Low-temperature rapid curing construction process for epoxy resin floor

Abstract

The application discloses an epoxy resin floor low-temperature rapid curing construction process and relates to the technical field of floor construction. The process locks a stable construction window period through region division, cooperates with base material surface cleaning, preheating and dehumidification and interface sealing treatment, adopts gradient step-by-step mixing and ultrasonic homogenization under a constant-temperature closed environment to prepare a mixed material, completes layered paving within a coating curing active window and implements step-by-step curing through closed heat preservation space with step-by-step heating. Through the combination of region division, base material low-temperature dehumidification, interface sealing and matching of the mixed material active window, a controllable construction environment optimization mechanism of temperature and humidity is constructed. Under the condition of low temperature and high humidity, the coating curing reaction can be ensured to be uniform, thereby the risk of coating shrinkage, surface whitening and adhesion reduction can be significantly reduced.

Description

Technical Field

[0001] This invention relates to the field of flooring construction technology, specifically to a low-temperature rapid curing construction process for epoxy resin flooring. Background Technology

[0002] Epoxy resin has strong adhesive properties and excellent mechanical properties. It can be used as an adhesive, coating, etc., and is widely used in many industries such as electrical and electronic, construction, etc. Cured epoxy resin is generally non-toxic and is mostly used as floor coating. Due to its strong adhesion to concrete substrate, it is used in building floor environments such as production workshops and underground parking garages. When constructing epoxy resin flooring, due to seasonal climate and project construction period restrictions, epoxy floor coating construction needs to be carried out in a low temperature and high humidity environment.

[0003] The conventional epoxy flooring construction process currently used in the industry is prone to problems such as whitening of the paint surface, pinholes and pores on the surface, and incomplete curing of the coating when working in the aforementioned low temperature and high humidity environment. These issues affect the performance of the flooring and can easily lead to rework and repairs, thus prolonging the overall construction cycle. It is also difficult to meet the construction quality requirements in low temperature and high humidity scenarios. Therefore, it is necessary to design a low temperature and rapid curing construction process for epoxy resin flooring. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a low-temperature rapid curing construction process for epoxy resin flooring, which solves the technical problems of surface pinholes and incomplete coating curing that easily occur when epoxy flooring is constructed in low-temperature and high-humidity environments.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a low-temperature rapid curing construction process for epoxy resin flooring, comprising the following steps:

[0006] Step 1: Area Division: Collect 24-hour temperature and humidity fluctuation data of the concrete substrate in the area to be constructed, divide it into independent and closed small construction areas, and lock the daily construction window period based on the temperature and humidity change pattern of the area. By dividing the area and locking the construction window period, construction can be carried out under relatively stable temperature and humidity conditions, thereby reducing the impact of low temperature and high humidity on the coating curing process.

[0007] Step 2, Substrate Treatment: For the substrate of the construction block during the locked window period, surface cleaning, low-temperature dehumidification and interface reinforcement sealing are carried out in sequence. Substrate treatment, through surface cleaning, preheating dehumidification and interface sealing, provides a dry, clean construction base surface with stable temperature and humidity for subsequent paving, thereby ensuring coating adhesion and uniform curing.

[0008] Step 3: Epoxy Resin Mixing: In a constant temperature and sealed environment, epoxy resin base material, curing agent and accelerator are mixed in a gradient step by step according to the formula. The mixing process is simultaneously assisted by ultrasonic homogenization to obtain a mixture for subsequent paving construction. By combining gradient step mixing with ultrasonic homogenization, a mixture with uniform component dispersion and suitable fluidity can be obtained, so that the coating can still react uniformly in a low temperature environment.

[0009] Step 4, Paving Construction: Apply primer, intermediate coat, and top coat sequentially to the pretreated substrate surface. Each adjacent coat must be laid within the active window after the previous coat is surface dry and before it is fully dry. The top coat is laid in one go using a constant temperature ultrasonic vibration smoothing process. During the paving process, air bubbles inside the coating are eliminated. Layered paving within the active window allows the upper and lower coatings to fully react and bond firmly. The constant temperature vibration smoothing of the top coat helps to eliminate air bubbles, thereby ensuring a smooth surface.

[0010] Step 5, Staged Curing: For the paved subfloor, construct a sealed, insulated curing space isolated from the outside world. Use a temperature-controlled heating device to perform staged curing with stepped heating. Staged curing, through sealed insulation and stepped heating, allows the coating to cure under controllable temperature, reducing the risk of internal stress accumulation caused by rapid temperature rise.

[0011] Preferably, in step one, the locked construction window period is a period of ambient temperature ≥0℃ and continuous duration not less than 5 hours. The area of ​​a single small construction area is controlled at 50-100㎡. The core processes of substrate treatment, mixture preparation and paving construction of a single block must be completed continuously within the locked window period. Continuous construction within the locked window period can avoid temperature and humidity fluctuations interfering with the curing reaction and reduce local pinholes and adhesion decline.

[0012] Preferably, in step two,

[0013] Surface cleaning specifically involves: using grinding equipment to coarsely grind the substrate, and using epoxy repair mortar to level and repair cracks and pits in the substrate. Coarse grinding and repairing cracks and pits can provide a smooth and clean substrate surface, thereby enhancing coating adhesion and reducing bubbles and surface defects.

[0014] Low-temperature dehumidification and interface sealing are performed as follows: The substrate is preheated using a graphene far-infrared heating module, and the construction area is sealed and dehumidified. After treatment, the temperature within 5mm of the substrate surface is controlled to be stable at 5-8℃ and the relative humidity within the area is ≤60%. Then, two coats of sealing primer are applied in sequence. First, an epoxy sealing primer is applied to seal the capillaries of the substrate. After it is surface dry, an interface-enhancing primer is applied to form a continuous interface bonding layer. The sealing primer seals the capillaries, and the interface-enhancing primer forms a continuous bonding layer, which effectively improves the adhesion between the coating and the substrate.

[0015] Preferably, in step three, the constant temperature sealed environment is controlled at 30-35℃ and the relative humidity is ≤60%; the gradient mixing and homogenization are completed in a sealed mixing equipment with temperature control throughout the process, and the temperature of the resulting mixture is stable at 32-40℃ and the viscosity is stable at 3000-5000mPa・s. Controlling the viscosity of the mixture within this range can ensure smooth paving and prevent sagging or uneven curing.

[0016] Preferably, the specific steps of gradient step-by-step mixing in step three are as follows:

[0017] First, preheat the epoxy resin base material in a sealed mixing tank with constant temperature preheating function, and control the base material temperature to be stable at 30-35℃. Controlling the base material temperature to 30-35℃ can improve the curing activity and ensure that the mixture maintains suitable fluidity in a low temperature environment.

[0018] Next, add the full amount of curing agent to the preheated base material, stir and mix while simultaneously turning on ultrasonic homogenization, and add the accelerator in two equal portions, stirring evenly after each addition;

[0019] Finally, pigments, fillers, quartz sand, defoamers, leveling agents, and other flooring construction materials are added. The mixture is stirred and ultrasonic homogenized simultaneously to obtain a mixture for subsequent paving construction. The homogeneous mixture obtained by gradient step mixing combined with ultrasonic homogenization can ensure smooth construction under low temperature conditions. Improvements are made to accelerate curing at low temperatures.

[0020] Preferably, in step four, when the ambient temperature is 0-5℃, the active window control time is 2-12 hours after the surface dryness of the previous coating; when the ambient temperature is -5℃ to 0℃, the control time is 4-24 hours after the surface dryness of the previous coating. The intermediate coating is laid in at least two coats, with the thickness of each coat controlled at 0.8-1.2 mm. The overlap of the curing reaction of adjacent coatings is ≥60%. The active window control ensures that the subsequent coating is laid while the reaction activity of the previous coating is still present, thereby improving the overall stability of the coating.

[0021] Preferably, in step five, the sealed thermal insulation curing space is constructed with flame-retardant thermal insulation cotton. Through a temperature and humidity linkage control device, the relative humidity in the curing space is stably controlled at 50-60%, isolating external temperature and humidity fluctuations and cold air penetration. Through sealed insulation and humidity control, the curing reaction is carried out in a stable temperature and humidity environment, reducing uneven curing and surface defects at low temperatures.

[0022] Preferably, the specific procedures for the stepped heating and phased curing in step five are as follows:

[0023] S1. Low-temperature curing: Within 24 hours after construction, control the temperature of the curing space to be stable at 5-8℃ to ensure that the floor reaches the strength required for walking.

[0024] S2. Temperature curing: On the 2nd-3rd day after construction, the temperature is increased by 3-5℃ to 15-20℃ daily at a uniform rate to promote the cross-linking reaction and release the internal stress of the coating.

[0025] S3. Constant temperature curing: 4-7 days after construction, control the temperature of the curing space to stabilize at 18-22℃ to complete the curing of the floor.

[0026] This invention provides a low-temperature, rapid curing construction process for epoxy resin flooring. Compared with existing technologies, it has the following advantages:

[0027] 1. This invention locks in a stable construction window by dividing the area, combined with preheating and dehumidification of the substrate treatment and interface sealing, and combined with the closed thermal insulation control of staged curing, to form a continuous temperature and humidity control throughout the entire process. This improves the construction stability in low temperature and high humidity environments from the entire construction process, improves the problems of high substrate moisture content and unstable interface bonding, and helps to reduce the probability of whitening, pinholes and uneven curing of the floor.

[0028] 2. This invention achieves phased control of the curing reaction by gradient stepwise mixing of epoxy resin with ultrasonic homogenization, combined with active window matching paving and stepped temperature rise curing, thereby improving the problem of uneven curing rate under low temperature environment, reducing the risk of stress concentration inside the coating, and improving the construction efficiency and coating forming stability under low temperature conditions. Attached Figure Description

[0029] Figure 1 This is a schematic diagram illustrating the construction principle of the present invention;

[0030] Figure 2 This is a schematic diagram of the construction process of the present invention;

[0031] Figure 3 This is a schematic diagram of the stepped heating and staged curing process of the present invention. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] See Figures 1-3 Two technical solutions were provided:

[0034] First implementation method:

[0035] A low-temperature rapid curing construction process for epoxy resin flooring, with the specific construction environment being: a conventional low-temperature environment of 0℃~5℃, relative humidity ≤85%, and the area to be constructed being a concrete floor. This process is suitable for daily construction operations in winter scenarios with low temperatures and high humidity.

[0036] The specific construction steps are as follows: Step 1: Area division Before construction, collect 24-hour temperature and humidity fluctuation data of the environment where the concrete substrate of the area to be constructed is located, determine the temperature change pattern within 24 hours, divide the overall construction area into several independent and closed small construction areas, and lock the daily construction window period for the corresponding area based on the temperature and humidity change pattern of each block.

[0037] The locked construction window period is a period of time when the ambient temperature is ≥0℃ and the continuous duration is not less than 5 hours. The area of ​​a single small construction area is controlled within 50-100㎡. The core processes of substrate treatment, mixture preparation and paving construction of a single block must be completed continuously within the locked window period. The division into small construction units not only facilitates on-site control of construction time, but also allows for more precise control of the temperature and humidity of each work surface.

[0038] Step 2: Substrate Treatment. For the substrate blocks with the locked construction window, carry out surface cleaning, low-temperature dehumidification and interface reinforcement sealing treatment in sequence.

[0039] The surface cleaning process mainly includes: using a dust-free grinding machine equipped with diamond grinding heads to coarsely grind the substrate surface to remove laitance, oil stains and protruding defects. The entire process is carried out in conjunction with an industrial vacuum cleaner for simultaneous dust removal. After the coarse grinding is completed, epoxy repair mortar is used to level and repair cracks and pits in the substrate.

[0040] The low-temperature dehumidification and interface enhancement sealing treatment specifically involves: using a graphene far-infrared heating module to preheat the substrate in full coverage, and simultaneously performing sealed dehumidification treatment on the construction area. After the treatment is completed, the temperature within 5mm of the substrate surface is controlled to be stable at 5-8℃, and the relative humidity within the construction area is ≤60%.

[0041] Next, apply two coats of sealing primer. First, apply the epoxy sealing primer to fully seal the capillaries of the substrate. After the sealing primer is surface dry, apply the interface enhancement primer to form a continuous and uniform interface bonding layer.

[0042] Step 3: In a constant temperature and sealed operating environment, epoxy resin base, curing agent and accelerator are mixed in a gradient according to the preset ratio. During the mixing process, ultrasonic homogenization is carried out simultaneously to obtain a uniformly mixed material.

[0043] The temperature of the constant temperature closed operating environment is controlled at 30-35℃ and the relative humidity is ≤60%. The gradient mixing and homogenization process is completed by a closed mixing equipment with temperature control function. The final mixture temperature is stable at 32-40℃ and the viscosity is stable at 3000-5000mPa・s. The time from the completion of the preparation of the mixture to the end of the paving is controlled within 15 minutes.

[0044] The specific steps of gradient step mixing are as follows:

[0045] First, preheat the epoxy resin base material in a sealed mixing tank with constant temperature preheating function, and control the base material temperature to be stable at 30-35℃.

[0046] Next, add all the curing agent specified in the formula to the preheated base material, and simultaneously turn on the ultrasonic homogenizer while stirring and mixing to ensure that the resin and curing agent are fully and evenly mixed to form a stable basic mixing system.

[0047] Add the accelerator in two equal portions, stirring well after each addition;

[0048] Finally, pigments, fillers, quartz sand, defoamers, leveling agents, and other commonly used auxiliary materials for flooring construction are added. The mixture is stirred and homogenized simultaneously with ultrasonic mixing to obtain a mixture for subsequent paving construction.

[0049] Step 4: Paving Construction. On the pre-treated substrate surface, apply primer, intermediate coat, and top coat in sequence. All adjacent layers must be laid within the active window after the previous layer is surface dry and before it is fully dry. The top coat is laid in one go using a constant temperature ultrasonic vibration smoothing process, and air bubbles inside the coating are eliminated simultaneously during the paving process.

[0050] When the ambient temperature is 0-5℃, the control time of the active window is 2-12 hours after the surface dryness of the previous coating; when the ambient temperature is -5℃~0℃, the control time is 4-24 hours after the surface dryness of the previous coating.

[0051] The intermediate coating is applied in at least two coats, with each coat having a thickness controlled between 0.8 and 1.2 mm. The overlap of the curing reaction between adjacent coats is ≥60%. By matching the curing activity window of the coatings during application, the bonding strength between the two coats can be effectively guaranteed.

[0052] Step 5: Phased Curing. For the completed floor substrate, construct a sealed, insulated curing space that is completely isolated from the external environment. Use a temperature-controlled heating device to perform phased curing with stepped heating. The sealed, insulated curing space is constructed with flame-retardant insulation cotton. Through a temperature and humidity linkage control device, the relative humidity in the curing space is stably controlled at 50-60%, and the space is kept isolated from external temperature and humidity fluctuations and cold air infiltration within the limits of permissible conditions.

[0053] The specific procedures for stepped heating and phased curing are as follows:

[0054] S1. Low-temperature curing: Within 24 hours after construction, the temperature of the curing space should be kept stable at 5-8℃ so that the floor can reach the strength required for walking.

[0055] S2. Temperature curing: On the 2nd-3rd day after construction, the temperature will be increased by 3-5℃ to 15-20℃ at a uniform rate every day.

[0056] S3. Constant temperature curing: 4-7 days after construction, control the temperature of the curing space to be stable at 18-22℃ to complete the curing of the floor.

[0057] In this embodiment, the various processes cooperate with each other to form a continuous construction control system. By dividing the area and locking the construction window in step one, the construction is concentrated in a period of relatively stable environment, thereby reducing the impact of temperature and humidity fluctuations on the coating film formation process. By preheating, dehumidifying and sealing the substrate in step two, the moisture content of the substrate is reduced, the cleanliness of the interface is improved, and the bonding effect between the coating and the substrate is enhanced.

[0058] Based on this, the gradient step-by-step mixing in step three, combined with ultrasonic homogenization, improves the dispersion uniformity of each component in the epoxy resin system. The active window matching paving in step four allows the upper and lower coatings to form an interface bond within the effective reaction stage, thereby improving the interlayer bonding stability. The airtight insulation and stepped temperature rise curing in step five allow the curing reaction to proceed gradually under relatively stable temperature conditions, thereby reducing the risk of internal stress concentration caused by rapid temperature rise.

[0059] By combining regional division, low-temperature dehumidification of the substrate and interface sealing with the active window of the mixture, a construction environment optimization mechanism with controllable temperature and humidity was constructed. Under low temperature and high humidity conditions, this mechanism can stabilize the surface moisture of the substrate and ensure uniform coating curing reaction, thereby significantly reducing the risk of coating pinholes, surface whitening and decreased adhesion.

[0060] By combining gradient step-by-step mixing, ultrasonic homogenization and layered paving, a chemical reaction optimization mechanism is formed to ensure uniform dispersion of the mixture and full reaction between coating layers. This mechanism eliminates bubbles and improves interlayer bonding under low temperature conditions, and further releases internal stress in the coating through stepped temperature curing, achieving rapid curing of the coating and stable mechanical properties.

[0061] By coordinating and controlling the above construction process, the stability of epoxy flooring construction in low temperature and high humidity environments is improved, and the coating film quality and curing consistency are enhanced without changing the epoxy resin base formula.

[0062] Second implementation method:

[0063] The core construction procedures in this embodiment are completely the same as those in the first embodiment. The only difference is that the following parameters have been adjusted for the extremely low temperature construction scenario of -15℃ to -5℃:

[0064] The construction environment is: -15℃ to -5℃ extremely low temperature environment, relative humidity ≤85%, and the area to be constructed is a concrete floor;

[0065] Area division: The area of ​​a single small construction area is controlled within 50㎡, and thickened flame-retardant thermal insulation cotton is used to close the enclosure. The construction window period is the continuous 5 hours with the highest temperature on a single day.

[0066] Substrate treatment: Extend the preheating time of the substrate for the graphene far-infrared heating module to ensure that the temperature within 5mm depth of the substrate surface is stable at 5-8℃. The two sealing primers are fast-drying epoxy primers suitable for use in extremely low temperature environments.

[0067] In the epoxy resin mixing process: the temperature of the constant temperature and sealed operation environment is increased to 35℃, and the discharge temperature of the resulting mixture is stabilized at 38-40℃, further shortening the time from the completion of the mixture preparation to the end of the paving.

[0068] Paving construction: The active window control time is executed within the range of -5℃ to 0℃, and the number of intermediate coating layers and the thickness of each layer are adjusted accordingly based on the curing speed under extremely low temperature conditions;

[0069] Staged curing process: Thickened flame-retardant insulation cotton is used to build a sealed curing space to improve the heat preservation and heat retention effect and isolate the external low temperature.

[0070] Based on the core process system, this embodiment further adapts to the problem that most existing construction processes are only suitable for construction environments above 0°C, and have great difficulty in construction in low-temperature environments below -10°C. By adjusting the size of the construction unit, adjusting the preheating and mixing parameters, and strengthening the curing and insulation performance through a closed-loop construction method, the epoxy resin insulation measures are guaranteed to cure, enabling normal construction in extremely low-temperature environments of -15°C. At the same time, it ensures that the floor reaches walkable strength within 24 hours after construction, forming a closed-loop construction process that is suitable for low-temperature construction.

[0071] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A low-temperature rapid curing construction process for epoxy resin flooring, characterized in that, Includes the following steps: Step 1: Area Division: Collect 24-hour temperature and humidity fluctuation data of the concrete substrate in the area to be constructed, divide it into independent and closed small construction areas, and determine the daily construction window period based on the temperature and humidity change patterns of the blocks. Step 2, Substrate Treatment: For the substrate of the construction area during the locked window period, surface cleaning, low-temperature dehumidification and interface reinforcement sealing are carried out in sequence; Step 3: Epoxy Resin Mixing: In a constant temperature and sealed environment, epoxy resin base material, curing agent and accelerator are mixed in a gradient step by step according to the formula. The mixing process is simultaneously assisted by ultrasonic homogenization treatment to obtain a mixture for subsequent paving construction. Step 4, Paving Construction: Apply primer, intermediate coat and top coat in sequence to the surface of the pretreated substrate. Each layer of coating must be laid within the active window after the previous layer is surface dry and before it is fully dry. The top coat is laid in one go using a constant temperature ultrasonic vibration smoothing process, and air bubbles inside the coating are eliminated during the paving process. Step 5, Phased Curing: For the completed floor substrate, construct a sealed, insulated curing space isolated from the outside world, and implement phased curing with a temperature-controlled heating device.

2. The low-temperature rapid curing construction process for epoxy resin flooring according to claim 1, characterized in that, In step one, the locked construction window period is a period of time with an ambient temperature ≥0℃ and a continuous duration of not less than 5 hours. The area of ​​a single small construction area is controlled within 50-100㎡. The core processes of substrate treatment, mixture preparation, and paving construction of a single block must be completed continuously within the locked window period.

3. The low-temperature rapid curing construction process for epoxy resin flooring according to claim 1, characterized in that, In step two Surface cleaning specifically involves: using grinding equipment to coarsely grind the substrate, and using epoxy repair mortar to level and repair cracks and pits in the substrate; Low-temperature dehumidification and interface sealing are performed as follows: the substrate is preheated using a graphene far-infrared heating module, and the construction area is sealed and dehumidified. After treatment, the temperature within 5mm of the substrate surface is controlled to be stable at 5-8℃ and the relative humidity within the area is ≤60%. Then, two coats of sealing primer are applied in sequence. First, an epoxy sealing primer is applied to seal the capillaries of the substrate. After it is surface dry, an interface enhancement primer is applied to form a continuous interface bonding layer.

4. The low-temperature rapid curing construction process for epoxy resin flooring according to claim 1, characterized in that, In step three, the constant temperature sealed environment is controlled at 30-35℃ and the relative humidity is ≤60%; the gradient mixing and homogenization are completed in the whole process using a temperature-controlled sealed stirring equipment, and the temperature of the resulting mixture is stable at 32-40℃ and the viscosity is stable at 3000-5000mPa・s.

5. The low-temperature rapid curing construction process for epoxy resin flooring according to claim 4, characterized in that, The specific steps of gradient step-by-step mixing in step three are as follows: First, preheat the epoxy resin base material in a sealed mixing tank with constant temperature preheating function, and control the base material temperature to be stable at 30-35℃. Next, add the full amount of curing agent to the preheated base material, stir and mix while simultaneously turning on ultrasonic homogenization, and add the accelerator in two equal portions, stirring evenly after each addition; Finally, pigments, fillers, quartz sand, defoamers, leveling agents, and other flooring construction materials are added, and ultrasonic homogenization is simultaneously activated during mixing to obtain a mixture for subsequent paving construction.

6. The low-temperature rapid curing construction process for epoxy resin flooring according to claim 1, characterized in that, In step four, when the ambient temperature is 0-5℃, the active window control time is 2-12 hours after the surface dryness of the previous coating; when the ambient temperature is -5℃~0℃, the control time is 4-24 hours after the surface dryness of the previous coating. The intermediate coating is laid in at least two coats, and the thickness of each coat is controlled at 0.8-1.2mm. The overlap of the curing reaction of adjacent coatings is ≥60%.

7. The low-temperature rapid curing construction process for epoxy resin flooring according to claim 1, characterized in that, In step five, the sealed thermal insulation curing space is constructed with flame-retardant insulation cotton. The relative humidity in the curing space is stably controlled at 50-60% through a temperature and humidity linkage control device, which isolates external temperature and humidity fluctuations and cold air infiltration.

8. The low-temperature rapid curing construction process for epoxy resin flooring according to claim 7, characterized in that, The specific procedures for the stepped heating and phased curing in step five are as follows: S1. Low-temperature curing: Within 24 hours after construction, control the temperature of the curing space to be stable at 5-8℃ to ensure that the floor reaches the strength required for walking. S2. Temperature curing: On the 2nd-3rd day after construction, the temperature is increased by 3-5℃ to 15-20℃ daily at a uniform rate to promote the cross-linking reaction and release the internal stress of the coating. S3. Constant temperature curing: After construction, control the temperature of the curing space to be stable at 18-22℃ for 4-7 days to complete the curing of the floor.

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