Wafer-based detection focusing method, device, equipment and product

Abstract

The application discloses a wafer detection-based focusing method, device, equipment and product, relates to the technical field of semiconductor wafer detection, and the method comprises the following steps: when it is detected that a to-be-detected wafer reaches an imaging position, emitting a point laser to the to-be-detected wafer through a test light path built in advance to obtain an imaging light beam; collecting a light spot image corresponding to the imaging light beam through a double-imaging camera, and calculating a light spot area through the light spot image; calculating an out-of-focus amount of the to-be-detected wafer according to the light spot area, moving the to-be-detected wafer for focusing according to the out-of-focus amount, and obtaining a focusing result. Therefore, the problem that the existing focusing mode needs to be repeatedly scanned, thereby being low in efficiency and failing to meet the requirement of accurate and rapid focusing of wafer microlenses is solved, and the efficiency of wafer detection-based focusing is improved.

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