A method for batch production of pre-plated gold-tin cover plates
By combining eutectic reflow soldering with forced cooling, an array of slots is designed on the heat-conducting plate and a circulating water cooling system is used. This solves the problems of uneven bonding strength and low production efficiency of pre-placed gold-tin solder in the existing technology, and achieves high-strength, high-precision and low-cost mass production.
CN122400699APending Publication Date: 2026-07-17GRIKIN ADVANCED MATERIALS
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GRIKIN ADVANCED MATERIALS
- Filing Date
- 2026-02-27
- Publication Date
- 2026-07-17
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Figure CN122400699A_ABST
Abstract
本发明公开了一种可批量制备预置金锡盖板的方法，属于半导体封装技术领域。该方法包括以下步骤：S1、提供带有阵列槽和内置循环水通道的导热板，将盖板与金锡焊料片装入阵列槽；S2、在保护气氛中进行共晶回流焊，使焊料熔融并与盖板表面形成冶金结合；S3、在焊料熔融瞬间启动强制水冷，使焊料急速凝固定型，形成预置焊料层；S4、冷却后取出成品。本发明通过“阵列定位‑共晶焊接‑瞬间凝固”的协同工艺，实现了焊料形状的高精度保持（轮廓变化＜3%）与高强度结合（剪切强度≥50MPa），单次可批量处理数百片，生产效率高、成本低，解决了传统点焊结合强度低、PVD工艺效率低下且成本高昂的问题，适用于需要高可靠性气密封装的大规模生产。
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