An automated conveyor device for chip production

Abstract

The application discloses an automatic conveying device for chip production and particularly relates to the conveying device field, which comprises a conveying device rack, a transmission wheel rotatably connected to the inner side of the conveying device rack, a conveying chain sleeved with the outer side of the transmission wheel, a connecting rod fixedly connected to the inner side of the transmission wheel, a driving motor fixedly connected to one side of the conveying device rack, the transmission wheel fixedly connected to the output end of the driving motor, a position detection assembly arranged on the top of the transmission wheel, a limiting slide rail fixedly connected to the top of the conveying device rack, a light shielding box body slidably connected to the top of the limiting slide rail, and a following assembly arranged on one side of the light shielding box body. The position detection assembly can make the wafer fixedly move along a limited track, the wafer can be detected without dead angle without programming control, the industrial vision camera can move along with the wafer conveying through cooperation of the following assembly, the purpose of detecting while conveying is achieved, and the detection efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of conveying devices, and more specifically, to an automated conveying device for chip production. Background Technology

[0002] A chip is a general term for semiconductor components. In electronics, it's a way to miniaturize circuits (mainly including semiconductor devices, but also passive components). These are often manufactured on the surface of semiconductor wafers. Wafers are the raw material substrate for chip manufacturing, while chips are finished units cut from wafers. Chip production is the process of processing wafers, and every step in wafer processing relies on high-precision visual inspection technology. A wafer contains multiple layers, and each layer undergoes a complex and precise process: material deposition, resist coating, photolithography, etching, ion implantation, and finally, resist removal. However, before coating another layer, the newly etched and implanted layers must be inspected for defects. Wafer layers can have scratches, rotational defects, exposure problems, particle contamination, hot spots, wafer edge defects, and various other defects that affect performance. Visual inspection technology can mark these defects, providing data support for process optimization.

[0003] Currently, when performing visual inspection on wafers, because the volume of high-precision industrial vision cameras is much smaller than that of wafers, the inspection process requires controlling the movement of the wafer to enable the vision camera to perform blind-angle inspection. This wafer movement process is mostly controlled by programming, which is difficult to operate and requires customization according to different wafers. In addition, the wafer is in a stopped state during the inspection process. These two drawbacks reduce the wafer inspection efficiency. Therefore, to address this problem, this application provides an automated conveying device for chip production to meet the requirements. Summary of the Invention

[0004] To overcome the aforementioned deficiencies of the prior art, embodiments of the present invention provide an automated conveying device for chip production. By setting up an alignment detection component, the wafer can be moved in a fixed manner along a defined trajectory, achieving wafer inspection without blind spots without the need for programming control. In conjunction with a following component, an industrial vision camera follows the wafer's conveying movement, achieving the purpose of simultaneous conveying and inspection, thereby improving inspection efficiency and solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: An automated conveying device for chip production includes a conveying frame. A drive wheel is rotatably connected to the inner side of the conveying frame, and a conveyor chain is sleeved on the outer side of the drive wheel. A connecting rod is fixedly connected to the inner side of the drive wheel. A drive motor is fixedly connected to one side of the conveying frame. The drive wheel is fixedly connected to the output end of the drive motor. An alignment detection component is provided on the top of the drive wheel. A limit rail is fixedly connected to the top of the conveying frame. A light-shielding box is slidably connected to the top of the limit rail. A following component is provided on one side of the light-shielding box. The alignment detection component includes a limit conveyor frame fixedly connected to the top of the conveyor chain. The limit conveyor frame is slidably connected to the inner side of the conveying frame. A movable base is slidably connected to the inner side of the limit conveyor frame. A wafer is placed on the top of the movable base. A limit crossbar is fixedly connected to the inner wall of the limit conveyor frame. The movable base is slidably connected to the outer side of the limit crossbar.

[0006] The alignment and inspection component can perform comprehensive lateral inspection by reciprocating the wafer, and together with the follower component, complete the inspection of the wafer without blind spots.

[0007] In the above technical solution, a first damper is further fixedly connected to the inner wall of the limiting conveyor frame, one end of the first damper is fixedly connected to the inside of the movable base, and a return spring is provided on the outer side of the first damper.

[0008] In the above technical solution, the bottom of the movable base is provided with a guide component, which is composed of multiple inclined guide components and straight guide components, and the multiple inclined guide components and straight guide components are distributed in a terminal connection manner.

[0009] In the above technical solution, a support column is fixedly connected to the inner side of the conveying device frame, and a guide wheel is rotatably connected to the top of the support column. The guide wheel and the guide assembly are arranged in an abutting position.

[0010] In the above technical solution, the following component further includes a connecting shaft column rotatably connected to one side of the light-shielding box, one end of the connecting shaft column is fixedly connected to an L-shaped fixing member, and the end of the connecting shaft column away from the L-shaped fixing member is fixedly connected to a transmission inclined plate.

[0011] In the above technical solution, a slanted plate limiting frame is fixedly connected to one side of the conveying device frame, and a limiting component is fixedly connected to one side of the limiting conveying frame.

[0012] By using the follower component, the industrial vision camera can be moved step by step towards the back of the wafer in conjunction with the alignment detection component, so as to achieve full coverage of the wafer surface.

[0013] The technical effects and advantages of this invention are as follows: By setting up the alignment detection component, the movable base can drive the wafer to move back and forth three times. With the follower component, the front, middle and rear ends of the wafer can be detected separately to achieve the purpose of detection without dead angles. By setting up a follower component, the industrial vision camera can be gradually moved to the middle and rear of the wafer during the three reciprocating motions of the alignment detection component. This allows the follower component to follow the alignment detection component in its reciprocating motion, gradually moving the industrial vision camera from the front to the rear of the wafer, thus completing the comprehensive inspection of the industrial vision camera. In summary: By using the guide assembly, three sets of limiting components, and two sets of inclined plate limiting frames, the industrial vision camera moves to the rear section of the wafer after the movable base completes one reciprocating movement. This continues until the movable base completes three reciprocating movements, during which the industrial vision camera simultaneously inspects the front, middle, and rear sections of the wafer, achieving seamless wafer inspection. This process is achieved through the alignment and following components and can be implemented in a fixed cycle. Seamless wafer inspection is not achieved through complex programming and can be adapted to all wafers requiring seamless inspection. Furthermore, the wafer remains in a slow transport state throughout the inspection process, with the light-shielding box moving alongside the wafer. The wafer is inspected by the industrial vision camera during transport, thus significantly improving wafer inspection efficiency. Attached Figure Description

[0014] Figure 1 A three-dimensional structural diagram of an automated conveying device used in chip production; Figure 2 This is a partial structural cross-sectional view of an automated conveyor system used in chip manufacturing. Figure 3 for Figure 2 Enlarged view of the A-section structure; Figure 4 This is a schematic diagram of the bottom structure of the movable base; Figure 5 A schematic diagram of the top structure of the guide component; Figure 6 A side view of an automated conveyor system used in chip manufacturing. Figure 7 for Figure 6 Enlarged view of the structure of part B.

[0015] The attached figures are labeled as follows: 1. Conveying device frame; 2. Drive wheel; 3. Conveying chain; 4. Connecting rod; 5. Drive motor; 6. Limiting conveyor frame; 7. Movable base; 8. Wafer; 9. Industrial vision camera; 10. Optical microscope; 11. Limiting crossbar; 12. First damper; 13. Return spring; 14. Guide assembly; 15. Inclined guide; 16. Straight guide; 17. Support column; 18. Guide wheel; 19. Light-shielding box; 20. Limiting slide rail; 21. Limiting component; 22. Connecting shaft column; 23. L-shaped fixing component; 24. Transmission inclined plate; 25. Inclined plate limiting frame; 26. Second damper; 27. Second spring. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Refer to the instruction manual appendix Figures 1-7 As shown, an automated conveying device for chip production according to an embodiment of the present invention includes a conveying device frame 1. A transmission wheel 2 is rotatably connected to the inner side of the conveying device frame 1. A conveying chain 3 is sleeved on the outer side of the transmission wheel 2. The conveying chain 3 is a chain conveyor line and is fixedly connected to a limiting conveyor frame 6 to drive its movement. A connecting rod 4 is fixedly connected to the inner side of the transmission wheel 2. A drive motor 5 is fixedly connected to one side of the conveying device frame 1. The transmission wheel 2 is fixedly connected to the output end of the drive motor 5. An alignment detection component is provided on the top of the transmission wheel 2. A limiting slide rail 20 is fixedly connected to the top of the conveying device frame 1. A light-shielding box 19 is slidably connected to the top of the limiting slide rail 20. An industrial vision camera 9 is fixedly connected to the inner side of the light-shielding box 19. An optical microscope device 10 is fixedly connected to the bottom of the industrial vision camera 9. A following component is provided on one side of the light-shielding box 19.

[0018] The industrial vision camera 9 is enclosed inside the light-shielding enclosure 19 to reduce the influence of ambient light and improve the clarity of the inspection.

[0019] The alignment detection component includes a limiting conveyor frame 6 fixedly connected to the top of the conveyor chain 3. The limiting conveyor frame 6 is slidably connected to the inner side of the conveyor frame 1. A movable base 7 is slidably connected to the inner side of the limiting conveyor frame 6. The movable base 7 is slidably connected to the inner side of the limiting conveyor frame 6, and the wafer 8 is set on the top of the movable base 7. The industrial vision camera 9 is set at one corner of the movable base 7. By sliding the movable base 7 on the inner side of the limiting conveyor frame 6, the industrial vision camera 9 can detect from one side of the wafer 8 to the other side, realizing the detection of one section of the wafer 8. The full detection is achieved through three cycles. The wafer 8 is set on the top of the movable base 7.

[0020] A limiting crossbar 11 is fixedly connected to the inner wall of the limiting conveyor frame 6, which horizontally limits the movable base 7. The movable base 7 is slidably connected to the outside of the limiting crossbar 11. A first damper 12 is fixedly connected to the inner wall of the limiting conveyor frame 6, with one end of the first damper 12 fixedly connected to the inside of the movable base 7. A return spring 13 is provided on the outside of the first damper 12. Through the cooperation of the first damper 12 and the return spring 13, the movable base 7 is limited, so that the movable base 7 can promptly and stably return to its original sliding displacement after sliding. The bottom of the movable base 7 is provided with a guide assembly 14, which consists of multiple inclined guide members 15 and straight guide members 16. The multiple inclined guide members 15 and straight guide members 16 are arranged in a terminal connection. The multiple inclined guide members 15 and straight guide members 16 are combined into three groups. The inner side of the conveyor frame 1 is fixedly connected with a support column 17. The top of the support column 17 is rotatably connected with a guide wheel 18. The guide wheel 18 is arranged in a contacting position with the guide assembly 14. The rotatable arrangement of the guide wheel 18 can reduce the friction between it and the guide assembly 14.

[0021] It should be noted that, when the wafer 8 is conveyed into the inner side of the light-shielding box 19, the guide wheel 18 contacts the first set of guide components 14. Under the guidance of the guide wheel 18 and the inclined guide component 15, the movable base 7 can slide to one side, causing the wafer 8 to move to the other side of the limiting conveyor 6. During this period, the industrial vision camera 9 detects the wafer 8 from one side to the other, completing the detection of the front part of the wafer 8. When the movable base 7 moves to the other side of the limiting conveyor 6, the first damper 12 and the return spring 13 retract simultaneously. At this time, the other end of the first set of guide components 14 contacts the guide wheel 15. When the guide wheel 18 contacts, since the straight guide member 16 is horizontally positioned, it cannot form a horizontal limit with the guide wheel 18. The return spring 13 is stretched to drive the movable base 7 to reset. During this period, the limiting conveyor 6 is always in a state of displacement driven by the conveyor chain 3, which allows the guide wheel 18 to contact the second set of oblique guide members 15, causing the movable base 7 to move again. The oblique guide members 15 and the straight guide members 16 are set in three sets, which allows the movable base 7 to move back and forth three times. With the following component, the front, middle and rear ends of the wafer 8 can be inspected respectively to achieve the purpose of inspection without dead angles.

[0022] Furthermore, the following component includes a connecting column 22 rotatably connected to one side of the light-shielding housing 19, a torsion spring between the connecting column 22 and the light-shielding housing 19, an L-shaped fixing member 23 fixedly connected to one end of the connecting column 22, and a transmission inclined plate 24 fixedly connected to the end of the connecting column 22 away from the L-shaped fixing member 23. An inclined plate limiting frame 25 is fixedly connected to one side of the conveyor frame 1, and a limiting member 21 is fixedly connected to one side of the limiting conveyor frame 6. The limiting member 21 and the L-shaped fixing member 23 are arranged in abutment. The three opposing ends are set with an arc-shaped profile. The side of the light-shielding box 19 away from the connecting shaft column 22 is fixedly connected to the second damper 26. The second damper 26 is fixedly connected to the top of the conveyor frame 1. The second spring 27 is set on the outside of the second damper 26. The limiting member 21 is set in three sets corresponding to the three sets of inclined guide members 15 and straight guide members 16. The limiting member 21 is distributed in a linear array on the top of the limiting conveyor frame 6. The inclined plate limiting frame 25 is set in two sets, corresponding to the second and third sets of inclined guide members 15 and straight guide members 16.

[0023] It should be noted that when the guide wheel 18 contacts the first set of inclined guide members 15, the first set of limiting members 21 abuts against the L-shaped fixing member 23, thereby driving the light-shielding box 19 to move. The second damper 26 and the second spring 27 are stretched accordingly. When the first set of straight guide members 16 contacts the guide wheel 18, the movable base 7 is in the reset process. At the same time, the transmission inclined plate 24 abuts against the first set of inclined plate limiting frame 25. Under the limitation of the inclined plate limiting frame 25, the transmission inclined plate 24 is caused to flip, thereby causing the connecting shaft column 22 to rotate, and then the L-shaped fixing member 23 separates from the first set of limiting members 21. Subsequently, the transmission inclined plate 24 and the first set of limiting members 21... A set of inclined plate limiting frames 25 separate, and the connecting shaft column 22 is reset under the action of the torsion spring. At this time, the light shielding box 19 is stretched by the second damper 26 and the second spring 27 and moves in the opposite direction until the L-shaped fixing part 23 contacts the second set of limiting parts 21. It is then limited by the second set of limiting parts 21 and drives the light shielding box 19 to move. At this time, due to the reverse displacement of the light shielding box 19, the industrial vision camera 9 moves to the middle position of the wafer 8. At this time, the guide wheel 18 contacts the second set of inclined guide parts 15, causing the movable base 7 to move again to realize the detection of the middle position of the wafer 8. The detection of the front, middle and rear sections of the wafer 8 is completed through the above cycle.

[0024] When the transmission slant plate 24 contacts the third set of slant plate limit frame 25, it causes the L-shaped fixing piece 23 to separate from the third set of limit piece 21. At this time, the light shield box 19 completely loses its limit and is reset under the contraction action of the second damper 26 and the second spring 27. The above steps are repeated to detect the subsequent wafer 8.

[0025] In summary: By setting up the guide component 14, three sets of limiting components 21, and two sets of inclined plate limiting frames 25, when the movable base 7 completes one reciprocating movement, the industrial vision camera 9 then moves to the rear section of the wafer 8 until the movable base 7 completes three reciprocating movements. At the same time, the industrial vision camera 9 completes the detection of the front, middle, and rear sections of the wafer 8, achieving blind-angle detection of the wafer 8. This process is achieved through the alignment detection component and the following component, and can achieve fixed cycles. It does not require complex programming to achieve blind-angle detection of the wafer 8 and can adapt to all wafers that require blind-angle detection. During the detection process, the wafer 8 is always in a slow transport state, and the light-shielding box 19 moves with the wafer 8. The wafer 8 is detected by the industrial vision camera 9 during the transport process, which can greatly improve the detection efficiency of the wafer.

[0026] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change. Secondly: The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other. In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automated conveying device for chip manufacturing, comprising a conveying device frame (1), characterized in that, A transmission wheel (2) is rotatably connected to the inner side of the conveying device frame (1). A conveying chain (3) is sleeved on the outer side of the transmission wheel (2). A connecting rod (4) is fixedly connected to the inner side of the transmission wheel (2). A drive motor (5) is fixedly connected to one side of the conveying device frame (1). The transmission wheel (2) is fixedly connected to the output end of the drive motor (5). An alignment detection component is provided on the top of the transmission wheel (2). A limit slide rail (20) is fixedly connected to the top of the conveying device frame (1). A light shield is slidably connected to the top of the limit slide rail (20). The body (19) has a following component on one side. The alignment detection component includes a limiting conveyor frame (6) fixedly connected to the top of the conveyor chain (3). The limiting conveyor frame (6) is slidably connected to the inner side of the conveyor frame (1). A movable base (7) is slidably connected to the inner side of the limiting conveyor frame (6). A wafer (8) is provided on the top of the movable base (7). A limiting crossbar (11) is fixedly connected to the inner wall of the limiting conveyor frame (6). The movable base (7) is slidably connected to the outer side of the limiting crossbar (11).

2. The automated conveying device for chip production according to claim 1, characterized in that, The inner wall of the limiting conveyor (6) is fixedly connected to a first damper (12), one end of the first damper (12) is fixedly connected to the inside of the movable base (7), and a return spring (13) is provided on the outer side of the first damper (12).

3. An automated conveying device for chip production according to claim 2, characterized in that, The bottom of the active base (7) is provided with a guide component (14), which is composed of multiple inclined guides (15) and straight guides (16). The multiple inclined guides (15) and straight guides (16) are arranged in a terminal connection.

4. An automated conveying device for chip production according to claim 3, characterized in that, The inner side of the conveying device frame (1) is fixedly connected to a support column (17), and the top of the support column (17) is rotatably connected to a guide wheel (18). The guide wheel (18) and the guide assembly (14) are arranged in an abutting position.

5. An automated conveying device for chip production according to claim 1, characterized in that, The following assembly includes a connecting column (22) rotatably connected to one side of the light-shielding box (19), one end of the connecting column (22) is fixedly connected to an L-shaped fastener (23), and the other end of the connecting column (22) away from the L-shaped fastener (23) is fixedly connected to a transmission slant plate (24).

6. An automated conveying device for chip production according to claim 1, characterized in that, An inclined plate limiting frame (25) is fixedly connected to one side of the conveying device frame (1), and a limiting component (21) is fixedly connected to one side of the limiting conveying frame (6).

7. An automated conveying device for chip production according to claim 5, characterized in that, The light-shielding box (19) is fixedly connected to a second damper (26) on the side away from the connecting shaft column (22). The second damper (26) is fixedly connected to the top of the conveying device frame (1). A second spring (27) is provided on the outside of the second damper (26).

8. An automated conveying device for chip production according to claim 1, characterized in that, An industrial vision camera (9) is fixedly connected to the inside of the light-shielding box (19), and an optical microscope device (10) is fixedly connected to the bottom of the industrial vision camera (9).

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