Liquid metal-based shape morphing insensitive flexible conductive fabric, and preparation method and application thereof
By uniformly depositing liquid metal microspheres on TPU fiber pads and forming continuous conductive paths, the problem of unstable resistance of existing flexible conductive materials under large deformation is solved. This achieves deformation-insensitive conductivity and simple process for preparing flexible conductive fabrics, which are suitable for a variety of applications.
Patent Information
- Application Number
- CN202610799502.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-04
- Publication Date
- 2026-08-04
AI Technical Summary
Existing flexible conductive materials have difficulty maintaining stable resistance under large deformation or multiple cyclic loads. In particular, it is difficult to achieve a uniform and stable conductive path on porous substrates. Moreover, the manufacturing process is complex or non-uniform, which affects electrical stability and long-term reliability.
TPU fiber pads were prepared using electrospinning technology, and liquid metal microspheres were uniformly deposited into the pores of TPU fibers through vacuum filtration and hot pressing to form a continuous conductive path. The fluidity and high surface tension of LM were used to stably bind it in the fiber network, achieving deformation insensitivity of the conductive network.
It maintains the integrity of the conductive path under deformations such as stretching, bending, compression, and torsion, with minimal resistance change, no leakage, simple and environmentally friendly process, and is suitable for a variety of applications such as flexible electrodes, circuits, physiological electrical signal monitoring, and thermal management.
Smart Images
Figure CN122504053A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of flexible electronics technology, specifically relating to a liquid metal-based deformation-insensitive flexible conductive fabric, its preparation method, and its application. Background Technology
[0002] Flexible electronic devices, capable of conforming to human skin or flexible structures under complex deformations such as bending, stretching, compression, and torsion, have broad application prospects in wearable health monitoring, human-computer interaction, soft robotics, flexible circuit interconnection, and thermal management. As a key material system in these applications, flexible conductive materials not only need to possess high conductivity and good flexibility, but also maintain stable resistance under large strain, multiaxial deformation, and cyclic loading conditions, while also ensuring reliability (such as leak-proofness, pressure resistance, and fatigue resistance) as well as process controllability and scalable fabrication.
[0003] Existing flexible conductive material solutions can be broadly classified into two categories. The first category consists of elastomeric composite materials or coated conductive fabrics constructed using solid conductive fillers such as carbon nanotubes, graphene, and metal nanowires / nanoparticles. These materials typically rely on the contact network between fillers to achieve conductivity. When subjected to stretching or bending, the conductive pathways are easily reconstructed, and the contact resistance between fillers changes significantly, causing the resistance to fluctuate with deformation. After large deformation or multiple cycles, the conductive network may also crack, detach, or fail locally, making it difficult to achieve true "deformation-insensitive conductivity."
[0004] The second category is flexible conductive materials based on liquid metal. Liquid metal (LM) has metallic conductivity and intrinsic fluidity. Theoretically, stress concentration can be alleviated by conformal flow, thus potentially achieving more stable conductivity under deformation. For the integration of LM, existing technologies mainly include: (1) Microchannel / cavity encapsulated LM conductor: Injecting LM into prefabricated microchannels or elastomer cavities to achieve conductivity. This type of structure usually requires multiple steps such as mold replication, bonding encapsulation, injection and sealing, and the manufacturing process is relatively complex, with higher device thickness and integration difficulty. (2) Coated / impregnated / printed LM or LM particle conductive layer: Coating, impregnating or printing LM (or LM micro / nano particle dispersion) onto the substrate surface to form a conductive layer / conductive pattern. While these methods offer advantages in simplifying processes and enhancing patterning capabilities, they typically face challenges such as poor wettability between the conductive layer (LM) and the polymer substrate, interference from surface oxide films on connectivity, and insufficient uniformity and stability of filling. This can lead to localized buildup or underfilling, resulting in uneven conductivity. Furthermore, during stretching, friction, or repeated bending, the surface conductive layer may crack, delaminate, or migrate, affecting resistance stability. Especially on porous substrates such as fabrics, relying solely on surface coatings / coatings often fails to create continuous, stable, and shape-rearranged conductive pathways within the fiber pores. Additionally, there is a potential risk of LM extrusion, leakage, or contamination under compression or localized extrusion loads.
[0005] For example, Chinese patent application CN 202410617381.1, "A Strain-Insensitive Liquid Metal Coated Conductive Fabric and Its Preparation Method," discloses a method to achieve strain-insensitive conductivity by constructing an LM coating on the fabric surface. However, this type of "coating-type" solution typically relies on coating adhesion / curing to maintain the integrity of the conductive layer. On the one hand, the high surface tension and oxide film characteristics of LM make it difficult to form a stable, uniform, and firmly bonded continuous conductive layer on the fiber surface. Under large deformation or cyclic loading, the coating may exhibit microcracks, delamination, or localized conductivity attenuation. On the other hand, the coating is mainly distributed on or near the surface of the fabric, making it difficult to achieve "bulk uniform filling" and stable binding of the three-dimensional porous structure. Under pressure, rubbing, or localized shearing, LM migration / extrusion may still occur, affecting electrical stability and long-term reliability. Furthermore, the coating process is quite sensitive to coating amount, bonding system, and drying and curing conditions, and there is still room for improvement in batch consistency and controllability.
[0006] Another Chinese patent application, CN 118155909A, entitled "Stretchable, Ultrathin, and Damage-Resistant Liquid Metal Thin Film Electrode and its Preparation Method," discloses a method to improve the stretchability and local damage resistance of thin film electrodes by introducing LM microspheres into a spinning mesh structure and activating them mechanically to form a conductive film. However, such thin film electrodes typically emphasize the "thinning / local activation / surface conductive film" path. The distribution morphology of the conductive material and the supporting skeleton structure determine that they are more suitable for thin film electrodes or the construction of local conductive pathways. In applications requiring greater current carrying capacity, lower sheet resistance / volume resistance, and long-term resistance stability and no leakage under multi-axis large deformation and pressure conditions, limitations may still exist in areas such as the degree of continuous LM filling, the stability of the conductive network in the thickness direction, and the risk of extrusion under pressure.
[0007] Therefore, although existing technologies have made progress in the stretchability, patterning, and local reliability of liquid metal (LM) conductive materials, achieving uniform, stable, and deep filling of LM within flexible porous frameworks (especially fiber networks / fabric structures) under controllable and scalable processes, while maintaining high conductivity, deformation-insensitive resistance stability, and leak-proof performance under complex deformations such as tension, bending, compression, and torsion, as well as cyclic loading, remains a critical problem that urgently needs to be solved in this field. Therefore, it is necessary to develop a liquid metal flexible conductive material and its preparation method that combines high conductivity, excellent deformation stability, leak-proof performance, and simple processing to meet the application needs of flexible electrodes, flexible circuits, physiological electrical signal monitoring, and thermal management. Summary of the Invention
[0008] To address the shortcomings and deficiencies of existing technologies and to reconcile the contradiction between the high conductivity and resistance stability under deformation of existing flexible conductive materials, the primary objective of this invention is to provide a method for preparing a liquid metal-based deformation-insensitive flexible conductive fabric.
[0009] Another objective of this invention is to provide a liquid metal-based deformation-insensitive flexible conductive fabric prepared by the above-described method. The flexible conductive fabric of this invention features a controllable, environmentally friendly manufacturing process, stable signal transmission, and a wide range of applications. Its unique LM-TPU fiber skeleton composite structure achieves uniform filling through vacuum filtration, significantly reducing resistance changes under various deformations such as stretching, bending, compression, and torsion, thus achieving excellent deformation-insensitive conductivity. Furthermore, it is leak-proof and structurally stable, making it widely applicable in fields such as flexible high-conductivity electrodes, flexible circuits, electromyography signal monitoring, contact / non-contact electrocardiogram signal monitoring, and thermal management.
[0010] Another object of the present invention is to provide the application of the above-mentioned liquid metal-based deformation-insensitive flexible conductive fabric.
[0011] The objective of this invention is achieved through the following technical solution:
[0012] The method for preparing liquid metal-based deformation-insensitive flexible conductive fabric proposed in this invention includes the following steps:
[0013] (1) The thermoplastic polyurethane elastomer (TPU) spinning solution was prepared into TPU fiber pads by electrospinning technology;
[0014] (2) Add anhydrous ethanol to LM, and then sonicate under ice bath conditions using a cell disruptor to obtain LM microsphere solution;
[0015] (3) The LM microspheres are uniformly deposited and trapped in the pores of the TPU fiber pad by vacuum filtration to obtain a TPU fiber pad filled with LM microspheres.
[0016] (4) The TPU fiber pad filled with LM microspheres is hot-pressed to cause the LM microspheres to break and fuse, forming a continuous conductive path, thus obtaining the liquid metal-based deformation-insensitive flexible conductive fabric.
[0017] Further, the thermoplastic polyurethane (TPU) spinning solution in step (1) is prepared by the following steps: adding thermoplastic polyurethane particles to a mixed solution of N,N-dimethylformamide (DMF) and tetrahydrofuran (THF), stirring to dissolve, and obtaining the TPU spinning solution.
[0018] More preferably, the stirring speed is 600~700 r / min, the stirring time is 8~10 h; the volume ratio of N,N-dimethylformamide and tetrahydrofuran is 1:1, and the mass fraction of TPU particles in the TPU spinning solution is 25 wt.%.
[0019] Furthermore, in the electrospinning process described in step (1), the stainless steel needle is model 14G, the applied voltage is 11.5 kV, the TPU spinning solution propulsion speed is 3 mL / h, the collection distance is 20 cm, and the roller speed is 100 r / min.
[0020] Further, the liquid metal mentioned in step (2) is a gallium-indium alloy (75.5 wt.% Ga, 24.5 wt.% In) with a melting point of 16°C or a gallium-indium-tin alloy (68.5 wt.% Ga, 21.5 wt.% In, 10 wt.% Sn) with a melting point of 0°C.
[0021] Further, the mass-to-volume ratio of the liquid metal to anhydrous ethanol in step (2) is 4 g: 30 mL.
[0022] Furthermore, the cell disruptor described in step (2) has an ice bath ultrasonic power of 225~250 W and an ultrasonic time of 30~40 min.
[0023] Further, the specific operation of step (3) is as follows: the thermoplastic polyurethane fiber pad is placed on a filtration device covered with a polytetrafluoroethylene filter membrane, and the LM microsphere solution is vacuum filtered. Through vacuum filtration, the LM microspheres are uniformly deposited and trapped in the pores of the TPU fiber pad. Through the vacuum filtration, almost all the LM microspheres in the solution can be loaded onto the TPU fiber pad, resulting in high material utilization.
[0024] Further, in step (4), the hot pressing pressure is 0.8~1 MPa, the hot pressing temperature is 100~110℃, and the hot pressing time is 3~5 min. The technical effects described in this invention can be achieved within the above hot pressing parameter range. If the hot pressing temperature is less than 100℃ and the pressure is less than 0.8MPa, the activation will be incomplete, and a large number of LM microspheres will not be activated to form conductive pathways. If the hot pressing temperature is higher than 110℃, the TPU fibers will begin to melt, affecting the mechanical properties of the film and blocking the LM conductive pathways. If the hot pressing pressure is greater than 1MPa, the fiber pad will be pressed too flat, which may cause liquid metal to overflow from the surface.
[0025] The liquid metal-based deformation-insensitive flexible conductive fabric prepared by this invention has applications in health monitoring equipment (such as electromyography and electrocardiogram signal monitoring), medical surgical instruments, human-computer interaction devices, electronic skin (such as flexible high-conductivity electrodes, flexible circuits, etc.), intelligent industrial components, and thermal management devices.
[0026] The high conductivity and deformation insensitivity of the liquid metal-based deformation-insensitive flexible conductive fabric prepared by this invention are mainly based on the following principles:
[0027] This conductive fabric uses a TPU fiber pad as a flexible skeleton, with metallic-grade conductive polymer (LM) uniformly filling the fiber pores, giving it extremely high conductivity. When the fabric undergoes deformations such as stretching, bending, compression, or twisting, the TPU fiber skeleton deforms accordingly, and its internal pore structure reorganizes or orients. Simultaneously, LM, with its excellent flowability, can flow and deform synchronously with the fiber skeleton, maintaining a continuous filling state within the fiber pores, preventing breakage or contact failure of the conductive path. Furthermore, due to its high surface tension, LM is stably bound within the fiber network, preventing leakage or precipitation even under large deformation or pressure conditions. Therefore, macroscopically, the fabric exhibits minimal resistance changes during various deformations, demonstrating excellent deformation-insensitive conductivity.
[0028] Compared with the prior art, the present invention has the following advantages and beneficial effects:
[0029] (1) The liquid metal-based deformation-insensitive flexible conductive fabric prepared by the present invention benefits from the high fluidity of LM, which can deform synchronously with the TPU fiber skeleton, and its high surface tension, which makes it stably bound in the fiber network. The conductive fabric can maintain the integrity of the conductive path under various mechanical deformations such as stretching, bending, compression, and twisting, with minimal resistance change and no leakage.
[0030] (2) The flexible substrate of the liquid metal-based deformation-insensitive flexible conductive fabric prepared by the present invention is TPU, and only LM is used as conductive filler. These two materials are simple to prepare, green and environmentally friendly, easy to recycle, and have excellent biocompatibility.
[0031] (3) The liquid metal-based deformation-insensitive flexible conductive fabric prepared by the present invention uses a simple integrated process of vacuum filtration and hot pressing activation. The process parameters are controllable, the operation is simple, the material cost is low, and it is easy to scale up production.
[0032] (4) The liquid metal-based deformation-insensitive flexible conductive fabric prepared by the present invention has the advantages of high conductivity, deformation insensitivity, and flexible wearability. The same device can simultaneously meet the needs of various application scenarios such as flexible circuits / electrodes, electromyography signal monitoring, contact / non-contact electrocardiogram signal monitoring, and thermal management.
[0033] (5) When the liquid metal-based deformation-insensitive flexible conductive fabric prepared in this invention is attached to the skin as a flexible electrode, its excellent deformation-insensitive properties can significantly reduce motion artifacts caused by human movement or muscle contraction, maintain stable skin-electrode interface impedance, and significantly improve the signal-to-noise ratio and monitoring accuracy of weak physiological electrical signals such as electromyography and electrocardiography. Attached Figure Description
[0034] Figure 1 The image shows the cross-sectional morphology of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in Example 1 in the unactivated liquid metal microsphere state.
[0035] Figure 2 The image shows a scanning electron microscope image of the surface morphology of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in Example 1.
[0036] Figure 3 Scanning electron microscope image of the overall cross-sectional morphology of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in Example 1.
[0037] Figure 4 A magnified scanning electron microscope image of a cross-section of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in Example 1.
[0038] Figure 5 This is a schematic diagram of the strain insensitivity of the deformation-insensitive flexible conductive fabric based on metal prepared in Example 1.
[0039] Figure 6 This is a schematic diagram of the compression insensitivity of the deformation-insensitive flexible conductive fabric based on metal prepared in Example 1.
[0040] Figure 7 This is a schematic diagram of the torsion insensitivity of the deformation-insensitive flexible conductive fabric based on metal prepared in Example 1.
[0041] Figure 8 The image shows a scanning electron microscope (SEM) image of the cross-sectional morphology of the incompletely activated liquid metal-based deformation-insensitive flexible conductive fabric prepared in Comparative Example 1. Detailed Implementation
[0042] The present invention will be further described in detail below with reference to embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto. All raw materials involved in the present invention can be purchased directly from the market. For process parameters not specifically specified, conventional techniques can be referred to.
[0043] Example 1
[0044] A liquid metal-based deformation-insensitive flexible conductive fabric is prepared by the following method:
[0045] (1) TPU particles were dissolved in a mixed solution of DMF and THF with a volume ratio of 1:1 at a speed of 600 r / min for 8 h to obtain a TPU spinning solution with a mass fraction of 25 wt.%.
[0046] (2) TPU fiber pads were prepared by electrospinning the TPU spinning solution. The stainless steel needle used in the electrospinning process was model 14G, the applied voltage was 11.5 kV, the TPU spinning solution feed rate was 3 mL / h, the collection distance was 20 cm, and the roller speed was 100 r / min.
[0047] (3) Weigh 4 g of LM (gallium-indium alloy with a melting point of 16℃, 75.5 wt.% Ga, 24.5 wt.% In) into a centrifuge tube, add 30 mL of anhydrous ethanol, and then sonicate in an ice bath at 250 W for 40 min using a cell disruptor to obtain an LM microsphere solution.
[0048] (4) Place the TPU fiber pad on a filtration device covered with a polytetrafluoroethylene filter membrane, perform vacuum filtration on the LM microsphere solution, uniformly deposit and retain the LM microspheres in the pores of the TPU fiber pad, and obtain a TPU fiber pad filled with LM microspheres.
[0049] (5) The TPU fiber pad filled with LM microspheres is subjected to hot pressing at 0.8 MPa, 100℃ and 3 min to cause the LM microspheres to break and fuse, forming a continuous conductive path, and thus obtaining a liquid metal-based deformation-insensitive flexible conductive fabric.
[0050] Comparative Example 1
[0051] A liquid metal-based deformation-insensitive flexible conductive fabric is prepared by the following method:
[0052] (1) TPU particles were dissolved in a mixed solution of DMF and THF with a volume ratio of 1:1 at a speed of 600 r / min for 8 h to obtain a TPU spinning solution with a mass fraction of 25 wt.%.
[0053] (2) TPU fiber pads were prepared by electrospinning the TPU spinning solution. The stainless steel needle used in the electrospinning process was model 14G, the applied voltage was 11.5 kV, the TPU spinning solution feed rate was 3 mL / h, the collection distance was 20 cm, and the roller speed was 100 r / min.
[0054] (3) Weigh 4 g of LM (gallium-indium alloy with a melting point of 16℃, 75.5 wt.% Ga, 24.5 wt.% In) into a centrifuge tube, add 30 mL of anhydrous ethanol, and then sonicate in an ice bath at 250 W for 40 min using a cell disruptor to obtain an LM microsphere solution.
[0055] (4) Place the TPU fiber pad on a filtration device covered with a polytetrafluoroethylene filter membrane, perform vacuum filtration on the LM microsphere solution, uniformly deposit and retain the LM microspheres in the pores of the TPU fiber pad, and obtain a TPU fiber pad filled with LM microspheres.
[0056] (5) Apply a pressure of 0.8 MPa to the TPU fiber pad filled with LM microspheres at room temperature for 3 min to obtain a liquid metal matrix deformation-insensitive flexible conductive fabric with incomplete activation.
[0057] Performance characterization:
[0058] Figure 1 The image shown is a scanning electron microscope (SEM) image of the cross-sectional morphology of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in step (4) of Example 1, in the unactivated state of the liquid metal microspheres. It can be observed that after vacuum filtration and filling, the liquid metal microspheres are uniformly and densely trapped in the pores between the TPU fibers, and the pores in the TPU fiber pad are almost completely filled by the liquid metal microspheres. This unique structural morphology benefits from the efficient filling of the microspheres by the vacuum filtration process, and at the same time lays the structural foundation for subsequent hot-pressing activation to achieve the melting and fusion between the microspheres and construct a deformation-insensitive stable conductive network.
[0059] Figure 2 The image shows a scanning electron microscope image of the surface morphology of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in Example 1. It can be observed that there are a large number of LMs on the surface of the flexible conductive fabric, which are evenly distributed, and the TPU fibers are clearly visible.
[0060] Figure 3 and Figure 4 The image shown is a scanning electron microscope (SEM) image of the overall cross-sectional morphology of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in Example 1. It reveals that the TPU fibers in the cross-section of this flexible conductive fabric have irregular circular or elliptical cross-sections, forming an interconnected three-dimensional porous network structure. After vacuum filtration and hot-pressing activation treatment, the LM (Liquid Metal Molecular Weight) uniformly and densely fills the pores between the TPU fibers, adhering tightly to the fiber skeleton, with no obvious voids or unfilled areas observed. The interface between the LM and the TPU fibers is clear, without delamination or debonding, indicating that the LM has fully penetrated into the fiber pad and formed a continuous conductive network. This cross-sectional morphology confirms that the vacuum filtration filling method used in this invention can effectively achieve uniform and complete filling of the LM in the TPU fiber pad, providing a structural basis for the fabric's high conductivity and deformation insensitivity.
[0061] Figure 5This is a schematic diagram illustrating the strain insensitivity of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in Example 1. The horizontal axis represents tensile strain, and the vertical axis represents the real-time resistance value. The test results show that the resistance value of this flexible conductive fabric remains at an extremely low level throughout the tensile strain range from 0% to 600%, with an average resistance of only 0.02241 Ω. The resistance-strain curve is almost a flat straight line, without any obvious fluctuations or upward trend.
[0062] Figure 6 This is a schematic diagram illustrating the compression insensitivity of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in Example 1. The horizontal axis represents the mass of the weight under applied pressure, and the vertical axis represents the real-time resistance value. Test results show that the resistance value of this flexible conductive fabric hardly changes under pressure variations from 0 to 400 g, with no significant fluctuations or upward trends observed.
[0063] Figure 7 This is a schematic diagram illustrating the torsion insensitivity performance of the liquid metal-based deformation-insensitive flexible conductive fabric prepared in Example 1. The horizontal axis represents the number of times the flexible conductive fabric is twisted 360°, and the vertical axis represents the real-time resistance value. The test results show that after 240 twists, the resistance value of the flexible conductive fabric shows almost no significant change compared to its original state, with no obvious fluctuations or upward trend observed.
[0064] Figure 8 The image shows a scanning electron microscope (SEM) image of the cross-sectional morphology of the partially activated liquid metal-based deformation-insensitive flexible conductive fabric prepared in Comparative Example 1. It can be observed that after activation by applying pressure at room temperature, only a portion of the LM microspheres in the cross-section are activated, forming local conductive pathways. A large number of unactivated LM microspheres exist as discrete "islands" within the fiber pores, unable to participate in the construction of conductive pathways. Numerous interfacial gaps exist between the activated and unactivated regions, requiring electron transport to bypass or cross non-conductive areas, leading to an increase in the overall resistance of the material. Furthermore, due to the unstable activation process, the resistance varies greatly between different batches or even between different locations within the same batch. When the fabric is subjected to various deformations, the fiber skeleton shifts and restructures. The activated local conductive pathways, lacking dynamic replenishment from surrounding LM microspheres, are prone to breakage at the deformation interface, resulting in significant resistance changes.
[0065] The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.
Claims
1. A method for preparing a liquid metal-based deformation-insensitive flexible conductive fabric, characterized in that, Includes the following steps: (1) Thermoplastic polyurethane spinning solution was prepared into TPU fiber pads by electrospinning technology; (2) Add anhydrous ethanol to liquid metal and then sonicate it under ice bath conditions using a cell disruptor to obtain an LM microsphere solution; (3) The LM microspheres are uniformly deposited and trapped in the pores of the TPU fiber pad by vacuum filtration to obtain a TPU fiber pad filled with LM microspheres. (4) The TPU fiber pad filled with LM microspheres is hot-pressed to obtain the liquid metal-based deformation-insensitive flexible conductive fabric.
2. The production method according to claim 1, characterized by, The thermoplastic polyurethane spinning solution described in step (1) is prepared by the following steps: thermoplastic polyurethane particles are added to a mixed solution of N,N-dimethylformamide and tetrahydrofuran, stirred and dissolved to obtain the TPU spinning solution.
3. The preparation method according to claim 1, characterized in that, In the electrospinning process described in step (1), the stainless steel needle is model 14G, the applied voltage is 11.5 kV, the TPU spinning solution propulsion speed is 3 mL / h, the collection distance is 20 cm, and the roller speed is 100 r / min.
4. The method of claim 1, wherein, The liquid metal in step (2) is a gallium-indium alloy or a gallium-indium-tin alloy; wherein the gallium-indium alloy has a melting point of 16°C and contains 75.5 wt.% Ga and 24.5 wt.% In; the gallium-indium-tin alloy has a melting point of 0°C and contains 68.5 wt.% Ga, 21.5 wt.% In and 10 wt.% Sn.
5. The preparation method according to claim 1, characterized in that, The mass-to-volume ratio of the liquid metal to anhydrous ethanol in step (2) is 4 g: 30 mL.
6. The method of claim 1, wherein, The cell disruptor described in step (2) has an ice bath ultrasonic power of 225~250 W and an ultrasonic time of 30~40 min.
7. The preparation method according to claim 1, characterized in that, The specific operation of step (3) is as follows: place the thermoplastic polyurethane fiber pad on a filtration device covered with a polytetrafluoroethylene filter membrane, perform vacuum filtration on the LM microsphere solution, and uniformly deposit and retain the LM microspheres in the pores of the TPU fiber pad through vacuum filtration.
8. The method of claim 1, wherein, The pressure of hot pressing in step (4) is 0.8~1MPa, the temperature of hot pressing is 100~110℃, and the time of hot pressing is 3~5 min.
9. A liquid metal-based, shape morphing, insensitive, flexible conductive fabric, characterized in that, It is prepared by the preparation method described in any one of claims 1-8.
10. The application of the liquid metal-based deformation-insensitive flexible conductive fabric of claim 9 in the fields of health monitoring equipment, medical surgical instruments, human-computer interaction devices, electronic skin, smart industrial components, or thermal management devices.