PCB embedded module structure and manufacturing process thereof
By introducing a conductive surface layer, insulating medium, heat spreader, and conductive interconnection structure into the PCB module, the problem of uneven heat dissipation in multi-chip parallel connection is solved, achieving temperature balance and improved heat dissipation performance, making it suitable for high-power electric drive systems.
CN122421184APending Publication Date: 2026-07-17CRRC ZHUZHOU ELECTRIC LOCOMOTIVE RESEARCH INSTITUTE CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CRRC ZHUZHOU ELECTRIC LOCOMOTIVE RESEARCH INSTITUTE CO LTD
- Filing Date
- 2026-05-09
- Publication Date
- 2026-07-17
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Figure CN122421184A_ABST
Abstract
本申请涉及一种PCB嵌入式模块结构及其制造工艺，模块结构包括导电表层、绝缘介质、均热板、功率芯片及至少一个导电连通结构；导电表层设置于绝缘介质的第一表面，均热板设置于绝缘介质的预留槽位内；均热板内部设有填充相变材料的真空腔，且均热板的边缘设有避开真空腔的实心导电部；功率芯片设置于均热板背离导电表层的一侧，功率芯片背离均热板的表面固定于下部连接结构上；导电连通结构沿垂直于绝缘介质的第一表面的方向，自上而下贯穿导电表层、绝缘介质以及均热板的实心导电部，导电连通结构的侧壁设有导电金属层，以实现导电表层与均热板的电连接。通过层间紧密贴合设计，实现了均热强化、电气性能保障与功率密度提升。
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