A calibration method, device, electronic device and semiconductor dicing apparatus

Abstract

The application relates to the technical field of semiconductor cutting equipment, in particular to a calibration method and device, electronic equipment and semiconductor cutting equipment, wherein the method comprises the following steps: obtaining a calibration table coordinate system corresponding to the calibration table according to position coordinates of a first target area on the calibration table; after a semiconductor packaging workpiece to be cut is placed on the calibration table, obtaining a workpiece coordinate system corresponding to the semiconductor packaging workpiece placed on the calibration table according to position coordinates of a second target area on the semiconductor packaging workpiece; calculating deviation information between the semiconductor packaging workpiece and a preset position according to the calibration table coordinate system, the workpiece coordinate system and a carrying arm coordinate system corresponding to the carrying arm; and controlling the calibration table to move or rotate and / or controlling the carrying arm to move according to the deviation information, so that the semiconductor packaging workpiece is located on the preset position, and the semiconductor packaging workpiece can be ensured to be on the preset position, so that the carrying arm can accurately carry the semiconductor packaging workpiece to a cutting table.

Description

Technical Field

[0001] This application relates to the field of semiconductor cutting equipment technology, and in particular to a calibration method, apparatus, electronic device and semiconductor cutting equipment. Background Technology

[0002] During the semiconductor cutting process, before the semiconductor packaged workpiece is transported to the cutting table by the transport arm, it needs to be placed on the calibration table for position calibration so that the transport arm can transport the position-calibrated workpiece to the cutting table for cutting.

[0003] In existing technologies, after the semiconductor packaged workpiece is placed on the calibration table, the existing calibration methods for calibrating the semiconductor packaged workpiece are prone to problems such as incomplete deviation calculation and unclear correction steps. Therefore, it is impossible to guarantee that the semiconductor packaged workpiece is placed in the ideal position, which can easily lead to positional deviation of the semiconductor packaged workpiece on the calibration table. Ultimately, this results in the transport arm being unable to accurately place the semiconductor packaged workpiece on the cutting table. Summary of the Invention

[0004] This application provides a calibration method, apparatus, electronic device, and semiconductor cutting equipment, which can correct the deviation between the actual position and the preset position of a semiconductor packaged workpiece, ensuring that the semiconductor packaged workpiece is in the preset position, so that the transport arm can accurately transport the semiconductor packaged workpiece to the cutting table.

[0005] In a first aspect, a calibration method is provided, applied to a semiconductor dicing equipment. The semiconductor dicing equipment includes a calibration table, a transport arm, and a dicing table. The calibration table is used to hold a semiconductor packaged workpiece and perform position calibration on the semiconductor packaged workpiece. The transport arm is used to transport the semiconductor packaged workpiece located on the calibration table to the dicing table. The method includes: Based on the position coordinates of the first target area on the calibration platform, the calibration platform coordinate system corresponding to the calibration platform is obtained; After the semiconductor package workpiece to be cut is placed on the calibration stage, the workpiece coordinate system corresponding to the semiconductor package workpiece placed on the calibration stage is obtained according to the position coordinates of the second target area on the semiconductor package workpiece. Based on the calibration stage coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm, calculate the deviation information between the semiconductor package workpiece and the preset position; the preset position is the position of the semiconductor package workpiece when the workpiece coordinate system and the transport arm coordinate system coincide. Based on the deviation information, control the axial rotation of the calibration stage and / or the movement along the X-axis, and / or control the movement of the transport arm along the Y-axis, so that the semiconductor package workpiece is positioned in a preset position.

[0006] Optionally, the calibration stage includes a suction cup and a mounting plate. The suction cup is mounted on the mounting plate via a mounting assembly. The mounting assembly includes two mounting blocks, which are located on opposite sides of the suction cup. Each mounting block and the suction cup are coaxially aligned along the X-axis, and the axis of each mounting block along the Y-axis is parallel to the axis of the suction cup along the Y-axis. Each mounting block has symmetrically arranged positioning holes on both sides of its X-axis axis. The first target area is the area corresponding to the positioning holes on the two mounting blocks. Based on the position coordinates corresponding to the first target area on the calibration stage, the calibration stage coordinate system is obtained, including: Obtain the first top view image of the calibration platform; Based on the position information of the area corresponding to each positioning hole in the first top view image, the reference position information corresponding to each positioning hole is obtained. Based on the reference position information corresponding to each positioning hole, calculate the reference center coordinate information corresponding to the center point of the suction cup, as well as the axis of the suction cup along the X-axis and the axis along the Y-axis. Based on the reference center coordinates of the center point of the suction cup, draw the suction cup coordinate system along the X-axis and Y-axis, and use the suction cup coordinate system as the calibration table coordinate system.

[0007] Optionally, the second target region includes the regions corresponding to at least three feature points on the semiconductor package workpiece; based on the position coordinates corresponding to the second target region on the semiconductor package workpiece, the workpiece coordinate system corresponding to the semiconductor package workpiece placed on the calibration stage is obtained, including: Acquire a second top view image of the semiconductor packaged workpiece mounted on the calibration stage; For each feature point on the semiconductor package workpiece, the feature point position information corresponding to the feature point on the semiconductor package workpiece is obtained based on the position information of the region corresponding to the feature point in the second top view image. Based on the feature point position information corresponding to at least three feature points on the semiconductor package workpiece, determine the workpiece center coordinate information corresponding to the center point of the semiconductor package workpiece, as well as the workpiece along the length direction and along the width direction. Based on the workpiece center coordinate information, draw the workpiece coordinate system corresponding to the semiconductor packaging workpiece along the length and width directions of the workpiece.

[0008] Optionally, the deviation information includes first deviation information of the semiconductor packaged workpiece on the calibration stage and second deviation information of the semiconductor packaged workpiece under the transport arm; based on the calibration stage coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm, the deviation information between the semiconductor packaged workpiece and the preset position is calculated, including: The deviation between the calibration table coordinate system and the workpiece coordinate system is calculated to obtain the first deviation information; the first deviation information includes the first deviation angle and the first deviation distance. The deviation between the coordinate system of the handling arm and the coordinate system of the workpiece is calculated to obtain the second deviation information; the deviation information includes the second deviation angle and the second deviation distance.

[0009] Optionally, the deviation between the calibration stage coordinate system and the workpiece coordinate system is calculated to obtain the first deviation information, including: Obtain the first coordinate information corresponding to the origin of the calibration table coordinate system and the second coordinate information corresponding to the origin of the workpiece coordinate system; Based on the first coordinate information and the second coordinate information, calculate the first coordinate deviation value between the origin of the calibration table coordinate system and the origin of the workpiece coordinate system; Based on the first coordinate deviation value, the first deviation angle and the first deviation distance are obtained; And / or, calculate the deviation between the transport arm coordinate system and the workpiece coordinate system corresponding to the transport arm to obtain the second deviation information, including: Obtain the second coordinate information corresponding to the origin of the workpiece coordinate system and the third coordinate information corresponding to the origin of the transport arm coordinate system; Based on the second and third coordinate information, calculate the second coordinate deviation value between the origin of the workpiece coordinate system and the origin of the transport arm coordinate system; Based on the second coordinate deviation value, the second deviation angle and the second deviation distance are obtained.

[0010] Optionally, based on the deviation information, the calibration stage is controlled to rotate axially and / or move along the X-axis, and / or the transport arm is controlled to move along the Y-axis, so that the semiconductor package workpiece is positioned at a preset position, including: Determine whether the first deviation information and the second deviation information are the same; If the first deviation information and the second deviation information are the same, then calculate the first rotation angle and the first rotation direction of the calibration table axial rotation based on the first deviation information; Based on the first rotation angle and the first rotation direction, the calibration stage is controlled to rotate axially so that the X-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the X-axis of the transport arm coordinate system, and the Y-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the Y-axis of the transport arm coordinate system. Based on the distance between the X-axis in the workpiece coordinate system and the X-axis in the transport arm coordinate system, the calibration stage is controlled to move along the X-axis; and based on the distance between the Y-axis in the workpiece coordinate system and the Y-axis in the transport arm coordinate system, the transport arm is controlled to move along the Y-axis, so that the workpiece coordinate system corresponding to the semiconductor package workpiece coincides with the transport arm coordinate system.

[0011] Optionally, it also includes: If the first deviation information and the second deviation information are different, then calculate the second rotation angle and the second rotation direction of the calibration table axial rotation based on the first deviation information and the second deviation information. Based on the second rotation angle and the second rotation direction, the calibration stage is controlled to rotate axially so that the X-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the X-axis of the transport arm coordinate system, and the Y-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the Y-axis of the transport arm coordinate system.

[0012] Optionally, it also includes: If the first deviation information and the second deviation information are different, then calculate the first preset moving distance of the calibration table along the X-axis direction and / or the second preset moving distance of the transport arm along the Y-axis direction based on the first deviation information and the second deviation information. According to the first preset moving distance, the calibration table is controlled to move along the X-axis; and according to the second preset moving distance, the transport arm is controlled to move along the Y-axis so that the origin of the workpiece coordinate system coincides with the origin of the transport arm coordinate system. Based on the first deviation information and the second deviation information, calculate the third rotation angle and the third rotation direction of the calibration table's axial rotation; Based on the third rotation angle and the third rotation direction, the calibration stage is controlled to rotate axially so that the workpiece coordinate system corresponding to the semiconductor package workpiece coincides with the transport arm coordinate system.

[0013] Secondly, a workpiece calibration device is provided, applied to a semiconductor cutting equipment. The semiconductor cutting equipment includes a calibration table, a transport arm, and a cutting table. The calibration table is used to hold a semiconductor packaged workpiece and perform position calibration on the semiconductor packaged workpiece. The transport arm is used to transport the semiconductor packaged workpiece located on the calibration table to the cutting table. The device includes: The calibration platform coordinate system acquisition module is used to obtain the calibration platform coordinate system corresponding to the calibration platform based on the position coordinates of the first target area on the calibration platform. The workpiece coordinate system acquisition module is used to obtain the workpiece coordinate system corresponding to the semiconductor packaged workpiece placed on the calibration table after the semiconductor packaged workpiece to be cut is placed on the calibration table, based on the position coordinates corresponding to the second target area on the semiconductor packaged workpiece. The deviation calculation module is used to calculate the deviation information between the semiconductor packaged workpiece and the preset position based on the calibration table coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm; the preset position is the position of the semiconductor packaged workpiece when the workpiece coordinate system and the transport arm coordinate system coincide. The control movement module is used to control the axial rotation and / or movement along the X-axis of the calibration stage, and to control the movement of the transport arm along the Y-axis, based on the deviation information, so that the semiconductor package workpiece is positioned in a preset position.

[0014] Thirdly, an electronic device is provided, comprising: a processor and a memory for storing a computer program, the processor for calling and running the computer program stored in the memory, and performing the methods as described in the first aspect or its various implementations.

[0015] Fourthly, a computer-readable storage medium is provided for storing a computer program that causes a computer to perform the methods described in the first aspect or its various implementations.

[0016] Fifthly, a semiconductor cutting apparatus is provided, including a calibration device as described in the second aspect, or an electronic device as described in the third aspect.

[0017] The technical solution provided in this application establishes a relationship between three coordinate systems: the calibration table coordinate system, the workpiece coordinate system, and the transport arm coordinate system. It calculates the deviation between the actual position and the preset position of the semiconductor packaged workpiece located on the calibration table. Based on the deviation information, it controls the axial rotation of the calibration table and / or the movement along the X-axis, and the movement of the transport arm along the Y-axis, to correct the deviation between the actual position and the preset position of the semiconductor packaged workpiece. This ensures that the semiconductor packaged workpiece is in the preset position, so that the transport arm can accurately transport the semiconductor packaged workpiece to the cutting table.

[0018] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 An application scenario diagram provided for an embodiment of this application; Figure 2 A flowchart illustrating a calibration method provided in this application embodiment; Figure 3 This is a schematic diagram of the calibration station provided in an embodiment of this application; Figure 4 This is a schematic diagram of a calibration device provided in an embodiment of this application; Figure 5This is a schematic block diagram of the electronic device provided in the embodiments of this application. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0023] In existing technologies for calibrating and handling semiconductor packaged parts, the deviation calculation of the semiconductor packaged parts is often too simplistic and incomplete. As a result, it is impossible to accurately correct the positional deviation of the semiconductor packaged parts, leading to incomplete calibration. Consequently, the handling arm cannot accurately transport the semiconductor packaged parts to the cutting table, thus affecting the yield of semiconductor cutting products. Therefore, there is an urgent need for a technical solution that can accurately calculate and correct the deviation of semiconductor packaged parts to ensure the positioning accuracy of the semiconductor packaged parts.

[0024] To at least address one of the technical problems existing in the prior art or related technologies, this invention provides a calibration method, apparatus, electronic device, and semiconductor cutting equipment. The method includes: obtaining a calibration table coordinate system based on the position coordinates corresponding to a first target area on the calibration table; after placing the semiconductor packaged workpiece to be cut on the calibration table, obtaining a workpiece coordinate system based on the position coordinates corresponding to a second target area on the semiconductor packaged workpiece; calculating deviation information between the semiconductor packaged workpiece and a preset position based on the calibration table coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm; the preset position is the position of the semiconductor packaged workpiece when the workpiece coordinate system and the transport arm coordinate system coincide; and, based on the deviation information, controlling the calibration table to rotate axially and / or move along the X-axis direction, and / or controlling the transport arm to move along the Y-axis direction, so that the semiconductor packaged workpiece is located at the preset position. This application can correct the deviation between the actual position and the preset position of the semiconductor packaged workpiece, ensuring that the semiconductor packaged workpiece is in the preset position, so that the transport arm can accurately transport the semiconductor packaged workpiece to the cutting table.

[0025] It should be understood that the technical solution of this application can be applied to the following scenarios, but is not limited to: In some possible ways, Figure 1 An application scenario diagram provided for an embodiment of this application, such as... Figure 1 As shown, this application scenario may include electronic device 110 and network device 120. Electronic device 110 can establish a connection with network device 120 through a wired network or a wireless network.

[0026] For example, electronic device 110 may be a desktop computer, laptop computer, tablet computer, etc., but is not limited thereto. Network device 120 may be a terminal device or a server, but is not limited thereto. In one embodiment of this application, electronic device 110 may send a request message to network device 120, which may be used to request the location coordinates corresponding to the first target area on the calibration table. Further, electronic device 110 may receive a response message sent by network device 120, which includes obtaining the location coordinates corresponding to the first target area on the calibration table.

[0027] also, Figure 1 An electronic device 110 and a network device 120 are provided as examples, but other numbers of electronic devices and network devices may be included in practice, and this application does not limit this.

[0028] In other possible implementations, the technical solution of this application may also be executed by the aforementioned electronic device 110, or by the aforementioned network device 120, and this application does not impose any restrictions on this.

[0029] After introducing the application scenarios of the embodiments of this application, the technical solution of this application will be described in detail below: Figure 2 The flowchart illustrates a calibration method provided in this application embodiment, and it can be derived from, for example... Figure 1 The electronic device 110 shown performs, but is not limited to, this method. The method is applied to a semiconductor dicing device, which includes a calibration table, a transport arm, and a dicing table. The calibration table is used to hold a semiconductor packaged workpiece and perform position calibration on the workpiece. The transport arm is used to transport the semiconductor packaged workpiece located on the calibration table to the dicing table. The method may include the following steps: S210. Based on the position coordinates of the first target area on the calibration platform, obtain the calibration platform coordinate system corresponding to the calibration platform.

[0030] Here, the calibration stage is the area where semiconductor packaged workpieces are placed, i.e., the suction cup can have a square surface.

[0031] It should be noted that obtaining the calibration platform coordinate system corresponding to the calibration platform based on the position coordinates of the first target area on the calibration platform may include the following steps: acquiring a platform image of the calibration platform; identifying the first target area in the platform image to determine the position coordinates of the first target area in the platform image; and obtaining the calibration platform coordinate system corresponding to the calibration platform in the platform image based on the position coordinates of the first target area in the platform image.

[0032] The first target area is at least three preset first areas on the calibration platform, and the at least three preset first areas are distributed on the upper surface of the calibration platform; here, the first target area is a preset first reference area on the calibration platform with a fixed position, so the first target area can be used as the first position reference for positioning the calibration platform itself.

[0033] For example, the first preset reference point in the upper left corner, the second preset reference point in the lower left corner, and the third preset reference point in the upper right corner of the calibration platform are selected as the first target area. The physical coordinates of the first, second, and third preset reference points are obtained through the visual inspection module. Assuming that the physical coordinates of the above preset reference points are (-20,10), (-20,-10), and (20,10), respectively, the origin of the calibration platform coordinate system is located using the physical coordinates of the above preset reference points to determine the position of the center point (0,0). Then, the long side of the calibration platform is taken as the X-axis and the short side is taken as the Y-axis to establish the calibration platform coordinate system. At this time, the position of any point on the calibration platform can be represented by the coordinates of the calibration platform coordinate system.

[0034] In this step, the calibration platform coordinate system obtained based on the position coordinates of the first target area on the calibration platform can provide a unified reference coordinate system for calculating the deviation information between the semiconductor packaged workpiece and the preset position, avoiding position judgment confusion caused by the lack of a reference coordinate system and ensuring the accuracy of all subsequent position data; at the same time, the calibration platform coordinate system also clarifies the position reference of the calibration platform, indirectly reducing the deviation of the semiconductor packaged workpiece caused by the "calibration platform's own reference offset".

[0035] S220. After the semiconductor packaged workpiece to be cut is placed on the calibration table, the workpiece coordinate system corresponding to the semiconductor packaged workpiece placed on the calibration table is obtained according to the position coordinates corresponding to the second target area on the semiconductor packaged workpiece.

[0036] Here, the semiconductor packaged workpiece can be a square workpiece.

[0037] It should be noted that obtaining the workpiece coordinate system corresponding to the semiconductor packaged workpiece placed on the calibration table based on the position coordinates corresponding to the second target area on the semiconductor packaged workpiece can include the following steps: acquiring a workpiece image of the semiconductor packaged workpiece carried on the calibration table; identifying the second target area in the workpiece image to determine the position coordinates corresponding to the second target area in the workpiece image; obtaining the workpiece coordinate system corresponding to the semiconductor packaged workpiece in the workpiece image based on the position coordinates corresponding to the second target area in the workpiece image; wherein, the second target area is at least three preset second areas on the semiconductor packaged workpiece, and at least three preset second areas are distributed on the upper surface of the semiconductor packaged workpiece; here, the second target area is a preset second reference area on the semiconductor packaged workpiece (such as the corners or markers on the semiconductor packaged workpiece). After the semiconductor packaged workpiece is placed on the calibration table, the coordinate system of the semiconductor packaged workpiece itself can be established by detecting the second reference area, which is the workpiece coordinate system, so as to accurately locate the actual position of the semiconductor packaged workpiece on the calibration table.

[0038] For example, the first marker point located at the upper left corner of the semiconductor package workpiece, the second marker point located at the upper right corner of the semiconductor package workpiece, and the third marker point located at the lower left corner of the semiconductor package workpiece are all selected as the second target area. The physical coordinates corresponding to the above three marker points are detected by the vision detection module. Assuming that the physical coordinates corresponding to the above three marker points are (-15,8), (15,8) and (-15,-8) respectively, the origin of the workpiece coordinate system is located using the physical coordinates corresponding to the above three marker points to determine the position of the center point (0,0). Then, the long side direction of the semiconductor package workpiece is taken as the X-axis and the short side direction is taken as the Y-axis to establish the semiconductor package workpiece coordinate system. At this time, the position of any point on the semiconductor package workpiece can be represented by the coordinates of the workpiece coordinate system.

[0039] In this step, by establishing the workpiece coordinate system of the semiconductor package workpiece itself, the actual position of the semiconductor package workpiece on the calibration table can be accurately located to determine the placement state of the semiconductor package workpiece. That is, by comparing with the coordinate system of the calibration table, it is possible to determine whether the semiconductor package workpiece is tilted or offset, thereby realizing the determination of the actual position of the semiconductor package workpiece and providing accurate position data of the semiconductor package workpiece for subsequent deviation information calculation.

[0040] S230. Calculate the deviation information between the semiconductor packaged workpiece and the preset position based on the calibration table coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm.

[0041] Here, the deviation information includes deviation distance and deviation angle; wherein, the deviation distance can be the distance between the center point in the workpiece coordinate system and the center point in the first transport arm coordinate system; the deviation information is the angle between the X-axis in the workpiece coordinate system and the X-axis in the first transport arm coordinate system.

[0042] The preset position refers to the position of the semiconductor package workpiece when the workpiece coordinate system and the transport arm coordinate system coincide. Here, the preset position can be understood as the "ideal placement position of the semiconductor package workpiece on the calibration stage," with the core criterion being "the workpiece coordinate system and the transport arm coordinate system coincide." At this point, the transport arm can accurately grasp the semiconductor package workpiece and transport it to the cutting stage. Specifically, when the semiconductor package workpiece is in the preset position, the center point in the workpiece coordinate system coincides with the center point in the transport coordinate system, the X-axis in the workpiece coordinate system coincides with the X-axis in the transport coordinate system, and the Y-axis in the workpiece coordinate system coincides with the Y-axis in the transport coordinate system.

[0043] It should be noted that the calibration table coordinate system, workpiece coordinate system, and transport arm coordinate system are all two-dimensional coordinate systems. Specifically, the calibration table coordinate system and workpiece coordinate system are image coordinate systems, which are converted to the same coordinate system as the transport arm coordinate system. Here, the transport arm coordinate system refers to the position coordinate system of the transport arm itself.

[0044] In this step, by calculating based on the coordinate system of the calibration stage, the coordinate system of the workpiece, and the coordinate system of the transport arm corresponding to the transport arm, the deviation information (deviation angle and deviation distance) between the semiconductor packaged workpiece and the preset position can be accurately obtained. This provides a clear basis for the subsequent deviation correction of the semiconductor packaged workpiece and avoids calibration errors caused by blindly correcting the position of the semiconductor packaged workpiece.

[0045] S240. Based on the deviation information, control the axial rotation of the calibration table and / or the movement along the X-axis, and / or control the movement of the transport arm along the Y-axis, so that the semiconductor package workpiece is located in a preset position.

[0046] It should be noted that the calibration platform can only move along the X-axis, the transport arm can only move along the Y-axis, and a DD motor is connected to the bottom of the calibration platform. This DD motor can control the axial rotation of the calibration platform to control the axial rotation of the semiconductor packaged workpiece located on the calibration platform.

[0047] Since the calibration table can only move along the X-axis and the transport arm can only move along the Y-axis, the deviation information is calculated according to step S230. The appropriate actuator (calibration table or transport arm) is selected for action adjustment to specifically correct the deviation of the semiconductor packaged workpiece. The axial rotation of the calibration table can correct the tilt deviation of the semiconductor packaged workpiece, and the movement of the calibration table along the X-axis and / or the movement of the transport arm along the Y-axis can correct the translation deviation of the semiconductor packaged workpiece. Finally, the semiconductor packaged workpiece reaches the ideal preset position, which ensures that the transport arm can accurately transport the semiconductor packaged workpiece located on the calibration table to the cutting table.

[0048] Taking a deviation information including a deviation of 5μm to the left between the X-axis in the workpiece coordinate system and the X-axis in the transport arm coordinate system, a deviation of 5μm to the bottom between the Y-axis in the workpiece coordinate system and the Y-axis in the transport arm coordinate system, and a deviation angle of 0.5° between the X-axis in the workpiece coordinate system and the X-axis in the transport arm coordinate system as an example, the calibration stage is rotated axially by 0.5° to correct the deviation angle of the semiconductor package workpiece tilt; the calibration stage is moved 5μm along the positive X-axis to correct the translation deviation of the semiconductor package workpiece on the X-axis; the transport arm is moved 5μm along the positive Y-axis to assist in correcting the deviation of the semiconductor package workpiece on the Y-axis. After the semiconductor package workpiece is corrected, the workpiece coordinate system and the transport arm coordinate system coincide, and at this time, the semiconductor package workpiece is in the ideal preset position.

[0049] In this step, targeted control of the calibration stage (axial rotation, movement along the X-axis) and / or the transport arm (movement along the Y-axis) corrects deviations in the semiconductor packaged workpiece, enabling the semiconductor packaged workpiece to be quickly and accurately adjusted to the preset position, thus ensuring that the transport arm accurately transports the semiconductor packaged workpiece to the cutting stage.

[0050] Using the above method, by establishing the relationship between the three coordinate systems of "calibration table coordinate system, workpiece coordinate system, and transport arm coordinate system", the deviation information between the actual position and the preset position of the semiconductor packaged workpiece located on the calibration table is calculated. Then, based on the deviation information, the axial rotation of the calibration table and / or the movement along the X-axis and the movement along the Y-axis of the transport arm are controlled to correct the deviation between the actual position and the preset position of the semiconductor packaged workpiece, ensuring that the semiconductor packaged workpiece is in the preset position, so that the transport arm can accurately transport the semiconductor packaged workpiece to the cutting table.

[0051] In some possible implementations, see [link to relevant documentation]. Figure 3 The calibration stage includes a suction cup 1 and a mounting plate 2. The suction cup 1 is mounted on the mounting plate 2 via a mounting assembly. The mounting assembly includes two mounting blocks 3, which are located on opposite sides of the suction cup 1. Each mounting block 3 and the suction cup 1 are coaxially arranged along the X-axis. The axis of each mounting block 3 along the Y-axis is parallel to the axis of the suction cup 1 along the Y-axis. Each mounting block 3 has symmetrically provided positioning holes 4 on both sides along the X-axis. The first target area is the area corresponding to the positioning holes 4 on the two mounting blocks 3.

[0052] Here, at least one pair of positioning holes 4 are symmetrically opened on both sides of the axis along the X-axis of each mounting block 3.

[0053] It should be noted that when assembling the suction cup 1 onto the mounting plate 2, the suction cup 1 is placed on the mounting plate 2 at the position for mounting the suction cup 1. Then, the two mounting blocks 3 are placed on the opposite sides of the suction cup 1, and the axes of the two mounting blocks 3 along the X-axis are aligned with the axis of the suction cup 1 along the X-axis. The mounting blocks 3 are then fixed onto the mounting plate 2, thereby fixing the suction cup onto the mounting plate 2 under the clamping of the two mounting blocks 3.

[0054] Accordingly, obtaining the calibration platform coordinate system based on the position coordinates of the first target area on the calibration platform can include the following steps: S310. Obtain the first top view image of the calibration platform.

[0055] Here, a first top-view image of the calibration table can be obtained through a vision inspection module located on the transport arm. The vision inspection module takes a picture from directly above the calibration table, and the image clearly shows the two mounting blocks located on both sides of the suction cup and their positioning holes. Here, the positioning holes can be represented as high-contrast circular features.

[0056] S320. Based on the position information of the area corresponding to each positioning hole in the first top view image, obtain the reference position information corresponding to each positioning hole.

[0057] Here, the position information of the area corresponding to each positioning hole in the first top view image can be read by a vision inspection module located on the transport arm. This position information can be coordinate information. It should be noted that the vision inspection module here can be a microscope.

[0058] Specifically, when obtaining the reference position information corresponding to each positioning hole based on the position information of the area corresponding to each positioning hole in the first top view image, the visual recognition module can use image processing algorithms (such as sub-pixel edge extraction and circle center fitting) on ​​the first top view image to locate the center coordinates of each positioning hole, and use the center coordinates of each positioning hole as the reference position information.

[0059] For example, when there are a total of four positioning holes on two mounting blocks, the image coordinates of the areas corresponding to the four positioning holes in the first top view image are: upper hole of mounting block A: (380, 450), lower hole of mounting block A: (380, 150), upper hole of mounting block B: (120, 450), lower hole of mounting block B: (120, 150). The above coordinates are used as the reference position information corresponding to each positioning hole.

[0060] S330. Based on the reference position information corresponding to each positioning hole, calculate the reference center coordinate information corresponding to the center point of the suction cup, as well as the axis of the suction cup along the X-axis and the axis along the Y-axis.

[0061] Following the example in step S320, the image coordinates corresponding to the center point of the suction cup can be calculated as (250, 300) by using the left hole of mounting block A, the right hole of mounting block A, the left hole of mounting block B, and the right hole of mounting block B. Then, by combining the X-axis and Y-axis of the suction cup, the true coordinate system of the suction cup can be obtained.

[0062] S340. Based on the reference center coordinate information corresponding to the center point of the suction cup, draw the suction cup coordinate system corresponding to the suction cup along the X-axis and Y-axis, and use the suction cup coordinate system as the calibration table coordinate system corresponding to the calibration table.

[0063] Here, the area corresponding to each positioning hole is taken as the first target area, which can determine the calibration table coordinate system corresponding to the current calibration table based on the current state of the calibration table. Among them, the positioning hole is an identifiable high-precision feature in the first top view image, which is not affected by temperature, wear, mechanical loosening, etc. Therefore, the reference stability of the calibration table coordinate system obtained by using the reference position information corresponding to each positioning hole is significantly improved.

[0064] Using the above method, by taking the area corresponding to the positioning hole on the mounting block in the first top view image as the first target area, a high-precision chuck coordinate system can be obtained based on the reference position information corresponding to each positioning hole. This allows the finally determined calibration table coordinate system to serve as the basis for all subsequent calculations, making the positioning, deviation quantification, and correction of semiconductor packaged workpieces more accurate.

[0065] In some possible implementations, the second target region includes the region corresponding to at least three feature points on the semiconductor package workpiece.

[0066] Here, the feature points on the semiconductor package workpiece can be vertices located at the four corners of the semiconductor package workpiece, points located on the four sides of the semiconductor package workpiece, or through holes located on the side ribs of the semiconductor package workpiece, so as to support multiple types of feature points (corner vertices, side points, side rib through holes), which can be adapted to semiconductor package workpieces of different shapes and specifications without adjusting the overall solution for different workpieces.

[0067] Accordingly, based on the position coordinates corresponding to the second target area on the semiconductor package workpiece, the workpiece coordinate system corresponding to the semiconductor package workpiece placed on the calibration stage is obtained, which may include the following steps: S410. Obtain a second top view image of the semiconductor packaged workpiece mounted on the calibration stage.

[0068] Here, after the semiconductor package workpiece to be cut is placed on the calibration table, a second top view image of the semiconductor package workpiece carried on the calibration table can be obtained by the vision inspection module located on the transport arm.

[0069] S420. For each feature point on the semiconductor package workpiece, based on the position information of the region corresponding to the feature point in the second top view image, obtain the feature point position information corresponding to the feature point on the semiconductor package workpiece.

[0070] Here, the position information of the region corresponding to each feature point in the second top view image can be read by the vision detection module located on the transport arm. The position information of the region corresponding to the feature point in the second top view image can be position coordinate information.

[0071] In this process, image processing algorithms (such as subpixel edge extraction and vertex fitting algorithms) from the visual detection module can be used to identify the feature point regions in the second top view image, locate the specific position of each feature point in the second top view image, and then convert it into position information (i.e., feature point position information) in the second top view image. Here, the conversion of the feature point position information is based on the calibration platform coordinate system established above to ensure consistency with the coordinate system used for subsequent deviation information calculation.

[0072] For example, the four corner vertices of the semiconductor packaged workpiece are selected as feature points, denoted as feature point A (top left), feature point B (top right), feature point C (bottom left), and feature point D (bottom right). The image processing algorithm of the vision inspection module identifies the positions of the four feature points in the second top view image. Combined with the coordinate system of the calibration platform, the position coordinates of the four feature points are obtained as follows: A (180, 170), B (400, 170), C (180, 350), and D (400, 350) (unit: μm). These coordinates are the feature point position information corresponding to each feature point.

[0073] S430. Based on the feature point position information corresponding to the feature points on the four sides of the semiconductor package workpiece, determine the workpiece center coordinate information corresponding to the center point of the semiconductor package workpiece, as well as the workpiece along the length direction and along the width direction.

[0074] Based on the feature point location information obtained by S420, the center point coordinate information of the semiconductor package workpiece is fitted through geometric calculation. At the same time, the length direction (long side direction) and width direction (short side direction) of the semiconductor package workpiece are determined. For square workpieces, the center point of the semiconductor package workpiece can be determined by the midpoint of the line connecting the diagonal feature points, and the length and width directions can be determined by the line connecting two opposite feature points, ensuring that the calculation results fit the actual placement state of the semiconductor package workpiece.

[0075] Using the example of the coordinates of the four feature points in S420 (A(180,170), B(400,170), C(180,350), D(400,350)), perform geometric calculations: ① Coordinates of the center point of the semiconductor package workpiece: Take the midpoint of the diagonals AD(290,260) and BC(290,260), and calculate the coordinates of the center point as (290,260); ② Length direction of the semiconductor package workpiece: The line connecting feature points A and B is horizontal and has a length of 260μm (long side), which is the length direction of the semiconductor package workpiece; ③ Width direction of the semiconductor package workpiece: The line connecting feature points A and C is vertical and has a length of 180μm (short side), which is the width direction of the semiconductor package workpiece.

[0076] S440. Based on the workpiece center coordinate information, draw the workpiece coordinate system corresponding to the semiconductor packaging workpiece along the length and width directions of the workpiece.

[0077] Taking the workpiece center point determined by S430 as the origin as an example, the workpiece's own coordinate system is drawn with the workpiece length direction as the X-axis and the width direction as the Y-axis. As can be seen, the workpiece coordinate system drawn here is synchronized with the current placement posture of the semiconductor packaging workpiece, which can accurately reflect the actual position and posture of the semiconductor packaging workpiece on the calibration table, providing a direct reference for subsequent comparison with the calibration table coordinate system and the transport arm coordinate system to calculate deviation information.

[0078] Using the above method, an automated process of "image acquisition → determination of feature point location information → calculation of coordinate parameters → drawing of coordinate system" is achieved, enabling accurate and efficient establishment of the workpiece coordinate system. In some possible embodiments, the deviation information includes first deviation information of the semiconductor packaged workpiece on the calibration stage and second deviation information of the semiconductor packaged workpiece below the transport arm; calculating the deviation information between the semiconductor packaged workpiece and the preset position based on the calibration stage coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm may include the following steps: S510. Calculate the deviation between the calibration table coordinate system and the workpiece coordinate system to obtain the first deviation information; the first deviation information includes the first deviation angle and the first deviation distance.

[0079] Here, the first deviation information is data quantified from the offset state of the semiconductor packaged workpiece relative to the calibration stage, reflecting the actual placement deviation of the semiconductor packaged workpiece on the calibration stage (deviation from the calibration stage reference). Specifically: the first deviation angle is the angle between the X-axis of the workpiece coordinate system and the X-axis of the calibration stage coordinate system, which reflects the degree of tilt of the semiconductor packaged workpiece on the calibration stage; the first deviation distance is the straight-line distance between the origin of the workpiece coordinate system, i.e., the center point of the workpiece, and the origin of the calibration stage coordinate system, which reflects the degree of translation of the semiconductor packaged workpiece in the X-axis and Y-axis directions.

[0080] By calculating the deviation between the calibration stage coordinate system and the workpiece coordinate system, the obtained first deviation information can focus on the reference deviation between the semiconductor packaging workpiece and the calibration stage. This allows for more targeted control of the calibration stage's correction actions (axial rotation, X-axis movement) based on the first deviation information, avoiding incomplete workpiece correction due to calibration stage reference deviation.

[0081] Combining the examples of the preset calibration platform coordinate system (origin (50,50), horizontal X-axis) and the established workpiece coordinate system (origin (30,20), horizontal X-axis), the first deviation information is calculated as follows: ① First deviation angle: The X-axis in the workpiece coordinate system is parallel to the X-axis in the calibration platform coordinate system, and the included angle is 0°, that is, the first deviation angle is 0°; ② First deviation distance: Calculated using the distance formula between two points, the straight-line distance between the workpiece center point (30,20) and the origin (50,50) of the calibration platform coordinate system is 36.06μm, that is, the first deviation distance is approximately 36.06μm; In summary, the first deviation information is: first deviation angle 0°, first deviation distance 36.06μm, reflecting that the semiconductor packaged workpiece has a translational deviation relative to the calibration platform reference on the calibration platform, but no tilting deviation.

[0082] S520. Calculate the deviation between the transport arm coordinate system and the workpiece coordinate system corresponding to the transport arm to obtain the second deviation information; the deviation information includes the second deviation angle and the second deviation distance.

[0083] Here, the second deviation information is the quantitative data of the offset state of the semiconductor packaged workpiece relative to the preset position of the transport arm. It directly reflects the deviation of the semiconductor packaged workpiece from the "ideal transport position", that is, the deviation from the transport arm reference. Among them, the second deviation angle is the angle between the X-axis of the workpiece coordinate system and the X-axis of the transport arm coordinate system (reflecting the influence of workpiece tilt on transport), and the second deviation distance is the straight-line distance between the origin of the workpiece coordinate system (the center point of the workpiece) and the origin of the transport arm coordinate system (reflecting the influence of workpiece translation on transport).

[0084] Here, by focusing on the "deviation between the workpiece and the transport arm", the corrective action (Y-axis movement) of the transport arm based on the second deviation information is made more targeted. At the same time, by combining the first deviation information, a dual deviation verification is formed to avoid omissions caused by single deviation calculation, and to ensure that subsequent correction actions can take into account the dual deviations of "workpiece and calibration table" and "workpiece and transport arm" to achieve comprehensive and accurate correction.

[0085] Combining the preset transport arm coordinate system (origin (30,20), horizontal X-axis) and the established workpiece coordinate system (origin (30,20), horizontal X-axis) as an example, the deviation is calculated as follows: ① Second deviation angle: The X-axis in the workpiece coordinate system is parallel to the X-axis in the transport arm coordinate system, with an angle of 0°, i.e., the second deviation angle is 0°; ② Second deviation distance: The center point of the workpiece (30,20) coincides with the origin (30,20) of the transport arm coordinate system, with a straight-line distance of 0μm, i.e., the second deviation distance is 0μm; In summary, the second deviation information is: second deviation angle 0°, second deviation distance 0μm, reflecting that the current position of the semiconductor packaged workpiece has reached the ideal transport position of the transport arm, and no additional correction is needed from the transport arm; If the semiconductor packaged workpiece is tilted, assuming that the angle between the X-axis of the workpiece coordinate system and the X-axis of the transport arm coordinate system is 0.5°, then the second deviation angle is 0.5°, which needs to be corrected by axial rotation of the calibration table.

[0086] Using the above method, a dual deviation verification system of "workpiece-calibration table" and "workpiece-transfer arm" can be constructed to accurately capture the tilt and translation deviations of the semiconductor packaging workpiece relative to its preset position. At the same time, the first deviation information obtained by calculating the deviation between the calibration table coordinate system and the workpiece coordinate system can provide a basis for the calibration table operation. The second deviation information obtained by calculating the deviation between the transfer arm coordinate system and the workpiece coordinate system can meet the handling requirements and provide support for the correction of the transfer arm and calibration table, avoiding blind correction of the position of the semiconductor packaging workpiece.

[0087] Furthermore, calculating the deviation between the calibration stage coordinate system and the workpiece coordinate system to obtain the first deviation information may include the following steps: S610. Obtain the first coordinate information corresponding to the origin of the calibration table coordinate system and the second coordinate information corresponding to the origin of the workpiece coordinate system.

[0088] S620. Based on the first coordinate information and the second coordinate information, calculate the first coordinate deviation value between the origin of the calibration table coordinate system and the origin of the workpiece coordinate system.

[0089] Here, based on the coordinate information of the two origins obtained by S610, the translational deviation components in the X-axis and Y-axis directions are calculated by the coordinate difference, which is the first coordinate deviation value. This deviation value quantifies the offset distance of the two coordinate system origins in the horizontal (X-axis) and vertical (Y-axis) directions, providing core data for the subsequent calculation of the first deviation angle and the first deviation distance.

[0090] For example, given the first coordinate information (50, 50) and the second coordinate information (30, 20), the first coordinate deviation value is calculated as follows: X-axis deviation value = 50 - 30 = 20 (the semiconductor package workpiece is offset by 20 in the negative X-axis direction relative to the calibration stage origin); Y-axis deviation value = 50 - 20 = 30 (the semiconductor package workpiece is offset by 30 in the negative Y-axis direction relative to the calibration stage origin), that is, the first coordinate deviation value is (20, 30) (unit: μm).

[0091] In this step, by calculating the coordinate difference based on the first and second coordinate information, the translational deviation components in the X and Y axes can be accurately quantified, and the origin offset can be converted into quantifiable deviation data. This provides clear and accurate intermediate data for subsequent calculations of deviation angle and deviation distance, improving the pertinence of deviation calculation.

[0092] S630. Based on the first coordinate deviation value, obtain the first deviation angle and the first deviation distance.

[0093] Here, the first deviation distance is the straight-line distance between the origins of the two coordinate systems, which can quantify the overall translational deviation of the semiconductor package workpiece relative to the calibration stage; the first deviation angle is the angle between the two coordinate systems on the X-axis, which quantifies the tilt deviation of the semiconductor package workpiece relative to the calibration stage. The first coordinate deviation value is converted into a deviation parameter that can be directly used for calibration stage correction through geometric calculation.

[0094] Based on the first coordinate deviation value (20,30), the example of calculating the first deviation distance and the first deviation angle is as follows: ① First deviation distance: calculated as 36.06μm using the distance formula between two points; ② First deviation angle: since the X-axis of the two coordinate systems are parallel, the included angle is 0°, that is, the first deviation angle is 0°. Finally, the first deviation information is "first deviation angle 0°, first deviation distance 36.06μm".

[0095] In this step, the first coordinate deviation value is converted into the first deviation angle (tilt deviation) and the first deviation distance (overall translation deviation), which can be directly adapted to the correction action requirements of the calibration table.

[0096] Using the above method, the obtained first deviation angle and first deviation distance can improve the quantification accuracy of the first deviation information, providing a precise basis for calibration table correction, so as to solve the problem of incomplete position calibration of semiconductor packaged workpieces on the calibration table.

[0097] The second deviation information is obtained by calculating the deviation between the coordinate system of the handling arm and the coordinate system of the workpiece, which may include the following steps: S710. Obtain the second coordinate information corresponding to the origin of the workpiece coordinate system and the third coordinate information corresponding to the origin of the transport arm coordinate system.

[0098] For example, the second coordinate information of the origin of the workpiece coordinate system is obtained as (30, 20) through the vision inspection module. At the same time, the third coordinate information of the origin of the transport arm coordinate system is obtained as (30, 20) through the preset parameters of the cutting equipment. The second coordinate information corresponding to the origin of the workpiece coordinate system and the third coordinate information corresponding to the origin of the transport arm coordinate system are both obtained based on the same two-dimensional coordinate system and can be directly used for subsequent calculation of the second deviation information. If there is a positional offset of the semiconductor packaged workpiece, the second coordinate information can be (30, 18) and the third coordinate information can be (30, 20), that is, the origin of the workpiece coordinate system and the origin of the transport arm coordinate system do not coincide.

[0099] S720. Based on the second coordinate information and the third coordinate information, calculate the second coordinate deviation value between the origin of the workpiece coordinate system and the origin of the transport arm coordinate system.

[0100] Based on the second and third coordinate information obtained in step S710, the translational deviation components of the semiconductor package workpiece in the X and Y axes are calculated by the coordinate difference, i.e., the second coordinate deviation value. The second coordinate deviation value quantifies the offset distance between the center point of the semiconductor package workpiece and the ideal handling reference point of the handling arm in the horizontal and vertical directions, providing core data for subsequent calculation of the second deviation angle and the second deviation distance, and directly reflecting the translational deviation between the current position of the semiconductor package workpiece and the ideal handling position.

[0101] Two scenarios are used to illustrate this step, reflecting actual working conditions: ① No offset of the semiconductor packaged workpiece: Combining the second coordinate information (30,20) and the third coordinate information (30,20), the X-axis deviation value is calculated as 30-30=0, the Y-axis deviation value is calculated as 20-20=0, and the second coordinate deviation value is (0,0); ② Y-axis offset of the semiconductor packaged workpiece: If the second coordinate information is (30,18) and the third coordinate information is (30,20), then the X-axis deviation value is 0μm, the Y-axis deviation value is 20-18=2μm, and the second coordinate deviation value is (0,2) (the semiconductor packaged workpiece is offset by 2μm along the negative Y-axis direction).

[0102] This step allows for the quantification of translational deviations of semiconductor package workpieces in the X and Y axes, accurately reflecting the deviations of the semiconductor package workpieces from their ideal handling positions.

[0103] S730. Based on the second coordinate deviation value, obtain the second deviation angle and the second deviation distance.

[0104] Here, the second deviation distance is the straight-line distance between the origin of the workpiece coordinate system and the transport arm coordinate system, which is the overall translational deviation of the semiconductor package workpiece relative to the ideal transport position of the transport arm; the second deviation angle is the angle between the corresponding X-axis of the workpiece coordinate system and the transport arm coordinate system, which is the tilt deviation of the semiconductor package workpiece relative to the transport arm. The second coordinate deviation value is converted into a quantitative parameter that can be directly used for the calibration table and transport arm position correction through geometric calculation.

[0105] For example, here we combine two scenarios for calculation: ① No offset of semiconductor packaged workpiece: Second coordinate deviation value (0μm, 0μm), second deviation distance = 0μm, the X-axis of the two coordinate systems are parallel, second deviation angle = 0°, and the second deviation information is "deviation angle 0°, deviation distance 0μm"; ② Semiconductor packaged workpiece has Y-axis offset and slight tilt: If the second coordinate deviation value is (0μm, 2μm), the angle between the X-axis of the workpiece coordinate system and the X-axis of the transport arm coordinate system is 0.3°, then the second deviation distance = 2μm, the second deviation angle = 0.3°, and the second deviation information is "deviation angle 0.3°, deviation distance 2μm", providing a clear basis for the axial rotation of the calibration table and the movement of the transport arm in the Y-axis.

[0106] This step converts the coordinate deviation between the workpiece coordinate system and the transport arm coordinate system into quantitative parameters, providing a clear basis for the correction actions of the calibration table and the transport arm, thereby ensuring the transport arm can accurately transport semiconductor packaged workpieces.

[0107] By using the above method, it can be ensured that the obtained second deviation information matches the handling requirements of semiconductor packaged workpieces, providing a complete and reliable basis for the subsequent correction actions of the calibration table and handling arm, thereby improving the overall calibration accuracy of semiconductor packaged workpieces.

[0108] Furthermore, based on the deviation information, controlling the calibration stage to rotate axially and / or move along the X-axis, and / or controlling the transport arm to move along the Y-axis, so that the semiconductor package workpiece is positioned in a preset position, may include the following steps: S810. Determine whether the first deviation information and the second deviation information are the same.

[0109] This step is a preliminary judgment for deviation correction. Its core is to determine the priority and implementation logic of subsequent correction actions by comparing the consistency of the first deviation information (the deviation between the semiconductor package workpiece and the calibration stage) and the second deviation information (the deviation between the semiconductor package workpiece and the transport arm).

[0110] S820. If the first deviation information and the second deviation information are the same, then calculate the first rotation angle and the first rotation direction of the calibration table axial rotation based on the first deviation information.

[0111] When the first deviation information and the second deviation information are the same, the overall offset state of the semiconductor packaged workpiece is consistent. The first rotation angle and the first rotation direction of the calibration table can be calculated based on the first deviation information (the deviation between the semiconductor packaged workpiece and the calibration table). The first rotation angle is equal to the first deviation angle (to counteract the tilt of the semiconductor packaged workpiece on the calibration table), and the first rotation direction is opposite to the tilt direction of the semiconductor packaged workpiece. This ensures that the workpiece coordinate system is parallel to the coordinate axis of the transport arm coordinate system after the calibration table rotates, laying the foundation for the subsequent translation correction of the calibration table and the transport arm.

[0112] For example: if the first deviation angle in the first deviation information is known to be 0.3° (the X-axis in the workpiece coordinate system is tilted 0.3° clockwise relative to the X-axis in the calibration table and transport arm coordinate system), then the first rotation angle is calculated to be 0.3°, and the first rotation direction is counterclockwise, so as to ensure that after the calibration table rotates counterclockwise by 0.3°, the X-axis in the workpiece coordinate system is parallel to the X-axis in the transport arm coordinate system.

[0113] S830. Based on the first rotation angle and the first rotation direction, control the axial rotation of the calibration stage so that the X-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the X-axis of the transport arm coordinate system, and the Y-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the Y-axis of the transport arm coordinate system.

[0114] Here, by controlling the calibration stage to rotate axially according to the calculated first rotation angle and first rotation direction, the tilt deviation of the semiconductor package workpiece on the calibration stage is offset, so that the coordinate axes of the workpiece coordinate system and the transport arm coordinate system are completely parallel, eliminating the influence of tilt on subsequent translation correction, ensuring accurate translation correction, and providing a premise for the workpiece coordinate system and the transport arm coordinate system to coincide.

[0115] For example, based on the first rotation angle of 0.3° calculated by S820 and the counterclockwise direction, the calibration stage is controlled to rotate counterclockwise by 0.3°. After the calibration stage rotates axially, the X-axis of the workpiece coordinate system is parallel to the X-axis of the transport arm coordinate system, and the Y-axis of the workpiece coordinate system is parallel to the Y-axis of the transport arm coordinate system, so as to completely cancel the tilt deviation of the semiconductor package workpiece on the calibration stage.

[0116] S840. Based on the distance between the X-axis in the workpiece coordinate system and the X-axis in the transport arm coordinate system, control the calibration stage to move along the X-axis direction; and based on the distance between the Y-axis in the workpiece coordinate system and the Y-axis in the transport arm coordinate system, control the transport arm to move along the Y-axis direction, so that the workpiece coordinate system corresponding to the semiconductor package workpiece coincides with the transport arm coordinate system.

[0117] Here, the distance between the X-axis in the workpiece coordinate system and the X-axis in the transport arm coordinate system, and the distance between the Y-axis in the workpiece coordinate system and the Y-axis in the transport arm coordinate system (i.e., translational deviation components) are used to control the calibration stage to move along the X-axis and the transport arm to move along the Y-axis, so as to counteract the translational deviation of the semiconductor package workpiece, thereby making the workpiece coordinate system and the transport arm coordinate system completely coincide, and at this time the semiconductor package workpiece reaches the ideal preset position.

[0118] For example: After the calibration table rotates axially, the coordinate axes of the workpiece coordinate system and the transport arm coordinate system are parallel. After detection, the distance between the X-axis and the distance between the Y-axis in the two coordinate systems is 0mm and 2mm (the workpiece is offset along the negative Y-axis). The transport arm is controlled to move 2mm along the positive Y-axis and not move in the X-axis direction. After the movement is completed, the workpiece coordinate system and the transport arm coordinate system are completely coincident. At this time, the semiconductor packaged workpiece reaches the preset position, and the semiconductor packaged workpiece at this time meets the requirements of precise transport by the transport arm.

[0119] Using the above method, through the process of "deviation judgment → rotation correction → translation correction", and for the scenario where "the first and second deviation information are the same", the control is carried out in steps S820 to S830 to control the rotation and movement of the calibration table and the movement of the transport arm in a targeted manner according to the situation where the deviation information is the same, so as to make the semiconductor packaged workpiece reach the preset position and achieve accurate calibration of the semiconductor packaged workpiece.

[0120] Furthermore, based on the deviation information, controlling the axial rotation of the calibration stage and / or its movement along the X-axis, and / or controlling the movement of the transport arm along the Y-axis, to position the semiconductor package workpiece in a preset position, may also include the following steps: S910. If the first deviation information and the second deviation information are different, then calculate the second rotation angle and the second rotation direction of the calibration table axial rotation based on the first deviation information and the second deviation information.

[0121] When the first deviation information and the second deviation information are different, it indicates that there is a difference in the tilt state of the semiconductor packaged workpiece relative to the calibration stage and the transport arm. It is necessary to combine the two deviation information to calculate the second rotation angle and the second rotation direction. Here, the second rotation angle is the difference between the two deviation angles (to accurately offset the actual tilt deviation of the workpiece), and the second rotation direction is determined by combining the tilt direction of the two deviation information to ensure that the coordinate system of the workpiece after the axial rotation of the calibration stage is parallel to the coordinate axis of the transport arm coordinate system, so as to provide an accurate premise for subsequent translation correction.

[0122] For example, the first deviation information is "deviation angle 0.5° (clockwise), deviation distance 3mm", and the second deviation information is "deviation angle 0.2° (clockwise), deviation distance 2mm". The second rotation angle is calculated as the difference between the two deviation angles of 0.3°, and the second rotation direction is counterclockwise (opposite to the tilt direction of the semiconductor packaged workpiece), ensuring that after the calibration table rotates axially, the coordinate axes of the workpiece coordinate system and the transport arm coordinate system are parallel.

[0123] S920. Based on the second rotation angle and the second rotation direction, control the axial rotation of the calibration stage so that the X-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the X-axis of the transport arm coordinate system, and the Y-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the Y-axis of the transport arm coordinate system.

[0124] Here, by controlling the calibration stage to rotate axially according to the comprehensively calculated rotation angle and direction, the actual tilt deviation of the semiconductor package workpiece is offset, eliminating the correction interference caused by the difference between the first deviation information and the second deviation information, making the coordinate axes of the workpiece coordinate system and the transport arm coordinate system completely parallel, clearing obstacles for subsequent translation correction (the translation logic in S840 can be used), ensuring the overall correction accuracy of the semiconductor package workpiece, and ensuring that the semiconductor package workpiece finally reaches the preset position.

[0125] Following the example in step S910, based on the second rotation angle of 0.3° calculated in step S910 and the counterclockwise direction, the calibration stage is controlled to rotate counterclockwise by 0.3°. After the calibration stage rotates axially, the X-axis of the workpiece coordinate system is parallel to the X-axis of the transport arm coordinate system, and the Y-axis of the workpiece coordinate system is parallel to the Y-axis of the transport arm coordinate system, so as to completely cancel the tilt deviation of the semiconductor package workpiece, and can proceed to the subsequent translation correction step of the workpiece.

[0126] By adopting the above steps, in the scenario where "the first and second deviation information are different", the rotation parameters of the calibration table can be accurately calculated and its rotation controlled to eliminate the tilt deviation of the workpiece and lay the foundation for subsequent translation correction.

[0127] Optionally, based on the deviation information, controlling the calibration stage to rotate axially and / or move along the X-axis, and / or controlling the transport arm to move along the Y-axis, so that the semiconductor package workpiece is positioned at a preset position, may further include the following steps: S1010. If the first deviation information and the second deviation information are different, then calculate the first preset moving distance of the calibration table along the X-axis direction and / or the second preset moving distance of the transport arm along the Y-axis direction based on the first deviation information and the second deviation information.

[0128] When the first deviation information and the second deviation information are different, the semiconductor packaged workpiece has a combined translational and tilting deviation. In this step, the translational deviation of the semiconductor packaged workpiece is corrected first. Combining the translational components in the first and second deviation information, the movement distance of the calibration stage along the X-axis (first preset movement distance) and the movement distance of the transport arm along the Y-axis (second preset movement distance) are calculated comprehensively. Here, the first preset movement distance is calculated based on the X-axis translational components in the first and second deviation information. Therefore, after the calibration stage moves the first preset movement distance along the X-axis, the translational deviation of the semiconductor packaged workpiece in the X-axis direction can be offset. The second preset movement distance is calculated based on the Y-axis translational components in the first and second deviation information. Therefore, after the transport arm moves the second preset movement distance along the Y-axis, the translational deviation of the semiconductor packaged workpiece in the Y-axis direction can be offset, laying the foundation for the subsequent rotational correction of the calibration stage.

[0129] For example: In a scenario where the first and second deviation information differ (moving first and then rotating), the first deviation information is "deviation angle 0.4° (clockwise), X-axis translation deviation 3mm, Y-axis translation deviation 4mm", and the second deviation information is "deviation angle 0.1° (clockwise), X-axis translation deviation 0mm, Y-axis translation deviation 1mm". The first preset moving distance is calculated to be 3mm (the calibration table moves along the negative X-axis direction to offset the X-axis translation deviation), and the second preset moving distance is calculated to be 1mm (the transport arm moves along the negative Y-axis direction to offset the Y-axis translation deviation), to ensure that the origin of the workpiece coordinate system coincides with the origin of the transport arm coordinate system after the movement.

[0130] S1020. According to the first preset moving distance, control the calibration table to move along the X-axis direction; and according to the second preset moving distance, control the transport arm to move along the Y-axis direction so that the origin of the workpiece coordinate system coincides with the origin of the transport arm coordinate system.

[0131] According to the preset moving distance calculated in step S1010, the calibration stage and the transport arm are controlled to move respectively to accurately offset the translational deviation of the semiconductor packaging workpiece in the X and Y axes, so that the origin of the workpiece coordinate system coincides with the origin of the transport arm coordinate system, eliminating the interference of the translational deviation of the semiconductor packaging workpiece on the subsequent rotation correction, ensuring that the rotation correction of the calibration stage is only for the tilt deviation, and improving the overall correction accuracy.

[0132] For example, based on the first preset moving distance of 3mm (negative X-axis direction) and the second preset moving distance of 1mm (negative Y-axis direction) calculated in the example of step S1010, the calibration stage is controlled to move 3mm along the negative X-axis direction, and the transport arm is controlled to move 1mm along the negative Y-axis direction. After the calibration stage and the transport arm have moved, the origin of the workpiece coordinate system and the origin of the transport arm coordinate system are completely coincident, so that the translational deviation of the semiconductor package workpiece is completely canceled.

[0133] S1030. Based on the first deviation information and the second deviation information, calculate the third rotation angle and the third rotation direction of the axial rotation of the calibration table.

[0134] After the translational deviation of the semiconductor packaged workpiece is offset, the tilt deviation of the semiconductor packaged workpiece needs to be corrected. Therefore, the tilt component in the dual deviation information formed by the first deviation information and the second deviation information is combined to comprehensively calculate the third rotation angle and the third rotation direction of the calibration table axial rotation. The third rotation angle is the difference between the two deviation angles (to accurately offset the actual tilt deviation of the workpiece), and the third rotation direction is determined by combining the tilt direction of the two deviation information. This ensures that after the calibration table rotates, the coordinate axes of the workpiece coordinate system and the transport arm coordinate system are completely parallel, providing a guarantee for the final coincidence of the two coordinate systems and further solving the pain point of inaccurate tilt correction when the deviations are not simultaneous in the existing technology.

[0135] For example, considering different deviation scenarios (moving first and then rotating), with a first deviation angle of 0.4° (clockwise) and a second deviation angle of 0.1° (clockwise), the third rotation angle is calculated as the difference between the two deviation angles of 0.3°. The third rotation direction is counterclockwise (opposite to the workpiece tilt direction), ensuring that the workpiece coordinate system is parallel to the coordinate axis of the transport arm coordinate system after the axial rotation of the calibration table.

[0136] S1040. Based on the third rotation angle and the third rotation direction, control the axial rotation of the calibration stage so that the workpiece coordinate system corresponding to the semiconductor package workpiece coincides with the transport arm coordinate system.

[0137] Here, by controlling the calibration platform to rotate axially according to the calculated third rotation angle and third rotation direction, the actual tilt deviation of the semiconductor packaged workpiece is precisely offset, making the coordinate axes of the workpiece coordinate system and the transport arm coordinate system completely parallel. Combined with the translation correction results mentioned above, the two coordinate systems are finally made to coincide, so as to ensure that the semiconductor packaged workpiece reaches the preset position, providing a guarantee for the precise transport of the transport arm and perfecting the "first move then rotate" correction closed loop for the semiconductor packaged workpiece.

[0138] For example: based on the third rotation angle of 0.3° calculated by S1030 and the counterclockwise direction, the calibration stage is controlled to rotate counterclockwise by 0.3°. After the rotation is completed, the workpiece coordinate system and the transport arm coordinate system are completely coincident, so that the semiconductor packaged workpiece reaches the preset position.

[0139] Using the above method, for scenarios where "the first and second deviation information are different", the logic of "translation first, then rotation" can be adopted. First, the origin of the two coordinate systems is aligned by moving the calibration table along the X-axis and the transport arm along the Y-axis. Then, the tilt deviation is offset by rotating the calibration table along the axial direction. Finally, the workpiece coordinate system and the transport arm coordinate system are made to coincide, which further improves the deviation correction system and makes the calibration method provided in this application adaptable to more complex deviation scenarios.

[0140] Figure 4 This is a schematic diagram of a calibration device 1100 according to an embodiment of the present invention. The calibration device 1100 is applied to a semiconductor cutting equipment, which includes a calibration table, a transport arm, and a cutting table. The calibration table is used to hold semiconductor packaged workpieces and perform position calibration on the workpieces. The transport arm is used to transport the semiconductor packaged workpieces located on the calibration table to the cutting table. The calibration device 1100 includes: The calibration platform coordinate system acquisition module 1110 is used to obtain the calibration platform coordinate system corresponding to the calibration platform based on the position coordinates corresponding to the first target area on the calibration platform. The workpiece coordinate system acquisition module 1120 is used to obtain the workpiece coordinate system corresponding to the semiconductor packaged workpiece placed on the calibration table after the semiconductor packaged workpiece to be cut is placed on the calibration table, based on the position coordinates corresponding to the second target area on the semiconductor packaged workpiece. The deviation calculation module 1130 is used to calculate the deviation information between the semiconductor packaged workpiece and the preset position based on the calibration table coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm; the preset position is the position of the semiconductor packaged workpiece when the workpiece coordinate system and the transport arm coordinate system coincide. The control movement module 1140 is used to control the axial rotation and / or movement along the X-axis of the calibration stage, and to control the movement of the transport arm along the Y-axis, based on the deviation information, so that the semiconductor package workpiece is located in a preset position.

[0141] In some implementations, the calibration stage includes a suction cup and a mounting plate. The suction cup is mounted on the mounting plate via a mounting assembly, which includes two mounting blocks located on opposite sides of the suction cup. Each mounting block and the suction cup are coaxially aligned along the X-axis, and the axis of each mounting block along the Y-axis is parallel to the axis of the suction cup along the Y-axis. Positioning holes are symmetrically formed on both sides of the axis of each mounting block along the X-axis. The first target area is the area corresponding to the positioning holes on the two mounting blocks. The calibration stage coordinate system acquisition module 1110 includes: The first image acquisition unit is used to acquire a first top view image of the calibration table; The reference position information determination unit is used to obtain the reference position information corresponding to each positioning hole based on the position information of the area corresponding to each positioning hole in the first top view image. The first calculation unit is used to calculate the reference center coordinate information corresponding to the center point of the suction cup, as well as the axis of the suction cup along the X-axis and the axis along the Y-axis, based on the reference position information corresponding to each positioning hole. The calibration stage coordinate system determination unit is used to draw the suction cup coordinate system corresponding to the suction cup along the X-axis and Y-axis based on the reference center coordinate information corresponding to the center point of the suction cup, and use the suction cup coordinate system as the calibration stage coordinate system corresponding to the calibration stage.

[0142] In some implementations, the workpiece coordinate system acquisition module 1120 includes: The second image acquisition unit is used to acquire a second top view image of the semiconductor packaged workpiece carried on the calibration table; The feature point location information determination unit is used to obtain the feature point location information corresponding to the feature point on the semiconductor package workpiece based on the location information of the region corresponding to the feature point in the second top view image for each feature point on the semiconductor package workpiece. The workpiece coordinate information determination unit is used to determine the workpiece center coordinate information corresponding to the center point of the semiconductor packaged workpiece, as well as the workpiece along the length direction and along the width direction, based on the feature point position information corresponding to the feature points on the semiconductor packaged workpiece. The workpiece coordinate system determination unit is used to draw the workpiece coordinate system corresponding to the semiconductor packaging workpiece along the length and width directions of the workpiece based on the workpiece center coordinate information.

[0143] In some implementations, the deviation information includes first deviation information of the semiconductor package workpiece on the calibration stage and second deviation information of the semiconductor package workpiece under the transport arm; the deviation calculation module 1130 includes: The first deviation information calculation unit is used to calculate the deviation between the calibration table coordinate system and the workpiece coordinate system to obtain the first deviation information; the first deviation information includes the first deviation angle and the first deviation distance. The second deviation information calculation unit is used to calculate the deviation between the transport arm coordinate system and the workpiece coordinate system corresponding to the transport arm, and obtain the second deviation information; the deviation information includes the second deviation angle and the second deviation distance.

[0144] In some possible implementations, the first deviation information calculation unit includes: The first coordinate acquisition subunit is used to acquire the first coordinate information corresponding to the origin of the calibration table coordinate system and the second coordinate information corresponding to the origin of the workpiece coordinate system. The first coordinate deviation calculation subunit is used to calculate the first coordinate deviation value between the origin of the calibration table coordinate system and the origin of the workpiece coordinate system based on the first coordinate information and the second coordinate information. The first deviation information calculation subunit is used to obtain the first deviation angle and the first deviation distance based on the first coordinate deviation value; And / or, the second deviation information calculation unit includes: The second coordinate acquisition subunit is used to acquire the second coordinate information corresponding to the origin of the workpiece coordinate system and the third coordinate information corresponding to the origin of the transport arm coordinate system. The second coordinate deviation calculation subunit is used to calculate the second coordinate deviation value between the origin of the workpiece coordinate system and the origin of the transport arm coordinate system based on the second coordinate information and the third coordinate information. The second deviation information calculation subunit is used to obtain the second deviation angle and the second deviation distance based on the second coordinate deviation value.

[0145] In some implementations, the control movement module 1140 includes: The judgment unit is used to determine whether the first deviation information and the second deviation information are the same; The first parameter determination unit is used to calculate the first rotation angle and the first rotation direction of the calibration table axial rotation based on the first deviation information if the first deviation information and the second deviation information are the same. The first axial rotation control unit is used to control the axial rotation of the calibration stage according to the first rotation angle and the first rotation direction, so that the X coordinate axis in the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the X coordinate axis in the transport arm coordinate system, and the Y coordinate axis in the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the Y coordinate axis in the transport arm coordinate system. The first linear motion control unit is used to control the calibration stage to move along the X-axis direction according to the distance between the X-axis in the workpiece coordinate system and the X-axis in the transport arm coordinate system; and to control the transport arm to move along the Y-axis direction according to the distance between the Y-axis in the workpiece coordinate system and the Y-axis in the transport arm coordinate system, so that the workpiece coordinate system corresponding to the semiconductor package workpiece coincides with the transport arm coordinate system.

[0146] In some implementations, the control movement module 1140 further includes: The second parameter determination unit is used to calculate the second rotation angle and the second rotation direction of the calibration table axial rotation based on the first deviation information and the second deviation information if the first deviation information and the second deviation information are different. The second axial rotation control unit is used to control the axial rotation of the calibration stage according to the second rotation angle and the second rotation direction, so that the X coordinate axis in the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the X coordinate axis in the transport arm coordinate system, and the Y coordinate axis in the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the Y axis in the transport arm coordinate system.

[0147] In some implementations, the control movement module 1140 further includes: The moving distance calculation unit is used to calculate, based on the first deviation information and the second deviation information, a first preset moving distance of the calibration table along the X-axis direction and / or a second preset moving distance of the transport arm along the Y-axis direction if the first deviation information and the second deviation information are different. The second linear motion control unit is used to control the calibration table to move along the X-axis direction according to the first preset moving distance; and to control the transport arm to move along the Y-axis direction according to the second preset moving distance, so that the origin of the workpiece coordinate system coincides with the origin of the transport arm coordinate system. The third parameter determination unit is used to calculate the third rotation angle and the third rotation direction of the calibration table axial rotation based on the first deviation information and the second deviation information. The third axial rotation control unit is used to control the axial rotation of the calibration stage according to the third rotation angle and the third rotation direction, so that the workpiece coordinate system corresponding to the semiconductor package workpiece coincides with the transport arm coordinate system.

[0148] It should be understood that the calibration device embodiments and calibration method embodiments can correspond to each other, and similar descriptions can be found in the calibration method embodiments. To avoid repetition, further details are omitted here. Specifically, Figure 4 The calibration device 1100 shown can perform the above-described calibration method embodiments, and the aforementioned and other operations and / or functions of each module in the calibration device 1100 are respectively for implementing the corresponding process in the above-described calibration method. For the sake of brevity, they will not be described in detail here.

[0149] The calibration device 1100 of this invention, as described above with reference to the accompanying drawings, is explained from the perspective of functional modules. It should be understood that this functional module can be implemented in hardware, in software instructions, or in a combination of hardware and software modules. Specifically, the steps of the calibration method and detection method embodiments of this invention can be completed by integrated logic circuits in the processor's hardware and / or by software instructions. The steps of the calibration method and detection method disclosed in this invention can be directly manifested as execution by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. Optionally, the software module can be located in a mature storage medium in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, or registers. This storage medium is located in memory, and the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above-described calibration method and detection method embodiments.

[0150] Figure 5 This is a schematic block diagram of an electronic device 110 according to an embodiment of the present invention.

[0151] like Figure 5 As shown, the electronic device 110 may include: The system includes a memory 111 and a processor 112. The memory 111 stores computer programs and transfers the program code to the processor 112. In other words, the processor 112 can retrieve and run the computer programs from the memory 111 to implement the methods described in the embodiments of the present invention.

[0152] For example, the processor 112 can be used to execute the above-described method embodiments according to instructions in the computer program.

[0153] In some embodiments of the present invention, the electronic device 110 may include, but is not limited to: General-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0154] In some embodiments of the present invention, the memory 111 includes, but is not limited to: Volatile memory and / or non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0155] In some embodiments of the present invention, the computer program may be divided into one or more modules, which are stored in the memory 111 and executed by the processor 112 to perform the method provided by the present invention. The one or more modules may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0156] like Figure 5 As shown, the electronic device 110 may further include: Transceiver 113, which can be connected to processor 112 or memory 111.

[0157] The processor 112 can control the transceiver 113 to communicate with other devices; specifically, it can send information or data to other devices or receive information or data sent by other devices. The transceiver 113 may include a transmitter and a receiver. The transceiver 113 may further include antennas, and the number of antennas may be one or more.

[0158] It should be understood that the various components in the electronic device are connected through a bus system, which includes a data bus, a power bus, a control bus, and a status signal bus.

[0159] The present invention also provides a semiconductor cutting apparatus, including the calibration device described above or the electronic device described above.

[0160] The present invention also provides a computer storage medium having a computer program stored thereon, which, when executed by a computer, enables the computer to perform the methods of the above-described method embodiments. Alternatively, one embodiment of the present invention also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the methods of the above-described method embodiments.

[0161] When implemented using software, it can be implemented entirely or partially as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., Digital Video Disc (DVD)), or a semiconductor medium (e.g., Solid State Disk (SSD)).

[0162] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0163] In the several embodiments provided by this invention, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0164] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. For example, the functional modules in the various embodiments of this application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0165] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A calibration method applied to a semiconductor dicing equipment, the semiconductor dicing equipment comprising a calibration table, a transport arm, and a dicing table, wherein the calibration table is used to carry a semiconductor packaged workpiece and perform position calibration on the semiconductor packaged workpiece, and the transport arm is used to transport the semiconductor packaged workpiece located on the calibration table to the dicing table, characterized in that, The method includes: The calibration table coordinate system corresponding to the calibration table is obtained based on the position coordinates of the first target area on the calibration table. After the semiconductor packaged workpiece to be cut is placed on the calibration table, the workpiece coordinate system corresponding to the semiconductor packaged workpiece placed on the calibration table is obtained according to the position coordinates corresponding to the second target area on the semiconductor packaged workpiece. Based on the calibration stage coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm, the deviation information between the semiconductor packaged workpiece and the preset position is calculated; the preset position is the position of the semiconductor packaged workpiece when the workpiece coordinate system and the transport arm coordinate system coincide. Based on the deviation information, the calibration platform is controlled to rotate axially and / or move along the X-axis, and / or the transport arm is controlled to move along the Y-axis, so that the semiconductor package workpiece is located at the preset position.

2. The calibration method according to claim 1, characterized in that, The calibration platform includes a suction cup and a mounting plate. The suction cup is mounted on the mounting plate via a mounting assembly. The mounting assembly includes two mounting blocks, which are located on opposite sides of the suction cup. Each mounting block and the suction cup are coaxially aligned along the X-axis, and the axis of each mounting block along the Y-axis is parallel to the axis of the suction cup along the Y-axis. Each mounting block has symmetrically arranged positioning holes on both sides of its X-axis axis. The first target area is the area corresponding to the positioning holes on the two mounting blocks. Obtaining the calibration platform coordinate system based on the position coordinates corresponding to the first target area on the calibration platform includes: Obtain a first top view image of the calibration platform; Based on the position information of the area corresponding to each positioning hole in the first top view image, the reference position information corresponding to each positioning hole is obtained. Based on the reference position information corresponding to each of the positioning holes, calculate the reference center coordinate information corresponding to the center point of the suction cup, as well as the axis of the suction cup along the X-axis and the axis along the Y-axis. Based on the reference center coordinate information corresponding to the center point of the suction cup, the suction cup coordinate system corresponding to the suction cup is drawn along the X-axis and Y-axis, and the suction cup coordinate system is used as the calibration platform coordinate system corresponding to the calibration platform.

3. The calibration method according to claim 1, characterized in that, The second target region includes the regions corresponding to at least three feature points on the semiconductor package workpiece; obtaining the workpiece coordinate system corresponding to the semiconductor package workpiece placed on the calibration stage based on the position coordinates corresponding to the second target region on the semiconductor package workpiece includes: Obtain a second top view image of the semiconductor packaged workpiece mounted on the calibration stage; For each feature point on the semiconductor package workpiece, the feature point position information corresponding to the feature point on the semiconductor package workpiece is obtained based on the position information of the region corresponding to the feature point in the second top view image. Based on the feature point position information corresponding to at least three feature points on the semiconductor package workpiece, determine the workpiece center coordinate information corresponding to the center point of the semiconductor package workpiece, as well as the workpiece along the length direction and along the width direction; Based on the workpiece center coordinate information, the workpiece coordinate system corresponding to the semiconductor packaging workpiece is drawn along the length direction and the width direction of the workpiece.

4. The calibration method according to claim 1, characterized in that, The deviation information includes first deviation information of the semiconductor packaged workpiece on the calibration table and second deviation information of the semiconductor packaged workpiece below the transport arm; the step of calculating the deviation information between the semiconductor packaged workpiece and the preset position based on the calibration table coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm includes: The deviation between the calibration table coordinate system and the workpiece coordinate system is calculated to obtain the first deviation information; the first deviation information includes a first deviation angle and a first deviation distance. The deviation between the coordinate system of the transport arm and the coordinate system of the workpiece corresponding to the transport arm is calculated to obtain the second deviation information; the deviation information includes the second deviation angle and the second deviation distance.

5. The calibration method according to claim 4, characterized in that, The calculation of the deviation between the calibration table coordinate system and the workpiece coordinate system to obtain the first deviation information includes: Obtain the first coordinate information corresponding to the origin of the calibration table coordinate system and the second coordinate information corresponding to the origin of the workpiece coordinate system; Based on the first coordinate information and the second coordinate information, calculate the first coordinate deviation value between the origin of the calibration table coordinate system and the origin of the workpiece coordinate system; Based on the first coordinate deviation value, the first deviation angle and the first deviation distance are obtained; And / or, the step of calculating the deviation between the transport arm coordinate system corresponding to the transport arm and the workpiece coordinate system to obtain the second deviation information includes: Obtain the second coordinate information corresponding to the origin of the workpiece coordinate system and the third coordinate information corresponding to the origin of the transport arm coordinate system; Based on the second coordinate information and the third coordinate information, calculate the second coordinate deviation value between the origin of the workpiece coordinate system and the origin of the transport arm coordinate system; Based on the second coordinate deviation value, the second deviation angle and the second deviation distance are obtained.

6. The calibration method according to claim 4, characterized in that, The step of controlling the calibration platform to rotate axially and / or move along the X-axis, and / or controlling the transport arm to move along the Y-axis, based on the deviation information, so that the semiconductor package workpiece is located at the preset position, includes: Determine whether the first deviation information and the second deviation information are the same; If the first deviation information and the second deviation information are the same, then the first rotation angle and the first rotation direction of the calibration table axial rotation are calculated based on the first deviation information. Based on the first rotation angle and the first rotation direction, the calibration stage is controlled to rotate axially so that the X-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the X-axis of the transport arm coordinate system, and the Y-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the Y-axis of the transport arm coordinate system. Based on the distance between the X-axis in the workpiece coordinate system and the X-axis in the transport arm coordinate system, the calibration stage is controlled to move along the X-axis; and based on the distance between the Y-axis in the workpiece coordinate system and the Y-axis in the transport arm coordinate system, the transport arm is controlled to move along the Y-axis, so that the workpiece coordinate system corresponding to the semiconductor package workpiece coincides with the transport arm coordinate system.

7. The calibration method according to claim 6, characterized in that, Also includes: If the first deviation information and the second deviation information are different, then the second rotation angle and the second rotation direction of the calibration table axial rotation are calculated based on the first deviation information and the second deviation information. Based on the second rotation angle and the second rotation direction, the calibration stage is controlled to rotate axially so that the X-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the X-axis of the transport arm coordinate system, and the Y-axis of the workpiece coordinate system corresponding to the semiconductor package workpiece is parallel to the Y-axis of the transport arm coordinate system.

8. The calibration method according to claim 6, characterized in that, Also includes: If the first deviation information and the second deviation information are different, then based on the first deviation information and the second deviation information, calculate the first preset moving distance of the calibration table along the X-axis direction and / or the second preset moving distance of the transport arm along the Y-axis direction; According to the first preset moving distance, the calibration platform is controlled to move along the X-axis; and according to the second preset moving distance, the transport arm is controlled to move along the Y-axis so that the origin of the workpiece coordinate system coincides with the origin of the transport arm coordinate system. Based on the first deviation information and the second deviation information, calculate the third rotation angle and the third rotation direction of the axial rotation of the calibration platform; Based on the third rotation angle and the third rotation direction, the calibration stage is controlled to rotate axially so that the workpiece coordinate system corresponding to the semiconductor package workpiece coincides with the transport arm coordinate system.

9. A workpiece calibration device, applied to a semiconductor cutting equipment, the semiconductor cutting equipment comprising a calibration table, a transport arm, and a cutting table, wherein the calibration table is used to carry a semiconductor packaged workpiece and perform position calibration on the semiconductor packaged workpiece, and the transport arm is used to transport the semiconductor packaged workpiece located on the calibration table to the cutting table, characterized in that, The device includes: The calibration platform coordinate system acquisition module is used to obtain the calibration platform coordinate system corresponding to the calibration platform based on the position coordinates corresponding to the first target area on the calibration platform. The workpiece coordinate system acquisition module is used to obtain the workpiece coordinate system corresponding to the semiconductor packaged workpiece placed on the calibration table after the semiconductor packaged workpiece to be cut is placed on the calibration table, based on the position coordinates corresponding to the second target area on the semiconductor packaged workpiece. The deviation calculation module is used to calculate the deviation information between the semiconductor packaged workpiece and the preset position based on the calibration table coordinate system, the workpiece coordinate system, and the transport arm coordinate system corresponding to the transport arm; the preset position is the position of the semiconductor packaged workpiece when the workpiece coordinate system and the transport arm coordinate system coincide. The control movement module is used to control the axial rotation and / or movement along the X-axis of the calibration stage and the movement along the Y-axis of the transport arm, based on the deviation information, so that the semiconductor packaged workpiece is located at the preset position.

10. An electronic device, characterized in that, include: A processor and a memory, the memory being used to store a computer program, the processor being used to invoke and run the computer program stored in the memory to perform the method of any one of claims 1-8.

11. A computer-readable storage medium, characterized in that, Used to store a computer program that causes a computer to perform the method as described in any one of claims 1-8.

12. A semiconductor cutting device, characterized in that, This includes the device as described in claim 9, or the electronic device as described in claim 10.

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