An antistatic system for a semiconductor clean room

Abstract

The application relates to an anti-static system for a semiconductor clean room, relates to the technical field of clean room engineering, and aims to reduce the influence of static electricity discharge on chip manufacturing in the semiconductor clean room. The anti-static system for the semiconductor clean room comprises a support frame, a plurality of groups of support rods for conducting ground arranged at the bottom of the support frame, an anti-static floor laid in the support frame, an anti-static floor slab laid at the ends of all the support rods away from the support frame, and a moisture-proof isolation layer arranged on the side wall of the anti-static floor slab; and an anti-static wall plate is arranged around the outer peripheral wall of the support frame. The application has the effect of reducing static electricity in the clean room.

Description

Technical Field

[0001] This application relates to the field of cleanroom engineering technology, and in particular to an anti-static system for semiconductor cleanrooms. Background Technology

[0002] Electronic-grade cleanrooms, also known as clean rooms, are dust-free production environments designed for high-tech manufacturing fields such as microelectronics and semiconductors. They meet the precision manufacturing requirements by controlling parameters such as the concentration of airborne particles, temperature, humidity, and pressure difference.

[0003] Regarding the aforementioned technologies, the inventors discovered that as semiconductor process nodes continue to shrink, the harm of electrostatic discharge to chip manufacturing is becoming increasingly prominent. Existing semiconductor cleanrooms are clearly insufficient in protecting against static electricity, which can easily affect the semiconductor chip manufacturing process, and therefore need to be improved. Summary of the Invention

[0004] In order to reduce the impact of electrostatic discharge on the chip manufacturing process in semiconductor cleanrooms, this application provides an anti-static system for semiconductor cleanrooms.

[0005] The anti-static system for semiconductor cleanrooms provided in this application adopts the following technical solution: An antistatic system for a semiconductor cleanroom includes a support frame and several sets of support rods spaced apart at the bottom of the support frame for conductive grounding. An antistatic floor is laid inside the support frame. The ends of all the support rods away from the support frame are covered with an antistatic floor, and the sidewall of the floor facing the antistatic floor is provided with a moisture-proof isolation layer. An antistatic wall panel is provided around the outer peripheral wall of the support frame.

[0006] By adopting the above technical solution, the support rods elevate the support frame to form a raised floor system, with the bottom space facilitating wiring, ventilation, and equipment installation. The floor serves as the bottom grounding electrode, and the anti-static floor serves as the upper working interface, with the two electrically connected through the support rods. The isolation layer provides moisture protection and auxiliary insulation control. The anti-static wall panels constitute a vertical static discharge and shielding enclosure. The synergistic effect of these structures forms a clear path for static charge to be conducted to the ground, effectively reducing static electricity accumulation in the clean room, lowering the risk of electrostatic discharge to semiconductor chip manufacturing, thereby improving the anti-static capability of the semiconductor clean room and reducing the damage caused by static electricity to the chips.

[0007] Preferably, the antistatic floor includes an antistatic facing layer, a substrate layer, and conductive edge strips; the antistatic facing layer is filled inside the support frame, the substrate layer is disposed on the side wall of the antistatic facing layer facing the floor, and the conductive edge strips are disposed on the peripheral side wall of the antistatic facing layer.

[0008] By adopting the above technical solution, the antistatic facing layer directly serves as the contact surface for people walking on it. The surface resistance is controlled within the range of static electricity conduction, which can quickly transfer static electricity from the human body. The substrate layer is preferably made of calcium carbonate material (such as calcium sulfate board), which provides the floor with the necessary mechanical strength, fire resistance and dimensional stability. The conductive edge strip is wrapped around the facing layer and is in close contact with the metal inner wall of the support frame, forming the first-level path for static electricity discharge, ensuring that static charge can be quickly conducted to the support rod.

[0009] Preferably, the flooring comprises a tile layer, a copper foil layer, a conductive base layer, and conductive adhesive; the tile layer, copper foil layer, and conductive base layer are all disposed at the bottom of all support rods, and are disposed layer by layer from top to bottom along the height direction of the support rods; the conductive adhesive is disposed in the gaps inside the tile layer, and is electrically connected to the copper foil layer. By adopting the above technical solution, the ceramic tile layer serves as the floor finish layer, which is wear-resistant and easy to clean and maintain in cleanrooms; the copper foil layer is laid under the ceramic tile layer as an equalizing ring network, which can quickly collect and evenly distribute static charges from the support rods and other locations; the conductive base layer is preferably a conductive carbon black layer, which utilizes the high conductivity of carbon black filler to combine with the substrate, ensuring a good electrical connection with the ground; the conductive adhesive fills the gaps between the ceramic tiles and conducts through the copper foil layer, eliminating the insulation island effect caused by the paving gaps, making the entire floor a continuous, equipotential grounding plane.

[0010] Preferably, the antistatic wall panel includes an antistatic steel plate, an inner core layer, and a fixed frame; the fixed frame is fixedly arranged around the circumference of the support frame, the inner core layer is filled inside the fixed frame, and the antistatic steel plate is arranged on the side wall of the inner core layer facing the support frame.

[0011] By adopting the above technical solution, the antistatic steel plate is preferably an antistatic color-coated steel plate with low surface resistance and uniform color, which can effectively shield external electromagnetic interference and conduct away static electricity on the wall surface; the inner core layer is preferably a rock wool core material layer, which is filled in the gaps of the light steel keel of the fixed frame, so that the wall panel has the functions of sound insulation, heat insulation and fire resistance, meeting the airtightness and cleanliness requirements of the clean room enclosure structure; the fixed frame, as a metal frame structure, not only supports the wall panel, but also serves as a grounding channel to conduct static electricity into the ground.

[0012] Preferably, the bottom of the support rod is provided with a limiting component to reduce the tilt of the support rod, the inside of the support frame is provided with an auxiliary support component to assist in supporting the antistatic floor, and the support frame is provided with a conductive component for conductive grounding.

[0013] By adopting the above technical solutions, the limiting components improve the installation stability of the support rods in the raised floor system, preventing displacement of the support rods due to equipment vibration or personnel movement, thereby ensuring the reliability of the electrostatic discharge path connection; the auxiliary support components enhance the load-bearing rigidity of the middle of the antistatic floor, preventing the floor from denting due to long-term heavy pressure or local impact, and extending the service life of the floor; the conductive components are used for dynamic grounding of operators, further improving the electrostatic protection system of the cleanroom.

[0014] Preferably, the limiting assembly includes a base, a fixing tube, a limiting ring plate, a limiting rod, and a sliding tube; the base is disposed between the ground and the isolation layer, and the fixing tube is disposed on the side wall of the base facing the isolation layer; the fixing tube penetrates the isolation layer, and the bottom end of the support rod is detachably connected to the fixing tube; the limiting ring plate is slidably sleeved on the support rod, the limiting rod is disposed on the side wall of the limiting ring plate facing the isolation layer, and the ends of all the limiting rods away from the limiting ring plate are inserted into the isolation layer; the sliding tube is slidably sleeved on the support rod, and the outer peripheral wall of the sliding tube is connected to the inner peripheral wall of the limiting ring plate.

[0015] By adopting the above technical solution, the base is pre-embedded or fixed inside the ground, providing a stable installation foundation; the fixing pipe extends upward through the isolation layer, providing precise insertion positioning for the support rod, and the detachable connection facilitates later maintenance and replacement; the limiting ring plate cooperates with the limiting rod to restrict the horizontal swing freedom of the upper part of the support rod; the introduction of the sliding tube increases the contact area and sliding guidance accuracy between the limiting ring plate and the support rod, so that the sliding tube can be raised and lowered after the support rod and the fixing pipe are installed, reducing interference with the installation of the support rod, and ensuring the stable installation of the limiting rod in the isolation layer, realizing the rigidity and stable connection of the bottom of the support rod, and reducing the accidental disconnection of the electrostatic conductive path.

[0016] Preferably, the auxiliary support assembly includes an auxiliary support plate, an auxiliary support mesh frame, and an auxiliary support wire mesh; the auxiliary support plate is disposed between the inner sidewalls of the support frame to support the antistatic floor; the auxiliary support mesh frame is disposed on the auxiliary support plate, and the auxiliary support wire mesh is disposed between the auxiliary support mesh frames to assist in supporting the antistatic floor.

[0017] By adopting the above technical solution, the auxiliary support plate acts as the main beam to transfer the load of the antistatic floor to the support frame; the auxiliary support mesh and the auxiliary support wire mesh form a lightweight mesh support layer, which not only reduces the self-weight of the structure, but also evenly distributes the concentrated pressure on the antistatic floor, reducing the risk of breakage of the antistatic floor due to long-term heavy pressure or local impact, and achieving stable support for the antistatic floor.

[0018] Preferably, the conductive component includes an antistatic garment, a sliding block, a conductive rope, fixed protrusions, a winding component, and a driving component; the antistatic garment is mounted on a support frame, the sliding block is slidably mounted on the support frame, and the conductive rope is rotatably mounted between the sliding block and the antistatic garment; the fixed protrusions are spaced apart at the bottom of the antistatic garment, and a gap is left between adjacent fixed protrusions for the conductive rope to abut against; the winding component is mounted on the antistatic garment for winding the conductive rope; and the driving component is mounted on the antistatic garment for assisting in unwinding the conductive rope.

[0019] By adopting the above technical solution, the operator wears anti-static clothing and is connected to the sliding block by a conductive rope. When the operator moves, jumps, or sits down in the clean room and is lifted off the ground, the sliding block slides synchronously along the support frame. The conductive rope is unwound and always guides the static electricity of the human body to the support frame and finally grounded through the support rod. This reduces the phenomenon of the human body static electricity affecting semiconductor manufacturing caused by the operator being lifted off the ground in the clean room. The gap formed by the fixed protrusion can constrain the path of the conductive rope, reducing the damage to the conductive rope caused by stepping on it at the bottom of the anti-static clothing; the winding component is used to automatically collect the conductive rope to prevent it from dragging on the ground; the drive component is set to help overcome the resistance of the winding component when the operator actively moves outward, making the unwinding process more effortless and smooth, and providing convenience for the operator's movement.

[0020] Preferably, the winding component includes a winding box, a winding shaft, a coil spring, and a rotating ring; the winding box is disposed at the bottom of the antistatic garment, and a passage opening is provided through the side wall of the winding box; the rotating ring is disposed on the side wall of the winding box facing the antistatic garment, and the antistatic garment is rotatably connected to the rotating ring; the winding shaft is rotatably disposed on the antistatic garment, and the winding box covers the winding shaft; the coil spring is disposed on the winding shaft located inside the winding box, and the end of the conductive rope away from the sliding block is connected to one end of the coil spring, the coil spring being used to wind the conductive rope into the winding box.

[0021] By adopting the above technical solution, the winding mechanism automatically winds up the conductive rope using the elastic restoring force of the coil spring, so that the conductive rope can be stored in the winding box when not in use, avoiding dragging and contaminating the cleanroom environment or tripping over personnel; the rotating ring allows the winding box to rotate freely within a certain angle according to the direction of human body turning, preventing the conductive rope from getting tangled and knotted, further improving the convenience and safety of use.

[0022] Preferably, the driving component includes a sliding seat, an anti-detachment plate, a drive motor, a trigger switch, and an elastic layer. The sliding seat is slidably disposed on the bottom of the antistatic garment, and the winding box, winding shaft, and fixing protrusion are all located at the bottom of the sliding seat. The bottom of the antistatic garment has a sliding groove for the sliding seat to abut against. The anti-detachment plate is disposed on the outer wall of the sliding seat to prevent the sliding seat from disengaging from the sliding groove. The drive motor is disposed inside the sliding seat to rotate the winding shaft to assist the coiling spring in unwinding the conductive rope. The trigger switch is disposed inside the sliding groove, and when the sliding seat drives the anti-detachment plate to slide towards the inside of the sliding groove, the anti-detachment plate presses the trigger point of the trigger switch to drive the drive motor to start. The elastic layer is disposed between the trigger switch and the anti-detachment plate to drive the anti-detachment plate to slide against the sliding groove through its own elasticity.

[0023] By adopting the above technical solution, when the operator moves outward and pulls the conductive rope, the reaction force of the conductive rope acts on the sliding seat through the winding box, causing the sliding seat to overcome the elastic force of the elastic layer and slide into the sliding groove. At this time, the anti-detachment plate presses the trigger switch, which starts the drive motor and drives the winding shaft to rotate in the forward direction, assisting the coil spring in unwinding, reducing the pulling force required for the operator to pull out the conductive rope and improving the ease of use. When the operator stops moving or the pulling force disappears, the elastic layer pushes the sliding seat to reset, the trigger switch is turned off, and the drive motor stops working, so that the coil spring can restore the free winding state.

[0024] In summary, this application includes at least one of the following beneficial technical effects: By combining a support frame, antistatic floor, flooring and antistatic wall panels in a three-dimensional manner, and with the moisture-proof isolation layer and auxiliary support components to enhance the structure, an all-directional static grounding discharge network and a stable physical support system are constructed, which significantly reduces the static accumulation phenomenon in semiconductor cleanrooms and ensures the yield and equipment safety of the chip manufacturing process. By setting a copper foil layer and conductive adhesive to connect the tile gaps in the floor and conducting the charge into the conductive carbon black layer, the insulation gaps between the various floor laying units are eliminated, ensuring rapid equalization of static charge on the ground and efficient discharge to the earth. The installation stability of the support rod in the raised floor system is improved by setting limit components, which prevents the support rod from shifting due to equipment vibration or personnel movement, thereby ensuring the reliability of the electrostatic discharge path connection; the auxiliary support components enhance the load-bearing rigidity of the middle of the antistatic floor, preventing the floor from denting due to long-term heavy pressure or local impact, and extending the service life of the floor; the conductive components are used for dynamic grounding of operators, further improving the electrostatic protection system of the cleanroom. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of an anti-static system for a semiconductor cleanroom according to an embodiment of this application.

[0026] Figure 2 It is used to embody Figure 1 An enlarged schematic diagram of the structure at point A in the middle.

[0027] Figure 3 It is a cross-sectional schematic diagram used to illustrate the connection between the antistatic floor and the flooring.

[0028] Figure 4 This is an exploded diagram used to illustrate the connection between the antistatic floor and the frame.

[0029] Figure 5 It is a cross-sectional schematic diagram used to illustrate the internal structure of a conductive component.

[0030] Explanation of reference numerals in the attached figures: 1. Support frame; 11. Support rod; 12. Isolation layer; 2. Antistatic floor; 21. Antistatic facing layer; 22. Substrate layer; 23. Conductive edge strip; 3. Flooring; 31. Tile layer; 32. Copper foil layer; 33. Conductive base layer; 34. Conductive adhesive; 4. Antistatic wall panel; 41. Antistatic steel plate; 42. Inner core layer; 43. Fixing frame; 5. Limiting component; 51. Base; 52. Fixing tube; 53. Limiting ring plate; 54. Limiting rod; 55. Sliding tube; 6. Auxiliary support Components; 61. Support plate; 62. Support mesh frame; 63. Support wire mesh; 7. Conductive component; 71. Antistatic clothing; 711. Sliding groove; 72. Sliding block; 73. Conductive rope; 74. Fixing protrusion; 75. Rewinding component; 750. Passageway; 751. Rewinding box; 752. Rewinding shaft; 753. Coil spring; 754. Rotating ring; 76. Driving component; 761. Sliding seat; 762. Anti-detachment ring plate; 763. Drive motor; 764. Trigger switch; 765. Elastic layer. Detailed Implementation

[0031] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0032] This application discloses an anti-static system for semiconductor cleanrooms to reduce the generation of static electricity in the cleanroom.

[0033] Reference Figure 1 and Figure 2 An anti-static system for semiconductor cleanrooms includes a support frame 1 and several sets of support rods 11 spaced apart at the bottom of the support frame 1 for conductive grounding. In this embodiment, the support rods 11 are preferably metal pipes with galvanized or conductive plastic coatings, possessing both conductivity and corrosion resistance.

[0034] Reference Figure 2 and Figure 3An antistatic floor 2 is laid inside the support frame 1, and an antistatic flooring 3 is laid at the ends of all support rods 11 away from the support frame 1. A moisture-proof isolation layer 12 is laid on the side wall of the flooring 3 facing the antistatic floor 2. This isolation layer 12 can be made of polyethylene film or moisture-proof aluminum foil rolls, serving both moisture-proof and sound-insulating functions. It prevents underground moisture from rising and eroding the antistatic floor 2, and also acts as an insulating buffer layer between the flooring 3 and the upper structure, ensuring that the static discharge path is controlled. Antistatic wall panels 4 are fixedly installed on the inner walls of the clean room, and the antistatic wall panels 4 extend and distribute around the outer perimeter of the support frame 1.

[0035] Reference Figure 2 and Figure 3 The antistatic floor 2 specifically includes an antistatic facing layer 21, a substrate layer 22, and conductive edge strips 23. The antistatic facing layer 21 is filled and embedded inside the grid of the supporting frame 1, and is usually made of PVC antistatic facing or HPL fireproof board facing, with a surface resistivity controlled at 10 Ω·cm. 6 Ω to 10 9 Between Ω. The substrate layer 22 is bonded to the lower sidewall of the antistatic facing layer 21 facing the floor 3. The substrate layer 22 is preferably made of calcium carbonate to provide sufficient bending strength, fire resistance and dimensional stability. The conductive strip 23 is wrapped around the four edges of the antistatic facing layer 21 and is in close contact with the metal inner wall of the support frame 1 to form a path for static discharge.

[0036] Reference Figure 2 and Figure 3 The floor slab 3 is laid on the ground and includes a tile layer 31, a copper foil layer 32, a conductive base layer 33, and conductive adhesive 34. The conductive base layer 33 is laid directly on the floor slab leveling layer and is composed of concrete or polymer mortar with added conductive carbon black, forming a conductive carbon black layer to ensure a low-resistance connection with the ground. The copper foil layer 32 is laid on the upper surface of the conductive base layer 33, preferably with a thickness of 0.05mm to 0.1mm, and is arranged in a mesh or strip pattern. The tile layer 31 uses anti-static tiles laid on top of the copper foil layer 32. The conductive adhesive 34 fills the gaps between adjacent tiles, and the bottom of the conductive adhesive 34 extends and conductively connects with the upper surface of the copper foil layer 32. At least a portion of the copper foil layer 32 is in contact with the conductive adhesive 34, thereby forming a continuous conductive mesh.

[0037] Reference Figure 2 and Figure 3The antistatic wall panel 4 includes an antistatic steel plate 41, an inner core layer 42, and a fixing frame 43. The fixing frame 43, as a metal frame structure, is fixed to the wall or column inside the clean room by expansion bolts around the supporting frame 1. The inner core layer 42 is filled in the gaps of the light steel keel of the fixing frame 43, and is filled with rock wool core material to enhance the heat insulation, sound insulation, and fire resistance of the clean room. The antistatic steel plate 41 is preferably an antistatic color-coated steel plate, which is fixed to the side wall of the inner core layer 42 facing the interior of the clean room by screws or structural adhesive.

[0038] Reference Figure 3 and Figure 4 The support frame 1 is internally equipped with an auxiliary support assembly 6 for supporting the antistatic floor 2. The auxiliary support assembly 6 includes an auxiliary support plate 61, an auxiliary support mesh frame 62, and an auxiliary support wire mesh 63. The auxiliary support plate 61 is made of channel steel and is horizontally welded between two opposite inner side walls of the support frame 1 to support the antistatic floor 2. The auxiliary support mesh frame 62 is welded and erected on the opposite auxiliary support plates 61 inside the mesh of the support frame 1. The auxiliary support wire mesh 63 is laid in the mesh gaps of the auxiliary support mesh frame 62, together assisting in supporting the base layer 22 of the antistatic floor 2 and preventing the antistatic floor 2 from vibrating or breaking due to large span or local heavy pressure.

[0039] Reference Figure 3 and Figure 4 The bottom of the support rod 11 is provided with a limiting component 5 to reduce the tilt of the support rod 11. The limiting component 5 includes a base 51, a fixing tube 52, a limiting ring plate 53, a limiting rod 54, and a sliding tube 55. The base 51 is a metal plate, which is embedded or bonded to the floor 3. The fixing tube 52 is vertically welded to the upper surface of the base 51 and penetrates the reserved hole on the isolation layer 12. The bottom end of the support rod 11 is threaded or inserted into the fixing tube 52 to achieve a detachable connection.

[0040] Reference Figure 3 and Figure 4 The sliding tube 55 is slidably sleeved on the support rod 11. The limiting ring plate 53 is welded and fixed to the outer peripheral wall of the sliding tube 55, which increases the contact area between the limiting ring plate 53 and the support rod 11, and improves the sliding guidance accuracy and horizontal constraint stiffness. The limiting rods 54 are welded to the side wall of the limiting ring plate 53 facing the side wall of the isolation layer 12, and the limiting rods 54 are spaced apart from each other. The tip of the limiting rod 54 is inserted into the flexible surface of the isolation layer 12 and abuts against the upper surface of the base 51, which prevents the support rod 11 from shaking due to lateral force.

[0041] Reference Figure 3 and Figure 5The support frame 1 is equipped with a conductive component 7 for conductive grounding. The conductive component 7 is used to connect the moving workers and specifically includes an anti-static suit 71, a sliding block 72, a conductive rope 73, a fixing protrusion 74, a winding component 75, and a driving component 76. The anti-static suit 71 is hung at a designated workstation inside the clean room. In this embodiment, the bottom of the anti-static suit 71 is equipped with shoes with grounding properties.

[0042] Reference Figure 3 and Figure 5 The sliding block 72 is made of conductive metal and is slidably connected to a pre-set groove on the top of the support frame 1. The conductive rope 73 contains multiple strands of copper foil wire, one end of which is connected to the sliding block 72, and the other end is connected to the bottom of the antistatic clothing 71. The fixing protrusions 74 are made of rubber or plastic and are bonded to the bottom sole wall of the antistatic clothing 71 at intervals, with gaps between adjacent fixing protrusions 74 for the conductive rope 73 to abut.

[0043] Reference Figure 3 and Figure 5 A winding component 75 is installed on the sole wall of the bottom of the antistatic garment 71 for winding the conductive rope 73. The winding component 75 includes a winding box 751, a winding shaft 752, a coil spring 753, and a rotating ring 754. The rotating ring 754 is rotatably connected to the sole wall of the bottom of the antistatic garment 71, and the winding box 751 is fixedly connected to the side wall of the rotating ring 754 away from the antistatic garment 71, so that the winding box 751 can rotate relative to the antistatic garment 71 via the rotating ring 754. The conductive rope 73 is wound inside the winding box 751, and the side wall of the winding box 751 has a passage opening 750 for the conductive rope 73 to pass through.

[0044] Reference Figure 3 and Figure 5 The take-up shaft 752 is rotatably connected to the sole wall of the antistatic suit 71, with the end of the take-up shaft 752 away from the antistatic suit 71 located inside the take-up box 751. A coil spring 753 is fixedly sleeved on the take-up shaft 752 located inside the take-up box 751, and the end of the conductive rope 73 away from the sliding block 72 is fixedly connected to the end of the coil spring 753. When the worker moves away from the support frame 1, the conductive rope 73 is pulled out against the elastic force of the coil spring 753; when the worker approaches the support frame 1, the coil spring 753 resets, driving the take-up shaft 752 to rotate and wind the conductive rope 73 into the take-up box 751.

[0045] Reference Figure 3 and Figure 5The driving component 76 is installed on the sole wall of the antistatic suit 71 to assist in unwinding the conductive rope 73. The driving component 76 includes a sliding seat 761, an anti-detachment plate 762, a drive motor 763, a trigger switch 764, and an elastic layer 765. A sliding groove 711 is provided on the sole wall of the antistatic suit 71. The sliding seat 761 is slidably connected to the inside of the sliding groove 711 in the vertical direction. The winding box 751, the winding shaft 752, and the fixing protrusion 74 are all provided on the bottom wall of the sliding seat 761 away from the antistatic suit 71.

[0046] Reference Figure 3 and Figure 5 The anti-detachment ring plate 762 is fixed to the outer wall of the sliding seat 761. The inner wall of the sliding groove 711 is provided with an anti-detachment ring groove that cooperates with the anti-detachment ring plate 762 to prevent the sliding seat 761 from completely disengaging from the sliding groove 711. The drive motor 763 is a miniature geared motor, which is fixedly installed inside the sliding seat 761. Its output shaft is connected to the take-up shaft 752 through a one-way overrunning clutch. It is used to drive the take-up shaft 752 to rotate in the forward direction when energized to assist unwinding. When the drive motor 763 is de-energized, the take-up shaft 752 can rotate freely.

[0047] Reference Figure 3 and Figure 5 The trigger switch 764 is a micro switch electrically connected to the drive motor 763. The trigger switch 764 is installed inside the sliding groove 711 at a position corresponding to the moving path of the anti-detachment ring plate 762. The elastic layer 765 is a soft and elastic rubber pad. The elastic layer 765 is filled inside the anti-detachment ring groove to separate the trigger point of the trigger switch 764 from the anti-detachment ring plate 762.

[0048] Reference Figure 3 and Figure 5 When the operator moves outward and pulls the conductive rope 73, the tension exerted by the conductive rope 73 on the winding box 751 causes the entire sliding seat 761 to overcome the elastic force of the elastic layer 765 and slide outward into the sliding groove 711. At this time, the anti-detachment plate 762 squeezes the elastic layer 765 and presses the trigger point of the trigger switch 764. The trigger switch 764 is turned on, the drive motor 763 starts and drives the winding shaft 752 to rotate in the forward direction, assisting the coil spring 753 in unwinding, thereby significantly reducing the resistance that the operator needs to overcome when pulling the conductive rope 73.

[0049] Reference Figure 3 and Figure 5 When the operator stops moving or retracts, the tension of the conductive rope 73 disappears. Under the restoring force of the elastic layer 765, the sliding seat 761 drives the anti-detachment ring plate 762 to slide and reset into the sliding groove 711. The trigger switch 764 is turned off, the drive motor 763 stops rotating, and the coil spring 753 resumes its free winding function, automatically retracting the conductive rope 73 into the winding box 751.

[0050] The implementation principle of an anti-static system for semiconductor cleanrooms according to an embodiment of this application is as follows: During construction, a conductive base layer 33, a copper foil layer 32, and a ceramic tile layer 31 are first laid to form a floor 3, and support rods 11 are pre-embedded in the corresponding positions. Then, an isolation layer 12 is laid, and a support frame 1 is installed on top of the support rods 11. An antistatic floor 2 is assembled inside the support frame 1, and antistatic wall panels 4 are installed around the perimeter of the support frame 1, so that the antistatic bottom, antistatic wall panels 4, support frame 1, support rods 11, and floor 3 form a stable grounding path.

[0051] The overall grounding system attracts and conducts static electricity within the cleanroom space to the grounding grid, achieving comprehensive and dynamic electrostatic protection. This improves the anti-static capability of the semiconductor cleanroom and reduces the harm of static electricity to the semiconductor chip manufacturing process.

[0052] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An anti-static system for semiconductor cleanrooms, characterized in that: It includes a support frame (1) and several sets of support rods (11) spaced apart at the bottom of the support frame (1) for conductive grounding. The support frame (1) is covered with an antistatic floor (2). The ends of all the support rods (11) away from the support frame (1) are covered with an antistatic floor (3). The side wall of the floor (3) facing the antistatic floor (2) is provided with a moisture-proof isolation layer (12). An antistatic wall panel (4) is provided around the outer perimeter of the support frame (1).

2. The anti-static system for semiconductor cleanrooms according to claim 1, characterized in that: The antistatic floor (2) includes an antistatic facing layer (21), a substrate layer (22), and a conductive edge strip (23); the antistatic facing layer (21) is filled inside the support frame (1), the substrate layer (22) is disposed on the side wall of the antistatic facing layer (21) facing the floor (3), and the conductive edge strip (23) is disposed on the peripheral side wall of the antistatic facing layer (21).

3. The anti-static system for semiconductor cleanrooms according to claim 1, characterized in that: The flooring (3) includes a tile layer (31), a copper foil layer (32), a conductive base layer (33), and a conductive adhesive (34); the tile layer (31), the copper foil layer (32), and the conductive base layer (33) are all located at the bottom of all the support rods (11), and the tile layer (31), the copper foil layer (32), and the conductive base layer (33) are all arranged layer by layer from top to bottom along the height direction of the support rods (11); the conductive adhesive (34) is located in the gaps inside the tile layer (31), and the conductive adhesive (34) is electrically connected to the copper foil layer (32).

4. The anti-static system for semiconductor cleanrooms according to claim 1, characterized in that: The antistatic wall panel (4) includes an antistatic steel plate (41), an inner core layer (42), and a fixed frame (43); the fixed frame (43) is fixedly arranged around the support frame (1) in the circumference, the inner core layer (42) is filled inside the fixed frame (43), and the antistatic steel plate (41) is arranged on the side wall of the inner core layer (42) facing the support frame (1).

5. An anti-static system for semiconductor cleanrooms according to claim 1, characterized in that: The bottom of the support rod (11) is provided with a limiting component (5) for reducing the tilt of the support rod (11), the inside of the support frame (1) is provided with an auxiliary support component (6) for assisting in supporting the antistatic floor (2), and the support frame (1) is provided with a conductive component (7) for conductive grounding.

6. An anti-static system for semiconductor cleanrooms according to claim 5, characterized in that: The limiting component (5) includes a base (51), a fixing tube (52), a limiting ring plate (53), a limiting rod (54), and a sliding tube (55); the base (51) is disposed between the floor (3) and the isolation layer (12), and the fixing tube (52) is disposed on the side wall of the base (51) facing the isolation layer (12); the fixing tube (52) penetrates the isolation layer (12), and the bottom end of the support rod (11) is movable from the fixing tube (52). Disassembly connection; the limiting ring plate (53) is slidably sleeved on the support rod (11), the limiting rod (54) is set on the side wall of the limiting ring plate (53) facing the isolation layer (12), and the ends of all the limiting rods (54) away from the limiting ring plate (53) are inserted into the isolation layer (12); the sliding tube (55) is slidably sleeved on the support rod (11), and the outer peripheral wall of the sliding tube (55) is connected to the inner peripheral wall of the limiting ring plate (53).

7. An anti-static system for semiconductor cleanrooms according to claim 5, characterized in that: The auxiliary support assembly (6) includes an auxiliary support plate (61), an auxiliary support mesh frame (62), and an auxiliary support wire mesh (63); the auxiliary support plate (61) is disposed between the inner sidewalls of the support frame (1) to support the antistatic floor (2); the auxiliary support mesh frame (62) is disposed on the auxiliary support plate (61), and the auxiliary support wire mesh (63) is disposed between the auxiliary support mesh frames (62) to assist in supporting the antistatic floor (2).

8. An anti-static system for a semiconductor cleanroom according to claim 5, characterized in that: The conductive component (7) includes an antistatic garment (71), a sliding block (72), a conductive rope (73), a fixing protrusion (74), a winding component (75), and a driving component (76). The antistatic garment (71) is mounted on a support frame (1), the sliding block (72) is slidably mounted on the support frame (1), and the conductive rope (73) is rotatably mounted between the sliding block (72) and the antistatic garment (71). The fixing protrusions (74) are spaced apart at the bottom of the antistatic garment (71), and a gap is left between adjacent fixing protrusions (74) for the conductive rope (73) to abut. The winding component (75) is mounted on the antistatic garment (71) for winding the conductive rope (73). The driving component (76) is mounted on the antistatic garment (71) for assisting in unwinding the conductive rope (73).

9. An anti-static system for a semiconductor cleanroom according to claim 8, characterized in that: The winding component (75) includes a winding box (751), a winding shaft (752), a coil spring (753), and a rotating ring (754); the winding box (751) is located at the bottom of the antistatic garment (71), and a passage opening (750) is provided through the side wall of the winding box (751); the rotating ring (754) is located on the side wall of the winding box (751) facing the antistatic garment (71), and the antistatic garment (71) rotates with the rotating ring (754). The winding shaft (752) is rotatably mounted on the antistatic clothing (71), and the winding box (751) covers the winding shaft (752); the coil spring (753) is mounted on the winding shaft (752) located inside the winding box (751), and the end of the conductive rope (73) away from the sliding block (72) is connected to one end of the coil spring (753), and the coil spring (753) is used to wind the conductive rope (73) into the winding box (751).

10. An anti-static system for a semiconductor cleanroom according to claim 8, characterized in that: The driving component (76) includes a sliding seat (761), an anti-detachment plate (762), a drive motor (763), a trigger switch (764), and an elastic layer (765); the sliding seat (761) is slidably disposed on the bottom of the antistatic suit (71), and the winding box (751), winding shaft (752), and fixing protrusion (74) are all located at the bottom of the sliding seat (761); the bottom of the antistatic suit (71) is provided with a sliding groove (711) for the sliding seat (761) to abut; the anti-detachment plate (762) is disposed on the outer wall of the sliding seat (761) to limit the sliding seat (761) from disengaging from the sliding groove (711); the drive motor ( 763) is disposed inside the sliding seat (761) for rotating the take-up shaft (752) to assist the coil spring (753) in unwinding the conductive rope (73); the trigger switch (764) is disposed inside the sliding groove (711), and when the sliding seat (761) drives the anti-detachment plate (762) to slide toward the sliding groove (711), the anti-detachment plate (762) presses the trigger point of the trigger switch (764) to drive the drive motor (763) to start; the elastic layer (765) is disposed between the trigger switch (764) and the anti-detachment plate (762) for using its own elastic force to drive the anti-detachment plate (762) to slide into the sliding groove (711).

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