A bonding head apparatus and method for heterogeneous integrated chip thermal compression bonding process
By designing a bonding head device composed of a matrix of micro actuators, the problems of uneven pressure and poor compatibility of traditional bonding heads in the thermo-press bonding of heterogeneous integrated chips are solved, achieving high-precision pressure and temperature control and ensuring uniform bonding of heterogeneous integrated chips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHIPMOS TECHNOLOGIES (SHANGHAI) LTD
- Filing Date
- 2026-05-09
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional bonding heads suffer from uneven pressure distribution, poor compatibility, and poor initial thermal contact due to warping in the thermocompression bonding process of heterogeneous integrated chips. They cannot achieve ultra-high resolution, continuous programmable pressure control of the area, and customized bonding environment.
Design a bonding head device that uses a matrix of thousands of independently controllable micro-actuators. The device defines arbitrary two-dimensional pressure distribution through software programming and can actively deform to conform to the warped surface of the chip, achieving precise local pressure application and uniform global bonding.
It achieves ultra-high resolution, area-domain continuous programmable pressure control for heterogeneous integrated chips, compensates for warpage, provides a customized bonding environment, and ensures independent and precise temperature and pressure control for each chipplet.
Smart Images
Figure CN122421802A_ABST