Back-washable semiconductor chuck and cleaning method
By setting a back-washing component in the center of the chuck body, simultaneous cleaning and drying of the back side of the wafer is achieved, solving the problem of chemical residue on the back side of the wafer and ensuring efficient wafer cleaning and production quality.
CN122294855APending Publication Date: 2026-06-26SUZHOU TECH INST FOR NANOTECH IND CO LTD
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Patent Information
- Application Number
- CN202610412659.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-31
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
Existing Bernoulli chucks cannot effectively remove chemical residues from the back of wafers in semiconductor manufacturing, leading to dirt spots and affecting product yield and production quality.
Method used
A backwashing assembly is installed at the center of the chuck body. The backwashing assembly simultaneously cleans and dries the back of the wafer, replacing the traditional passive centrifugal cleaning method. It uses active fluid flushing and gas removal to thoroughly remove residual liquid.
Benefits of technology
It achieves thorough cleaning of the back side of the wafer, avoiding the formation of dirt spots, while not affecting the output efficiency of single-wafer processes, significantly improving wafer cleanliness and production quality.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to a back-washable semiconductor chuck and a cleaning method. The semiconductor chuck comprises a chuck body, a supporting PIN, a clamping PIN and a back-washing assembly. The chuck body is used for bearing a wafer. The plurality of supporting PINs are arranged at intervals along the edge of the chuck main body, and the plurality of supporting PINs cooperate with each other to support the wafer. The plurality of clamping PINs are arranged at intervals along the edge of the chuck main body, and the plurality of clamping PINs cooperate with each other to clamp a wafer. And the back washing assembly is arranged at the center of the chuck main body and is used for cleaning and drying the back surface of the wafer while cleaning and drying the front surface of the wafer. By arranging the back washing assembly at the center of the chuck main body, the limitation that an original chuck only has a supporting and fixing function is changed, the back washing assembly is synchronously utilized to clean and blow-dry the back face of the wafer while the front face of the wafer is cleaned and blow-dried, and the problem that liquid medicine is left after seeping to the back face is directly solved from the physical level.
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