Mold glue sealing device and method for module wire harness isolation plate
By combining servo drive components, piezoelectric ceramic transducers, and miniature support pins, the problem of fluid shearing and impact of high-viscosity sealant in narrow mold cavities was solved, achieving stable encapsulation of module wiring harness isolation plates and improving encapsulation quality.
Patent Information
- Application Number
- CN202610838043.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-11
- Publication Date
- 2026-07-17
AI Technical Summary
In the existing technology, during the packaging and molding process of module wire harness isolation plates, the high-viscosity sealant injected into the narrow mold cavity causes fluid shear impact on the flexible wire harness, resulting in instability, displacement and bending of the flexible wire harness, thus reducing the packaging quality.
The device employs a combination of servo drive components, piezoelectric ceramic transducers, and miniature support pins. The servo motor drives the polymer sealing liquid, the piezoelectric ceramic transducer induces an acoustic flow effect to reduce the viscosity of the sealing liquid, and the miniature support pins provide adaptive mechanical support to control the fluid shear force during the sealing process.
It effectively reduces fluid shear impact, improves the stability of the sealing process and the molding qualification rate, and reduces the risk of displacement and breakage of flexible wire harnesses.
Smart Images
Figure CN122401758A_ABST