Wafer automatic stripping, cleaning, detecting and discharging equipment and wafer processing method

Abstract

The present application relates to the technical field of semiconductor wafer processing automation equipment, and particularly relates to a wafer automatic stripping, cleaning, detecting and discharging equipment and a wafer processing method. The equipment comprises a machine table, a controller, a conveying module, a lifting and stripping module, a first mechanical hand, a suction cup cleaning module, a carrying module, a wafer cleaning module, a detecting module, a second mechanical hand and a discharging module. The conveying module centrally conveys a wafer ingot to a stripping station, the lifting and stripping module is adhered to by stripping liquid and judges wafer stripping according to a sudden drop in pulling force. The carrying module clamps the edge of the wafer and completes transfer, standing cleaning, air drying, turning over and detecting and feeding, the detecting module completes edge finding positioning, notch gap adjustment and broken piece detection, and the second mechanical hand packs the wafer. The equipment can reduce the number of handovers, reduce pollution and broken piece risk.

Description

Technical Field

[0001] This invention relates to the field of automated semiconductor wafer processing equipment, and in particular to an automated wafer stripping, cleaning, inspection and unloading equipment and a wafer processing method. Background Technology

[0002] In the wafer fabrication process of semiconductor materials such as silicon carbide, silicon, and sapphire, the ingot or wafer assembly typically requires laser processing, interface modification, or pre-cutting before being separated from the ingot or carrier by a peeling mechanism. Because the peeled wafer is thin and its edges are easily damaged, and peeling fluid, debris, particles, or other contaminants may remain at the peeling interface, subsequent processes such as cleaning, drying, flipping, edge positioning, breakage detection, and packaging are usually required. In existing production lines, these processes are often completed by multiple independent devices or workstations. After peeling, the wafer undergoes multiple robotic handovers, adsorption, placement, and repositioning, which can easily introduce surface contamination, suction cup contamination transfer, wafer orientation deviations, and breakage risks, especially when the wafer is wet or semi-wet after peeling.

[0003] Chinese patent document CN120362766A discloses a wafer stripping and inspection device, which includes a conveying component and a stripping component. The conveying component has a transmission element, a guide rail, and a base for supporting the wafer ingot. The stripping component includes a lifting component, a support element, a clamp, and a through-beam optical sensor. In the specific stripping process, the wafer ingot is conveyed by the transmission element to the bottom of the stripping component. The lifting component lowers the support element, allowing the clamp to pick up the wafer from the wafer ingot. The inspection element determines whether the picked-up wafer is intact, and the through-beam optical sensor detects whether the wafer ingot has detached from the base. This technology can realize wafer ingot conveying, lifting and clamping, and preliminary inspection. However, its focus is on the stripping and inspection stages. It does not provide a complete integrated structure for how to continuously complete cleaning, drying, flipping, edge positioning, fragment detection, and packaging of the stripped wafer while maintaining a controlled posture. At the same time, this technology does not set up an independent suction cup cleaning and drying process to address the problem that stripping fluid or debris may adhere to the surface of the suction cup after stripping, and there is still a risk that contaminants will continue to be transferred with the robotic arm.

[0004] Chinese patent document CN111009482B discloses a wafer cleaning apparatus and a wafer cleaning device. The wafer cleaning apparatus includes a clamping mechanism and a brush body. The clamping mechanism is used to clamp the wafer, and the brush body can abut against the surface of the wafer to be cleaned and move relative to it to clean the wafer surface. The document also discloses that the clamping mechanism may include a turning mechanism to drive the clamping part to turn so that the surface of the wafer to be cleaned faces the brush body, and the wafer can be transferred to the clamping mechanism or removed from the clamping mechanism by a robotic arm. This technology can improve the cleaning effect of the wafer surface, but it belongs to the structural design of independent cleaning equipment or cleaning station. The wafer needs to be transferred by the robotic arm to the clamping mechanism before cleaning. It does not involve a continuous transport path from the wafer stripping to cleaning, drying, flipping and inspection loading, nor does it disclose a technical solution that uses the same long-stroke transport module's moving seat, follow-up drag chain, rotary drive assembly and edge clamping assembly to enable the wafer to complete horizontal transfer, 90° vertical cleaning, double-sided drying, continued rotation and flipping and inspection module handover in the same clamping state.

[0005] Therefore, while existing technologies disclose individual techniques such as wafer stripping, wafer cleaning, wafer inspection, and robotic transfer, there is still a lack of automated equipment that organically combines stripping, contamination isolation, long-stroke edge clamping and handling, upright cleaning, double-sided drying, continuous flipping, vacuum suction cup relay inspection, and unloading and packaging for wafers obtained from laser-processed ingot stripping. In particular, when stripped wafers contain stripping fluid or particle residue, reducing the number of wafer transfers, preventing contamination transfer via robotic suction cups, ensuring wafer stability during cleaning and flipping, and completing edge-finding positioning and breakage detection before packaging remain technical problems that need to be solved in this field. Summary of the Invention

[0006] The purpose of this invention is to provide an automatic wafer peeling, cleaning, inspection, and unloading device. By integrating wafer ingot conveying and centering, lifting and peeling, suction cup self-cleaning, long-stroke edge clamping and handling, wafer standing cleaning and drying, continuous flipping, edge finding and positioning, wafer breakage detection, and unloading and packaging into the same machine, this invention solves the problems of existing wafer peeling processes requiring multiple transfers and repeated positioning, easy contamination transmission, easy damage to wet wafers, and low efficiency in connecting peeling, cleaning, inspection, and packaging processes.

[0007] Firstly, in order to achieve the above-mentioned objectives, the present invention adopts the following technical solution:

[0008] An automated wafer stripping, cleaning, inspection, and unloading device includes a conveying module, a lifting stripping module, a first robotic arm, a suction cup cleaning module, a handling module, a wafer cleaning module, an inspection module, and a controller, all mounted on the machine platform. The conveying module is used to carry the crystal ingots and transport them to the stripping station; The lifting and stripping module is located above the stripping station and is used to complete the stripping of the wafer; The first robotic arm is used to transfer the stripped wafers from the lifting stripping module to the transport module, and after the wafers are handed over, they enter the suction cup cleaning module for suction cup cleaning and air drying; The transport module includes a linear drive mechanism, a moving base, a rotary drive assembly, and a wafer clamping assembly. The moving base is connected to the linear drive mechanism and can move between a wafer loading station, a wafer cleaning station, and a detection loading station. The rotary drive assembly is mounted on the moving base. The wafer clamping assembly is connected to the rotary drive assembly and is used to clamp the edge of the wafer. The rotary drive assembly is used to drive the wafer clamping assembly and the wafer it clamps to switch between a horizontal transfer posture, a vertical cleaning posture, and a flipping transfer posture. The wafer cleaning module is used to clean and dry the wafer from both sides when the wafer is in an upright cleaning posture. The detection module is used to receive the wafer after it has been flipped by the transport module, and to perform edge location, notch orientation adjustment and fragment detection on the wafer.

[0009] As a further improvement, the conveying module includes a conveying module frame panel, a transmission mechanism, a motor, a conveying trolley assembly, a liquid collection tank, and an RFID reading component. The transmission mechanism is mounted on the conveying module frame panel. The conveying trolley assembly and the liquid collection tank are connected to the moving end of the transmission mechanism, enabling the conveying trolley assembly to carry ingots and move between the loading position and the stripping station. The conveying trolley assembly is equipped with a positioning mechanism for clamping the ingot base and centering the ingot, as well as a detection sensor for detecting the presence or absence of ingots. The RFID reading component is used to read the identity information of the ingot base. The liquid collection tank is used to collect stripping liquid dripping from the lifting stripping module or the ingot.

[0010] As a further improvement, the lifting and stripping module is used to adhere to the upper surface of the ingot and output stripping fluid, so that the wafer to be stripped is in contact with the stripping fixture. During the lifting and stripping module's ascent, the wafer is judged to be stripped based on the state of the tension curve after continuous increase and then sudden drop. The lifting and stripping module includes a lifting component, a stripping fixture, a buffer mechanism, a tension sensor, and a detection sensor for detecting whether the ingot has detached from the ingot base. The stripping fixture is connected to the lifting component and has a stripping fluid output channel. The buffer mechanism is disposed between the lifting component and the stripping fixture. The controller is configured to control the stripping fixture to descend and adhere to the upper surface of the ingot, so that the stripping fluid fills the bonding interface between the stripping fixture and the wafer to be stripped. Then, the lifting component is controlled to rise, and the tensile curve collected by the tension sensor is used to determine whether the wafer has been stripped from the ingot.

[0011] As a further improvement, the controller is also configured to: first perform pre-pressure holding after the stripping jig adheres to the ingot, and then open the stripping fluid output channel to form a liquid film of stripping fluid at the adhesion interface; continuously collect the tension value of the tension sensor during the lifting assembly's ascent; when the tension value decreases by more than a preset amplitude or the rate of decrease exceeds a preset threshold within a preset time window, it is determined that the wafer stripping is complete, and the lifting assembly is controlled to decelerate or stop rising; when the detection sensor used to detect whether the ingot has detached from the ingot base outputs an abnormal signal, the lifting assembly is controlled to stop and an alarm is issued.

[0012] As a further improvement, the suction cup cleaning module includes a cleaning tank, an opening and closing door, a sealing element, a nozzle, and an air knife. The opening and closing door can be closed after the suction cup of the first robot arm is inserted into the cleaning tank. The sealing element can fit against the suction cup or suction cup mounting part of the first robot arm to limit the splashing of cleaning fluid. The nozzle is used to clean the surface of the suction cup, and the air knife is used to dry the suction cup during the withdrawal of the first robot arm.

[0013] And / or, the wafer cleaning module includes a lower housing, an upper housing that can be raised and lowered relative to the lower housing, a nozzle assembly, and a drying assembly. The controller is configured to control the upper housing to descend and form a cleaning space with the lower housing after the wafer clamping assembly feeds the wafer into the wafer cleaning module, control the nozzle assembly to spray cleaning fluid from both sides of the wafer, and control the drying assembly to blow dry gas from both sides of the wafer.

[0014] As a further improvement, the detection module includes an edge finder, a fragment detection component, a vacuum chuck, and an edge-finding positioning base. The vacuum chuck can move vertically, translate, and rotate around a vertical axis. The controller is configured to control the vacuum chuck to rise and adsorb the wafer when the transport module transports the wafer to the detection and loading station. After confirming that the vacuum adsorption state meets the preset conditions, the controller controls the wafer clamping component to release and retract, and then controls the vacuum chuck to descend. The edge finder completes the wafer edge positioning and notch notch direction adjustment, and the fragment detection component detects the wafer edge integrity during wafer rotation.

[0015] And / or, the device further includes a second robotic arm, a transfer station module, and a wafer unloading module. The second robotic arm is used to transfer the inspected wafers to the wafer unloading module, which is used to carry the wafer cassette and cooperate with the second robotic arm to complete the wafer cassette loading. The wafer unloading module includes a stage assembly and a stage base assembly. The stage assembly is mounted on the rotation mechanism of the stage base assembly. The stage assembly is equipped with an 8-inch cassette limiter, a 12-inch cassette limiter, an 8-inch cassette detection sensor, a 12-inch cassette detection sensor, and a wafer protrusion detection sensor. The rotation mechanism enables the stage assembly containing the wafer cassette to switch between a loading / unloading posture and a cassette loading posture aligned with the second robotic arm. The transfer station module is mounted on the machine platform and is equipped with a wafer material detection sensor. When the controller identifies that the size of the wafer being stripped is not a compatible 8-inch or 12-inch wafer with the unloading module, it controls the second robotic arm to transfer the detected wafer to the transfer station module.

[0016] As a further improvement, the handling module also includes a support column, a long-stroke crossbeam, and a follower cable chain. The long-stroke crossbeam is mounted on the machine base via the support column. The linear drive mechanism is arranged along the length of the long-stroke crossbeam. The follower cable chain is connected to the movable seat and is used to store air passages or cables when moving with the movable seat. The long-stroke crossbeam includes a beam body, a linear guide rail mounted on the beam body, and a slider that cooperates with the linear guide rail. The movable seat is fixed to the slider. The linear drive mechanism includes a drive motor and a transmission component. The drive motor drives the movable seat to perform linear reciprocating motion along the long-stroke crossbeam through the transmission component. The transmission component is one of a synchronous belt, a rack and pinion pair, or a lead screw pair.

[0017] As a further improvement, the wafer clamping assembly includes an arc-shaped support frame, multiple edge clamping claws spaced circumferentially along the arc-shaped support frame, and a clamping drive. The multiple edge clamping claws are used to clamp the wafer from its outer peripheral edge, and the clamping drive is used to drive at least one edge clamping claw to move closer to or away from the wafer edge. The arc-shaped support frame is a semi-circular or open-ring structure, and the open area of ​​the arc-shaped support frame is used to avoid the vacuum suction cup of the first robotic arm or detection module, so that the wafer can be transferred between the first robotic arm, the wafer clamping assembly, and the detection module.

[0018] And / or, the rotation drive assembly includes a rotary motor, a reduction mechanism, and a rotary shaft, the wafer clamping assembly is connected to the rotary shaft, and the controller is configured to control the rotary motor to drive the wafer clamping assembly to rotate 90° first, so that the wafer changes from a horizontal transfer posture to an upright cleaning posture; after the wafer has completed cleaning and drying, the controller further controls the wafer clamping assembly to rotate 90°, so that the wafer changes from an upright cleaning posture to a flipped transfer posture.

[0019] Secondly, the present invention also provides a wafer processing method using the aforementioned automatic wafer stripping, cleaning, inspection, and unloading equipment, comprising the following steps:

[0020] S1. The conveying module reads the crystal ingot's identity information, centers and clamps the crystal ingot, and conveys it to the stripping station;

[0021] S2. The lifting and stripping module descends to adhere to the upper surface of the ingot and outputs stripping fluid. Then it rises and judges that the wafer stripping is complete based on the state of the tension curve after continuous increase and sudden drop.

[0022] S3. The first robotic arm transfers the stripped wafer to the wafer clamping assembly of the transport module. Then, the first robotic arm enters the suction cup cleaning module to perform suction cup cleaning and drying.

[0023] S4. The moving seat of the transport module moves the wafer to the wafer cleaning station. The rotation drive component drives the wafer clamping component to rotate 90°, so that the wafer is in an upright cleaning posture. The wafer cleaning module cleans and dries both sides of the wafer.

[0024] S5. The rotary drive assembly drives the wafer clamping assembly to continue rotating 90° to complete the wafer flipping, and the moving seat moves the wafer to the inspection and loading station.

[0025] S6. The vacuum chuck of the detection module rises and adsorbs the wafer, the wafer clamping assembly is released and retracts, and the detection module performs edge positioning, notch notch orientation adjustment and fragmentation detection on the wafer.

[0026] As a further improvement, in step S2, after the peeling fixture of the lifting and peeling module is attached to the upper surface of the ingot, it first performs pre-pressure holding, and then outputs peeling fluid to the bonding interface between the peeling fixture and the wafer to be peeled, and continuously collects the tension value during the lifting component's ascent; when the tension value decreases by more than a preset amplitude or the rate of decrease exceeds a preset threshold within a preset time window, and no abnormal separation of the ingot from the ingot base is detected, the wafer is determined to have been peeled off.

[0027] And / or, in step S6, after the vacuum chuck rises and adsorbs the wafer, it is first confirmed that the vacuum adsorption state meets the preset conditions, and then the wafer clamping assembly is controlled to release the wafer and retract.

[0028] This invention uses a conveying module to center and clamp the ingot base and read the ingot's identity information, enabling the ingot to enter the stripping station with a defined posture, improving pre-stripping positioning consistency and batch traceability. A lifting stripping module creates a stripping fluid interface between the stripping fixture and the wafer, and a tension sensor detects a sudden drop after a sustained increase in tension to determine if stripping is complete, reducing wafer damage caused by insufficient or excessive stripping. A first robotic arm, after picking up the wafer, enters a suction cup cleaning module for cleaning and drying, removing stripping fluid, debris, and particles from the suction cup surface, reducing the risk of contaminants being transferred to subsequent wafers. The long-stroke crossbeam, moving seat, follow-up drag chain, rotary drive assembly, and wafer clamping assembly of the handling module ensure that the wafer is held in the same position. The system completes horizontal transfer, 90° vertical cleaning, double-sided cleaning and drying, continued rotation and flipping, and inspection and loading while in an edge-clamped state. This reduces the number of wafer transfers in wet or semi-wet conditions, lowers the probability of adsorption marks, pinch marks, and breakage, and improves the stability of wafer attitude switching. Through the controlled relay between the vacuum suction cup of the detection module and the handling module, the wafer is released only after adsorption is confirmed, avoiding wafer drop and collision, and further completing edge-finding positioning, notch direction adjustment, and breakage detection. Through the rotatable stage, cassette limit, cassette detection, and wafer protrusion detection of the unloading module, the wafer cassette can be aligned with the center of the second robotic arm for cassette loading, and wafer protrusion abnormalities can be identified before cassette loading, thereby improving the continuity, safety, and automation of the cleaning, inspection, and cassette loading process after wafer stripping. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of the automatic wafer stripping, cleaning, inspection and unloading equipment of the present invention.

[0030] Figure 2 This is a schematic diagram of the plan layout of the automatic wafer stripping, cleaning, inspection and unloading equipment of the present invention.

[0031] Figure 3 This is a schematic diagram of the working process of the automatic wafer stripping, cleaning, inspection and unloading equipment of the present invention.

[0032] Figure 4 This is a schematic diagram of the structure of the conveying module 300 of the present invention.

[0033] Figure 5 This is a schematic diagram of the lifting and stripping module 400 of the present invention.

[0034] Figure 6 This is a schematic diagram of the suction cup cleaning module 600 of the present invention.

[0035] Figure 7 This is a schematic diagram of the internal structure of the suction cup cleaning module 600 of the present invention.

[0036] Figure 8This is a schematic diagram of the transport module 700 of the present invention.

[0037] Figure 9 This is a schematic diagram of the structure of the wafer cleaning module 800 of the present invention.

[0038] Figure 10 This is a schematic diagram of the detection module 900 of the present invention.

[0039] Figure 11 This is a schematic diagram of the structure of the vacuum suction cup 920.

[0040] Figure 12 This is a schematic diagram of the structure of the feeding module 1100 of the present invention.

[0041] Figure 13 This is a schematic diagram of the structure of the turntable module 1200 in this invention. Detailed Implementation

[0042] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the following embodiments are used to illustrate the technical solutions of the present invention and do not limit the scope of protection of the present invention. Without departing from the overall concept of the present invention, those skilled in the art can make equivalent substitutions for the form of the drive mechanism, the type of sensor, the number of clamping elements, the relative positions of the workstations, and the control parameters.

[0043] like Figures 1 to 3 As shown, this embodiment provides an automatic wafer stripping, cleaning, inspection, and unloading device, including a machine base 100, a controller 200, and a conveying module 300, a lifting stripping module 400, a first robotic arm 500, a suction cup cleaning module 600, a handling module 700, a wafer cleaning module 800, an inspection module 900, a second robotic arm 1000, an unloading module 1100, and a transfer station module 1200, all mounted on the machine base 100. The machine base 100 can be a rectangular frame structure, with a mounting panel and several mounting reference holes on the upper part, and support feet, leveling feet, and electrical installation space on the lower part. The functional modules are arranged on the machine base 100 according to the flow direction of the ingot 1300 and the wafer 1320, so that the ingot 1300 enters the stripping station from the loading position, and the stripped wafer 1320 then sequentially undergoes cleaning, drying, flipping, inspection, and unloading / packing processes along the long stroke direction of the handling module 700.

[0044] The controller 200 can be a PLC controller, an industrial computer, or a combination of both. The controller 200 communicates with motors, cylinders, solenoid valves, vacuum generators, sensors, a robotic arm control unit, and a human-machine interface to perform actions such as ingot conveying, stripping judgment, robotic arm handover, suction cup cleaning, wafer cleaning, wafer flipping, detection and positioning, and unloading and packaging. The controller 200 has preset wafer processing programs and can call up corresponding process parameters based on the ingot 1300's identity information, wafer specifications, stripping results, and detection results.

[0045] In this embodiment, the ingot 1300 can be a silicon ingot, silicon carbide ingot, sapphire ingot, or other semiconductor ingot that has undergone laser processing, internal modification, or pre-cutting. The ingot 1300 is placed on the ingot base 1310, and the upper end of the ingot 1300 has a wafer 1320 to be stripped. After the wafer 1320 is stripped by the lifting and stripping module 400, the residual stripping liquid, debris, and particles on its surface need to be removed, and the notch direction adjustment and fragmentation detection are performed before unloading. The equipment in this embodiment arranges these processes on the same machine 100, and reduces the repeated transfer of the wafer 1320 in wet or semi-wet conditions by the edge clamping and continuous posture switching of the handling module 700.

[0046] The conveying module 300 of this invention can adopt a structure as shown in Chinese patents (CN120172069A, CN223751813U); or it can adopt a structure as shown in Chinese patents (CN120172069A, CN223751813U). Figure 4 As shown, the conveying module 300 includes a conveying module frame panel 310, a transmission mechanism 320, a motor 330, a conveying trolley assembly 340, a liquid collection tank 350, and an RFID reading assembly 360. The conveying module frame panel 310 is a long strip or rectangular plate structure, fixedly mounted on the machine base 100. The transmission mechanism 320 is arranged along the length of the conveying module frame panel 310 and can be a synchronous belt drive mechanism, a ball screw drive mechanism, a rack and pinion drive mechanism, or a linear motor mechanism. The motor 330 is located at one end or on the side of the transmission mechanism 320 and is used to input power to the transmission mechanism 320.

[0047] The conveyor trolley assembly 340 is mounted on the moving end of the transmission mechanism 320, enabling the conveyor trolley assembly 340 to reciprocate between the ingot loading position and the stripping station along a first direction. The conveyor trolley assembly 340 includes a support plate 341 for supporting the ingot base 1310, a positioning mechanism 342 for clamping the ingot base 1310, a synchronous drive mechanism 343, and a detection sensor 344 for detecting the presence or absence of the ingot 1300. The positioning mechanism 342 may include at least two sets of opposing centering grippers, each centering gripper arranged around the ingot base 1310. The synchronous drive mechanism 343 may be a linkage synchronization mechanism, a gear synchronization mechanism, a bidirectional screw mechanism, or a pneumatic synchronous clamping mechanism. When the detection sensor 344 detects that the ingot 1300 has been placed in place, the controller 200 controls the synchronous drive mechanism 343 to move, causing each centering gripper to simultaneously move closer to the center of the ingot base 1310, thereby clamping the ingot base 1310 and completing the centering of the ingot 1300. Through this centering action, when the ingot 1300 enters the stripping station, its center can be aligned with the center of the stripping fixture 420 of the lifting stripping module 400, reducing the risk of uneven stripping caused by the bias of the stripping fixture 420.

[0048] An RFID reader 360 is positioned on the loading side of the conveying module 300 or near the conveying path to read RFID tag information on the ingot base 1310. The read information may include ingot number, batch, specifications, processing parameters, or previous laser processing information. The controller 200 binds the information obtained by the RFID reader 360 with subsequent stripping, cleaning, inspection, and unloading information for easy traceability. A collection tank 350 is positioned below or to the side of the conveying trolley assembly 340 and moves with the moving end of the transmission mechanism 320. The collection tank 350 collects stripping fluid dripping from the stripping fixture 420, ingot 1300, or near the ingot base 1310 during the stripping process. A drain port 351 may be provided at the bottom or side of the collection tank 350, connecting to a drain pipe within the machine 100 to guide the stripping fluid into a recovery container or waste liquid pipe, preventing the stripping fluid from spreading on the machine 100, corroding moving parts, or contaminating sensors.

[0049] The lifting and stripping module 400 of the present invention can adopt a wafer stripping device disclosed in Chinese Patent (CN219106084U), or it can be as follows: Figure 5As shown, the lifting and stripping module 400 is positioned above the stripping station and includes a lifting assembly 410, a stripping fixture 420, a buffer mechanism 430, a tension sensor 440, and a bottom support detachment detection sensor 450. The lifting assembly 410 may include a lifting motor 411, a lead screw guide rail pair 412, a guide column 413, and a mounting plate 414. It is a vertical motion mechanism used to drive the stripping fixture 420 to move vertically. The stripping fixture 420 is located at the lower end of the lifting assembly 410. The stripping fixture 420 has a clamping surface facing the upper surface of the ingot 1300 and forms a stripping fluid output channel inside. The stripping fluid output channel is connected to a stripping fluid supply unit. When the stripping fixture 420 descends to contact the upper surface of the ingot 1300, the stripping fluid can enter the clamping interface between the stripping fixture 420 and the wafer 1320 to be stripped.

[0050] A buffer mechanism 430 is disposed between the lifting assembly 410 and the stripping fixture 420. The buffer mechanism 430 can be a spring-floating mechanism, an air-floating buffer mechanism, a guide-guided elastic connection mechanism, or a damping buffer mechanism. When the stripping fixture 420 descends to contact the upper surface of the ingot 1300, the buffer mechanism provides a certain floating margin to prevent the stripping fixture 420 from causing surface damage to the wafer 1320 or localized breakage of the ingot 1300 due to rigid impact. A tension sensor is disposed on the force path of the lifting assembly to detect the tension generated during the upward movement of the stripping fixture 420. A base detachment detection sensor 450 is disposed near the stripping station to detect whether the ingot 1300 or the ingot base 1310 has abnormally moved upward, tilted, or detached.

[0051] During the actual peeling process, after the conveying module 300 transports the ingot 1300 to the peeling station, the controller 200 controls the lifting assembly 410 to descend, causing the clamping surface of the peeling fixture 420 to adhere to the wafer 1320 to be peeled on the upper surface of the ingot 1300. After the peeling fixture 420 adheres, the controller 200 can first perform pre-pressure holding to stabilize the adhesion interface. Subsequently, the controller 200 opens the peeling fluid output channel, allowing the peeling fluid to fill the adhesion interface between the peeling fixture 420 and the wafer 1320 to be peeled, forming a liquid film. This liquid film helps to improve the adhesion or adsorption stability between the peeling fixture 420 and the wafer 1320, and also helps to reduce local stress concentration during peeling.

[0052] After the stripping fluid is output, the lifting assembly 410 drives the stripping fixture 420 to rise. Since the wafer 1320 to be stripped has not yet been completely separated from the ingot 1300, the tension value detected by the tension sensor will gradually increase as the lifting assembly 410 rises. When the wafer 1320 separates from the ingot 1300 along the predetermined stripping layer, the tension value will suddenly drop in a short period of time. The controller 200 continuously collects the tension value from the tension sensor and determines that the wafer 1320 has been stripped based on the sudden drop after the continuous increase in the tension curve. More specifically, the controller 200 can determine whether the decrease in tension value within a preset time window is greater than a preset value, or whether the decrease slope exceeds a preset threshold; when the above conditions are met, it is determined that the wafer 1320 has been stripped from the ingot 1300. If the base detachment detection sensor 450 detects that the ingot 1300 has abnormally detached from the ingot base 1310, the controller 200 controls the lifting assembly 410 to stop rising and issues an alarm to avoid lifting the ingot base 1310 or the undetached ingot 1300 as a whole.

[0053] like Figure 1 , Figure 2 and Figure 6 As shown, the first robotic arm 500 is positioned between the lifting and stripping module 400 and the transport module 700. After the lifting and stripping module 400 raises the stripped wafer 1320 to the pick-up height, the first robotic arm 500 uses a suction cup to pick up the wafer 1320 and removes it from the stripping fixture 420. The first robotic arm 500 transfers the wafer 1320 to the wafer clamping assembly 770 of the transport module 700, where the wafer clamping assembly 770 clamps the wafer 1320 from its outer peripheral edge. After releasing the wafer 1320, the first robotic arm 500 enters the suction cup cleaning module 600 for suction cup cleaning and drying.

[0054] like Figure 6 , Figure 7As shown, the suction cup cleaning module 600 includes a cleaning tank 610, a door 620, a seal 630, a nozzle 640, an air knife 650, and an exhaust pipe 660. The cleaning tank 610 is a box-like structure, forming an internal cleaning space for the suction cup of the first robotic arm 500 to enter. The door 620 is located on one side of the cleaning tank 610 and can close after the suction cup of the first robotic arm 500 extends into the cleaning tank 610. The seal 630 is located at the door 620 or the suction cup inlet of the cleaning tank 610. The seal 630 can be an annular sealing rubber or a flexible sealing strip, used to fit against the suction cup or suction cup mounting part of the first robotic arm 500, thereby limiting the splashing of cleaning fluid. The nozzle 640 is located inside the cleaning tank 610 and faces the working surface of the suction cup, used to spray cleaning water or cleaning fluid. The air knife 650 is located on the door 620 where the first robotic arm 500 exits, used to blow out dry gas to clean and dry the surface and edges of the suction cup. The exhaust duct 660 is located on the top or side of the cleaning box 610 and is used to exhaust humid gas or cleaning mist.

[0055] In this embodiment, the first robotic arm 500 performs suction cup cleaning after each transfer of the stripped wafer 1320 to the transport module 700. The working principle is as follows: after the wafer 1320 is stripped from the ingot 1300, stripping fluid, particles, or debris may remain on its surface or near its edges. When the first robotic arm 500 adsorbs and transfers the wafer 1320, the surface of its suction cup may be contaminated with these pollutants. If cleaning is not performed, these contaminants may be transferred to the next wafer 1320 during subsequent wafer removal processes. The suction cup cleaning module 600 performs online cleaning of the suction cups of the first robotic arm 500 through a combination of closed cleaning, spray rinsing, and withdrawal drying, thereby reducing the risk of contamination transfer.

[0056] like Figure 8 As shown, the handling module 700 includes a support column 710, a long-stroke crossbeam 720, a linear drive mechanism 730, a movable seat 740, a follower cable chain 750, a rotary drive assembly 760, and a wafer clamping assembly 770. The support column 710 is fixed to the machine base 100. The long-stroke crossbeam 720 is mounted on the support column 710 and extends along the line connecting the wafer loading station, the wafer cleaning station, and the inspection loading station. The long-stroke crossbeam 720 includes a beam body 721, a linear guide rail 722 mounted on the beam body 721, and a slider that cooperates with the linear guide rail 722. The movable seat 740 is fixed to the slider and connected to the linear drive mechanism 730.

[0057] The linear drive mechanism 730 includes a drive motor and a transmission component. The transmission component can be a synchronous belt, a rack and pinion pair, or a lead screw pair. The drive motor drives the movable seat 740 to perform linear reciprocating motion along the long-stroke crossbeam 720 via the transmission component. The controller 200 controls the drive motor to ensure that the movable seat 740 accurately stops at the wafer loading station, wafer cleaning station, and inspection loading station. One end of the follower cable chain 750 is fixed to the machine base 100 or the long-stroke crossbeam 720, and the other end is connected to the movable seat 740. The air circuit, vacuum line, clamping drive cable, rotary drive cable, and sensor signal line can be arranged inside the follower cable chain 750. When the movable seat 740 reciprocates, the follower cable chain 750 bends and unfolds synchronously to prevent cables and lines from sagging, tangling, or wearing during long-stroke motion.

[0058] A rotary drive assembly 760 is mounted on a movable base 740 and includes a rotary motor, a reduction gear, and a rotary shaft. A wafer clamping assembly 770 is connected to the rotary shaft. The rotary motor drives the rotary shaft to rotate via the reduction gear, thereby causing the wafer clamping assembly 770 and the wafer 1320 it clamps to switch between different postures. The wafer clamping assembly 770 includes an arc-shaped support frame 771, multiple edge clamping claws 772, and a clamping drive 773. The arc-shaped support frame 771 is a semi-annular or open annular structure, with its opening area used to avoid the vacuum suction cup 920 of the first robotic arm 500 or the detection module 900. The multiple edge clamping claws 772 are spaced circumferentially along the arc-shaped support frame 771 for clamping the wafer 1320 from its outer peripheral edge. The clamping drive 773 can be a cylinder, an electric gripper, or a miniature linear actuator, used to drive at least one edge clamping claw 772 to move closer to or away from the edge of the wafer 1320.

[0059] The wafer clamping assembly 770 employs an edge clamping method, which reduces contact with the effective surface of the wafer 1320. Compared to handling methods that directly adsorb the wafer surface using suction cups, edge clamping reduces adsorption marks, watermarks, and particle imprints. Furthermore, when the wafer 1320 is wet or semi-wet, edge clamping maintains the wafer 1320's stable posture during cleaning, drying, and flipping. The arc-shaped support frame 771 is designed with an opening, allowing the first robotic arm 500 to feed the wafer 1320 between the edge clamping claws 772 from the opening area. It also allows the vacuum suction cup 920 of the detection module 900 to approach the wafer 1320 during subsequent handover, thereby reducing structural interference.

[0060] The operation of the transport module 700 is as follows: The moving seat 740 first stops at the wafer loading station, and the wafer clamping assembly 770 is in a horizontal transfer posture. The first robot arm 500 delivers the stripped wafer 1320 to the wafer clamping assembly 770, and the clamping drive 773 drives the edge clamping claws 772 to clamp the outer peripheral edge of the wafer 1320. After confirming clamping, the first robot arm 500 releases the wafer 1320 and retracts. Then, the moving seat 740 moves along the long-stroke crossbeam 720 to the wafer cleaning station. Upon reaching the wafer cleaning station, the rotation drive assembly 760 drives the wafer clamping assembly 770 to rotate 90°, changing the wafer 1320 from a horizontal transfer posture to an upright cleaning posture. The wafer 1320 enters the wafer cleaning module 800 in the upright cleaning posture, which facilitates the downward drainage of the cleaning fluid along the surface of the wafer 1320 and reduces liquid retention. After cleaning and drying, the rotary drive assembly 760 continues to drive the wafer clamping assembly 770 to rotate 90°, causing the wafer 1320 to switch from an upright cleaning posture to a flipped transfer posture. Thus, the wafer 1320 completes horizontal transfer, upright cleaning, and flipping within the same clamping assembly, reducing the need for repeated gripping, placement, and repositioning in traditional processes.

[0061] like Figure 9 As shown, the wafer cleaning module 800 includes a lower housing 810, an upper housing 820, an upper housing lifting cylinder, a nozzle assembly 840, a drying assembly 850, and a drain port 860. The lower housing 810 is fixed on the machine base 100, and the upper housing 820 can be raised and lowered relative to the lower housing 810 under the drive of the upper housing lifting cylinder. Before the wafer 1320 enters, the upper housing 820 is in a raised state to form an opening space for the wafer clamping assembly 770 to enter. After the transport module 700 delivers the wafer 1320 to the cleaning station and places it in an upright cleaning posture, the controller 200 controls the upper housing 820 to descend, so that the upper housing 820 and the lower housing 810 cooperate to form a cleaning space.

[0062] The nozzle assembly 840 includes opposing nozzle groups located on both sides of the wafer 1320 and a nozzle lifting mechanism that drives the opposing nozzle groups to reciprocate vertically. During cleaning, the opposing nozzle groups spray cleaning fluid from both sides of the wafer 1320 and can alternately scan the surface of the wafer 1320 from top to bottom and from bottom to top under the drive of the nozzle lifting mechanism. The drying assembly 850 includes opposing air knife groups located on both sides of the wafer 1320. After cleaning, the controller 200 stops the fluid supply and starts the opposing air knife groups, so that drying gas is blown from both sides of the wafer 1320 onto the wafer surface to remove residual water. The cleaning fluid and rinsed particles are discharged through the drain port 860 at the bottom of the lower housing 810. When the wafer cleaning module 800 is used in conjunction with the handling module 700, the wafer 1320 is always held by the wafer clamping assembly 770 throughout the entire cleaning and drying process, avoiding repeated handover before and after cleaning.

[0063] like Figure 10 , Figure 11 As shown, the detection module 900 includes an edge-finding positioning base 910, a vacuum chuck 920, a Z-axis lifting mechanism 930, a Y-axis translation mechanism 940, a first rotation mechanism 950, an edge finder 960, a fragment detection component 970, and a vacuum pressure sensor. The vacuum chuck 920 is mounted on the first rotation mechanism 950, which is connected to the Y-axis translation mechanism 940 and the Z-axis lifting mechanism 930, enabling the vacuum chuck 920 to move vertically, translate, and rotate around a vertical axis. The edge finder 960 is positioned on the edge-finding positioning base 910 and faces the edge of the wafer 1320 supported by the vacuum chuck 920. The fragment detection component 970 is located on the outer periphery of the wafer 1320's rotation path and can be a photoelectric sensor, a laser sensor, a displacement sensor, or a vision inspection component. The vacuum pressure sensor is used to detect the adsorption state of the vacuum chuck 920.

[0064] After the handling module 700 moves the flipped wafer 1320 to the inspection and loading station, as follows: Figure 12 As shown, the vacuum chuck 920 rises under the drive of the Z-axis lifting mechanism 930 and approaches the wafer 1320, simultaneously initiating vacuum adsorption. A vacuum pressure sensor detects the vacuum pressure, and only when the vacuum adsorption state meets preset conditions does the controller 200 control the wafer clamping assembly 770 to release the wafer 1320 and retract with the moving base 740. Subsequently, the vacuum chuck 920 lowers the wafer 1320 to the detection position. This "adsorption confirmation followed by clamping and release" relay method prevents the wafer 1320 from falling off or colliding during the handover process.

[0065] During the inspection process, the edge finder 960 detects the edge contour and notch position of wafer 1320. The controller 200 determines the center offset of wafer 1320 and the notch direction based on the signal output by the edge finder 960, and corrects the position and notch direction of wafer 1320 through the Y-axis translation mechanism 940 and the first rotation mechanism 950, ensuring that wafer 1320 meets the subsequent packaging orientation requirements. Then, the first rotation mechanism 950 drives the vacuum chuck 920 and wafer 1320 to rotate one revolution, and the fragment detection component 970 detects the edge integrity of wafer 1320. When the fragment detection component 970 detects abnormal notches, breaks, abrupt changes, or edge variations exceeding a threshold on the wafer edge, the controller 200 classifies wafer 1320 as an abnormal wafer; if the detection result meets the requirements, wafer 1320 is determined to be ready for the unloading and packaging process.

[0066] like Figure 12As shown, the unloading module 1100 includes a stage assembly 1110, a stage base assembly 1120, a second rotation mechanism 1130, an 8-inch wafer cassette limiter 1141, a 12-inch wafer cassette limiter 1142, an 8-inch wafer cassette detection sensor 1151, a 12-inch wafer cassette detection sensor 1152, and a wafer protrusion detection sensor 1160. The stage assembly 1110 is mounted on the second rotation mechanism 1130 of the stage base assembly 1120. The stage assembly 1110 can be a plate-like or platform-like structure, on which limiters and detection sensors for positioning wafer cassettes are provided. The 8-inch wafer cassette limiter 1141 is used to limit the 8-inch wafer cassette, and the 12-inch wafer cassette limiter 1142 is used to limit the 12-inch wafer cassette. The 8-inch wafer cassette detection sensor 1151 and the 12-inch wafer cassette detection sensor 1152 are used to detect whether the wafer cassettes of the corresponding sizes are placed in place. The wafer protrusion detection sensor 1160 is used to detect whether the wafer 1320 protrudes from the outside of the wafer cassette.

[0067] In its initial state, the loading module 1100 positions the stage assembly 1110 in a posture conducive to manual or external robot loading and unloading of wafer cassettes. Once the cassette detection sensor detects that the wafer cassette is in place, the second rotating mechanism 1130 rotates the stage assembly 1110 to a cassette loading posture, aligning the center of the wafer cassette with the loading center of the second robotic arm 1000. The second robotic arm 1000 removes the wafer 1320 from the detection module 900 and loads it into the wafer cassette. Before or after cassette loading, the wafer protrusion detection sensor 1160 detects the wafer cassette entrance or edge area. If the wafer 1320 is detected protruding from the outside of the wafer cassette, the controller 200 controls the second robotic arm 1000 to stop and trigger an alarm, thereby preventing collisions with the wafer 1320 during subsequent cassette loading or stage rotation.

[0068] like Figure 13 As shown, the transfer station module 1200 is mounted on the machine 100 and is equipped with a wafer presence detection sensor 1210. When the controller 200 identifies that the size of the wafer 1320 being stripped is not compatible with the 8-inch or 12-inch wafers of the unloading module 1100, or when the wafer 1320 needs to enter a temporary storage process, it controls the second robotic arm 1000 to transfer the detected wafer 1320 to the transfer station module 1200. The wafer presence detection sensor 1210 is used to detect whether a wafer 1320 is present on the transfer station module 1200, avoiding duplicate wafer placement or accidental wafer removal.

[0069] like Figure 3 As shown, the complete working process of this embodiment is as follows.

[0070] First, the ingot 1300 to be stripped, along with the ingot base 1310, is placed on the conveying trolley assembly 340 of the conveying module 300. The RFID reader 360 reads the identity information of the ingot base 1310, and after the detection sensor 344 confirms the presence of the ingot 1300, the positioning mechanism 342 clamps the ingot base 1310 and completes centering. The motor 330 drives the transmission mechanism 320, causing the conveying trolley assembly 340 to move the ingot 1300 to the stripping station below the lifting stripping module 400, while the liquid collection tank 350 moves below the stripping area.

[0071] Next, the lifting assembly 410 lowers the stripping fixture 420, which, under the action of the buffer mechanism 430, flexibly adheres to the wafer 1320 to be stripped on the upper surface of the ingot 1300. The controller 200 controls the stripping fixture 420 to perform pre-pressure holding and outputs stripping fluid to the bonding interface through the stripping fluid output channel 421. The lifting assembly 410 then rises, and the tension sensor 440 continuously collects the tension value. When the tension curve suddenly drops after continuously increasing, and the base detachment detection sensor 450 does not detect abnormal detachment of the ingot 1300 from the ingot base 1310, the controller 200 determines that the wafer 1320 has been stripped and controls the lifting assembly 410 to raise the wafer 1320 to the picking height of the first robotic arm 500.

[0072] Next, the first robotic arm 500 picks up the stripped wafer 1320 and transfers it to the wafer clamping assembly 770 of the transport module 700. After the wafer clamping assembly 770 clamps the outer peripheral edge of the wafer 1320 with edge grippers 772, the first robotic arm 500 releases the wafer 1320 and it enters the suction cup cleaning module 600. The opening and closing door 620 of the suction cup cleaning module 600 closes, the seal 630 restricts the splashing of cleaning fluid, the nozzle 640 cleans the suction cup surface of the first robotic arm 500, and the air knife 650 dries the suction cup during the withdrawal of the first robotic arm 500.

[0073] Then, the moving seat 740 of the transport module 700 moves along the long-stroke crossbeam 720 to the wafer cleaning module 800. The rotary drive assembly 760 drives the wafer clamping assembly 770 to rotate 90°, so that the wafer 1320 is in an upright cleaning posture. The upper housing 820 descends and forms a cleaning space with the lower housing 810. The nozzle assembly 840 performs reciprocating cleaning from both sides of the wafer 1320, and the drying assembly 850 blows dry air from both sides for drying. After cleaning and drying are completed, the upper housing 820 rises, and the rotary drive assembly 760 continues to drive the wafer clamping assembly 770 to rotate 90°, so that the wafer 1320 is flipped and in a flipped transfer posture.

[0074] Subsequently, the moving seat 740 continues to move the wafer 1320 to the inspection and loading station. The vacuum chuck 920 rises to pick up the wafer 1320. After the vacuum pressure sensor confirms that the adsorption state meets the preset conditions, the wafer clamping assembly 770 releases and retracts. The vacuum chuck 920 drives the wafer 1320 down to the inspection position. The edge finder 960 completes the edge positioning of the wafer 1320 and the notch direction identification. The Y-axis translation mechanism 940 and the first rotation mechanism 950 adjust the position of the wafer 1320 and the notch direction. Then, the first rotation mechanism 950 drives the wafer 1320 to rotate one revolution, and the fragment detection assembly 970 detects the edge integrity of the wafer.

[0075] Finally, the second robotic arm 1000 removes the inspected wafer 1320 from the inspection module 900. If the wafer 1320 is an 8-inch or 12-inch wafer compatible with the unloading module 1100, and the inspection results meet the packaging requirements, the second robotic arm 1000 loads the wafer 1320 into the corresponding wafer cassette; if the wafer 1320 is not within the compatible size range, or needs to be temporarily stored, the second robotic arm 1000 transfers the wafer 1320 to the transfer station module 1200.

[0076] As can be seen from the above structure and operation process, the equipment in this embodiment completes the identification reading, centering, and peeling station transport of the ingot 1300 through the conveying module 300; completes the peeling liquid adhesion and tension drop judgment through the lifting peeling module 400; removes residual contaminants from the suction cup surface through the suction cup cleaning module 600 after handover by the first robot arm 500; realizes long-stroke transfer, upright cleaning, air drying, flipping, and inspection loading of the wafer 1320 under the same edge clamping state through the handling module 700; realizes vacuum relay, edge finding and positioning, notch notch direction adjustment, and fragment detection through the detection module 900; and realizes wafer box positioning and anti-protrusion detection through the unloading module 1100. The modules are not simply arranged side by side, but form a continuous process chain around the processing requirements of the wet, easily contaminated, easily damaged, and oriented packaging of the peeled wafer 1320. This can reduce the number of wafer 1320 handovers and improve the stability, cleanliness, and unloading reliability of the wafer 1320 processing.

Claims

1. An automated wafer stripping, cleaning, inspection, and unloading device, characterized in that, It includes a conveying module, a lifting and stripping module, a first robotic arm, a suction cup cleaning module, a handling module, a wafer cleaning module, a detection module, and a controller, all mounted on the machine. The conveying module is used to carry the crystal ingots and transport them to the stripping station; The lifting and stripping module is located above the stripping station and is used to complete the stripping of the wafer; The first robotic arm is used to transfer the stripped wafers from the lifting stripping module to the transport module, and after the wafers are handed over, they enter the suction cup cleaning module for suction cup cleaning and air drying; The transport module includes a linear drive mechanism, a moving base, a rotary drive assembly, and a wafer clamping assembly. The moving base is connected to the linear drive mechanism and can move between a wafer loading station, a wafer cleaning station, and a detection loading station. The rotary drive assembly is mounted on the moving base. The wafer clamping assembly is connected to the rotary drive assembly and is used to clamp the edge of the wafer. The rotary drive assembly is used to drive the wafer clamping assembly and the wafer it clamps to switch between a horizontal transfer posture, a vertical cleaning posture, and a flipping transfer posture. The wafer cleaning module is used to clean and dry the wafer from both sides when the wafer is in an upright cleaning posture. The detection module is used to receive the wafer after it has been flipped by the transport module, and to perform edge location, notch orientation adjustment and fragment detection on the wafer.

2. The automatic wafer stripping, cleaning, inspection, and unloading equipment according to claim 1, characterized in that, The conveying module includes a conveying module frame panel, a transmission mechanism, a motor, a conveying trolley assembly, a liquid collection tank, and an RFID reading component. The transmission mechanism is mounted on the conveying module frame panel. The conveying trolley assembly and the liquid collection tank are connected to the moving end of the transmission mechanism, enabling the conveying trolley assembly to carry ingots and move between the loading position and the stripping station. The conveying trolley assembly is equipped with a positioning mechanism for clamping the ingot base and centering the ingot, as well as a detection sensor for detecting the presence or absence of ingots. The RFID reading component is used to read the identity information of the ingot base. The liquid collection tank is used to collect stripping liquid dripping from the lifting stripping module or the ingot.

3. The automatic wafer stripping, cleaning, inspection, and unloading equipment according to claim 1, characterized in that, The lifting and stripping module is used to adhere to the upper surface of the ingot and output stripping fluid, so that the wafer to be stripped is in contact with the stripping fixture. During the upward movement of the lifting and stripping module, the wafer is judged to be stripped based on the state of the tension curve after continuous increase and then sudden drop. The lifting and stripping module includes a lifting component, a stripping fixture, a buffer mechanism, a tension sensor, and a detection sensor for detecting whether the ingot has detached from the ingot base. The stripping fixture is connected to the lifting component and has a stripping fluid output channel. The buffer mechanism is set between the lifting component and the stripping fixture. The controller is configured to control the stripping fixture to descend and adhere to the upper surface of the ingot, so that the stripping fluid fills the bonding interface between the stripping fixture and the wafer to be stripped. Then, the lifting component is controlled to rise, and the tensile curve collected by the tension sensor is used to determine whether the wafer has been stripped from the ingot.

4. The automatic wafer stripping, cleaning, inspection, and unloading equipment according to claim 3, characterized in that, The controller is further configured to: first perform pre-pressure holding after the stripping jig adheres to the ingot, then open the stripping fluid output channel to form a liquid film of stripping fluid at the adhesion interface; continuously collect the tension value of the tension sensor during the lifting assembly's ascent; when the tension value decreases by more than a preset amplitude or the rate of decrease exceeds a preset threshold within a preset time window, determine that the wafer stripping is complete, and control the lifting assembly to decelerate or stop rising; when the detection sensor used to detect whether the ingot has detached from the ingot base outputs an abnormal signal, control the lifting assembly to stop and issue an alarm.

5. The automatic wafer stripping, cleaning, inspection, and unloading equipment according to claim 1, characterized in that, The suction cup cleaning module includes a cleaning tank, an opening and closing door, a sealing element, a nozzle, and an air knife. The opening and closing door can be closed after the suction cup of the first robot arm is inserted into the cleaning tank. The sealing element can fit against the suction cup or suction cup mounting part of the first robot arm to limit the splashing of cleaning fluid. The nozzle is used to clean the surface of the suction cup, and the air knife is used to dry the suction cup during the withdrawal of the first robot arm. And / or, the wafer cleaning module includes a lower housing, an upper housing that can be raised and lowered relative to the lower housing, a nozzle assembly, and a drying assembly. The controller is configured to control the upper housing to descend and form a cleaning space with the lower housing after the wafer clamping assembly feeds the wafer into the wafer cleaning module, control the nozzle assembly to spray cleaning fluid from both sides of the wafer, and control the drying assembly to blow dry gas from both sides of the wafer.

6. The automatic wafer stripping, cleaning, inspection, and unloading equipment according to claim 1, characterized in that, The detection module includes an edge finder, a fragment detection component, a vacuum chuck, and an edge-finding positioning base. The vacuum chuck can move vertically, translate, and rotate around a vertical axis. The controller is configured to control the vacuum chuck to rise and adsorb the wafer when the transport module transports the wafer to the detection and loading station. After confirming that the vacuum adsorption state meets the preset conditions, the controller controls the wafer clamping component to release and retract, and then controls the vacuum chuck to descend. The edge finder completes the wafer edge positioning and notch notch direction adjustment, and the fragment detection component detects the wafer edge integrity during wafer rotation. And / or, the device further includes a second robotic arm, a transfer station module, and a wafer unloading module. The second robotic arm is used to transfer the inspected wafers to the wafer unloading module, which is used to carry the wafer cassette and cooperate with the second robotic arm to complete the wafer cassette loading. The wafer unloading module includes a stage assembly and a stage base assembly. The stage assembly is mounted on the rotation mechanism of the stage base assembly. The stage assembly is equipped with an 8-inch cassette limiter, a 12-inch cassette limiter, an 8-inch cassette detection sensor, a 12-inch cassette detection sensor, and a wafer protrusion detection sensor. The rotation mechanism enables the stage assembly containing the wafer cassette to switch between a loading / unloading posture and a cassette loading posture aligned with the second robotic arm. The transfer station module is mounted on the machine platform and is equipped with a wafer material detection sensor. When the controller identifies that the size of the wafer being stripped is not a compatible 8-inch or 12-inch wafer with the unloading module, it controls the second robotic arm to transfer the detected wafer to the transfer station module.

7. The automatic wafer stripping, cleaning, inspection, and unloading equipment according to claim 1, characterized in that, The handling module also includes a support column, a long-stroke crossbeam, and a follower cable chain. The long-stroke crossbeam is mounted on the machine platform via the support column. The linear drive mechanism is arranged along the length of the long-stroke crossbeam. The follower cable chain is connected to the moving seat and is used to store air passages or cables when moving with the moving seat. The long-stroke crossbeam includes a beam body, a linear guide rail mounted on the beam body, and a slider that cooperates with the linear guide rail. The moving seat is fixed to the slider. The linear drive mechanism includes a drive motor and a transmission component. The drive motor drives the moving seat to perform linear reciprocating motion along the long-stroke crossbeam through the transmission component. The transmission component is one of a synchronous belt, a rack and pinion pair, or a lead screw pair.

8. The automatic wafer stripping, cleaning, inspection, and unloading equipment according to claim 1, characterized in that, The wafer clamping assembly includes an arc-shaped support frame, multiple edge clamping claws spaced circumferentially along the arc-shaped support frame, and a clamping drive. The multiple edge clamping claws are used to clamp the wafer from the outer peripheral edge of the wafer, and the clamping drive is used to drive at least one edge clamping claw to move closer to or away from the edge of the wafer. The arc-shaped support frame is a semi-circular or open-ring structure. The open area of ​​the arc-shaped support frame is used to avoid the vacuum suction cup of the first robotic arm or detection module, so that the wafer can be transferred between the first robotic arm, the wafer clamping assembly and the detection module. And / or, the rotation drive assembly includes a rotary motor, a reduction mechanism and a rotation shaft, the wafer clamping assembly is connected to the rotation shaft, and the controller is configured to control the rotary motor to drive the wafer clamping assembly to rotate 90° first, so that the wafer changes from a horizontal transfer posture to an upright cleaning posture; After the wafer has been cleaned and dried, the wafer clamping assembly is controlled to continue rotating 90°, so that the wafer changes from the upright cleaning posture to the flipped transfer posture.

9. A wafer processing method using the automated wafer peeling, cleaning, inspection, and unloading equipment according to any one of claims 1 to 8, characterized in that, Includes the following steps: S1. The conveying module reads the crystal ingot's identity information, centers and clamps the crystal ingot, and conveys it to the stripping station; S2. The lifting and stripping module descends to adhere to the upper surface of the ingot and outputs stripping fluid. Then it rises and judges that the wafer stripping is complete based on the state of the tension curve after continuous increase and sudden drop. S3. The first robotic arm transfers the stripped wafer to the wafer clamping assembly of the transport module. Then, the first robotic arm enters the suction cup cleaning module to perform suction cup cleaning and drying. S4. The moving seat of the transport module moves the wafer to the wafer cleaning station. The rotation drive component drives the wafer clamping component to rotate 90°, so that the wafer is in an upright cleaning posture. The wafer cleaning module cleans and dries both sides of the wafer. S5. The rotary drive assembly drives the wafer clamping assembly to continue rotating 90° to complete the wafer flipping, and the moving seat moves the wafer to the inspection and loading station. S6. The vacuum chuck of the detection module rises and adsorbs the wafer, the wafer clamping assembly is released and retracts, and the detection module performs edge positioning, notch notch orientation adjustment and fragmentation detection on the wafer.

10. The wafer processing method according to claim 9, characterized in that, In step S2, after the peeling fixture of the lifting and peeling module is attached to the upper surface of the ingot, it first performs pre-pressure holding, and then outputs peeling fluid to the bonding interface between the peeling fixture and the wafer to be peeled, and continuously collects the tension value during the lifting component's ascent; when the tension value decreases by more than a preset amplitude or the rate of decrease exceeds a preset threshold within a preset time window, and no abnormal separation of the ingot from the ingot base is detected, the wafer is determined to have been peeled off. And / or, in step S6, after the vacuum chuck rises and adsorbs the wafer, it is first confirmed that the vacuum adsorption state meets the preset conditions, and then the wafer clamping assembly is controlled to release the wafer and retract.

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