Direct current power supply PCB substrate plating repair method
By using a combination of a regulated rectifier DC power supply and various conductive media, the problems of small PCB substrate repair area and low electroplating efficiency were solved, enabling efficient electroplating repair of large areas and irregular defects, thus improving the repair range and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ZHUHAI DINGZHONG TECHNOLOGY CO LTD
- Filing Date
- 2026-06-08
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies for PCB substrate repair have small repair areas, low electroplating efficiency, and limited applicability. They are difficult to handle irregular defects, have long repair times, and traditional processes rely on colloidal palladium conductive systems, which have limited applicability.
Electroplating repair is performed using a DC power supply with a voltage regulator and rectifier, combined with various conductive media such as ionic palladium, conductive silver oil and conductive copper paste. The tape opening is formed by laser cutting or knife cutting, customized according to the shape of the defect, and electroplating is performed using copper sulfate electroplating solution, followed by polishing.
It expands the repair range to within 10mm, shortens the repair time, improves repair efficiency and applicability, is suitable for irregular defects, and reduces maintenance costs.
Smart Images
Figure CN122406321A_ABST