Resin supply device, resin molding device, and method for manufacturing resin molded product

Abstract

A resin supply device for supplying a resin material to a molding die that molds a substrate resin by compression molding, includes a first tray configured with a resin material, at least one second tray smaller in size than the first tray and configured with the resin material, a tray conveyance section that conveys the second tray onto the first tray, a resin supply section that supplies the resin material to the second tray, and a control section that performs a first step of spreading the resin material to the second tray with the resin supply section, a second step of spreading the resin material with the resin supply section so as to overlap the resin material spread in the first step, and a third step of conveying the second tray to the first tray and configuring the resin material on the second tray in a region of the first tray where the resin material is not configured, the resin supply device being configured to configure the resin material in the first tray by repeating the first through third steps.

Description

Technical Field

[0001] This invention relates to a resin molding apparatus and a method for manufacturing resin molded articles. Background Technology

[0002] Patent Document 1 discloses a resin molding method for wafer-level packaging. In this resin molding method, a technique is disclosed in which resin material is also applied to areas where no chip is disposed in order to suppress the generation of unfilled areas of resin.

[0003] Prior art literature Patent documents Patent Document 1: U.S. Patent No. 2022 / 115247 Summary of the Invention

[0004] The problem that the invention aims to solve However, in panels that are formed by resin molding through compression, there are large panels that are intended to be cut into multiple panels. In such large panels, multiple regions (hereinafter referred to as islands) including multiple electronic components are formed, and gaps are formed between adjacent islands. Furthermore, after resin molding, the gaps between the islands are cut to divide the panel into multiple panels.

[0005] However, during resin molding, there is a problem that electronic components may detach from the panel due to the flow of molten resin into the gaps between the islands. This invention addresses this problem by providing a resin supply device, a resin molding apparatus, and a method for manufacturing a resin-molded article that can suppress the detachment of electronic components due to resin flow during compression molding.

[0006] Technical solutions for solving the problem The resin supply device of the present invention is used to supply resin material to a molding die, the molding die forming resin onto a substrate using compression molding. The resin supply device comprises: a first tray on which resin material is disposed; at least one second tray smaller than the first tray and on which the resin material is disposed; a tray conveying unit for conveying the second tray onto the first tray; a resin supply unit for supplying resin material to the second tray; and a control unit that performs: a first step of applying the resin material to the second tray using the resin supply unit; a second step of applying the resin material using the resin supply unit such that the resin material overlaps the outer edge of the resin material applied in the first step; and a third step of conveying the second tray onto the first tray and disposing of the resin material on the second tray in an area of ​​the first tray where no resin material is disposed. The resin supply device is configured to dispose of the resin material on the first tray by repeating the first to the third steps.

[0007] The resin supply method of the present invention is a resin supply method for supplying resin material to a molding die, wherein the molding die uses compression molding to mold resin onto a substrate. The resin supply method includes: a first step of preparing a first tray and a second tray smaller than the first tray; a second step of spreading resin material onto the second tray; a third step of spreading the resin material such that the resin material overlaps the outer edge of the resin material spread in the first step; and a fourth step of transferring the second tray to the first tray and placing the resin material on the second tray in an area of ​​the first tray where the resin material is not placed, thereby placing the resin material on the first tray by repeating the second to the fourth steps.

[0008] The method for manufacturing a resin molded article of the present invention includes: a step of preparing a substrate, the substrate having a carrier and a plurality of electronic components fixed on the carrier by temporary fasteners, and a plurality of islands including the plurality of electronic components being disposed on the carrier with gaps; a step of supplying resin material to a first tray using the resin supply method described above; a step of disposing of the resin material of the first tray in a molding die; a step of disposing of the substrate in the molding die; and a step of molding the resin material on the substrate in the molding die by compression molding.

[0009] Invention Effects According to the present invention, it is possible to prevent electronic components from falling off due to the flow of resin during compression molding. Attached Figure Description

[0010] Figure 1A This is a top view of the panel where electronic components are installed.

[0011] Figure 1B yes Figure 1A A sectional view.

[0012] Figure 2A This is a top view of the panel after resin molding.

[0013] Figure 2B yes Figure 2A A sectional view.

[0014] Figure 3 This is a top view showing a general outline of the resin molding apparatus.

[0015] Figure 4 This is a top view showing a general outline of the resin supply module.

[0016] Figure 5 This is a front view of a resin supply module equipped with a resin material supply device.

[0017] Figure 6 This is a front view of the resin material supply device.

[0018] Figure 7 yes Figure 6 Side view.

[0019] Figure 8 This is a side sectional view showing the composition of the small tray and the large tray.

[0020] Figure 9A This is a top view showing the method of supplying resin material to a small tray.

[0021] Figure 9B This is a top view showing the method of supplying resin material to a small tray.

[0022] Figure 9C This is a top view showing the method of supplying resin material to a small tray.

[0023] Figure 9D This is a top view showing the method of supplying resin material to a small tray.

[0024] Figure 9E This is a top view showing the method of supplying resin material to a small tray.

[0025] Figure 9F This is a top view showing the method of supplying resin material to a small tray.

[0026] Figure 9G This is a top view showing the method of supplying resin material to a small tray.

[0027] Figure 9H This is a top view showing the method of supplying resin material to a small tray.

[0028] Figure 9I This is a top view showing the method of supplying resin material to a small tray.

[0029] Figure 9J This is a top view showing the method of supplying resin material to a small tray.

[0030] Figure 10A This is a top view showing the method of supplying resin material from small trays to large trays.

[0031] Figure 10B This is a top view showing the method of supplying resin material from small trays to large trays.

[0032] Figure 10C This is a top view showing the method of supplying resin material from small trays to large trays.

[0033] Figure 10DThis is a top view showing the method of supplying resin material from small trays to large trays.

[0034] Figure 10E This is a top view showing the method of supplying resin material from small trays to large trays.

[0035] Figure 11A It is a cross-sectional view showing the molding process.

[0036] Figure 11B It is a cross-sectional view showing the molding process. Detailed Implementation

[0037] Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the accompanying drawings. First, the panel (substrate) formed by the resin molding apparatus will be described, followed by the resin molding apparatus used for molding the resin of the panel. Furthermore, for ease of explanation, the following description will follow the direction shown in the accompanying drawings, but the present invention is not limited to this direction.

[0038] <1. Panel> Figure 1A This is a top view of the panel that is being molded from resin. Figure 1B yes Figure 1A A sectional view. For example... Figure 1A and Figure 1B As shown, the panel P has a rectangular panel carrier 81 formed of glass or the like, a rectangular double-sided tape 82 fixed to the panel carrier 81, and multiple electronic components 83, such as semiconductor chips, disposed on the double-sided tape 82. Four rectangular islands 83A to 83D are formed on the double-sided tape 82, and the multiple electronic components 83 are arranged at given intervals in both the longitudinal and transverse directions on each island 83A to 83D. Hereinafter, for ease of explanation, the four islands will be referred to as the first island 83A, the second island 83B, the third island 83C, and the fourth island 83D.

[0039] The first island 83A and the second island 83B are arranged laterally with a longitudinally extending gap 85 between them. Similarly, the third island 83C and the fourth island 83D are also arranged laterally with a longitudinally extending gap 85 between them. In addition, a laterally extending gap 86 is formed between the first island 83A and the third island 83C, and between the second island 83B and the fourth island 83D. That is, in this embodiment, the four islands 83A to 83D are arranged with cross-shaped gaps 85 and 86 between them. In addition, a gap 87 is also formed on the outer periphery of the four islands 83A to 83D. That is, a frame-shaped gap 87 is formed between the outer edge of the double-sided tape 82 and the four islands 83A to 83D.

[0040] In this embodiment, it is envisioned that a larger panel P is used. For example, the panel P is formed into a rectangular plate with one side of 450 mm or more, 500 mm or more, or 600 mm or more.

[0041] In this embodiment, the panel P is molded with resin material as described above. Figure 2A This is a top view of a panel molded with resin material. Figure 2B yes Figure 2A A sectional view. For example... Figure 2A and Figure 2B As shown, a rectangular-shaped resin material, viewed from above, is molded on panel P to cover all electronic components. Thus, panel P, molded with resin, is equivalent to a resin molded product.

[0042] <2. Resin Molding Equipment> The resin molding apparatus 1 of this embodiment is an apparatus for sealing the electronic components 83 on the panel P with resin to manufacture resin molded articles. In particular, in this embodiment, as described below, a resin molding apparatus 1 employing a compression molding method (compression method) that compresses and molds resin material within a cavity is exemplified. Furthermore, in this embodiment, granular resin material is envisioned to be used, but as resin material, not only granular materials can be used, but also materials in any form such as powder or liquid can be used.

[0043] Figure 3 This is a schematic diagram of a resin molding apparatus. (For example...) Figure 3 As shown, the resin molding apparatus 1 includes a substrate loading / unloading module 10, a substrate transfer module 20, a molding module 30, a resin supply module (resin supply device) 40, and a control unit 50 as its components. Each component is detachable and replaceable relative to the other components. The following describes each component.

[0044] <2-1. Substrate Loading / Unloading Module> The substrate loading and unloading module 10 is a module for loading the panel P before resin molding and loading the panel P after resin molding. The substrate loading and unloading module 10 mainly includes a loading section 11, an unloading section 12, an inspection section 13, and an arm mechanism 14.

[0045] The loading section 11 is the part that holds the panel P before resin molding, and the unloading section 12 is the part that holds the panel P after resin molding. The loading section 11 and the unloading section 12 are each capable of accommodating multiple panels P.

[0046] Inspection unit 13 is a part that inspects the panel P after resin molding. Inspection unit 13 includes a mounting part (not shown) for placing the resin-molded panel P, an inspection mechanism for inspecting the panel P (not shown), etc.

[0047] The arm mechanism 14 is a mechanism for moving the panel P. The arm mechanism 14 includes an adsorption hand 14a for adsorbing the panel P, an arm 14b on which the adsorption hand 14a is mounted, and a drive unit 14c for rotating and moving the arm 14b appropriately.

[0048] <2-2. Substrate handover module> The substrate transfer module 20 is a module that transfers the panel P between the substrate loading / unloading module 10 and the forming module 30 described below. The substrate transfer module 20 mainly includes a loading section 21 and an unloading section 22.

[0049] The loading unit 21 receives the panel P before resin sealing from the arm mechanism 14 and transports it to the molding mold 31 of the molding module 30 described below. The unloading unit 22 receives the panel P after resin molding from the molding mold 31 and transports it to the substrate loading and unloading module 10. The loading unit 21 and the unloading unit 22 are capable of moving along a track L extending in the left-right direction. In this embodiment, the loading unit 21 and the unloading unit 22 are connected to each other in a manner that allows them to move integrally.

[0050] <2-3. Molding Module> The molding module 30 is a module that uses resin material supplied by the resin supply module 40 to seal electronic components mounted on the panel P. In this embodiment, two molding modules 30 are arranged side by side. The panel P can be resin-sealed in parallel using two molding modules 30, thereby improving the manufacturing efficiency of resin molded products. The molding module 30 mainly includes a molding mold 31 and a mold closing mechanism (not shown).

[0051] The molding die 31 uses molten resin material to compress and mold the panel P. The molding die 31 has a pair of molds (upper and lower), and a concave cavity (not shown) is formed in the lower mold to accommodate the resin material. On the other hand, in the upper mold, the panel P before resin molding is held with the electronic components facing the cavity side. In addition, the molding die 31 is provided with a heater for melting the resin material (not shown).

[0052] <2-4. Molding Module> The control unit 50 is configured to control the operation of each module of the resin molding apparatus 1. The control unit 50 controls the operation of the substrate loading / unloading module 10, the substrate transfer module 20, the molding module 30, and the resin supply module 40 described below. Furthermore, the control unit 50 can be used to arbitrarily change (adjust) the operation of each module.

[0053] <3. Resin Supply Module> The resin supply module 40 will be described in detail below. Figure 4This is a schematic top view of the resin supply module 40. The resin supply module 40 is a module used to supply resin material to the molding die 31 of the molding module 30. Figure 3 and Figure 4 As shown, the resin supply module 40 mainly includes two resin material supply devices 100, four small trays (second trays) 411-414, a small tray conveying mechanism (not shown), a dust collection table 43, a large tray (first tray) 44, and a large tray conveying mechanism 45.

[0054] A dust collection platform 43 is disposed between the two resin material supply devices 100 and the large tray 44. Each small tray 411-414 can move between the resin material supply device 100, the dust collection platform 43, and the large tray 44 via a small tray conveying mechanism. During this movement, each small tray 411-414 waits on the dust collection platform 43, at which time the dust adhering to the bottom surface of each tray 411-414 is collected.

[0055] As described below, in this resin supply module 40, resin material is supplied to one rectangular large tray 44 using four rectangular small trays 411-414. That is, the resin material disposed in the small trays 411-414 is supplied to the large tray 44. Therefore, the size of each small tray 411-414 is approximately 1 / 4 of the size of the large tray. Hereinafter, for ease of explanation, each small tray will be referred to as the first to fourth small trays 411-414. The details of each part will be described below.

[0056] <3-1. Resin Material Supply Device> Figure 5 This is a front view of the resin material supply device configured in the resin supply module. (Example) Figure 5 As shown, two resin material supply devices 100 are arranged side-by-side within the housing 40a of the resin supply module 40. Apart from being arranged approximately symmetrically from left to right, the two resin material supply devices 100 have substantially the same configuration. Therefore, the configuration of one (right-side) resin material supply device 100 will be described in detail below, while the description of the configuration of the other (left-side) resin material supply device 100 will be omitted.

[0057] In addition, each resin material supply device 100 is provided with two slots 130. Hereinafter, for ease of explanation, the slots provided in one resin material supply device 100 will be referred to as the first slot 130A and the second slot 130B. The slots provided in the other resin material supply device 100 will be referred to as the third slot 130C and the fourth slot 130D. Figure 4As shown, the first tank 130A and the second tank 130B supply resin material to each of the small trays of the first small tray 411 and the third small tray 413. On the other hand, the third tank 130C and the fourth tank 130D supply resin material to each of the small trays of the second small tray 412 and the fourth small tray 414.

[0058] Figure 6 This is a front view of the resin material supply device. Figure 7 yes Figure 6 A side view. (e.g.) Figure 6 and Figure 7 As shown, the resin material supply device 100 mainly includes a storage tank 110, a first vibrating unit 120, two tanks 130A and 130B, a second vibrating unit 140, a weighing scale 150, and a distributor 160. Additionally, in Figure 6 and Figure 7 In the image, the resin material contained in the storage container 110 and the tanks 130A and 130B is indicated by gray.

[0059] The storage container 110 contains resin material and supplies the resin material to the tank 130 below. The storage container 110 mainly has a receiving section 111 and a supply section 112.

[0060] The housing 111 has an opening at the top and an internal space for accommodating resin material, which is supplied (replenished) at given time intervals.

[0061] The supply section 112 is the part that supplies the resin material contained in the receiving section 111 to the tanks 130A and 130B. The supply section 112 is hollow to allow the resin material to move inside. The supply section 112 extends from the lower part of one side of the receiving section 111 to the top of the dispenser 160 described below. Near the front end (left end) of the supply section 112, there is a supply port 112a for discharging the resin material inside the supply section 112 to the lower part.

[0062] The first vibration unit 120 is used to discharge resin material from the reservoir 110. The first vibration unit 120 is provided at the lower part of the reservoir 110 to cause the reservoir 110 to vibrate. As a result, the resin material in the receiving part 111 can be moved to the supply part 112 and discharged downward from the supply port 112a.

[0063] Each tank 130A and 130B has the same structure, containing resin material and supplying resin material to each small tray 411-414. For example... Figure 6 As shown, two slots 130 are arranged side by side below the storage container 110 (when viewed from above, the supply port 112a sandwiching the storage container 110 is arranged in a symmetrical position on the left and right). Each slot 130A and 130B mainly has a receiving part 131 and a supply part 132.

[0064] The receiving section 131 has an opening at the top and an internal space for receiving resin material. The supply section 132 is the part that supplies the resin material received in the receiving section 131 to each of the small trays 411-414, and is formed in a hollow shape so that the resin material can move inside. The supply section 132 extends in one direction (rearward) from the lower part of one side of the receiving section 131, and a supply port 132a for discharging the resin material inside the supply section 132 to the lower part is provided near the front end of the supply section 132.

[0065] In addition, the two slots 130A and 130B are positioned close to each other to allow for simultaneous supply of resin material to one small tray 41. Specifically, the two slots 130A and 130B (especially the supply port 132a) are arranged with a left-right spacing of approximately half the left-right width of the small trays 411-414.

[0066] Figure 7 The second vibration unit 140 shown is used to discharge resin from each of the tanks 130A and 130B. The second vibration unit 140 is provided at the lower part of each of the tanks 130A and 130B to make them vibrate. As a result, the resin material in the receiving part 131 can be moved to the supply part 132 and discharged downward from the supply port 132a.

[0067] The weighing gauge 150 measures the weight of the resin material contained in tanks 130A and 130B. The weighing gauge 150 is located at the lower part of the second vibrating part 140 and can measure the weight of tanks 130A and 130B and the second vibrating part 140. Since the weights of tanks 130A and 130B and the second vibrating part 140 are known, the weight of the resin material contained in tanks 130A and 130B can be measured by subtracting the weights of tanks 130A and 130B from the measurement value of the weighing gauge 150.

[0068] Distributor 160 is used to distribute resin material supplied from reservoir 110 into two tanks 130A and 130B. Distributor 160 has a rotatable guide plate (not shown) inside, configured to tilt at a given time interval to guide the resin material supplied from reservoir 110 into either tank 130. Thus, resin material can be supplied to both tanks 130A and 130B from one reservoir 110.

[0069] <3-2. Small trays and large trays> Then, while referring to Figure 8 The small trays 411-414 and the large tray 44 will be described separately. Additionally, Figure 8 It is a schematic sectional view used to illustrate the composition of each component. The relative positional relationship of each component shown in the diagram is different from the actual positional relationship.

[0070] like Figure 8 As shown, the small tray 41 mainly includes a resin holding part 41a and a baffle 41b. The resin holding part 41a is the part that holds the resin material. The resin holding part 41a is formed into a plate that is roughly square when viewed from above, and has multiple slits 41c extending to the left and right arranged in a front-to-back manner.

[0071] The baffle 41b is a portion capable of closing the slit 41c of the resin holding portion 41a from below. The baffle 41b is formed into a plate that is approximately square when viewed from above. Slits 41d are formed on the baffle 41b in a manner corresponding to the slit 41c of the resin holding portion 41a. That is, the slits 41d of the baffle 41b are formed to extend to the left and right, and multiple slits 41d are formed to be arranged in a front-to-back manner. In addition, the front-to-back spacing of the slits 41d of the baffle 41b is formed to be the same as the front-to-back spacing of the slits 41c of the resin holding portion 41a. The baffle 41b is disposed near the lower part of the resin holding portion 41a and can be moved back and forth relative to the resin holding portion 41a by a moving mechanism (not shown).

[0072] like Figure 8 As shown, when the slit 41d of the baffle 41b is not vertically aligned with the slit 41c of the resin holding portion 41a, the slit 41c of the resin holding portion 41a is closed from below by the baffle 41b. In this state, resin material can be held on the upper surface of the small tray 41 (specifically, within the slit 41c of the resin holding portion 41a). Furthermore, by moving the baffle 41b and aligning the slit 41c of the resin holding portion 41a with the slit 41d of the baffle 41b, the resin material held within the slit 41c of the resin holding portion 41a can be discharged downwards. The resin material discharged from the small tray 41 is supplied to the receiving portion 44b of the large tray 44 described below.

[0073] The large tray 44 mainly comprises a frame member 44a and multiple receiving portions 44b. The frame member 44a is a member that supports the receiving portions 44b and is formed into a frame shape that is approximately square when viewed from above. That is, the frame member 44a is formed to have an opening approximately in the center when viewed from above.

[0074] Each receiving portion 44b is a portion for containing resin material and is formed in a generally cylindrical shape. Multiple receiving portions 44b are arranged with their long sides facing left and right on the inner side (opening portion) of the frame member 44a. The left and right ends of the receiving portions 44b are rotatably supported relative to the frame member 44a about an axis. Grooves 44c for containing resin material are formed on the outer peripheral surface of the receiving portions 44b, extending axially (long side direction). The front-to-back spacing (pitch) between adjacent receiving portions 44b is formed to be the same as the front-to-back spacing (pitch) of the slit 41c of the small tray 41. Furthermore, the receiving portions 44b can rotate at any angle relative to the frame member 44a via a drive mechanism (not shown).

[0075] like Figure 8 As shown, when the groove 44c of the receiving portion 44b faces upward, resin material can be received inside the groove 44c. Furthermore, by rotating the receiving portion 44b and causing the groove 44c to face downward, the resin material received in the groove 44c can be discharged downward.

[0076] Here, the left-right length of the slits 41c of each small tray 411-414 is approximately half the left-right length of the receiving portion 44b (groove 44c) of the large tray 44. Furthermore, the number of slits 41c of each small tray 411-414 is half the number of receiving portions 44b of the large tray 44. As described above, the dimensions of the small trays 411-414 in top view are approximately one-quarter the size of the large tray 44. Therefore, in order to supply resin material to all receiving portions 44b of the large tray 44 using the small trays 411-414, a total of four small trays 411-414 are required.

[0077] <4. Method for supplying resin material to the small tray> Next, the method of supplying resin material from the resin material supply device 100 to the small trays 411 to 414 will be described.

[0078] First, if the weight of the resin material contained in each tank 130A to 130D is lower than a given value when the weight is detected by the weight gauge 150, the control unit 50 controls the operation of the first vibration unit 120 and the distributor 160 to supply resin material to each tank 130A to 130D.

[0079] That is, when the weight of the resin material contained in each tank 130A to 130D is lower than a given value, the resin material contained in the storage container 110 is automatically supplied to tanks 130A to 130D. As a result, each tank 130A to 130D will always contain resin material with a weight greater than the given value.

[0080] Next, the method of supplying resin material to the first tray 411 through the first tank 130A and the second tank 130B will be described. Furthermore, the method of supplying resin material to the third tray 413 through the first tank 130A and the second tank 130B, and the method of supplying resin material to the second tray 412 and the fourth tray 414 through the third tank 130C and the fourth tank 130D are the same, and therefore will not be described further.

[0081] like Figure 9AAs shown, when resin material is supplied to the first small tray 411, the first small tray 411 before the resin material is supplied is moved by the small tray conveying mechanism to a position below the first groove 130A and the second groove 130B. At this time, the position of the first small tray 411 is adjusted so that the supply ports 132a of the two grooves 130A and 130B are directly above the given starting position S.

[0082] Next, the second vibration unit 140 is activated to supply resin material from each of the supply ports 132a of the two tanks 130A and 130B to the first tray 411. The operation of the second vibration unit 140 is controlled so that the flow rate (supply weight per unit time) of the resin material supplied from each tank 130A and 130B to the first tray 411 is approximately constant.

[0083] Furthermore, while the second vibration unit 140 is operating, the first small tray 411 begins to move horizontally. Specifically, the first small tray 411 is moved appropriately forward, backward, left, and right by the small tray conveying mechanism. The small tray conveying mechanism moves the first small tray 411 such that the supply ports 132a of each slot 130A and 130B pass through half (the front half) of the area of ​​the first small tray 411. In addition, the small tray conveying mechanism moves the first small tray 411 such that the supply ports 132a of each slot 130A and 130B finally return to directly above the starting position S. Figure 9A The diagram shows an example of the relative movement trajectory of two slots 130A and 130B relative to the first tray 411. By passing through the supply port 132a of each slot 130A and 130B along this trajectory, resin material can be spread over half of the area of ​​the first tray 411.

[0084] When the supply ports 132a of each of the tanks 130A and 130B return to directly above the starting position S, the second vibration unit 140 stops, and the supply of resin material from each of the tanks 130A and 130B to the first small tray 411 stops.

[0085] like Figure 9B As shown, resin material is supplied to half (the front half) of the first tray 411 in this manner. In Figure 9, the area where resin material has been supplied is shown in gray. Furthermore, the weight of the resin material supplied to the first tray 411 through a single supply of resin material using each of the troughs 130A and 130B (the supply of resin material from the start of operation of the second vibrating unit 140 until its stop) is controlled to reach a preset target value (target supply amount). Specifically, the target supply amount of resin material is supplied to the first tray 411 by appropriately controlling the operation of the second vibrating unit 140 and the tray conveying mechanism.

[0086] And, as Figure 9CAs shown, the front-to-back direction of the first small tray 411 is reversed by a small tray conveying mechanism. Then, in the first small tray 411, resin material is supplied from the two slots 130A and 130B to the remaining half of the area where no resin material has been supplied. In this case, the first small tray 411 is also moved as shown... Figure 9A The movement trajectory shown indicates that resin material is supplied from each of the slots 130A and 130B to the first small tray 411. As a result, as... Figure 9D As shown, the first small tray 411 is entirely equipped with resin material. When the resin material is supplied to the first small tray 411 in this manner, the front-back direction of the first small tray 411 is reversed, and the resin material is supplied in two batches.

[0087] As described above, since multiple (2) slots 130A and 130B are used to supply resin material to the first small tray 411, the time for supplying resin material to the first small tray 411 can be shortened.

[0088] Subsequently, additional resin material is supplied along the outer edge of the first small tray 411. (Refer to...) Figures 9E to 9J Let me explain this point. First, as... Figure 9E As shown, adjust the position of the first small tray 411 so that the supply ports 132a of the two slots 130A and 130B are directly above the given starting position S. Position the supply port 132a of the first slot 130A near the center of the right side of the first small tray 411, and position the supply port 132a of the second slot 130B near the center of the first small tray 411.

[0089] Secondly, only the second vibrating part 140 of the first groove 130A is activated, and the first small tray 411 is moved forward. Thus, as... Figure 9F As shown, additional resin material D is supplied from near the center of the left side of the first tray 411 to the rear end on the left side. This additional resin material D is stacked on top of the resin material supplied to the entire surface of the first tray 411. This is also the case in subsequent operations.

[0090] Next, the second vibrating section 140 of the two slots 130A and 130B is activated, and the first small tray 411 is moved to the left. Thus, as... Figure 9G As shown, additional resin material D is supplied along the edge of the rear end of the first small tray 411.

[0091] Furthermore, only the second vibration section 140 of the second groove 130B is activated, and the first small tray 411 is moved rearward. Thus, as... Figure 9HAs shown, additional resin material D is supplied from the rear right side of the first small tray 411 to near the center on the right side. Thus, the additional resin material D is supplied to half of the outer edge of the first small tray 411.

[0092] Next, as Figure 9I As shown, the front-to-back direction of the first small pallet 411 is reversed by the small pallet conveying mechanism. Then, in the first small pallet 411, according to... Figures 9E to 9H The steps shown involve supplying additional resin material D from the two tanks 130A and 130B to the outer edge of the remaining half of the tank where no additional resin material D has been supplied. The result is as follows: Figure 9J As shown, additional resin material D is deposited around the outer edge of the resin material disposed on the entire surface of the first small tray 411.

[0093] As described above, during the supply of resin material to the first tray 411, resin material is also supplied to the second tray 412 through the third and fourth tanks 130C and 130D. Therefore, as Figure 9J As shown, the resin material is also disposed on the second small tray 412.

[0094] <5. Method for supplying resin material from small trays to large trays> Next, while referring to Figures 10A to 10E The method of supplying resin material from small trays to large trays is explained. For example... Figure 10A As shown, in the initial state, the first small tray 411 and the second small tray 412 are positioned on the side of the resin material supply device 100, and the third small tray 413 and the fourth small tray 414 are positioned on the dust collection table 43. Then, when resin material is placed on the first small tray 411 and the second small tray 412, the first small tray 411 and the second small tray 412 are moved above the large tray 44 by the small tray conveying mechanism. Figure 10B As shown, the first small tray 411 is moved to the right front side of the large tray 44, and the second small tray 412 is moved to the left front side of the large tray 44. Then, as... Figure 8 As shown, the baffle 41b is moved horizontally, discharging the resin material held in the slit 41c downwards. This supplies the resin material into the grooves 44c of each receiving portion 44b of the large tray 44. Consequently, the resin material is supplied to the front half of the large tray 44.

[0095] At this time, the third tray 413 and the fourth tray 414 are moved toward the resin material supply device 100.

[0096] Next, as Figure 10CAs shown, the first small tray 411 and the second small tray 412, after the resin material is supplied to the large tray 44, are moved to the dust collection table 43. Then, the dust adhering to the bottom surface of each small tray 411, 412 is collected on the dust collection table 43.

[0097] And, as Figure 10D As shown, resin material is supplied to the third tray 413 and the fourth tray 414 via the resin material supply device 100. The steps are as follows: Figures 9A to 9J As shown in the image.

[0098] Next, as Figure 10E As shown, the third small pallet 413 and the fourth small pallet 414 are moved above the large pallet 44 by a small pallet conveying mechanism. At this time, the third small pallet 413 is moved to the right rear side of the large pallet 44, and the fourth small pallet 414 is moved to the left rear side of the large pallet 44. Then, the resin material held on the third small pallet 413 and the fourth small pallet 414 is supplied to the large pallet 44. As a result, the resin material is supplied to the rear half of the large pallet 44. Consequently, the entire large pallet 44 is covered with resin material.

[0099] At this time, resin material is disposed on the entire surface of the large tray 44, and additional resin material D is disposed throughout the cross-shaped area passing through the center of the large tray 44 and the entire circumference of the outer edge of the large tray 44. The positions where the additional resin material D is disposed correspond to the gaps 85 to 87 on the panel shown in FIG1.

[0100] <6. Molding process and subsequent processes in the molding module> When the resin material is placed on the large tray 44 in the manner described above, the loading unit 21 moves along the track L, transporting the panel P to a molding module 30. For example... Figure 11A As shown, the panel P, which is transported to the molding module 30, is adsorbed and held in the upper mold 311 of the molding mold 31.

[0101] Next, a release film (illustration omitted) is provided to cover the cavity 313 of the lower mold 312 of the forming mold 31.

[0102] Next, the large pallet 44, holding the resin material, is transported to the molding mold 31 of the molding module 30 by the large pallet conveying mechanism 45 moving along the track L. Afterwards, as... Figure 11A As shown, the resin material from the large tray 44 is supplied to the cavity 313 of the lower mold 312. After the large tray conveying mechanism 45 supplies the resin material to the molding mold 31, it returns to the resin supply module 40.

[0103] Next, the resin material is melted through the heater of molding die 31. Then, as... Figure 11BAs shown, the lower mold 312 and the upper mold 311 are brought close together by the mold-closing mechanism (mold closing), and the electronic components 83 of the panel P are immersed in molten resin material. In this state, appropriate pressure is applied to the resin material. Then, by the hardening of the resin material, a panel P with the electronic components sealed in resin is obtained.

[0104] Subsequently, the lower mold 312 and the upper mold 311 are separated by the mold closing mechanism (mold opening). Meanwhile, the unloading unit 22 moves along the track L to receive the resin-molded panel P from the molding mold 31. At this time, a new, unmolded panel P can be placed on the molding mold 31 by the loading unit 21, which moves together with the unloading unit 22. Afterward, the unloading unit 22 moves along the track L back to the substrate transfer module 20.

[0105] Next, the panel P held in the unloading section 22 is transported to the inspection section 13 by the arm mechanism 14. The resin-molded panel P is inspected in the inspection section 13.

[0106] The panel P, having completed its inspection, is transported to the transfer section 12 by the arm mechanism 14. The panel P, located in the transfer section 12, is then properly transferred to the outside.

[0107] <7. Characteristics> Because gaps 85 to 87 are formed between adjacent islands 83A to 83D and around the outer periphery of islands 83A to 83D in the aforementioned panel, molten resin flows into these gaps 85 to 87 during resin molding by compression. This flow causes electronic components to detach from the panel.

[0108] To address this issue, in this embodiment, as follows: Figure 11A As shown, resin material D is added in layers to the resin material disposed in the cavity 313 of the lower mold 312, corresponding to the gaps 85-87. Therefore, by adding resin material D, the flow of resin into the gaps 85-87 is suppressed, and as a result, the detachment of electronic components 83 can be suppressed.

[0109] <8. Examples of Variation> The present invention has been described above as an embodiment, but the present invention is not limited to the above embodiments. Various modifications can be made without departing from its spirit. For example, the following modifications can be made. In addition, the essence of the following variations can be appropriately combined.

[0110] (1) The components used in the resin molding apparatus 1 of the above embodiment (such as the substrate loading and unloading module 10) are examples that can be appropriately disassembled or replaced. For example, the substrate loading and unloading module 10 can be omitted and the panel P can be manually loaded and unloaded by the operator.

[0111] (2) In the above embodiment, the large tray is formed to be four times the size of the small tray, and the resin material is disposed on the large tray by supplying the resin material four times using the small tray, but it is not limited to this. For example, the large tray can also be formed to be twice the size of the small tray, and the resin material can be disposed on the large tray by supplying the resin material twice using the small tray. That is, as long as the large tray is formed to be n times the size of the small tray (n is a natural number of 2 or more), and the resin material is disposed on the entire surface of the large tray by supplying the resin material n times using the small tray.

[0112] (3) The configuration of the small tray 41 and the large tray 44 shown in the above embodiment is an example, and the method of supplying and holding the resin material can be appropriately changed.

[0113] (4) In the above embodiment, a resin material supply device 100 having two tanks 130 (resin supply section) is exemplified, but the present invention is not limited thereto, and may also have one or more tanks 130.

[0114] (5) The resin molding apparatus 1 of the above embodiment has two resin material supply devices 100, but the present invention is not limited thereto, and may also have one or more resin material supply devices 100.

[0115] (6) In addition, in this embodiment, the operation of each module is controlled by a single control unit 50, but the present invention is not limited to this, and multiple control units 50 may be provided. For example, a control unit 50 may be provided for each module or each device, and the operation of each module, etc., may be linked together while being controlled individually.

[0116] Symbol Explanation 1: Resin molding device 30: Molding Module 31: Molding mold 40: Resin Supply Module 50: Control Department 83: Electronic components 83A~83D: Island 85~87: Gap 411~414: Small tray (second tray) 43: Large tray (first tray).

Claims

1. A resin supply apparatus for supplying resin material to a molding die, the molding die forming a substrate with resin using compression molding, the resin supply apparatus comprising: The first tray is made of resin material; At least one second tray, smaller in size than the first tray, and configured with the resin material; The pallet conveying unit transfers the second pallet onto the first pallet; At least one resin supply unit supplies resin material to the second tray; and Control Department The control unit performs: The first step is to apply the resin material to the second tray using the resin supply unit; The second step involves using the resin supply section to spread the resin material so that the resin material overlaps the outer edge of the resin material spread in the first step; and The third step involves transferring the second tray to the first tray and placing the resin material from the second tray into an area of ​​the first tray where no resin material was previously placed. The resin supply device is configured to place the resin material onto the first tray by repeating the first to the third steps.

2. The resin supply device according to claim 1, wherein, The resin supply device has two or more second trays. The resin supply device is configured to supply resin material to each of the second trays via a plurality of resin supply sections.

3. The resin supply device according to claim 1 or 2, wherein, The second tray has a first region on the side of the resin supply section and a second region on the opposite side of the first region. In the first and second steps, after the control unit applies resin material to the first area of ​​the second tray, it rotates the second tray so that the second area of ​​the second tray faces the resin supply unit, thereby supplying resin material to the second area.

4. The resin supply device according to claim 1 or 2, wherein, The first tray and the second tray are formed in a rectangular shape. The first tray is four times the size of the second tray. The resin supply device is configured to supply resin material transported from the second pallet to each of the four regions after the first pallet is divided longitudinally and transversely.

5. The resin supply device according to claim 1 or 2, wherein, The substrate comprises: Vehicles; and Multiple electronic components are secured to the carrier by temporary fasteners. Multiple islands, each containing multiple electronic components, are arranged on the vehicle with gaps between them. The resin material is configured to face the substrate in the molding die. The additional resin material is disposed on the substrate at a position corresponding to the gap.

6. A resin molding apparatus, comprising: A molding module having a molding die utilizing compression molding; and A resin supply module comprising the resin supply device as described in claim 1 or 2, and supplying the resin material of the first tray to the molding die of the molding module.

7. A resin supply method comprising supplying resin material to a molding die, the molding die using compression molding to form resin onto a substrate, the resin supply method comprising: The first step is to prepare a first tray and a second tray that is smaller than the first tray. The second step is to apply resin material to the second tray. The third step is to spread the resin material so that it overlaps the outer edge of the resin material spread in the first step; as well as The fourth step involves transferring the second tray to the first tray and placing the resin material from the second tray into an area of ​​the first tray where no resin material was previously placed. The resin material is disposed on the first tray by repeating steps two through four.

8. A method for manufacturing a resin molded article, the method comprising: The step of preparing a substrate includes a carrier and multiple electronic components fixed to the carrier by temporary fasteners, and multiple islands including multiple electronic components are arranged on the carrier with gaps between them. The step of supplying resin material to the first tray using the resin supply method of claim 7; The step of placing the resin material of the first tray into the molding die; The step of placing the substrate in the molding die; as well as The step of molding the resin material onto the substrate using compression molding in the molding die.

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