Lens body and optical module

Abstract

The embodiment of the present application provides a lens body and an optical module, wherein the optical module comprises at least one set of lens bodies and at least one chip combination, the chip combination corresponds to the lens body one by one, the lens body comprises a plurality of optical signal channels arranged at intervals, at least two adjacent optical signal channels constitute a lens array, and the number and the position of the optical signal channels contained in different lens arrays are different at least in one. The number of a group of lens arrays corresponding to different chip combinations can be the same or different; when the same number of lens arrays corresponding to different chip combinations, the lens arrays corresponding to different chip combinations can be the same or different. The optical signal path of the chip combination is aligned with one of the lens arrays of the corresponding lens body, so as to transmit the optical signal between the chip combination and the optical fiber, so that the same lens body can meet the needs of different chip combinations, so that different optical modules can be compatible with different chip combinations to meet different scenes.

Description

Technical Field

[0001] This invention relates to the field of optical fiber communication technology, and in particular to a lens body and an optical module. Background Technology

[0002] An optical module is an optoelectronic device that realizes photoelectric conversion and electro-optic conversion during optical signal transmission. It is an important component of optical fiber communication system. An optical module includes a photonic integrated circuit chip and a lens. The lens can convert optical signals between the photonic integrated circuit chip and the optical fiber.

[0003] Because current lens structures on the market are typically set up with half transmitting and half receiving channels, the photonic integrated circuit chips that receive and emit optical signals must be placed side-by-side due to the lens structure, and their relative positions cannot be changed. This makes it impossible to meet the needs of many application scenarios. For example, in server systems, the transmitting and receiving ends are circuitically separate. If the transmitting and receiving photonic integrated circuit chips are mixed on optical modules and optical engines, it will inevitably cause the wiring between the photonic integrated circuit chips and electronic integrated circuit chips to cross or become too long, interfering with signal transmission. Summary of the Invention

[0004] In view of the above problems, embodiments of the present invention are proposed. The purpose of the embodiments of the present invention is to provide an optical module that is compatible with a receiver chip combination for receiving optical signals, a transmitter chip combination for transmitting optical signals, and a hybrid chip combination that can both receive and transmit optical signals.

[0005] To achieve this objective, the embodiments of the present invention adopt the following technical solutions:

[0006] An optical module, comprising:

[0007] At least one lens body, the lens body comprising a plurality of optical signal channels arranged sequentially and uniformly at intervals, wherein at least two adjacent optical signal channels constitute a lens array; and

[0008] At least one chip assembly, which corresponds one-to-one with the lens body, and the optical signal path of the chip assembly is aligned with one of the lens arrays corresponding to the lens body, so that the optical signal is transmitted between the chip assembly and the optical fiber through the lens array;

[0009] The number of lens arrays corresponding to different chip combinations can be the same or different;

[0010] When different chip combinations correspond to the same number of lens arrays, the lens arrays corresponding to different chip combinations may be the same or different;

[0011] The number of optical signal channels and the position of the optical signal channels are different among the different lens arrays.

[0012] Optionally, the chip assembly may also include at least two photonic integrated circuit chips.

[0013] Different photonic integrated circuit chips may have the same or different functions in receiving or transmitting optical signals.

[0014] Alternatively, different photonic integrated circuit chips may correspond to different lens arrays.

[0015] Optionally, the chip assembly further includes:

[0016] The electronic integrated circuit chip is coupled to the photonic integrated circuit chip in a one-to-one correspondence;

[0017] The photonic integrated circuit chip is matched to the lens array according to the position of the electronic integrated circuit chip.

[0018] Alternatively, multiple optical signal channels may be distributed across the same cross-section of the lens body.

[0019] Optionally, the bottom of the lens body is provided with a hollow area.

[0020] Optionally, a portion of the electronic integrated circuit chip may extend from the cutout area beyond the edge of the lens body.

[0021] Optionally, it also includes:

[0022] Multiple electronic components with the same or different functions;

[0023] The electronic components can be disposed in the hollowed-out area.

[0024] Optionally, it also includes:

[0025] The fiber optic connector is aligned with the side of the lens array that is away from the photonic integrated circuit chip;

[0026] The fiber optic connector and the lens body are provided with a matching positioning structure.

[0027] Another objective of this invention is to provide a lens body that can satisfy the requirements of a receiver chip combination for receiving optical signals, a transmitter chip combination for transmitting optical signals, and a hybrid chip combination that can both receive and transmit optical signals.

[0028] To achieve this objective, the embodiments of the present invention adopt the following technical solutions:

[0029] A lens body includes a plurality of optical signal channels arranged sequentially and uniformly at intervals, wherein at least two adjacent optical signal channels constitute a lens array;

[0030] The lens array corresponds to at least one chip assembly to transmit optical signals between the chip assembly and the optical fiber; the number of lens arrays corresponding to different chip assemblies may be the same or different;

[0031] When different chip combinations correspond to the same number of lens arrays, the lens arrays corresponding to different chip combinations may be the same or different;

[0032] The number of optical signal channels and the position of the optical signal channels are different among the different lens arrays.

[0033] The technical solution provided by this invention involves setting an optical module comprising at least one lens body and at least one chip assembly. Each chip assembly corresponds one-to-one with a lens body. Each lens body includes multiple optical signal channels arranged at uniform intervals. At least two adjacent optical signal channels form a lens array. Different lens arrays contain at least one different number of optical signal channels and have different positions. The optical signal path of the chip assembly is aligned with one of the lens arrays of the corresponding lens body. The optical signal is transmitted between the chip assembly and the optical fiber through the lens array. Different chip assemblies may correspond to the same or different numbers of lens arrays. When different chip assemblies correspond to the same number of lens arrays, the lens arrays may be the same or different, allowing lens bodies with the same structure to meet the needs of different chip assemblies. This enables different optical modules to be compatible with different chip assemblies, such as a receiving chip assembly for receiving optical signals, a transmitting chip assembly for transmitting optical signals, or a hybrid chip assembly that can both receive and transmit optical signals, to meet the needs of different scenarios. The photonic integrated circuit chip in the chip assembly can select the corresponding lens array according to the position of the electronic integrated circuit chip to ensure that the connection between the photonic integrated circuit chip and the electronic integrated circuit chip is the shortest and does not cross, thus ensuring that the electrical signal is not interfered with.

[0034] In addition, the technical solution provided by the embodiments of the present invention has a hollow area at the bottom of the lens body, which allows part of the electronic integrated circuit chip to extend from the hollow area to the edge of the lens body. In this way, even if the size of the electronic integrated circuit chip is relatively large, the original lens body can still be used, so that the lens body does not limit the size of the electronic integrated circuit chip. It is compatible with electronic integrated circuit chips of different sizes, thus making the application range wider and more flexible, thereby reducing costs and reducing the size of the optical module package. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figures 1-2 This is a partial structural schematic diagram of a lens body provided in an embodiment of the present invention;

[0037] Figures 3-4 This is a schematic diagram of the structure of a partial optical module provided in an embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of the structure of a lens body provided in an embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the structure of an optical module provided in an embodiment of the present invention.

[0040] In the picture:

[0041] 1. Lens body; 10. Lens array; 11. Optical signal channel; 12. Hollowed-out area;

[0042] 2. Photonic integrated circuit chip; 3. Electronic integrated circuit chip; 4. Electronic component; 5. Fiber optic connector; 6. Fiber optic cable. Detailed Implementation

[0043] Before implementing the embodiments of this application, the inventors conducted a careful study and analysis of optical modules. They discovered that existing optical modules, constrained by the structure of the lens body, not only limit the mounting position of the electronic integrated circuit chip coupled to the photonic integrated circuit chip to avoid interference from cross-wiring between the electronic and photonic integrated circuit chips, but also, when an optical module has multiple photonic integrated circuit chips, only some can be used for receiving optical signals and others for transmitting them, thus failing to meet the needs of more application scenarios.

[0044] Based on this, the inventors of this application attempted to increase the number of optical signal channels, which originally only contained a few matching photonic integrated circuit chips, to cover the entire cross-section of the same latitude, while ensuring the original structural size of the lens body. At least two adjacent optical signal channels can be combined to form a lens array. This eliminates the limitation of the position of a single lens array, allowing different photonic integrated circuit chips to choose suitable lens arrays for matching, without increasing the size of the optical module. This not only enables the mixed placement of two photonic integrated circuit chips capable of receiving and emitting optical signals, but also allows for the placement of two photonic integrated circuit chips that are both receiving or emitting optical signals. Furthermore, the appropriate position of the lens array can be selected according to the position of the electronic integrated circuit chip, minimizing the wiring between the electronic and photonic integrated circuit chips and preventing intersections, thus ensuring that the electrical signals are not interfered with during transmission. The following embodiments are thus derived.

[0045] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0046] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0047] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0048] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0049] This application provides an optical module, which is coupled to an optical fiber 6 at the transmitting end and / or receiving end of an optical communication system. This optical module can convert optical signals into electrical signals. When the optical module is located at the transmitting end, it can convert electrical signals into optical signals, which are then transmitted through the optical fiber 6. When the optical module is located at the receiving end, it can convert the optical signals transmitted through the optical fiber 6 back into electrical signals. Due to its advantages of high bandwidth, high transmission rate, low attenuation, immunity to electromagnetic interference, high information security, and small size and light weight, optical fiber transmission is gradually replacing traditional cable transmission and is widely used in the communications industry, AI industry, and other fields. As an important electro-optical conversion component in optical fiber transmission, the demand for optical modules is gradually increasing. This increase in demand is not only due to increased quantity but also to increasingly diversified functions. For example, high-power, long-distance optical modules are needed for long-distance backbone network transmission; while low-power, miniaturized optical modules are needed for short-distance data center interconnection.

[0050] Optical modules are classified into multimode optical modules and single-mode optical modules according to different application scenarios. Multimode optical modules are often characterized by low cost and suitability for high-speed, short-distance transmission. Because multimode optical modules mostly emphasize low cost, they often use chip-on-board (COB) packaging for their optical and electrical systems.

[0051] In some embodiments of this application, the optical module includes a photonic integrated circuit chip 2 and an electronic integrated circuit chip 3. The electronic integrated circuit chip 3 is mainly responsible for processing electrical signals, capable of performing digital-to-analog conversion on received electrical signals, or analog-to-digital conversion on electrical signals converted from optical signals. For example, when the corresponding circuit in the optical module is the transmitter of an optical communication system, the electronic integrated circuit chip 3 converts high-speed electrical signals from external devices, such as switches, into modulated electrical signals according to a certain encoding method to drive the photonic integrated circuit chip 2 to emit light. The photonic integrated circuit chip 2 can realize the mutual conversion between optical signals and electrical signals. For example, when the corresponding circuit in the optical module is the transmitter of an optical communication system, the photonic integrated circuit chip 2 loads the modulated electrical signal from the electronic integrated circuit chip 3 into a light wave to form an optical signal for transmission; when the corresponding circuit in the optical module is the receiver of an optical communication system, the photonic integrated circuit chip 2 converts the received optical signal into an analog electrical signal. The photonic integrated circuit chip 2 can be a chip with waveguides, modulators, and / or photodetectors, etc., which are not specifically limited in this application. In other words, when the corresponding circuit in the optical module is the transmitter (hereinafter referred to as the transmitter) of an optical communication system, the electronic integrated circuit chip 3 provides a driving signal to the photonic integrated circuit chip 2. The characteristics of the optical signal emitted or received by the photonic integrated circuit chip 2, such as intensity and frequency, are determined by the modulation electrical signal of the electronic integrated circuit chip 3. When the corresponding circuit in the optical module is the receiver (hereinafter referred to as the receiver) of an optical communication system, the photonic integrated circuit chip 2 converts the optical signal into an electrical signal, which is then transmitted to the electronic integrated circuit chip 3 for further processing, such as analog-to-digital conversion. The collaborative work between the photonic integrated circuit chip 2 and the electronic integrated circuit chip 3 enables the mutual conversion between electricity and light, and is a key link in signal conversion in the optical module.

[0052] As is well known, the light emitted by photonic integrated circuit chip 2 is mostly divergent light and cannot directly enter optical fiber 6. Please refer to [reference needed]. Figure 1 As shown, the focusing and collimating properties of a lens can be applied to an optical module to focus divergent light, converging it to a size that matches the numerical aperture of fiber 6, thus enabling more efficient coupling into fiber 6 for transmission. Alternatively, the light entering the photonic integrated circuit chip 2 from fiber 6 can be collimated for better reception by the chip.

[0053] Typically, the lens body used in an optical module is matched with a lens array 10 having the same number of optical signal channels 11 as the photonic integrated circuit chip 2. In response to the demands for bidirectional communication, improved fiber utilization and system integration, as well as reduced cost and efficiency, optical modules typically both receive and transmit optical signals. Therefore, in the photonic integrated circuit chips 2 within the optical module, some chips receive optical signals (hereinafter referred to as receiver chips), while others transmit optical signals (hereinafter referred to as transmitter chips). To minimize costs, lenses are often made of high-transmittance plastics, such as PEI material, allowing all channels to be arranged together and integrally molded into a lens array 10 using injection molding. Please refer to [reference needed]. Figures 3-4 As shown, since the photonic integrated circuit chip 2 needs to be connected to a matching optical signal channel, and the connection between the photonic integrated circuit chip 2 and the electronic integrated circuit chip 3 cannot be too long, because an excessively long connection will cause problems such as signal attenuation, delay, integrity damage, impedance mismatch, and noise coupling with the power line, the structure of the lens array 10 not only restricts the positions of the transmitting chip and the receiving chip, but also restricts the positions of the electronic integrated circuit chip coupled to the receiving chip and the electronic integrated circuit chip coupled to the transmitting chip.

[0054] However, since the lens structures in current dual-chip optical modules all use the aforementioned lens structures, the transmitting and receiving chips can only be placed together, which cannot meet the needs of many application scenarios. For example, in optical communication systems, the transmitting and receiving ends are circuitically separate. If the transmitting and receiving chips are mixed on the optical module or optical engine, signal lines will inevitably cross, adversely affecting performance. If they are placed separately, it will result in excessively long wiring between the electronic integrated circuit chip 3 and the photonic integrated circuit chip 2.

[0055] To solve the above problems, such as Figures 3-6As shown, in some embodiments of this application, the optical module further includes a lens body 1. The lens body 1 includes a plurality of optical signal channels 11 arranged sequentially and uniformly at intervals. At least two adjacent optical signal channels 11 constitute a lens array 10. For example, the lens body 1 includes 20 optical signal channels 11, where the nm-th to n-th optical signal channels 11 can be used as a lens array 10, where 2≤n≤20 and 0≤m≤n-1. The lens array 10 can be arbitrarily combined according to the needs of the photonic integrated circuit chip 2. That is, the number of optical signal channels 11 included in the lens array 10 and the position of the lens array 10 on the lens body 1 depend entirely on the number of optical signal channels 11 required by the photonic integrated circuit chip 2 and the position of the photonic integrated circuit chip 2. Any extra optical signal channels 11 are left idle, thus allowing the lens body 1 to correspond to multiple photonic integrated circuit chips 2, thereby making full use of the idle optical signal channels 11. Multiple photonic integrated circuit chips 2 constitute a chip assembly. Different chip assemblies may correspond to the same or different numbers of lens arrays 10. For example, chip assembly A includes 2 photonic integrated circuit chips 2, and chip assembly B includes 3 photonic integrated circuit chips 2. One photonic integrated circuit chip 2 corresponds to one lens array 10. Therefore, chip assembly A corresponds to 2 lens arrays 10, while chip assembly B corresponds to 3 lens arrays 10. In this case, the number of lens arrays 10 corresponding to chip assembly A and chip assembly B is different. For example, chip assembly A and chip assembly B both include 2 photonic integrated circuit chips 2. Photonic integrated circuit chip A corresponds to 1 lens array 10, and photonic integrated circuit chip B corresponds to 1 lens array 10. In this case, the number of lens arrays 10 corresponding to chip assembly A and chip assembly B is the same. When different chip assemblies correspond to the same number of lens arrays 10, the lens arrays 10 corresponding to different chip assemblies may be the same or different. At least one of the differences lies in the number and position of the optical signal channels 11 contained in the different lens arrays 10.Let's continue with chip combination A and chip combination B as examples. Example 1: Assume that optical module A includes chip combination A, which corresponds to lens body a. Chip combination A includes two receiving chips, corresponding to two lens arrays β of lens body a. Since the receiving chips require 6 optical signal channels 11, lens array β includes 6 optical signal channels 11. These two lens arrays β correspond to the 1st to 6th optical signal channels 11 and the 11th to 16th optical signal channels 11, respectively. Optical module B includes chip combination B, which corresponds to lens body b. Lens body a and lens body b have the same structure. Chip combination B includes two transmitting chips, corresponding to two lens arrays ε of lens body b. Since the transmitting chips require 4 optical signal channels 11, lens array ε includes 4 optical signal channels 11. These two lens arrays ε correspond to the 7th to 10th optical signal channels 11 and the 17th to 20th optical signal channels 11, respectively. At this point, the number and position of the optical signal channels 11 contained in lens array β and lens array ε are different. Therefore, lens array β and lens array ε belong to different lens arrays 10. Example 2: Assume that optical module A includes chip combination A and chip combination B, which correspond to lens body a and lens body b respectively, and lens body a and lens body b have the same structure. Chip combination A includes two receiving chips, corresponding to the two lens arrays β of lens body a. Since the receiving chips require 4 optical signal channels 11, lens array β includes 4 optical signal channels 11. These two lens arrays β correspond to the 1st to 4th optical signal channels 11 and the 11th to 14th optical signal channels 11 respectively. Chip combination B includes two transmitting chips, corresponding to the two lens arrays ε of lens body b. Since the transmitting chips also require 4 optical signal channels 11, lens array ε includes 4 optical signal channels 11. These two lens arrays ε correspond to the 1st to 4th optical signal channels 11 and the 15th to 18th optical signal channels 11 respectively. At this point, lens array β and lens array ε contain the same number of optical signal channels 11, but their positions are different. Therefore, lens array β and lens array ε belong to different lens arrays 10. It is important to note that if lens array β and lens array ε contain different numbers of optical signal channels 11, then their positions will inevitably be different, making lens array B and lens array ε different arrays. This way, chip combinations are not limited to the structure of a single lens array 10, and can meet diverse needs.

[0056] It should be noted that even if the chip combination corresponds to multiple lens arrays 10, there are still some optical signal channels 11 that are idle, so as to ensure that each photonic integrated circuit chip 2 constituting the optical chip combination can select a suitable lens array 10.

[0057] In some embodiments of this application, the chip assembly includes at least two photonic integrated circuit chips. Different photonic integrated circuit chips may have the same or different functions for receiving or transmitting optical signals. For example, optical module A includes chip assembly A, which includes at least two receiver chips; therefore, optical module A is a receiver optical module that can only receive optical signals. Optical module B includes chip assembly B, which includes at least two transmitter chips; therefore, optical module B is a transmitter optical module that can only transmit optical signals. Optical module C includes chip assembly C, which includes at least two photonic integrated circuit chips 2, where some photonic integrated circuit chips 2 are transmitter chips and others are receiver chips; in this case, optical module C can both transmit and receive optical signals. Optical module D includes a chipset. The optical module D consists of a combination of D1 and a chip assembly D2. Chip assembly D1 includes at least two transmitting chips, and chip assembly D2 includes at least two receiving chips. In this configuration, the optical module D can both transmit and receive optical signals. It also has two identical lens bodies 1, namely lens body D1 and lens body D2. Chip assembly D1 corresponds to lens body D1, and chip assembly D2 corresponds to lens body D2. Since the structures of the multiple photonic integrated circuit chips 2 constituting chip assembly D1 and chip assembly D2 are different, the lens arrays 10 on lens bodies D1 and D2 are different. Because the multiple photonic integrated circuit chips 2 constituting the chip assembly can be of different models, even if the chip assembly can only receive or transmit optical signals, it can still be compatible with different models of receiving or transmitting chips. Different models of photonic integrated circuit chips 2 correspond to different numbers of optical signal channels 11 forming the lens array 10. This allows the lens body of this embodiment to be configured in various ways, not only reducing the cost of the optical module but also enabling the optical module to be compatible with different chip assemblies.

[0058] In addition, to avoid excessively long or uneven wiring, the position of the photonic integrated circuit chip 2 needs to match the wiring position of the electronic integrated circuit chip 3. In some cases, the pins connecting the electronic integrated circuit chip 3 and the photonic integrated circuit chip 2 are set at a distance from the center of the substrate. The photonic integrated circuit chip 2 can be matched with the lens array 10 which is far away from the wiring position of the electronic integrated circuit chip 3. This ensures that the length of the wiring between the photonic integrated circuit chip 2 and the electronic integrated circuit chip 3 is kept to a minimum, ensuring good signal transmission, as well as the stability and integrity of signal transmission.

[0059] In some embodiments of this application, such as Figures 4-5As shown, multiple optical signal channels 11 cover the same cross-section of the entire lens body 1. Therefore, during manufacturing, several more optical signal channels 11 can be added to the existing injection mold, resulting in low modification costs. Furthermore, this can be achieved without changing the volume of the original lens body 1, ensuring that the size of the optical module does not increase.

[0060] It should be noted that the lens body 1 includes not only the lens array 10 itself but also the carrier of the lens array 10. Therefore, the lens body 1 is a whole with length, width, and height. The solution of this application embodiment has more lens arrays 10 without changing the original volume of the lens body 1.

[0061] Understandably, the original optical module is constrained by the structure of the lens body 1, meaning the electronic integrated circuit chip 3 can only be located within the size range of the lens body 1. This results in a situation where large-size electronic integrated circuit chip 3 and small-size electronic integrated circuit chip 3 cannot share the same lens body 1. Therefore, to solve this problem, such as... Figures 4-5 As shown, in some embodiments of this application, the bottom of the lens body 1 is provided with a hollow area 12. That is, multiple support feet are spaced apart on the circumference of the bottom of the lens body 1 to create space between the lens body 1 and the COB. This space is the hollow area 12, and the support feet are integrally injection molded by the lens body 1 during injection molding. There can be three support feet or one at each of the four corners of the lens body 1, as long as the requirements of the hollow area 12 are met. This application does not make specific limitations. Under this premise, a part of the electronic integrated circuit chip 3 of this application can extend from the hollow area 12 to the edge of the lens body 1. In this way, even if the size of the electronic integrated circuit chip 3 is relatively large, the original lens body 1 can still be used, so that the lens body 1 does not limit the size of the electronic integrated circuit chip 3. Electronic integrated circuit chips of different sizes can be compatible, thereby expanding the application range and making it more flexible, thereby reducing costs and reducing the size of the optical module package.

[0062] In addition, such as Figure 6 As shown, the optical module also includes other electronic components 4 to achieve different functional requirements. Since the lens body 1 has a cutout area 12, the electronic components 4 can be mounted on the COB at the cutout area 12 to further reduce the size of the optical module package.

[0063] In some embodiments of this application, such as Figure 6As shown, the optical module also includes a fiber optic connector 5, which is aligned with the side of the lens array 10 facing away from the photonic integrated circuit chip 2. A matching positioning structure is provided between the fiber optic connector 5 and the lens body 1. This ensures precise alignment of the fiber optic cable 6 with the lens body 1 while reducing installation difficulty. The positioning structure can be a combination of positioning posts and positioning holes. Alternatively, the fiber optic connector 5 may have positioning posts, while the lens body 1 may have positioning holes located on the side of the lens array 10 facing away from the photonic integrated circuit chip 2, with positioning holes at both ends. Another option is that the fiber optic connector 5 has positioning holes, while the lens body 1 has positioning posts located on the side of the lens array 10 facing away from the photonic integrated circuit chip 2, with positioning posts at both ends. As long as precise alignment of the fiber optic cable 6 with the lens body 1 is achieved, this application does not impose specific limitations.

[0064] In some embodiments of this application, the optical module may include one chip assembly, or two or more chip assemblies. Each chip assembly corresponds to a lens body 1. Therefore, the optical module includes at least one lens body 1. The optical signal path of the chip assembly is aligned with one of the lens arrays corresponding to the lens body, and the optical signal is transmitted between the chip assembly and the optical fiber through the lens array. For example, optical module A includes chip assemblies A1, A2, A3, and A4. The lens array corresponding to each chip assembly contains 8 optical signal channels 11. That is, chip assemblies A1, A2, A3, and A4 each have 8 channels. Chip assemblies A and A2 are receiving chips, and chip assemblies A3 and A4 are transmitting chips. Thus, optical module A can accommodate 16 optical channels, of which 8 channels are receiving channels and the other 8 channels are transmitting channels. Optical module B includes chip combination B1 and chip combination B2. Each chip combination corresponds to a lens array containing 8 optical signal channels 11. Chip combination B1 is the receiving chip, and chip combination B2 is the transmitting chip. Therefore, optical module B can accommodate 8 optical channels, of which 4 channels are receiving channels and the other 4 channels are transmitting channels. The above is just an example. In practice, the number of chip combinations included in an optical module is not limited to 4 or 2, as long as it can be accommodated on the printed circuit board. This application does not make a specific limitation on the number of chip combinations. Multiple chip combinations included in the optical module can simultaneously be chip combinations for receiving optical signals, or chip combinations for transmitting optical signals, or some chip combinations can be chip combinations for receiving optical signals and others for transmitting optical signals. By setting the optical module to include multiple chip combinations, it is possible to achieve compatibility with signal data transmission with different numbers of channels on the same printed circuit board and other structural components to meet various application scenarios with different rates.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical module, characterized in that, include: At least one lens body, the lens body comprising a plurality of optical signal channels arranged sequentially and uniformly at intervals, wherein at least two adjacent optical signal channels constitute a lens array; as well as At least one chip assembly, which corresponds one-to-one with the lens body, and the optical signal path of the chip assembly is aligned with one of the lens arrays corresponding to the lens body, so that the optical signal is transmitted between the chip assembly and the optical fiber through the lens array; The number of lens arrays corresponding to different chip combinations can be the same or different; When different chip combinations correspond to the same number of lens arrays, the lens arrays corresponding to different chip combinations may be the same or different; The number of optical signal channels and the position of the optical signal channels are different among the different lens arrays.

2. The optical module according to claim 1, characterized in that, Also includes: The chip assembly includes at least two photonic integrated circuit chips; Different photonic integrated circuit chips may have the same or different functions in receiving or transmitting optical signals.

3. The optical module according to claim 2, characterized in that, Different photonic integrated circuit chips correspond to different lens arrays.

4. The optical module according to claim 2, characterized in that, The chip assembly also includes: The electronic integrated circuit chip is coupled to the photonic integrated circuit chip in a one-to-one correspondence; The photonic integrated circuit chip is matched to the lens array according to the position of the electronic integrated circuit chip.

5. The optical module according to claim 1, characterized in that, Multiple optical signal channels are distributed across the same cross-section of the lens body.

6. The optical module according to any one of claims 1 to 5, characterized in that, The bottom of the lens body has a hollowed-out area.

7. The optical module according to claim 6, characterized in that, A portion of the electronic integrated circuit chip may extend from the hollowed-out area beyond the edge of the lens body.

8. The optical module according to claim 6, characterized in that, Also includes: Multiple electronic components with the same or different functions; The electronic components can be disposed in the hollowed-out area.

9. The optical module according to any one of claims 1 to 5, characterized in that, Also includes: The fiber optic connector is aligned with the side of the lens array opposite to the chip assembly; The fiber optic connector and the lens body are provided with a matching positioning structure.

10. A lens body, characterized in that, It includes multiple optical signal channels arranged at uniform intervals in sequence, and at least two adjacent optical signal channels constitute a lens array; The lens array corresponds to at least one chip to transmit optical signals between the chip assembly and the optical fiber. The number of lens arrays corresponding to different chip combinations can be the same or different; When different chip combinations correspond to the same number of lens arrays, the lens arrays corresponding to different chip combinations may be the same or different; The number of optical signal channels and the position of the optical signal channels are different among the different lens arrays.

Images