Printed circuit board heat exchanger dynamic pinch point temperature difference determination and output control method and device, computer equipment and computer readable storage medium

Abstract

The application provides a printed circuit board heat exchanger dynamic pinch point temperature difference determination and output control method, device, computer equipment and computer readable storage medium. The method comprises the following steps: obtaining initial parameters of a heat exchanger, wherein the initial parameters comprise metal material and structure parameters, initial steady-state operation parameters and dynamic variable load conditions; performing flow heat transfer data processing on the initial parameters to obtain real-time temperature distribution along a cold side channel and a hot side channel of the heat exchanger in a dynamic process; determining the real-time temperature difference along the cold side channel and the hot side channel according to the temperature distribution along the channels, identifying the minimum value of the temperature difference along the channels as a dynamic pinch point temperature difference; and judging the numerical value of the dynamic pinch point temperature difference and a preset pinch point temperature value, and regulating the dynamic variable load condition of the heat exchanger. The application can perform efficient and safe operation regulation and control on SCO2 circulation, and has important engineering application value.

Description

Technical Field

[0001] This application relates to the technical field of heat exchanger performance prediction, and in particular to a method, apparatus, computer device, and computer-readable storage medium for determining and controlling the dynamic pinch temperature difference of a printed circuit board heat exchanger. Background Technology

[0002] Supercritical carbon dioxide (SCO2) power cycle systems have advantages such as compact structure, low cost, and high efficiency, and are considered one of the most promising energy conversion systems in the emerging energy field. Printed circuit board heat exchangers (PCHEs) are currently recognized internationally as the most suitable type of efficient and compact heat exchanger for SCO2 cycles.

[0003] Domestic and international scholars have conducted extensive research on the flow and heat transfer characteristics and enhanced heat transfer mechanisms of SCO2 in PCHEs under steady-state conditions. This research has revealed the coupling mechanisms of buoyancy, thermal acceleration effects, channel structure, and turbulent heat transfer under strongly variable physical properties, and proposed various novel heat exchange channel structures (straight channels, zigzag, S-shaped, airfoil, etc.) to improve the thermal-hydraulic performance of PCHEs. However, research on PCHE performance under dynamic conditions, especially on the determination of dynamic pinch point temperatures, is still relatively scarce. Furthermore, strategies for controlling the pinch point temperature of heat exchangers during variable load operation require further development. Therefore, establishing accurate methods for determining the dynamic pinch point temperature difference and controlling the output of printed circuit board heat exchangers is of great significance for the research of their control strategies and can provide an important basis for the efficient and safe operation and control of future SCO2 cycles.

[0004] It should be noted that the above content is not necessarily prior art, nor is it intended to limit the scope of patent protection of this application. Summary of the Invention

[0005] This application provides a method, apparatus, computer device, and computer-readable storage medium for determining and controlling the dynamic pinch temperature difference of a printed circuit board heat exchanger, in order to solve or alleviate one or more of the technical problems mentioned above.

[0006] To achieve the above objectives, this application provides a method for determining and controlling the dynamic pinch temperature difference of a printed circuit board heat exchanger, the method comprising: Obtain the initial parameters of the heat exchanger, including metal material and structural parameters, initial steady-state operating parameters, and dynamic load conditions; The initial parameters are processed using flow heat transfer data to obtain the real-time temperature distribution along the cold and hot sides of the heat exchanger during the dynamic process. Based on the temperature distribution along the path, the real-time temperature difference between the cold side and the hot side channels is determined, and the minimum value of the temperature difference along the path is identified as the dynamic pinch temperature difference; The dynamic pinch temperature difference is compared with the preset pinch temperature value to determine the dynamic load conditions of the heat exchanger.

[0007] Optionally, the initial parameters of the heat exchanger are obtained, including: Obtain the metal material type and microchannel structure of the heat exchanger, and determine the hydraulic diameter, rib width, plate thickness and channel length of the microchannel structure; Obtain the initial steady-state operating parameters of the heat exchanger, and determine the flow rate, pressure, and inlet temperature of the cold side channel and the hot side channel, respectively; The dynamic variable load conditions of the heat exchanger are obtained to determine the inlet temperature change gradient and temperature change time of the cold side channel and the hot side channel.

[0008] Optionally, the initial parameters are subjected to flow heat transfer data processing, including: Based on the channel structure of the heat exchanger and the initial parameters, processing parameters are obtained, including the Nusselt number, friction factor, and convective heat transfer coefficient. A dynamic response flow heat transfer model for the heat exchanger is established, which includes the flow heat transfer control equations for the cold side channel, the flow heat transfer control equations for the hot side channel, and the wall heat transfer control equations. Based on the initial parameters and processing parameters, the real-time temperature distribution along the cold and hot sides of the heat exchanger during the dynamic process is obtained through a dynamic response flow heat transfer model.

[0009] Optionally, the flow heat transfer data processing of the initial parameters further includes: discretizing the heat exchanger into multiple sub-heat exchange units along the flow direction, and determining the temperature change of each sub-heat exchange unit through a dynamic response flow heat transfer model.

[0010] Optionally, identifying the minimum value of the temperature difference along the friction path as the dynamic pinch temperature difference includes: Obtain the temperature difference along the cold side and hot side of the heat exchanger at various times; Iterate through all the friction temperature differences and identify the friction temperature difference with the smallest value to determine the dynamic pinch temperature difference; Output the time and location of the dynamic pinch temperature difference.

[0011] Optionally, determining the magnitude of the dynamic pinch temperature difference and the preset pinch temperature value, and adjusting the dynamic load conditions of the heat exchanger, includes: Obtain the preset pinch point temperature value; Compare the dynamic pinch temperature difference value with the preset pinch temperature value; If the dynamic pinch temperature difference is not less than the preset pinch temperature, maintain the current dynamic load change condition. If the dynamic pinch temperature difference is less than the preset pinch temperature, the dynamic load change condition is adjusted.

[0012] Optionally, adjusting the dynamic load conditions includes: Reduce the inlet temperature change gradient and / or shorten the temperature change time of the cold side and hot side channels of the heat exchanger.

[0013] This application provides a dynamic pinch point temperature difference determination and output control device for a printed circuit board type heat exchanger, the device comprising: The acquisition module is used to acquire the initial parameters of the heat exchanger, including metal material and structural parameters, initial steady-state operating parameters, and dynamic load conditions. The processing module is used to process the initial parameters for flow heat transfer data to obtain the real-time temperature distribution along the cold side and hot side of the heat exchanger during the dynamic process. The calculation module is used to determine the real-time temperature difference between the cold side channel and the hot side channel based on the temperature distribution along the path, and to identify the minimum value of the temperature difference along the path as the dynamic pinch temperature difference; The control module is used to determine the magnitude of the dynamic pinch temperature difference and the preset pinch temperature value, and to control the dynamic load conditions of the heat exchanger.

[0014] This application also provides a computer device, including: At least one processor; and A memory that is communicatively connected to the at least one processor; Wherein: the memory stores instructions that can be executed by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform the method as described above.

[0015] This application also provides a computer-readable storage medium storing computer instructions that, when executed by a processor, implement the method described above.

[0016] The embodiments of this application employing the above-described technical solution may have the following advantages: (1) By establishing a one-dimensional PCHE dynamic response flow heat transfer control equation that includes cold side channel, hot side channel and wall, the heat exchanger is discretized into multiple sub-heat exchange units along the flow direction. This can accurately predict the temperature field distribution of the printed circuit board heat exchanger during dynamic operation under varying load, realize the real-time determination of dynamic pinch point temperature difference, accurately identify the minimum value of pinch point temperature difference and its occurrence time and spatial location, and provide a quantitative basis for evaluating the performance status of the heat exchanger during dynamic operation under varying load.

[0017] (2) By comparing the calculated dynamic pinch temperature difference with the preset pinch temperature value, the dynamic load conditions are adjusted according to the comparison results. When the dynamic pinch temperature difference is lower than the preset pinch temperature value, the load conditions can be adjusted in time to avoid the heat exchanger from losing heat exchange efficiency or failing due to the pinch temperature difference being too small, thus ensuring the efficient and safe operation of the SCO2 power cycle system under variable load conditions. Attached Figure Description

[0018] The accompanying drawings exemplify embodiments and form part of the specification, serving together with the textual description to explain exemplary implementations of the embodiments. The illustrated embodiments are for illustrative purposes only and do not limit the scope of the claims. Throughout the drawings, the same reference numerals refer to similar but not necessarily identical elements.

[0019] Figure 1 A flowchart illustrating a method according to Embodiment 1 of this application is shown schematically. Figure 2 Schematic illustration Figure 1 Flowchart of the sub-steps in step S100; Figure 3 A schematic diagram of a heat exchanger structure according to an embodiment of this application is shown. Figure 4 Schematic illustration Figure 1 Flowchart of the sub-steps in step S200; Figure 5 Schematic illustration Figure 1 Flowchart of the sub-steps in step S300; Figure 6 Schematic illustration Figure 1 Flowchart of the sub-steps in step S400; Figure 7 A block diagram of the device according to Embodiment 2 of this application is schematically shown; and Figure 8 A schematic diagram of the hardware architecture of a computer device according to Embodiment 3 of this application is shown. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0021] It should be noted that the descriptions involving "first," "second," etc., in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0022] It should be noted that, in any stage of this application involving the collection, storage, use, transmission, and processing of data, each stage strictly adheres to the laws, regulations, industry standards, and regulatory requirements of the data source, usage location, and relevant countries and regions to ensure the legality and compliance of data activities. In the collection stage, the purpose, method, and scope of collection are clearly communicated to the data subject in a prominent manner. Collection is conducted only after obtaining the data subject's legal authorization, ensuring that the collection process follows the "minimum necessary" principle and does not exceed the scope of data collection. In the storage stage, storage periods are limited, and data is promptly deleted or anonymized / encrypted after the storage purpose is achieved. In the usage stage, a strict data security protection mechanism is implemented, using field-level desensitization technology and processing the original data according to preset desensitization rules. For different types of data, multiple desensitization strategies, such as data generalization, data anonymization, and data encryption, are employed to effectively mitigate the risk of sensitive information leakage and ensure that all data used is securely processed and desensitized, comprehensively protecting the rights and interests of data subjects and data security. In the transmission and processing stages, the confidentiality and security of data are ensured during transmission and processing.

[0023] In the description of this application, it should be understood that the numerical labels before the steps do not indicate the order of the steps, but are only used to facilitate the description of this application and to distinguish each step, and therefore should not be construed as a limitation of this application.

[0024] The technical solutions of this application are described below through several embodiments. It should be understood that these embodiments can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0025] Example 1 Figure 1 A flowchart illustrating the dynamic pinch temperature difference determination and output control method for a printed circuit board heat exchanger according to Embodiment 1 of this application is shown.

[0026] like Figure 1 As shown, the dynamic pinch point temperature difference determination and output control method for the printed circuit board heat exchanger may include the following, wherein: Step S100 The initial parameters of the heat exchanger are obtained, including the metal material and structural parameters, the initial steady-state operating parameters, and the dynamic load conditions.

[0027] In this embodiment, by obtaining the initial parameters of the heat exchanger, the physical object of the simulation, the baseline state before the start of dynamic changes, and the applied dynamic disturbances or changes can be defined. All input information is collected, including but not limited to the physical properties of the heat exchanger, the initial working state, and the upcoming changes in operating conditions.

[0028] In optional embodiments, such as Figure 2 As shown, step S100 includes: Step S110: Obtain the metal material type and microchannel structure of the heat exchanger, and determine the hydraulic diameter, rib width, plate thickness and channel length of the microchannel structure.

[0029] In some embodiments, 316L stainless steel can be selected as the material for the heat exchanger.

[0030] In this embodiment, as Figure 3 The diagram illustrates the cross-sectional structure, key geometric parameters, and working principle of the microchannels in this embodiment of the heat exchanger. The microchannels are semi-circular straight channels. The relevant parameters for the microchannels of the heat exchanger are determined as follows: Hydraulic diameter D e The unit is meters (m). Rib width between two adjacent semi-circular cross-section straight channels R w The unit is meters (m). Plate thickness between adjacent cold-side and hot-side channels P t The unit is meters (m). Channel length L The unit is meters (m).

[0031] Among them, hydraulic diameter D e The calculation formula is: , D It is the diameter of the semi-circular cross-section.

[0032] Step S120: Obtain the initial steady-state operating parameters of the heat exchanger, and determine the flow rate, pressure, and inlet temperature of the cold side channel and the hot side channel respectively.

[0033] In this embodiment, as Figure 3 As shown, the arrows indicate that the hot-side fluid flows from left (z=0) to right (z= L The flow is from the right (z=) while the cold side fluid flows from the right (z=) L The flow moves to the left (z=0), forming countercurrent heat exchange.

[0034] The flow rate, pressure, and inlet temperature of the cold and hot side passages include the following parameters: Cold side flow rate of the heat exchanger cold side passage m c The unit is kg / s; Hot side flow rate of hot side channel m h The unit is kg / s; Cold side inlet pressure of the cold side channel P cin The unit is kPa; Cold side outlet pressure of the cold side channel P cout The unit is kPa; Hot side inlet pressure of hot side channel P hin The unit is kPa; Hot side outlet pressure of hot side channel P hout The unit is kPa; Cold side inlet temperature of the cold side channel T cin The unit is ℃; Cold side outlet temperature of the cold side channel T cout The unit is ℃; Hot side inlet temperature of hot side channel T hin The unit is ℃; Hot side outlet temperature of hot side channel T hout The unit is ℃.

[0035] Step S130: Obtain the dynamic variable load conditions of the heat exchanger to determine the inlet temperature change gradient and temperature change time of the cold side channel and the hot side channel.

[0036] In this embodiment, the inlet temperature gradients of the cold-side and hot-side channels are obtained based on the dynamic load conditions of the heat exchanger. T r The unit is K / s, and the time of temperature change. t heat The unit is s.

[0037] Step S200 The initial parameters are processed using flow heat transfer data to obtain the real-time temperature distribution along the cold and hot sides of the heat exchanger during the dynamic process.

[0038] In this embodiment, step S200 is the core step, the purpose of which is to obtain the real-time temperature distribution along the cold and hot sides of the heat exchanger during dynamic processes through mathematical model simulation. That is, a one-dimensional PCHE dynamic response flow heat transfer control equation is used to predict the behavior of the heat exchanger under dynamic conditions, especially the temperature distribution along its length, thereby simplifying a complex three-dimensional heat transfer problem into a one-dimensional model.

[0039] In optional embodiments, such as Figure 4 As shown, step S200 includes: Step S210: Based on the channel structure and initial parameters of the heat exchanger, obtain the processing parameters, including the Nusselt number, friction factor, and convective heat transfer coefficient.

[0040] In this embodiment, the Nusselt number, friction factor, and convective heat transfer coefficient are calculated based on the initial parameters and conditions of step S100.

[0041] Since the channel structure is a straight channel with a semi-circular cross-section, the Nusselt number and friction factor can be calculated using the Gnielinski formula.

[0042] Friction factor f The expression is:

[0043] Nusel number Nu The expression is:

[0044] in, Re The Reynolds number can be determined based on the flow rate. m The calculation yielded: ; Pr For Prandtl numbers:

[0045] convective heat transfer coefficient h The expression is:

[0046] in, μ Viscosity, unit: Pa s; A The cross-sectional area of ​​the semicircular channel is expressed in meters (m²). 2 ; cp Specific heat capacity, unit is J kg -1 ℃ -1 ; kThermal conductivity, in W / (m²) ℃).

[0047] Step S220: Establish a dynamic response flow heat transfer model for the heat exchanger. The model includes the flow heat transfer control equations for the cold side channel, the flow heat transfer control equations for the hot side channel, and the wall heat transfer control equations.

[0048] In one embodiment, step S200 further includes: Step 230: Discretize the heat exchanger into multiple sub-heat exchange units along the flow direction, and determine the temperature change of each sub-heat exchange unit through a dynamic response flow heat transfer model.

[0049] In this embodiment, in order to better capture the variable properties of SCO2, such as Figure 3 As shown, the heat exchanger is discretized into N sub-heat exchange units, where N is an integer greater than 0.

[0050] Specifically, the channel length is L The heat exchanger is discretized into N tiny sub-heat exchange units along the flow direction z, numbered from 1 to N, and the length of each sub-heat exchange unit is... L / N, where i represents any sub-heat exchange unit.

[0051] Figure 3 In the diagram, the wall represents the intermediate medium for heat transfer, namely the solid metal portion. T i hin , T i hout , T i cin , T i cout The diagrams illustrate the process of heat transfer from the hot fluid to the wall and then from the wall to the cold fluid within the i-th sub-heat exchange unit. The flow and heat transfer control equation for the i-th cold-side channel in the heat exchanger is:

[0052]

[0053] The flow and heat transfer control equation for the i-th hot-side channel in the corresponding heat exchanger is:

[0054]

[0055]

[0056] The heat transfer control equation for the heat exchanger wall is:

[0057] Where ρ is density, with units of kg. m -3 ; v Flow velocity, in meters (m) s -1 ; t Time, in seconds; m i The mass flow rate of the i-th channel is expressed in kg. s -1 ; z The length in the direction of flow, in meters; h The convective heat transfer coefficient is expressed in W. m -2 ℃ -1 ; C The perimeter of the cross section is in meters (m). T Temperature, in °C; f Darcy friction factor; D e The hydraulic diameter of the channel is in meters (m). P Pressure, unit is Pa; k Thermal conductivity, in W m -1 ℃ -1 Subscript c indicates cold side, subscript h indicates hot side, and subscript w indicates wall surface; A cw The cross-sectional area of ​​the solid metal in the smallest heat transfer unit:

[0058] In this embodiment, 316L stainless steel is selected as the material for the heat exchanger, and its specific heat capacity and thermal conductivity are: Specific heat capacity of metallic materials:

[0059] k w,i Thermal conductivity of metallic materials:

[0060] The boundary control conditions for the above formula are shown in the following formula:

[0061]

[0062]

[0063]

[0064]

[0065]

[0066]

[0067]

[0068]

[0069]

[0070] In this embodiment, the dynamic load condition is the inlet temperature of the hot side as... T r heating rate t heat The time frame is such that the dynamic boundary input conditions for the above formula are as follows: 0≤ t ≤ t heat hour,

[0071] t > t heat hour,

[0072] Step S240: Based on the initial parameters and processing parameters, the dynamic response flow heat transfer model is used to obtain the real-time temperature distribution along the cold and hot sides of the heat exchanger during the dynamic process.

[0073] The Nusselt number, convective heat transfer coefficient, friction factor, structural parameters, operating parameters, and dynamic load conditions are substituted into the one-dimensional PCHE dynamic response flow heat transfer control equation for solution.

[0074] The real-time temperature distribution along the cold and hot sides of the flow path is calculated based on the flow heat transfer control equations during the dynamic process.

[0075] Step S300 Based on the temperature distribution along the path, the real-time temperature difference between the cold and hot sides of the channel is determined, and the minimum value of the temperature difference along the path is identified as the dynamic pinch point temperature difference.

[0076] In this embodiment, step S300 requires extracting key performance indicators from step S200. These indicators are crucial to the safety and efficiency of the heat exchanger, namely the dynamic pinch temperature difference, which is the minimum temperature difference between the hot and cold fluids throughout the entire heat exchange process.

[0077] In optional embodiments, such as Figure 5 As shown, step S300 includes: Step S310: Obtain the temperature difference along the cold side and hot side of the heat exchanger at various times.

[0078] Step S320: Traverse all friction temperature differences and identify the friction temperature difference with the smallest value to determine the dynamic pinch temperature difference.

[0079] Step S330: Output the time and location of the dynamic pinch temperature difference.

[0080] Step S400 The dynamic pinch temperature difference is compared with the preset pinch temperature value to adjust the dynamic load conditions of the heat exchanger.

[0081] In this embodiment, step S400 is the decision and feedback control link, which compares the dynamic pinch temperature difference obtained in step S300 with a preset pinch temperature value. If the predicted value is lower than the threshold, it indicates that the current variable load condition is too severe, which may lead to a decrease in heat exchange efficiency or even failure. Therefore, it is necessary to adjust the variable load condition, thereby forming a complete control adjustment method.

[0082] In optional embodiments, such as Figure 6 As shown, step S400 includes: Step S410: Obtain the preset clamp temperature value. Step S420: Compare the dynamic pinch temperature difference value with the preset pinch temperature value.

[0083] If the dynamic pinch temperature difference is not less than the preset pinch temperature, maintain the current dynamic load change condition; if the dynamic pinch temperature difference is less than the preset pinch temperature, adjust the dynamic load change condition.

[0084] Optionally, the dynamic load conditions can be adjusted, including: Reduce the inlet temperature change gradient and / or shorten the temperature change time of the cold and hot side channels of the heat exchanger.

[0085] Example 2 Figure 7This diagram schematically illustrates a block diagram of a dynamic pinch temperature difference determination and output control device for a printed circuit board heat exchanger according to Embodiment 2 of this application. This device can be divided into one or more program modules. One or more program modules are stored in a storage medium and executed by one or more processors to complete the embodiment of this application. The program module referred to in this embodiment is a series of computer program instruction segments capable of performing a specific function. The following description will specifically introduce the function of each program module in this embodiment. For example... Figure 7 As shown, the device 1000 may include: an acquisition module 1100, a processing module 1200, a calculation module 1300, and a control module 1400, wherein: The acquisition module 1100 is used to acquire the initial parameters of the heat exchanger, including metal material and structural parameters, initial steady-state operating parameters, and dynamic load conditions. The processing module 1200 is used to process the initial parameters for flow heat transfer data to obtain the real-time temperature distribution along the cold and hot sides of the heat exchanger during the dynamic process. The calculation module 1300 is used to determine the real-time temperature difference between the cold side channel and the hot side channel based on the temperature distribution along the path, and to identify the minimum value of the temperature difference along the path as the dynamic pinch point temperature difference; The control module 1400 is used to determine the magnitude of the dynamic pinch temperature difference and the preset pinch temperature value, and to control the dynamic load conditions of the heat exchanger.

[0086] As an optional embodiment, the acquisition module 1100 is further configured to: Obtain the metal material type and microchannel structure of the heat exchanger, and determine the hydraulic diameter, rib width, plate thickness and channel length of the microchannel structure.

[0087] Obtain the initial steady-state operating parameters of the heat exchanger, and determine the flow rate, pressure, and inlet temperature of the cold side channel and the hot side channel, respectively.

[0088] The dynamic load conditions of the heat exchanger are obtained to determine the inlet temperature gradient and temperature change time of the cold and hot side channels.

[0089] As an optional embodiment, the processing module 1200 is further configured to: Based on the heat exchanger's channel structure and initial parameters, processing parameters are obtained, including the Nusselt number, friction factor, and convective heat transfer coefficient.

[0090] A dynamic response flow heat transfer model for the heat exchanger is established, which includes the flow heat transfer control equations for the cold side channel, the flow heat transfer control equations for the hot side channel, and the wall heat transfer control equations.

[0091] Based on the initial and processing parameters, a dynamic response flow heat transfer model is used to obtain the real-time temperature distribution along the cold and hot sides of the heat exchanger during the dynamic process.

[0092] As an optional embodiment, the processing module 1200 is further configured to: The heat exchanger is discretized into multiple sub-heat exchange units along the flow direction, and the temperature change of each sub-heat exchange unit is determined by a dynamic response flow heat transfer model.

[0093] As an optional embodiment, the computing module 1300 is also used for: Obtain the temperature difference along the cold and hot sides of the heat exchanger at various times.

[0094] Iterate through all the friction temperature differences and identify the friction temperature difference with the smallest value to determine the dynamic pinch temperature difference; Output the time and location of the dynamic pinch temperature difference.

[0095] As an optional embodiment, the control module 1400 is also used for: Obtain the preset pinch point temperature value.

[0096] Compare the dynamic pinch temperature difference value with the preset pinch temperature value.

[0097] If the dynamic pinch temperature difference is not less than the preset pinch temperature, maintain the current dynamic load change conditions.

[0098] If the dynamic pinch temperature difference is less than the preset pinch temperature, adjust the dynamic load conditions.

[0099] As an optional embodiment, the control module 1400 is also used for: Reduce the inlet temperature change gradient and / or shorten the temperature change time of the cold and hot side channels of the heat exchanger.

[0100] Example 3 Figure 8 This illustration schematically shows a hardware architecture diagram of a computer device 10000 suitable for implementing a method for determining and controlling the dynamic pinch temperature difference of a printed circuit board heat exchanger according to Embodiment 3 of this application. In some embodiments, the computer device 10000 may be a terminal device such as a smartphone, wearable device, tablet computer, personal computer, in-vehicle terminal, game console, virtual device, workbench, digital assistant, set-top box, robot, etc. In other embodiments, the computer device 10000 may be a rack server, blade server, tower server, or cabinet server (including independent servers or server clusters composed of multiple servers), etc. Figure 8As shown, the computer device 10000 includes, but is not limited to: a memory 10010, a processor 10020, and a network interface 10030 that can communicate and be linked with each other via a system bus. Wherein: The memory 10010 includes at least one type of computer-readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 10010 may be an internal storage module of a computer device 10000, such as the hard disk or memory of the computer device 10000. In other embodiments, the memory 10010 may also be an external storage device of the computer device 10000, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the computer device 10000. Of course, the memory 10010 may also include both the internal storage module and the external storage device of the computer device 10000. In this embodiment, the memory 10010 is typically used to store the operating system and various application software installed on the computer device 10000, such as program code for image processing methods. Furthermore, the memory 10010 can also be used to temporarily store various types of data that have been output or will be output.

[0101] In some embodiments, processor 10020 may be a central processing unit (CPU), controller, microcontroller, microprocessor, or other chip. Processor 10020 is typically used to control the overall operation of computer device 10000, such as performing control and processing related to data interaction or communication with computer device 10000. In this embodiment, processor 10020 is used to run program code stored in memory 10010 or process data.

[0102] Network interface 10030 may include a wireless network interface or a wired network interface, which is typically used to establish a communication link between computer device 10000 and other computer devices. For example, network interface 10030 is used to connect computer device 10000 to an external terminal via a network, establishing a data transmission channel and communication link between computer device 10000 and the external terminal. The network may be an intranet, the Internet, Global System for Mobile Communication (GSM), Wideband Code Division Multiple Access (WCDMA), 4G network, 5G network, Bluetooth, Wi-Fi, or other wireless or wired networks.

[0103] It should be pointed out that, Figure 7 Only computer devices with components 10010-10030 are shown; however, it should be understood that it is not required to implement all of the shown components, and more or fewer components may be implemented instead.

[0104] In this embodiment, the printed circuit board heat exchanger dynamic pinch temperature difference determination and output control method stored in memory 10010 can be further divided into one or more program modules and executed by one or more processors (such as processor 10020) to complete the embodiment of this application.

[0105] Example 4 This application also provides a computer-readable storage medium storing a computer program thereon, wherein when the computer program is executed by a processor, it implements the steps of the printed circuit board heat exchanger dynamic pinch temperature difference determination and output control method in the embodiment.

[0106] In this embodiment, the computer-readable storage medium includes flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the computer-readable storage medium may be an internal storage unit of a computer device, such as the hard disk or memory of the computer device. In other embodiments, the computer-readable storage medium may also be an external storage device of the computer device, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., provided on the computer device. Of course, the computer-readable storage medium may include both the internal storage unit and the external storage device of the computer device. In this embodiment, the computer-readable storage medium is typically used to store the operating system and various application software installed on the computer device, such as the program code of the image processing method in the embodiment. In addition, the computer-readable storage medium can also be used to temporarily store various types of data that have been output or will be output.

[0107] Example 5 This application provides a computer program product, including a computer program that, when executed by a processor, implements the methods described in the above embodiments.

[0108] Obviously, those skilled in the art should understand that the modules or steps of the embodiments of this application described above can be implemented using general-purpose computer devices. They can be centralized on a single computer device or distributed across a network of multiple computer devices. Optionally, they can be implemented using computer-executable program code, thereby storing them in a storage device for execution by a computer device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the embodiments of this application are not limited to any particular combination of hardware and software.

[0109] It should be noted that the above are merely preferred embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A method for determining and controlling the dynamic pinch temperature difference of a printed circuit board heat exchanger, characterized in that, The method includes: Obtain the initial parameters of the heat exchanger, including metal material and structural parameters, initial steady-state operating parameters, and dynamic load conditions; The initial parameters are processed using flow heat transfer data to obtain the real-time temperature distribution along the cold and hot sides of the heat exchanger during the dynamic process. Based on the temperature distribution along the path, the real-time temperature difference between the cold side and the hot side channels is determined, and the minimum value of the temperature difference along the path is identified as the dynamic pinch temperature difference; The dynamic pinch temperature difference is compared with the preset pinch temperature value to determine the dynamic load conditions of the heat exchanger.

2. The determination and output control method according to claim 1, characterized in that, Obtain the initial parameters of the heat exchanger, including: Obtain the metal material type and microchannel structure of the heat exchanger, and determine the hydraulic diameter, rib width, plate thickness and channel length of the microchannel structure; Obtain the initial steady-state operating parameters of the heat exchanger, and determine the flow rate, pressure, and inlet temperature of the cold side channel and the hot side channel, respectively; The dynamic variable load conditions of the heat exchanger are obtained to determine the inlet temperature change gradient and temperature change time of the cold side channel and the hot side channel.

3. The determination and output control method according to claim 1, characterized in that, The initial parameters are subjected to flow heat transfer data processing, including: Based on the channel structure of the heat exchanger and the initial parameters, processing parameters are obtained, including the Nusselt number, friction factor, and convective heat transfer coefficient. A dynamic response flow heat transfer model for the heat exchanger is established, which includes the flow heat transfer control equations for the cold side channel, the flow heat transfer control equations for the hot side channel, and the wall heat transfer control equations. Based on the initial parameters and processing parameters, the real-time temperature distribution along the cold and hot sides of the heat exchanger during the dynamic process is obtained through a dynamic response flow heat transfer model.

4. The determination and output control method according to claim 3, characterized in that, The flow heat transfer data processing of the initial parameters also includes: discretizing the heat exchanger into multiple sub-heat exchange units along the flow direction, and determining the temperature change of each sub-heat exchange unit through a dynamic response flow heat transfer model.

5. The determination and output control method according to claim 1, characterized in that, Identifying the minimum value of the temperature difference along the friction path as the dynamic pinch temperature difference includes: Obtain the temperature difference along the cold side and hot side of the heat exchanger at various times; Iterate through all the friction temperature differences and identify the friction temperature difference with the smallest value to determine the dynamic pinch temperature difference; Output the time and location of the dynamic pinch temperature difference.

6. The determination and output control method according to claim 1, characterized in that, Determining the magnitude of the dynamic pinch temperature difference and the preset pinch temperature value, and adjusting the dynamic load conditions of the heat exchanger, including: Obtain the preset pinch point temperature value; Compare the dynamic pinch temperature difference value with the preset pinch temperature value; If the dynamic pinch temperature difference is not less than the preset pinch temperature, maintain the current dynamic load change condition. If the dynamic pinch temperature difference is less than the preset pinch temperature, the dynamic load change condition is adjusted.

7. The determination and output control method according to claim 6, characterized in that, Regulating the dynamic load conditions includes: Reduce the inlet temperature change gradient and / or shorten the temperature change time of the cold side and hot side channels of the heat exchanger.

8. A device for determining and controlling the dynamic pinch point temperature difference of a printed circuit board heat exchanger, characterized in that, The device includes: The acquisition module is used to acquire the initial parameters of the heat exchanger, including metal material and structural parameters, initial steady-state operating parameters, and dynamic load conditions. The processing module is used to process the initial parameters for flow heat transfer data to obtain the real-time temperature distribution along the cold side and hot side of the heat exchanger during the dynamic process. The calculation module is used to determine the real-time temperature difference between the cold side channel and the hot side channel based on the temperature distribution along the path, and to identify the minimum value of the temperature difference along the path as the dynamic pinch temperature difference; The control module is used to determine the magnitude of the dynamic pinch temperature difference and the preset pinch temperature value, and to control the dynamic load conditions of the heat exchanger.

9. A computer device, characterized in that, include: At least one processor; and A memory communicatively connected to the at least one processor; wherein: The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that, when executed by a processor, implement the method as described in any one of claims 1 to 7.

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