Multi-gap resistive plate chamber detector and method of manufacturing the same

Abstract

The application provides a multi-gas-gap resistive plate chamber detector and a preparation method thereof. The detector comprises a multi-gas-gap chamber, an electrode layer and a fixing structure. The multi-gas-gap chamber comprises resistive glass plates and spacing layers which are alternately stacked, and the spacing layers comprise a plurality of spacing structures which are arranged at intervals. The electrode layer is arranged on opposite sides of the multi-gas-gap chamber. The fixing structure is arranged on the side of the electrode layer away from the multi-gas-gap chamber. The electrode layer is provided with a hollow region corresponding to the spacing structure, so as to reduce the electric field strength around the spacing structure.

Description

Technical Field

[0001] This application relates to the field of particle detector technology, specifically to a multi-gap resistive plate detector and its fabrication method. Background Technology

[0002] Multi-gap resistive plate chamber (MRPC) detectors are particle detectors that operate based on the principle of gas avalanche discharge. They are widely used due to their excellent time resolution, high particle detection efficiency, and ease of fabricating large-area sensitive regions. However, MRPC detectors in this field still face certain technical bottlenecks. Summary of the Invention

[0003] In view of the above problems, this application provides a multi-gap resistive plate detector and its preparation method.

[0004] According to a first aspect of the embodiments of this application, a multi-gap resistive plate chamber detector is provided. The detector includes a multi-gap chamber, an electrode layer, and a fixing structure. The multi-gap chamber includes alternately stacked resistive glass plates and spacer layers, the spacer layers including a plurality of spacer structures arranged at intervals. The electrode layer is disposed on opposite sides of the multi-gap chamber. The fixing structure is disposed on the side of the electrode layer opposite to the multi-gap chamber. The electrode layer has hollowed-out areas corresponding to the spacer structures to reduce the electric field strength around the spacer structures.

[0005] According to an embodiment of this application, the projected area of ​​the hollowed-out region on the resistive glass plate is greater than or equal to the projected area of ​​the spacer structure corresponding to the hollowed-out region on the resistive glass plate.

[0006] According to an embodiment of this application, when the projected shape of the spacer structure and the hollow area is circular, the difference between the diameter of the hollow area and the diameter of the spacer structure corresponding to the hollow area is 0.5mm to 10mm.

[0007] According to embodiments of this application, the diameter of the spacer structure is 0.5 mm to 10 mm; and / or the thickness of the spacer structure is 0.1 mm to 2 mm.

[0008] According to an embodiment of this application, the interval between adjacent spacer structures on a preset plane is 1cm to 5cm, and the preset plane is the plane where any resistive glass plate in the multi-gap cavity is located.

[0009] According to a second aspect of the embodiments of this application, a method for fabricating a multi-gap resistive plate chamber detector is provided. The method includes: forming an electrode layer with a hollowed-out area on a resistive glass plate according to a preset pattern to form a resistive glass plate with a pre-fixed electrode layer, the preset pattern corresponding to the spacing structure of a multi-gap chamber; positioning the spacing structure on the resistive glass plate according to the preset pattern to form a resistive glass plate with a pre-fixed spacing structure; and obtaining a multi-gap resistive plate chamber detector based on the resistive glass plate with the pre-fixed electrode layer, the resistive glass plate with the pre-fixed spacing structure, and the fixing structure.

[0010] According to an embodiment of this application, an electrode layer with a hollowed-out area is formed on a resistive glass plate according to a preset pattern to form a resistive glass plate with a pre-fixed electrode layer, including: setting a patterned masking film corresponding to the preset pattern on two resistive glass plates; spraying electrode material on two resistive glass plates to form an electrode layer; and removing the masking film to form two resistive glass plates with pre-fixed electrode layers.

[0011] According to an embodiment of this application, a patterned masking film corresponding to a preset pattern is set on two resistive glass plates, including: placing the two resistive glass plates on a positioning drawing, the positioning drawing including markers determined based on the position of the spacer structure in the preset pattern; and setting the masking film based on the markers.

[0012] According to an embodiment of this application, a resistive glass plate with a pre-fixed spacing structure includes multiple resistive glass plates with a single-sided pre-fixed spacing structure and a resistive glass plate with a double-sided pre-fixed spacing structure; wherein, positioning the spacing structure on the resistive glass plate according to a preset pattern to form a resistive glass plate with a pre-fixed spacing structure includes: positioning the spacing structure on the upper surface of the multiple resistive glass plates according to a preset pattern to form multiple resistive glass plates with a single-sided pre-fixed spacing structure; and positioning the spacing structure on the lower surface of any resistive glass plate with a single-sided pre-fixed spacing structure according to a preset pattern to form a resistive glass plate with a double-sided pre-fixed spacing structure.

[0013] According to an embodiment of this application, a multi-gap resistive plate chamber detector is obtained based on a resistive glass plate with a pre-fixed electrode layer, a resistive glass plate with a pre-fixed spacing structure, and a fixing structure. The method includes: placing multiple resistive glass plates with single-sided pre-fixed spacing structures on a resistive glass plate with double-sided pre-fixed spacing structures to form a multi-gap chamber with alternating stacked resistive glass plates and spacing structures; placing resistive glass plates with pre-fixed electrode layers on opposite sides of the multi-gap chamber; and placing the fixing structure on opposite sides of the resistive glass plates with pre-fixed electrode layers to obtain the multi-gap resistive plate chamber detector.

[0014] According to the embodiments of this application, the multi-gap resistive plate detector has a hollowed-out area on the electrode layer corresponding to the spacer structure in the multi-gap chamber. This can reduce the electric field strength around the spacer structure, thereby reducing the risk of local aging in the multi-gap chamber, improving the service life of the detector, and reducing the interference of electric field distortion generated around the spacer structure on the working gas, further improving the stability of the detector operation. Attached Figure Description

[0015] The above-mentioned contents, other objects, features and advantages of this application will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0016] Figure 1 A schematic diagram of the structure of a multi-gap resistive plate chamber detector according to an embodiment of this application is shown.

[0017] Figure 2 This schematically illustrates a structural diagram of the electrode layer of a multi-gap resistive plate chamber detector according to an embodiment of this application;

[0018] Figure 3 A schematic cross-sectional view of a multi-gap chamber according to an embodiment of this application is shown.

[0019] Figure 4 A flowchart illustrating a method for fabricating a multi-gap resistive plate chamber detector according to an embodiment of this application is shown schematically.

[0020] Figure 5 A schematic diagram illustrating the positioning drawings in the preparation method according to an embodiment of this application is shown.

[0021] Figure 6 A schematic diagram illustrating a simulation structure of a single air gap structure according to an embodiment of this application is shown.

[0022] Figure 7 A schematic cross-sectional view of the field strength simulation results of a single air gap structure according to an embodiment of this application is shown.

[0023] The attached figures are labeled as follows:

[0024] Multi-gap chamber 1;

[0025] Electrode layer 2;

[0026] Resistive glass plate 11;

[0027] Spacing structure 12;

[0028] Hollowed-out area 21;

[0029] Insulating film 31;

[0030] Printed circuit board 32;

[0031] Honeycomb panel 33;

[0032] Signal readout bar 321;

[0033] Nylon nails 34;

[0034] Fix the steel needle 35. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0036] The endpoints and any values ​​of the ranges disclosed in this application are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this application.

[0037] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0038] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0039] In the description of this application, it should be understood that the terms "longitudinal", "length", "circumferential", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the subsystem or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0040] Similarly, to simplify this application and aid in understanding one or more of the various disclosed aspects, in the above description of exemplary embodiments of this application, various features of this application are sometimes grouped together into a single embodiment, figure, or description thereof. The use of terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicates that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] Multi-gap resistive plate chamber (MRPC) detectors are particle detectors that operate based on the principle of gas avalanche discharge. MRPC detectors are widely used due to their excellent time resolution, high particle detection efficiency, and ease of fabrication of large-area sensitive regions.

[0042] The working principle of MRPC is as follows: Under the conditions of filling with a suitable working gas and applying a high-voltage electric field, charged particles passing through the air gap induce primary ionization in the working gas, which is then amplified through an avalanche process. This amplified signal is then induced on the outer signal readout bar, allowing the electronic system to acquire the signal. Because the MRPC has a narrow single-layer air gap and a high working electric field strength, the signal time dispersion caused by different primary ionization positions is small, and the signal rise edge is relatively steep, giving the MRPC good time measurement accuracy. Furthermore, due to the high resistivity of the resistive glass plates, the induced electric field of the avalanche signal can penetrate each layer of resistive glass plates, allowing the signal readout bars on both the top and bottom sides to acquire signal contributions from each air gap, thus achieving high detection efficiency for the MRPC.

[0043] Although MRPC detectors possess excellent time resolution and high detection efficiency, the increasing brightness of particle accelerators and the advancing requirements of related physics experiments have placed more stringent demands on their long-term stable operation under conditions of strong radiation and high count rates. For example, the compressed baryonic matter experiment at the Antiproton and Ion Research Facility (APIF) at the German Heavy Ion Research Center (DRI) currently under construction requires the MRPC detector used in its time-of-flight detection system to operate continuously for more than ten years under particle flux conditions ranging from 1 kHz / cm² to 25 kHz / cm². The strong electric field within the multi-gap chamber poses a significant challenge to the long-term anti-aging capabilities of the MRPC detector.

[0044] To address the aforementioned issues, related technologies replace the spacer structures within multi-gap chambers, such as continuous nylon fishing lines, with discontinuous insulating pads. This reduces obstruction to gas exchange and alleviates the aging problem caused by the deposition of surrounding gas ionization in the spacer structures under strong irradiation.

[0045] MRPC detectors generate a strong electric field within a multi-gauge cavity through electrode layers on opposite sides. However, MRPCs using insulating gaskets still suffer from aging issues. At the edge region where the insulating gasket contacts the resistive glass plate, gas exchange is still insufficient to achieve the same level of sufficiency as in a completely open space. Studies have shown that when a voltage is applied to the electrode layers, a uniform and stable electric field is generated within each air gap in the detector. However, due to the difference in dielectric constant between the insulating gasket and the working gas, local electric field distortion exists at the edge region of the insulating gasket. Under sustained strong electric field and strong irradiation, the working gas in this edge region still undergoes a certain degree of ionization, resulting in deposits on the electrode layers. This leads to an increase in dark current and local noise in the MRPC detector.

[0046] In view of this, embodiments of this application provide a multi-gap resistive plate detector and its fabrication method. By setting hollow areas on the electrode layer, the aging and noise problems caused by insufficient working gas exchange and electric field distortion around the gap structure are reduced, further improving the stability of the detector in high particle flux environments and extending the detector's lifespan. Meanwhile, this fabrication method is simple and feasible, and compatible with existing fabrication processes.

[0047] Figure 1 A schematic diagram of the structure of a multi-gap resistive plate chamber detector according to an embodiment of this application is shown. Figure 2 This diagram schematically illustrates the structure of the electrode layers in a multi-gap resistive plate chamber detector according to an embodiment of this application. It should be noted that in this embodiment, the electrode layers disposed on opposite sides of the detector have the same structure. Figure 2 The structure of only one side of the electrode layer is shown as an example; the other side of the electrode layer is not described in detail. For clarity, Figure 2 The shape, number, and arrangement of the hollowed-out areas are for illustrative purposes only and are not specifically limited in this application.

[0048] like Figure 1 As shown, the multi-gap resistive plate detector of this embodiment may include a multi-gap chamber 1, an electrode layer 2, and a fixing structure.

[0049] The multi-gap chamber 1 may include alternating stacked resistive glass plates 11 and spacer layers. The resistive glass plates 11, due to their high resistivity, allow the induced electric field of the avalanche signal to penetrate each layer of resistive glass plates 11, and prevent damage to the detector from large-area continuous discharge. The thickness of the resistive glass plates 11 may range from 0.2 mm to 2 mm, for example, 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, 1 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, 2.0 mm, etc. The spacer layers may include multiple spacer structures 12 arranged at intervals. The spacer structures 12 between each spacer layer may correspond one-to-one. The spacer structures 12 may include insulating pads or nylon fishing lines, etc., wherein the insulating pads may be insulating film materials such as polyetheretherketone, polyethylene terephthalate, polyimide, and ceramics, or film materials composited from these substrates and adhesive solid adhesives. The shape, number, and arrangement of the spacer structures 12 in each spacer layer can be set according to specific application requirements, and this application does not impose specific limitations.

[0050] like Figure 1 and Figure 2 As shown, electrode layers 2 can be disposed on opposite sides of the multi-gap chamber 1, including an upper electrode layer and a lower electrode layer. By applying a high voltage to the upper and lower electrode layers, a stable and uniform high-voltage electric field can be formed in the multi-gap chamber 1, providing conditions for the gas avalanche process. Hollowed-out regions 21 corresponding to the spacer structure 12 can be formed on the electrode layers 2 (upper and lower electrode layers) to reduce the electric field strength around the spacer structure 12. Electrode layers 2 may include conductive graphite, etc.

[0051] In the example, by hollowing out the corresponding spacer structure positions in the electrode layer, the electric field intensity in the area surrounding the spacer structure can be reduced to a negligible level. This reduces the ionization and aging effect of the working gas caused by the strong electric field around the spacer structure, improving the detector's operational stability under strong radiation environments. Simultaneously, the electric field distortion caused by the difference in dielectric constant between the spacer structure edge and the working gas is effectively suppressed, further reducing the detector's aging effect and noise count rate.

[0052] In addition, the detector in this embodiment retains the spacer structure in the multi-gap cavity and geometrically reconstructs the electric field by designing a hollow area. This avoids the interference of the spacer structure on the electric field within the working area covered by the electric field, and realizes the separation of the working area and the spacer structure in the electric field space.

[0053] Although the electrode layers on opposite sides of the multi-gap chamber are referred to here as the "upper" electrode layer and the "lower" electrode layer, "upper" and "lower" are only relative terms. For example, in Figure 1In the flipped state shown, the "upper" electrode layer is located at the bottom, and the "lower" electrode layer is located at the top. Here, "upper" and "lower" are defined relative to the plane on which the detector is mounted; a position closer to this plane can be "lower," and a position farther from this plane can be "upper." Similarly, "upper" and "lower" also apply to other structures appearing later in the text. This definition will become clearer when considered in conjunction with the manufacturing process described below.

[0054] In some embodiments, the surface resistivity of the electrode layer 2 can be from 1 megohm per square to 50 megohm per square, such as 1 megohm per square, 5 megohm per square, 10 megohm per square, 15 megohm per square, 20 megohm per square, 25 megohm per square, 30 megohm per square, 35 megohm per square, 40 megohm per square, 45 megohm per square, 50 megohm per square, etc., where megohm per square represents the unit of surface resistivity.

[0055] Continue to refer to Figure 1 The fixing structure can be disposed on the side of electrode layer 2 away from multi-gap chamber 1, that is, on the side of upper electrode layer and lower electrode layer away from multi-gap chamber 1 respectively. The fixing structure may include an insulating film 31, a printed circuit board 32, and a honeycomb plate 33. Specifically, the fixing structure may include an upper insulating film, an upper printed circuit board, and an upper honeycomb plate sequentially disposed on the upper electrode layer, and a lower insulating film, a lower printed circuit board, and a lower honeycomb plate sequentially disposed on the lower electrode layer. The honeycomb plate 33 can provide support and fixing functions for the detector. The printed circuit board 32 is located on the inner side of the upper and lower honeycomb plates, and the printed circuit board 32 includes a plurality of signal readout strips 321 arranged at a certain interval. The signal readout strips 321 can be used for signal pickup. The insulating film 31 can be disposed between electrode layer 2 and printed circuit board 32 to achieve electrical isolation. The insulating film 31 can be a Kapton insulating film or a Mylar insulating film, and the thickness of the insulating film 31 can be 50μm to 1mm, such as 50μm, 0.1mm, 0.2mm, 0.4mm, 0.6mm, 0.8mm, 1mm, etc.

[0056] According to an embodiment of this application, the detector has a hollowed-out area on the electrode layer that corresponds to the spacer structure in the multi-gap chamber. This can reduce the electric field strength around the spacer structure, thereby reducing the risk of local aging in the multi-gap chamber, improving the service life of the detector, and reducing the interference of electric field distortion around the spacer structure on the working gas, further improving the stability of the detector operation.

[0057] Continue to refer to Figure 1 The fixing structure in this embodiment may also include nylon nails 34 and fixing steel pins 35, which are used to fix the various structures of the detector to maintain the stability of the multi-gap chamber 1.

[0058] In some embodiments, the projected area of ​​the hollowed-out region on the resistive glass plate can be greater than or equal to the projected area of ​​the spacer structure corresponding to the hollowed-out region on the resistive glass plate, that is, the size of the hollowed-out region can be greater than or equal to the size of the spacer structure on the plane of the resistive glass plate.

[0059] In some embodiments, the projected shape of the spacer structure and the hollow area can be circular, and the difference between the diameter of the hollow area and the diameter of the spacer structure corresponding to the hollow area can be 0.5mm to 10mm, such as 0.5mm, 1mm, 2mm, 4mm, 6mm, 8mm, 10mm, etc.

[0060] According to an embodiment of this application, the design of using a hollow area slightly larger than the size of the spacer structure can effectively accommodate the small assembly tolerances caused by the stacking of multiple resistive glass plates and reduce the interference of stray electric fields at the edges on the detector.

[0061] Figure 3 A schematic cross-sectional view of a multi-gap chamber according to an embodiment of this application is shown. It should be noted that... Figure 3 The cross-section of the multi-gap chamber in the example is parallel to the plane containing the resistive glass plate. Figure 3 The number and arrangement of the intermediate partitions are for illustrative purposes only and are not specifically limited in this application.

[0062] like Figure 3 As shown, when the projection shape of the spacer structure 12 on the resistive glass plate 11 is circular, the diameter D of the spacer structure 12 can be 0.5mm to 10mm, for example, 0.5mm, 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 9.0mm, 10mm, etc. In some embodiments, on a preset plane, the interval S between adjacent spacer structures 12 can be 1cm to 5cm, for example, 1cm, 2cm, 3cm, 4cm, 5cm, etc. The preset plane can be the plane where any resistive glass plate in the multi-gap cavity is located.

[0063] Combination Figure 1 and Figure 3 The thickness H of the spacer structure 12 can be 0.1mm to 2mm, for example, 0.1mm, 0.25mm, 0.5mm, 0.75mm, 1mm, 1.25mm, 1.5mm, 1.75mm, 2mm, etc. The thickness H of the spacer structure 12 is the spacing distance between each layer of resistive glass plate 11, that is, the spacing distance between each layer of air gap in the multi-air gap chamber 1 of the detector.

[0064] Figure 4 A flowchart illustrating a method for fabricating a multi-gap resistive plate chamber detector according to an embodiment of this application is shown.

[0065] like Figure 4 As shown, the preparation method of this embodiment may include operations S410 to S430.

[0066] In operation S410, an electrode layer with a hollowed-out area is formed on a resistive glass plate according to a preset pattern to form a resistive glass plate with a pre-fixed electrode layer.

[0067] The preset pattern can correspond to the spacer structure in the multi-gap chamber.

[0068] In operation S420, a pre-defined pattern is positioned on a resistive glass plate to form a resistive glass plate with a pre-fixed interval structure.

[0069] In operation S430, a multi-gap resistive plate chamber detector is obtained based on a resistive glass plate with a pre-fixed electrode layer, a resistive glass plate with a pre-fixed spacing structure, and a fixing structure.

[0070] According to the embodiments of this application, the above preparation method is simple, easily compatible with existing MRPC preparation processes, and has good engineering feasibility.

[0071] To better understand the fabrication method of the multi-gap resistive plate detector of this application, the fabrication method of this application will be described below with reference to specific embodiments.

[0072] According to an embodiment of this application, in operation S410, a resistive glass plate with a pre-fixed electrode layer can be formed.

[0073] For example, patterned masking films corresponding to a preset pattern are applied to two resistive glass plates. In some embodiments, a laser cutting machine can be used to cut multiple masking films with smooth edges from a single-sided adhesive substrate material. The single-sided adhesive substrate material can be a single-sided adhesive tape with weak adhesion to the resistive glass plates, so that no adhesive residue is left when removing the masking film. The shape of the masking film can correspond to the shape of the spacer structure, such as a circle. The diameter of the masking film can be 1mm to 20mm, for example, 2.5mm.

[0074] In some embodiments, positioning drawings of the same size as the resistive glass plate of this application can be produced by laser cutting or printing.

[0075] Figure 5 The diagram illustrates a positioning drawing in the preparation method according to an embodiment of this application. Figure 5 The following explanation uses a resistive glass plate with dimensions of 353mm × 276mm as an example.

[0076] like Figure 5As shown, the positioning drawing has multiple annotation points L determined based on the positions of the interval structures in a preset pattern. The spacing S between the centers of the interval structures can be 19 mm. Each row along the long side A1 of the positioning drawing can include 19 annotation points L, and each column along the short side B1 of the positioning drawing can include 15 annotation points L. The dimensions of the interval structures can be marked on the positioning drawing, and a crosshair can be marked at their center. For example, Figure 5 The positioning drawing shown uses a circle with a diameter of 2mm as a marker L at the center of the spacer structure to mark the position of the spacer structure with a diameter of 2mm.

[0077] Place the resistive glass plate on the positioning drawing and align it with the drawing. Based on the positioning drawing, apply multiple masking films to the exposed markings on the resistive glass plate. In some embodiments, the resistive glass plate can be cleaned with a clean cloth dampened with anhydrous ethanol, and then placed on the positioning drawing. Completely cover the 2mm diameter markings representing the spacing structure with a 6mm diameter circular masking film to ensure that this area is not covered by the electrode material when it is sprayed. After applying the masking film, the surface of the resistive glass plate can be blown clean with a high-pressure air gun to check if the masking film is firmly attached. If any has come loose, it needs to be reattached.

[0078] Electrode material can be sprayed onto a resistive glass plate to form an electrode layer. In some embodiments, the areas of the resistive glass plate not covered by the masking film can be cleaned and dried using a clean cloth dampened with anhydrous ethanol. The gaps between the masking films and the edges of the resistive glass plate need to be carefully wiped to ensure no residue remains. An air gun is connected to a container containing a suspension of electrode material to evenly spray the electrode material onto the resistive glass plate. After the electrode material has dried and cured, the masking film can be removed, resulting in a resistive glass plate with a pre-fixed electrode layer, such as... Figure 2 As shown.

[0079] In some embodiments, the concentration of the electrode material ejected by the air gun can be controlled to remain stable. Additionally, the air gun can be controlled to move at a uniform speed above the surface of the resistive glass plate at a distance of 5 cm to 10 cm, ensuring that the electrode material adheres evenly to the resistive glass plate. An electrode layer is formed on another resistive glass plate using the same method described above, which will not be elaborated further here.

[0080] In some embodiments, after spraying, the two resistive glass plates with pre-fixed electrode layers are left to stand in a constant temperature and humidity room for 24 hours to ensure that the electrode material is dry and cured on the resistive glass plates. Then, the masking film is peeled off one by one by holding the edge of the masking film with tweezers. After removing all the masking films, two resistive glass plates with pre-fixed electrode layers can be obtained.

[0081] In some embodiments, a high-pressure air gun can be used to clean the resistive glass plate with the pre-fixed electrode layer and check for any electrode layer detachment. Subsequently, the surface resistivity of the electrode layer can be measured to ensure it meets the required standard. For example, nine test points (three rows and three columns) can be selected on the electrode layer for individual measurement, with the surface resistivity controlled between 1 megohm per square meter and 50 megohms per square meter. Additionally, the edges of the cut-out areas can be checked for clarity, and no electrode material residue should remain within the cut-out areas.

[0082] According to an embodiment of this application, in operation S420, a resistive glass plate with a pre-fixed interval structure can be formed. The resistive glass plate with the pre-fixed interval structure includes multiple resistive glass plates with a single-sided pre-fixed interval structure and a resistive glass plate with a double-sided pre-fixed interval structure.

[0083] Place the resistive glass plate on the aforementioned positioning drawing and align it with it. Based on the positioning drawing, multiple spacer structures can be positioned on the resistive glass plate. In some embodiments, the resistive glass plate can be cleaned with a clean cloth dampened with anhydrous ethanol, and the cleaned resistive glass plate can be placed on the positioning drawing. Spacer structures with a diameter of 2mm can be aligned with the markings on the positioning drawing and pasted onto the resistive glass plate. After pasting, the surface of the resistive glass plate can be cleaned with an air gun to check whether the spacer structures are secure. If any spacer structures fall off, they need to be re-pasted. In this way, multiple resistive glass plates with single-sided pre-fixed spacer structures can be obtained.

[0084] Flip over any resistive glass plate with a single-sided pre-fixed spacer structure. Based on the position of the pre-positioned spacer structure, attach a 2mm diameter spacer structure to the other side of the resistive glass plate. This yields a resistive glass plate with a double-sided pre-fixed spacer structure. The thickness of the spacer structure can be 0.25mm.

[0085] According to an embodiment of this application, in operation S430, a multi-gap resistive plate chamber detector can be obtained based on a resistive glass plate with a pre-fixed electrode layer, a resistive glass plate with a pre-fixed spacing structure, and a fixing structure.

[0086] The various structural components of the detector in this embodiment can be cleaned using a clean cloth dampened with anhydrous ethanol. These components include the honeycomb panel, printed circuit board, insulating film, resistive glass plate with pre-fixed electrode layer, resistive glass plate with pre-fixed interval structure, double-sided tape, fixing pins, positioning blocks, and other auxiliary materials to remove surface dust and oil. The components can then be allowed to air dry naturally before use. This embodiment can be illustrated by an MRPC detector with a multi-air-gap chamber containing five air-gap layers. Specifically, there are two honeycomb panels, two printed circuit boards, two insulating films, two resistive glass plates with pre-fixed electrode layer, three resistive glass plates with a single-sided pre-fixed interval structure, and one resistive glass plate with a double-sided pre-fixed interval structure.

[0087] In some embodiments, the lower honeycomb panel with double-sided adhesive can be adhered to the outer surface of the lower printed circuit board (i.e., the side facing away from the multi-air gap chamber). The lower printed circuit board has circuit traces such as high-voltage power supply contacts and signal readout strips. After adhesion, a nylon screw is installed at each of the four corners of the lower printed circuit board, with the nut located on the outer surface side of the lower printed circuit board and the stud passing through the lower printed circuit board towards the inner surface. The lower insulating film can be pre-windowed and cut, and the cut lower insulating film is laid flat on the inner surface of the lower printed circuit board. Pre-windowing can be used to expose the high-voltage power supply contacts. Subsequently, glass positioning blocks are installed on the two diagonally opposite studs to provide horizontal positioning constraints for the resistive glass plate during subsequent assembly. A strip of double-sided carbon film tape is flatly adhered to the exposed high-voltage power supply contacts to achieve voltage connection with the resistive glass plate.

[0088] In some embodiments, a resistive glass plate with a pre-fixed electrode layer can be placed on the lower insulating film. One side of the pre-fixed electrode layer can face the lower insulating film, so that the electrode layer is in close contact with the surface of the lower insulating film, while ensuring that the electrode layer at the edge of the resistive glass plate makes reliable contact with the high-voltage feed contacts on the lower printed circuit board through carbon film tape.

[0089] A resistive glass plate with a double-sided pre-fixed spacer structure can be gently placed on a resistive glass plate with a pre-fixed electrode layer, and horizontal alignment can be achieved using positioning blocks at the four corners of the lower printed circuit board, so that the spacer structure falls into the hollow area on the electrode layer, thereby forming the first air gap of the multi-air gap chamber. At this time, the spacer structure on the other side of the resistive glass plate with the double-sided pre-fixed spacer structure constitutes the spacer layer of the second air gap.

[0090] Three resistive glass plates with single-sided pre-fixed spacers can be stacked sequentially on a resistive glass plate with double-sided pre-fixed spacers. Each resistive glass plate with a single-sided pre-fixed spacer has its pre-fixed spacer side facing upwards, and they are horizontally aligned layer by layer using positioning blocks to ensure that the spacers are vertically aligned. This sequentially forms the second to fourth air gaps of the multi-gap chamber.

[0091] Next, another resistive glass plate with a pre-fixed electrode layer is placed on the top resistive glass plate with a single-sided pre-fixed spacing structure. One side of the pre-fixed electrode layer faces away from the resistive glass plate with the single-sided pre-fixed spacing structure. Using the same operation as above, horizontal alignment is achieved through positioning blocks, so that the hollowed-out areas of the upper electrode layer correspond one-to-one with the spacing structures of the lower layers in the vertical direction, thereby forming the fifth air gap layer of the multi-air gap chamber. In this way, a multi-air gap chamber with five air gap layers can be formed. The spacing between each air gap layer can be 0.25 mm.

[0092] In some embodiments, the same operation as described above can be used to attach the upper honeycomb panel with double-sided adhesive to the outer surface of the upper printed circuit board (i.e., the side facing away from the multi-air gap chamber). The cut upper insulating film is then laid flat on the inner surface of the upper printed circuit board. The cut upper insulating film has been pre-windowed at the corresponding positions of the high-voltage feed contacts to expose them. A strip of double-sided carbon film tape is then flatly adhered to the exposed high-voltage feed contacts to establish voltage connection with the resistive glass plate.

[0093] The entire structure is then flipped over, and one side of the upper insulating film is fastened to the resistive glass plate with the pre-fixed electrode layer, so that the carbon film tape makes voltage contact with the electrode layer. After fastening, a weight can be evenly placed above the detector and left to stand under pressure for 24 hours to ensure that the layers are tightly bonded.

[0094] In some embodiments, multiple fixing pins can be passed through pre-drilled solder pads on the upper and lower printed circuit boards, respectively, allowing the fixing pins to penetrate the entire upper and lower printed circuit boards of the detector. A soldering torch is used to weld and fix the fixing pins, ensuring the entire multi-air gap chamber remains stable through the mechanical constraint of the fixing pins. Then, signal output connectors, high-voltage lines, and grounding wires are soldered onto the upper and lower printed circuit boards, and all solder joints are coated with silicone for protection and insulation. This results in the following... Figure 1 The MRPC detector shown.

[0095] To further describe the technical effects of the MRPC detector in this application, the following will combine... Figures 6-7 The MRPC detector in the embodiments will be described. For ease of explanation, Figures 6-7The simulation results characterize the single air gap structure constructed between two resistive glass plates.

[0096] Figure 6 A schematic diagram of a simulation structure of a single air gap structure according to an embodiment of this application is shown.

[0097] like Figure 6 As shown, multiple spacer structures 12 arranged in a certain array are set between two resistive glass plates 11 to form a single air gap structure. The resistive glass plate 11 has dimensions of 200mm × 120mm and a thickness of 0.23mm. The spacing between the two resistive glass plates 11 is 0.25mm. The diameter of the spacer structure 12 is 2mm, and the center-to-center distance between adjacent spacer structures 12 is 20mm. The diameter of the hollow area 21 on the two resistive glass plates 11 is 6mm. The above single air gap structure can be analyzed using multiphysics simulation software. A voltage can be applied to the non-hollow area on the two resistive glass plates 11, and the voltage can be set to ±1300V.

[0098] Figure 7 A schematic cross-sectional view of the field strength simulation results for a single air gap structure according to an embodiment of this application is shown. It should be noted that... Figure 7 This is a partially enlarged view of a cross-sectional schematic diagram of the single air gap structure in this embodiment along the direction perpendicular to the resistive glass plate, representing the electric field in the region surrounding the spacer structure.

[0099] like Figure 7 As shown, when a voltage of ±1300V is applied to the non-perforated areas of the two resistive glass plates 11, the electric field strength of the spacer structure 12 and the perforated area 21 is lower than the electric field strength of the area between the spacer structures 12, and the electric field strength of the spacer structure 12 and the perforated area 21 can be close to 0.

[0100] According to the embodiments of this application, by setting a hollow area at the position corresponding to the spacer structure on the electrode layer, the electric field strength around the spacer structure is reduced to a negligible level, thereby achieving a state in which the spacer structure does not interfere with the working electric field in the air gap region covered by the electric field. This effectively reduces aging and noise problems caused by insufficient gas exchange and uneven electric field around the spacer structure, further improving the stability of the detector in a high particle flux environment and extending the detector life.

[0101] Those skilled in the art will understand that the features described in the various embodiments of this application can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in this application. In particular, the features described in the various embodiments of this application can be combined and / or combined in various ways without departing from the spirit and teachings of this application. All such combinations and / or combinations fall within the scope of this application.

[0102] The embodiments of this application have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this application. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Without departing from the scope of this application, those skilled in the art can make various substitutions and modifications, all of which should fall within the scope of this application.

Claims

1. A multi-gap resistive plate chamber detector, characterized in that, include: A multi-gap chamber comprising alternating stacked resistive glass plates and spacer layers, the spacer layers comprising multiple spacer structures spaced apart from each other; Electrode layers disposed on opposite sides of the multi-gap chamber; and A fixed structure is provided on the side of the electrode layer opposite to the multi-gap chamber; The electrode layer has a hollowed-out area corresponding to the spacer structure to reduce the electric field strength around the spacer structure.

2. The multi-gauge resistive plate chamber detector according to claim 1, characterized in that, The projected area of ​​the hollowed-out region on the resistive glass plate is greater than or equal to the projected area of ​​the spacer structure corresponding to the hollowed-out region on the resistive glass plate.

3. The multi-gaps resistive plate chamber detector according to claim 2, characterized in that, When the projected shape of the spacer structure and the hollowed-out area is circular, the difference between the diameter of the hollowed-out area and the diameter of the spacer structure corresponding to the hollowed-out area is 0.5mm to 10mm.

4. The multi-gaps resistive plate chamber detector according to claim 3, characterized in that, The diameter of the spacer structure is 0.5mm to 10mm; and / or, The thickness of the spacer structure is 0.1mm to 2mm.

5. The multi-gauge resistive plate chamber detector according to any one of claims 1 to 4, characterized in that, The spacing between adjacent spacers on the preset plane is 1cm to 5cm, and the preset plane is the plane where any resistive glass plate in the multi-gap cavity is located.

6. A method for fabricating a multi-gaps resistive plate chamber detector, characterized in that, include: An electrode layer with a hollowed-out area is formed on a resistive glass plate according to a preset pattern to form a resistive glass plate with a pre-fixed electrode layer. The preset pattern corresponds to the spacer structure of the multi-gap chamber. The spacer structure is positioned on a resistive glass plate according to the preset pattern to form a resistive glass plate with a pre-fixed spacer structure. Based on the resistive glass plate with pre-fixed electrode layer, the resistive glass plate with pre-fixed spacing structure, and the fixing structure, a multi-gap resistive plate chamber detector is obtained.

7. The preparation method according to claim 6, characterized in that, The process of forming an electrode layer with a hollowed-out area on a resistive glass plate according to a preset pattern to form a resistive glass plate with a pre-fixed electrode layer includes: A patterned masking film corresponding to the preset pattern is set on two resistive glass plates; Electrode material is sprayed onto the two resistive glass plates to form the electrode layer; Remove the masking film to form two resistive glass plates with pre-fixed electrode layers.

8. The preparation method according to claim 7, characterized in that, The step of setting a patterned masking film corresponding to the preset pattern on the two resistive glass plates includes: The two resistive glass plates are placed on a positioning drawing, which includes markings determined based on the position of the interval structure in the preset pattern. The masking film is set based on the marked points.

9. The preparation method according to any one of claims 6 to 8, characterized in that, The resistive glass plate with a pre-fixed interval structure includes multiple resistive glass plates with a single-sided pre-fixed interval structure and one resistive glass plate with a double-sided pre-fixed interval structure. The step of positioning the spacing structure on the resistive glass plate according to the preset pattern to form a resistive glass plate with a pre-fixed spacing structure includes: The spacing structure is positioned on the upper surface of multiple resistive glass plates according to the preset pattern to form multiple resistive glass plates with a single-sided pre-fixed spacing structure. The spacer structure is positioned on the lower surface of any of the resistive glass plates with a single-sided pre-fixed spacer structure according to the preset pattern to form the resistive glass plate with a double-sided pre-fixed spacer structure.

10. The preparation method according to claim 9, characterized in that, The resistive glass plate with pre-fixed electrode layer, the resistive glass plate with pre-fixed spacing structure, and the fixing structure form a multi-gap resistive plate chamber detector, comprising: Multiple resistive glass plates with single-sided pre-fixed interval structures are disposed on the resistive glass plate with double-sided pre-fixed interval structures to form a multi-gap chamber with the resistive glass plates and the interval structures stacked alternately. The resistive glass plate with a pre-fixed electrode layer is disposed on opposite sides of the multi-gap chamber; The fixing structure is set on opposite sides of the resistive glass plate with pre-fixed electrode layer to obtain the multi-gap resistive plate chamber detector.

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