Heat dissipation system and server

Abstract

The application provides a heat dissipation system and a server, relates to the technical field of cooling and heat dissipation, and relates to a heat dissipation system. The heat dissipation system comprises a frame, a first cold plate, a second cold plate and a liquid leakage flow guide assembly installed in the frame. The first cold plate and the second cold plate are interconnected through an adapter pipe group. The liquid leakage flow guide assembly comprises a first flow guide groove and a second flow guide groove. The first flow guide groove is installed at the connection end of the adapter pipe group and the first cold plate. The second flow guide groove is installed at the connection end of the adapter pipe group and the second cold plate. The first flow guide groove and the second flow guide groove are connected to form a flow guide channel. The flow guide channel is connected with a drainage groove. The drainage groove is arranged along the side wall of the frame and extends to the outside of the frame. The application can avoid the problem of liquid leakage accumulation of the heat dissipation system and improve the reliability of the heat dissipation system.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a heat dissipation system and a server. Background Technology

[0002] The existing discrete cold plate architecture assigns each functional chip to an independent cold plate or heat sink, with the cold plates connected in series via hoses or threaded connectors. This results in high flow resistance coefficients for the coolant, long and dispersed heat conduction paths, and low heat exchange efficiency. Due to the complexity and large number of pipes arranged between the cold plates, if a leak occurs, a specific drainage hole needs to be made for each pipe on the bottom wall of the chassis. However, the area of ​​the drainage hole is limited, which limits the amount of leaked liquid that can be drained, leading to leakage accumulation and affecting the safety of server operation. Summary of the Invention

[0003] The purpose of this application is to solve the aforementioned technical problems by providing a heat dissipation system and a server, thereby avoiding the problem of liquid leakage and accumulation in the heat dissipation system and improving its reliability. To achieve the above objective, the technical solution of this application is as follows: In a first aspect, this application provides a heat dissipation system, including a frame, a first cold plate and a second cold plate installed within the frame, and a leakage guiding assembly. The first cold plate and the second cold plate are interconnected via a transfer pipe assembly. The leakage guiding assembly includes a first guide channel and a second guide channel. The first guide channel is installed at the connection end between the transfer pipe assembly and the first cold plate, and the second guide channel is installed at the connection end between the transfer pipe assembly and the second cold plate. The first guide channel and the second guide channel are connected to form a guiding channel. The guiding channel is connected to a drainage channel, which is arranged along the side wall of the frame and extends to the outside of the frame.

[0004] Secondly, this application provides a server, including a chassis and at least one of the above-mentioned heat dissipation systems disposed within the chassis.

[0005] Compared with existing technologies, the advantages of the heat dissipation system and server in this application are mainly reflected in: By setting a first drainage channel to guide leakage at the connection end between the transfer pipe assembly and the first cold plate, and a second drainage channel to guide leakage at the connection end between the transfer pipe assembly and the second cold plate, the leakage is guided to the support groove by a partition bracket. The partition bracket is set between the first and second cold plates, and the end of the partition bracket can be effectively assembled to the side wall of the frame, thereby providing stable support for the support groove. The drainage channel is connected to the support groove, and the leakage in the support groove is discharged along the side wall of the frame through the drainage channel. This avoids the traditional method of opening multiple drainage holes on the bottom wall of the chassis. In this application, the drainage channel does not need to occupy a large internal space and can be directly attached to the side wall of the frame. It specifically addresses the location where leakage may occur during the assembly of the transfer pipe assembly. The heat dissipation system greatly reduces the arrangement path of the liquid cooling pipes exposed outside the plate, provides a designable space for the effective collection of leakage at the installation position of the transfer pipe assembly, avoids leakage accumulation inside the server chassis, and improves the operational safety of the server. Attached Figure Description

[0006] Figure 1 This is a disassembly diagram of a heat dissipation system provided in Embodiment 1 of this application; Figure 2 for Figure 1 The diagram shows the first cold plate, the second cold plate, and the partition bracket in one embodiment. Figure 3 for Figure 1 The frame shown is a structural schematic diagram of one embodiment; Figure 4 for Figure 1 The diagram shows the structure of the first cold plate and the second cold plate in one embodiment. Figure 5 for Figure 1 The first plate shown is a structural schematic diagram of one embodiment; Figure 6 for Figure 1 The diagram shows the flow of the cooling medium in one embodiment of the heat dissipation system. Figure 7 for Figure 5 The first cold plate shown is a cross-sectional schematic diagram of AA in one embodiment; Figure 8 for Figure 5 The second cold plate shown is a cross-sectional schematic diagram of BB in one embodiment; Figure 9 for Figure 1 The diagram shows a disassembly of the first cold plate and the first module assembly in one embodiment. Figure 10 for Figure 1 The diagram shows a disassembly of the second cold plate and the second module assembly in one embodiment. Figure 11 for Figure 10 The diagram shows a disassembly of the OCP module in one embodiment. Figure 12 for Figure 10 The diagram shown is a disassembled schematic of the E1.S module in one embodiment. Figure 13 for Figure 10 The diagram shows a disassembly of the second cold plate and OCM module in one embodiment. Figure 14 for Figure 10 The diagram shown illustrates the structure of the memory component in one embodiment. Figure 15 for Figure 1 The diagram shows a partial schematic of one embodiment of the leakage diversion assembly. Figure 16 for Figure 15 The diagram shown is a structural schematic of one embodiment of the partition bracket; Figure 17 for Figure 15 The diagram shows the drainage channel and chassis in one embodiment. Figure 18 This is a schematic diagram of the cooling medium flow in another heat dissipation system provided in Embodiment 2 of this application; Figure 19 for Figure 18 The diagram shows a cross-sectional view of the liquid-dispensing cooling channel in one embodiment.

[0007] Figure label: First cold plate 1, main liquid cooling channel 11, first branch liquid cooling cavity 12, main liquid inlet layer 13, main reflux layer 14, upper branch layer 15, lower branch layer 16, first plate body 17, first fin structure 18; Second cold plate 2, second branch liquid cooling cavity 21, second branch channel 22, branch sub-cavity 23, boss assembly 24, first boss 25, second boss 26, second plate 27, inclined surface 28, second fin structure 29. Transfer pipe assembly 3, liquid inlet pipe 31, liquid outlet pipe 32, first mounting base 33, second mounting base 34; Liquid inlet channel 41, reflux channel 42, liquid inlet 43, liquid outlet 44, first branch channel 45, branch slot 46, side slot 47, limiting slot 48; Heat dissipation section 5, upper heat dissipation plate 51, lower heat dissipation plate 52, third boss 53, mounting groove 54, positioning post 55, limiting post 56, connecting contact point 57, memory connector 58; First module component 61, upper layer OAM module 62, lower layer OAM module 63, OAM tray 631, general baseband board 632, second module component 64, OCM module 65, CPU module 651, OCM motherboard 652, memory component 653, NIC module 66, OCP module 67, E1.S module 68, thermal conductive layer 69; 7. Fixing bracket, 71. Heat-conducting end, 72. Cooling plate, 73. Cooling tank, 74. Heat-conducting copper pipe, 75. External port, 76. Horizontal upper layer memory, 77. Horizontal lower layer memory, 78. Heat-conducting plate, 79. Flange; Frame 8, first guide channel 81, second guide channel 82, partition bracket 83, bracket groove 84, diversion channel 85, diversion hole 86, collection box 87, support plate 88; Liquid cooling channel 9, liquid inlet layer 91, liquid return layer 92, chassis 93. Detailed Implementation

[0008] To make the technical solutions and advantages of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0009] This application provides a heat dissipation system, which is not limited to server heat dissipation, but can also be applied to other fields with heat source heat dissipation requirements, such as vehicle control systems. This embodiment is illustrated using a server as an example, where the heat dissipation system is installed in the server.

[0010] In related technologies, with the increasing demand for large-scale and multimodal AI computing power, the power consumption of a single AI chip has exceeded 2000W, and the power density of a single rack is moving towards the hundreds of kilowatts or even megawatts. When the power of a single rack is 60kW, traditional air-cooling systems can no longer support heat dissipation. When the power density rises to over 200kW, traditional liquid cooling solutions based on air-cooling architecture modifications will reach physical limits, easily causing chip thermal throttling issues. In the existing discrete cold plate architecture, each functional chip corresponds to an independent cold plate or heat sink, resulting in dispersed heat dissipation paths and low system integration. The cold plates are connected in series via flexible hoses and threaded joints, resulting in high flow resistance coefficients, long heat conduction paths, and low heat exchange efficiency. Furthermore, functional expansion modules typically rely on independent air-cooled heat sinks, which are isolated from the motherboard liquid cooling circuit, leading to prominent local heat accumulation issues in the compact space layout. At the same time, the discrete cold plate architecture also suffers from insufficient reliability of the liquid cooling path. Due to the large number of flexible hoses and threaded joints, there is a risk of joint fatigue loosening and hose aging and leakage under long-term vibration environments. In the confined space of servers, the anti-leakage design is inadequate. Therefore, this application designs a heat dissipation system to solve the above-mentioned technical problems, which will be described in detail below. For ease of description, the width direction of the heat dissipation system is defined as the first direction, the length direction as the second direction, and the height direction as the third direction. Figure 6 , Figure 7 The middle arrow indicates the flow direction of the cooling medium. Figure 9 , Figure 10 The middle arrow indicates the direction of heat transfer.

[0011] like Figures 1-6As shown, the heat dissipation system includes a first cold plate 1 and a second cold plate 2. Both the first cold plate 1 and the second cold plate 2 are configured to contact the heat source, and both the first cold plate 1 and the second cold plate 2 can contact the heat source on one side or both sides. The first cold plate 1 includes a first plate body 17, a main liquid cooling channel 11 disposed in the first plate body 17, and at least one first branch liquid cooling cavity 12. In this embodiment, multiple first branch liquid cooling cavities 12 are used as an example. The main liquid cooling channel 11 is divided into a main liquid inlet layer 13 and a main reflux layer 14. Each first branch liquid cooling cavity 12 is connected to the main liquid inlet layer 13 and the main reflux layer 14 respectively. A transfer pipe assembly 3 is provided between the first cold plate 1 and the second cold plate 2. The second cold plate 2 includes a second plate body 27 and at least one second branch liquid cooling cavity 21 disposed in the second plate body 27. In this embodiment, one second branch liquid cooling cavity 21 is used as an example. The second branch liquid cooling cavity 21 is connected to the main liquid inlet layer 13 and the main reflux layer 14 respectively through the transfer pipe assembly 3. The cooling medium circulates in the heat dissipation system. The cooling medium flows from the main liquid inlet layer 13 of the main liquid cooling channel 11 through multiple first branch liquid cooling chambers 12. After heat exchange in the first branch liquid cooling chambers 12, the cooling medium is discharged from the main return layer 14. After entering the main liquid inlet layer 13, the cooling medium flows through the transfer pipe assembly 3 and then through the second branch liquid cooling chamber 21. After heat exchange in the second branch liquid cooling chamber 21, the cooling medium flows back from the transfer pipe assembly 3 to the main return layer 14 and is discharged again.

[0012] like Figure 1 , Figure 3 As shown, the heat dissipation system also includes a frame 8, in which the first cold plate 1 and the second cold plate 2 are both housed, facilitating the assembly of the entire system within the server chassis 93 and improving assembly convenience. The frame 8 has a roughly groove-like structure, used to support the second cold plate 2 and for embedding the first cold plate 1 during assembly.

[0013] This embodiment, by setting a first cold plate 1 and a second cold plate 2, can achieve multi-faceted contact with the heat source, integrating the heat source onto the first cold plate 1 and the second cold plate 2 to achieve sufficient heat dissipation; at least one first branch liquid cooling cavity 12 is connected to the main liquid cooling channel 11, and at least one second branch liquid cooling cavity 21 is connected to the main liquid cooling channel 11 via a transfer pipe assembly 3, allowing the cooling medium to be distributed within the main liquid cooling channel 11, thereby enabling the first cold plate 1 and the second cold plate 2 to share the main liquid cooling channel 11, and the main liquid cooling channel 11 and the first branch liquid cooling cavity 12 to be integrated into one cold plate, while the second branch... The liquid cooling cavity 21 can be set in another cold plate, which greatly reduces the complexity and length of the wiring of the connecting pipes. Both the first cold plate 1 and the second cold plate 2 can cool multiple heat source areas. The heat dissipation path is concentrated, the heat dissipation system has a high degree of integration, the heat conduction path is shortened, the flow resistance coefficient is low, and thus the heat exchange efficiency is high. Since the heat dissipation path between the first cold plate 1 and the second cold plate 2 is shortened, it can be adapted to the heat dissipation of heat source components with close proximity, meet the functional connection requirements of heat source components, improve the reliability of the path design, and avoid the problem of local heat accumulation.

[0014] For example, both the first cold plate 1 and the second cold plate 2 have a generally rectangular plate structure. Depending on the manufacturing process and assembly steps, the main liquid cooling channel 11 and the first branch liquid cooling cavity 12 can be integrated or formed on the first cold plate 1. Correspondingly, the second branch liquid cooling cavity 21 can also be formed on the second cold plate 2. For example, the second cold plate 2 is composed of two plates, which enclose the second branch liquid cooling cavity 21. The first cold plate 1 can also be composed of two plates, which enclose the main liquid cooling channel 11 and the first branch liquid cooling cavity 12. The thickness direction of the first cold plate 1 and the second cold plate 2 is the third direction. The upper surface of the first cold plate 1 faces upward along the third direction, and the lower surface of the first cold plate 1 faces downward along the third direction. Hereafter, "upper surface" and "lower surface" refer to the surfaces of the corresponding components facing each other along the third direction.

[0015] In some implementations, such as Figure 1 , Figure 2 As shown, the first cold plate 1 and the second cold plate 2 are arranged in the same straight line or in a relatively parallel arrangement. Multiple first branch liquid cooling cavities 12 are connected to the same side of the main liquid cooling channel 11, and the second branch liquid cooling cavity 21 is connected to the other side of the main liquid cooling channel 11 through the adapter pipe assembly 3.

[0016] Specifically, such as Figures 4-6 , Figure 7As shown, this embodiment uses the first module component 61 and the second module component 64 as heat sources for illustration. The first cold plate 1 and the second cold plate 2 can be arranged side by side and aligned. Any surface or opposite surface of the first cold plate 1 is configured to be connected to the first module component 61 for heat dissipation of the first module component 61. The heat dissipation system is applied in the server chassis 93. The first module component 61 includes a functional expansion module, such as an Open Accelerator Module (OAM). Two OAM modules are respectively disposed on the upper and lower surfaces of the first cold plate 1 to achieve effective heat dissipation of the first module component 61.

[0017] like Figures 4-6 , Figure 8 , Figure 10 As shown, any surface or opposite surface of the second cold plate 2 is configured to be connected to the second module assembly 64 for heat dissipation of the second module assembly 64; the second module assembly 64 includes functional expansion modules, such as optical communication modules (OCM, Optical Channel Monitor) and network interface cards (NICs). The OCM module 65 is disposed on the lower surface of the second cold plate 2, and the NIC module 66 is disposed on the upper surface of the second cold plate 2, thereby achieving effective heat dissipation of the second module assembly 64.

[0018] The first branch liquid cooling cavity 12 and the second branch liquid cooling cavity 21 are respectively arranged at both ends of the main liquid cooling channel 11 along the second direction. The adapter pipe assembly 3 is connected to the middle of the main liquid cooling channel 11. After the cooling medium is introduced into the main liquid cooling channel 11, it can be evenly distributed to the first branch liquid cooling cavity 12 and the second branch liquid cooling cavity 21 to ensure the flow rate and pressure of the cooling medium entering the second branch liquid cooling cavity 21. At the same time, the first branch liquid cooling cavity 12 and the second branch liquid cooling cavity 21 are located on both sides of the main liquid cooling channel 11, which is conducive to the side connection of the second cold plate 2 to the first cold plate 1, meeting the space arrangement requirements of various module components in the server chassis 93.

[0019] In some implementations, such as Figure 5 , Figure 7 As shown, the first cold plate 1 has a liquid inlet channel 41 and a return channel 42 at both ends, and the main liquid inlet layer 13 and the main return layer 14 are stacked. The main liquid cooling channel 11 is located between the liquid inlet channel 41 and the return channel 42. The main liquid inlet layer 13 is connected to the liquid inlet channel 41, and the main return layer 14 is connected to the return channel 42. The liquid inlet channel 41 has a liquid inlet 43, and the return channel 42 has a liquid outlet 44.

[0020] For example, both the inlet channel 41 and the return channel 42 are formed in the first cold plate 1. For instance, the first cold plate 1 is composed of two plates that enclose the inlet channel 41 and the return channel 42. The inlet channel 41 and the return channel 42 are located at both ends of the first cold plate 1 along the first direction. The inlet port 43 and the outlet port 44 are both extended to the rear window of the chassis 93 through pipes. The inlet port 43 and the outlet port 44 are connected to a coolant distribution unit (not shown in the figure) for circulating the cooling medium, so that the cooling medium can circulate in the main liquid cooling channel 11 and circulate out of the first cold plate 1 after absorbing heat. The main liquid cooling channel 11 has a generally rectangular structure, with its two ends along the first direction close to the two ends of the first cold plate 1 along the first direction, so that the main liquid cooling channel 11 has a large flow guiding volume in the first cold plate 1, ensuring the flow rate of the cooling medium circulating to the multiple first branch liquid cooling chambers 12.

[0021] In some implementations, such as Figure 2 , Figure 7 As shown, the first branch liquid cooling cavity 12 includes an upper branch layer 15 and a lower branch layer 16. The upper branch layer 15 and the lower branch layer 16 are stacked and interconnected. A first branch channel 45 is provided between the first branch liquid cooling cavity 12 and the main liquid cooling channel 11. The upper branch layer 15 is connected to the main liquid inlet layer 13 through a first branch channel 45, and the lower branch layer 16 is connected to the main return layer 14 through another first branch channel 45.

[0022] Specifically, the upper branch layer 15 is located above the lower branch layer 16 along the third direction. The cooling medium circulates in a U-shaped path within the first branch liquid cooling cavity 12. For example, the inlet of the upper branch layer 15 and the outlet of the lower branch layer 16 are both located on the side of the first branch liquid cooling cavity 12 facing the main liquid cooling channel 11, i.e., one end along the second direction. The outlet of the upper branch layer 15 is connected to the inlet of the lower branch layer 16. The cooling medium circulates from top to bottom in the upper branch layer 15 and the lower branch layer 16, effectively absorbing the heat from the heat source in contact with the first branch liquid cooling cavity 12.

[0023] The first branch liquid cooling cavity 12 is provided with a first fin structure 18. The fin spacing of the first fin structure 18 is 0.2mm-0.4mm, the fin height of the first fin structure 18 is 6mm-8mm, and the fin thickness of the first fin structure 18 is 0.2mm-0.4mm, which is the distance between the fins along the first direction. A cooling medium passage is formed between adjacent fins, and the flow direction of the cooling medium is consistent with the arrangement direction of the passage.

[0024] In some implementations, such as Figure 2 , Figure 5 As shown, the first cold plate 1 is provided with a heat dissipation part 5, which is connected to the side of the first branch liquid cooling cavity 12 away from the main liquid cooling channel 11, and / or connected to the first branch channel 45.

[0025] Since the heat dissipation unit 5 can be set at the intersection of the upper branch layer 15 and the lower branch layer 16, the heat dissipation unit 5 can effectively even out the temperature on the side of the first branch liquid cooling cavity 12 away from the main liquid cooling channel 11. Since the heat dissipation unit 5 can be set on the two first branch channels 45, it can also effectively even out the temperature of the first branch channels 45, that is, even out the temperature of the inlet and outlet of the first branch liquid cooling cavity 12, so that the cooling medium has a uniform temperature when circulating to the first branch liquid cooling cavity 12, avoiding the problem of local overcooling or overheating.

[0026] For example, the heat dissipation section 5 includes an upper heat dissipation plate 51 and a lower heat dissipation plate 52 stacked together. The upper heat dissipation plate 51 and the lower heat dissipation plate 52 are arranged to clamp the first branch liquid cooling cavity 12 relative to each other, and / or to clamp the first branch channel 45 relative to each other.

[0027] The upper heat sink 51 is located above the lower heat sink 52 along a third direction. The upper heat sink 51 and the lower heat sink 52 clamp one end of the first branch liquid cooling cavity 12 along a second direction, connecting multiple first branch liquid cooling cavities 12 in series to balance the overall temperature of the first cold plate 1. The clamping manner of the upper heat sink 51 and the lower heat sink 52 ensures stable heat conduction by contacting the first branch liquid cooling cavity 12 and / or the first branch channel 45.

[0028] In some implementations, such as Figure 2 , Figure 5 As shown, the first cold plate 1 also includes a first plate body 17. The first plate body 17 has multiple branch slots 46 and side slots 47. The multiple branch slots 46 and side slots 47 are connected and arranged in communication. The side slots 47 are located at the edge of the first plate body 17 and are connected to the edge of the first plate body 17. The main liquid cooling channel 11 is embedded in the side slot 47 and connected to the first plate body 17. The first branch liquid cooling cavity 12 is embedded in the branch slot 46 and connected to the first plate body 17.

[0029] The first plate 17 is used to support the main liquid cooling channel 11 and multiple first branch liquid cooling cavities 12. The circumferential direction of the main liquid cooling channel 11 is connected to the upper surface of the first plate 17. The two ends of the first branch liquid cooling cavities 12 along the first direction are respectively connected to the upper surface of the first plate 17. The above connection methods can be screwed, snap-fit, etc. The assembly of the main liquid cooling channel 11 and multiple first branch liquid cooling cavities 12 into the first plate 17 is simple and reduces the space occupied above and below the first plate 17, providing sufficient installation space for the first module assembly 61. The main liquid cooling channel 11 and multiple first branch liquid cooling cavities 12 are embedded in the first plate 17, which is fixed and stable, and the first plate 17 achieves efficient heat absorption.

[0030] The main liquid cooling channel 11 is partially embedded in the side slot 47 and partially exposed at the edge of the first plate 17, so that the transfer pipe assembly 3 can be connected to the middle of the main liquid cooling channel 11, providing space for the arrangement of the transfer pipe assembly 3.

[0031] For example, the ends of multiple branch slots 46 opposite to the side slots 47 are interconnected, the heat dissipation part 5 is embedded in the branch slots 46 and abuts against the slot wall of the branch slots 46, the heat dissipation part 5 is connected in series with multiple first branch liquid cooling cavities 12 and / or connected to the two first branch channels 45 corresponding to each first branch liquid cooling cavity 12.

[0032] The upper surface of the first plate 17 is provided with a limiting groove 48. The limiting groove 48 is located between the side slot 47 and the branch slot 46, and / or located at the end of the branch slot 46 away from the side slot 47. The distance of the limiting groove 48 along the first direction is adapted to the distance of the heat dissipation part 5 along the first direction. The two ends of the heat dissipation part 5 along the second direction overlap in the limiting groove 48. The upper surface of the heat dissipation part 5 and the upper surface of the first plate 17 can be flush to ensure the stability of the heat dissipation part 5 installation, while not occupying the upper space of the first plate 17.

[0033] In some implementations, such as Figure 2 , Figure 7 As shown, a third boss 53 is provided on any surface or opposite surface of the first branch liquid cooling cavity 12, and the first module assembly 61 abuts against the third boss 53.

[0034] The area of ​​the third protrusion 53 is adapted to the surface area of ​​the first branch liquid cooling cavity 12. The third protrusion 53 and the first module assembly 61 are in contact to achieve heat transfer. The cooling medium in the first branch liquid cooling cavity 12 effectively absorbs the heat from the first module assembly 61.

[0035] Since there are multiple first branch liquid cooling cavities 12, the third boss 53 can be selectively set with a corresponding height, with a tolerance of ±0.03mm, so that the third boss 53 can abut against the corresponding module in the first module assembly 61, and the contact surface between the third boss 53 and the first module assembly 61 is a plane.

[0036] For example, such as Figure 1 , Figure 9As shown, the first module assembly 61 includes an upper OAM module 62 and a lower OAM module 63. The upper OAM module 62 is mounted on the upper surface of the first cold plate 1, and the lower OAM module 63 is mounted upside down on the lower surface of the first cold plate 1. The upper OAM module 62 and the lower OAM module 63 have roughly the same structure, both including an OAM tray 631, a circuit board, and an OAM module arranged in sequence. The circuit board is, for example, a universal baseband board 632 (UBB). The OAM module is plugged into the UBB and mounted on the OAM tray 631. Four OAM modules can be set on the UBB. The first module assembly 61 contains eight OAM modules, making full use of the height installation space of the first module assembly 61 to achieve high-density OAM module integration. The OAM module abuts against the third protrusion 53 on the corresponding first branch liquid cooling cavity 12. The first cold plate 1 is embedded between the opposite side walls of the frame 8. The OAM tray 631 is fixed to the bottom wall of the frame 8 by screws or other means.

[0037] The first cold plate 1 can be made of aluminum alloy, and its internal channels are made of oxygen-free copper or copper-aluminum composite material. Various high-power chips on the OAM module, such as GPU Die / ASIC Die, VR modules (VR, Virtual Reality Chip), etc., have a heat flux density ≥100W / cm³. 2 The third protrusion 53 contacts the OAM module through a thermally conductive silicone grease interface material, ensuring a low interface thermal resistance of <0.05℃·cm. 2 / W. The third protrusion 53 is respectively disposed on the upper and lower surfaces of the first branch liquid cooling cavity 12, which can realize the dual-layer heat dissipation requirements.

[0038] In some implementations, such as Figure 2 , Figure 6 , Figure 8 As shown, multiple second branch channels 22 are arranged at both ends of the second branch liquid cooling cavity 21 along the first direction in the second cold plate 2. The second branch liquid cooling cavity 21 is divided into adjacent branch sub-cavities 23. One end of each of the two branch sub-cavities 23 is connected to the transfer pipe assembly 3 through two second branch channels 22, so that one branch sub-cavity 23 is connected to the main liquid inlet layer 13 and the other branch sub-cavity 23 is connected to the main return layer 14. The other ends of the two branch sub-cavities 23 are interconnected through a second branch channel 22.

[0039] The transfer pipe assembly 3 includes a liquid inlet pipe 31 and a liquid outlet pipe 32. The cooling medium of the main liquid inlet layer 13 is transferred to a branch sub-cavity 23 through the liquid inlet pipe 31, and then flows back to another branch sub-cavity 23 through part of the second branch channel 22. The cooling medium undergoes heat transfer in the second branch liquid cooling cavity 21, and finally flows back to the main return layer 14 through the liquid outlet pipe 32.

[0040] The connecting pipe assembly 3 interconnects the first cold plate 1 and the second cold plate 2. It can be assembled using universal quick connectors and bellows. The quick connectors have a self-locking structure to prevent loosening due to vibration after insertion. The quick connectors also have a one-way shut-off valve to automatically block flow when disconnected. The bellows are made of polytetrafluoroethylene (PTFE), suitable for cooling medium flow, and have good temperature resistance.

[0041] In some implementations, such as Figure 1 , Figure 2 , Figure 8 , Figure 10 As shown, a boss assembly 24 is provided on the surface of the second cold plate 2, and the orthographic projection of the boss assembly 24 relative to the second cold plate 2 at least partially overlaps with the orthographic projection of the second branch channel 22 relative to the second cold plate 2.

[0042] Both the upper and lower surfaces of the second cold plate 2 can be provided with boss components 24. The arrangement trajectory of the second branch channel 22 is adapted to the heating area of ​​the heat source on the second cold plate 2. The boss components 24 achieve heat transfer through contact. The arrangement position of the boss components 24 should be adapted to the arrangement trajectory of the second branch channel 22 so that the heat transferred by the boss components 24 is transferred to the cooling medium in the second branch channel 22 through a shorter path, thereby improving the heat conduction efficiency.

[0043] The material of the second cold plate 2 can be the same as that of the first cold plate 1. The second branch channel 22 can be tubular, with a cross-sectional width of 8.15mm-9.15mm and a cross-sectional height of 3.15mm-4.15mm. A second fin structure 29 is arranged in the second branch liquid cooling cavity 21. The fin spacing of the second fin structure 29 is 0.3mm-0.5mm, the fin thickness is 0.2mm-0.4mm (i.e., the distance between the fins along the second direction), and the fin height is 4mm-6mm. A flow channel is formed between adjacent fins in the second fin structure 29, through which the cooling medium flows. The second fin structure 29 increases the contact area with the cooling medium, improving heat dissipation. The flow direction of the cooling medium is consistent with the arrangement direction of the flow channel in the second fin structure 29. In this embodiment, the cooling medium flows along the first direction in the second branch liquid cooling cavity 21.

[0044] In some implementations, such as Figure 6 , Figure 8 , Figure 10As shown, the second cold plate 2 also includes a second plate body 27. An installation groove 54 is provided in the middle of the second plate body 27. The second branch liquid cooling cavity 21 is embedded in the installation groove 54 and connected to the second plate body 27. The second branch channel 22 is formed in the second plate body 27 and communicates with the groove wall of the installation groove 54.

[0045] The second branch liquid cooling cavity 21 has a roughly rectangular structure. Both its upper and lower surfaces are exposed on the second plate 27, allowing the boss assembly 24 to be mounted on it. The second branch liquid cooling cavity 21 is fixed to the second plate 27 by screws, snap-fits, or other methods. To achieve communication between the second branch channel 22 and the branch sub-cavity 23, the end of the second branch channel 22 is formed in the wall of the mounting groove 54, allowing the outlet or inlet of the branch sub-cavity 23 to be inserted into the end of the second branch channel 22 for interconnection.

[0046] For example, the boss assembly 24 includes a plurality of first bosses 25 and a plurality of second bosses 26. The plurality of first bosses 25 are arranged on the second branch liquid cooling cavity 21 and / or located at both ends of the second branch liquid cooling cavity 21 on the second plate 27, and the plurality of second bosses 26 are arranged on the edge of the second cold plate 2. The second module assembly 64 abuts against the first bosses 25 and / or the second bosses 26, and the second module assembly 64 includes a plurality of stacked functional expansion modules and / or functional chips.

[0047] Multiple first protrusions 25 are arranged at intervals along the first direction. Multiple first protrusions 25 are arranged on the second branch liquid cooling cavity 21 and at both ends of the second branch liquid cooling cavity 21 along the first direction. The arrangement positions of multiple first protrusions 25 and multiple second protrusions 26 are adapted to the arrangement positions of the heating areas on the second module assembly 64. The protrusion assembly 24 achieves heat transfer by contacting the second module assembly 64.

[0048] In some implementations, such as Figure 8 , Figure 10 As shown, the first boss 25 and the second boss 26 are both disposed on one surface of the second plate 27. In the second module assembly 64 located on one surface of the second plate 27, the functional expansion module opposite to the second plate 27 abuts against the first boss 25, and the abutting surface between the first boss 25 and the functional expansion module is planar. The functional expansion module opposite to the second plate 27 is provided with a heat-conducting end 71. The second boss 26 is disposed perpendicular to the second plate 27, and the end of the second boss 26 is an inclined surface 28. The contact surface of the heat-conducting end 71 abuts and matches the inclined surface 28. For example, the inclination angle of the inclined surface 28 along a third direction is 45°. The contact surface of the heat-conducting end 71 abuts tightly against the inclined surface 28, increasing the heat exchange area.

[0049] like Figures 10-13As shown, the second module component 64 includes functional expansion modules such as an OCM module 65, an Open Compute Project (OCP) module, a NIC module 66, and an E1.S high-speed solid-state drive module (E1.S module 68). The upper surface of the second board 27 is equipped with the NIC module 66, and the upper surface of the NIC module 66 is equipped with an OCP module 67 and an E1.S module 68. The OCP module 67 and E1.S module 68 are mounted on a mounting bracket 7, with two E1.S modules 68 positioned between two OCP modules 67, achieving side-by-side assembly via the mounting bracket 7. The lower surface of the second board 27 is equipped with the OCM module 65. Specifically, a functional chip, such as a Central Processing Unit (CPU), is arranged in the middle of the OCM motherboard 652. Memory components 653 are arranged on both sides of the CPU module 651. The bottom of the OCM module 65 is equipped with an OCM tray, and the top of the OCM module 65 is connected to the second board 27. The OCM tray can be fixed to the bottom wall of the frame 8 by screws, so that the integral second cold plate 2 and the second module assembly 64 can be assembled in the frame 8.

[0050] For example, the first protrusion 25 is disposed on the upper surface of the second plate 27. The first protrusion 25 contacts the NIC chip in the NIC module 66. The first protrusion 25 and the NIC chip are in contact through a thermal interface material, such as a silicone grease pad. The second protrusion 26 transfers heat to the OCP module 67 and the E1.S module 68 through lateral contact. The NIC module 66, OCP module 67 and E1.S module 68 can achieve a planar high-density deployment, and each module can achieve effective heat conduction through the second cold plate 2.

[0051] Specifically, such as Figure 11 As shown, a cooling plate 72 is installed on the functional expansion module opposite to the second plate 27 for heat dissipation of the functional expansion module; a cooling groove 73 is opened on the cooling plate 72, and a heat-conducting copper pipe 74 is installed in the cooling groove 73. The end of the cooling plate 72 is a heat-conducting end 71, which protrudes from the functional expansion module. One end of the heat-conducting copper pipe 74 is located on the heat-conducting end 71, and the other end of the heat-conducting copper pipe 74 is connected to the external port 75 of the functional expansion module, and / or both ends of the heat-conducting copper pipe 74 are located on the heat-conducting end 71.

[0052] The OCP module 67 is equipped with a cooling plate 72, which abuts against the OCP chip. The cooling plate 72 is made of metal and is used for heat transfer. The heat-conducting end 71 protrudes from the end of the OCP module 67 so that it can abut against the second protrusion 26. Correspondingly, the NIC module 66 avoids the area where the second protrusion 26 and the heat-conducting end 71 are located. The heat-conducting copper pipe 74 stores phase change material inside, enabling the heat-conducting copper pipe 74 to effectively transfer heat between its two ends. The OCP module 67 has an external port 75 at its end opposite the heat-conducting end 71. The external port 75 is the optical module port. Two cooling plates 72 can be configured and stacked. One cooling plate 72 transfers heat from the OCP chip in the OCP module 67, with both ends of its heat-conducting copper pipe 74 located on the heat-conducting end 71. The other cooling plate transfers heat from the optical module, with one end of its heat-conducting copper pipe 74 located on the heat-conducting end 71 and the other end snapped onto the external port 75. When the optical module is inserted into the external port 75, the heat-conducting copper pipe 74 transfers the heat from the external port 75 to the second protrusion 26 through the heat-conducting end 71. The two cooling plates 72 effectively transfer heat from the external port 75 and the OCP module 67 to the second cold plate 2.

[0053] like Figure 12 As shown, the E1.S module 68 can also be equipped with a cooling plate 72. The cooling plate 72 is connected to the outer surface of the E1.S module 68. The cooling plate 72 corresponds to the heat-generating area in the E1.S module 68. The connection method is not limited to screw connection, snap connection, etc. The cooling groove 73 is set towards the E1.S module 68. The heat-conducting copper pipe 74 is located between the cooling groove 73 and the E1.S module 68. The heat-conducting end 71 is set to protrude relative to the end of the E1.S module 68 so that the heat-conducting end 71 can abut against the second boss 26. The heat-conducting end 71 transfers the heat of the E1.S module 68 to the second cold plate 2. To improve the heat conduction of the cooling plate 72, a heat-conducting layer 69 is provided between the cooling plate 72 and the E1.S module 68. The heat-conducting layer 69 can be made of a heat-conducting interface material, such as a silicone grease pad. Understandably, in order to achieve the heat conduction stability and uniformity of the functional expansion module and the functional chip, the heat-generating area of ​​the functional expansion module and the functional chip can be provided with the heat-conducting layer 69, which is used to contact the boss assembly 24, the third boss 53, or the cooling plate 72.

[0054] In some implementations, such as Figure 8 , Figure 13 As shown, the first boss 25 is disposed on the other surface of the second plate 27. In the second module assembly 64 located on the other surface of the second plate 27, a heat-conducting plate 78 is disposed between the stacked functional chips. The end of the heat-conducting plate 78 extends out of the side of the functional chip and abuts against the first boss 25.

[0055] For example, a first protrusion 25 is disposed on the lower surface of the second plate 27. A portion of the first protrusion 25 abuts against the CPU module 651 in the second module assembly 64, thereby achieving heat transfer. The memory component 653 in the second module assembly 64 abuts against another portion of the first protrusion 25 through a heat-conducting plate 78. The memory component 653 includes a horizontally stacked upper-layer memory 76 and a horizontally stacked lower-layer memory 77. The memory component 653 also includes multiple memory connectors 58. Taking two memory connectors 58 as an example, the number of memory connectors 58 is adapted to the number of memory modules in the memory component 653. The bottom of the two memory connectors 58 is connected to the upper surface of the OCM motherboard 652, and the top of the memory connectors 58 has a connection contact point 57. There is a height difference between the two memory connectors 58. The horizontally stacked upper-layer memory 76 and the horizontally stacked lower-layer memory 77 are respectively assembled onto the two memory connectors 58. The memory component 653 is connected to the memory connectors 58 through the connection contact point 57, thereby achieving an electrical connection between the memory component 653 and the OCM motherboard 652.

[0056] like Figure 14 As shown, in order to achieve quick positioning of memory component 653 and memory connector 58, a positioning post 55 is provided on the top of memory connector 58, and a positioning hole matching the positioning post 55 is provided on memory component 653. Memory component 653 is directly positioned on memory connector 58 through the cooperation of positioning post 55 and positioning hole.

[0057] A heat-conducting plate 78 is provided between the upper horizontal memory 76 and the lower horizontal memory 77. Limiting posts 56 are provided on both the upper and lower surfaces of the heat-conducting plate 78. Limiting grooves 48 that match the limiting posts 56 are provided on the memory assembly 653. For example, limiting holes are provided at both ends of the upper horizontal memory 76 along the second direction and at both ends of the lower horizontal memory 77 along the second direction. The memory assembly 653 and the heat-conducting plate 78 are stably assembled through the cooperation of the limiting holes and the limiting posts 56.

[0058] The heat-conducting plate 78 can be made of metal and has good thermal conductivity. The upper horizontal memory layer 76 and the lower horizontal memory layer 77 are partially offset along the first direction. The heat-conducting plate 78 has a flange 79. One side of the flange 79 is aligned with the lower horizontal memory layer 77, and the other side of the flange 79 abuts against the side of the upper horizontal memory layer 76. The upper surface of the flange 79 is located above the upper surface of the upper horizontal memory layer 76 and abuts against the first boss 25. The heat-conducting plate 78 and the flange 79 can effectively transfer the heat of the memory component 653 to the second cold plate 2, thereby achieving efficient heat dissipation of the memory component 653. Compared to traditional vertical memory assembly, this design avoids the height limitations of vertical memory assembly. It adopts a stacked assembly method with horizontal upper-layer memory 76 and horizontal lower-layer memory 77, allowing multiple memory components 653 to be integrated and laid out flat. For example, four memory components 653 can be arranged on one side of the CPU module 651. The four memory components 653 are arranged in a matrix, which can meet the density arrangement requirements of internal components and achieve good heat dissipation through the heat dissipation plate 78. The memory components 653 are connected by connection contacts 57 laid on the memory connector 58. The contact points 57 are arranged in an array and can be set on the entire upper surface of the memory connector 58 to achieve efficient and stable signal transmission.

[0059] Based on the actual usage requirements of memory component 653, the number of memory modules can be greater than two. Multiple memory modules are arranged in a multi-layered, staggered layout, effectively increasing the number of memory modules that can be integrated between the OCM motherboard 652 and the second cold plate 2. The second cold plate 2 is double-sided bonded to the second module component 64, achieving a planar, high-density deployment and increasing the component load density per unit area.

[0060] In some implementations, such as Figures 15-17 As shown, the heat dissipation system also includes a leakage guide assembly, which includes a first guide channel 81 and a second guide channel 82. The first guide channel 81 is installed at the connection end between the adapter pipe assembly 3 and the main liquid cooling channel 11, and the second guide channel 82 is installed at the connection end between the adapter pipe assembly 3 and the second cold plate 2, that is, the second guide channel 82 is installed at the connection end between the adapter pipe assembly 3 and the second branch channel 22. The first guide channel 81 and the second guide channel 82 are connected to form a guide channel. In the confined space environment of the server, the anti-leakage design is effective and can be set in locations prone to leakage.

[0061] For example, the first cold plate 1 and the second cold plate 2 are arranged in the same direction. A partition bracket 83 is provided between the first cold plate 1 and the second cold plate 2. The partition bracket 83 is connected to the frame 8. A bracket groove 84 is provided on the partition bracket 83. The first guide groove 81 and the second guide groove 82 are respectively attached to the opposite groove walls of the bracket groove 84 so that the leakage in the first guide groove 81 and the second guide groove 82 is guided to the bracket groove 84. The partition bracket 83 is connected to a drainage groove 85. The drainage groove 85 is arranged along the side wall of the frame 8 to reduce the space occupied by the drainage groove 85 in the chassis 93.

[0062] A first mounting base 33 is provided on the side of the main liquid cooling channel 11 facing the second cold plate 2, and a second mounting base 34 is provided on the side of the second cold plate 2 facing the first cold plate 1. The two ends of the transfer pipe assembly 3 are respectively connected to the first mounting base 33 and the second mounting base 34 to realize the conduction of cooling medium between the first cold plate 1 and the second cold plate 2.

[0063] One end of the first guide channel 81 is connected to the bottom of the first mounting base 33. If a leak occurs at the connection end between the adapter pipe assembly 3 and the main liquid cooling channel 11, the cooling medium can drip into the first guide channel 81. Correspondingly, one end of the second guide channel 82 is connected to the bottom of the second mounting base 34. If a leak occurs at the connection end between the adapter pipe assembly 3 and the second cold plate 2, the cooling medium can drip into the second guide channel 82. Both the first guide channel 81 and the second guide channel 82 are attached to the bracket groove 84, so that the leaked cooling medium can be guided into the bracket groove 84. The converged cooling medium is discharged from the heat dissipation system, preventing the leaked cooling medium from remaining in the server chassis 93.

[0064] The partition bracket 83 is configured to support the bottom of the server's backplane. Both ends of the partition bracket 83 are connected to opposite side walls of the frame 8. Specifically, a support plate 88 is provided at each end of the partition bracket 83. The support plate 88 is located within a bracket groove 84, which separates the bracket groove 84 into two adjacent grooves. The support plate 88 does not obstruct the flow of leaked cooling medium. The support plate 88 has a bend, forming a T-shaped structure. The support plate 88 is connected to the side wall of the frame 8 via the bend, and the connection method can be screwed, snap-fit, etc., allowing the partition bracket 83 to be stably assembled onto the side wall of the frame 8.

[0065] like Figure 15 , Figure 16As shown, a drainage hole 86 is provided on the corner. The two slots of the support groove 84 are connected to the drainage channel 85 through the two drainage holes 86. One end of the drainage hole 86 is connected to one end of the drainage channel 85, and the other end of the drainage channel 85 is exposed outside the frame. Leaked cooling medium is discharged from the support groove 84, the drainage hole 86, and the drainage channel 85. The drainage channel 85 can be fixed to the side wall of the frame 8 by means of bonding, screwing, snapping, etc. The bottom of the drainage channel 85 has an arc-shaped structure to reduce the flow resistance of the cooling medium. The drainage channel 85 is inclined from the support groove 84 to the outside of the frame 8. For example, in the horizontal direction, the bottom of the drainage channel 85 is inclined at 3°-5° to facilitate the cooling medium to be discharged to the outside of the frame 8. Similarly, the bottom of the first guide channel 81 and the bottom of the second guide channel 82 are both inclined at 1°-2° to facilitate the cooling medium to flow into the support groove 84.

[0066] The leakage diversion assembly effectively interconnects the first diversion channel 81, the second diversion channel 82, and the drainage channel 85 via a partition bracket 83. Designed with the principles of liquid collection, diversion, and drainage, it effectively protects the areas of the transfer pipe assembly 3 at risk of leakage. A hydrophobic coating is applied to the inner wall of the diversion channel to reduce residual cooling medium from leaks. The first diversion channel 81 diverts leakage at the connection between the transfer pipe assembly 3 and the first cold plate 1; the second diversion channel 82 diverts leakage at the connection between the transfer pipe assembly 3 and the second cold plate 2; and the partition bracket 83 diverts the leakage into the support groove 84. The partition bracket 83 is positioned between the first cold plate 1 and the second cold plate 2, and its ends can be effectively assembled onto the side wall of the frame, providing stable support for the support groove 84. The drainage channel 85 communicates with the support groove 84, diverting the leakage in the support groove 84. The drainage channel 85 leads out along the side wall of the frame 8, avoiding the traditional method of opening multiple drainage holes on the bottom wall of the chassis. In this application, the drainage channel 85 does not need to occupy a large internal space and can be directly attached to the side wall of the frame 8. It specifically addresses the locations where leakage may occur during the assembly of the transfer pipe assembly. The heat dissipation system greatly reduces the arrangement path of the liquid cooling pipes exposed outside the board, providing a designable space for the effective collection of leakage at the installation location of the transfer pipe assembly 3, preventing leakage from accumulating inside the server chassis and improving the operational safety of the server.

[0067] The partition bracket 83 is equipped with a backplane circuit board (not shown in the figure). The UBB in the first module assembly 61 is electrically connected to the backplane circuit board, and the OCM module in the second module assembly 64 is electrically connected to the backplane circuit board. The partition bracket 83 serves as a bridge connecting the first module assembly 61 and the second module assembly 64. The partition bracket 83 is used to guide the leakage of cooling medium, avoiding the need for additional leak-proof components and providing sufficient usable space for the heat dissipation system.

[0068] like Figure 17As shown, the leakage diversion assembly also includes a collection box 87. The heat dissipation system is installed in the chassis 93. The end of the drainage channel 85 is away from the support slot 84, that is, the outlet of the drainage channel 85 is located at the rear window of the chassis 93. The collection box 87 is located below the outlet of the drainage channel 85 to collect dripping cooling medium. The collection box 87 is equipped with a liquid-absorbing pad, such as non-woven fabric, to increase the accumulation of cooling medium. To facilitate maintenance of the collection box 87, a visualization window can be provided on its outer wall. The visualization window embeds a color-changing indicator. The color-changing indicator changes color upon contact with the cooling medium. The visualization window allows for a direct visual assessment of whether maintenance is required. For example, if the color indicator covers more than half of the display area of ​​the visualization window, maintenance is necessary.

[0069] The specific cooling process of the heat dissipation system is as follows: the coolant distribution unit transmits the coolant to the inlet channel 41 and the main liquid cooling channel 11; the flow pressure of the coolant is 0.3MPa-0.5MPa, and the inlet temperature is 25℃-45℃; the coolant is diverted from the main liquid cooling channel 11 to each first branch liquid cooling cavity 12, thereby cooling the first module component 61. For example, the upper OAM module 62 and the lower OAM module 63 are cooled through a stacked contact method, and the temperature of the coolant increases by 8℃-20℃; at the same time, the coolant flows from the main liquid cooling channel 11 to the main branch liquid cooling cavity 12. The heat is diverted to the second branch liquid cooling cavity 21, which then cools the second module components 64. For example, the NIC module 66 and OCM module 65 are cooled through a stacked contact method, while the OCP module 67 and E1.S module 68 are cooled through a lateral contact method. The heat from these modules is transferred through the second branch liquid cooling cavity 21 and multiple second branch channels 22, raising the temperature of the cooling medium by 8°C-15°C. The cooling medium from the second branch liquid cooling cavity 21 and the first branch liquid cooling cavity 12 then flows back to the main liquid cooling channel 11 and is then transferred to the coolant distribution unit for circulation. The cooling system can support server rack power of 330kW-1MW, improving heat dissipation efficiency by more than double compared to traditional discrete cold plate architectures, reducing the number of assembly interfaces by 80%, lowering the flow resistance coefficient by 60%, and improving overall energy efficiency by 10%.

[0070] In other embodiments, another heat dissipation system is provided, wherein the structure of the first cold plate 1 is the same as in the embodiments described above, such as... Figure 18 , Figure 19 As shown, the difference from the above embodiment lies in the structure of the second cold plate 2. Specifically, the second cold plate 2 can be provided with a liquid cooling channel 9, and multiple second branch liquid cooling cavities 21 can be connected in parallel on the liquid cooling channel 9. The cooling function of the second branch channel 22 in the original embodiment 1 is replaced by multiple second branch liquid cooling cavities 21. The structure of the second branch liquid cooling cavity 21 in embodiment 2 can be the same as that of the first branch liquid cooling cavity 12 in embodiment 1.

[0071] For example, the liquid cooling channel 9 is divided into two layers: a liquid inlet layer 91 and a liquid return layer 92. The liquid cooling channel 9 can have the same structure as the main liquid cooling channel 11 in Embodiment 1. Multiple second branch liquid cooling chambers 21 are respectively connected to the liquid inlet layer 91 and the liquid return layer 92. The liquid inlet layer 91 is connected to the main liquid inlet layer 13 via a transfer pipe assembly 3, and the liquid return layer 92 is connected to the main liquid return layer 14 via the transfer pipe assembly 3.

[0072] The upper and / or lower surfaces of multiple second branch liquid cooling cavities 21 are used to abut against the second module assembly 64, and each module in the second module assembly 64 is selected and set according to the actual application.

[0073] The first cold plate 1 and the second cold plate 2 can be arranged in the same straight line direction or relatively parallel. In order to avoid the complexity of multi-path connection caused by using too many connecting pipe groups 3, the heat dissipation system can be assembled as an independent structure into the server chassis 93. Understandably, the heat dissipation system can be arranged in multiple ways according to the usage requirements.

[0074] In other embodiments, a server is provided, including a chassis 93 and at least one of the above-described heat dissipation systems disposed within the chassis 93.

[0075] The server has the same beneficial effects as the cooling system mentioned above.

[0076] It should be noted that the above-mentioned heat dissipation system is not limited to use in servers, but can also be used in temperature control systems in vehicles, etc. This application is applicable to any situation similar to this application.

[0077] In the description of this application: Unless otherwise stated, directional terms such as "up" and "down" generally refer to the relative position of the corresponding component in the direction of gravity when it is in use. "Inner" and "outer" refer to the inner and outer contours of the corresponding component itself.

[0078] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0079] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

Claims

1. A heat dissipation system, characterized in that: The system includes a frame (8), a first cold plate (1) and a second cold plate (2) installed within the frame (8), and a leakage diversion assembly. The first cold plate (1) and the second cold plate (2) are interconnected via a connecting pipe assembly (3). The leakage diversion assembly includes a first diversion channel (81) and a second diversion channel (82). The first diversion channel (81) is installed at the connection end of the adapter pipe assembly (3) and the first cold plate (1). The second diversion channel (82) is installed at the connection end of the adapter pipe assembly (3) and the second cold plate (2). The first diversion channel (81) and the second diversion channel (82) are connected to form a diversion channel. The diversion channel is connected to a guide channel (85). The guide channel (85) is arranged along the side wall of the frame (8) and extends to the outside of the frame (8).

2. The heat dissipation system according to claim 1, characterized in that: A partition bracket (83) is provided between the first cold plate (1) and the second cold plate (2). The partition bracket (83) is connected to the frame (8). A bracket groove (84) is provided on the partition bracket (83). The first guide groove (81) and the second guide groove (82) are respectively attached to the opposite groove wall of the bracket groove (84) so ​​that the leakage of the first guide groove (81) and the second guide groove (82) is guided to the bracket groove (84). The bracket groove (84) is connected to the drainage groove (85).

3. The heat dissipation system according to claim 1, characterized in that: Along the horizontal direction, the bottom of the first guide channel (81) and the bottom of the second guide channel (82) are both inclined; the bottom of the diversion channel (85) has an arc-shaped structure and the bottom of the diversion channel (85) is inclined.

4. The heat dissipation system according to claim 1, characterized in that: The first cold plate (1) includes a first plate body (17), a main liquid cooling channel (11) disposed in the first plate body (17), and at least one first branch liquid cooling cavity (12). The main liquid cooling channel (11) is divided into a main liquid inlet layer (13) and a main reflux layer (14). The first branch liquid cooling cavity (12) is connected to the main liquid inlet layer (13) and the main reflux layer (14) respectively. The second cold plate (2) includes a second plate body (27) and at least one second branch liquid cooling cavity (21) disposed in the second plate body (27). The second branch liquid cooling cavity (21) is connected to the main liquid inlet layer (13) and the main reflux layer (14) respectively through the transfer pipe assembly (3).

5. The heat dissipation system according to claim 4, characterized in that: The first cold plate (1) and the second cold plate (2) are arranged in the same straight direction or arranged in parallel. Multiple first branch liquid cooling cavities (12) are connected to the same side of the main liquid cooling channel (11), and the second branch liquid cooling cavity (21) is connected to the other side of the main liquid cooling channel (11) through the adapter pipe assembly (3).

6. The heat dissipation system according to claim 4, characterized in that: The first cold plate (1) has a liquid inlet channel (41) and a return channel (42) at both ends respectively. The main liquid inlet layer (13) and the main return layer (14) are stacked. The main liquid cooling channel (11) is located between the liquid inlet channel (41) and the return channel (42). The main liquid inlet layer (13) is connected to the liquid inlet channel (41), and the main return layer (14) is connected to the return channel (42). The liquid inlet channel (41) has a liquid inlet (43), and the return channel (42) has a liquid outlet (44).

7. The heat dissipation system according to claim 4, characterized in that: The first branch liquid cooling cavity (12) includes an upper branch layer (15) and a lower branch layer (16). The upper branch layer (15) and the lower branch layer (16) are stacked and interconnected. A first branch channel (45) is provided between the first branch liquid cooling cavity (12) and the main liquid cooling channel (11). The upper branch layer (15) is connected to the main liquid inlet layer (13) through a first branch channel (45), and the lower branch layer (16) is connected to the main return layer (14) through another first branch channel (45).

8. The heat dissipation system according to claim 7, characterized in that: The first cold plate (1) is provided with a heat dissipation part (5), which is connected to the side of the first branch liquid cooling cavity (12) away from the main liquid cooling channel (11) and / or connected to the first branch channel (45).

9. The heat dissipation system according to claim 8, characterized in that: The heat dissipation section (5) includes an upper heat dissipation plate (51) and a lower heat dissipation plate (52) stacked together. The upper heat dissipation plate (51) and the lower heat dissipation plate (52) are arranged to clamp the first branch liquid cooling cavity (12) relative to each other, and / or to clamp the first branch channel (45) relative to each other.

10. The heat dissipation system according to claim 8, characterized in that: The first plate (17) has multiple branch slots (46) and side slots (47). The multiple branch slots (46) are connected to the side slots (47). The side slots (47) are located at the edge of the first plate (17) and are connected to the edge of the first plate (17). The main liquid cooling channel (11) is embedded in the side slots (47) and is connected to the first plate (17). The multiple first branch liquid cooling cavities (12) are embedded in the multiple branch slots (46) and are connected to the first plate (17).

11. The heat dissipation system according to claim 10, characterized in that: The ends of the multiple branch slots (46) opposite to the side slots (47) are interconnected. The heat dissipation part (5) is embedded in the branch slots (46) and abuts against the slot wall of the branch slots (46). The heat dissipation part (5) is connected in series with multiple first branch liquid cooling cavities (12) and / or connected to the two first branch channels (45) corresponding to each first branch liquid cooling cavity (12).

12. The heat dissipation system according to claim 4, characterized in that: The first plate (17) is configured to connect to the first module assembly (61) on any surface or opposite surface for heat dissipation of the first module assembly (61); the first branch liquid cooling cavity (12) is provided with a third boss (53) on any surface or opposite surface, and the first module assembly (61) abuts against the third boss (53).

13. The heat dissipation system according to any one of claims 4-12, characterized in that: The second cold plate (2) has multiple second branch channels (22) arranged at both ends of the second branch liquid cooling cavity (21). The second branch liquid cooling cavity (21) is divided into adjacent branch sub-cavities (23). One end of each of the two branch sub-cavities (23) is connected to the transfer pipe assembly (3) through the two second branch channels (22) so that one branch sub-cavity (23) is connected to the main liquid inlet layer (13) and the other branch sub-cavity (23) is connected to the main return layer (14). The other ends of the two branch sub-cavities (23) are interconnected through a second branch channel (22).

14. The heat dissipation system according to claim 13, characterized in that: The surface of the second cold plate (2) is provided with a boss assembly (24), the orthographic projection of the boss assembly (24) relative to the second cold plate (2) at least partially coincides with the orthographic projection of the second branch channel (22) relative to the second cold plate (2).

15. The heat dissipation system according to claim 13, characterized in that: The second plate (27) has an installation groove (54) in the middle. The second branch liquid cooling cavity (21) is embedded in the installation groove (54) and connected to the second plate (27). The second branch channel (22) is formed in the second plate (27) and communicates with the groove wall of the installation groove (54).

16. The heat dissipation system according to claim 14, characterized in that: The boss assembly (24) includes a plurality of first bosses (25) and a plurality of second bosses (26). The plurality of first bosses (25) are arranged on the second branch liquid cooling cavity (21) and / or located at both ends of the second branch liquid cooling cavity (21), and the plurality of second bosses (26) are arranged on the edge of the second cold plate (2).

17. The heat dissipation system according to claim 16, characterized in that: The second plate (27) is configured to connect to the second module assembly (64) on any surface or opposite surface for heat dissipation of the second module assembly (64); the second module assembly (64) abuts against the first boss (25) and / or against the second boss (26), and the second module assembly (64) includes a plurality of stacked functional expansion modules and / or functional chips.

18. The heat dissipation system according to claim 17, characterized in that: The first boss (25) and the second boss (26) are both disposed on one surface of the second plate (27). In the second module assembly (64) located on one surface of the second plate (27), the functional expansion module opposite to the second plate (27) abuts against the first boss (25), and the functional expansion module opposite to the second plate (27) is provided with a heat-conducting end (71). The second boss (26) is disposed perpendicular to the second plate (27), and the end of the second boss (26) is an inclined surface (28). The contact surface of the heat-conducting end (71) abuts against and is adapted to the inclined surface (28).

19. The heat dissipation system according to claim 18, characterized in that: A cooling plate (72) is installed on the functional expansion module opposite to the second plate (27) for heat dissipation of the functional expansion module; a cooling groove (73) is opened on the cooling plate (72), and a heat-conducting copper pipe (74) is installed in the cooling groove (73). The end of the cooling plate (72) is the heat-conducting end (71). One end of the heat-conducting copper pipe (74) is located on the heat-conducting end (71), and the other end of the heat-conducting copper pipe (74) is connected to the external port (75) of the functional expansion module, and / or both ends of the heat-conducting copper pipe (74) are located on the heat-conducting end (71).

20. The heat dissipation system according to claim 17, characterized in that: The first boss (25) is disposed on the other surface of the second plate (27). In the second module assembly (64) located on the other surface of the second plate (27), a heat-conducting plate (78) is disposed between the stacked functional chips. The end of the heat-conducting plate (78) extends out of the side of the functional chip and abuts against the first boss (25).

21. A server, characterized in that: It includes a chassis (93) and at least one heat dissipation system as described in any one of claims 1-20 disposed within the chassis (93).

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