A PCB embedded power module with a buried planar roebel coil

Abstract

The application relates to the field of high-density power integration, in particular to a PCB embedded power module with a buried planar Rogowski coil. The PCB embedded power module provided by the application comprises a power PCB board, a laminated structure, the laminated structure having a plurality of conductive layers and a plurality of insulating layers which are alternately stacked; a power chip which is embedded in the laminated structure of the power PCB board and is electrically connected with at least part of the conductive layers; and a planar Rogowski coil which is embedded in the laminated structure of the power PCB board and is used for sensing the current of the power chip; wherein at least part of the conductive layers of the laminated structure form a containing space through a connecting structure, and the planar Rogowski coil is buried and integrated in the containing space and is electrically isolated from the conductive layers. The application replaces the traditional spiral coil with the planar Rogowski coil by adopting the PCB buried integration method, and high-precision detection of the chip switching transient current of the PCB embedded power module is realized.

Description

Technical Field

[0001] This invention relates to the field of high-density power integration, and more specifically, to a PCB-embedded power module with an embedded planar Rogowski coil. Background Technology

[0002] In power electronic devices, power modules often employ chip cascading to improve voltage withstand capability, while simultaneously enhancing current carrying capacity through chip paralleling. This technical approach has led to its widespread application in various power electronic systems. With the advent of wide-bandgap semiconductor devices, high-power converters are developing towards lower power consumption, and high-density power integration has become an important research direction in the field of power electronics.

[0003] Traditional power module packaging structures typically achieve electrical interconnection between chips via bonding wires. This method easily introduces significant parasitic parameters, which can induce voltage overshoot and oscillation during switching transients, thus limiting the full potential of high-speed switching performance of wide-bandgap devices. PCB-embedded power modules, by embedding power semiconductor devices within the PCB's layered structure, offer several advantages. Firstly, they achieve shorter signal transmission paths, effectively reducing parasitic inductance in the power loop, suppressing voltage overshoot and oscillation during switching transients, and helping to reduce signal interference. Secondly, the device embedding scheme within the PCB layered structure enables higher-density power integration, effectively reducing the size and weight of the power module.

[0004] However, this highly integrated design presents new challenges to current sensing technology. Current sensing is commonly used for overcurrent fault protection and switching loss measurement, but current sensors typically need to be placed in the drain or source current conduction path of switching devices. Their structural dimensions inevitably alter the design of the commutation circuit, thus affecting stray inductance in the circuit. Furthermore, in high-power converters, under high-voltage and high-current applications, current sensors not only need electrical isolation capabilities to meet insulation requirements but also high bandwidth characteristics to accurately capture current changes in parallel power devices during switching transients.

[0005] Rogowski coils offer high measurement bandwidth, accurately capturing the switching transient current of power devices without requiring direct electrical connection to the conductor under test, thus meeting the insulation requirements of high-voltage applications. However, traditional helical Rogowski coils need to be arranged around the conductor under test, resulting in poor dimensional adaptability. This not only increases the complexity of circuit layout but also introduces additional stray inductance, making it difficult to meet the integration, low parasitic parameters, and high bandwidth requirements of PCB-embedded power modules for current sensors.

[0006] Therefore, there is an urgent need to develop a novel Rogowski coil current sensor solution with high bandwidth, high size adaptability, and low stray inductance to meet the current detection requirements of PCB embedded power modules in high-density integration scenarios. Summary of the Invention

[0007] The purpose of this invention is to provide a PCB-embedded power module with an embedded planar Rogowski coil, which solves the problems of poor size adaptability, introduction of additional stray inductance, and limited measurement bandwidth when current sensors are applied to PCB-embedded power modules in the prior art.

[0008] To achieve the above objectives, the present invention provides a PCB-embedded power module with an embedded planar Rogowski coil, comprising a power PCB board, a power chip, and a planar Rogowski coil: The power PCB board includes a stacked structure having multiple conductive layers and multiple insulating layers stacked alternately. The power chip is embedded in the stacked structure of the power PCB board and is electrically connected to at least a portion of the conductive layers among the plurality of conductive layers. The planar Rogowski coil is embedded within the stacked structure of the power PCB board and is used to sense the current of the power chip. In this structure, at least a portion of the conductive layers of the stacked structure form a receiving space through a connecting structure, and the planar Rogowski coil is embedded and integrated within the receiving space and electrically isolated from the conductive layers.

[0009] In some embodiments, the plurality of conductive layers include a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive layer stacked sequentially.

[0010] In some embodiments, the accommodating space is a U-shaped space, which is defined by the third conductive layer, the fourth conductive layer, the fifth conductive layer, and the connecting structure.

[0011] In some embodiments, the connection structure includes a first connection structure, a second connection structure, a third connection structure, and a fourth connection structure; The third conductive layer is connected to the fourth conductive layer via the first connecting structure, and then connected to the fifth conductive layer via the second connecting structure; the fifth conductive layer extends horizontally by a preset distance, then is connected back to the fourth conductive layer via the third connecting structure, and then connected back to the third conductive layer via the fourth connecting structure.

[0012] In some embodiments, the planar Rogowski coil includes a helical winding structure consisting of multiple lateral traces located on different conductive layers of the power PCB board and multiple longitudinal vias connecting the multiple lateral traces.

[0013] In some embodiments, the winding spacing of the planar Rogowski coil is uniformly distributed along the surface of the power chip, and the total width of the projection of the planar Rogowski coil onto the surface of the power chip matches the size of the source region of the power chip.

[0014] In some embodiments, the planar Rogowski coil is embedded in the power PCB board using a PCB manufacturing process, which includes laser blind vias, electroplating filling, and inner layer lamination.

[0015] In some embodiments, the power chip is one or more of Si MOSFET, SiC MOSFET, GaN MOSFET or IGBT.

[0016] In some embodiments, the power chip forms an electrical and mechanical connection with the corresponding conductive layer in the power PCB board through a silver sintering process or a tin soldering process.

[0017] In some embodiments, the insulating layer is made of a resin material, wherein the glass transition temperature Tg of the resin material is greater than or equal to 170°C.

[0018] In some embodiments, the connection structure further includes a fifth connection structure, a sixth connection structure, and a seventh connection structure; The fifth connection structure is used to realize the electrical connection between the first conductive layer and the second conductive layer; The sixth connection structure is used to realize the electrical connection between the second conductive layer and the gate of the power chip; The seventh connection structure is used to realize the electrical connection between the third conductive layer and the source of the power chip.

[0019] In some embodiments, the insulating layer is filled between the planar Rogowski coil and the inner wall of the conductive layer constituting the receiving space.

[0020] In some embodiments, the connection structure is a vertical via structure.

[0021] This invention provides a PCB-embedded power module with an embedded planar Rogowski coil. By adopting a PCB embedded integration method, a U-shaped dedicated accommodating space is constructed and a planar Rogowski coil is used to replace the traditional spiral coil. This enables high-precision detection of the switching transient current of the PCB-embedded power module chip, achieving a current detection effect with high bandwidth, high adaptability, and low stray inductance. Attached Figure Description

[0022] The above and other features, properties and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings and embodiments, in which the same reference numerals always denote the same features, wherein: Figure 1 A side cross-sectional view of a power PCB board according to an embodiment of the present invention is disclosed; Figure 2 A schematic diagram of a planar Rogowski coil according to an embodiment of the present invention is disclosed; Figure 3 A side cross-sectional view of a PCB-embedded power module with an embedded planar Rogowski coil according to an embodiment of the present invention is disclosed.

[0023] The meanings of the labels in the figures are as follows: 1. Power PCB board; 11 First copper layer; 12. Second copper layer; 13. Third copper layer; 14. Fourth copper layer; 15. Fifth copper layer; 2 power chips; 3. Planar Rogowski coil; 31. Horizontal cabling; 32 longitudinal vias; 41 First connection structure; 42. Second connection structure; 43. Third connection structure; 44. Fourth connection structure; 45. Fifth connection structure; 46. ​​The sixth connection structure; 47. Seventh connection structure. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention.

[0025] In recent years, power modules have been developing towards higher power and higher integration. To improve the current carrying capacity of the modules, a multi-chip parallel design is often adopted, and the current sharing characteristics of power chips have received widespread attention. However, traditional current sensors are often difficult to directly adapt due to the special physical structure of PCB-embedded power modules. Traditional power module packaging structures achieve chip interconnection through bonding wires, which easily introduces parasitic parameters, inducing voltage overshoot and oscillation during switching transients, thus limiting the performance advantages of wide-bandgap devices in high-speed switching.

[0026] To address the shortcomings of existing technologies, this invention provides a PCB-embedded power module with an embedded planar Rogowski coil, which is suitable for applications where PCB-embedded power modules are packaged in parallel with high current output chips. It has significant advantages such as high bandwidth, high size adaptability, and low insertion stray inductance.

[0027] Figure 1 A side cross-sectional view of a power PCB board according to an embodiment of the present invention is disclosed. Figure 2 A schematic diagram of a planar Rogowski coil according to an embodiment of the present invention is disclosed. Figure 3 A side cross-sectional view of a PCB-embedded power module with an embedded planar Rogowski coil according to an embodiment of the present invention is disclosed, as shown below. Figures 1 to 3 As shown, the present invention proposes a PCB-embedded power module with an embedded planar Rogowski coil, comprising a power PCB board 1, a power chip 2, and a planar Rogowski coil 3. The power PCB board 1 includes a stacked structure having multiple conductive layers and multiple insulating layers stacked alternately. The power chip 2 is embedded in the stacked structure of the power PCB board 1 and is electrically connected to at least a portion of the conductive layers among the plurality of conductive layers. The planar Rogowski coil 3 is embedded in the stacked structure of the power PCB board 1 and is used to sense the current of the power chip 2. In this structure, at least a portion of the conductive layers of the stacked structure form a receiving space through a connecting structure, and the planar Rogowski coil 3 is embedded and integrated within the receiving space and is electrically isolated from the conductive layers.

[0028] The PCB-embedded power module with embedded planar Rogowski coil proposed in this invention adopts a PCB embedded integration scheme, embedding the planar Rogowski coil in the stacked structure of the power PCB board. By extending the PCB wiring layer and using vertical vias to construct a dedicated accommodating space, and replacing the traditional spiral coil structure with a planar coil structure, the inherent defects of the traditional structure are overcome, and high-precision detection of the switching transient current of the PCB-embedded power module chip is achieved.

[0029] In some embodiments, the plurality of conductive layers include a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive layer stacked sequentially.

[0030] In some embodiments, the insulating layer is made of a resin material. Preferably, the glass transition temperature (Tg) of the resin material is greater than or equal to 170°C to ensure the structural stability and reliability of the power module under high-temperature operating conditions. For example, the resin material may be a high-Tg BT (bismaleimide triazine) resin. The insulating layer is filled between adjacent conductive layers to achieve interlayer electrical isolation.

[0031] In some embodiments, the accommodating space is a U-shaped space, which is defined by the third conductive layer, the fourth conductive layer, the fifth conductive layer, and the connecting structure. This U-shaped space provides a dedicated embedded mounting location for the planar Rogowski coil.

[0032] It is understood that the conductive layer can be made of appropriate conductive materials, such as copper, aluminum, or their alloys, according to actual process requirements. The following example illustrates the implementation of the conductive layer as a copper layer.

[0033] like Figure 3 As shown, when the conductive layer is a copper layer, the plurality of conductive layers are specifically a first copper layer 11, a second copper layer 12, a third copper layer 13, a fourth copper layer 14, and a fifth copper layer 15 stacked sequentially from top to bottom. The first conductive layer corresponds to the first copper layer 11, the second conductive layer corresponds to the fourth copper layer 12, the third conductive layer corresponds to the third copper layer 13, the fourth conductive layer corresponds to the fourth copper layer 14, and the fifth conductive layer corresponds to the fifth copper layer 15. The insulating layer fills the spaces between adjacent copper layers.

[0034] The arrangement of each connection structure is illustrated below with reference to this specific embodiment.

[0035] like Figure 3 As shown, the connection structure includes a first connection structure 41, a second connection structure 42, a third connection structure 43, and a fourth connection structure 44.

[0036] Preferably, each connection structure is a vertical via structure. The vertical via penetrates the insulating layer between the corresponding conductive layers, and the via wall or interior is filled with conductive material to achieve a reliable electrical connection. Vertical vias are arranged between the third copper layer 13 and the fourth copper layer 14, and between the fourth copper layer 14 and the fifth copper layer 15, respectively, to accommodate the construction of the power transmission path.

[0037] To form a receiving space for accommodating the planar Rogowski coil 3, such as Figure 3 As shown, in this embodiment, the third copper layer 13, the fourth copper layer 14, and the fifth copper layer 15 are connected through the following path: The third copper layer 13 is connected to the fourth copper layer 14 via the first connecting structure 41, and then to the fifth copper layer 15 via the second connecting structure 42. The fifth copper layer 15 extends horizontally to the right by a predetermined distance, then connects back to the fourth copper layer 14 via the third connecting structure 43, and then connects back to the third copper layer 13 via the fourth connecting structure 44. This vertical reciprocating connection path causes the power current to form a U-shaped surrounding area between the third copper layer 13 and the fifth copper layer 15, and this U-shaped area is the accommodating space.

[0038] The planar Rogowski coil 3 is embedded within the U-shaped receiving space and has no direct electrical contact with the third copper layer 13, fourth copper layer 14, fifth copper layer 15, or connecting structures of the surrounding power PCB board 1. The insulating layer fills the space between the planar Rogowski coil 3 and the inner wall of the copper layers constituting the receiving space to meet electrical insulation requirements and ensure that the power copper layer traces and the planar Rogowski coil 3 maintain a preset magnetic coupling efficiency.

[0039] In this embodiment, embedded integration refers to integrating the Rogowski coil into the interior of the PCB stack-up structure in an embedded manner, rather than mounting it on the PCB surface, thereby fully leveraging the miniaturized integration advantages of the PCB stack-up space and effectively reducing the overall size and weight of the module.

[0040] Traditional spiral coil structures need to be arranged around the conductor being measured, which often leads to local narrowing of the current-carrying loop, thereby increasing voltage overshoot and oscillation during the switching transient process, making it difficult to adapt to different measurement scenarios.

[0041] In this embodiment, the U-shaped accommodating space constructed by the power traces, vertical vias, and copper layers eliminates the need to narrow the width of the power copper layer traces, effectively controlling the parasitic stray inductance generated by the introduction of the current sensor. Simultaneously, this U-shaped accommodating space allows the physical structure of the planar Rogowski coil 3 to be flexibly adjusted according to different power chip sizes and wiring requirements, improving the coil's size adaptability and electromagnetic interference immunity.

[0042] like Figure 1 and Figure 3 As shown, the connection structure also includes a fifth connection structure 45, a sixth connection structure 46, and a seventh connection structure 47.

[0043] The fifth connection structure 45 is disposed between the first copper layer 11 and the second copper layer 12 to achieve an electrical connection between them. The sixth connection structure 46 is used to achieve an electrical connection between the second copper layer 12 and the gate of the power chip 2 to achieve the output of the gate signal. The seventh connection structure 47 is used to achieve an electrical connection between the third copper layer 13 and the source of the power chip 2 to achieve the conduction of the source current.

[0044] In this embodiment, the planar Rogowski coil integration scheme, as an integrated design of power current commutation structure and high bandwidth and high size adaptability, can measure the switching transient process of power chip with higher accuracy at the cost of extremely low stray inductance, without changing the current conduction path.

[0045] like Figure 2 As shown, the planar Rogowski coil 3 includes a spiral winding structure consisting of multiple transverse traces 31 located on different conductive layers of the power PCB board 1 and multiple longitudinal vias 32 connecting the multiple transverse traces 31.

[0046] In this embodiment, the planar Rogowski coil 3 refers to a coil structure formed by combining horizontal traces (e.g., PCB traces) and vertical vias (e.g., vertical vias) to effectively increase bandwidth and improve the adaptability of the Rogowski coil structure to the conductor under test. Specifically, the horizontal traces 31 constitute the horizontal main body of the Rogowski coil winding, and their trace width and spacing should conform to PCB manufacturing process standards; the vertical vias 32 constitute the vertical main body of the Rogowski coil winding, and the diameter of the vias determines the minimum winding width.

[0047] The measurement bandwidth of traditional helical Rogowski coils is limited by the total number of turns and the winding length, making it difficult to meet the high-speed switching transient detection requirements of wide-bandgap power devices. In this embodiment, however, the planar Rogowski coil 3 is directly embedded in the stacked structure of the power PCB board 1 and arranged close to the source region of the power chip 2, significantly shortening the equivalent length of the coil winding and thus greatly improving the measurement bandwidth, enabling more accurate capture of the switching transient current of the power chip.

[0048] It should be noted that, Figure 3 The planar Rogowski coil 3, schematically drawn with dashed lines, is... Figure 2 The diagram shows a representation of the coil structure. Figure 2 This is a schematic diagram of the planar Rogowski coil. The specific number of turns can be flexibly set according to the size of the actual device under test, while the winding structure remains unchanged. The coil as a whole presents a straight, extending shape. Figure 2 When viewed from the starting end to the ending end of the coil, that is, corresponding to... Figure 3 The viewpoint shown in the dashed-line planar Rogowski coil 3.

[0049] In one embodiment, the winding spacing of the planar Rogowski coil 3 is uniformly distributed along the surface of the power chip 2, and the total width of the projection of the planar Rogowski coil 3 on the surface of the power chip 2 matches the size of the source region of the power chip 2. The width and spacing of the traces must meet PCB manufacturing standards, which helps to improve the accuracy of current detection and the size adaptability of the coil to the conductor under test.

[0050] In some embodiments, the planar Rogowski coil 3 is embedded in the power PCB board 1 using a PCB manufacturing process, which includes laser blind vias, electroplating filling, and inner layer lamination. In some embodiments, the PCB manufacturing process may sequentially include: The laser blind hole process creates a connection path between the upper and lower layers of the embedded coil; The electroplating filling process is used to uniformly and densely fill the blind holes with copper to ensure good connection between the turns of the coil. The inner layer lamination process involves fusing the multi-layer structure through high temperature and high pressure, and filling the interlayer spaces with insulating material.

[0051] The electroplating filling process includes VCP (Vertical Continuous Plating) electroplating and via-filling electroplating. VCP electroplating is used to deposit a conductive layer on the inner wall of the blind via to achieve electrical connection between the upper and lower layers. Via-filling electroplating is used to uniformly and densely fill the inside of the blind via with conductive material to ensure good connection between the turns of the coil.

[0052] In some embodiments, the power chip 2 forms an electrical and mechanical connection with the corresponding conductive layer within the power PCB board 1 via a silver sintering process or a soldering process. For example, the power chip 2 can be soldered or sintered onto the upper surface of the third copper layer 13. The silver sintering process utilizes the solid-phase diffusion of silver particles under high temperature and pressure to form a highly reliable connection, suitable for high-temperature, high-power-density applications. The soldering process, on the other hand, forms a connection through solder melting and wetting; this process is mature, low-cost, and suitable for conventional power module packaging.

[0053] In some embodiments, the power chip 2 is one or more of Si MOSFET, SiC MOSFET, GaN MOSFET, or IGBT. Those skilled in the art can flexibly select a single type of chip or mix and connect multiple types of chips in parallel according to actual requirements for withstand voltage, current carrying capacity, and switching frequency.

[0054] Compared with the prior art, the PCB embedded power module with embedded planar Rogowski coil proposed in this invention has the following advantages: 1) By embedding planar Rogowski coils into the stacked structure of PCB embedded power modules, only the power copper layer traces need to be extended appropriately without narrowing the copper layer width, which significantly reduces the additional stray inductance. 2) A planar Rogowski coil is used instead of a traditional spiral Rogowski coil, which ensures magnetic coupling strength by shortening the physical distance between the Rogowski coil and the power copper layer trace; 3) The planar structure shortens the total length of the Rogowski coil winding, effectively improving the measurement bandwidth of the coil and realizing high-density, high-precision integrated current detection.

[0055] In summary, this invention proposes a PCB-embedded power module with an embedded planar Rogowski coil. Employing a PCB-embedded integration method, the planar Rogowski coil is embedded within the stacked structure of the power PCB board. A dedicated U-shaped accommodating space is created by extending the PCB wiring layers and using vertical vias. Replacing the traditional helical coil structure with a planar coil structure effectively overcomes the inherent disadvantages of traditional solutions, such as narrow current-carrying loops, limited bandwidth, and poor size adaptability. This planar Rogowski coil integration solution achieves high-bandwidth, high-precision current detection of the power chip's switching transients with minimal additional stray inductance, without significantly altering the power current conduction path. It combines the significant advantages of high size adaptability and low stray inductance, providing a highly promising solution for current detection in high-density integration scenarios for PCB-embedded power modules.

[0056] The present invention has been described in detail above with reference to preferred embodiments and accompanying drawings in a non-limiting manner. It should be understood that the above embodiments are only used to illustrate the principles and beneficial effects of the present invention and are not intended to limit the scope of protection of the present invention. For example, the type of power chip can be arbitrarily selected or combined from Si MOSFET, SiC MOSFET, GaN MOSFET, or IGBT according to actual application requirements; the construction of the U-shaped accommodating space depends on the specific arrangement of the PCB wiring layers and vertical vias, but its extension length, number of vias, and relative positions can be adjusted according to the power level and wiring space. All other embodiments obtained by those skilled in the art within the spirit and principles of the present invention without creative effort are within the scope of protection of the present invention.

[0057] In the description of this solution, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this solution and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the solution.

[0058] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0059] The above embodiments are provided for those skilled in the art to implement or use the present invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the claims.

Claims

1. A PCB-embedded power module with an embedded planar Rogowski coil, characterized in that, Includes power PCB board, power chip, and planar Rogowski coil: The power PCB board includes a stacked structure having multiple conductive layers and multiple insulating layers stacked alternately. The power chip is embedded in the stacked structure of the power PCB board and is electrically connected to at least a portion of the conductive layers among the plurality of conductive layers. The planar Rogowski coil is embedded within the stacked structure of the power PCB board and is used to sense the current of the power chip. In this structure, at least a portion of the conductive layers of the stacked structure form a receiving space through a connecting structure, and the planar Rogowski coil is embedded and integrated within the receiving space and electrically isolated from the conductive layers.

2. The PCB-embedded power module with an embedded planar Rogowski coil according to claim 1, characterized in that, The plurality of conductive layers include a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive layer stacked sequentially.

3. The PCB embedded power module with an embedded planar Rogowski coil according to claim 2, characterized in that, The accommodating space is a U-shaped space, which is defined by the third conductive layer, the fourth conductive layer, the fifth conductive layer, and the connecting structure.

4. The PCB embedded power module with an embedded planar Rogowski coil according to claim 3, characterized in that, The connection structure includes a first connection structure, a second connection structure, a third connection structure, and a fourth connection structure; The third conductive layer is connected to the fourth conductive layer via the first connecting structure, and then connected to the fifth conductive layer via the second connecting structure; After the fifth conductive layer extends horizontally by a predetermined distance, it is connected back to the fourth conductive layer via the third connecting structure, and then connected back to the third conductive layer via the fourth connecting structure.

5. The PCB embedded power module with an embedded planar Rogowski coil according to claim 1, characterized in that, The planar Rogowski coil comprises a helical winding structure consisting of multiple transverse traces located on different conductive layers of the power PCB board and multiple longitudinal vias connecting the transverse traces.

6. The PCB-embedded power module with an embedded planar Rogowski coil according to claim 5, characterized in that, The winding spacing of the planar Rogowski coil is uniformly distributed along the surface of the power chip, and the total width of the projection of the planar Rogowski coil onto the surface of the power chip matches the size of the source region of the power chip.

7. The PCB-embedded power module with an embedded planar Rogowski coil according to claim 1, characterized in that, The planar Rogowski coil is embedded in the power PCB board using PCB manufacturing process, which includes laser blind via, electroplating filling, and inner layer lamination.

8. The PCB embedded power module with an embedded planar Rogowski coil according to claim 1, characterized in that, The power chip is one or more of Si MOSFET, SiC MOSFET, GaN MOSFET or IGBT.

9. The PCB embedded power module with an embedded planar Rogowski coil according to claim 1, characterized in that, The power chip is electrically and mechanically connected to the corresponding conductive layer in the power PCB board through a silver sintering process or a tin soldering process.

10. The PCB-embedded power module with an embedded planar Rogowski coil according to claim 1, characterized in that, The insulating layer is made of a resin material, and the glass transition temperature Tg of the resin material is greater than or equal to 170°C.

11. The PCB-embedded power module with an embedded planar Rogowski coil according to claim 2, characterized in that, The connection structure further includes a fifth connection structure, a sixth connection structure, and a seventh connection structure; The fifth connection structure is used to realize the electrical connection between the first conductive layer and the second conductive layer; The sixth connection structure is used to realize the electrical connection between the second conductive layer and the gate of the power chip; The seventh connection structure is used to realize the electrical connection between the third conductive layer and the source of the power chip.

12. The PCB embedded power module according to claim 1, characterized in that, The insulating layer fills the space between the planar Rogowski coil and the inner wall of the conductive layer that forms the receiving space.

13. The PCB embedded power module with an embedded planar Rogowski coil according to claim 1, characterized in that, The connection structure is a vertical through-hole structure.

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