Metaparamylon composite paper based on anf microgel enhancement and its preparation method and application
The preparation method of meta-aramid composite paper reinforced by ANF microgel solves the problem of incompatibility between aramid fibers and inorganic fillers, improves the insulation and mechanical properties of meta-aramid paper, and achieves higher electric field stability and mechanical strength.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHAANXI UNIV OF SCI & TECH
- Filing Date
- 2026-04-27
- Publication Date
- 2026-07-17
AI Technical Summary
There is interfacial incompatibility between the aramid fibers and inorganic fillers inside meta-aramid paper, which leads to the deterioration of mechanical properties, making it unable to withstand mechanical vibration and stress, and causing severe electrical aging, affecting insulation performance and service life.
A method for preparing meta-aramid composite paper reinforced with ANF microgels was adopted. ANF microgels with a three-dimensional nanoporous network structure were prepared by in-situ protonation and high-speed shearing. The strong interfacial adhesion and capillary force of the microgels were used to fill the micro-gaps between fibers, thereby improving insulation and mechanical properties.
It significantly improves the insulation and mechanical properties of meta-aramid paper, with characteristic breakdown strength of 20-40 kV/mm, tensile strength of 10.5-32.7 MPa, and elongation at break of 2.1-5.3%, effectively reducing electrical aging and mechanical damage.
Smart Images
Figure CN122406589A_ABST