Thin film coating apparatus and method of manufacturing electronic device using the same

Abstract

A film coating apparatus and a method of manufacturing an electronic device using the same are provided. One aspect of the present invention discloses a film coating apparatus including a worktable for supporting a processed object, and an electrode pattern portion disposed above the worktable opposite the processed object and including a first electrode pattern to which a first voltage is applied and a second electrode pattern to which a second voltage different from the first voltage is applied, the electrode pattern portion being configured to perform a rotational motion about a first axis.

Description

Technical Field

[0001] This invention relates to a thin film coating apparatus. This invention also relates to a method for manufacturing electronic devices using this thin film coating apparatus. Background Technology

[0002] Electronic devices can display images or videos using a display panel provided on the device. The display panel can visually display data. The display panel can use light-emitting diodes (LEDs) to provide images or videos. Electronic devices and display panels can be realized by arranging (or coating) multiple thin films on a substrate.

[0003] Methods for depositing thin films on a substrate include chemical bath deposition (CBD), spin coating, dip coating, doctor blade coating, metering rod coating, slot-die coating, spray coating, screen printing, inkjet printing, and aerosol jet printing. The processes described above can have various problems, which may lead to poor film coating. A film coating method and apparatus that can overcome these problems is needed. Summary of the Invention

[0004] According to one or more embodiments of the present invention, a thin film coating apparatus includes: a worktable for supporting a workpiece; and an electrode patterning section arranged above the worktable opposite to the workpiece, and including a first electrode pattern to which a first voltage is applied and a second electrode pattern to which a second voltage different from the first voltage is applied, the electrode patterning section being configured to rotate about a first axis.

[0005] In one embodiment, the worktable may be configured to rotate about the first axis.

[0006] In one embodiment, the thin film coating apparatus may further include: a first moving part for moving the electrode patterned part along the first axis; and a second moving part for moving the electrode patterned part along a second axis different from the first axis.

[0007] In one embodiment, the thin film coating apparatus may further include: a first transfer component connected to the first electrode pattern via a first cable; and a second transfer component connected to the second electrode pattern via a second cable.

[0008] In one embodiment, the thin film coating apparatus may further include: a control unit for generating the first voltage and the second voltage; a third transmission component connected to the control unit and for transmitting the first voltage to the first transmission component; and a fourth transmission component connected to the control unit and for transmitting the second voltage to the second transmission component.

[0009] In one embodiment, on a plane perpendicular to the first axis, the position where the first cable connects to the first electrode pattern can coincide with the center of the first electrode pattern portion.

[0010] In one embodiment, the first electrode pattern may include a plurality of electrodes spaced apart from each other, and the first cable may be connected to the plurality of electrodes at a plurality of connection points.

[0011] In one embodiment, the first electrode pattern may include a first electrode pattern and a first electrode pattern, the first electrode pattern extending along a first edge of the electrode pattern portion, and the first electrode pattern extending from the first electrode pattern toward a second edge on the side opposite to the first edge.

[0012] In one embodiment, the first electrode pattern may have a frame shape surrounding the second electrode pattern on a plane perpendicular to the first axis.

[0013] In one embodiment, the electrode pattern portion may include an insulating portion, within which the first electrode pattern and the second electrode pattern may be embedded.

[0014] In one embodiment, the insulating portion may include: a first insulating layer disposed above the first electrode pattern and the second electrode pattern; a second insulating layer disposed below the first electrode pattern and the second electrode pattern; and a third insulating layer filling the space between the first electrode pattern and the second electrode pattern.

[0015] In one embodiment, the electrode pattern portion may further include: a third electrode pattern, which is subjected to a third voltage different from the first voltage and the second voltage.

[0016] According to one or more embodiments of the present invention, a method for manufacturing an electronic device includes the following steps: providing a thin film coating apparatus, the thin film coating apparatus including: a worktable for supporting a workpiece; and an electrode patterning portion arranged above the worktable opposite to the workpiece, and including a first electrode pattern to which a first voltage is applied and a second electrode pattern to which a second voltage different from the first voltage is applied, the electrode patterning portion being configured to rotate about a first axis; providing the workpiece on the worktable, the workpiece including a processing substrate and a liquid medicine disposed on the processing substrate; and coating a predetermined area on the processing substrate in the form of a thin film by driving the electrode patterning portion.

[0017] In one embodiment, during the step of coating the thin film, the first voltage may be applied to the first electrode pattern, and the second voltage may be applied to the second electrode pattern while the electrode pattern portion is rotated about the first axis.

[0018] In one embodiment, the worktable may be configured to rotate about the first axis. During the coating of the thin film, the first voltage may be applied to the first electrode pattern, and the second voltage may be applied to the second electrode pattern while the liquid medicine and the processing substrate provided on the worktable rotate together with the worktable about the first axis.

[0019] In one embodiment, the method may further include the step of bringing the electrode patterned portion close to the liquid medicine.

[0020] In one embodiment, the method may further include the steps of generating the first voltage and the second voltage and transferring them to the first electrode pattern and the second electrode pattern, respectively.

[0021] In one embodiment, the method may further include the step of heating the liquid medicine on the processing substrate.

[0022] In one embodiment, the electrode pattern portion may include an insulating portion, within which the first electrode pattern and the second electrode pattern may be embedded.

[0023] In one embodiment, the electrode pattern portion may further include: a third electrode pattern, which is subjected to a third voltage different from the first voltage and the second voltage.

[0024] According to various embodiments of the present invention described above, a thin film coating apparatus including a rotatable electrode pattern portion is provided. The thin film coating apparatus of the present invention can coat a chemical solution onto a processing substrate without contacting the substrate to be coated or the chemical solution as the coating substance. This improves coating performance, enhances the durability of the processing substrate, saves coating costs, and reduces the defect rate. Therefore, the overall coating quality can be improved. Attached Figure Description

[0025] Figure 1 This is a perspective view of a thin film coating apparatus according to an embodiment.

[0026] Figure 2a This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0027] Figure 2b This is a longitudinal cross-sectional view of the electrode pattern portion of one embodiment.

[0028] Figure 3a This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0029] Figure 3b This is a longitudinal cross-sectional view of the electrode pattern portion of one embodiment.

[0030] Figure 4 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0031] Figure 5 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0032] Figure 6 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0033] Figure 7 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0034] Figure 8 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0035] Figure 9 This is a block diagram illustrating a method for manufacturing an electronic device according to one embodiment.

[0036] Figure 10a , Figure 10b , Figure 10c , Figure 10d and Figure 10e This is a cross-sectional view illustrating the steps of a method for manufacturing an electronic device according to an embodiment.

[0037] Figure 11 This is a block diagram of an electronic device according to an embodiment.

[0038] Figure 12, Figure 13 and Figure 14 These are schematic diagrams of electronic devices according to various embodiments.

[0039] Figure 15 This is a schematic plan view of an electronic device according to one embodiment.

[0040] Figure 16 This is a cross-sectional view of a display panel according to one embodiment.

[0041] Explanation of reference numerals in the attached figures

[0042] 10: Electronic device 222b1: Electrode pattern of the second-first electrode

[0043] 11: Display panel 222b2: Electrode pattern of the second-second electrode

[0044] 2: Thin film coating device CNT1: First connection position

[0045] 20: Processed object CNT2: Second connection position

[0046] PS: Processing substrate 23: First support portion

[0047] CS: Liquid 24: Second Support Section

[0048] 21: Workbench 25: Third Support Section

[0049] 22: Electrode pattern section; 26: Fourth support section

[0050] 221: Insulation part 27a: First cable

[0051] 221a: First insulation layer; 27b: Second cable

[0052] 221b: Second insulating layer; 28a: First transmission component

[0053] 221c: Third insulating layer; 28b: Second transmission component

[0054] 222: Electrode section 29a: Third transmission component

[0055] 222a: First electrode pattern; 29b: Fourth transmission component

[0056] 222a1: Electrode pattern 1-1; 30a: First voltage line

[0057] 222a2: Pattern of first and second electrodes; 30b: Second voltage line

[0058] 222b: Second electrode pattern; 31: Control unit Detailed Implementation

[0059] This invention can be modified in various ways and can have many embodiments. Specific embodiments are illustrated in the accompanying drawings, and detailed descriptions are provided in the specific embodiments. The effects and features of the invention, as well as methods for implementing them, will become clear with reference to the accompanying drawings and the embodiments described in detail below. This invention is not limited to the embodiments disclosed below, but can be implemented in many different forms.

[0060] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding structural elements will be referred to by the same reference numerals, and repeated descriptions of them will be omitted.

[0061] In this specification, the terms "first," "second," etc., are not used in a limiting sense, but are used for the purpose of distinguishing one structural element from another.

[0062] In this specification, the singular expression includes the plural expression unless the context clearly indicates a different meaning.

[0063] In this specification, terms such as "comprising" or "having" indicate the presence of features or structural elements described in the specification, and do not preclude the possibility of adding more than one other feature or structural element.

[0064] In this specification, when a part referred to as a membrane, region, structural element, etc. is located above or on top of another part, this includes not only the case where it is directly above the other part, but also the case where there are other membranes, regions, structural elements, etc. in between.

[0065] For ease of explanation, the size of structural elements may be exaggerated or reduced in the accompanying drawings. For example, the size and thickness of the structures shown in the figures are arbitrarily depicted for ease of explanation, and therefore the invention is not necessarily limited to the depicted content.

[0066] Where an embodiment can be implemented in different ways, a particular process sequence may also be performed in a different order than that described. For example, two processes described consecutively may be performed substantially simultaneously, or they may be performed in the reverse order of that described process.

[0067] In this specification, "A and / or B" means A, B, or A and B. In this specification, "at least one of A or B" means A, B, or A and B.

[0068] In this specification, when referred to as a connection (e.g., an electrical connection) of a membrane, region, structural element, etc., this includes cases where the membrane, region, or structural element is directly connected (e.g., an electrical connection) and / or where it is indirectly connected (e.g., an electrical connection) through the presence of other membranes, regions, structural elements, etc., in the middle of the membrane, region, or structural element.

[0069] The x-axis, y-axis, and z-axis are not limited to the three axes of a rectangular coordinate system; they can be interpreted in a broader sense that includes these axes. For example, the x-axis, y-axis, and z-axis can be orthogonal to each other, or they can be non-orthogonal to each other.

[0070] Figure 1 This is a perspective view of a thin film coating apparatus according to an embodiment.

[0071] Reference Figure 1 The thin film coating apparatus 2 may include a worktable 21, an electrode patterning section 22, a first support section 23, a second support section 24, a third support section 25, a fourth support section 26, a first cable 27a, a second cable 27b, a first transmission component 28a, a second transmission component 28b, a third transmission component 29a, a fourth transmission component 29b, a first voltage line 30a, a second voltage line 30b, and a control section 31.

[0072] The worktable 21 provides space in which the workpiece 20 of the thin film coating apparatus 2 can be loaded (e.g., placed). The workpiece 20 of the thin film coating apparatus 2 may include a processing substrate PS and a liquid CS. In one embodiment, the thin film coating apparatus 2 may be an apparatus for coating the processing substrate PS with the liquid CS. In one embodiment, the processing substrate PS may be arranged on the worktable 21, and the liquid CS may be arranged on the processing substrate PS (e.g., in droplet form). In one embodiment, the worktable 21 may include a heater that can heat the liquid CS to adjust the viscosity of the liquid CS. The thin film coating apparatus 2 may use the electrode patterning portion 22 to spread the liquid CS arranged on the processing substrate PS over a predetermined area (e.g., the entire processing substrate PS) of the processing substrate PS, and may coat the liquid CS on the processing substrate PS by planarizing the upper surface of the spread liquid CS. In one embodiment, the processing substrate PS may refer to the substrate 91 of the display panel 11 described later (see reference). Figure 16 In one embodiment, the processing substrate PS can refer to a semi-finished product of a display panel 11 on a substrate 91 having multiple layers disposed thereon. In one embodiment, the processing substrate PS can refer to a semi-finished product of any electronic device that is in the manufacturing process of an electronic device and is the object to which the coating solution CS is applied.

[0073] The electrode pattern portion 22 can be arranged above the worktable 21 opposite to the workpiece 20. The electrode pattern portion 22 may include an insulating portion 221 and an electrode portion 222. The electrode portion 222 may be embedded within the insulating portion 221. In one embodiment, the insulating portion 221 may include a first insulating layer 221a, a second insulating layer 221b, and a third insulating layer 221c. In one embodiment, the electrode portion 222 may include a first electrode pattern 222a and a second electrode pattern 222b. In one embodiment, the first insulating layer 221a may be arranged above the electrode portion 222 (e.g., the first electrode pattern 222a and the second electrode pattern 222b). In one embodiment, the second insulating layer 221b may be arranged below the electrode portion 222 (e.g., the first electrode pattern 222a and the second electrode pattern 222b). In one embodiment, the electrode portion 222 (e.g., the first electrode pattern 222a and the second electrode pattern 222b) may be arranged between the first insulating layer 221a and the second insulating layer 221b. In one embodiment, the third insulating layer 221c may be disposed between the first electrode pattern 222a and the second electrode pattern 222b. In one embodiment, the third insulating layer 221c may fill the space between the first electrode pattern 222a and the second electrode pattern 222b. In one embodiment, the first insulating layer 221a, the second insulating layer 221b, and the third insulating layer 221c may be integrally disposed. In one embodiment, the first insulating layer 221a, the second insulating layer 221b, and the third insulating layer 221c may comprise the same material. In one embodiment, the insulating portion 221 may comprise an inorganic insulator such as silicon oxide (SiO2), or an organic insulator such as polyimide (PI) and / or parylene, or may comprise both inorganic and organic insulators simultaneously.

[0074] The electrode pattern section 22 can be supported by the first support section 23, the second support section 24, the third support section 25 and the fourth support section 26 and arranged above the worktable 21.

[0075] The first support portion 23 can be connected to the second support portion 24. The first support portion 23 enables the electrode pattern portion 22 to move in parallel along a first axis (e.g., the z-axis). In one embodiment, the first support portion 23 enables the second support portion 24, the third support portion 25, the fourth support portion 26, and the electrode pattern portion 22 to move in parallel along the first axis (e.g., the z-axis) as a single unit. The first support portion 23 may have any suitable mechanism (e.g., an actuator) for realizing the above-described parallel movement.

[0076] The second support portion 24 can be connected to the first support portion 23 and the third support portion 25. The second support portion 24 enables the electrode pattern portion 22 to move in parallel along a second axis (e.g., the y-axis). In one embodiment, the second support portion 24 enables the third support portion 25, the fourth support portion 26, and the electrode pattern portion 22 to move in parallel along the second axis (e.g., the y-axis) as a single unit. The second support portion 24 may have any suitable mechanism (e.g., an actuator) for realizing the above-described parallel movement.

[0077] The third support portion 25 can be connected to the second support portion 24 and the fourth support portion 26. The third support portion 25 allows the electrode pattern portion 22 to move in parallel along a third axis (e.g., the x-axis). In one embodiment, the third support portion 25 allows the fourth support portion 26 and the electrode pattern portion 22 to move in parallel along the third axis (e.g., the x-axis) as a single unit. The third support portion 25 may have any suitable mechanism (e.g., an actuator) for realizing the above-described parallel movement.

[0078] The fourth support portion 26 can be connected to the third support portion 25 and the electrode pattern portion 22. The fourth support portion 26 enables the electrode pattern portion 22 to rotate about a first axis (e.g., the z-axis). In one embodiment, the fourth support portion 26 enables the insulating portion 221 and the electrode portion 222 of the electrode pattern portion 22 to rotate as a single unit about the first axis (e.g., the z-axis). The fourth support portion 26 may have any suitable mechanism (e.g., a rotor) for realizing the above-described rotational movement. In one embodiment, the worktable 21 may be configured to rotate about the first axis (e.g., the z-axis). In one embodiment, any mechanism (e.g., a rotor) for realizing the above-described rotational movement of the worktable 21 may be provided outside the worktable 21 or built into the worktable 21. In one embodiment, the workpiece 20 arranged on the worktable 21 can rotate (e.g., relative to the electrode pattern portion 22) by the rotational movement of the worktable 21.

[0079] The first electrode pattern 222a can be connected (e.g., electrically connected) to the control unit 31 via the first cable 27a, the first transmission component 28a, the third transmission component 29a, and the first voltage line 30a, and is supplied with a first voltage V1. In one embodiment, the first voltage line 30a can be supplied with DC or AC power. In one embodiment, the first voltage line 30a can be grounded.

[0080] A first voltage line 30a may extend within the first support portion 23, the second support portion 24, the third support portion 25, and the fourth support portion 26 and be connected (e.g., electrically connected) to the third transmission member 29a. In one embodiment, the third transmission member 29a may include a carbon brush. The third transmission member 29a may contact the first transmission member 28a. In one embodiment, the first transmission member 28a may include a slip ring. The first transmission member 28a may be connected (e.g., electrically connected) to a first cable 27a, which may be connected (e.g., electrically connected) to a first electrode pattern 222a.

[0081] The second electrode pattern 222b can be connected (e.g., electrically connected) to the control unit 31 via the second cable 27b, the second transmission component 28b, the fourth transmission component 29b, and the second voltage line 30b, and is supplied with a second voltage V2. In one embodiment, the second voltage line 30b can be supplied with DC or AC power.

[0082] The second voltage line 30b may extend within the first support portion 23, the second support portion 24, the third support portion 25, and the fourth support portion 26 and be connected (e.g., electrically connected) to the fourth transmission member 29b. In one embodiment, the fourth transmission member 29b may include a carbon brush. The fourth transmission member 29b may contact the second transmission member 28b. In one embodiment, the second transmission member 28b may include a slip ring. The second transmission member 28b may be connected (e.g., electrically connected) to the second cable 27b, which may be connected (e.g., electrically connected) to the second electrode pattern 222b.

[0083] When the electrode pattern portion 22 rotates via the fourth support portion 26, the first transmission member 28a can rotate together with the electrode pattern portion 22 and the first cable 27a around a first axis (e.g., the z-axis). In one embodiment, the first transmission member 28a and the third transmission member 29a are not fixedly connected but simply in contact, so even if the electrode pattern portion 22 and the first transmission member 28a rotate, the first voltage V1 from the first voltage line 30a can be continuously supplied to the first electrode pattern 222a via the third transmission member 29a, the first transmission member 28a, and the first cable 27a.

[0084] Similarly, when the electrode pattern portion 22 rotates via the fourth support portion 26, the second transmission member 28b can rotate together with the electrode pattern portion 22 and the second cable 27b around a first axis (e.g., the z-axis). In one embodiment, the second transmission member 28b and the fourth transmission member 29b are not fixedly connected but simply in contact, so even if the electrode pattern portion 22 and the second transmission member 28b rotate, the second voltage V2 from the second voltage line 30b can be continuously supplied to the second electrode pattern 222b via the fourth transmission member 29b, the second transmission member 28b, and the second cable 27b.

[0085] In one embodiment, the first transmission component 28a, the second transmission component 28b, the third transmission component 29a, and the fourth transmission component 29b may be housed within the fourth support portion 26. In one embodiment, the fourth support portion 26 may include (e.g., a cylindrical) housing in which a mechanism (e.g., a rotor) for rotating the electrode pattern portion 22 and the first to fourth transmission components 28a, 28b, 29a, and 29b may be housed. In one embodiment, the electrode pattern portion 22 and the fourth support portion 26 may be connected to each other via a rod, wherein the rod is used to transmit rotational motion generated by the fourth support portion 26 to the electrode pattern portion 22. In one embodiment, the first cable 27a and the second cable 27b may extend within the rod.

[0086] The control unit 31 can provide voltage (or power) to the electrode pattern section 22 via the first voltage line 30a and the second voltage line 30b. In one embodiment, the control unit 31 can provide DC power or AC power. In one embodiment, the control unit 31 can also provide a ground voltage to one of the first voltage line 30a and the second voltage line 30b. In one embodiment, the control unit 31 may include a function generator that generates voltage and an amplifier that amplifies the voltage generated by the function generator. In one embodiment, the control unit 31 may, for example, select an appropriate voltage and provide it to the first voltage line 30a and / or the second voltage line 30b based on the type (and viscosity) of the liquid CS, the size of the substrate PS, the area to be coated with the liquid CS, the shape of the electrode section 222 of the electrode pattern section 22, the rotation speed of the electrode pattern section 22, and the interval between the electrode pattern section 22 and the object being processed 20. Alternatively, the user may select an appropriate first voltage V1 and / or second voltage V2 considering the factors described above and input it to the control unit 31. In one embodiment, the control unit 31 can also control the first support unit 23, the second support unit 24, the third support unit 25 and the fourth support unit 26 to adjust the position of the electrode pattern unit 22.

[0087] Figure 2a This is a cross-sectional view of the electrode pattern portion of one embodiment. Figure 2bThis is a longitudinal cross-sectional view of the electrode pattern portion in one embodiment, which is along... Figure 2a A cross-sectional view of the electrode pattern section taken from line II-II'. Figure 3a This is a cross-sectional view of the electrode pattern portion of one embodiment. Figure 3b This is a longitudinal cross-sectional view of the electrode pattern portion in one embodiment, which is along... Figure 3a A cross-sectional view of the electrode pattern section taken by line III-III'.

[0088] Figure 2a and Figure 3a It is a cross-sectional view of the electrode pattern portion 22 taken along a plane (e.g., the xy plane) perpendicular to the first axis (e.g., the z-axis). Figure 2b and Figure 3b This is a cross-sectional view of the electrode pattern portion 22 taken along a plane (e.g., the zx plane) parallel to the first axis (e.g., the z-axis). For ease of illustration and explanation, in Figure 2a , Figure 2b , Figure 3a and Figure 3b The first insulating layer 221a and the second insulating layer 221b are omitted (see reference). Figure 1 ). Figure 3a and Figure 3b The diagram shows that Figure 2a and Figure 2b The embodiment shown is an embodiment that rotates 90 degrees clockwise around a first axis (e.g., the z-axis).

[0089] Reference Figure 2a , Figure 2b , Figure 3a and Figure 3b The electrode pattern portion 22 may include an insulating portion 221 and an electrode portion 222. The electrode portion 222 may include a first electrode pattern 222a and a second electrode pattern 222b. The insulating portion 221 may include a third insulating layer 221c disposed in the space between the first electrode pattern 222a and the second electrode pattern 222b. The first electrode pattern 222a may include a first-1 electrode pattern 222a1 and a first-2 electrode pattern 222a2, the first-1 electrode pattern 222a1 extending along a first edge of the electrode pattern portion 22, and the first-2 electrode pattern 222a2 extending from the first-1 electrode pattern 222a1 toward a second edge opposite to the first edge. The second electrode pattern 222b may include a second-first electrode pattern 222b1 and a second-second electrode pattern 222b2, wherein the second-first electrode pattern 222b1 extends along the second edge of the electrode pattern portion 22, and the second-second electrode pattern 222b2 extends from the second-first electrode pattern 222b1 toward a first edge on the side opposite to the second edge. The first-second electrode pattern 222a2 and the second-second electrode pattern 222b2 may be arranged alternately in the central portion of the electrode pattern portion 22.

[0090] The first electrode pattern 222a and the second electrode pattern 222b may be spaced apart from each other, and a third insulating layer 221c may be disposed between the first electrode pattern 222a and the second electrode pattern 222b. In one embodiment, the first electrode pattern 222a and the second electrode pattern 222b may be separated by the third insulating layer 221c. In one embodiment, the third insulating layer 221c may be disposed between the first-1 electrode pattern 222a1 and the second-1 electrode pattern 222b1 and between the first-2 electrode pattern 222a2 and the second-2 electrode pattern 222b2. In one embodiment, the spacing between the first electrode pattern 222a and the second electrode pattern 222b (e.g., the spacing between the first-2 electrode pattern 222a2 and the second-2 electrode pattern 222b2) may be from about 0.1 mm to about 1 mm.

[0091] In one embodiment, the first cable 27a may be connected to the first electrode pattern 222a (e.g., the first-second electrode pattern 222a2) at the central portion of the electrode pattern portion 22. In one embodiment, the first connection position CNT1 between the first cable 27a and the first electrode pattern 222a may be arranged at the central portion of the electrode pattern portion 22. In one embodiment, the first connection position CNT1 may be arranged at the center of the electrode pattern portion 22, for example, on a first axis (e.g., the z-axis). Figure 2a and Figure 3a The illustration shows an embodiment in which the center of the first connection position CNT1 is aligned with the center of the electrode pattern portion 22.

[0092] In one embodiment, the second cable 27b may be connected to the second electrode pattern 222b (e.g., the second-2nd electrode pattern 222b2) at the central portion of the electrode pattern portion 22. In one embodiment, the second connection position CNT2 between the second cable 27b and the second electrode pattern 222b may be arranged at the central portion of the electrode pattern portion 22. In one embodiment, the second connection position CNT2 may be arranged at the center of the electrode pattern portion 22, for example, on a first axis (e.g., the z-axis).

[0093] In one embodiment, the center of the electrode pattern portion 22, such as the first axis (e.g., the z-axis), may be arranged between the first connection position CNT1 and the second connection position CNT2 (e.g., the midpoint).

[0094] If, for example, different voltages are applied to the first electrode pattern 222a and the second electrode pattern 222b via the first cable 27a and the second cable 27b, an electric field E (illustrated by dashed lines) can be formed between the first electrode pattern 222a and the second electrode pattern 222b. In one embodiment, as... Figure 2bAn electric field can be formed between the first-second electrode pattern 222a2 and the second-second electrode pattern 222b2, as shown. In one embodiment, as... Figure 3b An electric field can be formed between the first-second electrode pattern 222a2 and the second-first electrode pattern 222b1, as shown.

[0095] Figure 2a and Figure 3a The illustration shows an embodiment where the electrode pattern portion 22 is entirely circular, but the present invention is not necessarily limited to this. In one embodiment, the electrode pattern portion 22 may have various shapes such as polygonal, elliptical, or irregular.

[0096] Figure 4 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0097] Figure 2a and Figure 3a The illustration shows five first-second electrode patterns 222a2 and four second-second electrode patterns 222b2 arranged between the first-second electrode patterns 222a2, but the invention is not necessarily limited to this number. In one embodiment, reference is made to... Figure 4 The first electrode pattern 222a illustrates a first-1 electrode pattern 222a1 and seven first-2 electrode patterns 222a2 extending from the first-1 electrode pattern 222a1; the second electrode pattern 222b illustrates a second-1 electrode pattern 222b1 and seven second-2 electrode patterns 222b2 extending from the second-1 electrode pattern 222b1.

[0098] Figure 5 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0099] Reference Figure 5 The first electrode pattern 222a may have a quadrilateral (e.g., square) shape, and the second electrode pattern 222b may have a frame (e.g., closed loop) shape surrounding the first electrode pattern 222a. In one embodiment, the first electrode pattern 222a and the second electrode pattern 222b may be separated from each other by a third insulating layer 221c. In one embodiment, the third insulating layer 221c may be arranged on the outside of the second electrode pattern 222b. In one embodiment, the first connection position CNT1 may be aligned with the center of the electrode pattern portion 22.

[0100] The present invention is not necessarily limited to embodiments in which the second electrode pattern 222b surrounds the first electrode pattern 222a. In one embodiment, the second electrode pattern 222b may have a quadrilateral (e.g., square) shape, and the first electrode pattern 222a may have a frame (e.g., closed loop) shape surrounding the second electrode pattern 222b.

[0101] The present invention is not necessarily limited to a first electrode pattern 222a in the shape of a quadrilateral and a second electrode pattern 222b in the shape of a quadrilateral frame. In one embodiment, the first electrode pattern 222a may have a circular shape and the second electrode pattern 222b may have a circular frame (e.g., a ring) shape surrounding the first electrode pattern 222a.

[0102] The present invention is not necessarily limited to the embodiment in which the third insulating layer 221c is disposed outside the second electrode pattern 222b. In one embodiment, the second electrode pattern 222b may be configured as a shape corresponding to the edge of the electrode pattern portion 22 (e.g., annular shape). In another embodiment, the second electrode pattern 222b may also be disposed at the outermost periphery of the electrode pattern portion 22 to define the edge of the electrode pattern portion 22.

[0103] Figure 6 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0104] Reference Figure 6 The first electrode pattern 222a and the second electrode pattern 222b may have a semi-circular shape. In one embodiment, the first electrode pattern 222a and the second electrode pattern 222b may be separated from each other by a third insulating layer 221c. In one embodiment, both the first connection position CNT1 and the second connection position CNT2 may not be located at the center of the electrode pattern portion 22. In one embodiment, the center of the electrode pattern portion 22 may be located between the first connection position CNT1 and the second connection position CNT2 (e.g., the midpoint). In one embodiment, the first connection position CNT1 and the second connection position CNT2 may be arranged such that the center of the electrode pattern portion 22 is located between these two positions.

[0105] Figure 7 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0106] Reference Figure 7 The electrode pattern section 22 may include a plurality of first electrode patterns 222a, a plurality of second electrode patterns 222b, a plurality of first connection positions CNT1, and a plurality of second connection positions CNT2. In one embodiment, the plurality of first electrode patterns 222a can be separated by a third insulating layer 221c. In one embodiment, the plurality of second electrode patterns 222b can be separated by a third insulating layer 221c. In one embodiment, adjacent first electrode patterns 222a and second electrode patterns 222b can be separated by a third insulating layer 221c. In one embodiment, the plurality of first electrode patterns 222a and the plurality of second electrode patterns 222b can be arranged alternately in a clockwise (or counterclockwise) direction with a first axis (e.g., the z-axis) as the center.

[0107] In one embodiment, a plurality of first electrode patterns 222a and a plurality of first connection positions CNT1 may be provided, and one first connection position CNT1 may correspond to one first electrode pattern 222a. In one embodiment, a plurality of first cables 27a may be provided and the plurality of first cables 27a are connected to the plurality of first connection positions CNT1, or a single first cable 27a may be provided and a connector (not shown) may be used to connect the single first cable 27a to the plurality of first connection positions CNT1.

[0108] In one embodiment, a plurality of second electrode patterns 222b and a plurality of second connection positions CNT2 may be provided, and one second connection position CNT2 may correspond to one second electrode pattern 222b. In one embodiment, a plurality of second cables 27b may be provided and the plurality of second cables 27b are connected to the plurality of second connection positions CNT2, or a single second cable 27b may be provided and a connector (not shown) may be used to connect the single second cable 27b to the plurality of second connection positions CNT2.

[0109] Figure 8 This is a cross-sectional view of the electrode pattern portion of one embodiment.

[0110] Reference Figure 8 The electrode pattern section 22 may include a first electrode pattern 222a, a second electrode pattern 222b, and a third electrode pattern 222c. The first electrode pattern 222a, the second electrode pattern 222b, and the third electrode pattern 222c can be separated from each other by a third insulating layer 221c. A third cable 27c may be connected to the third electrode pattern 222c. The third cable 27c may be connected to the third electrode pattern 222c at a third connection position CNT3. A third voltage, different from the first voltage V1 and the second voltage V2, may be applied to the third cable 27c, and consequently to the third electrode pattern 222c.

[0111] The aforementioned thin film coating apparatus 2 (refer to) Figure 1 This can be used when manufacturing electronic devices using the processes described later. In one embodiment, the process for manufacturing the electronic device may include a process of coating a liquid CS onto a processing substrate PS. The thin film coating apparatus 2 of the present invention can be used in such a coating process.

[0112] Figure 9 This is a block diagram illustrating a method for manufacturing an electronic device according to one embodiment. Figures 10a to 10e This is a cross-sectional view illustrating the steps of a method for manufacturing an electronic device according to an embodiment.

[0113] Reference Figure 9 and Figure 10aThe manufacturing method of the electronic device may include the step of preparing the thin film coating apparatus 2. In the current step of the process, the workpiece 20 may not be provided on the worktable 21, and the control unit 31 may be in a closed state, for example, not applying voltage to the first voltage line 30a and the second voltage line 30b.

[0114] Reference Figure 9 and Figure 10b A method for manufacturing an electronic device may include the step of providing a workpiece 20 to a thin-film coating apparatus 2, the workpiece 20 including a processing substrate PS and a chemical solution CS. The processing substrate PS may be disposed on a stage 21, and the chemical solution CS may be disposed on the processing substrate PS. In one embodiment, the chemical solution CS may face the electrode pattern portion 22. In the current step of the process, the chemical solution CS may be provided in the form of droplets (e.g., having a meniscus). In the current step of the process, the chemical solution CS may be in a state where it is not spread in the desired area. In one embodiment, the method for manufacturing an electronic device may include the step of heating the chemical solution CS, for example, using a heater (not shown) disposed on the stage 21. By heating the chemical solution CS, the viscosity and spreadability of the chemical solution CS can be adjusted.

[0115] Reference Figure 9 and Figure 10c A method for manufacturing an electronic device may include the step of bringing the electrode pattern portion 22 and the liquid drug CS close together. In one embodiment, a first support portion 23, a second support portion 24, and / or a third support portion 25 may be used to bring the electrode pattern portion 22 and the liquid drug CS close together. Figure 10c The illustration shows an embodiment in which the electrode pattern portion 22 is lowered along a first axis (e.g., the z-axis) to approach the liquid drug CS using the first support portion 23.

[0116] Reference Figure 9 , Figure 10d and Figure 10e The method of manufacturing an electronic device may include the step of spreading a liquid drug CS in the form of a thin film on a predetermined area (e.g., the entire processing substrate PS) on a processing substrate PS by driving an electrode patterning portion 22.

[0117] Reference Figure 9 and Figure 10d A method for manufacturing an electronic device may include the steps of generating and transmitting a first voltage V1 and a second voltage V2. In one embodiment, the first voltage V1 may be generated (e.g., in a control unit 31) and transmitted from the control unit 31 to a first voltage line 30a. The first voltage V1 may be transmitted to an electrode portion 222 (e.g., a first electrode pattern 222a) via the first voltage line 30a, a third transmission member 29a, a first transmission member 28a, and a first cable 27a. Figure 1In one embodiment, a second voltage V2 can be generated (e.g., in the control unit 31) and transmitted from the control unit 31 to the second voltage line 30b. The second voltage V2 can be transmitted to the electrode section 222 (e.g., the second electrode pattern 222b) via the second voltage line 30b, the fourth transmission member 29b, the second transmission member 28b, and the second cable 27b. Figure 1 )).

[0118] Therefore, an electric field E can be formed in the electrode pattern section 22 (e.g., the electrode section 222 of the electrode pattern section 22), and the liquid medicine CS on the processing substrate PS can move under the influence of the electric field E of the electrode pattern section 22. (Referring to...) Figure 10c In the steps described, the electrode pattern section 22 and the liquid medicine CS can be brought close enough so that the liquid medicine CS moves according to the electric field E of the electrode pattern section 22.

[0119] Reference Figure 9 and Figure 10e A method for manufacturing an electronic device may include the step of rotating the electrode patterning portion 22 and / or the worktable 21. In one embodiment, the electrode patterning portion 22 and / or the worktable 21 may rotate about a first axis (e.g., the z-axis). In one embodiment, only the electrode patterning portion 22 may be rotated while the worktable 21 is fixed, only the worktable 21 may be rotated while the electrode patterning portion 22 is fixed, or both the worktable 21 and the electrode patterning portion 22 may be rotated. In embodiments where the worktable 21 is rotated, the workpiece 20 (e.g., a processing substrate PS and a pharmaceutical solution CS) on the worktable 21 may also rotate together with the worktable 21. In one embodiment, the electrode patterning portion 22 may be rotated via a fourth support portion 26, and the worktable 21 may be rotated via a mechanism (e.g., a rotor) separately disposed on the outside or inside of the worktable 21.

[0120] In one embodiment, a first voltage V1 and a second voltage V2 can be applied to the electrode section 222 during the rotation of the electrode pattern section 22 and / or the stage 21. Thus, the electrode pattern section 22 and / or the stage 21 can rotate while an electric field is formed around the electrode pattern section 22. The liquid medicine CS on the processing substrate PS can move according to the electric field E of the electrode pattern section 22. Therefore, a portion of the droplet-shaped liquid medicine CS can spread towards the periphery of the processing substrate PS, and the shape of the upper surface of the liquid medicine CS can change according to the rotation of the electrode pattern section 22 and / or the stage 21. The liquid medicine CS can be spread in a predetermined area (e.g., the entire processing substrate PS) by adjusting the distance between the electrode pattern section 22 and the liquid medicine CS, the type of liquid medicine CS, the potential difference between the first voltage V1 and the second voltage V2 (and the intensity of the resulting electric field E), the rotation direction and / or acceleration of the electrode pattern section 22 and / or the stage 21, and the upper surface of the liquid medicine CS can be planarized. Thus, the liquid medicine CS can be coated on the processing substrate PS.

[0121] Figure 11 This is a block diagram of an electronic device according to an embodiment.

[0122] Reference Figure 11 The electronic device 10 may include a display panel 11, a processor 12, a memory 13, and a power module 14. In one embodiment, the electronic device 10 or the display panel 11 can be referenced... Figures 9 to 10e The method described is used to manufacture electronic devices.

[0123] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller. In one embodiment, the processor 12 may be provided as two or more components functionally or structurally. For example, the processor 12 may include: a main processor in the form of a first driver chip, which includes the CPU; and an auxiliary processor in the form of a second driver chip, which includes a controller that receives image signals from the main processor and processes the image signals to match the interface specifications of the display panel 11.

[0124] The memory 13 may include at least one of non-volatile memory and volatile memory. The memory 13 may store data information required for the operation of the processor 12 or the display panel 11. When the processor 12 executes an application program stored in the memory 13, image data signals and / or input control signals are transmitted to the display panel 11, and the display panel 11 can process the received signals and output image information through the display screen.

[0125] The power module 14 may include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 10. Power conversion based on the power conversion module may include, but is not limited to, DC-DC conversion, AC-DC conversion, and DC-AC conversion.

[0126] The electronic device 10 may further include an input module 15, an output module 16, and / or a communication module 17.

[0127] Input module 15 can provide input information to processor 12 and / or display panel 11. Input module 15 may include not only physical buttons, keyboards, and microphones, but also various sensor modules. Examples of sensor modules may include not only touch sensors, pressure sensors, proximity sensors, position sensors, digitizers, motion recognition sensors, camera sensors, light sensors, photoelectric conversion sensors, and temperature sensors, but also biometric sensors such as blood pressure sensors, blood glucose sensors, electrocardiogram sensors, and heart rate sensors.

[0128] Output module 16 may be a non-image output module, which can receive information other than images transmitted from processor 12 and provide such information to the user. Examples of non-image output modules 16 include audio modules, haptic modules, light-emitting modules, etc., and may include other functional modules inherent to electronic device 10 (e.g., cooling modules of refrigerators, etc.).

[0129] The communication module 17 is responsible for sending and receiving information between the electronic device 10 and external devices, and may include a receiving unit and a transmitting unit. The communication module 17 may include various wireless communication modules such as mobile communication modules, Wi-Fi modules, and Bluetooth modules, or various wired communication modules.

[0130] At least one of the structures of the aforementioned electronic device 10 may be included within the display device. Furthermore, a portion of an individual module functionally included within a single module may be included within the display device, while another portion may be provided independently of the display device. For example, the display device may include a display panel 11, and the processor 12, memory 13, and power module 14 may be provided as other devices within the electronic device 10, without being included in the display device. As another example, the power module 14 may also be located within the display device and supply power to the processor 12 and memory 13 provided within the electronic device 10 but not included in the display device; the invention is not limited to the above examples.

[0131] Figures 12 to 14 These are schematic diagrams of electronic devices according to various embodiments. Figures 12 to 14 The illustrations show examples of various electronic devices involved in the application embodiments of the display device.

[0132] exist Figure 12 The illustration shows examples of electronic devices, including a smartphone 10_1a, a tablet PC 10_1b, a laptop computer 10_1c, a television 10_1d, and a desktop monitor 10_1e.

[0133] In addition to a display panel, the smartphone 10_1a may also include an input module (such as a touch sensor) and a communication module. The smartphone 10_1a can process information received through the communication module or other input modules and display the information through the display panel of the display device.

[0134] In the case of tablet PC 10_1b, laptop computer 10_1c, television 10_1d, and desktop monitor 10_1e, a display panel and input module may be included similarly to those in smartphone 10_1a, and a communication module may be further included as appropriate.

[0135] exist Figure 13 The illustration shows an electronic device, including a display panel, used in a wearable electronic device. Wearable electronic devices can include smart glasses 10_2a, head-mounted displays 10_2b, and smartwatches 10_2c, etc.

[0136] The smart glasses 10_2a and the head-mounted display 10_2b may include a display panel for projecting display images and a reflector for reflecting the projected display images to the user's eyes, thereby providing the user with virtual reality or augmented reality images.

[0137] The smartwatch 10_2c may include a biometric sensor as an input device and provide the user with biometric information identified by the biometric sensor via a display panel.

[0138] exist Figure 14 The illustration shows an example of an electronic device, including a display panel, being used in a vehicle. For example, electronic device 10_3 can be used in a car's dashboard or center console panel, or in a center information display (CID) located on the car's dashboard, or in an interior mirror display that replaces the rearview mirror.

[0139] Although not illustrated, the electronic devices used in the application embodiments can include not only devices primarily displaying images, such as billboards, illuminated panels, and game consoles, but also various home appliances that display information via a display panel, such as refrigerators, washing machines, dryers, air conditioners, and cleaning robots. Furthermore, when the display panel has a light-transmitting function, it can be applied to electronic devices such as smart windows or transparent display devices that simultaneously display backgrounds and images. The types of electronic devices in the embodiments are not limited to the examples described above, and various other electronic devices not illustrated can also be used.

[0140] Figure 15 This is a schematic plan view of an electronic device according to one embodiment. Figure 16 This is a cross-sectional view of a display panel according to one embodiment.

[0141] exist Figure 15 The illustration shows an embodiment of an electronic device 10 as a smartphone, but the invention is not necessarily limited thereto. The electronic device 10 may include a display panel 11 and a housing 19. In one embodiment, the display panel 11 may be housed within the housing 19. The housing 19 is not necessarily embodied in… Figure 15 The form shown is not limited in type or form as long as it provides space to accommodate the display panel 11, and can belong to the housing 19 referred to in this specification.

[0142] Reference Figure 15 and Figure 16 A display area DA and a peripheral area PA surrounding the display area DA may be defined on the substrate 91 of the display panel 11. A light-emitting element 98 may be arranged in the display area DA, and power wiring (not shown) may be arranged in the peripheral area PA.

[0143] Multiple deposited material patterns can be arranged in the display area DA. Figure 15 The diagram shows that the display panel 11 and the display area DA are generally quadrilateral, but the present invention is not necessarily limited to this. The display panel 11 and / or the display area DA can also be other shapes, such as irregular shapes.

[0144] The display panel 11 may include a substrate 91, a thin-film transistor (TFT) disposed on the substrate 91, and a light-emitting element 98 disposed on the TFT. The light-emitting element 98 may be electrically connected to the TFT.

[0145] The substrate 91 may include a plastic material or a metal material. In one embodiment, the substrate 91 may include polyimide (PI). Thin-film transistors (TFTs) may be disposed on the substrate 91, and a via layer 97 may be disposed over the TFTs, on which light-emitting elements 98 may be disposed.

[0146] A buffer layer 92 comprising an inorganic insulating material may be further disposed on the upper surface of the substrate 91. The buffer layer 92 may include silicon oxide (SiO2) or silicon nitride (SiN). x ) and / or silicon oxynitride (SiO) x N y ).

[0147] An active layer 93 may be arranged on the buffer layer 92 in a prescribed pattern, and the active layer 93 may be covered by the gate insulating layer 94. The active layer 93 may have a source region 93-1 and a drain region 93-3, and a channel region 93-2 may be provided between the source region 93-1 and the drain region 93-3.

[0148] The active layer 93 can be formed to include a variety of materials. In one embodiment, the active layer 93 may include an inorganic semiconductor material such as amorphous silicon or crystalline silicon. In one embodiment, the active layer 93 may contain an oxide semiconductor. In one embodiment, the active layer 93 may include an organic semiconductor material.

[0149] The active layer 93 can be formed by forming an amorphous silicon film on the buffer layer 92, crystallizing the amorphous silicon film to form a polycrystalline silicon film, and then patterning the polycrystalline silicon film. The source region 93-1 and the drain region 93-3 of the active layer 93 may be doped with impurities.

[0150] A gate electrode 95 corresponding to the active layer 93 and an interlayer insulating layer 96 covering the gate electrode 95 may be arranged on the upper surface of the gate insulating layer 94. After forming a contact hole H1 in the interlayer insulating layer 96 and the gate insulating layer 94, a source electrode 97-1 and a drain electrode 97-2 may be arranged on the interlayer insulating layer 96 in such a way that they contact the source region 93-1 and the drain region 93-3, respectively.

[0151] A via layer 97 may be disposed on the thin-film transistor (TFT), and a pixel electrode 98-1 of a light-emitting element 98 may be disposed on the via layer 97. The pixel electrode 98-1 may contact the drain electrode 97-2 of the TFT through a via H2 formed in the via layer 97. The via layer 97 may be formed as a single layer or two or more layers from inorganic and / or organic materials, and may be formed as a planarization film so that the upper surface is flat regardless of the curvature of the lower film, or may be formed by bending along the curvature of the lower film.

[0152] After the pixel electrode 98-1 is arranged on the via layer 97, a pixel limiting film 99 can be formed in such a way that it covers the pixel electrode 98-1 and the via layer 97. The pixel limiting film 99 can be opened in such a way that a portion of the pixel electrode 98-1 is exposed.

[0153] An intermediate layer 98-2 and a counter electrode 98-3 may be disposed on the pixel electrode 98-1. The counter electrode 98-3 may be disposed on the intermediate layer 98-2 and the pixel defining film 99. In one embodiment, the counter electrode 98-3 may be disposed on the entire surface of the substrate 91.

[0154] The intermediate layer 98-2 may include a light-emitting layer. In one embodiment, the intermediate layer 98-2 may include a light-emitting layer, and may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. The invention is not limited thereto; the intermediate layer 98-2 may include a light-emitting layer and may further include various other functional layers (not shown).

[0155] Pixel electrode 98-1 and counter electrode 98-3 can be insulated from each other through intermediate layer 98-2. By applying voltages of different polarities to intermediate layer 98-2 through pixel electrode 98-1 and counter electrode 98-3, light emission can be achieved in the light-emitting layer included in intermediate layer 98-2.

[0156] It can have multiple intermediate layers 98-2, and the multiple intermediate layers 98-2 can form a display area DA. At this time, the multiple intermediate layers 98-2 can be arranged inside the display area DA with each other separated.

[0157] The thin-film encapsulation layer TFE may include multiple inorganic layers, or may include inorganic and organic layers. The organic layer of the thin-film encapsulation layer TFE may be formed from a polymer, preferably a single film or laminated film including any one of polyethylene terephthalate, polyimide, polycarbonate, epoxy, polyethylene, and polyacrylate. The inorganic layer of the thin-film encapsulation layer TFE may be a single film or laminated film including metal oxides or metal nitrides. For example, the inorganic layer may include silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiO) x N y It can be any one of aluminum oxide (Al2O3) and titanium oxide (TiO2). The uppermost layer of the thin-film encapsulation layer TFE exposed to the outside can be formed as an inorganic layer to prevent moisture from penetrating the light-emitting element.

[0158] The thin-film encapsulation layer TFE may include at least one sandwich structure in which at least one organic layer is inserted between at least two inorganic layers. As another example, the thin-film encapsulation layer TFE may include at least one sandwich structure in which at least one inorganic layer is inserted between at least two organic layers. As yet another example, the thin-film encapsulation layer TFE may also include a sandwich structure in which at least one organic layer is inserted between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is inserted between at least two organic layers.

[0159] At least one of the films or layers that are structural elements of the electronic device 10 or the display panel 11 described above can be disposed on the substrate 91 using the thin film coating apparatus 2 described above.

[0160] The invention has been described above with reference to an embodiment illustrated in the accompanying drawings, but this is merely illustrative. Those skilled in the art will understand that various modifications and variations of the embodiment are possible. Therefore, the true scope of protection of the invention should be determined based on the technical concept of the claims.

Claims

1. A thin film coating apparatus, comprising: A workbench is used to support the object being processed. and An electrode pattern section is arranged above the worktable opposite to the workpiece and includes a first electrode pattern to which a first voltage is applied and a second electrode pattern to which a second voltage different from the first voltage is applied. The electrode pattern section is configured to rotate about a first axis.

2. The thin film coating apparatus according to claim 1, wherein, The worktable is configured to rotate about the first axis.

3. The thin film coating apparatus according to claim 1, further comprising: A first moving part is used to move the electrode pattern part along the first axis; and The second moving part is used to move the electrode pattern part along a second axis that is different from the first axis.

4. The thin film coating apparatus according to claim 1, further comprising: The first transmission component is connected to the first electrode pattern via a first cable; and The second transmission component is connected to the second electrode pattern via a second cable.

5. The thin film coating apparatus according to claim 4, further comprising: The control unit is used to generate the first voltage and the second voltage; The third transmission component is connected to the control unit and is used to transmit the first voltage to the first transmission component; and The fourth transmission component is connected to the control unit and is used to transmit the second voltage to the second transmission component.

6. The thin film coating apparatus according to claim 4, wherein, On a plane perpendicular to the first axis, the position where the first cable connects to the first electrode pattern coincides with the center of the electrode pattern portion.

7. The thin film coating apparatus according to claim 4, wherein, The first electrode pattern includes a plurality of electrodes spaced apart from each other, and the first cable is connected to the plurality of electrodes at a plurality of connection points.

8. The thin film coating apparatus according to claim 1, wherein, The first electrode pattern includes a first electrode pattern and a first electrode pattern, the first electrode pattern extending along a first edge of the electrode pattern portion, and the first electrode pattern extending from the first electrode pattern toward a second edge on the side opposite to the first edge.

9. The thin film coating apparatus according to claim 1, wherein, On a plane perpendicular to the first axis, the first electrode pattern has a frame shape surrounding the second electrode pattern.

10. The thin film coating apparatus according to claim 1, wherein, The electrode pattern portion includes an insulating portion, in which the first electrode pattern and the second electrode pattern are embedded.

11. The thin film coating apparatus according to claim 10, wherein, The insulating portion includes: a first insulating layer disposed above the first electrode pattern and the second electrode pattern; a second insulating layer disposed below the first electrode pattern and the second electrode pattern; and a third insulating layer filling the space between the first electrode pattern and the second electrode pattern.

12. The thin film coating apparatus according to claim 1, wherein, The electrode pattern portion further includes a third electrode pattern, which is subjected to a third voltage different from the first voltage and the second voltage.

13. A method for manufacturing an electronic device, comprising the following steps: A thin film coating apparatus is provided, the thin film coating apparatus comprising: a worktable for supporting a workpiece; and an electrode patterning section disposed above the worktable opposite to the workpiece, and including a first electrode pattern to which a first voltage is applied and a second electrode pattern to which a second voltage different from the first voltage is applied, the electrode patterning section being configured to rotate about a first axis; The workpiece is provided on the worktable, the workpiece comprising a processing substrate and a pharmaceutical solution disposed on the processing substrate; and The liquid medicine is applied in the form of a thin film to a predetermined area on the processing substrate by driving the electrode pattern section.

14. The method of manufacturing an electronic device according to claim 13, wherein, In the step of coating the thin film, the first voltage is applied to the first electrode pattern, and the second voltage is applied to the second electrode pattern while the electrode pattern portion is rotated about the first axis.

15. The method of manufacturing an electronic device according to claim 13, wherein, The worktable is configured to rotate about the first axis. In the step of coating the thin film, the first voltage is applied to the first electrode pattern and the second voltage is applied to the second electrode pattern, while the liquid medicine and the processing substrate provided on the worktable rotate together with the worktable about the first axis.

16. The method of manufacturing an electronic device according to claim 13, further comprising the step of bringing the electrode pattern portion close to the liquid medicine.

17. The method of manufacturing an electronic device according to claim 13, further comprising the steps of generating the first voltage and the second voltage and respectively transferring them to the first electrode pattern and the second electrode pattern.

18. The method of manufacturing an electronic device according to claim 13, further comprising the step of heating the liquid medicine on the processing substrate.

19. The method of manufacturing an electronic device according to claim 13, wherein, The electrode pattern portion includes an insulating portion, in which the first electrode pattern and the second electrode pattern are embedded.

20. The method of manufacturing an electronic device according to claim 13, wherein, The electrode pattern portion further includes a third electrode pattern, which is subjected to a third voltage different from the first voltage and the second voltage.

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