A backlight compensation method, a backlight control chip, a backlight circuit and a display device

Abstract

The application provides a backlight compensation method, a backlight control chip, a backlight circuit and a display device. The method comprises the following steps: acquiring current temperatures collected by a plurality of temperature collection components arranged on a backlight panel; determining target temperatures of backlight sources in backlight partitions based on the current temperatures, a first arrangement mode of the plurality of temperature collection components on the backlight panel, and a second arrangement mode of the plurality of backlight partitions on the backlight panel; compensating initial dimming data of the corresponding backlight partitions according to the target temperatures of the backlight sources in the backlight partitions to obtain target dimming data of the backlight partitions; and controlling the luminous brightness of the backlight sources in the corresponding backlight partitions based on the target dimming data. Thus, the current temperatures collected by the temperature collection components and the arrangement modes of the backlight partitions are calculated to accurately determine the real temperatures of the backlight sources in the backlight partitions, and high-precision backlight compensation is performed accordingly, so that the color accuracy of a display picture is improved, and the display performance is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a backlight compensation method, a backlight control chip, a backlight circuit, and a display device. Background Technology

[0002] With the rapid development of display backlight technology, backlight systems, as the core component determining the color performance of displayed images, widely adopt color backlighting to further improve the color gamut coverage and color reproduction accuracy of display devices. In color backlight systems, a single backlight source typically consists of multiple LEDs of different colors (such as red, green, and blue LEDs), or multiple color LEDs can be packaged into one unit through integration technology to achieve rich color output through light mixing.

[0003] In practical applications, the output characteristics of the backlight drift with temperature changes, causing different colors of light-emitting diodes (LEDs) to exhibit varying degrees of color shift. This results in the final displayed color deviating from the ideal color, affecting the color accuracy of the displayed image. Therefore, compensating for the backlight to maintain color temperature stability is crucial. However, existing compensation methods struggle to accurately reflect the true temperature of the backlight, resulting in low compensation accuracy. Summary of the Invention

[0004] This application provides a backlight compensation method, a backlight control chip, a backlight circuit, and a display device, which are used to accurately collect the real-time temperature of the backlight source and achieve high-precision backlight compensation based on the temperature, thereby effectively improving display performance.

[0005] In a first aspect, this application provides a backlight compensation method, including: The current temperature is obtained from multiple temperature acquisition components set on the backlight panel, and the current temperature is used to indicate the temperature of the backlight panel substrate at the location of the corresponding temperature acquisition component. Based on the current temperature, the first arrangement of the multiple temperature acquisition components on the backlight panel, and the second arrangement of the multiple backlight zones on the backlight panel, the target temperature of the backlight in each of the backlight zones is determined. For any backlight zone, the initial dimming data of the backlight zone is compensated according to the target temperature of the backlight source in the backlight zone to obtain the target dimming data of the backlight zone. The brightness of the backlight in the corresponding backlight zone is controlled based on the target dimming data.

[0006] Secondly, this application also provides a backlight control chip, comprising: The receiving module is used to acquire the current temperature collected by multiple temperature acquisition components set on the backlight panel, and the current temperature is used to indicate the temperature of the backlight panel substrate at the location of the corresponding temperature acquisition component. The temperature processing module is used to determine the target temperature of the backlight in each of the backlight zones based on the current temperature, the first arrangement of the multiple temperature acquisition components on the backlight panel, and the second arrangement of the multiple backlight zones on the backlight panel. The backlight compensation module compensates the initial dimming data of any backlight zone based on the target temperature of the backlight source in the backlight zone to obtain the target dimming data of the backlight zone. The backlight control module is used to control the luminous brightness of the backlight source in the corresponding backlight zone based on the target dimming data.

[0007] Thirdly, this application also provides a backlight circuit, including: a backlight panel and a backlight control chip as described in the second aspect; The backlight panel includes a substrate, a thermally conductive layer, a connecting dielectric layer, multiple temperature acquisition components, and multiple backlight sources; The thermally conductive layer is located on one side of the substrate and covers part of the surface of the substrate; The plurality of temperature acquisition components and the plurality of backlights are all located on the side of the thermal conductive layer away from the substrate, and at least one of the plurality of temperature acquisition components has its orthographic projection on the substrate located within the orthographic projection range of the thermal conductive layer on the substrate. The connecting medium layer is located between the thermally conductive layer and the temperature acquisition component, and is in contact with the temperature acquisition component; The backlight control chip is connected to the plurality of temperature acquisition components and the plurality of backlight sources, respectively.

[0008] Fourthly, this application also provides a display device, including: a display panel and a backlight circuit as described in any of the third aspects; The display panel is positioned opposite to the backlight panel in the backlight circuit.

[0009] The beneficial effects of this application are as follows: The backlight compensation method provided in this application first obtains the current temperature collected by multiple temperature acquisition components on the backlight panel. This current temperature indicates the temperature of the backlight panel substrate at the location of the corresponding temperature acquisition component. Based on the current temperature, the first arrangement of the multiple temperature acquisition components on the backlight panel, and the second arrangement of the multiple backlight zones on the backlight panel, the target temperature of the backlight source in each backlight zone is determined. Secondly, for any backlight zone, the initial dimming data of the backlight zone is compensated according to the target temperature of the backlight source in the backlight zone to obtain the target dimming data of the backlight zone. Finally, the luminous brightness of the backlight source in the corresponding backlight zone is controlled based on the target dimming data. Since the target temperature of the backlight source in each backlight zone is determined based on the current temperature collected by multiple temperature acquisition components on the backlight panel and the spatial arrangement relationship between the temperature acquisition components and the backlight zone, the obtained target temperature can more accurately reflect the true temperature of the backlight source. Compared with the prior art method of indirectly adjusting the backlight brightness by collecting ambient temperature, the target temperature obtained in this application has higher accuracy. Based on this, using a highly accurate target temperature for backlight compensation can effectively improve the accuracy of backlight compensation, ensure the accuracy of backlight brightness, reduce or even eliminate color shift caused by temperature changes, thereby significantly improving the color accuracy and overall visual experience of the displayed image and optimizing display performance. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1A This is a schematic diagram of the structure of a display device provided in an embodiment of this application; Figure 1B This is a schematic diagram of the structure of another display device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a backlight panel provided in an embodiment of this application; Figure 3 This is a schematic diagram of a backlight circuit provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a temperature acquisition component provided in an embodiment of this application; Figure 5A A partial top view of a backlight panel provided in an embodiment of this application; Figure 5BA cross-sectional view of a backlight panel provided in an embodiment of this application; Figure 6 A schematic flowchart of a backlight compensation method provided in an embodiment of this application; Figure 7 A schematic diagram illustrating the correspondence between a backlight partition and the detection area of ​​a temperature acquisition component, provided for an embodiment of this application; Figure 8 This application provides a schematic flowchart of a method for determining the target temperature of a backlight in a backlight zone, as illustrated in an embodiment of the present application. Figure 9 A schematic flowchart of a backlight compensation method provided in an embodiment of this application; Figure 10 This application provides a schematic diagram of the signal flow of a backlight control chip according to an embodiment of the present application. Figure 11 This is a schematic diagram of the structure of a backlight control chip provided in an embodiment of this application. Detailed Implementation

[0012] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0013] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0014] With the continuous development of display technology, users have placed higher demands on the display effects of display devices, especially in high-precision display fields such as smartphones, televisions, and automotive displays. To improve the color performance of display devices, color backlight technology has emerged. A color backlight system typically consists of multiple backlight sources emitting different colors, achieving rich color output through light mixing. For example, this color backlight system may include three-color light-emitting diodes (LEDs) of red (R), green (G), and blue (B), or four-color LEDs of red, green, blue, and white (W), etc., and will not be listed here.

[0015] However, in practical applications, the actual output characteristics of LEDs drift with temperature changes, resulting in varying degrees of color shift for different colored LEDs. This causes the final displayed color to deviate from the ideal color, thus affecting the color accuracy of the displayed image. Specifically, as the LED emission process continues, its temperature gradually increases. The spectral output of blue LEDs tends to decrease, while the spectral output of green and red LEDs increases. These changes cause a noticeable color shift in the light mixing effect, which directly affects the color accuracy of the final displayed image, thereby reducing the user's visual experience.

[0016] Therefore, ensuring color accuracy and white balance is crucial for display devices using color backlighting. To mitigate the aforementioned color shift and improve display quality, temperature compensation of the backlight system is typically required to correct the color shift problem. Traditional backlight temperature compensation methods mainly include the following two: The first method involves installing an ambient temperature sensor in the display device, such as a negative temperature coefficient (NTC) thermistor or an integrated ambient temperature sensor. This sensor collects the ambient temperature and adjusts the backlight brightness accordingly. However, in practical applications, due to the complex heat conduction paths within the backlight system and the placement of the ambient temperature sensor, there is often a significant difference between the ambient temperature and the actual temperature of the backlight. This results in poor compensation accuracy and limited improvement in color difference accuracy.

[0017] The second approach involves integrating temperature sensors, such as thermocouples or resistance temperature detectors (RTDs), into the backlight system. These sensors monitor the backlight temperature in real time and adjust its brightness accordingly. However, obtaining accurate results requires integrating a large number of temperature sensors into the backlight system. Furthermore, the installation and wiring of these sensors are complex and require external circuitry, significantly increasing the overall hardware complexity and cost of the display device, which hinders its further development and adoption.

[0018] Based on this, embodiments of this application provide a backlight compensation method, a backlight control chip, a backlight circuit, and a display device, which are used to accurately collect the real-time temperature of the backlight source and achieve high-precision backlight compensation based on the temperature, thereby effectively improving display performance.

[0019] To facilitate understanding of the technical solutions provided in the embodiments of this application, their specific application scenarios will be explained below.

[0020] The backlight compensation method provided in this application can be applied to display devices, which can be any electronic device with display functions, including but not limited to: consumer electronics, automotive electronic products, and financial terminal electronic products. Consumer electronics include, for example, mobile phones, tablets, laptops, PDAs, LCD TVs, smart photo frames, e-readers, personal computers (PCs), personal digital assistants (PDAs), desktop monitors, and smart wearable products (such as smartwatches, smart bracelets, virtual reality (VR) devices, and augmented reality (AR) devices). Automotive electronic products include, for example, in-vehicle displays. Financial terminal electronic products include, for example, Automated Teller Machines (ATMs) and self-service terminals; this application does not specifically limit these.

[0021] For ease of explanation, we will use an LCD TV as an example for illustration. Figure 1A A schematic diagram of the structure of a display device provided in an embodiment of this application; Figure 1B This is another structural schematic diagram of the display device provided in the embodiments of this application.

[0022] Reference Figure 1A and Figure 1BThe display device 10 includes a main processor 11, a display circuit 12, and a backlight circuit 13; the main processor 11 is electrically connected to both the display circuit 12 and the backlight circuit 13. The display circuit 12 includes a timing controller 121 and a display panel 122, and the backlight circuit 13 includes a backlight controller 131 and a backlight panel 132; the display panel 122 and the backlight panel 132 are arranged opposite each other, and the display panel 122 is located on the light-emitting side of the backlight panel 132.

[0023] In one possible implementation, refer to Figure 1A The main processor 11 is electrically connected to the timing controller 121, which in turn is electrically connected to the backlight controller 131 and the display panel 122. In this architecture, the main processor 11 sends image data corresponding to an image frame to the timing controller 121. For example, the main processor 11 and the timing controller 121 can be connected via a high-speed serial interface (V-By-One, VBO) to transmit image data. After receiving the image data, the timing controller 121 controls the display panel 122 to display the image frame based on the image data, and generates Local Dimming Data (LDD) (hereinafter referred to as dimming data) based on the image data, and sends the dimming data to the backlight controller 131. For example, the timing controller 121 and the display panel 122 can transmit image data via a point-to-point (P2P) signal interface; the timing controller 121 and the backlight controller 131 can be connected via a serial peripheral interface (SPI) to transmit dimming data. The backlight controller 131 is used to transmit dimming data to the backlight panel 132 to control the backlight panel 132 to illuminate the backlight.

[0024] In specific implementations, the main processor 11 can be implemented using a system-on-chip (SoC) or other electronic devices capable of outputting image data; the timing controller 121 can be implemented using a timing controller (TCON) chip, a timing controller embedded local dimming (TELD) chip, etc.; and the backlight controller 131 can be implemented using a dimming control chip, a microcontroller unit (MCU), etc. It should be understood that the specific implementation of the above-mentioned devices can be determined according to the actual architecture of the display device 10 and the specific application scenario, and this application embodiment does not limit this.

[0025] In another possible implementation, refer to Figure 1B The main processor 11 can also be electrically connected to the timing controller 121 and the backlight controller 131 respectively. In this architecture, the main processor 11 is used to generate dimming data according to the image data corresponding to the image frame, and send the image data to the timing controller 121, which controls the display panel 122 to display the image frame; at the same time, it sends the dimming data to the backlight controller 131, which transmits the dimming data to the backlight panel 132 to control the backlight panel 132 to illuminate the backlight.

[0026] Furthermore, it should be understood that Figure 1A and Figure 1B The display device architecture shown is merely an example and does not constitute any limitation on the specific display device architecture provided in the embodiments of this application. In practical applications, the internal architecture of the display device can be flexibly adjusted according to different application scenarios to meet corresponding adaptation requirements.

[0027] Figure 2 This is a schematic diagram of a backlight panel provided in an embodiment of this application. (Refer to...) Figure 2 The backlight panel 132 may include multiple driving chips 1321 and multiple backlight sources 1322, wherein the multiple backlight sources 1322 may have multiple light emission colors. Figure 2 The following is an illustration using multiple backlights 1322, including red (R), green (G), and blue (B) three-color backlights.

[0028] In the backlight panel 132, each driver chip 1321 is electrically connected to one or more backlight sources 1322. When one driver chip 1321 is connected to multiple backlight sources 1322, the emitted colors of the multiple backlight sources 1322 can be the same or different. Figure 2 An example is shown where a driver chip 1321 is connected to multiple backlights 1322 with different emitting colors, i.e., a driver chip 1321 is connected to multiple red backlights, multiple green backlights and multiple blue backlights respectively.

[0029] In specific implementations, the backlight 1322 in this application embodiment can be a light-emitting diode (LED), a mini light-emitting diode (Mini LED), an active matrix mini light-emitting diode (AM mini-LED), etc., which will not be listed here.

[0030] Reference Figure 2Multiple driver chips 1321 are arranged in an array on the display panel 132. Exemplarily, multiple driver chips 1321 located in the same column can be connected in series. Dimming data sent by the backlight controller 131 can be sequentially transmitted to each driver chip 1321 in the series path. Each driver chip 1321 can control the brightness of its connected backlight 1322 according to the dimming data it receives. Furthermore, each driver chip 1321 is also connected to a power supply terminal VDD and a ground terminal GND, respectively. The power supply terminal VDD is used to supply power to the driver chip 1321, and the ground terminal GND is used to ground the driver chip 1321.

[0031] The backlight panel 132 also has multiple power modules 1323. The number of power modules 1323 can be determined according to the color of the backlight 132 on the backlight panel 132. Different power modules are used to provide power supply voltage to the backlight of the corresponding color. For example, refer to Figure 2 Taking multiple backlights 1322, including red, green, and blue backlights, as an example, three power modules 1323 are set accordingly: power module 1, power module 2, and power module 3. Among them, power module 1 provides power supply voltage for the red backlight, power module 2 provides power supply voltage for the green backlight, and power module 3 provides power supply voltage for the blue backlight.

[0032] It should be noted that, Figure 2 This application provides only an exemplary driving architecture for a backlight panel. In actual applications, the number of driving chips 1321, the layout of the backlight 1322, and the configuration of the power module 1323 can be adjusted according to the size of the backlight panel 132, the number of partitions, and design requirements. This application does not limit these aspects.

[0033] Furthermore, to achieve high-precision temperature acquisition of the backlight, the embodiments of this application have made the following improvements to the structure of the backlight panel in the backlight circuit: Figure 3 This is a schematic diagram of a backlight circuit provided in an embodiment of this application. Figure 3 As shown, the backlight circuit includes a backlight panel 132 and a backlight control chip 500. The backlight control chip 500 is used to execute the relevant processes of the backlight compensation method provided in the embodiments of this application (see subsequent embodiments for details). Specifically, the backlight control chip 500 may include... Figure 1A or Figure 1B The backlight controller 131, timing controller 121 and main processor 11 are at least one of which can be flexibly configured according to the specific internal architecture of the display device, thereby facilitating system integration and functional expansion.

[0034] like Figure 2 and Figure 3As shown, a plurality of temperature acquisition components 300 are also provided on the backlight panel 132; the plurality of temperature acquisition components 300 are arranged at intervals on the backlight panel 132 according to a preset arrangement. For example, the plurality of temperature acquisition components 300 can be evenly distributed on the backlight panel 132 in an array arrangement to cover different detection areas A1 of the entire backlight panel 132. Figure 3 The temperature acquisition component 300 is illustrated as an example of a 2x3 grid. Correspondingly, the backlight panel 132 includes a 2x3 detection area A1, with each detection area A1 corresponding to a temperature sensor 300. Each temperature acquisition component 300 is used to acquire the temperature data of its own detection area A1, and uses this temperature data and the backlight compensation method provided in this embodiment to compensate for the backlight brightness of the backlight source 1322 in the detection area A1 (see subsequent embodiments for details), thereby achieving the purpose of compensating for the color shift of the backlight source 1322 and improving color accuracy.

[0035] In the embodiments of this application, such as Figure 3 As shown, multiple temperature acquisition components 300 are respectively connected to the backlight control chip 500 to transmit their detected temperature data to the backlight control chip 500, so that the backlight control chip 500 executes the relevant processes of the backlight compensation method provided in this embodiment (see subsequent embodiments for details). In specific implementation, multiple temperature acquisition components 300 can be electrically connected to the backlight control chip 500 through the same communication bus. This communication bus supports a master-slave communication protocol, such as a single-wire protocol or an inter-integrated circuit (I-Wire) bus. 2 C) Protocols, etc. Among them, the backlight control chip 500 serves as the master device, and multiple temperature acquisition components 300 serve as slave devices, enabling centralized acquisition and processing of multiple temperature data.

[0036] Figure 4 This is a schematic diagram of a temperature acquisition component provided in an embodiment of this application. In specific implementations, the temperature acquisition component 300 can employ a digital temperature sensor. For example, a temperature sensor of model DS18B20 or GX18E20, which has advantages such as high accuracy, digital output, and strong anti-interference capability. Taking the DS18B20 temperature sensor as an example, this model of temperature sensor can have various physical forms. Figure 4 As shown, Figure 4 Images (a), (b), and (c) in the diagram illustrate different physical configurations of the DS18B20 temperature sensor. Figure 4 (d) in the middle is Figure 4The image (c) shows a top view of the temperature sensor in its physical form. This facilitates the integration and functional expansion of the temperature acquisition component 300, demonstrating good applicability and feasibility.

[0037] Furthermore, to improve the accuracy of temperature acquisition by the temperature acquisition component 300, the embodiments of this application also include the following design: Figure 5A This is a partial top view of a backlight panel provided in an embodiment of this application. Figure 5B for Figure 5A The diagram shows a cross-sectional view of the backlight panel at the dashed line AA. Figure 5A and Figure 5B As shown, the backlight panel 132 also includes a substrate 100 and a thermally conductive layer 200; the thermally conductive layer 200 is located on one side of the substrate 100 and covers part of the surface of the substrate 100, and a plurality of temperature acquisition components 300 are located on the side of the thermally conductive layer 200 away from the substrate 100, and the orthographic projection of at least one of the plurality of temperature acquisition components 300 on the substrate 100 is located within the orthographic projection range of the thermally conductive layer 200 on the substrate 100.

[0038] Specifically, the substrate 100, serving as the supporting base for the backlight panel 132, can be a printed circuit board (PCB) or other suitable substrate material, and circuit wiring is provided on the substrate 100 to realize electrical connections between various electronic devices. For example, the electrical connection between the backlight and the driver chip is realized through circuit wiring.

[0039] like Figure 2 , Figure 3 , Figure 5A and Figure 5B As shown, in a specific implementation, the backlight control chip 500 is electrically connected to multiple temperature acquisition components 300, and is electrically connected to the backlight source 1322 via the driver chip 1321. Specifically, the backlight control chip 500 sends the generated dimming data to the driver chip 1321, which generates a pulse width modulation (PWM) control signal based on the dimming data, and the PWM control signal controls the backlight source 1322 to emit light.

[0040] In this embodiment, at least one of the multiple temperature acquisition components 300 has its orthographic projection on the substrate 100 within the orthographic projection range of the thermally conductive layer 200 on the substrate 100. Similarly, the orthographic projections of the multiple backlights 1322 on the substrate 100 also fall within the orthographic projection range of the thermally conductive layer 200 on the substrate 100. This design aims to ensure that the temperature acquisition component 300 can effectively sense the temperature of the backlight 1322 through the thermally conductive layer 200. Specifically, the thermally conductive layer 200 covers areas of the backlight panel where heat is concentrated (such as the area where the backlight is located). By placing the temperature acquisition component 300 within the orthographic projection range of the thermally conductive layer 200, the heat generated by the backlight 1322 can be quickly conducted to the temperature acquisition component 300 through the thermally conductive layer 200. During this process, heat loss is minimal and negligible, resulting in the temperature acquired by the temperature acquisition component 300 being highly close to the actual temperature of its nearest backlight 1322, thereby effectively improving the real-time performance and accuracy of temperature acquisition.

[0041] For example, the substrate 100 can be an aluminum substrate, and the arrangement of the temperature acquisition components 300 can be flexibly adjusted according to design requirements. For instance, in one specific implementation, all temperature acquisition components 300 can be placed within the orthographic projection range of the heat-conducting layer 200, so that each temperature acquisition component 300 is thermally connected to the heat-conducting layer 200, thereby maximizing the consistency and uniformity of temperature acquisition. In another specific implementation, differentiated design can be made according to the thermal distribution characteristics and structural layout of the backlight panel: for detection areas with concentrated heat and high requirements for temperature compensation accuracy, the corresponding temperature acquisition components 300 are placed within the orthographic projection range of the heat-conducting layer 200 to ensure temperature measurement accuracy; for areas with lower heat or relatively lower requirements for compensation accuracy, some temperature acquisition components 300 are directly placed on the substrate 100 to simplify the structural layout or reduce costs.

[0042] In this embodiment, the heat-conducting layer 200 can be made of a metal material; in other words, the heat-conducting layer 200 can be a metal layer. Because metal materials have excellent thermal conductivity, the heat-conducting layer 200 formed therefrom can quickly and efficiently conduct the heat generated by the backlight 1322 during operation to the temperature acquisition component 300, effectively reducing heat loss along the conduction path. This allows the temperature acquisition component 300 to sense the actual temperature change of the backlight 1322 more promptly and accurately, thereby providing a high-precision temperature basis for subsequent backlight compensation and ensuring the accuracy and real-time performance of the compensation.

[0043] For example, the thermally conductive layer 200 can be a copper-plated layer formed of copper metal, utilizing the excellent thermal conductivity of copper to further improve heat conduction efficiency. In practical applications, the heat conduction effect can be enhanced by increasing the area of ​​the copper-plated layer (e.g., the area of ​​a single copper-plated area is greater than or equal to 10 mm²). Compared with the traditional method of suspending the temperature sensor, this application, through the direct or indirect contact between the thermally conductive layer 200 and the temperature acquisition component 300, can significantly shorten the heat conduction path. Actual measurements show that its temperature acquisition response speed can be improved by more than 50%, thereby capturing backlight temperature fluctuations more promptly and achieving rapid response to temperature changes.

[0044] It should be noted that this application does not limit the specific material of the heat-conducting layer 200. For example, the heat-conducting layer 200 can also be made of other single metal materials such as silver or aluminum, or a mixture of multiple metals or an alloy. At the same time, the thickness, coverage area, distribution pattern, etc. of the heat-conducting layer 200 can be flexibly adjusted according to the actual heat distribution characteristics and structural design requirements of the backlight panel. This application embodiment does not limit this as well.

[0045] Furthermore, to improve thermal conductivity, refer to Figure 5B The backlight panel 132 is also provided with a connecting medium layer 600, which is located between the heat-conducting layer 200 and the temperature acquisition component 300, and is in contact with the temperature acquisition component 300.

[0046] Specifically, the connecting dielectric layer 600 is formed on the side of the thermally conductive layer 200 facing away from the substrate 100, and there is no air gap between the connecting dielectric layer 600 and the thermally conductive layer 200 to ensure that heat can be continuously and stably conducted to the connecting dielectric layer 600. At the same time, the connecting dielectric layer 600 is in direct contact with the temperature acquisition component 300, and there is also no air gap between the connecting dielectric layer 600 and the temperature acquisition component 300, thereby avoiding thermal resistance caused by air gaps and further improving heat conduction efficiency.

[0047] Simultaneously, the orthographic projection of the connecting dielectric layer 600 on the substrate 100 overlaps with the orthographic projection of the temperature acquisition component 300 on the substrate 100. This means the connecting dielectric layer 600 and the temperature acquisition component 300 are configured in a one-to-one correspondence, filling the minute gap between the heat-conducting layer 200 and the temperature acquisition component 300, thus forming a continuous and tight heat conduction path. This design further reduces heat loss along the conduction path, ensuring that the temperature acquisition component 300 can quickly and accurately sense the true temperature of the backlight 1322, thereby providing a high-precision temperature basis for backlight compensation.

[0048] In this embodiment, the connecting dielectric layer 600 can be made of thermally conductive adhesive or thermally conductive silicone grease to fill the tiny gap between the thermally conductive layer 200 and the temperature acquisition component 300, further reducing thermal resistance and improving heat conduction efficiency. It should be noted that this embodiment does not limit the specific material of the connecting dielectric layer 600, as long as it has good thermal conductivity. For example, other thermally conductive materials such as thermally conductive pads or thermally conductive tapes can also be used. Alternatively, the heat dissipation pads on the substrate 100 can be used as the connecting dielectric layer 600. The specific implementation is flexible and diverse, and this embodiment does not impose specific limitations.

[0049] In another embodiment, when the heat-conducting layer 200 and the temperature acquisition component 300 can achieve a tight fit with no obvious gap between the contact surfaces, the connecting medium layer 600 can be omitted. In this case, the temperature acquisition component 300 directly contacts the heat-conducting layer 200, and effective heat conduction can still be achieved. This application does not specifically limit whether or not to provide the connecting medium layer 600.

[0050] Furthermore, in this embodiment, the backlight control chip 500 can either integrate backlight control functions or be used in conjunction with a backlight controller; this embodiment does not limit the specific functionality. For example, the backlight control chip 500 can be the backlight controller 131 described in the preceding embodiments, or it can be a chip that integrates data processing and backlight control functions, such as a chip that integrates microcontroller unit (MCU) functions and backlight control functions.

[0051] Based on the aforementioned backlight circuit structure design, this application embodiment also provides a backlight compensation method, which can be applied to the aforementioned backlight control chip 500. Through this method, the backlight control chip 500 can accurately calculate the target temperature of each backlight zone on the backlight panel based on the temperature data collected by the temperature acquisition component 300, and accordingly perform dynamic compensation on the backlight source 1322, thereby achieving high-precision backlight brightness adjustment. Figure 6 The diagram shown is a flowchart illustrating a backlight compensation method provided in an embodiment of this application. The method includes the following steps: S601: Obtain the current temperature collected by multiple temperature acquisition components set on the backlight panel. The current temperature is used to indicate the temperature of the backlight panel substrate at the location of the corresponding temperature acquisition component.

[0052] S602: Based on the current temperature, the first arrangement of multiple temperature acquisition components on the backlight panel, and the second arrangement of multiple backlight zones on the backlight panel, determine the target temperature of the backlight source in each backlight zone.

[0053] S603: For any backlight zone, compensate the initial dimming data of the backlight zone according to the target temperature of the backlight source in the backlight zone to obtain the target dimming data of the backlight zone.

[0054] S604: Controls the luminous brightness of the backlight in the corresponding backlight zone based on the target dimming data.

[0055] Thus, since the target temperature of the backlight in each backlight zone is determined based on the current temperature collected by multiple temperature acquisition components on the backlight panel, combined with the spatial arrangement of these components and the backlight zones, the obtained target temperature can more accurately reflect the true temperature of the backlight. Compared to the existing technology that indirectly adjusts the backlight brightness by collecting ambient temperature, the target temperature obtained in this application has higher accuracy. Based on this, using the highly accurate target temperature for backlight compensation can effectively improve the precision of backlight compensation, ensure the accuracy of the backlight brightness, reduce or even eliminate color shift caused by temperature changes, thereby significantly improving the color accuracy and overall visual experience of the displayed image and optimizing display performance.

[0056] The steps described above in this application will be explained in detail below with reference to specific embodiments.

[0057] In this embodiment, a backlight zone on the backlight panel 132 is a basic unit capable of independent backlight control. In some embodiments, the area where one or more backlight sources 1322 connected to an output channel of a driver chip 1321 are located can be considered as a backlight zone. Thus, corresponding to the array arrangement of multiple backlight sources 1322 on the backlight panel 132, the second arrangement of multiple backlight zones on the backlight panel 132 is also an array arrangement.

[0058] Furthermore, the arrangement of the multiple temperature acquisition components 300 on the backlight panel 132 can be varied, and can be adapted to factors such as the shape and size of the backlight panel 132. For example, the multiple temperature acquisition components 300 can be arranged in an array on the backlight panel 132. Figure 3 A schematic diagram shows the temperature acquisition components 300 arranged in a 2-row × 3-column array on the backlight panel 132. Alternatively, multiple temperature acquisition components 300 may be arranged in other feasible ways on the backlight panel 132, such as in a single row or a single column, and this embodiment does not limit this arrangement.

[0059] For ease of explanation, the following embodiments are described using the example of multiple temperature acquisition components 300 arranged in an array on the backlight panel 132.

[0060] During the execution of step S601, refer to Figure 3Since the backlight control chip 500 is connected to each temperature acquisition component 300 via a communication bus, after multiple temperature acquisition components 300 acquire the current temperature, the backlight control chip 500 can read multiple current temperatures through this communication bus. Furthermore, to simplify the internal wiring layout of the backlight circuit, the backlight control chip 500 is connected to each temperature acquisition component 300 via a single communication bus. In this case, the backlight control chip 500 can sequentially read the current temperature of each temperature acquisition component 300 using a polling method. The polling order can be flexibly set according to actual needs. For example, when multiple temperature acquisition components 300 are arranged in an array, a "Z"-shaped order can be used to read the current temperature.

[0061] In addition, the backlight control chip 500 can acquire the current temperature collected by each temperature acquisition component 300 according to a preset sampling period. Specifically, the backlight control chip 500 initiates communication requests to each temperature acquisition component 300 sequentially at fixed time intervals or fixed frequencies (e.g., 10 times per second) to obtain the current temperature collected by each temperature acquisition component 300 at the current moment, thereby ensuring the timeliness and efficiency of temperature information updates.

[0062] As can be seen from the foregoing embodiments, each temperature acquisition component 300 is disposed on the substrate 100 of the backlight panel 132. Therefore, the current temperature acquired in real time by each temperature acquisition component 300 is essentially the temperature of the substrate 100 at its location. Furthermore, based on the arrangement of the temperature acquisition components 300 in the foregoing embodiments (see Appendix...), Figure 5A and appendix Figure 5B (As per the corresponding description), the real-time temperature acquired by the temperature acquisition component 300 is basically consistent with the temperature of its nearest backlight 1322. After the backlight control chip 500 acquires multiple current temperatures, the target temperature of the backlight in each backlight zone on the backlight panel is further calculated using the method in step S602, as follows: Figure 7 This is a schematic diagram illustrating the correspondence between the backlight partitions and the detection area of ​​the temperature acquisition component provided in an embodiment of this application. It can be referred to concurrently. Figure 2 , Figure 3 and Figure 7 In this embodiment, to simplify the hardware structure of the backlight circuit and reduce the cost of the display device, only a small number of temperature acquisition components 300 are provided on the backlight panel 132. For example, 25 temperature acquisition components 300 can be provided, arranged in a 5x5 array. However, the number of backlight zones B1 on the backlight panel 132 is usually large, especially in display devices with high-precision backlight control. Therefore, the detection area A1 corresponding to one temperature acquisition component 300 will correspond to multiple backlight zones B1. Figure 7This is an example of a detection area A1 corresponding to 5 rows × 7 columns of backlight partitions B1.

[0063] In order to accurately determine the actual temperature of multiple backlight zones within each detection area A1 (i.e., the actual temperature of the backlight source in each backlight zone), this embodiment of the application performs mapping calculations on the current temperature directly collected by each temperature acquisition component 300 based on the arrangement of multiple temperature acquisition components 300 on the backlight panel 132 and the arrangement of multiple backlight zones on the backlight panel 132, thereby obtaining the target temperature of the backlight source in each backlight zone.

[0064] like Figure 8 The diagram shown is a flowchart illustrating a method for determining the target temperature of the backlight in a backlight zone by executing step S602, according to an embodiment of this application. Specifically, it may include the following steps: S701: For any backlight zone, based on the first arrangement, the first position information of the backlight zone on the backlight panel is mapped to obtain the second position information of the backlight zone.

[0065] In specific implementation, refer to Figure 7 For any one of the multiple backlight zones B1 on the backlight panel 132, the first position information of the backlight zone B1 on the backlight panel 132 can be determined according to the arrangement of the multiple backlight zones B1 on the backlight panel 132; wherein, the first position information may include the row position information X and column position information Y of the backlight zone 132.

[0066] For example, taking the arrangement of multiple backlight zones on the backlight panel in an array of 32 rows × 18 columns as an example, for the backlight zone located in the 20th row and the 5th column, its first position information can be represented as (20, 5). In other words, the row position information X of the backlight zone is 20 and the column position information Y is 5.

[0067] After determining the first position information of each backlight partition, the first position information can be mapped and calculated according to the first arrangement to obtain multiple second position information. It can be understood that, corresponding to the first position information, the second position information also includes row position information X_index and column position information Y_index. In other words, by mapping and calculating the row position information X in the first position information, the row position information X_index is obtained; and by mapping and calculating the column position information Y in the first position information, the column position information Y_index is obtained. Specifically, this may include the following steps: S701-1: Based on the first arrangement, determine the first quantity and the second quantity of temperature acquisition components 300 on the backlight panel 132, wherein the first quantity is used to indicate the number of rows of temperature acquisition components 300 on the backlight panel 300, and the second quantity is used to indicate the number of columns of temperature acquisition components 300 on the backlight panel 300.

[0068] For example, if the temperature acquisition component 300 is configured in a 5x5 array, then the first quantity is 5 and the second quantity is 5. Of course, if the temperature acquisition component 300 is configured in a 1x5 array, then the first quantity is 1 and the second quantity is 5.

[0069] Similarly, based on the arrangement of multiple backlight zones on the backlight panel, the third and fourth quantities corresponding to the backlight zones on the backlight panel 132 can be determined. The third quantity indicates the number of rows of the backlight zones on the backlight panel, and the fourth quantity indicates the number of columns of the backlight zones on the backlight panel. For example, if the multiple backlight zones on the backlight panel 132 are arranged in a 32-row × 18-column array, then the third quantity is 32 and the fourth quantity is 18.

[0070] S701-2: Determine the mapping coefficient based on the first quantity, the second quantity, and the third and fourth quantities corresponding to the backlight zones on the backlight panel.

[0071] In this embodiment, to map the row position information X and column position information Y of the backlight partition, the mapping coefficients may include a row direction mapping coefficient K1 and a column direction mapping coefficient K2. The row direction mapping coefficient K1 can be determined based on a first quantity and a third quantity. Specifically, the row direction mapping coefficient K1 can be the ratio of the third quantity to the first quantity. The column direction mapping coefficient K2 can be determined based on the first column data and a fourth quantity. Specifically, the column direction mapping coefficient K2 can be the ratio of the fourth quantity to the first column data.

[0072] For example, if the first quantity is 5, the second quantity is 5, the third quantity is 32, and the fourth quantity is 18, then the row direction mapping coefficient K1 = 32 / 5 = 6.4; the column direction mapping coefficient K2 = 18 / 5 = 3.6.

[0073] S701-3: The first position information is mapped and calculated according to the mapping coefficient to obtain the second position information.

[0074] In this embodiment, since the mapping coefficients include row direction mapping coefficient K1 and column direction mapping coefficient K2, the row position information X can be mapped using the row direction mapping coefficient K1 to obtain the row position information X_index. Specifically, the row position information X_index is the ratio of the row position information X to the row direction mapping coefficient K1, i.e., X_index = X / K1. Similarly, the column position information Y is mapped using the column direction mapping coefficient K2 to obtain the column position information Y_index. Specifically, the column position information Y_index is the ratio of the column position information Y to the column direction mapping coefficient K2, i.e., Y_index = Y / K2. Therefore, based on the row position information X_index and the column position information Y_index, the second position information of the backlight partition can be determined.

[0075] For example, taking the backlight partition located in the 20th row and 5th column as an example, and taking the row direction mapping coefficient K1=6.4 and the column direction mapping coefficient K2=3.6 as an example, the row position information X_index=X / K1=20 / 6.4=3.125 and the column position information Y_index=Y / K2=5 / 3.6=1.389 corresponding to this backlight partition, that is, the second position information is (3.125, 1.389).

[0076] S702: Based on the second position information and the third position information of multiple temperature acquisition components on the backlight panel, determine the target temperature acquisition component among the multiple temperature acquisition components.

[0077] In the embodiments of this application, reference is made to Figure 3 Based on the first arrangement, the third position information of each temperature acquisition component 300 on the backlight panel 132 can be determined. This third position information includes the row position information X' and column position information Y' of the temperature acquisition component 300. For example, taking a configuration where multiple temperature acquisition components 300 are arranged in a 5x5 array on the backlight panel 132, the third position information of the backlight partition located in the 3rd row and 2nd column can be represented as (3, 2). In other words, the row position information X' of this backlight partition is 3, and the column position information Y' is 2.

[0078] After determining the third position information of each temperature acquisition component 300, the backlight control chip 500 can select at least one temperature acquisition component 300 as the target temperature acquisition component from among multiple temperature acquisition components 300, based on the second position information of the backlight partition and the third position information of the temperature acquisition components 300. Specifically, this may include the following steps: S702-1: For the second position information of each backlight partition: round the row position information to obtain at least one row index value, and round the column position information to obtain at least one column index value.

[0079] In this embodiment, during the rounding process of the row position information X_index, the backlight control chip 500 can round down to generate row index value 1 and round up to generate row index value 2. Similarly, during the rounding process of the column position information Y_index, the backlight control chip 500 can round down to generate column index value 1 and round up to generate column index value 2.

[0080] For example, taking the second position information (3.125, 1.389) in the aforementioned example as an example, the row position information X_index=3.125 is rounded down to get row index value 1 as 3, and rounded up to get row index value 2 as 4; the column position information Y_index=1.389 is rounded down to get column index value 1 as 1, and rounded up to get column index value 2 as 2.

[0081] Furthermore, it is understood that the row index value and / or column index value calculated using step S702-1 may be the same or different for the second position information of different backlight partitions, and this application embodiment does not impose any restrictions on this.

[0082] For example, the backlight partition located at row 20, column 5 is defined as backlight partition 1, and the backlight partition located at row 19, column 3 is defined as backlight partition 2. Then, the second position information of backlight partition 1 calculated using step S701-3 is (3.125, 1.389), and the second position information of backlight partition 2 is (2.969, 0.833). Next, using step S702-1, the index values ​​corresponding to the two backlight partitions are calculated respectively: the row position information in the second position information of backlight partition 1 is rounded down, resulting in a row index value of 3; the row position information in the second position information of backlight partition 2 is rounded up, also resulting in a row index value of 3. Furthermore, the column position information in the second position information of backlight partition 1 is rounded down, resulting in a column index value of 1; the column position information in the second position information of backlight partition 2 is rounded up, also resulting in a column index value of 1. Therefore, backlight partition 1 and backlight partition 2 can correspond to the same set of row / column index values.

[0083] S702-2: Construct at least one index location information based on at least one row index value and at least one column index value.

[0084] Specifically, the backlight control chip 500 obtains two row index values, row index 1 and row index 2, by rounding the row position information X_index; and obtains two column index values, column index 1 and column index 2, by rounding the column position information Y_index. Combining these two row index values ​​and two column index values ​​yields four index position information values.

[0085] For example, if row index 1 is 3, row index 2 is 4, column index 1 is 1, and column index 2 is 2, the constructed index position information is (3, 1), (3, 2), (4, 1) and (4, 2).

[0086] S702-3: Based on at least one index position information and the third position information of each of the multiple temperature acquisition components, select at least one temperature acquisition component as the target temperature acquisition component from among the multiple temperature acquisition components.

[0087] Specifically, the backlight control chip 500 can compare the at least one index position information determined in step S702-2 with the third position information of each temperature acquisition component 300, and determine the temperature acquisition component 300 whose third position information matches the index position information as the target temperature acquisition component. The target temperature acquisition component determined in this way is one or more temperature acquisition components that are closest to the current backlight zone among the multiple temperature acquisition components 300, and the current temperature acquired by it best reflects the actual temperature of the backlight in the current backlight zone.

[0088] For example, taking the index position information determined in the aforementioned example as (3,1), (3,2), (4,1) and (4,2) as an example, the four temperature acquisition components 300 with the third position information as (3,1), (3,2), (4,1) and (4,2) are used as target temperature acquisition components.

[0089] It should be noted that for backlight zones located at the edges or corners of the backlight panel, the index values ​​obtained by rounding up or down may exceed the index range of the temperature acquisition components. For example, for a temperature acquisition component 300 arranged in a 5x5 array, its row index range is greater than or equal to 0 and less than or equal to 4, and its column index range is also greater than or equal to 0 and less than or equal to 4. When the calculated index value is greater than 4, it is considered an invalid index value. In this case, only the temperature acquisition component corresponding to the index position information constructed from the valid index value is used as the target temperature acquisition component. There may be two or one target temperature acquisition components.

[0090] S703: Determine the target temperature of the backlight in the backlight zone based on the current temperature and second position information of the target temperature acquisition component.

[0091] In this embodiment, after determining the target temperature acquisition component, the backlight control chip 500 can further calculate the target temperature of the backlight source in the current backlight zone based on the current temperature acquired by the target temperature acquisition component and the second position information of the current backlight zone. The target temperature determined in this way is approximately equal to the actual temperature of the backlight source in the current backlight zone, with a small error and high accuracy of the temperature measurement result, thus providing a good foundation for subsequent backlight brightness compensation using the target temperature.

[0092] Specifically, embodiments of this application can utilize the second location information to perform a weighted calculation on the current temperature of the target temperature acquisition component to obtain the target temperature of the backlight in the backlight zone. This may include the following steps: S703-1: Calculate the first weight X_p based on row position information, and calculate the second weight Y_p based on column position information.

[0093] In this embodiment, the backlight control chip 500 can use the fractional part of the row position information X_index as a first weight X_p. This first weight X_p is used to characterize the relative distance between the point represented by the row position information and the row index value 1, that is, the proportion of this distance in the row index range formed by row index value 1 and row index value 2. Similarly, the fractional part of the column position information Y_index can be used as a second weight Y_p. This second weight Y_p is used to characterize the relative distance between the point represented by the column position information and the column index value 1, that is, the proportion of this distance in the column index range formed by column index value 1 and column index value 2.

[0094] For example, still using the row position information X_index=3.125 and column position information Y_index=1.389 from the previous example, the decimal part of the row position information X_index=3.125 is used as the first weight X_p, i.e., the first weight X_p=0.125. This first weight X_p represents the distance of the target point in the row direction from the row index value 13 (i.e., the lower limit of the row index), accounting for 12.5% ​​of the row index range (3 to 4). The decimal part of the column position information Y_index=1.389 is used as the second weight Y_p, i.e., the second weight Y_p=0.389. This second weight Y_p represents the distance of the target point in the column direction from the column index value 11 (i.e., the lower limit of the column index), accounting for 38.9% of the column index range (1 to 2).

[0095] S703-2: Based on the first and second weights, perform linear interpolation calculation on the current temperature of the target temperature acquisition component to obtain the target temperature of the backlight in the backlight partition.

[0096] In this embodiment, after determining the first weight X_p and the second weight Y_p, the backlight control chip 500 can use the first weight X_p and the second weight Y_p to perform bilinear interpolation calculation on the current temperature of the target temperature acquisition component to obtain the target temperature of the backlight in the backlight partition. This embodiment provides two specific optional bilinear interpolation calculation methods, as follows: In one feasible implementation, the backlight control chip 500 can first perform linear interpolation calculation in the row direction based on the current temperature of the target acquisition component based on the first weight X_p, and then perform linear interpolation in the column direction based on the second weight Y_p. Specifically, this may include the following steps: S703-2-A1: The backlight control chip 500 can perform two linear interpolation calculations on the current temperature of the target temperature acquisition component based on the first weight X_p, and obtain the first interpolation result T1 and the second interpolation result T2 respectively.

[0097] In practical implementation, multiple target temperature acquisition components can be grouped according to different row index values. For example, the first group of target temperature acquisition components can be determined based on row index value 1, and the row position information of the target temperature acquisition components in this group is equal to row index value 1; and the second group of target temperature acquisition components can be determined based on row index value 2, and the row position information of the target temperature acquisition components in this group is equal to row index value 2.

[0098] For example, taking the previous example with row index 1 as 3, row index 2 as 4, column index 1 as 1, and column index 2 as 2, and taking the third position information of the target temperature acquisition components as (3,1), (3,2), (4,1), and (4,2), the temperature acquisition components with the third position information of (3,1) and (3,2) are taken as the first group of target temperature acquisition components, and the temperature acquisition components with the third position information of (4,1) and (4,2) are taken as the second group of target temperature acquisition components.

[0099] Next, for the first group of target temperature acquisition components, the current temperature of these components is used as the two endpoints of the same row. A linear interpolation along the row direction is performed using the first weight X_p to obtain the first interpolation result T1. Specifically, the linear interpolation calculation can be performed using the following formula: T1 = (D2 - D1) × X_p + D1; Where T1 is the first interpolation result, D1 is the current temperature of the target temperature acquisition component with smaller column position information in the first group of target temperature acquisition components, D2 is the current temperature of the target temperature acquisition component with larger column position information in the first group of target temperature acquisition components, and X_p is the first weight.

[0100] Similarly, for the second group of target temperature acquisition components, the current temperature of these components is used as the two endpoints of the same row. A linear interpolation along the row direction is performed using the first weight X_p to obtain the second interpolation result T2. Specifically, the linear interpolation calculation can be performed using the following formula: T2 = (D4 - D3) × X_p + D3; Where T2 is the second interpolation result, D3 is the current temperature of the target temperature acquisition component with smaller column position information in the second group of target temperature acquisition components, D4 is the current temperature of the target temperature acquisition component with larger column position information in the second group of target temperature acquisition components, and X_p is the first weight.

[0101] For example, consider a first group of target temperature acquisition components including temperature acquisition components with third position information of (3,1) and (3,2), and a second group of target temperature acquisition components including temperature acquisition components with third position information of (4,1) and (4,2). Table 1 shows an example of the current temperature acquired by multiple temperature acquisition components 300:

[0102] Table 1

[0103] Referring to Table 1, for the first group of target temperature acquisition components: the current temperature of the target temperature acquisition component with the third position information (3,1) is D1, and D1=50℃; the current temperature of the target temperature acquisition component with the third position information (3,2) is D2, and D2=65℃. Then the first interpolation result T1=(65-50)×0.125+50=51.875℃.

[0104] For the second group of target temperature acquisition components: the current temperature of the target temperature acquisition component with the third position information (4,1) is D3, and D3=60℃; the current temperature of the target temperature acquisition component with the third position information (4,2) is D4, and D4=65℃. Then the second interpolation result T2=(65-60)×0.125+60=60.625℃.

[0105] S703-2-A2: The backlight control chip 500 performs linear interpolation calculations on the first interpolation result T1 and the second interpolation result T2 based on the second weight Y_p, and uses the generated interpolation result as the target temperature Td of the backlight in the backlight partition.

[0106] Specifically, the first interpolation result T1 and the second interpolation result T2 are taken as two endpoints on the same column. A linear interpolation calculation is performed on these two interpolation results in the column direction using the second weight Y_p. The calculated result is the target temperature Td of the backlight. The linear interpolation calculation can be performed using the following formula: Td = (T2 - T1) × Y_p + T1; Where Td is the target temperature of the backlight in the backlight partition, T1 is the first interpolation result, T2 is the second interpolation result, and Y_p is the second weight.

[0107] For example, taking the second weight Y_p=0.389, the first interpolation result T1=51.875℃, and the second interpolation result T2=60.625℃ as an example, the target temperature of the backlight in the backlight zone is Td=(60.625-51.875)×0.389+51.875=55.279℃.

[0108] In another feasible implementation, the backlight control chip 500 can first perform linear interpolation calculation in the column direction based on the second weight Y_p to calculate the current temperature of the target acquisition component, and then perform linear interpolation in the row direction based on the first weight X_p. Specifically, this may include the following steps: S703-2-B1: The backlight control chip 500 can perform column-direction linear interpolation calculation on the current temperature of the target temperature acquisition component based on the second weight Y_p, and obtain the third interpolation result T3 and the fourth interpolation result T4.

[0109] In practical implementation, multiple target temperature acquisition components can be grouped according to different column index values. For example, the first group of target temperature acquisition components can be determined based on column index value 1, and the third column position information of the target temperature acquisition components in this group is all equal to column index value 1; and the second group of target temperature acquisition components can be determined based on column index value 2, and the third column position information of the target temperature acquisition components in this group is all equal to column index value 2.

[0110] For example, taking the previous example with row index 1 as 3, row index 2 as 4, column index 1 as 1, and column index 2 as 2, and taking the third position information of the target temperature acquisition components as (3,1), (3,2), (4,1), and (4,2) respectively, the temperature acquisition components with the third position information of (3,1) and (4,1) are taken as the first group of target temperature acquisition components, and the temperature acquisition components with the third position information of (3,2) and (4,2) are taken as the second group of target temperature acquisition components.

[0111] Next, for the first group of target temperature acquisition components, the current temperature of these components is used as the two endpoints of the same column. A linear interpolation along the column direction is then performed using the second weight Y_p to obtain the third interpolation result T3. Specifically, the linear interpolation calculation can be performed using the following formula: T3 = (D3 - D1) × Y_p + D1; Where T3 is the third interpolation result, D1 is the current temperature of the target temperature acquisition component with smaller line position information in the first group of target temperature acquisition components, D3 is the current temperature of the target temperature acquisition component with larger line position information in the first group of target temperature acquisition components, and Y_p is the second weight.

[0112] Similarly, for the second group of target temperature acquisition components, the current temperature of these components is used as the two endpoints of the same column. A linear interpolation along the column direction is performed using the second weight Y_p to obtain the fourth interpolation result T4. Specifically, the linear interpolation calculation can be performed using the following formula: T4 = (D4 - D2) × Y_p + D2; Where T4 is the fourth interpolation result, D2 is the current temperature of the target temperature acquisition component with smaller line position information in the second group of target temperature acquisition components, D4 is the current temperature of the target temperature acquisition component with larger line position information in the second group of target temperature acquisition components, and Y_p is the second weight.

[0113] For example, the first group of target temperature acquisition components includes temperature acquisition components with third position information of (3,1) and (4,1), and the second group of target temperature acquisition components includes temperature acquisition components with third position information of (3,2) and (4,2).

[0114] Referring to Table 1, for the first group of target temperature acquisition components: the current temperature of the target temperature acquisition component with the third position information (3,1) is D1, and D1=50℃; the current temperature of the target temperature acquisition component with the third position information (4,1) is D3, and D3=60℃. Then the third interpolation result T3=(60-50)×0.389+50=53.89℃.

[0115] For the second group of target temperature acquisition components: the current temperature of the target temperature acquisition component with the third position information (3,2) is D2, and D2=65℃; the current temperature of the target temperature acquisition component with the third position information (4,2) is D4, and D4=65℃, then the second interpolation result T2=(65-65)×0.389+65=65℃.

[0116] S703-2-B2: The backlight control chip 500 performs linear interpolation calculations on the third interpolation result T3 and the fourth interpolation result T4 based on the first weight X_p, and uses the generated interpolation result as the target temperature Td of the backlight in the backlight partition.

[0117] Specifically, the third interpolation result T3 and the fourth interpolation result T4 are taken as two endpoints on the same row. Linear interpolation is performed along the row direction using the first weight X_p, and the result is the target temperature Td of the backlight. The linear interpolation can be calculated using the following formula: Td = (T4 - T3) × X_p + T3; Where Td is the target temperature of the backlight in the backlight partition, T3 is the third interpolation result, T4 is the fourth interpolation result, and X_p is the first weight.

[0118] For example, taking the first weight X_p=0.125, the third interpolation result T3=53.89℃, and the fourth interpolation result T4=65℃ as an example, the target temperature of the backlight in the backlight zone is Td=(65-53.89)×0.125+53.89=55.279℃.

[0119] It is understood that in practical applications, the technical solution of this application can be achieved regardless of whether linear interpolation in the row direction is performed first and then linear interpolation in the column direction, or vice versa. The specific order can be flexibly set according to actual needs, and this application embodiment does not limit this. Thus, by providing two optional interpolation orders, the backlight control chip 500 can flexibly choose according to actual computing resources or hardware architecture, while ensuring the accuracy and consistency of temperature estimation results.

[0120] Furthermore, after calculating the target temperature of the backlight source in each backlight zone, the backlight control chip 500 can compensate for the initial dimming data of each backlight zone using the method in step S603, thereby adjusting the luminous brightness of the backlight source in each backlight zone. Specifically, this may include the following steps: S603-1: The backlight control chip 500 calculates the dimming compensation value corresponding to the backlight zone based on the target temperature of the backlight source in the backlight zone and the preset correspondence.

[0121] Specifically, the backlight control chip 500 internally stores a preset correspondence, which characterizes the relationship between temperature and current changes. This preset correspondence is pre-calibrated experimentally, recording the brightness decay characteristics of backlights with different emitting colors at different temperatures. For example, Table 2 below shows an example of a preset correspondence using RGB LEDs as a backlight:

[0122] Table 2

[0123] Specifically, the backlight control chip 500 can use the following method when executing S603-1: First, for any backlight zone, the backlight control chip 500 can determine the temperature range of the target temperature corresponding to that backlight zone in a preset correspondence, wherein the temperature range includes an upper limit temperature and a lower limit temperature.

[0124] In practical implementation, the backlight control chip 500 can take the interval formed by the two temperatures with the smallest difference from the target temperature corresponding to the backlight partition among the multiple temperatures included in the preset correspondence as the temperature interval of the target temperature in the preset correspondence. For example, referring to Table 2, taking the target temperature corresponding to the backlight partition as 88℃, it is within the temperature interval of 85℃ to 90℃, that is, the temperature interval corresponding to the target temperature is [85℃, 90℃], where the upper limit temperature of this temperature interval is 90℃ and the lower limit temperature is 85℃.

[0125] After determining the temperature range, the backlight control chip 500 determines the first current change value corresponding to the upper limit temperature and the second current change value corresponding to the lower limit temperature in the preset correspondence.

[0126] For example, taking a backlight zone with a target temperature of 88℃, a temperature range of [85℃, 90℃], and a backlight source of red LEDs as an example, as shown in Table 2: the upper limit temperature is 90℃, and the corresponding first current change value is 3.61A; the lower limit temperature is 85℃, and the corresponding second current change value is 2.51A.

[0127] Finally, the backlight control chip 500 determines the dimming compensation value based on the target temperature, upper limit temperature, lower limit temperature, first current change value, and second current change value.

[0128] Specifically, in determining the dimming compensation value, the following method can be used: the backlight control chip 500 first calculates the first difference between the target temperature and the lower limit temperature, and the second difference between the upper limit temperature and the lower limit temperature, and then calculates the first ratio between the first difference and the second difference. This first ratio represents the relative position of the target temperature within its temperature range.

[0129] For example, taking the target temperature corresponding to the backlight zone as 88℃ as an example, according to Table 2, its upper limit temperature is 90℃ and the lower limit temperature is 85℃. Then the first difference = target temperature - lower limit temperature = 88℃ - 85℃ = 3℃; the second difference = upper limit temperature - lower limit temperature = 90℃ - 85℃ = 5℃; and the first ratio = first difference / second difference = 3℃ / 5℃ = 0.6.

[0130] Then, the backlight control chip 500 calculates the difference between the first current change value and the second current change value to obtain the third difference value, and calculates the product of the third difference value and the first ratio value to obtain the current increment.

[0131] For example, taking a first ratio of 0.6, a first current change of 3.61A, and a second current change of 2.51A as an example, the third difference = first current change - second current change = 3.61A - 2.51A = 1.1A; the current increment = first ratio × third difference = 0.6 × 1.1A = 0.66A.

[0132] Finally, the backlight control chip 500 sums the current increment with the first current change value to obtain the dimming compensation value.

[0133] For example, taking a current increment of 0.66A and a first current change of 3.61A as an example, the dimming compensation value = current increment + first current change = 0.66A + 3.61A = 3.17A.

[0134] Therefore, the backlight control chip 500 can calculate the dimming compensation value corresponding to each backlight zone using the following formula: dT=(Temp-T1) / (T2-T1)×(DT2-DT1)+DT1; Where dT is the dimming compensation value corresponding to the backlight zone, Temp is the target temperature corresponding to the backlight zone, T1 is the lower limit temperature of the temperature range, T2 is the upper limit temperature of the temperature range, DT1 is the first current change value, and DT2 is the second current change value.

[0135] In practical implementation, for backlights of different emission colors (such as red, green, and blue LEDs), the backlight control chip 500 can independently calculate the dimming compensation value corresponding to each color of backlight to adapt to the different attenuation characteristics of different colored backlights with temperature changes. This enables more precise backlight compensation, specifically compensating for color shift issues caused by backlights of different emission colors, thereby improving the color accuracy of the displayed image.

[0136] S603-2: The backlight control chip 500 compensates the initial dimming data corresponding to the backlight zone based on the dimming compensation value to obtain the target dimming data corresponding to the backlight zone.

[0137] In practical implementation, after the backlight control chip 500 determines the dimming compensation value for each backlight zone, for any given backlight zone: the initial dimming data of that backlight zone can be compensated using the corresponding dimming compensation value to generate the target dimming data for that backlight zone. Then, the brightness of the backlight source within that backlight zone is controlled using the target dimming data, achieving precise control of the backlight.

[0138] In practical applications, dimming data typically includes current data and PWM data. For example, 16-bit dimming data can consist of 6 bits of current data and 10 bits of PWM data. In the embodiments of this application, any one or both of the current data and PWM data can be adjusted to obtain the target dimming data, and this application does not impose any limitations on this.

[0139] Taking the adjustment of only current data as an example: the initial dimming data includes initial current data and initial PWM data, the target dimming data includes target current data and target PWM data, and the dimming compensation value calculated according to the aforementioned embodiment includes the current compensation value. In the process of using the current compensation value to compensate the initial current data to obtain the target current data, the backlight control chip 500 may use calculation methods such as summation / weighted summation, and this application does not impose any restrictions on this.

[0140] In one specific implementation, this can be achieved through the following steps: First, the backlight control chip 500 determines the current increment data corresponding to the backlight partition based on the current compensation value and the initial current data corresponding to the backlight partition. Specifically, the backlight control chip 500 can first calculate the difference between the initial current data and the set current data corresponding to the backlight partition, where the set current data reflects the current data of the backlight source in the backlight partition under maximum white balance. Then, the product of the difference and the current compensation value is used as the current increment data. Finally, the backlight control chip 500 uses the sum of the initial current data and the corresponding current increment data as the target current data corresponding to the backlight partition.

[0141] Specifically, the backlight control chip 500 can determine the target current data using the following formula: I_out=(I_cur-I_set)×dT+I_cur; Where I_out is the target current data, (I_cur-I_set)×dT is the current increment data, I_cur is the initial current data, I_set is the set current data, and dT is the current compensation value.

[0142] It is understandable that the set current data I_set represents the current of backlights of different emission colors under maximum white balance. This data can be obtained from previous experiments, and the set current data I_set corresponding to different emission colors of backlights are different from each other. For example, the set current data I_set for red LEDs is 3.725A; the set current data I_set for green LEDs is 3.521A; and the set current data I_set for blue LEDs is 1.643A.

[0143] Then, the initial PWM data is directly used as the target PWM data, and the target dimming data is formed based on the target current data and the target PWM data.

[0144] Finally, the backlight control chip 500 controls the brightness of the backlight source in the corresponding backlight zone according to the target dimming data. In one feasible implementation, the backlight control chip 500 can directly control the brightness of the backlight source in the corresponding backlight zone according to the target dimming data. In another feasible implementation, the backlight control chip 500 can send the target dimming data to the driver chip on the backlight panel, and the driver chip provides operating current to the connected backlight source according to the target dimming data and generates a PWM control signal to control the backlight source to turn on or off, thereby realizing different brightness levels of the backlight source. It is understood that factors such as the magnitude of the operating current, the amplitude of the PWM control signal, and the duty cycle will affect the brightness of the backlight source, and the adjustment method is relatively flexible. This application embodiment does not impose specific limitations on this.

[0145] In this way, by controlling the backlight of each backlight zone to emit light at the compensated brightness, the brightness decay caused by temperature changes can be reduced or even offset, the color temperature stability of the backlight can be maintained, and more precise brightness control and more accurate color performance can be achieved.

[0146] The following will combine Figure 9 The overall workflow of this application is illustrated by way of example. Figure 9 This application provides an overall flowchart of a backlight compensation method, with the specific steps as follows: S801: Display device starts.

[0147] S802: The backlight control chip periodically collects the current temperature from each temperature acquisition component.

[0148] S803: The backlight control chip calculates the target temperature of the backlight in each backlight zone based on the current temperature of each temperature acquisition component.

[0149] S804: The backlight control chip calculates the dimming compensation value corresponding to the backlight zone based on the target temperature of the backlight source in the backlight zone and the preset correspondence.

[0150] S805: The backlight control chip compensates the initial dimming data corresponding to the backlight zone based on the dimming compensation value to obtain the target dimming data corresponding to the backlight zone.

[0151] S806: The backlight control chip sends target dimming data to the driver chip. The driver chip generates a PWM control signal based on the target dimming data and uses the PWM control signal to adjust the brightness of the backlight connected to it.

[0152] Through the above process, the closed-loop adjustment of temperature acquisition, target temperature calculation, dimming compensation value calculation, dimming data update and distribution, and backlight brightness driving is performed repeatedly according to the preset sampling cycle, thereby effectively offsetting the luminous characteristic drift and color deviation caused by the backlight operating temperature rise, and ensuring the color accuracy and white balance stability of the display screen.

[0153] In one embodiment, such as Figure 10 The diagram illustrates the signal flow of a backlight control chip according to an embodiment of this application. The backlight control chip 500 obtains the current temperature collected by multiple temperature acquisition components 300 on the backlight panel through temperature readback, and simultaneously monitors the power supply status of the backlight panel through readback status. Based on the real-time read temperature, the backlight control chip 500 calculates the dimming compensation value for the corresponding backlight zone. After completing temperature acquisition and dimming compensation value update, the backlight control chip 500 does not immediately output the compensation result, but waits for the next zone output opportunity. When a backlight zone needs brightness update, the backlight control chip 500 superimposes the newly calculated dimming compensation value with the initial output current value to generate the final output current value, and sends this output value as dimming data to the driver chip. Based on the received dimming data, the driver chip drives the backlight source to emit light through current adjustment or PWM, thereby achieving dynamic adjustment of the brightness of each backlight zone.

[0154] Meanwhile, the backlight control chip 500 monitors the power supply voltage of the backlight panel in real time by reading back the power supply status to check for overvoltage or undervoltage. When an abnormal power supply voltage is detected, the backlight control chip 500 sends a feedback signal to the power module. The power module adjusts the output voltage according to the feedback signal to provide a suitable operating voltage for the backlight, ensuring that the backlight operates in a stable power supply environment.

[0155] Through the above mechanism, the backlight control chip 500 can sense temperature fluctuations caused by changes in external ambient temperature or changes in the brightness of the backlight itself in real time. Based on the temperature collected by the high-precision temperature acquisition component, it can dynamically adjust the luminous brightness of each backlight zone by accurately calculating and adjusting the dimming compensation value in real time, thereby effectively offsetting the color shift caused by temperature changes, maintaining the color temperature stability of the backlight, and achieving stable white balance output.

[0156] Based on the same inventive concept, this embodiment of the invention also provides a backlight control chip. The implementation principle of the backlight control chip is similar to that of the aforementioned backlight compensation method. The specific implementation method of the backlight control chip can be found in the aforementioned backlight compensation method embodiment, and the repeated parts will not be described again.

[0157] like Figure 11 The diagram shown is a structural schematic of a backlight control chip provided in an embodiment of this application. The backlight control chip 500 may include: The receiving module 510 is used to acquire the current temperature collected by multiple temperature acquisition components set on the backlight panel. The current temperature is used to indicate the temperature of the backlight panel substrate at the location of the corresponding temperature acquisition component. Temperature processing module 520 is used to determine the target temperature of the backlight in each backlight zone based on the current temperature, the first arrangement of multiple temperature acquisition components on the backlight panel, and the second arrangement of multiple backlight zones on the backlight panel. The backlight compensation module 530 is used to compensate the initial dimming data of any backlight zone according to the target temperature of the backlight in the backlight zone, so as to obtain the target dimming data of the backlight zone. The backlight control module 540 is used to control the luminous brightness of the backlight in the corresponding backlight zone based on the target dimming data.

[0158] In one embodiment, the temperature processing module 520 is specifically used for: For any backlight zone, based on the first arrangement, the first position information of the backlight zone on the backlight panel is mapped to obtain the second position information of the backlight zone, wherein the first position information is determined based on the second arrangement. Based on the second position information and the third position information of multiple temperature acquisition components on the backlight panel, the target temperature acquisition component is determined among the multiple temperature acquisition components, wherein the third position information is determined based on the first arrangement. Based on the current temperature and second location information of the target temperature acquisition component, the target temperature of the backlight in the backlight zone is determined.

[0159] In one embodiment, the second position information includes row position information and column position information; the temperature processing module 520 is specifically used for: The first weight is calculated based on row position information, and the second weight is calculated based on column position information; Based on the first and second weights, the current temperature of the target temperature acquisition component is linearly interpolated to obtain the target temperature of the backlight in the backlight partition.

[0160] In one embodiment, the temperature processing module 520 is specifically used for: Based on the first weight, a linear interpolation calculation is performed on the current temperature of the target temperature acquisition component to obtain the first interpolation result and the second interpolation result; Based on the second weight, linear interpolation is performed on the first interpolation result and the second interpolation result, and the generated interpolation result is used as the target temperature of the backlight in the backlight partition.

[0161] In one embodiment, the temperature processing module 520 is specifically used for: Based on the second weight, linear interpolation is performed on the current temperature of the target temperature acquisition component to obtain the third and fourth interpolation results; Based on the first weight, linear interpolation is performed on the third and fourth interpolation results, and the generated interpolation results are used as the target temperature of the backlight in the backlight partition.

[0162] In one embodiment, the temperature processing module 520 is specifically used for: The second location information includes row location information and column location information; based on the second and third location information, the target temperature acquisition component is determined among multiple temperature acquisition components, including: The row position information is rounded to obtain at least one row index value, and the column position information is rounded to obtain at least one column index value; Construct at least one index location information based on at least one row index value and at least one column index value; Based on at least one index position information and the third position information of each of the multiple temperature acquisition components, at least one temperature acquisition component is selected as the target temperature acquisition component from among the multiple temperature acquisition components.

[0163] In one embodiment, the temperature processing module 520 is specifically used for: Based on the first arrangement, a first number and a second number of temperature acquisition components on the backlight panel are determined. The first number is used to indicate the number of rows of temperature acquisition components on the backlight panel, and the second number is used to indicate the number of columns of temperature acquisition components on the backlight panel. Based on the first quantity, the second quantity, and the third and fourth quantities corresponding to the backlight partitions on the backlight panel, the mapping coefficient is determined. The third quantity is used to indicate the number of rows of the backlight partitions on the backlight panel, and the fourth quantity is used to indicate the number of columns of the backlight partitions on the backlight panel. The second position information is obtained by calculating the first position information based on the mapping coefficient.

[0164] In one embodiment, the backlight compensation module 530 is specifically used for: Based on the target temperature of the backlight in the backlight zone and the preset correspondence, the dimming compensation value corresponding to the backlight zone is calculated. The preset correspondence is used to characterize the correspondence between temperature and current change value. Based on the dimming compensation value, the initial dimming data corresponding to the backlight zone is compensated to obtain the target dimming data corresponding to the backlight zone.

[0165] In one embodiment, the backlight compensation module 530 is specifically used for: Determine the temperature range of the target temperature corresponding to the backlight zone in the preset correspondence relationship, where the temperature range includes the upper limit temperature and the lower limit temperature; In the preset correspondence, determine the first current change value corresponding to the upper limit temperature and the second current change value corresponding to the lower limit temperature; The dimming compensation value is determined based on the target temperature, upper limit temperature, lower limit temperature, first current change value, and second current change value.

[0166] In one embodiment, the backlight compensation module 530 is specifically used for: Based on the first difference between the target temperature and the lower limit temperature, and the second difference between the upper limit temperature and the lower limit temperature, determine the first ratio of the first difference to the second difference; The product of the third difference and the first ratio is used to obtain the current increment, where the third difference is the difference between the first current change and the second current change. The dimming compensation value is obtained by summing the current increment with the first current change value.

[0167] In one embodiment, the dimming compensation value includes a current compensation value, and the initial dimming data includes initial current data; the backlight compensation module 530 is specifically used for: Based on the current compensation value and the initial current data corresponding to the backlight partition, determine the current increment data corresponding to the backlight partition. The sum of the initial current data and the corresponding current increment data is used as the target current data for the backlight partition, where the target dimming data includes the target current data.

[0168] Based on the same inventive concept, this embodiment of the invention also provides a backlight circuit. The implementation principle of the backlight circuit is similar to that of the aforementioned backlight compensation method. The specific implementation method of the backlight circuit can be found in the aforementioned backlight compensation method embodiment, and the repeated parts will not be described again.

[0169] Furthermore, the specific structural design of the backlight circuit provided in this application can be referred to the foregoing. Figure 3 The relevant descriptions of the corresponding embodiments will not be repeated here.

[0170] Based on the same inventive concept, this invention also provides a display device. The implementation principle of this display device is similar to that of the aforementioned backlight compensation method. The specific implementation of this display device can be found in the aforementioned backlight compensation method embodiments, and repeated details will not be described again.

[0171] Furthermore, the specific structural design of the display device provided in this application can be referred to the foregoing. Figures 1A to 3 The relevant descriptions of the corresponding embodiments will not be repeated here.

[0172] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0173] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A backlight compensation method, characterized in that, include: The current temperature is obtained from multiple temperature acquisition components set on the backlight panel, and the current temperature is used to indicate the temperature of the backlight panel substrate at the location of the corresponding temperature acquisition component. Based on the current temperature, the first arrangement of the multiple temperature acquisition components on the backlight panel, and the second arrangement of the multiple backlight zones on the backlight panel, the target temperature of the backlight in each of the backlight zones is determined. For any backlight zone, the initial dimming data of the backlight zone is compensated according to the target temperature of the backlight source in the backlight zone to obtain the target dimming data of the backlight zone. The brightness of the backlight in the corresponding backlight zone is controlled based on the target dimming data.

2. The method according to claim 1, characterized in that, The step of determining the target temperature of the backlight source in each of the backlight zones based on the current temperature, the first arrangement of the multiple temperature acquisition components on the backlight panel, and the second arrangement of the multiple backlight zones on the backlight panel includes: For any backlight zone, based on the first arrangement, the first position information of the backlight zone on the backlight panel is mapped to obtain the second position information of the backlight zone, wherein the first position information is determined based on the second arrangement. Based on the second position information and the third position information of the plurality of temperature acquisition components on the backlight panel, a target temperature acquisition component is determined among the plurality of temperature acquisition components, wherein the third position information is determined based on the first arrangement. Based on the current temperature of the target temperature acquisition component and the second location information, the target temperature of the backlight in the backlight zone is determined.

3. The method according to claim 2, characterized in that, The second location information includes row location information and column location information; determining the target temperature of the backlight in the backlight partition based on the current temperature of the target temperature acquisition component and the second location information includes: Based on the row position information, a first weight is calculated, and based on the column position information, a second weight is calculated. Based on the first weight and the second weight, the current temperature of the target temperature acquisition component is linearly interpolated to obtain the target temperature of the backlight in the backlight partition.

4. The method according to claim 3, characterized in that, The step of performing linear interpolation calculation on the current temperature of the target temperature acquisition component based on the first weight and the second weight to obtain the target temperature of the backlight in the backlight partition includes: Based on the first weight, the current temperature of the target temperature acquisition component is linearly interpolated to obtain a first interpolation result and a second interpolation result. Based on the second weight, linear interpolation is performed on the first interpolation result and the second interpolation result, and the generated interpolation result is used as the target temperature of the backlight in the backlight partition.

5. The method according to claim 3, characterized in that, The step of performing linear interpolation calculation on the current temperature of the target temperature acquisition component based on the first weight and the second weight to obtain the target temperature of the backlight in the backlight partition includes: Based on the second weight, a linear interpolation calculation is performed on the current temperature of the target temperature acquisition component to obtain a third interpolation result and a fourth interpolation result; Based on the first weight, linear interpolation is performed on the third interpolation result and the fourth interpolation result, and the generated interpolation result is used as the target temperature of the backlight in the backlight partition.

6. The method according to claim 2, characterized in that, The second location information includes row location information and column location information; the step of determining the target temperature acquisition component among the plurality of temperature acquisition components based on the second location information and the third location information of the plurality of temperature acquisition components on the backlight panel includes: The row position information is rounded to obtain at least one row index value, and the column position information is rounded to obtain at least one column index value; Based on the at least one row index value and the at least one column index value, at least one index location information is constructed; Based on the at least one index position information and the third position information of each of the plurality of temperature acquisition components, at least one temperature acquisition component is selected as the target temperature acquisition component from the plurality of temperature acquisition components.

7. The method according to claim 2, characterized in that, The step of mapping the first position information of the backlight partition on the backlight panel based on the first arrangement to obtain the second position information of the backlight partition includes: Based on the first arrangement, a first number and a second number of temperature acquisition components on the backlight panel are determined. The first number is used to indicate the number of rows of the temperature acquisition components on the backlight panel, and the second number is used to indicate the number of columns of the temperature acquisition components on the backlight panel. Based on the first quantity, the second quantity, and the third and fourth quantities corresponding to the backlight partitions on the backlight panel, a mapping coefficient is determined. The third quantity is used to indicate the number of rows of the backlight partitions on the backlight panel, and the fourth quantity is used to indicate the number of columns of the backlight partitions on the backlight panel. The second location information is obtained by calculating the first location information based on the mapping coefficient.

8. The method according to any one of claims 1 to 7, characterized in that, The step of compensating the initial dimming data of the backlight zone based on the target temperature of the backlight source in the backlight zone to obtain the target dimming data of the backlight zone includes: Based on the target temperature of the backlight in the backlight zone and the preset correspondence, the dimming compensation value corresponding to the backlight zone is calculated, wherein the preset correspondence is used to characterize the correspondence between temperature and current change value; Based on the dimming compensation value, the initial dimming data corresponding to the backlight zone is compensated to obtain the target dimming data corresponding to the backlight zone.

9. The method according to claim 8, characterized in that, The step of calculating the dimming compensation value corresponding to each backlight zone based on the target temperature of the backlight in the backlight zone and the preset correspondence includes: The target temperature corresponding to the backlight zone is determined to be within the temperature range of the preset correspondence, wherein the temperature range includes an upper limit temperature and a lower limit temperature; In the preset correspondence, determine the first current change value corresponding to the upper limit temperature and the second current change value corresponding to the lower limit temperature; The dimming compensation value is determined based on the target temperature, the upper limit temperature, the lower limit temperature, the first current change value, and the second current change value.

10. The method according to claim 9, characterized in that, The step of determining the dimming compensation value based on the target temperature, the upper limit temperature, the lower limit temperature, the first current change value, and the second current change value includes: Based on the first difference between the target temperature and the lower limit temperature, and the second difference between the upper limit temperature and the lower limit temperature, a first ratio of the first difference to the second difference is determined; The product of the third difference and the first ratio is calculated to obtain the current increment, wherein the third difference is the difference between the first current change value and the second current change value; The dimming compensation value is obtained by summing the current increment with the first current change value.

11. The method according to claim 8, characterized in that, The dimming compensation value includes a current compensation value, and the initial dimming data includes initial current data; the step of compensating the initial dimming data corresponding to the backlight zone based on the dimming compensation value to obtain the target dimming data corresponding to the backlight zone includes: Based on the current compensation value and the initial current data corresponding to the backlight partition, determine the current increment data corresponding to the backlight partition; The sum of the initial current data and the corresponding current increment data is used as the target current data corresponding to the backlight zone, wherein the target dimming data includes the target current data.

12. A backlight control chip, characterized in that, include: The receiving module is used to acquire the current temperature collected by multiple temperature acquisition components set on the backlight panel, and the current temperature is used to indicate the temperature of the backlight panel substrate at the location of the corresponding temperature acquisition component. The temperature processing module is used to determine the target temperature of the backlight in each of the backlight zones based on the current temperature, the first arrangement of the multiple temperature acquisition components on the backlight panel, and the second arrangement of the multiple backlight zones on the backlight panel. The backlight compensation module is used to compensate the initial dimming data of any backlight zone based on the target temperature of the backlight source in the backlight zone, so as to obtain the target dimming data of the backlight zone. The backlight control module is used to control the luminous brightness of the backlight source in the corresponding backlight zone based on the target dimming data.

13. A backlight circuit, characterized in that, include: Backlight panel and backlight control chip as described in claim 12; The backlight panel includes a substrate, a thermally conductive layer, a connecting dielectric layer, multiple temperature acquisition components, and multiple backlight sources; The thermally conductive layer is located on one side of the substrate and covers part of the surface of the substrate; The plurality of temperature acquisition components and the plurality of backlights are all located on the side of the thermal conductive layer away from the substrate, and at least one of the plurality of temperature acquisition components has its orthographic projection on the substrate located within the orthographic projection range of the thermal conductive layer on the substrate. The connecting medium layer is located between the thermally conductive layer and the temperature acquisition component, and is in contact with the temperature acquisition component; The backlight control chip is connected to the plurality of temperature acquisition components and the plurality of backlight sources, respectively.

14. A display device, characterized in that, include: Display panel and backlight circuit as described in claim 13; The display panel is positioned opposite to the backlight panel in the backlight circuit.

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