A cleaning device applied to semiconductor equipment component production

Abstract

The application discloses a cleaning device applied to semiconductor equipment component production, a guide ring is suspendedly arranged on the top of the base through a support, a guide groove is formed in the inner wall of the guide ring, four annular array distributed turnover structures are arranged on the rotary seat, the lower end of each turnover structure is arranged in the inner ring of the guide ring and is in rolling contact with the guide groove, an oscillation structure is arranged above each turnover structure, a clamping structure is arranged on the oscillation structure, a plurality of linear workpieces are arranged on the clamping structure, a dissolving tank, a cleaning tank and a air drying box are fixed to the left side, the rear side and the right side of the top of the base respectively, the workpiece is clamped once, and the whole process is automatically circulated, and the whole process from feeding, dissolving, ultrasonic cleaning to air drying does not need secondary clamping, repeated hoisting or manual transfer, and the risk of scratching, bumping and deformation of the surface of the precision workpiece in the process of multiple taking, placing, aligning and hoisting is fundamentally avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing, and more particularly to a cleaning apparatus for use in the production of semiconductor equipment components. Background Technology

[0002] In the industrial production process of semiconductor equipment components, especially ring-shaped workpieces, wafer clamping rings, and shielding rings, after machining, coating, photolithography, and assembly processes, surface contaminants such as oil, metal debris, oxide layers, photoresist residue, dust, and fine particulate matter inevitably remain. If these contaminants are not effectively removed, they will not only reduce the dimensional accuracy and surface quality of the components, but also cause problems such as equipment wear, poor contact, and vacuum leakage during subsequent assembly and use, directly affecting the operational stability, service life, and production yield of semiconductor equipment. Therefore, multi-stage, high-cleanliness cleaning is an essential and critical step.

[0003] Currently, the industry's cleaning methods for such components still mainly rely on traditional segmented operations. This typically involves manual handling or using a lifting platform to move the workpiece sequentially into a dissolving solution tank, an ultrasonic cleaning tank, and finally a drying area. In actual production, workpieces require multiple clamping, lifting, translation, and repositioning operations. Frequent handling and hoisting operations easily cause scratches, impacts, and deformations on precision surfaces, while also increasing the risk of external particle contamination. Furthermore, since workpieces are often immersed vertically, uneven liquid flow can occur in areas with tiny holes on ring-shaped workpieces. Air bubbles can easily remain in blind holes, crevices, and inner arcs, creating significant cleaning dead zones and making it difficult to achieve comprehensive and uniform cleaning. Summary of the Invention

[0004] The present invention provides a cleaning device for the production of semiconductor equipment components, which solves the above-mentioned problems.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A cleaning device for semiconductor equipment component production includes a base. A circular track is fixed above the base via a bracket. A rotating seat is rotatably mounted above the circular track via a slider. The rotating seat is connected to a reducer via a rotating shaft. The reducer, via an encoder, causes the rotating seat to rotate intermittently, stopping for a period of time every 90 degrees of rotation. A guide ring is suspended above the base via a bracket. The guide ring has a guide groove on its inner wall and is positioned directly below the rotating seat. The center of the guide ring is collinear with the centers of the rotating seat and the circular track. Four rotating structures arranged in a circular array are mounted on the rotating seat. The lower end of each rotating structure passes through the rotating seat, is within the inner ring of the guide ring, and rolls in contact with the guide groove. The area above the base can be divided into a feeding section. The system has four stations: dissolving, cleaning, and drying. In the initial state, four flipping structures are located above these four areas. Each flipping structure is equipped with an oscillating structure, and a clamping structure is installed on the oscillating structure. Multiple linearly arranged workpieces are installed on the clamping structure. A dissolving tank, a cleaning tank, and a drying box are fixed on the left, rear, and right sides above the base, respectively. The dissolving tank and the cleaning tank are both arc-shaped structures, and their centers are collinear with the center of the rotating base. The dissolving tank is filled with chemical solution to remove specific films or contaminants. The cleaning tank is filled with deionized water and equipped with an ultrasonic generator to ultrasonically clean the workpiece surface to remove particulate matter. The drying box can quickly dry the cleaned workpieces.

[0006] Preferably, the guide channel includes a decomposition channel and a cleaning channel, the positions of the decomposition channel and the cleaning channel correspond to the dissolution pool and the cleaning pool, respectively, and one end of the cleaning channel and the decomposition channel are connected by a connecting channel, and the other end is connected by an arc-shaped channel.

[0007] Preferably, the decomposition tank structure is the same as the cleaning tank structure. The decomposition tank includes an arc-shaped holding tank. Both ends of the holding tank are provided with downwardly inclined flipping tanks and reset tanks. The holding tank is located above the arc-shaped tank and the connecting tank. The arc-shaped tank and the connecting tank are at the same height. The reset groove in the decomposition tank is connected to the flip groove in the cleaning tank through a connecting groove. The flip groove in the decomposition tank is connected to the arc-shaped groove, and the reset groove in the cleaning tank is connected to the arc-shaped groove.

[0008] Preferably, the rotating seat has a through-hole formed vertically, and a vertical track is fixed below the rotating seat. The flipping structure includes two fixed frames fixed above the rotating seat, which are symmetrically distributed about the through-hole. A flipping shaft is rotatably mounted between the two fixed frames via a bearing. A flipping frame is fixed on the flipping shaft. The flipping frame has a U-shaped structure. Two flipping gears are mounted on the flipping shaft. The two flipping gears mesh with two flipping racks respectively. The two flipping racks are slidably mounted in the through-hole via the vertical track and a slider. When the flipping racks move upward to the top, the flipping frame can be flipped outward by 90 degrees, so that the oscillation structure and clamping structure can be easily arranged vertically downward from a horizontal distribution. A lifting wheel is rotatably mounted between the bottom ends of the two flipping racks via a pivot pin. The lifting wheel is rolled in a guide groove.

[0009] In the initial state, when the flipping structure is in the front, that is, when the flipping structure is located at the loading station, the lifting wheel in the flipping structure is in the arc groove, the flipping frame in the flipping structure is vertically upward, and the oscillation structure and the clamping structure are distributed parallel to the upper surface of the rotating seat. At this time, we can fix the workpiece to be cleaned on the oscillation structure through the clamping structure, with the workpiece vertically downward. The rotating seat drives the flipping structure to rotate 90 degrees clockwise. The flipping structure moves from the loading station to the dissolving station. During this process, the lifting wheel will move upward through the flipping groove into the holding groove. At this time, the lifting wheel and the flipping rack move upward along the vertical track. The upward-moving flipping rack will drive the flipping gear to rotate, thereby causing the flipping frame to rotate downward 90 degrees. The oscillation structure and clamping structure will be vertically downward as a whole. The workpiece will be immersed in the dissolving pool to dissolve the stains, and the workpiece will be in a horizontal state in the dissolving pool. Afterwards, the lifting wheel will move downward along the reset groove through the holding groove. At this time, the lifting wheel and the flip rack move downward along the vertical track. The downward-moving flip rack will drive the flip gear to rotate in the opposite direction, so that the flip frame rotates upward by ninety degrees. The oscillation structure and the clamping structure will be horizontal as a whole. At this time, the workpiece is still directly above the melting pool. As the rotation continues, the flipping structure will move from the dissolving station to the cleaning station. During this process, the lifting wheel moves towards the flipping groove in the cleaning tank through the connecting groove. The flipping structure flips down 90 degrees again, immersing the workpiece in the cleaning tank for cleaning. Then, the flipping structure causes the oscillating structure and clamping structure to move in the opposite direction and be in a horizontal state. The workpiece is removed from the cleaning tank and is in a vertical state, which can quickly drain the water stains attached to the surface. At this time, the lifting wheel is in the arc-shaped groove.

[0010] Preferably, a side plate is fixed on the flipping frame, and the oscillation structure includes two vibrating rods slidably inserted into the side plate. A mounting frame is fixed to one end of the two vibrating rods away from the flipping frame. The mounting frame has an L-shaped structure. A downward compression spring is sleeved on the vibrating rod. The two ends of the downward compression spring abut against the side plate and the mounting frame, respectively. The downward compression spring causes the mounting frame to always tend to move away from the flipping frame. A mounting block is welded on the mounting frame, and a mounting hole is opened on the mounting block for mounting the clamping structure.

[0011] Preferably, an oscillating block is fixed on the side of the mounting frame away from the flipping frame, and an oscillating inclined surface is provided on the oscillating block; Multiple lifting blocks arranged in a circular array are welded to the upper part of the inner wall of the dissolving tank. Both ends of the lifting blocks are designed with inclined surfaces, which are lifting inclined surfaces. The slope of the lifting inclined surface is the same as the slope of the oscillating inclined surface. The cleaning tank is provided with lifting blocks that are consistent with those above the dissolving tank. When the flipping structure rotates 90 degrees downwards so that the oscillating structure is vertically downwards, the oscillating block also faces downwards, and the oscillating inclined surface of the oscillating block faces the lifting inclined surface. When the rotating seat drives the flipping structure and the oscillating structure to move, the oscillating block will oscillate and move up and down through the oscillating inclined surface and the lifting inclined surface, thereby causing the oscillating structure, the clamping structure and the workpiece to move up and down. When moving up and down, relative motion is generated between the workpiece and the solution, forming a certain liquid flushing force, which can effectively remove the small particles that have been loosened but have not yet detached from the surface, especially in areas where the liquid flow is slow, such as the inner wall and holes of the workpiece. Meanwhile, because the workpiece has small blind holes, air bubbles are likely to remain in the depressions or corners when immersed. The liquid flow impact and pressure changes generated by the up-and-down movement can squeeze out the air bubbles, preventing them from blocking the liquid contact surface and preventing localized incomplete cleaning or watermark defects. For the cleaning tank, moving the workpiece up and down allows it to continuously pass through areas with different ultrasonic intensities, averaging the ultrasonic energy and preventing over-cleaning and surface damage in some areas while under-cleaning in others.

[0012] Preferably, the clamping structure includes a fixing rod that is bolted to a mounting hole above the mounting block, and multiple clamping discs are mounted on the fixing rod by screws. The workpiece is sleeved on the fixing rod and is positioned between two adjacent clamping discs.

[0013] Preferably, the outer diameter of the chuck is larger than the inner diameter of the workpiece, and the inner ring of the chuck is integrally formed with multiple ring-shaped array of limiting posts, the limiting posts are in contact with the inner ring surface of the workpiece, and the height of the limiting posts is greater than the thickness of the workpiece. Because the height of the limiting post is greater than the thickness of the workpiece, there is a certain distance between the upper surface of the workpiece and the upper clamping plate. The workpiece can move up and down. When the clamping structure moves up and down under the action of the oscillation structure, the workpiece will be pushed up and fall by the liquid when it moves downward inside the liquid. The lower surface of the workpiece will briefly detach from the upper surface of the clamping plate and come into contact with the liquid. This allows the workpiece to come into contact with the liquid in all directions for dissolution and cleaning without leaving any dead corners, thus improving the cleaning effect.

[0014] The beneficial effects of this invention are: 1. By using rotary indexing in conjunction with mechanical guide grooves, multi-station automatic flow and posture flipping can be achieved, enabling workpieces to be clamped once and flow automatically throughout the entire process. From loading, dissolving, ultrasonic cleaning to air drying, the entire process does not require secondary clamping, repeated hoisting or manual transfer. This fundamentally avoids the risk of scratches, bumps and deformations on the surface of precision workpieces caused by multiple pick-up, placement, alignment and hoisting processes, greatly reduces the probability of particulate contamination, and significantly improves the cleaning yield and product reliability of semiconductor precision components.

[0015] 2. By controlling the workpiece to automatically flip and immerse itself in the liquid through a fixed guide groove, the workpiece flips downward to immerse itself in the liquid when it enters the cleaning station, and flips upward to reset itself when it leaves the station. This allows the liquid adhering to the surface of the workpiece to flow back into the corresponding tank, greatly reducing the situation where the workpiece carries liquid into the next process, effectively avoiding cross-contamination between tanks, maintaining the purity of the dissolved medicine and deionized water, reducing consumable consumption, and improving cleaning stability.

[0016] 3. An elastic oscillation structure is set up in the dissolution and ultrasonic cleaning station, so that the workpiece moves up and down in reciprocating motion with the inclined plane during rotation, which enhances the liquid flushing and disturbance effect. It can effectively remove air bubbles that are easy to get stuck in blind holes, corners, inner side walls and other places of the workpiece, eliminate cleaning dead corners, and at the same time make the workpiece pass through the ultrasonic area evenly, balance the ultrasonic energy, avoid the problem of excessive cleaning and damage to the surface in some places or incomplete cleaning in some places, and significantly improve the uniformity and cleanliness of cleaning. Attached Figure Description

[0017] Figure 1 This is a front view of a cleaning apparatus for the production of semiconductor equipment components proposed in this invention; Figure 2 for Figure 1 A schematic diagram of the rotating base, the flipping structure, the oscillation structure, and the clamping structure. Figure 3 for Figure 2 Schematic diagram of the inverted structure, oscillation structure, clamping structure, and guide ring; Figure 4 for Figure 2 A bottom view; Figure 5for Figure 4 The unfolded diagram of the guide ring; Figure 6 for Figure 3 Schematic diagrams of the inverted structure and the oscillating structure; Figure 7 for Figure 1 Enlarged view of point A in the middle; Figure 8 for Figure 6 Exploded views of the inverted structure and the oscillating structure; Figure 9 for Figure 7 Exploded view of the clamping structure.

[0018] Numbering on the map: 1. Base; 2. Rotating seat; 21. Circular track; 22. Vertical track; 3. Guide ring; 31. Guide groove; 32. Disassembly groove; 321. Tilting groove; 322. Holding groove; 323. Reset groove; 33. Connecting groove; 34. Cleaning groove; 35. Arc-shaped groove; 4. Tilting structure; 41. Fixing frame; 42. Tilting shaft; 43. Tilting frame; 431. Side plate; 44. Tilting gear; 45. Tilting rack; 46. Lifting wheel; 5. Oscillating structure; 51. Mounting bracket; 52. Mounting block; 53. Oscillating block; 531. Oscillating inclined plane; 54. Lower compression spring; 55. Vibration rod; 6. Clamping structure; 61. Fixing rod; 62. Clamping plate; 63. Workpiece; 7. Dissolving tank; 71. Lifting block; 711. Lifting ramp; 8. Cleaning pool; 9. Drying box. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] Reference Figure 1 - Figure 9A cleaning device for semiconductor equipment component production includes a base 1. A ring track 21 is fixed above the base 1 via a bracket. A rotating seat 2 is rotatably mounted above the ring track 21 via a slider. The rotating seat 2 is connected to a reducer via a rotating shaft. The reducer, via an encoder, causes the rotating seat 2 to rotate intermittently, stopping for a period of time every 90 degrees of rotation. A guide ring 3 is suspended above the base 1 via a bracket. The inner wall of the guide ring 3 has a guide groove 31. The guide ring 3 is located directly below the rotating seat 2, and its center is collinear with the centers of the rotating seat 2 and the ring track 21. Four rotating structures 4 arranged in a ring array are mounted on the rotating seat 2. The lower end of each rotating structure 4 passes through the rotating seat 2, is within the inner ring of the guide ring 3, and rolls in contact with the guide groove 31. The area above the base 1 can be divided into... The system has four stations: feeding, dissolving, cleaning, and drying. In the initial state, four flipping structures 4 are located above these four areas. Each flipping structure 4 is equipped with an oscillating structure 5, and a clamping structure 6 is installed on the oscillating structure 5. Multiple linearly arranged workpieces 63 are installed on the clamping structure 6. A dissolving tank 7, a cleaning tank 8, and a drying box 9 are fixed on the left, rear, and right sides above the base 1, respectively. Both the dissolving tank 7 and the cleaning tank 8 are arc-shaped structures, and their centers are collinear with the center of the rotating seat 2. The dissolving tank 7 is filled with chemical solution to remove specific membranes or contaminants. The cleaning tank 8 is filled with deionized water and equipped with an ultrasonic generator to ultrasonically clean the surface of the workpieces 63 to remove particulate matter. The drying box 9 can quickly dry the cleaned workpieces 63.

[0021] Reference Figure 3 - Figure 5 The guide channel 31 includes a decomposition channel 32 and a cleaning channel 34. The positions of the decomposition channel 32 and the cleaning channel 34 correspond to the dissolution pool 7 and the cleaning pool 8, respectively. One end of the cleaning channel 34 and the decomposition channel 32 are connected by a connecting channel 33, and the other end is connected by an arc-shaped channel 35.

[0022] Reference Figure 5 The structure of the decomposition tank 32 is the same as that of the cleaning tank 34. The decomposition tank 32 includes an arc-shaped holding tank 322. Both ends of the holding tank 322 are provided with a downwardly inclined flipping tank 321 and a reset tank 323. The holding tank 322 is located above the arc-shaped tank 35 and the connecting tank 33. The arc-shaped tank 35 and the connecting tank 33 are at the same height. The reset groove 323 in the decomposition tank 32 and the flip groove 321 in the cleaning tank 34 are connected by the connecting groove 33. The flip groove 321 in the decomposition tank 32 is connected to the arc groove 35, and the reset groove 323 in the cleaning tank 34 is connected to the arc groove 35.

[0023] Reference Figure 3 - Figure 8The rotating seat 2 has a through-hole extending vertically. A vertical track 22 is fixed below the rotating seat 2. The flipping structure 4 includes two fixed frames 41 fixed above the rotating seat 2. The two fixed frames 41 are symmetrically distributed about the through-hole. A flipping shaft 42 is rotatably mounted between the two fixed frames 41 via a bearing. A flipping frame 43 is fixed on the flipping shaft 42. The flipping frame 43 has a U-shaped structure. Two flipping gears 44 are mounted on the flipping shaft 42. The two flipping gears 44 mesh with two flipping racks 45 respectively. The two flipping racks 45 are slidably mounted in the through-hole via the vertical track 22 and the slider. When the flipping racks 45 move upward to the top, they can cause the flipping frame 43 to flip outward by 90 degrees, thereby making the oscillation structure 5 and the clamping structure 6 easier to vertically downward from a horizontal distribution. A lifting wheel 46 is rotatably mounted between the bottom ends of the two flipping racks 45 via a shaft pin. The lifting wheel 46 is rolled in the guide groove 31.

[0024] Reference Figure 3 , Figure 5 In the initial state, when the flipping structure 4 is in the front, that is, when the flipping structure 4 is located at the loading station, the lifting wheel 46 in the flipping structure 4 is in the arc groove 35, the flipping frame 43 in the flipping structure 4 is vertically upward, and the oscillation structure 5 and the clamping structure 6 are both distributed parallel to the upper surface of the rotating seat 2. At this time, we can fix the workpiece 63 to be cleaned on the oscillation structure 5 through the clamping structure 6, and the workpiece 63 is vertically downward. The rotating seat 2 drives the flipping structure 4 to rotate 90 degrees clockwise. The flipping structure 4 moves from the loading station to the dissolving station. During this process, the lifting wheel 46 will move upward through the flipping groove 321 into the holding groove 322. At this time, the lifting wheel 46 and the flipping rack 45 move upward along the vertical track 22. The upward-moving flipping rack 45 will drive the flipping gear 44 to rotate, thereby causing the flipping frame 43 to rotate downward 90 degrees. The oscillation structure 5 and the clamping structure 6 will be vertically downward as a whole. The workpiece 63 will be immersed in the dissolving pool 7 to dissolve the stains, and the workpiece 63 will be in a horizontal state in the dissolving pool 7. Afterwards, the lifting wheel 46 will move downward along the reset groove 323 through the holding groove 322. At this time, the lifting wheel 46 and the flip rack 45 move downward along the vertical track 22. The downward-moving flip rack 45 will drive the flip gear 44 to rotate in the opposite direction, so that the flip frame 43 rotates upward by ninety degrees. The oscillation structure 5 and the clamping structure 6 will be horizontal as a whole. At this time, the workpiece 63 is still directly above the melting pool 7. As the rotation continues, the flipping structure 4 will move from the dissolving station to the cleaning station. During this process, the lifting wheel 46 moves towards the flipping groove 321 in the cleaning tank 34 through the connecting groove 33. The flipping structure 4 flips down 90 degrees again, allowing the workpiece 63 to be immersed in the cleaning tank 8 for cleaning. Then, the flipping structure 4 causes the oscillating structure 5 and the clamping structure 6 to move in the opposite direction and be in a horizontal state. The workpiece 63 is removed from the cleaning tank 8 and is in a vertical state, which can quickly drain the water stains attached to the surface. At this time, the lifting wheel 46 is in the arc groove 35. Then the rotating seat 2 rotates 90 degrees again, and the flipping structure 4 moves from the cleaning station to the drying station. During this process, the lifting wheel 46 moves along the arc groove 35, the clamping structure 6 is horizontally in the drying box 9, and the workpiece 63 is also vertically in the drying box 9, which facilitates the rapid drying of the workpiece 63 and allows the liquid to flow down quickly, thus improving the drying efficiency. Rotating seat 2 rotates 90 degrees again, and flipping structure 4 moves from the drying station to the loading station, where unloading and loading can be carried out. By repeating the above operations, the workpiece 63 can be continuously cleaned.

[0025] Reference Figure 6 - Figure 8 A side plate 431 is fixed on the flipping frame 43. The oscillation structure 5 includes two vibrating rods 55 that are slidably inserted into the side plate 431. A mounting frame 51 is fixed to one end of the two vibrating rods 55 away from the flipping frame 43. The mounting frame 51 has an L-shaped structure. A lower compression spring 54 is sleeved on the vibrating rod 55. The two ends of the lower compression spring 54 abut against the side plate 431 and the mounting frame 51 respectively. The lower compression spring 54 makes the mounting frame 51 always tend to move away from the flipping frame 43. A mounting block 52 is welded on the mounting frame 51. The mounting block 52 has a mounting hole for mounting the clamping structure 6.

[0026] Reference Figure 6 , Figure 7 An oscillating block 53 is fixed on the side of the mounting frame 51 away from the flipping frame 43, and an oscillating inclined surface 531 is provided on the oscillating block 53; Multiple lifting blocks 71 arranged in a circular array are welded on the upper part of the inner wall of the dissolving tank 7. Both ends of the lifting blocks 71 are designed with inclined surfaces, which are called lifting inclined surfaces 711. The slope of the lifting inclined surface 711 is the same as the slope of the oscillating inclined surface 531. The cleaning tank 8 is equipped with lifting blocks 71 that are the same as those above the dissolving tank 7. When the flipping structure 4 rotates 90 degrees downwards so that the oscillating structure 5 is vertically downwards, the oscillating block 53 is also downwards, and the oscillating inclined surface 531 of the oscillating block 53 faces the lifting inclined surface 711. When the rotating seat 2 drives the flipping structure 4 and the oscillating structure 5 to move, the oscillating block 53 will oscillate and move up and down through the oscillating inclined surface 531 and the lifting inclined surface 711, thereby causing the oscillating structure 5, the clamping structure 6 and the workpiece 63 to move up and down. When moving up and down, the workpiece 63 and the solution generate relative motion, forming a certain liquid flushing force, which can effectively remove the small particles that have been loosened but have not yet detached from the surface, especially in areas where the liquid flow is slow, such as the inner wall and holes of the workpiece 63. Meanwhile, since the workpiece 63 has small blind holes, air bubbles are likely to remain in the recesses or corners when immersed. The liquid flow impact and pressure changes generated by the up-and-down movement can squeeze out the air bubbles, preventing them from blocking the liquid contact surface and preventing local incomplete cleaning or watermark defects. For the cleaning tank 8, moving the workpiece 63 up and down allows it to continuously pass through areas with different ultrasonic intensities, averaging the ultrasonic energy and preventing over-cleaning and surface damage in some areas while under-cleaning in others.

[0027] Reference Figure 7 , Figure 9 The clamping structure 6 includes a fixing rod 61 that is fixed to the mounting hole above the mounting block 52 by bolts. Multiple clamping plates 62 are mounted on the fixing rod 61 by screws. The workpiece 63 is sleeved on the fixing rod 61 and is located between two adjacent clamping plates 62.

[0028] Reference Figure 9 The outer diameter of the chuck 62 is larger than the inner diameter of the workpiece 63, and the inner ring of the chuck 62 is integrally formed with multiple ring array of limiting posts. The limiting posts are in contact with the inner ring surface of the workpiece 63, and the height of the limiting posts is greater than the thickness of the workpiece 63. During installation, first, a clamping plate 62 is fixed to the top of the fixing rod 61 with screws. Then, the workpiece 63 is sleeved on the fixing rod 61. Next, another clamping plate 62 is sleeved on the fixing rod 61, with the limiting post of the clamping plate 62 abutting against the lower surface of the previous clamping plate 62, and the inner ring surface of the workpiece 63 is tangent to the limiting post. This process is repeated to install and fix multiple workpieces 63. When loading and unloading, the entire clamping structure 6 is replaced as a whole to improve loading and unloading efficiency. Because the height of the limiting post is greater than the thickness of the workpiece 63, there is a certain distance between the upper surface of the workpiece 63 and the upper clamping plate 62. The workpiece 63 can move up and down. When the clamping structure 6 moves up and down under the action of the oscillation structure 5, the workpiece 63 will be pushed up and fall by the liquid when it moves downward inside the liquid. The lower surface of the workpiece 63 will briefly detach from the upper surface of the clamping plate 62 and come into contact with the liquid. This allows the workpiece 63 to come into contact with the liquid in all directions for dissolution and cleaning without leaving any dead corners, thus improving the cleaning effect.

[0029] Working principle: In the initial state, the four sets of flipping structures 4 correspond to the feeding station, melting station, cleaning station and drying station respectively. One set of flipping structures 4 is located at the feeding station. The lifting wheel 46 in this flipping structure 4 is in the arc groove 35 of the guide groove 31. At this time, the flipping rack 45 is in a low position, and the flipping frame 43 of the flipping structure 4 is kept vertically upward, so that the oscillation structure 5 and the clamping structure 6 are in a horizontal state. Multiple workpieces 63 are pre-installed and fixed to the clamping plate 62 by the fixing rod 61 of the clamping structure 6. The limiting post on the clamping plate 62 limits the workpieces 63, so that the workpieces 63 remain stable and can float slightly. Then, the clamped workpieces 6 are fixed in the mounting hole of the mounting block 52 by bolts.

[0030] Start the reducer, so that the rotating seat 2 rotates 90 degrees clockwise, and the flipping structure 4 moves from the loading station to the dissolving station. During this process, the lifting wheel 46 at the bottom of the flipping structure 4 rolls upward along the flipping groove 321 of the guide groove 31, driving the flipping rack 45 to slide upward along the vertical track 22 on the rotating seat 2. The flipping rack 45 meshes with the flipping gear 44 on the flipping shaft 42, driving the flipping shaft 42 to drive the flipping frame 43 to flip downward 90 degrees, so that the oscillation structure 5, the clamping structure 6 and the workpiece 63 are vertically downward as a whole. The workpiece 63 is immersed in the chemical solution in the dissolving pool 7 to dissolve and remove surface contaminants. When the lifting wheel 46 enters the holding groove 322, the workpiece 63 remains immersed and completes the dissolution process. Then, the lifting wheel 46 rolls down along the reset groove 323, driving the flipping rack 45 to move down, causing the flipping frame 43 to flip up and reset, the clamping structure 6 returns to horizontal, and the workpiece 63 is removed from the liquid surface of the dissolution pool 7 and completes the initial draining.

[0031] The rotating seat 2 continues to rotate, and the flipping structure 4 moves from the dissolving station to the cleaning station. The lifting wheel 46 enters the flipping groove 321 of the cleaning tank 34 through the connecting groove 33, and drives the flipping structure 4 to flip down 90 degrees again, so that the workpiece 63 is immersed in the deionized water in the cleaning pool 8, and the ultrasonic generator is used to remove particulate impurities.

[0032] During the above process, as the workpiece 63 is immersed into the dissolving tank 7 and the cleaning tank 8, the oscillating block 53 of the oscillating structure 5 moves. The oscillating inclined surface 531 on the oscillating block 53 contacts and engages with the lifting inclined surface 711 on the lifting block 71 on the inner wall of the dissolving tank 7 and the cleaning tank 8. Under the driving force of the rotational movement, the mounting frame 51 drives the vibrating rod 55 to slide back and forth along the side plate 431 of the flipping frame 43. Under the elastic action of the lower compression spring 54, it realizes up and down oscillation, which drives the workpiece 63 to move up and down in the liquid, enhances the liquid flushing effect, removes residual bubbles and homogenizes the ultrasonic energy, avoids cleaning dead corners and local damage. After cleaning is completed, the lifting wheel 46 moves down along the reset groove 323 of the cleaning tank 34, the flipping structure 4 resets upward, and the workpiece 63 is removed from the cleaning tank 8 and drains quickly.

[0033] Rotating seat 2 rotates 90 degrees again, flipping structure 4 moves to the air drying station, lifting wheel 46 moves along arc groove 35, clamping structure 6 enters the air drying box 9 while keeping horizontal, workpiece 63 is in a vertical state, which facilitates the rapid flow of surface liquid. Air drying box 9 quickly dries workpiece 63, improving drying efficiency and drying effect.

[0034] Finally, the rotating seat 2 continues to rotate 90 degrees, and the flipping structure 4 returns to the loading station. At this time, the clamping structure 6, which has been cleaned and dried, can be removed as a whole and replaced with a new clamping structure 6 to be cleaned. The above process of rotation, flipping, dissolving, cleaning, and drying is repeated to achieve continuous and automated cleaning operation.

[0035] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A cleaning apparatus for use in the production of semiconductor equipment components, characterized in that, A cleaning device for semiconductor equipment component production includes a base (1), an annular track (21) fixed above the base (1) by a bracket, a rotating seat (2) mounted above the annular track (21) by a slider, a guide ring (3) suspended above the base (1) by a bracket, a guide groove (31) is provided on the inner wall of the guide ring (3), the guide ring (3) is located directly below the rotating seat (2), four rotating structures (4) arranged in annular array are mounted on the rotating seat (2), the lower end of the rotating structure (4) passes through the rotating seat (2) and is located in the inner circle of the guide ring (3) and rolls in contact with the guide groove (31), an oscillation structure (5) is mounted above each rotating structure (4), a clamping structure (6) is mounted on the oscillation structure (5), and multiple linearly separate workpieces (63) are mounted on the clamping structure (6), a dissolving tank (7), a cleaning tank (8) and a drying box (9) are fixed on the left, rear and right sides above the base (1) respectively.

2. The cleaning apparatus for semiconductor equipment component production according to claim 1, characterized in that, The guide groove (31) includes a decomposition groove (32) and a cleaning groove (34). The positions of the decomposition groove (32) and the cleaning groove (34) correspond to the dissolution pool (7) and the cleaning pool (8), respectively. One end of the cleaning groove (34) and the decomposition groove (32) are connected by a connecting groove (33), and the other end is connected by an arc groove (35).

3. The cleaning apparatus for semiconductor equipment component production according to claim 2, characterized in that, The structure of the decomposition tank (32) is the same as that of the cleaning tank (34). The decomposition tank (32) includes an arc-shaped holding tank (322). Both ends of the holding tank (322) are provided with downward-sloping flipping tank (321) and reset tank (323). The holding tank (322) is located above the arc-shaped tank (35) and the connecting tank (33). The arc-shaped tank (35) and the connecting tank (33) are at the same height. The reset groove (323) in the decomposition tank (32) and the flip groove (321) in the cleaning tank (34) are connected by a connecting groove (33). The flip groove (321) in the decomposition tank (32) is connected to the arc groove (35). The reset groove (323) in the cleaning tank (34) is connected to the arc groove (35).

4. A cleaning apparatus for semiconductor equipment component production according to claim 1, characterized in that, The rotating seat (2) has a through-hole formed vertically. A vertical track (22) is fixed below the rotating seat (2). The flipping structure (4) includes two fixed frames (41) fixed above the rotating seat (2). The two fixed frames (41) are symmetrically distributed about the through-hole. A flipping shaft (42) is rotatably installed between the two fixed frames (41) through a bearing. A flipping frame (43) is fixed on the flipping shaft (42). The flipping frame (43) has a U-shaped structure. Two flipping gears (44) are installed on the flipping shaft (42). The two flipping gears (44) mesh with two flipping racks (45) respectively. The two flipping racks (45) are slidably installed in the through-hole through the vertical track (22) and the slider. A lifting wheel (46) is rotatably installed between the bottom ends of the two flipping racks (45) through a shaft pin. The lifting wheel (46) is rolled in the guide groove (31).

5. A cleaning apparatus for semiconductor equipment component production according to claim 4, characterized in that, The flipping frame (43) is fixed with a side plate (431). The oscillation structure (5) includes two vibrating rods (55) that are slidably inserted into the side plate (431). The two vibrating rods (55) are fixed with a mounting bracket (51) at one end away from the flipping frame (43). The mounting bracket (51) is L-shaped. A lower compression spring (54) is sleeved on the vibrating rod (55). The two ends of the lower compression spring (54) abut against the side plate (431) and the mounting bracket (51) respectively. A mounting block (52) is welded on the mounting bracket (51). The mounting block (52) has a mounting hole.

6. A cleaning apparatus for semiconductor equipment component production according to claim 5, characterized in that, An oscillating block (53) is fixed on the side of the mounting frame (51) away from the flipping frame (43), and an oscillating inclined surface (531) is provided on the oscillating block (53). Multiple lifting blocks (71) arranged in a circular array are welded above the inner wall of the dissolving pool (7). Both ends of the lifting blocks (71) are designed with inclined surfaces, which are called lifting inclined surfaces (711). The slope of the lifting inclined surface (711) is the same as the slope of the oscillating inclined surface (531). The cleaning pool (8) is provided with lifting blocks (71) that are consistent with those above the dissolving pool (7).

7. A cleaning apparatus for semiconductor equipment component production according to claim 5, characterized in that, The clamping structure (6) includes a fixing rod (61) fixed in the mounting hole above the mounting block (52) by bolts. Multiple clamping plates (62) are mounted on the fixing rod (61) by screws. The workpiece (63) is sleeved on the fixing rod (61) and the workpiece (63) is located between two adjacent clamping plates (62).

8. A cleaning apparatus for semiconductor equipment component production according to claim 7, characterized in that, The outer diameter of the chuck (62) is larger than the inner diameter of the workpiece (63), and the inner ring of the chuck (62) is integrally formed with multiple ring array of limiting posts. The limiting posts are in contact with the inner ring surface of the workpiece (63), and the height of the limiting posts is greater than the thickness of the workpiece (63).

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