Three-dimensional packaging structure and method of manufacturing the same
By employing a hybrid bonding method in the 3D packaging structure, sensitive signals and non-sensitive signals are transmitted in two separate planes, solving the problem of signal transmission being easily interfered with and achieving high-quality signal transmission.
CN122421784APending Publication Date: 2026-07-17HYGON INFORMATION TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HYGON INFORMATION TECH CO LTD
- Filing Date
- 2026-04-13
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing 3D packaging structures, signal transmission is prone to interference, which affects the quality of signal transmission.
Method used
By employing a hybrid bonding method, sensitive and non-sensitive signals between two wafers are transmitted on two separate planes. Signal isolation is achieved through a combination of bonding metal layers and redistribution layers.
Benefits of technology
It effectively reduces signal interference and ensures signal transmission quality.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122421784A_ABST
Abstract
本发明提供一种三维封装结构，包括第一晶圆及第二晶圆；第一晶圆上方设置有第一有源区及第一金属互连区、晶背侧开设有第一硅通孔至第一金属互连区，第一硅通孔侧设置有第一键合金属层；第二晶圆的正面预埋有第二硅通孔，第二硅通孔上设置第二有源区及第二金属互连区，第二金属互连区侧设置有第二键合金属层；第一键合金属层与切割后形成的第二晶圆裸片上的第二键合金属层混杂键合连接；第二晶圆裸片两侧填充有介质材料，穿透介质材料、第一键合金属层及第一晶圆开设有达到第一金属互连区的第三硅通孔，第三硅通孔上设置有连通第二硅通孔和第三硅通孔的第二重布线层，第一金属互连区上方设置有凸块。本发明能够将减少信号干扰，保证信号传输质量。
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