Graphene foam composite heat-conducting gasket, preparation method and electronic device

CN122402001APending Publication Date: 2026-07-17CHANGSHA LANGYUE NEW MATERIALS CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHANGSHA LANGYUE NEW MATERIALS CO LTD
Filing Date
2026-04-11
Publication Date
2026-07-17

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Abstract

The application belongs to the technical field of thermal interface materials, and particularly relates to a graphene foam composite heat-conducting gasket, a preparation method thereof and an electronic device. The composite heat-conducting gasket comprises a graphene foam core body. The preparation process of the graphene foam core body comprises the following steps: after the graphene foam is loaded with nano liquid metal particles, the graphene foam is subjected to nano liquid metal vapor welding treatment in a closed space, so that the nano liquid metal forms metal welding points in situ at graphene sheet layer joint nodes. The graphene foam is used as the core body, the nano liquid metal particles are loaded, and the metal vapor welding treatment is performed in the closed space, so that the nano liquid metal forms the metal welding points in situ at the graphene sheet layer joint nodes, and the structural strength of the graphene foam is significantly improved. Then, the adhesive is coated, and the layers are subjected to heat pressing and compounding, so that an integrated laminated structure is formed. The heat-conducting gasket prepared by the application meets the heat dissipation requirement of high heat flow density electronic devices.
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