A dynamic seal for a semiconductor equipment vacuum chamber
By employing a dual-sealing structure that connects the fixed flange and the movable flange using a vacuum bellows in the vacuum chamber of semiconductor equipment, the problem of vacuum leakage caused by radial runout of the lifting shaft is solved, thereby improving the reliability and stability of dynamic sealing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANDONG LIGUAN MICROELECTRONICS EQUIP CO LTD
- Filing Date
- 2026-04-14
- Publication Date
- 2026-07-24
AI Technical Summary
In the prior art, radial runout of the lifting shaft causes the fixed sealing structure to fail, leading to dynamic leakage in the vacuum chamber.
A vacuum bellows is used to connect the fixed flange and the movable flange, and a double sealing structure is set up, including a first static seal consisting of a fixed flange, a first pressure ring and a first sealing ring, and a second follow-up seal consisting of a movable flange, a second pressure ring and a second sealing ring. The flexible deformation of the vacuum bellows drives the movable flange and the second sealing ring to follow, maintaining close contact with the lifting shaft.
It effectively blocks the vacuum leakage path caused by changes in shaft motion posture, improves the reliability and stability of vacuum seals, and especially in long-term operation, it can adaptively cope with complex dynamic working conditions, enhancing the sealing guarantee of the vacuum chamber.
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Figure CN122447490A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of semiconductor manufacturing technology, and particularly relates to a dynamic sealing device for a vacuum chamber of semiconductor equipment. Background Technology
[0002] As semiconductor manufacturing processes advance to smaller process nodes, increasingly stringent requirements are placed on the cleanliness and stability of the production environment. Maintaining a high vacuum in the process chamber is fundamental to ensuring high yields in critical steps such as thin film deposition and etching. In many semiconductor devices, a reciprocating lifting shaft is used to transport wafers into the vacuum chamber. This necessitates creating a through-hole at the bottom of the chamber for the lifting shaft while simultaneously addressing the challenge of maintaining vacuum at this dynamically sealed point to prevent external air intrusion and disruption of the vacuum environment.
[0003] To achieve vacuum sealing at moving parts, existing technologies typically involve installing a fixed sealing structure at the through-hole at the bottom of the vacuum chamber. A common practice is to create a sealing groove on a fixed flange at the bottom of the chamber and install a rubber or metal sealing ring within the groove. The sealing ring is then tightened with fasteners, causing its inner ring to tightly grip the lifting shaft. The elastic deformation of the sealing material fills the microscopic gaps, thereby preventing gas from passing through.
[0004] However, the aforementioned static sealing scheme based on a fixed flange and a compression seal ring has inherent limitations. During the long-stroke reciprocating motion of the lifting shaft, micron-level radial runout or eccentricity is unavoidable. When this radial runout occurs, because the seal ring is rigidly pressed into the fixed flange groove, its position cannot be adjusted accordingly, resulting in uneven contact pressure distribution between the inner ring of the seal ring and the moving shaft, and even momentary separation, leading to vacuum leakage.
[0005] Therefore, the present invention provides a dynamic sealing device for a vacuum chamber of a semiconductor device. Summary of the Invention
[0006] The present invention provides a dynamic sealing device for a vacuum chamber of a semiconductor device, which at least solves the problem in the prior art where the failure of the fixed sealing structure caused by radial misalignment of the lifting shaft leads to dynamic leakage of the vacuum chamber.
[0007] This application provides a dynamic sealing device for a vacuum chamber of a semiconductor device. The device includes a fixed flange, a vacuum bellows, a first pressure ring, a first sealing ring, a movable flange, a second pressure ring, and a second sealing ring. The fixed flange, vacuum bellows, first pressure ring, first sealing ring, movable flange, second pressure ring, and second sealing ring are all sleeved on the lifting shaft; The fixed flange is installed at the bottom of the vacuum chamber, and the first sealing ring is installed inside the fixed flange; The first pressure ring is installed at the bottom of the fixed flange; The top of the vacuum bellows is connected to the bottom of the first pressure ring, and the bottom of the vacuum bellows is connected to the movable flange. The second sealing ring is installed inside the movable flange; The second pressure ring is installed at the bottom of the movable flange.
[0008] Furthermore, the vacuum bellows is a metal bellows.
[0009] Furthermore, both the first sealing ring and the second sealing ring are X-shaped sealing rings.
[0010] Furthermore, the fixed flange is provided with a first sealing groove, and the first sealing ring is installed in the first sealing groove.
[0011] Furthermore, the movable flange is provided with a second sealing groove, and the second sealing ring is installed in the second sealing groove.
[0012] Furthermore, the vacuum bellows and the fixed flange are fixedly connected by welding.
[0013] Furthermore, the vacuum bellows is fixedly connected to the fixed flange by bolts.
[0014] Furthermore, the vacuum bellows and the movable flange are fixedly connected by welding.
[0015] Furthermore, the second pressure ring is connected to the movable flange by bolts.
[0016] Furthermore, when the lifting shaft wobbles radially, the vacuum bellows undergoes flexible deformation, causing the movable flange, the second pressure ring, and the second sealing ring to move accordingly, thereby maintaining close contact between the second sealing ring and the lifting shaft.
[0017] As can be seen from the above technical solutions, the present invention has the following advantages: The dynamic sealing device for the vacuum chamber of semiconductor equipment provided in this application constructs a flexible follow-up sealing system by using a vacuum bellows to connect the fixed flange and the movable flange, and setting a second seal. When the lifting shaft wobbles radially, the vacuum bellows can generate corresponding flexible deformation, causing the movable flange at its bottom, the second pressure ring, and the second sealing ring to move slightly with the shaft. This allows the second seal to adaptively track the instantaneous position change of the shaft, thereby maintaining uniform contact and stable compression between the second sealing ring and the surface of the lifting shaft throughout the entire dynamic process of shaft wobbling. This effectively blocks the vacuum leakage path caused by changes in the shaft's motion posture, significantly improving the reliability of the vacuum seal.
[0018] This application establishes a first seal consisting of a first pressure ring and a first sealing ring, and a second seal consisting of a movable flange, a second pressure ring, and a second sealing ring, forming a series of double sealing barriers. Even if one seal experiences a momentary decrease in sealing capacity due to extreme operating conditions, the other seal can still provide effective isolation. In particular, by placing the second seal on a movable component, it becomes the main seal for dynamic sealing, while the first seal can serve as a static seal or an auxiliary seal. The two work together to cope with complex dynamic operating conditions, greatly enhancing the sealing guarantee of the entire vacuum chamber during long-term operation. Attached Figure Description
[0019] To more clearly illustrate the technical solution of this application, the accompanying drawings used in the description will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a structural diagram of the dynamic sealing device for the vacuum chamber of a semiconductor device according to the present invention.
[0021] Reference numerals in the attached drawings: 1-Fixed flange; 2-Vacuum bellows; 3-First pressure ring; 4-First sealing ring; 5-Modible flange; 6-Second pressure ring; 7-Second sealing ring; 8-Vacuum chamber; 9-Lifting shaft. Detailed Implementation
[0022] To make the purpose, features, and advantages of this application more apparent and understandable, specific embodiments and accompanying drawings will be used to clearly and completely describe the technical solution protected by this application. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0023] Various embodiments of this disclosure will be described more fully in the following detailed description of dynamic sealing devices for vacuum chambers of semiconductor devices. This disclosure may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of this disclosure to the specific embodiments disclosed herein, but rather this disclosure should be understood to cover all adjustments, equivalents, and / or alternatives falling within the spirit and scope of the various embodiments of this disclosure.
[0024] In the following, the terms “comprising” or “may include”, which may be used in various embodiments of this disclosure, indicate the presence of the disclosed functions, operations, or elements, and do not limit the addition of one or more functions, operations, or elements. Furthermore, as used in various embodiments of this disclosure, the terms “comprising,” “having,” and their cognates are intended only to indicate a particular feature, number, step, operation, element, component, or combination of the foregoing, and should not be construed as primarily excluding the presence of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing, or the possibility of adding one or more combinations of the foregoing.
[0025] In various embodiments of this disclosure, the expression "or" or "at least one of A and / or B" includes any combination or all combinations of the words listed simultaneously. For example, the expression "A or B" or "at least one of A and / or B" may include A, may include B, or may include both A and B.
[0026] The terms used in the various embodiments of this disclosure (such as "first," "second," etc.) may modify various components in the various embodiments, but do not limit the corresponding components. For example, the above terms do not limit the order and / or importance of the components. The above terms are only used for the purpose of distinguishing one component from others. For example, a first user device and a second user device refer to different user devices, although both are user devices. For example, a first component may be referred to as a second component without departing from the scope of the various embodiments of this disclosure, and similarly, a second component may also be referred to as a first component.
[0027] It should be noted that if a description is made of "connecting" one component to another, then the first component can be directly connected to the second component, and a third component can be "connected" between the first and second components. Conversely, when a component is "directly connected" to another component, it can be understood that there is no third component between the first and second components.
[0028] The term "user" as used in various embodiments of this disclosure may refer to a person using an electronic device, and may be a monitoring person, a testing person, or an operator.
[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0030] This application provides a dynamic sealing device for a vacuum chamber of a semiconductor device, solving the current urgent technical problem of achieving a dynamic and reliable seal between the lifting shaft and the vacuum chamber in a vacuum environment.
[0031] The technical solutions proposed in the embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0032] Figure 1 This is a structural diagram of a dynamic sealing device for a vacuum chamber of a semiconductor device, provided as an embodiment of this application. Figure 1 As shown in the figure, an embodiment of this application provides a dynamic sealing device for a vacuum chamber of a semiconductor device. The device includes a fixed flange 1, a vacuum bellows 2, a first pressure ring 3, a first sealing ring 4, a movable flange 5, a second pressure ring 6, and a second sealing ring 7. The fixed flange 1, vacuum bellows 2, first pressure ring 3, first sealing ring 4, movable flange 5, second pressure ring 6, and second sealing ring 7 are all sleeved on the lifting shaft 9; The fixed flange 1 is installed at the bottom of the vacuum chamber 8, and the first sealing ring 4 is installed inside the fixed flange 1; The first pressure ring 3 is installed at the bottom of the fixed flange 1; The top of the vacuum bellows 2 is connected to the bottom of the first pressure ring 3, and the bottom of the vacuum bellows 2 is connected to the movable flange 5. The second sealing ring 7 is installed inside the movable flange 5; The second pressure ring 6 is installed at the bottom of the movable flange 5.
[0033] In one exemplary embodiment, the vacuum bellows 2 is a metal bellows. The vacuum bellows 2 is a flexible tubular component capable of axial expansion and contraction and radial bending; in this invention, it is a metal bellows. Its top end is connected to the first pressure ring 3, and its bottom end is connected to the movable flange 5. Its core function is to provide flexible deformation capability, allowing the bottom assembly connected to it to move with the lifting shaft.
[0034] According to another embodiment of the present invention, both the first sealing ring 4 and the second sealing ring 7 are X-shaped sealing rings.
[0035] The first sealing ring 4 is installed inside the fixed flange 1, specifically an X-shaped sealing ring. It works in conjunction with the fixed flange 1 and the first pressure ring 3 to form the first seal for the lifting shaft 9.
[0036] According to an embodiment of this application, the fixed flange 1 is provided with a first sealing groove, and the first sealing ring 4 is installed in the first sealing groove.
[0037] The fixed flange 1 is installed at the bottom of the vacuum chamber 8 for position fixation. It serves as the installation base and static support structure for the entire dynamic sealing device and is provided with a first sealing groove for accommodating the first sealing ring 4.
[0038] The first pressure ring 3 is an annular component installed at the bottom of the fixed flange 1. Its function is to press the first sealing ring 4 located in the first sealing groove of the fixed flange 1 from below, assisting in the formation of the first seal.
[0039] In one embodiment, the movable flange 5 is provided with a second sealing groove, and the second sealing ring 7 is installed in the second sealing groove.
[0040] The first sealing ring 4 is disposed between the first pressure ring 3 and the fixed flange 1, forming the first seal for the lifting shaft 9.
[0041] The second sealing ring 7 is disposed between the second pressure ring 6 and the movable flange 5, forming a second seal for the lifting shaft 9.
[0042] The movable flange 5 is connected to the bottom of the vacuum bellows 2. Due to the flexibility of the vacuum bellows 2, the movable flange 5 can be displaced, and its interior is provided with a second sealing groove for installing the second sealing ring 7. The second sealing ring 7 is installed inside the movable flange 5 and is also an X-shaped sealing ring. It works in conjunction with the movable flange 5 and the second pressure ring 6 to form a second seal for the lifting shaft 9.
[0043] The first seal is a sealing assembly consisting of the first sealing ring 4, the fixed flange 1, and the first pressure ring 3. Its main function is to provide a basic, relatively static seal.
[0044] The second seal is a sealing assembly consisting of the second sealing ring 7, the movable flange 5, and the second pressure ring 6. Because it is located at the bottom of the movable vacuum bellows 2, it can follow the slight movement of the lifting shaft 9, thus serving as the main seal to cope with shaft oscillation.
[0045] The second pressure ring 6 is an annular component installed at the bottom of the movable flange 5. Its function is to press the second sealing ring 7 located in the sealing groove of the movable flange from below, and it is usually connected to the movable flange 5 by bolts.
[0046] It should be further noted that the vacuum bellows 2 and the fixed flange 1 are fixedly connected by welding.
[0047] Furthermore, as a refinement and extension of the specific implementation of the above embodiments, in order to fully illustrate the specific implementation process in this embodiment, another dynamic sealing device for a vacuum chamber of a semiconductor device is provided, wherein the vacuum bellows 2 and the fixed flange 1 are fixedly connected by bolts.
[0048] Based on the above embodiments, in order to further improve the dynamic sealing device for the vacuum chamber of semiconductor equipment provided in the above embodiments, and to provide an implementable method, in one embodiment, the vacuum bellows 2 and the movable flange 5 are fixedly connected by welding.
[0049] It should be noted that the second pressure ring 6 is connected to the movable flange 5 by bolts.
[0050] As an example, when the lifting shaft 9 wobbles radially, the vacuum bellows 2 undergoes flexible deformation, causing the movable flange 5, the second pressure ring 6, and the second sealing ring 7 to move accordingly, so as to maintain close contact between the second sealing ring 7 and the lifting shaft 9.
[0051] As an example, the fixed flange 1, vacuum bellows 2, first pressure ring 3, first sealing ring 4, movable flange 5, second pressure ring 6, and second sealing ring 7 are all fitted onto the lifting shaft 9, which needs to pass through the bottom of the vacuum chamber 8. The fixed flange 1 is bolted to the bottom of the vacuum chamber 8, serving as the mounting base for the entire device. The first sealing ring 4 is installed in a first sealing groove machined inside the fixed flange 1. The first pressure ring 3 is installed at the bottom of the fixed flange 1, its function being to press the first sealing ring 4 from below, causing the first sealing ring 4 to deform radially and grip the lifting shaft 9, thereby forming the first static seal. The top end of the vacuum bellows 2 is fixedly connected to the bottom of the first pressure ring 3 by welding, and its bottom end is welded to the movable flange 5 as a whole. A second sealing groove is also machined inside the movable flange 5, in which the second sealing ring 7 is installed. The second pressure ring 6 is bolted to the bottom of the movable flange 5, pressing the second sealing ring 7 into the second sealing groove, causing it to grip the lifting shaft 9 and form the second seal.
[0052] In this embodiment, the vacuum bellows 2 serves as a key flexible connector, and is made of metal to ensure low outgassing rate and high strength in a vacuum environment. Both the first sealing ring 4 and the second sealing ring 7 are preferably X-shaped rubber sealing rings to provide better sealing contact surface under pressure. This structure forms a top-down sealing chain: the fixed flange 1 and the first pressure ring 3 clamp the first sealing ring 4 to form the first barrier; the vacuum bellows 2 acts as a transmission medium; and the movable flange 5 and the second pressure ring 6 clamp the second sealing ring 7 to form the following second barrier.
[0053] Working Principle: When the lifting shaft 9 only moves axially, both seals function effectively. When the lifting shaft 9 experiences unavoidable radial runout, the vacuum bellows 2 can flexibly bend and deform, causing the movable flange 5, the second pressure ring 6, and the second sealing ring 7 connected to its bottom end to move slightly. This ensures that the second sealing ring 7 always follows and closely adheres to the surface of the lifting shaft 9, maintaining stable contact pressure and effectively preventing instantaneous leakage gaps caused by relative displacement, thus ensuring the reliability of the dynamic seal. The fixed flange 1 is fixed to the chamber, and each component is sequentially fitted onto the shaft 9 and connected. During equipment operation, the shaft 9 moves, and the second seal adaptively follows, with the first seal providing basic protection. By introducing a flexible bellows and a movable sealing structure, the traditional static seal is transformed into an intelligent follow-up seal, fundamentally solving the dynamic leakage problem caused by the radial runout of the shaft, and greatly improving the sealing stability and service life of the vacuum chamber under long-term, complex motion.
[0054] According to another embodiment of the present invention, the vacuum bellows 2 is a metal bellows. Specifically, an annular bellows made of materials such as stainless steel can be used. Through its corrugated structure, it possesses excellent axial extensibility and radial bending flexibility. In this device, it acts as a sealed, flexible bridge, connecting the upper fixed part with the lower movable part, while its own metal shell ensures the airtightness of the connection, preventing it from becoming a new leakage point. In this embodiment, one end of the vacuum bellows 2 is welded to the first pressure ring 3, and the other end is welded to the movable flange 5, forming a rigid-flexible sealed transmission unit.
[0055] Working principle: Utilizing the elasticity of metal, the radial yaw force applied by the lifting shaft 9 is converted into its own bending deformation, rather than rigid resistance, thus absorbing the yaw energy. When the shaft 9 yaws and pushes the second sealing ring 7, the force is transmitted to the bellows 2 through the movable flange 5. The bellows 2 bends, allowing its bottom component to produce compliant displacement. The metal bellows provides a reliable, wear-free, and long-life flexible kinematic pair, which is the core of realizing the follow-up function, ensuring the smoothness and repeatability of the follow-up process, and avoiding the aging, creep deformation, or vacuum venting problems that may occur when using non-metallic flexible parts.
[0056] According to embodiments of this application, both the first sealing ring 4 and the second sealing ring 7 are X-type sealing rings. In specific implementations, the X-type sealing ring, due to its cross-sectional shape, can generate multiple sealing lips under pressure, resulting in more sufficient contact with the shaft and sealing groove, and thus a better sealing effect than an O-ring. In the embodiment, the first sealing ring 4 is pressed between the bottom surface of the first sealing groove of the fixed flange 1 and the upper end face of the first pressure ring 3, forming a first seal. The second sealing ring 7 is pressed between the bottom surface of the second sealing groove of the movable flange 5 and the upper end face of the second pressure ring 6, forming a second seal.
[0057] Working principle: Under the preload of the pressure ring, the X-type sealing ring expands radially, and its multiple lips tightly fit against the outer wall of the lifting shaft 9 and the side wall of the sealing groove, blocking the leakage path. Even if the second seal moves, the first static seal continues to work as a basic barrier. The use of X-type sealing rings improves the inherent sealing capacity of a single seal and reduces the probability of leakage; the dual X-type sealing rings arranged in series form a redundant safety system. Even if the effectiveness of one seal decreases slightly due to extreme conditions, the other can still provide an effective seal, significantly enhancing the safety margin and reliability of the entire device.
[0058] In one embodiment, the second pressure ring 6 is bolted to the movable flange 5. Specifically, multiple threaded holes are machined circumferentially on the bottom end face of the movable flange 5, and corresponding through holes are provided on the second pressure ring 6. Hexagonal socket head cap screws are passed through the through holes and screwed into the threaded holes to fasten the second pressure ring 6 to the movable flange 5. In this embodiment, the bolts are evenly distributed to ensure balanced clamping force. The working principle is that the bolted connection provides a strong and adjustable axial clamping force, ensuring that the second sealing ring 7 receives uniform and sufficient compression to achieve initial sealing. Simultaneously, the bolted connection is detachable, facilitating replacement of the second sealing ring 7 during maintenance. During installation or maintenance, the assembly of the second seal is completed by tightening the bolts; during operation, the connection remains rigid, fixing the movable flange 5, the second sealing ring 7, and the second pressure ring 6 into a movable whole. The bolted connection method is simple and reliable, with a large and controllable clamping force, facilitating standardized assembly and maintenance, and ensuring the structural integrity and stability of the second sealing assembly during operation.
[0059] It should be further explained that when the lifting shaft 9 experiences radial sway, the vacuum bellows 2 undergoes flexible deformation, causing the movable flange 5, the second pressure ring 6, and the second sealing ring 7 to move accordingly, maintaining close contact between the second sealing ring 7 and the lifting shaft 9. This is the core working mechanism of this device. In specific implementation, assuming the lifting shaft 9 experiences radial runout of several micrometers to tens of micrometers during movement, it will push the second sealing ring 7, which is in close contact with it. Since the second sealing ring 7 is pressed between the movable flange 5 and the second pressure ring 6, this force is transmitted to the movable flange 5. The movable flange 5 is rigidly connected to the vacuum bellows 2, while the top of the bellows 2 is fixed relative to the fixed flange 1 via the first pressure ring 3. At this time, the wall of the vacuum bellows 2 undergoes slight bending elastic deformation, allowing the movable flange 5 at its bottom to produce a small translation and deflection in the same direction as the sway of the lifting shaft 9. In this embodiment, this following process is continuous and dynamic, capable of compensating for instantaneous position changes of the shaft in real time. Its working principle is essentially to use the elastic deformation of flexible elements to match the instantaneous deviations between moving pairs. This transforms the seal from passively bearing wear and leakage to actively adapting to motion, completely solving the pain point of dynamic leakage and improving the reliability of the seal by an order of magnitude. It is particularly suitable for semiconductor manufacturing equipment with extremely high requirements for vacuum stability.
[0060] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
[0061] Any changes, modifications, substitutions, and variations made to the embodiments without departing from the principles and spirit of the present invention still fall within the protection scope of the present invention.
Claims
1. A dynamic sealing device for a vacuum chamber of a semiconductor device, characterized in that, The device includes a fixed flange (1), a vacuum bellows (2), a first pressure ring (3), a first sealing ring (4), a movable flange (5), a second pressure ring (6), and a second sealing ring (7); The fixed flange (1), vacuum bellows (2), first pressure ring (3), first sealing ring (4), movable flange (5), second pressure ring (6) and second sealing ring (7) are all sleeved on the lifting shaft (9); The fixed flange (1) is installed at the bottom of the vacuum chamber (8), and the first sealing ring (4) is installed inside the fixed flange (1); The first pressure ring (3) is installed at the bottom of the fixed flange (1); The top of the vacuum bellows (2) is connected to the bottom of the first pressure ring (3), and the bottom of the vacuum bellows (2) is connected to the movable flange (5). The second sealing ring (7) is installed inside the movable flange (5); The second pressure ring (6) is installed at the bottom of the movable flange (5).
2. The dynamic sealing device according to claim 1, characterized in that, The vacuum bellows (2) is a metal bellows.
3. The dynamic sealing device according to claim 1, characterized in that, Both the first sealing ring (4) and the second sealing ring (7) are X-type sealing rings.
4. The dynamic sealing device according to claim 1, characterized in that, The fixed flange (1) is provided with a first sealing groove, and the first sealing ring (4) is installed in the first sealing groove.
5. The dynamic sealing device according to claim 1, characterized in that, The movable flange (5) is provided with a second sealing groove, and the second sealing ring (7) is installed in the second sealing groove.
6. The dynamic sealing device according to claim 1, characterized in that, The vacuum bellows (2) and the fixed flange (1) are fixedly connected by welding.
7. The dynamic sealing device according to claim 1, characterized in that, The vacuum bellows (2) and the fixed flange (1) are fixedly connected by bolts.
8. The dynamic sealing device according to claim 1, characterized in that, The vacuum bellows (2) and the movable flange (5) are fixedly connected by welding.
9. The dynamic sealing device according to claim 1, characterized in that, The second pressure ring (6) is connected to the movable flange (5) by bolts.
10. The dynamic sealing device according to claim 1, characterized in that, When the lifting shaft (9) wobbles radially, the vacuum bellows (2) undergoes flexible deformation, causing the movable flange (5), the second pressure ring (6), and the second sealing ring (7) to move accordingly, so as to maintain close contact between the second sealing ring (7) and the lifting shaft (9).