A laser device

Abstract

The application relates to the technical field of optical communication, in particular to a laser device. The laser device comprises a shell, a semiconductor refrigeration sheet, a gain chip, a filter lens group, a reflection isolation piece and a back light detector; the shell is provided with an outlight port; the semiconductor refrigeration sheet is arranged in the shell and comprises a common heating part, a first refrigeration part and a second refrigeration part; the gain chip and the back light detector are arranged in the shell and on the first refrigeration part; and the filter lens group and the reflection isolation piece are arranged in the shell and on the second refrigeration part. The first refrigeration part and the second refrigeration part are arranged, the temperature of different parts is controlled independently, the temperature control is more accurate, meanwhile, the reflection isolation piece is designed in an integral molding mode, the number of discrete components and the assembly space are reduced, the overall structure volume is smaller, the refrigeration sheet is stably controlled in temperature, and the working performance stability and the service life are remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to a laser device. Background Technology

[0002] Tunable laser devices are lasers whose output wavelength can be dynamically adjusted. They integrate optical components such as gain chips, filter arrays, mirrors, isolators, and backlight detectors. These lasers typically employ thermoelectric coolers (TES) to uniformly control the temperature of all components, meaning all components are mounted on the same cold surface of the TES for overall cooling. However, the gain chip, as an active component, generates significant heat. When it shares a single cold surface with the temperature-sensitive filter array, heat can easily be conducted through the cold surface substrate to the filter array, causing thermal crosstalk, leading to wavelength drift and affecting the stability of the output light. Furthermore, in terms of optical path integration, existing mirrors and isolators are usually separate units, which can result in excessive space occupation and uneven temperature control, affecting long-term optical path stability and device miniaturization.

[0003] In summary, there is an urgent need for a tunable laser device that can achieve independent temperature control in different zones and has a more compact structural layout. Summary of the Invention

[0004] This invention provides a laser device that enables independent temperature control in different zones, resulting in more stable performance and a more compact structure.

[0005] This invention discloses a laser device, comprising:

[0006] The housing has a light outlet; A semiconductor cooling chip is installed in the housing. The semiconductor cooling chip includes a heating section, a first cooling section and a second cooling section. The first cooling section and the second cooling section are disposed on the same side of the heating section with a gap between them. The first cooling section is located on the side of the second cooling section away from the light outlet. A gain chip is installed in the housing and disposed on the first cooling unit; the gain chip includes a first waveguide port and a second waveguide port disposed opposite to each other in a first direction, the first waveguide port being disposed towards the light output port; A filter assembly is installed in the housing and disposed on the second cooling unit, and the filter assembly is located in the emission direction of the first waveguide port. A reflective isolator is mounted on the second cooling unit and located on the optical path between the filter lens group and the light output port; the reflective isolator includes an integrally formed reflective part and an isolating part, the reflective part is located on the side of the isolating part away from the light output port, the reflective part is used to reflect part of the light back to the first waveguide port through the filter lens group, and the isolating part is used to isolate the reflected light; A backlight detector is used to monitor and provide feedback on the power of light waves. The backlight detector is mounted on the first cooling unit and located on the optical path of the second waveguide port, so that the light energy of the second waveguide port is incident on the backlight detector.

[0007] In one embodiment, the reflective isolator further includes a mounting portion mounted on the second cooling unit, and the isolator is mounted on the side of the mounting portion away from the second cooling unit.

[0008] In one embodiment, the isolation part is an isolator, and the reflective part is a reflective coating disposed on the side of the isolator away from the light outlet; the mounting part is provided with a slot on the side opposite to the second cooling part, and the isolator is embedded in the slot.

[0009] In one embodiment, the housing includes two side portions located on both sides of the light outlet, each side portion having pins inserted thereon for connecting to an external circuit board; the inner wall of the housing has two protrusions symmetrically arranged on both sides of the light outlet, and the semiconductor cooling chip is located between the two protrusions; a metal plate is provided on the side of the protrusion away from the heating element, and the pins are electrically connected to the metal plate, the metal plate being used to electrically connect to the semiconductor cooling chip via a metal solder wire.

[0010] In one embodiment, the side of the boss away from the heating section is lower than the first cooling section and the second cooling section.

[0011] In one embodiment, the device further includes a first temperature control element mounted on the first cooling unit and used to monitor the temperature of the first cooling unit; and / or, it includes a second temperature control element mounted on the second cold surface and used to monitor the temperature of the second cold surface.

[0012] In one embodiment, the filter array includes a plurality of filter elements, which are arranged at intervals along the first direction; The filter includes a light-transmitting section, and a plurality of light-transmitting sections are arranged sequentially along the emission direction of the first waveguide port. The filter has a heating wire on one side in the first direction, and the heating wire extends circumferentially along the outer contour of the light-transmitting section. The heating wire is used to adjust the temperature of the light-transmitting section.

[0013] In one embodiment, the filter further includes a fixing part connected to the light-transmitting part, and the fixing part is provided with a third temperature control element and a heat-conducting element. The third temperature control element is electrically connected to the heat-conducting element. From the first direction, the heating wire and the light-transmitting part are located in the inner ring of the heat-conducting element.

[0014] In one embodiment, the device further includes a carrier and a total reflection mirror. The carrier is mounted on the first cooling unit. The gain chip and the total reflection mirror are both mounted on the side of the carrier facing away from the first cooling unit. The carrier has a groove. The total reflection mirror is mounted at the opening of the groove. The total reflection mirror is located in the emission direction of the second waveguide port. The backlight detector is mounted in the groove and is located in the refraction direction of the total reflection mirror.

[0015] In one embodiment, a collimating lens is further included, which is mounted on the first cooling unit and located between the first waveguide port and the filter lens group. The collimating lens is used to collimate the light emitted from the first waveguide port. Alternatively, a sleeve is provided outside the housing, which surrounds the light outlet. The laser device further includes a coupling lens, which is mounted inside the sleeve and is used to couple light.

[0016] The beneficial effects of the laser device provided in this invention are as follows: By separating the first cooling section and the second cooling section on the common heating section of the semiconductor cooling chip, and placing the gain chip and the backlight detector on the first cooling section, and placing the filter lens group and the reflective isolator on the second cooling section, independent temperature control of different components is achieved, resulting in more precise temperature control. At the same time, the reflective isolator adopts an integrated design of the reflective section and the isolator section, which reduces the number of discrete components and the assembly space, making the overall structure smaller and facilitating temperature control by the semiconductor cooling chip. This significantly improves the working performance stability of the laser device and effectively extends its service life. Attached Figure Description

[0017] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is a schematic diagram of the internal structure of the laser device provided in an embodiment of the present invention; Figure 2 This is an assembly diagram of the semiconductor cooling chip, gain chip, and reflective isolator provided in an embodiment of the present invention; Figure 3 yes Figure 2 A magnified view of a portion of position A in the middle; Figure 4 This is a disassembly diagram of the reflective isolator provided in an embodiment of the present invention; Figure 5 This is a front view of the filter 41 from the first direction provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the optical path of the laser device provided in an embodiment of the present invention.

[0018] The labels for the attached figures are as follows: 1000, Laser device; 10, Housing; 11, Light outlet; 12, Sleeve; 13, Pin; 14, Boss; 141, Metal sheet; 20, Semiconductor cooling chip; 21, Heating unit; 22, First cooling unit; 221, First temperature control element; 23, Second cooling unit; 231, Second temperature control element; 30, Gain chip; 31, First waveguide port; 32, Second waveguide port; 40, Filter assembly; 41, Filter; 411, Light transmission unit; 412, Fixing unit; 413, Heating wire; 414, Third temperature control element; 415, Heat conductor; 50, Reflective isolator; 51, Reflective part; 52, Isolation part; 53, Mounting part; 531, Slot; 60, Backlight detector; 70, Carrier; 71, Groove; 80, Total reflection mirror; 90, Collimating lens; 100, Coupling lens. Detailed Implementation

[0019] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0020] This invention provides a laser device 1000, such as... Figure 1 - Figure 3 As shown, the device includes a housing 10, a thermoelectric cooler 20, a gain chip 30, a filter assembly 40, a reflective isolator 50, and a backlight detector 60. The housing 10 has a light-emitting port 11. The thermoelectric cooler 20 is installed in the housing 10 and includes a heating section 21, a first cooling section 22, and a second cooling section 23. The first cooling section 22 and the second cooling section 23 are separated and disposed on the same side of the heating section 21, with the first cooling section 22 located on the side of the second cooling section 23 away from the light-emitting port 11. The gain chip 30 is installed in the housing 10 and disposed on the first cooling section 22. The gain chip 30 includes components in a first direction (e.g., ...). Figure 1 and Figure 2The first waveguide port 31 and the second waveguide port 32 are arranged opposite to each other (as shown in the X direction in the diagram), with the first waveguide port 31 facing the light output port 11; the filter assembly 40 is installed in the housing 10 and is disposed on the second cooling unit 23, and the filter assembly 40 is located in the emission direction of the first waveguide port 31; the reflective isolator 50 is installed on the second cooling unit 23 and is located on the optical path between the filter assembly 40 and the light output port 11; the reflective isolator 50 includes an integrally formed reflective part 51 and an isolator part 52, the reflective part 51 is located on the side of the isolator part 52 away from the light output port 11, the reflective part 51 is used to reflect part of the light back to the first waveguide port 31 through the filter assembly 40, and the isolator part 52 is used to isolate the reflected light; the backlight detector 60 is used to monitor and feedback the power of the light wave, the backlight detector 60 is installed on the first cooling unit 22 and is located on the optical path of the second waveguide port 32, so that the light energy of the second waveguide port 32 is incident on the backlight detector 60. This application achieves independent temperature control for different components by separating a first cooling section 22 and a second cooling section 23 on the common heating section 21 of the semiconductor cooling chip 20, and placing the gain chip 30 and the backlight detector 60 on the first cooling section 22, and the filter lens group 40 and the reflective isolator 50 on the second cooling section 23. This results in more precise temperature control. At the same time, the reflective isolator 50 adopts a design where the reflective section 51 and the isolator section 52 are integrally formed, which reduces the number of discrete components and the assembly space, making the overall structure smaller. It also facilitates the stable operation of each optical component under the stable temperature control of the semiconductor cooling chip 20, thereby improving their working performance stability and service life.

[0021] Specifically, after the thermoelectric cooler 20 is powered on, one side of its common heating section 21 is the hot end, and the side containing the first cooling section 22 and the second cooling section 23 is the cold end. Since the first cooling section 22 and the second cooling section 23 are separated from each other on the common heating section 21, there is no direct heat conduction path between them, allowing them to be controlled at different target temperatures. The gain chip 30, as the core light-emitting element, generates a significant amount of heat during operation and is sensitive to temperature changes. Its independent placement on the first cooling section 22 allows for concentrated and efficient cooling, ensuring the stability of its output wavelength and power. Simultaneously, the backlight detector 60 is also located on the first cooling section 22, placing it in the same temperature range as the gain chip 30, ensuring the accuracy of the monitoring data. The filter assembly 40 is used for frequency selection and stabilization, and its optical performance is also subject to strict temperature requirements. Its separate placement on the second cooling section 23 avoids thermal crosstalk caused by the heat generated by the gain chip 30, ensuring that the filter assembly 40 always operates within its optimal temperature range. The reflective isolator 50 is also mounted on the second cooling section 23. Its reflective part 51 reflects a portion of the specific wavelength light selected by the filter group 40 back to the first waveguide port 31 of the gain chip 30, forming a feedback loop for the resonant cavity and maintaining laser oscillation. The isolator 52 allows forward-emitting light to pass through while blocking the reflected light from returning in reverse, preventing self-excitation interference in the optical path. Since the reflective part 51 and the isolator 52 are integrally formed, the relative positional accuracy between them is guaranteed by the manufacturing process in one step, eliminating the need for subsequent assembly and adjustment. This not only reduces the volume occupied by the optical path components but also ensures the long-term stability of the optical path alignment. In summary, this structural configuration is synergistically optimized from the two dimensions of thermal management and optical path integration, enabling each core component to operate under precise and stable temperature conditions, significantly improving the overall performance stability and service life of the laser device 1000.

[0022] Reference Figure 2 and Figure 4 In one embodiment, the reflective isolator 50 further includes a mounting portion 53, which is mounted on the second cooling portion 23, and the isolator 52 is mounted on the side of the mounting portion 53 away from the second cooling portion 23. This arrangement, by adding the mounting portion 53 and placing the isolator 52 on top of the mounting portion 53, better secures the isolator 52 and facilitates temperature control of the isolator 52 by the thermoelectric cooler 20.

[0023] Specifically, the mounting portion 53, acting as a transitional carrier 70 between the isolation portion 52 and the second cooling portion 23, provides a larger mounting contact area, allowing the reflective isolator 50 to be more securely fixed to the second cooling portion 23, resisting the influence of external vibrations and impacts on the optical path. Simultaneously, the presence of the mounting portion 53 increases the heat conduction area between the isolation portion 52 and the second cooling portion 23, shortening the heat conduction path. This allows the cooling energy from the second cooling portion 23 to be transferred to the isolation portion 52 more evenly and quickly, ensuring that the isolation portion 52 always operates within the set temperature range, thereby maintaining the stability of its isolation performance.

[0024] Preferably, the isolating part 52 is an isolator, and the reflecting part 51 is a reflective coating disposed on the side of the isolator away from the light outlet 11; the mounting part 53 has a slot 531 on the side opposite to the second cooling part 23, and the isolator is embedded in the slot 531. This arrangement provides a specific embodiment of the reflective isolator 50, that is, using a combination of an isolator and a reflective coating, and fixing it by being embedded in the slot 531, which has a simple structure and reliable assembly.

[0025] Reference Figure 1 In one embodiment, the housing 10 includes two sides located on both sides of the light outlet 11, each side having pins 13 inserted thereon for connecting to an external circuit board. The inner wall of the housing 10 has two protrusions 14 symmetrically arranged on both sides of the light outlet 11, with the thermoelectric cooler 20 located between the two protrusions 14. A metal sheet 141 is provided on the side of the protrusion 14 away from the heating element 21, and the pins 13 are electrically connected to the metal sheet 141. The metal sheet 141 is used to electrically connect the thermoelectric cooler 20 via a metal solder wire. This arrangement, by providing the metal sheet 141 on the protrusion 14 and electrically connecting it to the pins 13, makes it easier to solder the thermoelectric cooler 20 onto the metal sheet 141 via a metal solder wire, thereby achieving electrical connection with the pins 13 and simplifying the internal electrical connection process.

[0026] Specifically, the thermoelectric cooler 20 typically requires leads for power supply. However, the electrode pads of the thermoelectric cooler 20 itself are relatively small, making direct soldering to the pins 13 difficult and unreliable. By providing a boss 14 on the inner wall of the housing 10, and pre-fabricating a large metal sheet 141 on the boss 14, the metal sheet 141 is connected to the pins 13 penetrating the housing 10 via internal wiring. During internal assembly, the power supply circuit can be completed simply by soldering the electrodes of the thermoelectric cooler 20 to the corresponding metal sheet 141 using metal solder wire. The metal sheet 141 provides ample solderable area and a stable solder base, reducing the difficulty of the soldering process while improving the consistency and long-term reliability of the solder joints.

[0027] Preferably, the side of the boss 14 furthest from the heating section 21 is lower than the first cooling section 22 and the second cooling section 23. This arrangement creates a height difference by making the height of the boss 14 lower than the first cooling section 22 and the second cooling section 23, allowing the metal welding wire to automatically droop during connection, which is beneficial for welding operations and avoids interference between the welding wire and the surface of the cooling section.

[0028] Specifically, during wire bonding, one end of the wire is welded to the electrode of the first cooling section 22 or the second cooling section 23, and the other end is welded to the metal plate 141 of the boss 14. Since the top surface of the boss 14 is lower than the surface of the cooling section, the wire will form a natural arc droop between the two connection points. This height difference design provides ample space for the wire routing, preventing the wire from breaking due to excessive tension, and also preventing the wire from touching the surface of the optical components above the cooling section, ensuring the reliability of the electrical connection and the cleanliness of the optical path.

[0029] Reference Figure 1 and Figure 2 In one embodiment, the laser device 1000 further includes a first temperature control element 221, which is mounted on the first cooling section 22 and is used to monitor the temperature of the first cooling section 22; and / or, the laser device 1000 includes a second temperature control element 231, which is mounted on the second cold surface and is used to monitor the temperature of the second cold surface. This configuration, by providing independent temperature control elements on the first cooling section 22 and the second cooling section 23 respectively, enables real-time monitoring of the temperature of their respective cooling areas, thereby achieving auxiliary precise temperature control and providing accurate feedback signals for closed-loop temperature regulation.

[0030] Specifically, the first temperature control element 221 (e.g., a thermistor) is directly mounted on the surface of the first cooling section 22, continuously monitoring the real-time temperature of the area where the gain chip 30 and the backlight detector 60 are located, and feeding the temperature data back to the external temperature control circuit. When the detected temperature deviates from the preset target temperature, the temperature control circuit adjusts the current supplied to the first cooling section 22 of the semiconductor cooling chip 20 to restore and stabilize it at the set temperature. Similarly, the second temperature control element 231 (e.g., a thermistor) independently monitors the temperature of the area where the second cooling section 23 is located, providing independent closed-loop temperature control protection for the filter assembly 40 and the reflective isolator 50. This dual-zone independent monitoring design allows the temperature control strategies of different components to be set and adjusted independently without interference, further improving the overall temperature control accuracy of the device.

[0031] Reference Figure 2 and Figure 5In one embodiment, the filter assembly 40 includes a plurality of filter elements 41, which are arranged at intervals along a first direction. Each filter element 41 includes a light-transmitting portion 411, which are sequentially arranged along the emission direction of the first waveguide port 31. A heating wire 413 is provided on one side of the filter element 41 in the first direction. The heating wire 413 extends circumferentially along the outer contour of the light-transmitting portion 411 and is used to adjust the temperature of the light-transmitting portion 411. With this arrangement, by surrounding the light-transmitting portion 411 of the filter element 41 with the heating wire 413, the heat generated by the heating wire 413 can be evenly distributed along the outer contour of the light-transmitting portion 411, which is more conducive to uniform heating and ensures that the optical characteristics of the light-transmitting portion 411 are consistent throughout, thus stabilizing the filtering effect.

[0032] Specifically, the light-transmitting portion 411 of each filter 41 is the core area through which the light path passes, and its temperature uniformity directly affects the refractive index and the accuracy of the filtered wavelength. The heating wire 413 is designed as a circumferential structure extending along the outer contour of the light-transmitting portion 411. When current passes through the heating wire 413, heat is uniformly conducted from the periphery of the light-transmitting portion 411 to the center, avoiding wavefront distortion and filter bandwidth shift caused by localized overheating or temperature gradients. Multiple filters 41 are arranged sequentially along the first direction, each with independent temperature control, enabling precise filtering selection of different wavelengths of light and achieving complex spectral shaping and frequency stabilization functions.

[0033] Reference Figure 2 and Figure 5 In one embodiment, the filter 41 further includes a fixing part 412 connected to the light-transmitting part 411. The fixing part 412 is provided with a third temperature control element 414 and a heat-conducting element 415. The third temperature control element 414 is electrically connected to the heat-conducting element 415. Viewed from the first direction, the heating wire 413 and the light-transmitting part 411 are located in the inner ring of the heat-conducting element 415. With this arrangement, the temperature of the light-transmitting part 411 can be detected by the third temperature control element 414 and the heat-conducting element 415. Since the heat-conducting element 415 surrounds the heating wire 413 and the light-transmitting part 411 in its inner ring, the temperature of the light-transmitting part 411 and its heating area can be sensed more directly and accurately, providing reliable feedback for precise temperature control.

[0034] Specifically, the fixing part 412 is connected to the light-transmitting part 411. The heat-conducting element 415 can be a metal wire, which is embedded or attached to the fixing part 412 and structurally surrounds the heating wire 413 and the light-transmitting part 411 in its inner ring area. The third temperature control element 414 is a thermistor, which is electrically connected to the heat-conducting element 415. The heat-conducting element 415 efficiently collects temperature information around the light-transmitting part 411 and transmits it to the third temperature control element 414. Since the inner ring of the heat-conducting element 415 directly corresponds to the core area of ​​heating and light transmission, the temperature it senses can most accurately reflect the working temperature of the light-transmitting part 411. This allows the external temperature control circuit to accurately adjust the heating power of the heating wire 413 based on this accurate feedback signal, achieving extremely high temperature control accuracy.

[0035] Reference Figure 3 In one embodiment, the laser device 1000 further includes a carrier 70 and a total reflection mirror 80. The carrier 70 is mounted on the first cooling section 22. The gain chip 30 and the total reflection mirror 80 are both mounted on the side of the carrier 70 facing away from the first cooling section 22. The carrier 70 has a groove 71, and the total reflection mirror 80 is mounted at the opening of the groove 71. The total reflection mirror 80 is located in the emission direction of the second waveguide port 32. The backlight detector 60 is mounted in the groove 71 and located in the refraction direction of the total reflection mirror 80. With this configuration, by placing the total reflection mirror 80 at the opening of the groove 71 and the backlight detector 60 built into the groove 71, on the one hand, the backlight detector 60 is located inside the groove 71, avoiding interference from ambient stray light and improving monitoring accuracy; on the other hand, the total reflection mirror 80 and the backlight detector 60 are stacked vertically in space, which helps to reduce the space layout.

[0036] Specifically, the backlight emitted from the second waveguide port 32 of the gain chip 30 first reaches the total reflection mirror 80 mounted on the carrier 70. The total reflection mirror 80 reflects part or all of the light beam at a specific angle and guides it downwards, with the refracted light entering the groove 71 formed on the carrier 70. The backlight detector 60 is installed inside the groove 71, with its photosensitive surface facing the incident direction of the refracted light. It receives the optical signal and converts it into an electrical signal for monitoring and feedback of the laser power. Since the backlight detector 60 is located in the semi-enclosed groove 71 structure, the sidewalls of the groove 71 effectively block stray ambient light from other directions, improving the signal-to-noise ratio and detection accuracy. At the same time, the total reflection mirror 80 and the backlight detector 60 are vertically stacked in a direction perpendicular to the first cooling section 22, significantly reducing the space occupied by the rear end of the optical path in the horizontal direction, making the overall structure more compact.

[0037] Reference Figure 1 and Figure 2In one embodiment, the laser device 1000 further includes a collimating lens 90, which is mounted on the first cooling section 22 and located between the first waveguide port 31 and the filter group 40. The collimating lens 90 is used to collimate the emitted light from the first waveguide port 31. Alternatively, a sleeve 12 is provided outside the housing 10, surrounding the light outlet 11. The laser device 1000 also includes a coupling lens 100, which is mounted inside the sleeve 12 and is used to couple light. With this configuration, by adding a collimating lens 90 after the first waveguide port 31 to collimate the emitted light, the beam divergence angle can be reduced, allowing the beam to enter the filter group 40 in a parallel or nearly parallel state, thereby improving filtering efficiency and optical path stability. Furthermore, by adding a coupling lens 100 inside the sleeve 12 outside the light outlet 11 to couple the output light, the beam can be efficiently coupled into downstream optical fibers or other optical systems, reducing coupling loss.

[0038] Reference Figure 6 To better understand the technical solution of this application, the working principle of the laser device 1000 is explained below: The gain chip operates under the temperature control of the first cooling unit 22. Its first waveguide port 31 emits initial light, which is collimated by the collimating lens 90 to form a parallel beam and enters the filter group 40 set on the second cooling unit 23. The filter group 40 filters and selects the incident light for a specific wavelength, allowing only the target wavelength light that meets the requirements to pass through. The filtered beam continues to propagate forward and reaches the reflective isolator 50. In the reflective isolator 50, the reflector 51 at the front end reflects part of the light along the original path, causing it to pass through the filter group 40 again and return to the first waveguide port 31 of the gain chip 30 to excite the gain chip 30 and make it reach the upper limit of power saturation output; at the same time, the other part of the light that is not reflected passes through the reflector 51, enters the coupling lens 100 set at the light outlet 11 through the isolation part 52 at the rear end, and is focused by the coupling lens 100 and enters the pigtail as a stable laser signal output. In addition, the second waveguide port 32 of the gain chip 30 emits a small amount of backlight. This backlight is refracted by the total reflection mirror 80 and deflected downwards, then incident on the backlight detector 60 located in the groove 71. The backlight detector 60 monitors the optical power in real time and feeds it back to the external control circuit to realize closed-loop monitoring of the laser output.

[0039] In the above scheme, the gain chip 30 and other components are respectively arranged on the first cooling section 22 and the second cooling section 23, which can achieve more accurate temperature control and is conducive to the more stable operation of the laser device 1000. In addition, the integrated setting of the reflective isolation component 50 is conducive to optimizing the internal space layout and the second cooling section 23 to control its temperature more stably.

[0040] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of the present invention.

Claims

1. A laser device, characterized in that, include: The housing has a light outlet; A semiconductor cooling chip is installed in the housing. The semiconductor cooling chip includes a heating section, a first cooling section and a second cooling section. The first cooling section and the second cooling section are disposed on the same side of the heating section with a gap between them. The first cooling section is located on the side of the second cooling section away from the light outlet. A gain chip is installed in the housing and disposed on the first cooling unit; the gain chip includes a first waveguide port and a second waveguide port disposed opposite to each other in a first direction, the first waveguide port being disposed towards the light output port; A filter assembly is installed in the housing and disposed on the second cooling unit, and the filter assembly is located in the emission direction of the first waveguide port. A reflective isolator is mounted on the second cooling unit and located on the optical path between the filter lens group and the light output port; the reflective isolator includes an integrally formed reflective part and an isolating part, the reflective part is located on the side of the isolating part away from the light output port, the reflective part is used to reflect part of the light back to the first waveguide port through the filter lens group, and the isolating part is used to isolate the reflected light; A backlight detector is used to monitor and provide feedback on the power of light waves. The backlight detector is mounted on the first cooling unit and located on the optical path of the second waveguide port, so that the light energy of the second waveguide port is incident on the backlight detector.

2. The laser device according to claim 1, characterized in that, The reflective isolator further includes a mounting portion, which is mounted on the second cooling unit, and the isolator is mounted on the side of the mounting portion away from the second cooling unit.

3. The laser device according to claim 2, characterized in that, The isolation part is an isolator, and the reflective part is a reflective coating disposed on the side of the isolator away from the light outlet; the mounting part is provided with a slot on the side opposite to the second cooling part, and the isolator is embedded in the slot.

4. The laser device according to claim 1, characterized in that, The housing includes two side portions located on both sides of the light outlet, each side portion having pins inserted thereon for connecting to an external circuit board; the inner wall of the housing has two protrusions symmetrically arranged on both sides of the light outlet, and the semiconductor cooling chip is located between the two protrusions; a metal plate is provided on the side of the protrusion away from the heating element, and the pins are electrically connected to the metal plate, which is used to electrically connect to the semiconductor cooling chip via a metal solder wire.

5. The laser device according to claim 4, characterized in that, The side of the boss away from the heating section is lower than the first cooling section and the second cooling section.

6. The laser device according to claim 1, characterized in that, It also includes a first temperature control element, which is mounted on the first refrigeration unit and is used to monitor the temperature of the first refrigeration unit; and / or, it includes a second temperature control element, which is mounted on the second cold surface and is used to monitor the temperature of the second cold surface.

7. The laser device according to claim 1, characterized in that, The filter assembly includes multiple filter elements, which are arranged at intervals along the first direction. The filter includes a light-transmitting section, and a plurality of light-transmitting sections are arranged sequentially along the emission direction of the first waveguide port. The filter has a heating wire on one side in the first direction, and the heating wire extends circumferentially along the outer contour of the light-transmitting section. The heating wire is used to adjust the temperature of the light-transmitting section.

8. The laser device according to claim 7, characterized in that, The filter also includes a fixing part, which is connected to the light-transmitting part. The fixing part is provided with a third temperature control element and a heat-conducting element. The third temperature control element is electrically connected to the heat-conducting element. From the first direction, the heating wire and the light-transmitting part are located in the inner ring of the heat-conducting element.

9. The laser device according to any one of claims 1-8, characterized in that, It also includes a carrier and a total reflection mirror. The carrier is installed in the first cooling unit. The gain chip and the total reflection mirror are both installed on the side of the carrier facing away from the first cooling unit. The carrier has a groove. The total reflection mirror is installed at the opening of the groove. The total reflection mirror is located in the emission direction of the second waveguide port. The backlight detector is installed in the groove and is located in the refraction direction of the total reflection mirror.

10. The laser device according to any one of claims 1-8, characterized in that, It also includes a collimating lens, which is mounted on the first cooling unit and located between the first waveguide port and the filter lens group. The collimating lens is used to collimate the light emitted from the first waveguide port. Alternatively, a sleeve is provided outside the housing, which surrounds the light outlet. The laser device also includes a coupling lens, which is mounted inside the sleeve and is used to couple light.

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