their original plane; and an inactive bonding element 16 disposed between the first and second layers 12, 14. The web 31 is disposed on the first roller 32 in the form of a roll 33 of web 31. In an alternative embodiment, the web 31 may be provided in a fan-folded configuration.

[0087] The second roller 34 has a plurality of protrusions 36 formed thereon. The protrusions 36 may be dome-shaped, such that the embossing 42 formed by the protrusions 36 is also dome-shaped. In alternative embodiments, the protrusions 36 may have other shapes, depending on the desired shape of the embossing 42 to be produced by the apparatus 29. For example, in alternative embodiments, the protrusions 36 may be shaped such that the embossing 17 has an elliptical or stepped structure. In other alternative embodiments, the protrusions 36 may be configured to form valleys or ridges around each embossing 42.

[0088] The device 29 also includes a third roller 38 having a plurality of recesses 40 formed therein. The recesses have concave profiles that match the convex profiles of the protrusions 36. The second and third rollers 36, 38 rotate in opposite directions and pull the web 31 from the first roller 32. As the second rollers 36 and third rollers 38 rotate, each protrusion 36 is configured to align with a corresponding recess 40. Additionally, the web 31 is indexed into the device 29 such that each pair of weakened regions 20, 21 on the web 31 aligns with the protrusion 36 and its associated recess 40 as the pair of weakened regions 20, 21 passes between the second and third rollers 34, 38.

[0089] The protrusion 36 causes the weakened area 20 to move out of the plane of the first layer 12 and into the overlying weakened area 21 on the second layer 14. In addition, the protrusion 36 causes the weakened areas 20, 21 to move out of the plane of the second layer 14, thereby forming an embossing 42 on the newly formed packaging article 10.

[0090] Once formed, the packaged article 10 can be manually or by automated equipment cut, torn, or otherwise separated into individual parts of the required length, such as... Figure 10 As shown.

[0091] Embossing 42 can be of various sizes. For example, in some embodiments, the base of embossing 42 (i.e., the portion of embossing 42 adjacent to the adjacent non-embossed surface of the first or second layer 12, 14) can have a maximum size of about 1 / 16 inch to about 1 inch. (In the case of embossing 42, the base has a circular shape; therefore, the maximum size of the base is equal to the diameter of the base.) In some embodiments, the maximum size of the base can be about 1 / 16 inch. In other embodiments, the maximum size of the base can be about 3 / 4 inch. In other embodiments, the maximum size of the base can be about 1 / 2 inch. These size ranges are presented for illustrative purposes only. The maximum size of the base can have other values ​​in alternative embodiments.

[0092] like Figure 4 As can be seen, the height of the embossing 42 (i.e., the elevation of the peak of the embossing 42 relative to the base of the embossing 42) is less than the diameter of the base. In an alternative embodiment, the height of the embossing 42 may be approximately equal to or greater than the diameter of the base.

[0093] One or both of the second and third rollers 34, 38 can be heated such that contact between the weakened regions 20, 21 and the second and / or third rollers 34, 38 results in heating and activation of the adhesive material between the first and second layers 12, 14. In an alternative embodiment of device 29, heating can be performed by a separate heater.

[0094] In an alternative embodiment of device 29, the die may be configured as a stamping die, a blower, or another type of mechanism in place of the second roller 34 and the third roller 38.

[0095] Figure 9An alternative embodiment of device 29 is shown, which takes the form of device 50. Device 50 includes second and third rollers 34, 38 of system 30. Device 50 includes rollers 52a, 52b. Roller 52a has a first layer 12 disposed thereon in a roll configuration. Roller 52b has a second layer 14 disposed thereon in a roll configuration. The first and second layers 12, 14 are disposed on rollers 52a, 52b as corresponding rolls 53a, 53b. The first and second layers 12, 14 are respectively drawn between the second and third rollers 34, 38 and become overlapping as they pass between the second and third rollers 34, 38. As described above with respect to web 31, bonding element 16 may be disposed on the inward-facing surface of the first layer 12 and / or the second layer 14, i.e., the first layer 12 and / or the second layer 14 may be disposed on the corresponding rollers 52a, 52b with bonding element 16 disposed thereon. Figure 9 It is shown that the bonding element 16 is applied only to the second layer 14. The first and second layers 12, 14 are embossed as described above with respect to the web 31 when passing between the second and third rollers 34, 38.

[0096] In an alternative embodiment of device 50, the adhesive element 16 may be a pressure-sensitive adhesive applied to the first layer 12. When the first layer 12 is on roller 52a, the adhesive may be covered by a release strip. The device may be configured to automatically remove the release strip as the first layer 12 travels between roller 52a and second and third rollers 34, 38.

[0097] Figure 10 Another alternative embodiment of device 29 is shown, which takes the form of device 60. Device 60 is essentially the same as device 50, except that device 60 includes an applicator 62 that applies the adhesive element 16 to the second layer 14 after the second layer 14 has been unwound from roller 52a and before the second layer 14 reaches the second and third rollers 34, 38. In this embodiment, the first and second layers are disposed on the respective rollers 52a, 52b without the adhesive element 16 being applied thereto. In an alternative embodiment of device 60, the adhesive element 16 may be applied to the first layer 12 as a supplement to or alternative to the second layer 14.

[0098] Figure 11Another alternative embodiment of the device 29 is shown, in the form of system 70. System 70 is essentially the same as system 30, with the following exceptions. System 70 includes two additional rollers 72, 73, which preheat opposite sides of the web 74 before it reaches the second and third rollers 34, 38. The web 37 is disposed on the first roller 32 as a roll 77 of the web 74. In other alternative embodiments, only one of the rollers 72, 73 may be a heated roller. Additionally, device 70 may include an additional roller 75, which helps guide the newly formed packaged article 10a as it disengages from roller 38. Furthermore, the weakened regions 20 and 26 are offset such that the embossing 42 formed on the packaged article 10a is arranged in staggered rows.

[0099] Figure 12 Another alternative embodiment of device 29 is shown, which takes the form of device 80. Device 80 is configured to... Figure 13 The web 82 shown is used together. The web 82 includes a first layer 12, a layer 89, and a release layer 88. Layer 89 is disposed on the release layer 88 and includes a plurality of patches 86. The first layer 12 is provided in a rolled configuration and is disposed on a first roller 90 of the device 80. The release layer 88 and the patches 86 are provided in a rolled configuration and are disposed on a second roller 92 of the device 80. The first layer and the web 82 are corresponding rolls 91, 93 disposed on the rollers (first and second rollers 90, 92).

[0100] As the release layer 88 and patch 86, along with the first layer 12, are pulled from the corresponding second and first rolls 92, 90, the release layer 88 and layer 89 (including patch 86) are aligned with and superimposed on the first layer 12, such that each patch 86 is aligned with a corresponding weakened region 20 on the first layer 12. The resulting web 82 is aligned onto the second and third rolls 34, 38, such that each of the aligned patch pairs 86 and weakened regions 20 is aligned with a corresponding protrusion 36 and recess 44 on the corresponding second and third rolls 34, 38. The protrusion 36 displaces the corresponding weakened region 20 and the adjacent patch 86 to form an embossing 42. Subsequently, the release layer 88 without patch 86 is wound onto a roll 94 located downstream of the second and third rolls 34, 38. The space within layer 89 resulting from the removal of patch 86 is... Figure 12 The figure is indicated by reference numeral 87. In an alternative embodiment, the web 82 may be configured with a disc having a heat-activated adhesive element instead of the patch 86.

[0101] In an alternative embodiment of the web 31, the weakened regions 20, 21 may be formed only on one of the first and second layers 12, 14, with the other layer formed without any cutouts. For example, Figure 14 shows an alternative embodiment of the web 31 in the form of a web 120 in an unassembled state. The web 120 comprises a second layer 14 and a layer 122 thereon without weakened regions. (For clarity, the web 120 is shown without the bonding element 16.) Alternatively, the web 120 may comprise the first layer 12 and layer 122. Forming cutouts only in one of the layers eliminates the need to align the first layer 12 and layer 122 with each other when forming the web 120 or when feeding the first layer 12 and layer 122 separately to a roller or other die in apparatus 50, 60.

[0102] In other alternative embodiments, the cuts may be widely distributed across one or two layers and may be spaced sufficiently close together such that each pair of protrusions and recesses on the rollers or other forming apparatus will align with at least one cut on the layer during the forming operation. In some embodiments, the cuts may be significantly smaller than the protrusions or other means of embossing the layer. For example, Figure 15 shows an alternative embodiment of the web 31 in the form of a web 126 in an unassembled state. The web 126 comprises a first layer 12 and a layer 128 in which cuts 130 are widely distributed throughout the layer. Alternatively, the web 126 may comprise a second layer 14 and a layer 128. (For clarity, the web 120 is shown without the bonding element 16.) In this particular embodiment, the cuts 130 are randomly oriented and, in some cases, intersect with other cuts 130. In other embodiments, the cuts 130 may be non-randomly distributed. The extensive distribution of the notches 130 eliminates the need to align the first layers 13 and 128 with each other when forming the web 126 or when feeding the first layers 12 and 128 separately to the rollers or other forming devices in the apparatuses 50 and 60, so as to provide stress relief provided by the notches.

[0103] In some embodiments, for example, cut 130 may be formed on at least about 10 percent of the surface of layer 128. In other embodiments, for example, cut 130 may be formed on at least about 25 percent of the surface of layer 128. In other embodiments, for example, cut 130 may be formed on at least about 50 percent of the surface of layer 128.

[0104] Figure 16 illustrates another alternative embodiment in the form of a web 132 in an unassembled state. The web comprises layer 128 and another layer 134, which is substantially similar to layer 128, with cutouts 130 widely distributed on layer 132. (For clarity, web 120 is shown without adhesive element 16.) Therefore, when forming web 132 or when layers 128 and 134 are fed separately to rollers or other forming devices in devices 50 and 60, it is not necessary to align layers 128 and 134 with each other. Furthermore, since the cutouts 130 are widely distributed in both layers 128 and 134, it is not necessary to align web 132 or individual layers 128 and 134 with the forming device.

[0105] In other alternative embodiments, both layers can be formed without any cuts. In such embodiments, tearing of the layers during embossing can be avoided or minimized by minimizing the size of the embossing. For example, Figures 17-19 show an alternative embodiment in the form of a packaging article 100 having an embossing 102 formed thereon. The packaging article 100 comprises a first layer 104 and a second layer 106, the second layer being secured to the first layer 104 by a heat-activated adhesive element 16 as described above with respect to the packaging article 10. Figure 17 shows a piece of packaging article 100 wrapped multiple times around an object 104 packaged in a box 105 to provide protection for the object 104 during transport.

[0106] The packaging article 100 can be formed from a pre-formed web 107 as described above with respect to the packaging article 10. The web 107 is shown in cross-section in FIG. 19 and in FIG. 17 as a roll 111 of the web 107. Alternatively, the packaging article 100 can be formed by feeding a first layer and a second layer 104, 106 on a separate substrate to rollers or other forming devices, as in devices 50, 60.

[0107] Embossing 102 has a spherical shape. Embossing 102 may have other shapes in alternative embodiments.

[0108] Embossing 102 may have, for example, a diameter of about 3 / 4 inch or less (measured at its base). The diameter of embossing 102 is indicated by arrow 108 in Figures 18 and 19. (Since the embossing is spherical, the diameter of the base also represents the maximum and minimum dimensions of the base.) In other embodiments, embossing 102 may have, for example, a diameter of about 1 / 2 inch or less. In other embodiments, embossing 102 may have, for example, a diameter of about 1 / 4 inch or less. In other embodiments, embossing 102 may have, for example, a diameter of about 1 / 16 inch to about 1 / 4 inch.

[0109] In some embodiments, the height of the embossing 102 may not exceed approximately half the diameter of the embossing 102 (measured at the base of the embossing 102). In other embodiments, the height of the embossing 102 may not exceed approximately one-third the diameter of the embossing 102. In other embodiments, the height of the embossing 102 may not exceed approximately one-quarter the diameter of the embossing 102. For example, in some embodiments, the base may have a diameter of approximately 0.35 to approximately 0.60 inches, and the height of the embossing 102 may be approximately 0.12 inches to approximately 0.20 inches. In other embodiments, for example, the base may have a diameter of approximately 0.475 inches, and the height of the embossing 102 may be approximately 0.158 inches.

[0110] The height of the embossing machine protrusion corresponds to the "internal depth" of the paper dome - .148 (3.8 mm). The diameter of the embossing machine protrusion corresponds to the "ID" of the paper dome - .440 (11.2 mm).

[0111] The embossing 102 may be spaced, for example, from about 1 / 32 inch to about 1 / 8 inch. The spacing between the embossing 102 is indicated by arrow 110 in Figure 18. In alternative embodiments, the embossing 102 may be spaced less than 1 / 32 inch or greater than 1 / 8 inch. The density of the embossing 102 arranged on the packaging article 100 may be, for example, from about 9 embossing 102 per square inch to about 120 embossing 102 per square inch. In alternative embodiments, the density of the embossing 102 arranged on the packaging article 100 may be greater than or less than these values.

[0112] The localized displacement of the layers 104, 106 caused by the protrusions 36 on the roller 34 (or other forming device) can stretch the material of each of the first and second layers 104, 106 and cause it to converge toward the areas on the first and second layers 104, 106 that have been displaced by the protrusions 36. This collective convergence of material at various locations on the protrusions 36 allows the material to slide over the protrusions 36. The ability of the first and second layers 104, 106 to stretch and slide over the protrusions 36 can reduce the tendency for the first and second layers 104, 106 to tear during the formation of the embossing 102. For example, the ability of the first and second layers 104, 106 to stretch and slide without tearing can be influenced by factors such as the thickness, stretchability, and moisture content of the paper or other material forming the first and second layers 104, 106; the height of the protrusions 36 (and the embossing 102); and the spacing between the embossings 102.

[0113] The smaller dimensions of embossing 102 can prevent or inhibit tearing of the first and second layers 104, 106 during the formation of embossing 102 if local displacement occurs. Additionally, if any such tearing does occur, the smaller dimensions of embossing 102 can limit it to an acceptable level, i.e., a level that does not significantly affect the cushioning, insulation, or other related properties of the packaged article 100. For example, limiting the height of the embossing to half the maximum dimension of the base results in a shallower embossing 102, which can help minimize or eliminate tearing of layers 104, 106 during the formation of embossing 102. (In embodiments with non-spherical embossing, where the dimensions of the base vary along the length or width of the base, limiting the ratio of the local height of the embossing to the corresponding local minimum dimension of the base of the embossing can help minimize or eliminate tearing of the layers during the formation of the embossing.)

[0114] The ability to eliminate or limit tearing of the first and second layers 104, 106 without placing slits or other cuts in the area to be embossed eliminates the need for alignment of the first and second layers 102, 104 with each other when forming the first and second layers 102, 104 into webs or when feeding the first and second layers 104, 106 individually to rollers or other forming equipment as in apparatuses 50, 60. Furthermore, the absence of slits in the first and second layers 104, 106 eliminates the need for alignment of the webs or the individual first and second layers 104, 106 with the forming equipment.

[0115] In all of the above embodiments, additional layers may be added so that the resulting packaged article comprises more than two substrate layers.

[0116] Although the invention has been described and illustrated with reference to one or more embodiments, equivalent changes and modifications will occur to those skilled in the art upon reading and understanding this specification and the accompanying drawings. Furthermore, while specific features of the invention have been disclosed herein with reference to only a few embodiments, it will be readily apparent to those skilled in the art that combining such features with one or more other features of other embodiments for any given or particular application may be desirable and advantageous. Therefore, the scope of the invention should not be limited to any of the specific embodiments described above. Rather, the scope of the invention should be determined by the appended claims and their equivalents.

[0117] Although this solution has been described and illustrated with respect to one or more implementations, equivalent changes and modifications will occur to those skilled in the art upon reading and understanding this specification and the accompanying drawings. Furthermore, while a particular feature of this solution may be disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, which may be desirable and advantageous for any given or particular application. Therefore, the breadth and scope of this solution should not be limited to any of the embodiments described above. Rather, the scope of this solution should be defined by the appended claims and their equivalents.

Claims

1. A web for use with an embossing device, the web comprising: A first substrate layer and an adhesive element disposed on the first substrate layer, wherein: The first substrate layer includes a plurality of weakened regions, each weakened region having one or more cuts formed therein, the one or more cuts being asymmetrically arranged around the center of the weakened region and configured to facilitate displacement of the weakened region by a mold of the embossing device to form an embossing on the first substrate layer.

2. The web material according to claim 1, further comprising: A second substrate layer is stacked on the first substrate layer and has a plurality of weakened regions. Each weakened region on the second substrate layer has one or more cutouts formed therein. The one or more cutouts are asymmetrically arranged around the center of the weakened region on the second substrate layer, wherein: The adhesive element is disposed between the first substrate layer and the second substrate layer and is configured to fix the first substrate layer to the second substrate layer; Each weakened region on the second substrate layer covers an associated weakened region on the first substrate layer; and The weakened regions on the first substrate layer and the second substrate layer are configured to facilitate displacement of the weakened regions when the mold presses the weakened region of the first substrate layer into the associated weakened region of the second substrate layer, so as to form embossing on the first substrate layer and the second substrate layer.

3. The web material according to claim 1, wherein at least one of the first substrate layer and the second substrate layer comprises paper.

4. The web material according to claim 3, wherein at least one of the first substrate layer and the second substrate layer comprises ordinary kraft paper.

5. The web material according to claim 3, wherein at least one of the first substrate layer and the second substrate layer comprises stretchable paper.

6. The web of claim 2, wherein the one or more cuts in each weakened region of the first substrate layer and the second substrate layer comprise helical cuts.

7. The web of material according to claim 6, wherein: Each of the spiral cuts in the first substrate bends along a first direction around the center of the spiral cut in the first substrate; and Each of the spiral cuts in the second substrate bends around the center of the spiral cut in the second substrate along a second direction opposite to the first direction.

8. The web material according to claim 2, wherein: The one or more cuts in each weakened region of the first substrate layer include helical cuts; and The one or more cuts in each weakened region of the second substrate layer include a plurality of intersecting linear cuts.

9. The web material according to claim 1, further comprising: The C-shaped folded sheet includes a first substrate layer and a second substrate layer.

10. The web of claim 1, wherein the bonding element comprises a thermally activatable material.

11. The web of claim 10, wherein the heat-activated material comprises a heat-sealing material or a hot-melt adhesive.

12. The web of claim 11, wherein the heat-sealable material comprises a polymer dispersion coating.

13. The web of claim 1, wherein the bonding element comprises a thermoplastic material.

14. The web of claim 1, wherein the cut is configured to serve as a stress-relieving feature that minimizes or prevents tearing of the first substrate layer or the second substrate layer during the embossing process.

15. The web of claim 1, wherein the cut includes a perforation line extending across the weakened region.

16. A system for forming a packaged article, comprising: A supply device comprising a first substrate layer, a second substrate layer stacked on the first substrate layer, and an adhesive element disposed between the first substrate layer and the second substrate layer and configured to fix the first substrate layer to the second substrate layer, wherein at least one of the first substrate layer and the second substrate layer includes a plurality of weakened regions, each weakened region having one or more cuts formed therein, the cuts being asymmetrically disposed around the center of the weakened region. as well as An embossing apparatus, the embossing apparatus including a mold configured to press a first substrate layer into a second substrate layer at a weakened region to form embossing on the first substrate layer and the second substrate layer, wherein: The cut in at least one of the first substrate layer and the second substrate layer is configured to facilitate displacement of the weakened region when the mold presses the first substrate layer into the second substrate layer at the weakened region.

17. The system according to claim 16, wherein: The weakened region is formed in the first substrate layer and the second substrate layer; The mold is configured to press the weakened region of the first substrate layer into an associated weakened region of the second substrate layer to form the embossing; and The weakened region is configured to facilitate displacement of the weakened region when the mold presses the weakened region of the first substrate layer into the associated weakened region of the second substrate layer to form the embossing.

18. The system of claim 16, wherein the cut is configured to serve as a stress-relieving feature that minimizes or prevents tearing of the first substrate layer or the second substrate layer when the mold presses the first substrate layer into the second substrate layer at the weakened region.

19. The system of claim 16, wherein the cut includes a perforated line extending across the weakened region.

20. The system of claim 16, wherein at least one of the first substrate layer and the second substrate layer comprises paper.

21. The system of claim 20, wherein at least one of the first substrate layer and the second substrate layer comprises ordinary kraft paper.

22. The system of claim 20, wherein at least one of the first substrate layer and the second substrate layer comprises stretchable paper.

23. The system of claim 16, wherein the bonding element comprises a thermally activatable material.

24. The system of claim 23, wherein the mold is configured to heat the thermally activatable material.

25. The system according to claim 16, wherein: The mold includes a first roller and a second roller, the first roller having a plurality of protrusions and the second roller having a plurality of recesses formed therein; The first roller and the second roller are configured such that each of the protrusions aligns with and enters the corresponding recess when the first roller and the second roller rotate synchronously. The protrusion is configured to press the first substrate layer into the second substrate layer at the weakened region as the first substrate layer and the second substrate layer pass between the first roller and the second roller to form the embossing.

26. The system of claim 16, further comprising an applicator configured to apply the adhesive element to at least one of the first substrate layer and the second substrate layer before the first substrate layer and the second substrate layer reach the mold.

27. The system of claim 16, wherein the one or more cuts in each weakened region of the weakened region in the first substrate layer and the second substrate layer comprise helical cuts.

28. The system according to claim 27, wherein: Each of the spiral cuts in the first substrate is wound around the center of the spiral cut in the first substrate along a first direction; and Each of the spiral cuts in the second substrate is wound around the center of the spiral cut in the second substrate in a second direction opposite to the first direction.

29. The web of material according to claim 16, wherein: The one or more cuts in each weakened region of the first substrate layer include helical cuts; and The one or more cuts in each weakened region of the second substrate layer include a plurality of intersecting linear cuts.

30. A packaging article formed from the web material according to claim 1.

31. A packaging article unit, comprising: Adhesive elements; A first substrate layer, wherein the first substrate layer has embossing; as well as A second substrate layer has an embossed pattern, the embossing on the second substrate layer being positioned within the embossing of the first substrate layer and fixed to the embossing on the first substrate layer by the adhesive element, wherein: The embossing on at least one of the first substrate layer and the second substrate layer has one or more cuts, the cuts being asymmetrically arranged around the center of the embossing.

32. The packaging unit of claim 31, wherein at least one of the first substrate layer and the second substrate layer comprises paper.

33. The packaging unit according to claim 32, wherein at least one of the first substrate layer and the second substrate layer comprises ordinary kraft paper.

34. The packaging unit of claim 31, wherein at least one of the first substrate layer and the second substrate layer comprises stretchable paper.

35. The packaging unit of claim 31, wherein the one or more cuts are generally helical.

36. The packaging unit of claim 31 further includes a C-shaped folded sheet, the C-shaped folded sheet comprising the first substrate layer and the second substrate layer.

37. The packaging unit of claim 30, wherein the adhesive element comprises a heat-activated material.

38. A method for forming a web for use with a shaped component, the method comprising: A supply device is provided, the supply device including a first substrate layer, a second substrate layer stacked on the first substrate layer, and an adhesive element disposed between the first substrate layer and the second substrate layer and configured to fix the first substrate layer to the second substrate layer, at least one of the first substrate layer and the second substrate layer including a plurality of weakened regions, each weakened region having one or more cuts formed therein, the cuts being asymmetrically disposed around the center of the weakened region. An embossing apparatus is provided, the embossing apparatus being configured to receive a first substrate layer and a second substrate layer and including a mold; and Using the mold, the first substrate layer is pressed into the second substrate layer at the weakened region to form embossing on the first substrate layer and the second substrate layer.

39. The method according to claim 38, wherein: The weakened region is formed in the first substrate layer and the second substrate layer; and The method further includes using the mold to press a weakened region of the first substrate layer into an associated weakened region of the second substrate layer to form the embossing.

40. The method of claim 39, wherein: The bonding element comprises a thermally activatable material; and The method further includes heating the thermally activatable material.

41. The method of claim 40, further comprising: The thermally activatable material is heated when the first substrate layer is pressed into the second substrate layer at the weakened region.

42. The method of claim 40, further comprising: The thermo-activated material is heated before it reaches the mold.

43. A system for forming a packaged article, comprising: A supply device comprising: a first substrate layer including a plurality of weakened regions, each weakened region having one or more cutouts formed therein; and a second substrate layer stacked on the first substrate layer and including a plurality of removable patches, each patch configured to align with a corresponding weakened region on the first substrate; and An embossing apparatus, the embossing apparatus including a mold configured to press the patch into a corresponding weakened region on a first substrate to form an embossing on the first substrate, wherein: The cutout in the first substrate layer is configured to facilitate the displacement of the weakened region when the mold presses the patch into the corresponding weakened region.

44. A web configured for use with an embossing device, the web comprising: A first substrate layer includes a plurality of weakened regions, each weakened region having one or more cutouts formed therein; as well as A second substrate layer is stacked on the first substrate layer and includes a plurality of removable patches, each removable patch being configured to align with a corresponding weakened region on the first substrate.

Images