Heat exchanger and air conditioning device
By setting up multi-layer plates and pipe connection structures within the plate structure, the refrigerant flow rate and flow path are controlled, solving the problem of refrigerant pressure loss in the stacked manifold, and realizing efficient refrigerant flow and system miniaturization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DAIKIN INDUSTRIES LTD
- Filing Date
- 2024-10-08
- Publication Date
- 2026-07-24
AI Technical Summary
In existing technologies, the pressure loss caused by friction and collision with the wall surface when the refrigerant flows in a stacked manifold is significant and difficult to reduce effectively.
By setting first and second refrigerant flow paths within the plate structure, connecting the heat transfer tubes to the plate structure via pipes, controlling the refrigerant flow rate, reducing collisions with the wall surface, employing chamfered or rounded corner designs to smooth the flow, and controlling the pipe spacing to avoid interference.
This effectively reduces refrigerant pressure loss within the plate structure, achieves efficient refrigerant flow, and reduces system energy consumption and size.
Smart Images

Figure CN122459638A_ABST