Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic devices
By combining a buffer tank and a multi-stage pump system with a needle valve to control bubble discharge, and by using the gap control and power management of the ultrasonic device, the problem of bubble accumulation during high-temperature chemical solution cleaning was solved, achieving stable operation of the equipment and efficient cleaning results.
CN122396237APending Publication Date: 2026-07-14ACM RES (SHANGHAI) INC
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ACM RES (SHANGHAI) INC
- Filing Date
- 2015-12-09
- Publication Date
- 2026-07-14
AI Technical Summary
Technical Problem
During high-temperature chemical solution cleaning, the generation and aggregation of bubbles can cause the cleaning equipment to malfunction, affecting the cleaning effect and the equipment's lifespan.
Method used
By employing a buffer tank and a multi-stage pump system combined with a needle valve to control bubble discharge, and by combining the gap control and power management of the ultrasonic device, the accumulation of bubbles during the cleaning process is reduced through gap adjustment and bubble release steps.
Benefits of technology
It effectively reduces the impact of air bubbles on cleaning equipment, improves cleaning results and equipment lifespan, and ensures a stable supply of high-temperature chemical solutions and the continuity of the cleaning process.
✦ Generated by Eureka AI based on patent content.
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Figure CN122396237A_ABST
Abstract
This invention discloses a high-temperature chemical solution supply system for cleaning substrates. The system includes a solution tank for containing a chemical solution; a first pump, the inlet of which is connected to the solution tank, and the outlet of which is connected to a buffer tank; a buffer tank including a tank body, an exhaust pipe, and a needle valve, one end of which is connected to the tank body and the other end to the solution tank, and the needle valve mounted on the exhaust pipe for regulating the pressure within the buffer tank; and a second pump, the inlet of which is connected to the buffer tank, and the outlet of which is connected to a cleaning chamber for cleaning the substrate. When the second pump is in the open state, the first pump and the needle valve are also in the open state. The pressure within the buffer tank is regulated by the needle valve and the first pump, causing the chemical solution in the buffer tank to be forced into the inlet of the second pump. This invention also provides a substrate cleaning apparatus including a high-temperature chemical solution supply system and an ultrasonic / megasonite device, as well as a method for cleaning substrates.
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