Force / tactile sensor module and sensor, surface force solving method and device

Abstract

The application discloses a force / tactile sensor module and sensor, a surface force solving method and device, and comprises a magnetic substance, a magnetic induction chip and a PCB board; the magnetic induction chip is arranged below the magnetic substance, one side of the magnetic induction chip is provided with the PCB board, and the PCB board is electrically connected with the controller; the magnetic substance is arranged in multiple arrays, and the number of measuring points of the magnetic induction chip is greater than or equal to the number of the magnetic substance; the plurality of magnetic substances are wrapped by the elastic member. By integrating the magnetic substance, the magnetic induction chip and the PCB board in the same force / tactile sensor module, accurate collection, processing and transmission of force / tactile sensor signals can be realized independently, and through the surface force solving method and device provided by the application, the sensitivity of sensing can be ensured, and cross talk can be effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a force / tactile sensor module and sensor, a surface force calculation method and apparatus. Background Technology

[0002] Existing sensor technologies are mainly based on principles such as piezoelectricity, resistance, capacitance, optical fiber, and the Hall effect. Although these technologies have been widely applied in the fields of force and tactile sensing, they still have limitations in accurately measuring force distribution and capturing multidimensional tactile information, mainly in the following aspects:

[0003] 1. Insufficient integration: In existing force / tactile sensors, signal acquisition, processing, and transmission functions are separated into different hardware modules, requiring multiple independent components to work together. This not only increases the application design complexity and actual size of force / tactile sensors, but also increases manufacturing costs and integration difficulty. Furthermore, in systems with space constraints, it can lead to crosstalk issues due to space limitations, and performs poorly in applications requiring high integration.

[0004] 2. Limited measurement accuracy: Existing force / tactile sensors have relatively low accuracy when capturing multidimensional force information, especially in detecting subtle changes in force and force in multiple directions. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a force / touch sensor module and sensor. By integrating magnetic materials, magnetic induction chips and PCB boards into the same force / touch sensor module, the accurate acquisition, processing and transmission of force / touch sensor signals can be achieved independently. The surface force solution method and device provided by this invention can ensure the sensitivity of the sensing while effectively reducing crosstalk.

[0006] Therefore, the technical solution provided by this invention is as follows:

[0007] A force / tactile sensor module includes a magnetic material, a magnetic sensing chip, and a PCB board. The magnetic sensing chip is disposed below the magnetic material, and the PCB board is disposed on one side of the magnetic sensing chip. The PCB board has a port for electrical connection with a controller. Multiple arrays of the magnetic material are arranged, and the number of measuring points of the magnetic sensing chip is greater than or equal to the number of magnetic materials. The multiple magnetic materials are wrapped by an elastic element.

[0008] Furthermore, a separating layer is provided on the outside of the plurality of magnetic induction chips, and the top of the separating layer is disposed between the magnetic induction chip and the magnetic material.

[0009] Furthermore, the PCB board and the magnetic induction chip are electrically connected.

[0010] Furthermore, the spacing between adjacent magnetic materials is 2 mm to 10 mm.

[0011] Furthermore, the minimum distance between the magnetic material and the magnetic induction chip is 0.2 mm.

[0012] Furthermore, the magnetic induction chip is disposed on the bracket.

[0013] A force / tactile sensor, comprising the force / tactile sensor module described above.

[0014] A surface force solution method based on the above-mentioned force / tactile sensor module includes the following steps:

[0015] Obtain the magnetic field vector for each point to be detected;

[0016] Obtain the displacement-magnetic field relationship between the displacement of the magnetic material and the magnetic field vector (1);

[0017] (1)

[0018] The total number of magnetic materials is The magnetic field vector at a certain moment is ,here This represents the first magnetic field detection point measured in the global coordinates of the force / tactile sensor. , and Axial magnetic field; Total number of triaxial magnetic induction detection points ;No. ( The displacement of a magnetic material in the global coordinate system ; Indicates the first A magnetic material in displacement Under the subscript The corresponding magnetic field generated at the point to be detected and in the direction; in the first ( By taking values ​​from each component, we obtain the formula. ;

[0019] Based on the magnetic field vector of each point to be detected, and combined with the displacement magnetic field relationship, the displacement vector of the magnetic material is obtained.

[0020] The surface force is calculated based on the displacement vector of the magnetic material.

[0021] A surface force solving apparatus, the apparatus comprising:

[0022] The magnetic field acquisition module is used to acquire the magnetic field vector of each point to be detected;

[0023] The formula acquisition module is used to obtain the displacement-magnetic field relationship (1) between the displacement of the magnetic material and the magnetic field vector.

[0024] (1)

[0025] Wherein, the magnetic field vector at a certain moment is ,here This represents the first magnetic field detection point measured in the global coordinates of the force / tactile sensor. , and Axial magnetic field; First ( The displacement of a magnetic material in the global coordinate system ; Indicates the first A magnetic material in displacement Under the subscript The magnetic field generated at the corresponding measuring point and in the direction;

[0026] The displacement calculation module is used to calculate the displacement vector of the magnetic material based on the magnetic field vector of each measuring point and the displacement magnetic field relationship.

[0027] The force calculation module is used to calculate the surface force based on the displacement vector of the magnetic material.

[0028] A surface force calculation system includes at least one force / tactile sensor module, the force / tactile sensor module comprising: a magnetic material, a magnetic induction chip, and a PCB board; the magnetic induction chip is disposed below the magnetic material, and the PCB board is disposed on one side of the magnetic induction chip, the PCB board and the controller are electrically connected; multiple arrays of the magnetic material are arranged, and the number of measuring points of the magnetic induction chip is greater than or equal to the number of magnetic materials; the multiple magnetic materials are externally wrapped by an elastic element; wherein, the controller is used to implement the above-described surface force calculation method.

[0029] Compared with the prior art, the present invention has the following main advantages:

[0030] This invention provides a force / tactile sensor module. By placing a magnetic induction chip under each magnetic material and connecting the magnetic induction chip to a PCB board to form a single force / tactile sensing unit, it achieves accurate acquisition, processing, and transmission of independent force / tactile sensor signals. Based on the acquired data from different force / tactile sensor signals, the module can be independently controlled via a matching PCB board and controller, significantly improving its sensitivity and accuracy. Furthermore, this invention allows for the arbitrary combination of multiple force / tactile sensor modules to create force / tactile sensors with different shapes and structures on different object surfaces. This reduces the need for redesigning and processing individual products, expands the applicability of the force / tactile sensors, and ultimately improves overall processing and design efficiency.

[0031] Furthermore, by employing multiple magnetic materials and multiple magnetic sensing chips, with the number of measuring points on the magnetic sensing chips being greater than or equal to the number of magnetic materials, it is ensured that each magnetic material can sense at least one physical quantity. This multi-point sensing and multiple measuring point setup enables effective monitoring for different structures under test. Additionally, the multiple magnetic materials are externally encased in an elastic element to ensure the sealing of the force / tactile sensor module and the stability of the magnetic materials. This also guarantees the signal transmission stability of the force / tactile sensor module and provides a flexible contact surface.

[0032] Furthermore, the flexible contact surface of the elastic element better conforms to the object being grasped, enhancing the gripping and dexterity of the force / tactile sensor module in practical applications. Simultaneously, the cushioning properties of the elastic element effectively absorb external impacts, protecting sensitive internal magnetic materials and sensor components, extending the sensor's lifespan. It also ensures good sensing performance when in contact with irregular or curved objects, adapting to a wider range of application scenarios and improving the sensor's applicability. The elastic element reduces wear caused by prolonged contact or friction, protecting the sensor surface from physical damage and extending product lifespan. In scenarios involving human-device contact, such as wearable devices and robotic haptics, the elastic element provides a softer, more comfortable feel, enhancing the user experience. Moreover, the elastic element offers better sealing, providing additional protection and ensuring a tight seal through its elasticity, preventing external contaminants such as dust, moisture, and grease from entering the sensor, thus maintaining its airtightness and long-term stability.

[0033] Furthermore, by placing a separator layer outside the multiple magnetic sensing chips, effective isolation and protection are provided for the external environment of the chips, such as moisture and dust, ensuring the reliability and long-term stability of the force / tactile sensor module in complex environments. The top of the separator layer is positioned between the magnetic sensing chips and the magnetic material, effectively ensuring effective separation between them.

[0034] Furthermore, the spacing between adjacent magnetic materials, ranging from 2mm to 10mm, provides a balance for each force / tactile sensing unit, effectively improving sensing accuracy.

[0035] Furthermore, the minimum distance between the magnetic material and the magnetic induction chip is 0.2mm. This distance ensures that the magnetic induction chip has sufficient sensitivity, avoids overloading the magnetic induction chip, and reduces crosstalk. By effectively enabling the application of this technology in common manufacturing processes, production costs are effectively reduced, and it is more suitable for mass production in practical applications.

[0036] Furthermore, the present invention provides a force / tactile sensor that, by arbitrarily splicing multiple force / tactile sensor modules, allows for maintenance only on the faulty module if maintenance is required in the future, thus ensuring the safe application of the force / tactile sensor as a whole, improving maintenance efficiency, and greatly reducing maintenance costs.

[0037] Furthermore, this invention provides a method, apparatus, system, module, and storage medium for calculating surface forces. The method involves obtaining the magnetic field vector at each point to be detected; determining the displacement-magnetic field relationship between the displacement of the magnetic material and the magnetic field vector; then calculating the displacement vector of the magnetic material; and finally calculating the surface force. Because the spacing between the various magnetic materials is small, magnetic signal crosstalk is easily generated. Interference is eliminated through calculation to prevent magnetic signal crosstalk, ensuring that the force / tactile sensor maintains excellent measurement stability and sensitivity even with a high-density arrangement. Attached Figure Description

[0038] To more clearly illustrate the solutions in this invention, the accompanying drawings used in the description of the embodiments of this invention will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0039] Figure 1 This is a side view of a force / tactile sensor module according to a preferred embodiment of the present invention;

[0040] Figure 2 yes Figure 1 A schematic diagram of the overall structure of a force / tactile sensor module is provided.

[0041] Figure 3 This is a schematic diagram of a preferred embodiment of a force / touch sensor of the present invention, which is composed of multiple force / touch sensor modules;

[0042] Figure 4 This is a schematic diagram of another preferred embodiment of a force / touch sensor of the present invention, which is composed of multiple force / touch sensor modules;

[0043] Figure 5 This is a flowchart illustrating a surface force calculation method according to a preferred embodiment of the present invention.

[0044] Figure 6 This is a schematic diagram of a surface force solving device provided in a preferred embodiment of the present invention;

[0045] Figure 7 This is a schematic diagram of the structure of a controller provided in a preferred embodiment of the present invention.

[0046] Reference numerals: 110, elastic element; 120, magnetic material; 130, magnetic induction chip; 140, PCB board; 150, bracket; 160, controller; 161, memory; 162, processor; 163, network interface; 170, partition layer; 410, magnetic field acquisition module; 420, formula acquisition module; 430, displacement calculation module; 440, force calculation module. Detailed Implementation

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the specification of the invention is for the purpose of describing particular embodiments only and is not intended to limit the invention; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings are used to distinguish different objects, not to describe a particular order.

[0048] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0049] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0050] In a preferred embodiment of the present invention, a force / tactile sensor module is provided, such as... Figure 1 and Figure 2 As shown, the system includes an elastic element 110, a magnetic material 120, a magnetic induction chip 130, a PCB board 140, a bracket 150, a controller 160, and a partition layer 170. The number of measuring points on the magnetic induction chip 130 is greater than or equal to the number of magnetic materials 120. Specifically, multiple magnetic materials 120 are arranged in an array, and each magnetic material 120 is sensed below at least through measuring points on the magnetic induction chip 130. Each magnetic material 120 and its corresponding magnetic induction chip 130 constitute a force / tactile sensing unit. The PCB board 140 and the controller 160 are located below the multiple magnetic induction chips 130. The magnetic field signal is monitored by sensing changes in the magnetic field brought about by the multiple magnetic materials 120 corresponding to the multiple magnetic induction chips 130. The PCB board 140 provides electrical connection and transmission of the magnetic field signal, and the controller 160 monitors multi-dimensional force information such as displacement and contact force, thereby providing high-precision tactile feedback.

[0051] In a preferred embodiment of the present invention, the plurality of magnetic materials 120 may be, but are not limited to, magnets or electromagnets, and the plurality of magnetic materials 120 may be made of permanent magnet materials, ferrites, rare earth metals, superconducting materials, high permeability alloys, etc.

[0052] In a preferred embodiment of the present invention, a plurality of magnetic materials 120 are externally wrapped with an elastic member 110. The elastic member 110 has an internal groove structure that matches the shape and size of the plurality of magnetic materials 120. By fitting the plurality of magnetic materials 120 into the groove structure of the elastic member 110, the overall sealing performance of the force / tactile sensor module and the stability of the magnetic materials 120 can be effectively ensured, achieving complete coverage of the periphery and top of the magnetic materials 120. This effectively ensures the signal transmission stability of the force / tactile sensor module; simultaneously, it provides a flexible contact surface layer for the force / tactile sensor module.

[0053] The flexible contact layer better conforms to the object being grasped, enhancing the gripping and dexterity of the force / tactile sensor module in practical applications. Simultaneously, the cushioning properties of the flexible contact layer effectively absorb external impacts, protecting the sensitive internal magnetic material 120 and sensor elements, extending the sensor's lifespan. It also ensures good sensing performance when in contact with irregular or curved objects, adapting to a wider range of application scenarios and improving the sensor's applicability. The flexible contact layer of the elastic element 110 reduces wear caused by prolonged contact or friction, protecting the sensor surface from physical damage and extending the product's lifespan. In scenarios involving human-device contact, such as wearable devices and robotic haptics, the flexible contact layer of the elastic element 110 provides a softer, more comfortable feel, enhancing the user experience. Furthermore, the flexible contact layer of the elastic element 110 offers better sealing, providing additional protection and ensuring a tight seal through its elasticity, preventing external contaminants such as dust, moisture, and grease from entering the sensor, thus maintaining its airtightness and long-term stability.

[0054] In a preferred embodiment of the present invention, the material of the elastic element 110 can be natural rubber, synthetic rubber, thermoplastic elastomer (TPE), special elastomer, foam elastomer, and bio-based elastomer. The elastic element 110 can be manufactured using solid or liquid molding processes.

[0055] In a preferred embodiment of the present invention, a plurality of magnetic induction chips 130 are externally wrapped with a partition layer 170, and a plurality of magnetic materials 120 are tightly attached to the top surface of the partition layer 170 by an externally wrapped elastic member 110, thereby ensuring a stable structural connection and positioning between the plurality of magnetic materials 120 and the plurality of magnetic induction chips 130.

[0056] In this preferred embodiment, the elastic element 110 and the potting layer 170 are fixedly connected to ensure the structural connection stability, thereby effectively ensuring the stability of the signal transmission of the force / touch sensor module; the magnetic induction chip 130 is electrically connected to the PCB board 140, which effectively improves the space utilization of the force / touch sensor module, and at the same time can effectively improve the integration of the force / touch sensor module.

[0057] In a preferred embodiment of the present invention, the separator layer 170 is made of a high-strength material with good protective performance. The material can be selected from epoxy resin, polyurethane, acrylic resin, polyester resin, high-hardness silicone, etc. The selected material has the following properties: moisture resistance, electrical insulation, pressure resistance and impact resistance, as well as good chemical resistance, temperature resistance and aging resistance.

[0058] The force / touch sensor module provided by the present invention can completely encapsulate multiple magnetic induction chips 130 by setting a separation layer 170, effectively isolating the multiple magnetic induction chips 130 from external environments such as moisture, dust, chemicals, grease, dirt, salt spray, water immersion, and microbial erosion. The potting layer 170 ensures the reliability of signal transmission of the magnetic induction chips 130 in complex environments and the long-term stability of the force / touch sensor module.

[0059] In a preferred embodiment of the present invention, the bottom end face of the separator layer 170 is connected to the PCB board 140, the controller 160 is disposed on one side of the PCB board 140, and the controller 160 is electrically connected to a plurality of magnetic induction chips 130.

[0060] In a preferred embodiment of the present invention, the PCB board 140 can be used to integrate the control circuit of the magnetic induction chip 130 and the controller 160. By integrating the controller 160 and the control circuit, the space utilization of the force / touch sensor module is effectively improved, and the integration degree of the force / touch sensor module is also effectively improved.

[0061] In a preferred embodiment of the present invention, the PCB board 140 may be any existing or future PCB board 140, such as: double-sided board, multilayer board, flexible circuit board or rigid-flex circuit board.

[0062] In a single-layer PCB board 140, multiple magnetic induction chips 130 and a controller 160 are located on the same conductive layer. In a multi-layer PCB board 140, the conductive layers of different numbers of layers are located on different conductive layers along the thickness direction of the PCB board 140. In a double-sided PCB board 140, the double-sided PCB board 140 includes a first conductive layer and a second conductive layer, located on the front and back sides of the PCB board 140, respectively. The side closer to the multiple magnetic materials 120 is the first conductive layer, within which multiple magnetic induction chips 130 are disposed. The side farther from the multiple magnetic materials 120 is the second conductive layer, within which a controller 160 is disposed. Multiple magnetic induction chips 130 are arrayed on the first conductive layer of the PCB board 140 and electrically connected to it. The controller 160 is disposed on the second conductive layer of the PCB board 140.

[0063] In a preferred embodiment of the present invention, the controller 160 is used to receive magnetic field signals monitored and transmitted by multiple magnetic induction chips 130, and then calculates the displacement of the corresponding node of the flexible body based on the magnetic field signals, and obtains the contact force information of the surface of the flexible body based on the displacement. The controller 160 can be electrically connected to multiple magnetic induction chips 130 in parallel, series or other ways as needed.

[0064] In a preferred embodiment of the present invention, the controller 160 may be, but is not limited to, a programmable logic controller (PLC); a field-programmable gate array (FPGA); a digital signal processor (DSP); or a microcontroller unit (MCU) and similar controllers.

[0065] This invention integrates the elastic element 110, multiple magnetic materials 120, multiple magnetic induction chips 130, PCB board 140 and controller 160 into the same force / touch sensor module, ensuring a simple structure and enabling independent acquisition, processing and transmission of force / touch sensor signals.

[0066] In a preferred embodiment of the present invention, the spacing between adjacent magnetic materials 120 is 2 mm to 10 mm; the spacing of 2 mm to 10 mm provides a balance for each force / touch sensing unit, which can effectively improve the sensing accuracy.

[0067] In a preferred embodiment of the present invention, the magnetic material 120 is cylindrical; the diameter of the cylinder is 1 mm to 8 mm; and / or, the height of the cylinder is 1 mm to 5 mm. The cylindrical structure of the magnetic material 120 allows for a more concentrated magnetic field in the vertical direction, which helps ensure that the magnetic induction chip 130 in the force / tactile sensor module can accurately detect changes in the magnetic field, improving sensing accuracy; it can also reduce the phenomenon of non-rebound; the manufacturing process is mature and suitable for mass production, effectively reducing production costs. Simultaneously, this diameter and height setting ensures that a sufficiently strong magnetic field can be generated within a limited space, while avoiding excessive space occupation and reducing magnetic field interference to adjacent force / tactile sensing units, allowing for a more compact arrangement of the force / tactile sensing units.

[0068] In a preferred embodiment of the present invention, the distance between the magnetic material 120 and the magnetic induction chip 130 is 0.2 mm. This distance ensures that the magnetic induction chip 130 has sufficient sensitivity while avoiding overload, effectively guaranteeing sensing accuracy without crosstalk. By applying this technology to common manufacturing processes, production costs are effectively reduced, making it more suitable for mass production in practical applications.

[0069] In a preferred embodiment of the present invention, a bracket 150 is included, on which a plurality of magnetic induction chips 130 are disposed. The bracket 150 provides robust structural support for the force / touch sensor module and facilitates stable connection with other force / touch sensor modules, ensuring reliability during installation and use.

[0070] This invention also provides a force / tactile sensor. By arbitrarily splicing together multiple force / tactile sensor modules, force / tactile sensors of arbitrary shapes can be formed according to the structure of the surface to be measured. This reduces the need for redesign and processing of individual products, expands the applicability of force / tactile sensors, and thus improves overall processing and design efficiency. Furthermore, during subsequent maintenance, only the problematic force / tactile sensor module needs to be addressed individually, effectively ensuring maintenance efficiency while significantly reducing maintenance costs.

[0071] In a preferred embodiment provided by the present invention, such as Figure 1 and Figure 2 As shown, a rectangular force / tactile sensor module is configured, comprising N*M magnetic materials 120, N * *M * Each magnetic induction chip 130 and PCB board 140 are used. In this embodiment, N and M in the magnetic material 120 are set to 4 and 5 respectively, and N is correspondingly set below each of the 4*5 magnetic materials 120. * *M * In this embodiment, N magnetic induction chips 130 are used. * and M * The number is set to 4 or 5, where each magnetic material 120 corresponds to one magnetic induction chip 130. In other embodiments, N * and M * They can also be integers greater than or equal to 4 and 5, respectively. In this embodiment, each magnetic material 120 and the corresponding magnetic induction chip 130 form a force / touch sensing unit, and 4*5 force / touch sensing units constitute a force / touch sensor module, realizing a collection of multiple force / touch sensing units.

[0072] It should also be noted that in other embodiments of the present invention, force / touch sensing units arranged in a ring array or in an elliptical array can also be used. The specific positional relationship of the force / touch sensing units can be adaptively selected according to different application scenarios. The force / touch sensing units arranged in a rectangular array in this embodiment are provided only as exemplary force / touch sensing units.

[0073] In a preferred embodiment provided by the present invention, such as Figure 3 and Figure 4As shown, based on the force / tactile sensor module of the above embodiment, this embodiment of the invention provides a force / tactile sensor. This force / tactile sensor includes at least one of the above-described force / tactile sensor modules. Figure 3 As shown, in a preferred embodiment of the present invention, a force / touch sensor module composed of four 4*5 force / touch sensing units can be spliced ​​together to form a plane, thus forming a force / touch sensor.

[0074] like Figure 4 As shown, multiple force / tactile sensor modules can be assembled into a polyhedral structure. In this preferred embodiment, three 4*5 force / tactile sensing units are assembled into a force / tactile sensor module at a certain angle to form a force / tactile sensor with a certain bend. By arbitrarily assembling multiple force / tactile sensor modules, force / tactile sensors with different shapes can be formed from different object surface structures to be measured. This reduces the need for redesign and processing of individual products, increases the applicability of force / tactile sensors, and thus improves overall processing and design efficiency. In addition, if maintenance is required later, repairs can be made only for problematic modules to ensure the safe application of the entire force / tactile sensor system, improving maintenance efficiency and greatly reducing maintenance costs.

[0075] like Figure 5 As shown, based on the force / tactile sensor module of the above embodiment, for example, when the magnetic material is an N35 neodymium iron boron magnet with a length of 1mm, there will be obvious crosstalk signal within about 3mm of the magnetic induction chip 130 in another force / tactile sensing unit.

[0076] This invention provides a method for solving surface forces, which is generally executed by a controller 160; wherein, the controller 160 can be the controller 160 of each force / touch sensor module, or the controller 160 of the entire force / touch sensor system, and specifically includes the following steps:

[0077] Step 310: Obtain the magnetic field vector for each point to be detected;

[0078] In a preferred embodiment of the present invention, the controller 160 acquires the magnetic field vector of the corresponding magnetic material 120 collected by each magnetic induction chip 130 according to a preset address.

[0079] Step 320: Obtain the displacement-magnetic field relationship between the displacement of magnetic material 120 and the magnetic field vector.

[0080] 1

[0081] Here, the total number of magnetic materials (120) is denoted as , and the total number of triaxial magnetic induction measuring points is denoted as . The magnetic field vector measured by the force / tactile sensor at a certain moment is . ,here This represents the magnetic field measured at the first magnetic field measuring point, numbered 0, in the global coordinate system of the force / tactile sensor. , and The axial magnetic field, and so on. Let the first... The displacement of a magnetic material 120 in the global coordinate system is integrated according to the magnetic dipole formula, and the result is obtained at the i-th... Taking values ​​from each component, we obtain the formula. .here Indicates the first 120 pairs of magnetic field vector components of a magnetic material Contribution; function Indicates the first A magnetic material 120 is in displacement Under the subscript The specific form of the magnetic field generated at the corresponding measuring point and in the corresponding direction is related to the shape of the magnetic material 120 and the relative position between the point to be tested and the magnetic material 120. Furthermore, since the magnetic field decays with the cube of the distance, when the distance between the two is very large... The value is zero when the two are relatively close. It manifests as crosstalk.

[0082] In a preferred embodiment of the present invention, the force / tactile sensor module based on the above embodiment is prone to magnetic signal crosstalk due to the small spacing between the various magnetic materials 120, which needs to be eliminated based on the above relation 1.

[0083] Step 330: Based on the magnetic field vector of each point to be detected, and combined with the displacement magnetic field relationship 1, calculate the displacement vector of the magnetic material 120.

[0084] In a preferred embodiment of the present invention, since the number of magnetic materials 120 is not necessarily equal to the number of magnetic induction chips 130, the above equation may be in an underdetermined or overdetermined state. It can be solved by regularization methods such as adding Tikhonov regularization terms and minimization methods such as quadratic programming, Newton's method or other gradient-based methods.

[0085] In a preferred embodiment of the present invention, step 330 includes the following method steps:

[0086] Step 331: Obtain the Taylor expansion of the displacement magnetic field relation 1 as relation 2.

[0087] For example, a linearized calculation method combined with ridge regression is used. Taking the above equation as an example, performing a Taylor expansion under the static condition of no load on the force / tactile sensor and retaining the linear terms, we obtain the following relationship 2: ;in, It is a Jacobian matrix, which, after calibration, becomes a constant matrix. This is the magnetic field vector value detected by the force / tactile sensor under static conditions without load. After calibration, it is a constant vector, and the quantity to be solved is... Let be a column vector, which is the displacement vector formed by the displacements of all magnetic materials 120 in three directions, i.e. .

[0088] Step 332: Convert Taylor expansion relation 2 into a minimization problem, and solve for the displacement vector of magnetic material 120 based on the minimization problem.

[0089] Will The solution is transformed into a minimization problem:

[0090]

[0091] Here, a regularization term is constructed using the L2 norm based on the displacement, with coefficients of . The value is determined based on experience.

[0092] This problem has an analytical solution:

[0093]

[0094] Therefore, the displacement vector of magnetic material 120 can be obtained. .

[0095] Step 340: Calculate the surface force based on the displacement vector of the magnetic material 120.

[0096] Specifically, the surface force distribution of a force / tactile sensor is typically represented by a virtual mesh covering the effective pressing area, and the mesh distribution should be as uniform as possible. The surface force is defined at each vertex of the mesh, denoted by the number of vertices. Then the surface force can be expressed as a vector. ,here This represents the first mesh vertex, numbered 0, defined in the force / haptic sensor's global coordinates. , and Shaft surface forces. These can be obtained through calibration or simulation. to displacement vector mapping matrix The two satisfy relation 3: ;

[0097] It should be noted that the mapping matrix here Since it is not a square matrix, it can be solved using a regularized minimization method or a pseudoinverse. Here, we take the pseudoinverse as an example, which can be obtained as follows: ;in, This represents finding the pseudo-inverse of the input matrix.

[0098] In a preferred embodiment of the present invention, when the spacing between adjacent magnetic materials 120 is small and magnetic signal crosstalk occurs, the present invention can eliminate crosstalk by adopting the above-mentioned surface force solution method, ensuring that the force / tactile sensor still has excellent measurement accuracy under high-density arrangement.

[0099] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. This computer program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. The aforementioned storage medium can be a magnetic disk, optical disk, read-only memory (ROM), or other non-volatile storage media, or random access memory (RAM), etc.

[0100] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0101] Further reference Figure 6 As a response to the above Figure 5 To implement the method shown, this embodiment of the invention provides a preferred surface force solving device, which is similar to... Figure 5 Corresponding to the method embodiment shown, the device can be specifically applied to the controller 160.

[0102] like Figure 6 As shown, the surface force solving device of this embodiment includes: acquiring the magnetic field vector of each detection point through the magnetic field acquisition module 410; obtaining the displacement-magnetic field relationship between the displacement of the magnetic material 120 and the magnetic field vector through the formula acquisition module 420; obtaining the displacement vector of the magnetic material 120 through the displacement calculation module 430; and finally obtaining the surface force through the force calculation module 440.

[0103] Because the spacing between the various magnetic materials 120 is small, magnetic signal crosstalk is easily generated. The interference is eliminated by calculation using the surface force solving device provided in this embodiment of the invention, which prevents magnetic signal crosstalk and ensures that the force / tactile sensor still has excellent measurement stability under high density arrangement.

[0104] To solve the above-mentioned technical problems, a preferred embodiment of the present invention provides a method such as... Figure 7 The controller 160 is shown. The controller 160 includes a memory 161, a processor 162, and a network interface 163 that are communicatively connected to each other via a system bus. It should be noted that only a computer device with memory 161, processor 162, and network interface 163 is shown in the figure; however, it should be understood that it is not required to implement all the components shown, and more or fewer components can be implemented alternatively. Those skilled in the art will understand that the computer device described herein is a device capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0105] The memory 161 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory such as SD or DX memory, random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In a preferred embodiment of the present invention, the memory 161 may be an internal storage unit of the controller 160, such as the hard disk or memory of the controller 160. In other embodiments, the memory 161 may also be an external storage device of the controller 160, such as a plug-in hard disk, smart media card (SMC), secure digital card (SD card), flash card, etc., equipped on the controller 160. Of course, the memory 161 may include both the internal storage unit and the external storage device of the controller 160. In a preferred embodiment of the present invention, the memory 161 is typically used to store the operating system and various application software installed on the controller 160, such as the program code of the surface force solution method. In addition, the memory 161 can also be used to temporarily store various types of data that have been output or will be output.

[0106] In some embodiments, processor 162 may be a Central Processing Unit (CPU), controller 160, microcontroller, microprocessor, or other data processing chip. Processor 162 is typically used to control the overall operation of controller 160. In a preferred embodiment of the invention, processor 162 is used to run program code stored in memory 161 or process data, such as running program code for a surface force solution method.

[0107] Network interface 163 may include a wireless network interface or a wired network interface, which is typically used to establish communication connections between controller 160 and other electronic devices.

[0108] The present invention also provides a computer-readable storage medium storing a surface force solving program, which can be executed by at least one processor 162 to perform the steps of the surface force solving method described above.

[0109] Through the above description of the embodiments, those skilled in the art can clearly understand that the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium such as ROM / RAM, magnetic disk, or optical disk, and includes several instructions to enable a terminal device, such as a mobile phone, computer, server, air conditioner, or network device, to execute the methods of the various embodiments of the present invention.

[0110] Obviously, the embodiments described above are merely some embodiments of the present invention, not all embodiments. The accompanying drawings show preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms; rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this invention.

Claims

1. A force / tactile sensor module, characterized in that, The device includes a magnetic material (120), a magnetic induction chip (130), and a PCB board (140). The magnetic induction chip (130) is disposed below the magnetic material (120), and the PCB board (140) is disposed on one side of the magnetic induction chip (130). The PCB board (140) is provided with a port that can be electrically connected to a controller. Multiple arrays of the magnetic material (120) are arranged, and the number of measuring points of the magnetic induction chip (130) is greater than or equal to the number of the magnetic material (120). The multiple magnetic materials (120) are wrapped by the elastic element (110).

2. The force / tactile sensor module according to claim 1, characterized in that, A separation layer (170) is provided on the outside of the plurality of magnetic induction chips (130), and the top of the separation layer (170) is disposed between the magnetic induction chip (130) and the magnetic material (120).

3. A force / tactile sensor module according to claim 1 or claim 2, characterized in that, The PCB board (140) and the magnetic induction chip (130) are electrically connected.

4. A force / tactile sensor module according to claim 1 or claim 2, characterized in that, The spacing between adjacent magnetic materials (120) is 2 mm to 10 mm.

5. A force / tactile sensor module according to claim 1 or claim 2, characterized in that, The minimum distance between the magnetic material (120) and the magnetic induction chip (130) is 0.2 mm.

6. A force / tactile sensor module according to claim 1 or claim 2, characterized in that, The magnetic induction chip (130) is disposed on the bracket (150).

7. A force / tactile sensor, characterized in that, It includes at least one force / tactile sensor module as described in any one of claims 1 to 6.

8. A method for solving the surface force of a force / tactile sensor module based on any one of claims 1 to 6, characterized in that, The surface force solution method includes the following steps: Obtain the magnetic field vector for each point to be detected; Obtain the displacement-magnetic field relationship (1) between the displacement of the magnetic material (120) and the magnetic field vector. （1） The total number of magnetic materials (120) is The magnetic field vector at a certain moment is ,here This represents the magnetic field measured at the first (numbered 0) test point in the global coordinate system of the force / tactile sensor. , and Axial magnetic field; Total number of triaxial magnetic induction detection points ;No. ( The displacement of 120 magnetic materials in the global coordinate system ; Indicates the first A magnetic material in displacement Under the subscript The corresponding magnetic field generated at the point to be detected and in the direction; in the first ( By taking values ​​from each component, we obtain the formula. ; Based on the magnetic field vector of each point to be detected, and combined with the displacement magnetic field relationship (1), the displacement vector of the magnetic material (120) is obtained. The surface force is determined based on the displacement vector of the magnetic material (120).

9. A surface force solving device, characterized in that, The device includes: The magnetic field acquisition module is used to acquire the magnetic field vector of each point to be detected; The formula acquisition module is used to acquire the displacement magnetic field relationship (1) between the displacement of the magnetic material (120) and the magnetic field vector. （1） Wherein, the magnetic field vector at a certain moment is ,here This represents the first (numbered 0) magnetic field detection point measured in the global coordinates of the force / tactile sensor. , and Axial magnetic field; First ( The displacement of a magnetic material in the global coordinate system ; Indicates the first A magnetic material (120) in displacement Under the subscript The magnetic field generated at the corresponding measuring point and in the direction; The displacement calculation module is used to calculate the displacement vector of the magnetic material (120) based on the magnetic field vector of each measuring point and the displacement magnetic field relationship (1). The force calculation module is used to calculate the surface force based on the displacement vector of the magnetic material (120).

10. A surface force solution system, characterized in that, The solution system includes at least one force / tactile sensor module, which includes: a magnetic material (120), a magnetic induction chip (130), and a PCB board (140); the magnetic induction chip (130) is disposed below the magnetic material (120), and the PCB board (140) is disposed on one side of the magnetic induction chip (130), and the PCB board (140) can be used to electrically connect with the controller; multiple arrays of the magnetic material (120) are arranged, and the number of measuring points of the magnetic induction chip (130) is greater than or equal to the number of the magnetic material (120); the multiple magnetic materials (120) are wrapped by the elastic element (110); wherein, the controller (160) is used to implement the surface force solution method of claim 8.

Images