Microfluidic chip and preparation method and application thereof
By doping a microfluidic chip substrate with perfluorinated modified nanofillers, a core was prepared and bonded to the substrate, solving the problems of insufficient hydrophobicity, biomolecule adsorption, and structural stability of microfluidic chips, and achieving efficient and stable droplet preparation and chip performance.
Patent Information
- Application Number
- CN202610817319.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-08
- Publication Date
- 2026-08-25
AI Technical Summary
Existing microfluidic chips suffer from insufficient hydrophobicity, susceptibility to non-specific adsorption of biomolecules, poor uniformity of channel modification, and unsatisfactory stability of the modified sealing structure, making it difficult to meet the needs of large-scale mass production.
By incorporating perfluorinated modified nanofillers into a microfluidic chip substrate, a core is fabricated using a microfluidic chip molding process and bonded to the substrate to form a channel structure. This avoids the need for surface modification and directly regulates the physicochemical properties of the chip.
It significantly improves the hydrophobic properties of microfluidic chips, ensures the consistency of droplet preparation, reduces biomolecule adsorption, enhances chip rigidity and thermal stability, solves the problems of insufficient hydrophobic properties and structural stability in existing technologies, and achieves long-term stability and durability.
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Abstract
Description
Technical Field
[0001] This application relates to the field of microfluidic chip manufacturing technology, and in particular to a microfluidic chip, its preparation method, and its application. Background Technology
[0002] PDMS, as the most widely used hydrophobic material, has a natural contact angle greater than 100°, but it still has fatal flaws: on the one hand, PDMS is prone to non-specific adsorption of biomolecules, which leads to a continuous decrease in the contact angle and damages the stability of droplets; on the other hand, its surface activation treatment effect is difficult to last. Although high-energy physical treatments such as oxygen plasma can activate surface functional groups, achieve bonding with glass and improve hydrophilicity, the activated state is transient and will return to hydrophobicity within a few hours to a few days.
[0003] To improve the hydrophobic stability of PDMS or compensate for the insufficient hydrophobicity of other materials, existing PDMS chip processes mostly employ a multi-channel parallel injection molding step emulsion structure. This method increases production efficiency by generating droplets at a low speed and stabilizing the flow of liquid, thus increasing the number of channels. However, this approach significantly increases the design and manufacturing costs of the chip. Furthermore, current mainstream channel modification methods struggle to achieve uniform modification within closed microchannels, and the fluorinated surface requires nitrogen storage, increasing storage and usage costs and failing to meet the efficiency and consistency requirements of large-scale mass production. Especially in mass production scenarios, injection molding of thermoplastic polymers such as PMMA, PS, PP, and COC / COP is the mainstream solution, but it still faces the following dual challenges: From a hydrophobicity perspective, only COC materials have a natural contact angle of 90–100°, while other materials require additional hydrophobic treatment. Furthermore, after mass production of thermoplastic materials, the consistency of channel surface modification is extremely poor, with contact angle fluctuations reaching 8–10°, severely affecting droplet size uniformity. From a process adaptability perspective, there is a structural contradiction between modification and sealing. Modifying channels before sealing reduces the material's surface energy, making mainstream sealing methods such as thermal bonding and ultrasonic sealing prone to leakage. If sealing is performed before modification, the modification effect on microchannels narrower than 40μm is extremely poor, and it easily clogs the flow channels. Neither solution can simultaneously achieve modification uniformity and bonding stability. In addition, existing processes also face the challenge of balancing efficiency and cost.
[0004] In summary, the current field of microfluidic chip fabrication suffers from insufficient and easily degraded hydrophobic properties of materials, prominent issues with non-specific adsorption of biomolecules, poor uniformity of channel modification, and unsatisfactory stability of the modified sealing structure. There is an urgent need for an integrated fabrication solution that can comprehensively address these problems. Summary of the Invention
[0005] In view of this, the purpose of this application is to provide a microfluidic chip, its preparation method and application, to solve the technical pain points of existing microfluidic chips, such as insufficient hydrophobic properties, easy non-specific adsorption of biomolecules, and poor structural and performance stability.
[0006] To achieve the above-mentioned technical objectives, this application provides a method for fabricating a microfluidic chip, comprising the following steps:
[0007] Step S1: Add perfluorinated modified nanofillers to the microfluidic chip substrate and mix them evenly to obtain a premix.
[0008] Step S2: The premix is molded using a microfluidic chip molding process to obtain the core.
[0009] Step S3: Bond the core to the substrate to obtain a microfluidic chip.
[0010] Furthermore, the perfluorinated modified nanofiller includes at least one of perfluorinated modified titanium dioxide nanoparticles, perfluorinated modified silica nanoparticles, and perfluorinated modified multi-walled carbon nanotubes.
[0011] Furthermore, the mass ratio of perfluorinated modified nanofiller to microfluidic chip substrate is 0.005–0.03:1.
[0012] Furthermore, the microfluidic chip substrate includes a photocurable adhesive and a photocuring agent.
[0013] Furthermore, the microfluidic chip substrate includes a thermosetting adhesive and a thermosetting agent.
[0014] Furthermore, the microfluidic chip substrate includes thermoplastic adhesive.
[0015] Furthermore, microfluidic chip molding processes include mold making technology and / or 3D printing technology.
[0016] Furthermore, it also includes thermal reversion treatment of the microfluidic chip.
[0017] This application provides a microfluidic chip, including a substrate and a core. The core has a groove, the substrate and the core are fixedly connected, and the groove of the substrate and the core surrounds each other to form a channel structure. The core is made of a microfluidic chip substrate doped with perfluorinated modified nanofiller through a molding process, and the perfluorinated modified nanofiller is uniformly distributed in the core.
[0018] This application provides an application of a microfluidic chip for the preparation of monodisperse microspheres and hydrogel spheres.
[0019] In summary, this application provides a method for preparing a microfluidic chip with enhanced hydrophobic properties, comprising the following steps: introducing perfluorinated modified nanofillers into a microfluidic chip substrate, and obtaining a premix after homogenization and mixing; molding the premix using a microfluidic chip molding process to obtain a core; and bonding and encapsulating the core with the substrate to finally obtain the microfluidic chip. This application, by doping the microfluidic chip substrate with perfluorinated modified nanofillers, controls the physicochemical properties of the microfluidic chip itself from the source, resulting in a microfluidic chip with the following advantages: First, it significantly improves the surface contact angle of the microfluidic chip, greatly optimizes hydrophobic performance, and ensures the particle size consistency of droplet preparation such as monodisperse microspheres and hydrogel spheres; second, it effectively reduces the non-specific adsorption effect of biomolecules on the surface of the microfluidic chip, avoiding a continuous decrease in contact angle that could damage droplet stability; third, it enhances the rigidity of the microfluidic chip itself, improving its tolerance to pressure loads and thermal stability. More importantly, this solution does not involve any surface modification, successfully avoiding the contradiction between modification and sealing structure stability caused by surface modification in the prior art. It also avoids the technical problems of bonding leakage caused by pre-sealing modification or microchannel blockage caused by post-sealing modification.
[0020] Compared to existing technologies that rely on post-treatment methods such as surface chemical modification and physical modification, this application directly composites modified fillers into the substrate to regulate the physicochemical properties of the microfluidic chip itself from the source. The surface performance optimization achieved has long-term stability and durability, completely getting rid of the limitation of easy decay of traditional surface treatment effects. Detailed Implementation
[0021] The technical solutions of the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments in this application specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection claimed in this application.
[0022] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship shown, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0024] The raw materials used in this invention are not particularly restricted in their source; they can be purchased on the market or prepared using conventional methods known to those skilled in the art.
[0025] This application provides a method for fabricating a microfluidic chip, comprising the following steps:
[0026] Step S1: Add perfluorinated modified nanofillers to the microfluidic chip substrate and mix them evenly to obtain a premix.
[0027] Step S2: The premix is molded using a microfluidic chip molding process to obtain the core.
[0028] Step S3: Bond the core to the substrate to obtain a microfluidic chip.
[0029] In some embodiments, the perfluorinated modified nanofiller includes at least one of perfluorinated modified titanium dioxide nanoparticles, perfluorinated modified silica nanoparticles, and perfluorinated modified multi-walled carbon nanotubes.
[0030] In some embodiments, the preparation method of the perfluorinated modified nanofiller is as follows: the nanofiller is dispersed in anhydrous toluene, a perfluorosilane is added, and the mixture is heated under reflux at 60°C to 80°C for 6 to 24 hours to obtain the perfluorinated modified nanofiller; wherein the perfluorosilane includes at least one of perfluorooctyltriethoxysilane and tridecafluorooctyltriethoxysilane.
[0031] In some specific embodiments, anhydrous toluene is used as the solvent, and the mass percentage of perfluorosilane is 2-3%.
[0032] In some embodiments, the mass ratio of perfluorinated modified nanofiller to microfluidic chip substrate is 0.005 to 0.03:1.
[0033] In some embodiments, the microfluidic chip substrate includes a photocurable adhesive and a photocuring agent.
[0034] In some preferred embodiments, the photocurable base adhesive is selected from thermosetting or photocurable polymers such as polyurethane, epoxy resin, and polyacrylate; the photocuring agent is a curing agent compatible with the photocurable base adhesive.
[0035] In some embodiments, the microfluidic chip substrate includes a thermosetting adhesive and a thermosetting agent.
[0036] In some preferred embodiments, the thermosetting base adhesive includes a PDMS base adhesive, wherein the PDMS base adhesive is polydimethylsiloxane, and the curing agent is a curing agent commonly used with PDMS.
[0037] In some embodiments, the microfluidic chip substrate comprises a thermoplastic base adhesive.
[0038] In some preferred embodiments, the thermoplastic base adhesive is selected from at least one of polymethyl methacrylate (PMMA), polystyrene (PS), polypropylene (PP), and cyclic olefin copolymer / cyclic olefin polymer (COC / COP).
[0039] It should be noted that both COC and COP are thermoplastic materials with similar structures and properties, and can achieve essentially the same technical effects in this application. During injection molding, the barrel temperature of COC material is 220–320°C, the melt temperature is 250–300°C, and the mold temperature is 40–160°C. Specifically, for the Mitsui APEL series COC grades, the preferred barrel temperature is 240–260°C, and the preferred mold temperature is 90–120°C.
[0040] In some embodiments, the microfluidic chip molding process includes molding technology and / or 3D printing technology.
[0041] In some embodiments, the microfluidic chip is further subjected to thermal recyclization.
[0042] This application provides a hydrophobic microfluidic chip, including a substrate and a core. The core has a groove, and the substrate and the core are fixedly connected. The groove of the substrate and the core encloses the channel structure. The core is made of a microfluidic chip substrate doped with perfluorinated modified nanofiller through a molding process. The perfluorinated modified nanofiller is uniformly distributed in the core.
[0043] This application provides an application of a hydrophobic microfluidic chip for the preparation of monodisperse microspheres and hydrogel spheres.
[0044] The applicant further provides the following specific embodiments to describe the present invention. It should be noted that these embodiments are merely descriptive and do not limit the present invention in any way.
[0045] Comparative Example 1
[0046] This embodiment provides a method for fabricating a microfluidic chip, including the following steps:
[0047] Step S1: In a disposable container, add 100g of PDMS base adhesive (Dow Corning Sylgard 184, base) and 10g of PDMS curing agent (Dow Corning Sylgard 184, curing agent). Stir both in the same direction for 5 minutes using a sinking mechanical agitator to obtain a PDMS mixture.
[0048] Step S2: Transfer the PDMS mixture to a vacuum degassing device and vacuum it for 40 minutes: Put the PDMS mixture into a vacuum degassing machine, turn on the vacuum pump, and evacuate to a negative pressure of 1 atmosphere. Continue degassing for 40 minutes. If you want to increase the degassing speed, you can repeat the steps of evacuating to negative pressure and restoring normal pressure to speed up the degassing speed until you get a bubble-free, translucent to milky white PDMS mixture.
[0049] Step S3: The degassed PDMS mixture is poured into a microfluidic channel mold, placed in a vacuum degassing machine, the vacuum pump is turned on, and the pressure is evacuated to a negative pressure of 1 atmosphere for 40 minutes. Then, a thermosetting treatment is performed to obtain the PDMS core. The PDMS core is then bonded to glass with oxygen plasma to form a microfluidic chip with a channel structure. Finally, the microfluidic chip is placed in an 80°C oven for heat reforming treatment for 30 days.
[0050] In this comparative example, the microfluidic chip was placed in a 120°C oven for 7 days for thermal reformation, which also achieved the same technical effect.
[0051] Comparative Example 2:
[0052] Step S1: In a disposable container, add 100g of PDMS base adhesive (Dow Corning Sylgard 184, base) and 10g of PDMS curing agent (Dow Corning Sylgard 184, curing agent). Stir both in the same direction for 5 minutes using a sinking mechanical agitator to obtain a PDMS mixture.
[0053] Step S2: Transfer the PDMS mixture to a vacuum degassing device and vacuum it for 40 minutes: Put the PDMS mixture into a vacuum degassing machine, turn on the vacuum pump, and evacuate to a negative pressure of 1 atmosphere. Continue degassing for 40 minutes. If you want to increase the degassing speed, you can repeat the steps of evacuating to negative pressure and restoring normal pressure to speed up the degassing speed until you get a bubble-free, translucent to milky white PDMS mixture.
[0054] Step S3: The degassed PDMS mixture is poured into a microfluidic channel mold and placed in a vacuum degassing machine. The vacuum pump is turned on and the pressure is reduced to 1 atmosphere. Degassing is continued for 40 minutes, followed by thermosetting to obtain the PDMS channel cavity. Another portion of the degassed PDMS mixture is poured into a smooth glass plate mold to create the chip substrate. The mold is placed in a vacuum degassing machine, and the vacuum pump is turned on and the pressure is reduced to 1 atmosphere. Degassing is continued for 40 minutes. After degassing, the mold is placed on a temperature-controlled baking stage and cured at 70°C for 16 minutes. When the substrate is in a semi-cured state, the PDMS channel cavity is immediately bonded to the substrate. After the two sides are bonded and the air bubbles near the channel are automatically vented, it is transferred to an 80°C oven for curing for 24 hours to obtain the microfluidic chip. The microfluidic chip is then placed in an 80°C oven for heat reforming treatment for 7 days.
[0055] Comparative Example 3:
[0056] Step S1: In a disposable container, add 100g of PDMS base adhesive (Dow Corning Sylgard 184, base) and 10g of PDMS curing agent (Dow Corning Sylgard 184, curing agent). Stir both in the same direction for 5 minutes using a sinking mechanical agitator to obtain a PDMS mixture.
[0057] Step S2: Transfer the PDMS mixture to a vacuum degassing device and vacuum it for 40 minutes: Put the PDMS mixture into a vacuum degassing machine, turn on the vacuum pump, and evacuate to a negative pressure of 1 atmosphere. Continue degassing for 40 minutes. If you want to increase the degassing speed, you can repeat the steps of evacuating to negative pressure and restoring normal pressure to speed up the degassing speed until you get a bubble-free, translucent to milky white PDMS mixture.
[0058] Step S3: The degassed PDMS mixture is poured into a microfluidic channel mold, placed in a vacuum degassing machine, the vacuum pump is turned on, the pressure is evacuated to a negative pressure of 1 atmosphere, and degassing is continued for 40 minutes. Then, a thermosetting treatment is performed to obtain the PDMS core. The PDMS core is then bonded to glass with oxygen plasma to form a microfluidic chip with a channel structure.
[0059] Step S4: Dilute the Juzeit PDMS concentrated hydrophobic treatment agent to 20 times with the matching diluent to form a modification solution. Use a pipette to add 10 μL of the modification solution to the bonded microfluidic chip. Wait 20-30 seconds until the modification solution completely wets the microfluidic chip channels. Then use a nitrogen gun to blow away any excess modification solution from the chip. Place the chip in an 80°C oven to dry for 10 minutes. Once the chip surface is completely dry, it can be used.
[0060] Preparation Example 1
[0061] This preparation example provides a method for preparing perfluorinated modified nanofillers, including the following steps:
[0062] 100g of SiO2 nanofiller was dispersed in anhydrous toluene of analytical grade, and perfluorooctyltriethoxysilane was added; the mixture was heated under reflux at 70°C for 1 hour to obtain perfluorinated modified SiO2. The perfluorinated modified SiO2 was then centrifuged, washed, and dried for later use.
[0063] In this preparation example, anhydrous toluene was used as the solvent, and the mass ratio of perfluorooctyltriethoxysilane was 3%.
[0064] Example 1
[0065] This embodiment provides a method for fabricating a microfluidic chip, including the following steps:
[0066] Step S1: In a disposable container, add 100g of PDMS base adhesive (Dow Corning Sylgard 184, base) and 10g of PDMS curing agent (Dow Corning Sylgard 184, curing agent). Finally, weigh 1.1g of perfluorinated modified silica nanoparticles using an analytical balance. Stir both in the same direction for 5 minutes using a sinking mechanical stirrer to obtain a PDMS mixture.
[0067] Step S2: Transfer the PDMS mixture to a vacuum degassing device for vacuum treatment for 10 minutes: Place the mixed colloid into a vacuum degassing machine, turn on the vacuum pump, draw a negative pressure of 1 atmosphere, and continue degassing for 10 minutes. If you want to increase the degassing speed, you can repeat the steps of drawing a negative pressure and restoring normal pressure to speed up the degassing speed until you get a bubble-free, translucent to milky white PDMS mixture.
[0068] Step S3: Pour the degassed PDMS mixture into a mold, place it in a vacuum degassing machine, turn on the vacuum pump, draw a negative pressure of 1 atmosphere, and continue degassing for 40 minutes. Then perform thermosetting treatment to obtain the PDMS core. Surface bond the PDMS core to glass to form a microfluidic chip with a channel structure. Finally, place the microfluidic chip in an 80℃ oven for heat reforming treatment for 7 days.
[0069] This embodiment adds perfluorinated modified silica nanoparticles, which have the following beneficial effects compared with Comparative Example 1: (1) Compared with Comparative Example 1, the preparation cycle is shortened and the process efficiency is improved: In the preparation system of droplet generation chip, after introducing perfluorinated silica nanoparticles, the degassing time can be shortened by 60% to 80%, and the thermal reversion time of microfluidic chip can be shortened by 2 to 4 times, which effectively accelerates the chip preparation process and effectively improves the uniformity of chip surface properties, reducing batch-to-batch differences caused by manual processes. (2) Compared with Comparative Example 1, the chip surface has self-cleaning properties and optimizes interface performance: The chip surface provided in this embodiment has excellent self-cleaning properties. This property can significantly inhibit the non-specific adsorption of biomolecules, proteins and other substances on the chip surface, reduce the interference of interface contamination on the detection process from the source, improve the accuracy of chip signal acquisition, and reduce the false positive rate.
[0070] To further highlight the technical advantages of this application, the examples are compared and analyzed with Comparative Examples 1 to 3. The comparative study is carried out from two aspects: the difference in preparation process and the difference in the performance of the final product. The specific results are shown in Table 1 and Table 2.
[0071] Table 1. Comparison of preparation processes between Example 1 and Comparative Examples 1-3
[0072]
[0073] Table 2. Comparison of the technical effects of the microfluidic chips prepared in Example 1 and Comparative Examples 1-3
[0074]
[0075] Example 2
[0076] This embodiment provides a method for fabricating a microfluidic chip, including the following steps:
[0077] Step S1: Select a cyclic olefin copolymer (COC, Mitsui APEL series) and add it to the injection molding machine barrel. Melt it at a barrel temperature of 280°C to obtain the masterbatch.
[0078] Step S2: Add perfluorinated modified nanofiller to the masterbatch. The mass of the perfluorinated modified nanofiller is 1.5% of the total mass of the masterbatch, and the perfluorinated modified nanofiller is selected from perfluorinated modified silica nanoparticles. Mix the masterbatch and the perfluorinated modified nanofiller evenly to obtain a mixed filler.
[0079] Step S3: Inject the mixed filler into the screw mixer, mix and heat until completely mixed, then extrude into the injection mold of the chip, place it in a vacuum degassing machine, turn on the vacuum pump, draw a negative pressure of 1 atmosphere, and continue degassing for 40 minutes. After molding, open the mold to obtain the chip flow channel layer structure; then hot press the chip flow channel layer structure with a single-sided adhesive COC film at 140°C to form a chip solid injection molded part.
[0080] Example 3
[0081] This embodiment provides a method for fabricating a microfluidic chip, including the following steps:
[0082] Step S1: Select a cyclic olefin polymer (COP, Mitsui APEL series) and add it to the injection molding machine barrel. Melt it at a barrel temperature of 280°C to obtain the masterbatch.
[0083] Step S2: Add perfluorinated modified nanofiller to the masterbatch. The mass of the perfluorinated modified nanofiller is 1.5% of the mass of the masterbatch, and the perfluorinated modified nanofiller is selected from perfluorinated modified silica nanoparticles. Mix the masterbatch and the perfluorinated modified nanofiller evenly to obtain a mixed filler.
[0084] Step S3: Inject the mixed filler into the screw mixer, mix and heat at 280°C until completely mixed, then extrude into the injection mold of the chip, place it in a vacuum degassing machine, turn on the vacuum pump, draw a negative pressure of 1 atmosphere, and continue degassing for 40 minutes. After molding, open the mold to obtain the chip flow channel layer structure; then hot press the chip flow channel layer structure with a single-sided adhesive COC film at 140°C to form a chip solid injection molded part.
[0085] Example 4
[0086] This embodiment provides a method for fabricating a microfluidic chip, including the following steps:
[0087] Step S1: Epoxy resin, a curing agent compatible with the epoxy resin (1:1 ratio), and perfluorinated modified silica nanoparticles are mixed evenly to obtain a premix; wherein the mass of the perfluorinated modified nanoparticles is 0.5% of the total mass of the UV-curable adhesive and the UV-curable material.
[0088] Step S2: Transfer the premix to the hopper, then place the hopper into the planetary degassing machine, turn on the vacuum pump, draw a negative pressure of 1 atmosphere, and continue degassing for 40 minutes; after degassing, transfer the premix to the raw material hopper of the printing equipment, select the 3D printer to prepare the chip flow channel structure; place the chip flow channel layer structure at 30°C for 5 hours, then place it at 80°C for 2 hours. After curing, bond the chip flow channel structure to the bottom layer structure.
[0089] In this embodiment, the epoxy resin and the matching curing agent used were purchased from Anhui Youfeng New Materials Co., Ltd., specifically epoxy resin 5120A and curing agent 5120B, with a mass ratio of 1:1. The curing process is as follows: heat curing at 30°C for 5-8 hours, followed by heating to 80°C for 1-2 hours.
[0090] In this embodiment, the epoxy resin and its matching curing agent can be replaced with a photocurable ultra-transparent resin, specifically NOVA3D's washable μLtra clear resin, which is compatible with 385–405 nm UV curing. The corresponding printing equipment can be a NOVA 3D photocurable printer, or other LCD photocurable 3D printers compatible with the 385–405 nm curing band, all of which can meet the chip printing and fabrication requirements of this solution.
[0091] The above are merely preferred embodiments of this application and are not intended to limit the present invention. Although this application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A method for fabricating a microfluidic chip, characterized in that, Includes the following steps: Step S1: Add perfluorinated modified nanofillers to the microfluidic chip substrate and mix them evenly to obtain a premix. Step S2: The premix is molded using a microfluidic chip molding process to obtain the core. Step S3: Bond the core to the substrate to obtain a microfluidic chip.
2. The method for fabricating a microfluidic chip according to claim 1, characterized in that, The perfluorinated modified nanofiller includes at least one of perfluorinated modified titanium dioxide nanoparticles, perfluorinated modified silica nanoparticles, and perfluorinated modified multi-walled carbon nanotubes.
3. The method for fabricating a microfluidic chip according to claim 1, characterized in that, The mass ratio of the perfluorinated modified nanofiller to the microfluidic chip substrate is 0.005 to 0.03:
1.
4. The method for fabricating a microfluidic chip according to claim 1, characterized in that, The microfluidic chip substrate includes a photocurable adhesive and a photocuring agent.
5. The method for fabricating a microfluidic chip according to claim 1, characterized in that, The microfluidic chip substrate includes a thermosetting adhesive and a thermosetting agent.
6. The method for fabricating a microfluidic chip according to claim 1, characterized in that, The microfluidic chip substrate includes a thermoplastic base adhesive.
7. The method for fabricating a microfluidic chip according to claim 1, characterized in that, The microfluidic chip molding process includes mold casting technology and / or 3D printing technology.
8. The method for fabricating a microfluidic chip according to claim 1, characterized in that, It also includes thermal reversion processing of microfluidic chips.
9. A microfluidic chip obtained by the preparation method according to any one of claims 1 to 8, characterized in that, It includes a base and a core, the core having a groove, the base being fixedly connected to the core, and the groove of the base and the core forming a channel structure. The core is made from a microfluidic chip substrate doped with perfluorinated modified nanofillers through a molding process, and the perfluorinated modified nanofillers are uniformly distributed in the core.
10. An application of a hydrophobic microfluidic chip obtained by the preparation method according to any one of claims 1 to 8, characterized in that, Used to prepare monodisperse microspheres and hydrogel spheres.