Inductor array design for high-density vertical power delivery applications
By using a vertical inductor array design, the challenge of power demand in high computing density applications of horizontal power delivery systems is solved, achieving efficient power delivery and density, suitable for high-performance computing and artificial intelligence systems.
CN122417616APending Publication Date: 2026-07-17TESLA INC
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TESLA INC
- Filing Date
- 2026-01-13
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing horizontal power delivery systems struggle to meet power demands in high-computation-density applications, particularly in providing high power density and efficiency within limited spaces.
Method used
Employing an array-based inductor design, vertical power delivery is achieved through vertical inductor units and arrays, including power conductors, ground conductors, inductor cores, and PCBs. This supports multi-phase operation and optimizes inductor parameters to adapt to different application requirements.
Benefits of technology
It improves power delivery efficiency and density, reduces resistive losses, simplifies system integration, and is suitable for high-density computing applications such as data centers and artificial intelligence systems.
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Figure CN122417616A_ABST
Abstract
本公开的主题为“用于高密度竖直功率输送应用的电感器阵列设计”。用于竖直功率输送的电感器单元包括第一板、第二板、功率导体、电感器芯和接地导体。功率导体在第一板和第二板之间沿竖直方向延伸。电感器芯在第一板和第二板之间沿竖直方向延伸。接地导体在第一板和第二板之间沿竖直方向延伸。功率导体被配置为在第一板和第二板之间沿竖直方向输送功率。电感器单元被配置为功率输送路径中的电感器。
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