Terminal structure, method of manufacture and terminal device

Abstract

The application discloses a terminal structural member, a manufacturing method and a terminal device, and relates to the technical field of terminal devices. The terminal structural member comprises a substrate, a solidified layer and a marking member. The substrate comprises a first side and a second side arranged oppositely along the thickness direction. The solidified layer is arranged on the first side. The solidified layer is provided with a receiving hole. One end of the receiving hole is opened to one side of the substrate away from the first side. The marking member is arranged in the receiving hole. The application does not need to arrange a slot on the substrate matched with the marking member. Instead, other simpler ways are used to form the receiving hole in the solidified layer, thereby simplifying the manufacturing of the terminal structural member. In addition, since the slot matched with the marking member does not need to be arranged on the substrate, the strength of the substrate is not affected by the slot. Furthermore, a thickening area to prevent the slot from affecting the strength of the substrate does not need to be arranged on the substrate, thereby avoiding the thickening area from occupying the internal space of the terminal device and being unfavorable to the thinning design of the terminal device.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and in particular to a terminal structural component, manufacturing method, and terminal equipment. Background Technology

[0002] Currently, the casing of terminal devices typically includes a casing body and a resin layer set on the casing body. Mounting grooves are machined on the resin layer and the casing body using CNC machining. Logo identification parts are pasted into the mounting grooves. However, slotting the casing body will affect the strength of the casing. Summary of the Invention

[0003] This application provides a terminal structural component, a manufacturing method, and a terminal device to solve the technical problem that the installation method of existing logo identification components affects the strength of the outer shell.

[0004] The technical solution is as follows: The first aspect of this application provides a terminal structural component, comprising: The substrate includes a first side surface and a second side surface disposed opposite to each other along the thickness direction; A curing layer is disposed on the first side surface, and a receiving hole is provided on the curing layer, with one end of the receiving hole extending to the side of the substrate away from the first side surface. The marking element matches the shape of the receiving hole and is set inside the receiving hole.

[0005] In this application, the curing layer is provided with receiving holes and the identification element is disposed in the receiving holes, so that there is no need to provide a slot on the substrate to cooperate with the identification element. Since the curing layer is a cured film layer, the receiving holes on the curing layer are not limited to CNC machining. Other simpler methods can be used to form receiving holes in the curing layer, simplifying the manufacturing of terminal structural components. In addition, since there is no need to provide a slot on the substrate to cooperate with the identification element, the strength of the substrate will not be affected by the slot on the substrate. There is also no need to provide a thickened area on the substrate to avoid the impact of the slot on the substrate strength. This avoids the thickened area occupying the internal space of the terminal device, which is not conducive to the thinning design of the terminal device.

[0006] In some implementations, the other end of the receiving hole is opened to the side where the cured layer connects to the first side, and the identifier is attached to the substrate.

[0007] In this implementation, the identification element can be first attached to the substrate, and then a curable material can be applied to the substrate. When curing the curable material, it is easy to achieve that the cured layer after curing is integrated with the sidewall of the identification element along the thickness direction.

[0008] In some implementations, the cured layer is integrally connected to the sidewall of the marking component along its thickness direction.

[0009] In this implementation, not only is it beneficial to improve the strength of the identification element connected to the substrate, but it can also avoid gaps between the identification element and the hole wall.

[0010] In some implementations, the identification element is made of metal.

[0011] In this implementation, by setting the marker to be made of metal, when the curable material is cured by light curing, the marker reflects light. The reflected light passes through the curable material and is then emitted, so that the curable material on the marker is exposed to light twice. This facilitates the hardening and embrittlement of the curable material on the marker, making it easier to peel the curable material off the marker.

[0012] In some implementations, the side of the marker facing away from the substrate is a smooth surface.

[0013] In this implementation, by setting the side of the marker away from the substrate to be a smooth surface, the connection strength between the marker and the cured curable material can be reduced, thereby making it easier to peel the cured material off the marker.

[0014] In some implementations, an anti-connection coating is applied to the side of the identifier facing away from the substrate.

[0015] In this implementation, by providing an anti-connection coating on the side of the label that faces away from the substrate, the connection strength between the label and the cured curable material can be reduced, thereby making it easier to peel the cured material off the label.

[0016] In some implementations, the substrate includes a substrate body and a paint layer, the paint layer is disposed on one side of the substrate body along the thickness direction, and the side of the substrate body opposite to the paint layer forms a second side surface.

[0017] In this implementation, by setting the substrate to include a paint layer, it can have the functions of blocking the base color and providing basic protection. When the paint layer has a light-absorbing effect, it will increase the time required to cure the curable material on the substrate. Increasing the time is beneficial to hardening and embrittlement of the curable material on the marking, thereby facilitating the removal of the curable material on the marking.

[0018] In some implementations, the curing layer is a resin material.

[0019] In some implementations, the curing layer is transferred onto the substrate.

[0020] In this implementation, the thickness of the curable material on the sign is smaller when the curable material is cured. When the curable material is cured, the curable material on the sign is easier to harden and become brittle, making it easier to peel the curable material off the sign.

[0021] In some implementations, the thickness of the marking element is no greater than the thickness of the cured layer.

[0022] In this implementation, the thickness of the marker is set to be no greater than the thickness of the curing layer, that is, the side of the marker facing away from the substrate does not protrude from the curing layer, in order to prevent the marker from easily scratching the user and to prevent the marker from easily falling off under the action of external force.

[0023] A second aspect of this application provides a method for manufacturing a terminal structural component, comprising: Attach the identification components to the base plate; A curable material is applied to the side of the substrate where the identification element is attached and to the identification element itself. To perform a curing operation on curable materials; Remove any cured curable material from the signage.

[0024] In this application, by defining the connection of the logo to the substrate, and then providing a curable material on one side of the substrate where the logo is connected and on the logo, the curable material on the substrate is integrally connected with the sidewall of the logo along the thickness direction during curing. This not only improves the strength of the logo connection to the substrate but also avoids gaps between the logo and the wall of the receiving hole. Compared to the mounting grooves in the resin layer and the outer shell of related technologies, where the logo is placed in the mounting groove, the logo is prone to protruding from the resin layer due to errors in precision. The manufacturing method provided in this application, as long as the thickness of the curable material on the substrate is reasonably set, is less likely to result in the logo protruding from the curable material on the substrate on the side away from the substrate, resulting in a high product qualification rate. Compared to the mounting grooves in the resin layer and the outer shell of related technologies, where the logo is placed in the mounting groove, the logo is prone to protruding from the resin layer due to errors in precision. The adhesive on the logo and the main body of the outer shell is prone to overflow, but the manufacturing method provided in this application does not have this problem. Compared with the related technology, where the logo is placed in the mounting groove on the resin layer and the main body of the outer shell, the logo is prone to misalignment. In the manufacturing method provided in this application, the logo is first connected to the substrate, which facilitates precise connection of the logo to the substrate. Compared with the related technology, where the logo is placed in the mounting groove on the resin layer and the main body of the outer shell, the logo is prone to unevenness (e.g., one end of the logo may protrude from the resin layer and the other end may be recessed into the resin layer). In the manufacturing method provided in this application, the logo is first connected to the substrate, which facilitates a flat connection of the logo to the substrate. This results in a visual effect where the logo is completely embedded in the cured material surface of the substrate and is at the same height as the surface.

[0025] In some implementations, a curable material is provided on the side of the substrate connected to the marking element and on the marking element, including: A transfer printing process is used to apply a curable material to a substrate and a label, wherein the thickness of the curable material on the label is less than the thickness of the curable material on the substrate.

[0026] In this implementation, a transfer process is used to set the curable material on the substrate and the marking component. The curable material on the marking component is thin, and when the curable material is cured, the curable material on the marking component is easier to harden and become brittle, thus making it easier to peel off the curable material on the marking component.

[0027] In some implementations, a curable material is provided on the side of the substrate connected to the marking element and on the marking element, including: Curable materials are applied to the substrate and markings using a spraying method.

[0028] In this implementation, by limiting the curable material to be applied to the substrate and the marking component by spraying, more options are provided for applying the curable material to the substrate and the marking component.

[0029] In some implementations, the curing process is performed on the curable material, including: Curing can be achieved by light curing or baking curing.

[0030] In this implementation, by limiting the use of light curing or baking curing, it is indicated that the curable material provided in the embodiments of this application is not limited to light-curable materials or thermosetting materials, and appropriate materials can be selected according to the actual situation.

[0031] In some implementations, the curable material that has been cured on the marking element is removed, including: The curable material that has been cured on the signage is removed by adhesive peeling.

[0032] In this implementation, the cured curable material on the sign is removed by adhesive peeling. This method is not only simple to operate, but also facilitates the better removal of the cured curable material from the sign.

[0033] In some implementations, laser engraving is used to scan the curable material along the edge of the marking before adhesive removal.

[0034] In this implementation, laser engraving is used to scan the edge of the sign to cut off the curable material on the sign and the curable material on the substrate. This makes it easier to remove the curable material on the sign by adhesive, reducing the number of times the adhesive can be removed. It also makes it easier to ensure that the curable material on the substrate is flat near the edge of the sign when the curable material on the sign is removed by adhesive.

[0035] In some implementations, an anti-attachment coating is applied to the side of the identifier facing away from the substrate before it is attached to the substrate.

[0036] In this implementation, by providing an anti-connection coating on the side of the label that is away from the substrate, the connection strength between the label and the cured curable material can be reduced, thereby making it easier to peel the cured material off the label.

[0037] In some implementations, the side of the identifier facing away from the substrate is processed before it is attached to the substrate to improve the surface smoothness of that side.

[0038] In this implementation, by processing the side of the label that is away from the substrate to improve the surface smoothness, the connection strength between the label and the cured curable material can be reduced, thereby making it easier to peel the cured material off the label.

[0039] A third aspect of this application provides a terminal device, including a terminal structural component as provided in any of the above technical solutions.

[0040] Since the terminal device includes the aforementioned terminal structural components, it possesses at least all the beneficial effects of the terminal structural components, which will not be elaborated further here. Attached Figure Description

[0041] Figure 1 This is a partial cross-sectional view of the casing of a terminal device in the related technology. Figure 1 ; Figure 2 This is a partial cross-sectional view of the casing of a terminal device in the related technology. Figure 2 ; Figure 3 Partial cross-sectional view of terminal structural components provided in some embodiments of this application Figure 1 ; Figure 4 Partial cross-sectional view of terminal structural components provided in some embodiments of this application Figure 2 ; Figure 5 Partial cross-sectional schematic diagram of a substrate provided in some embodiments of this application; Figure 6A partial cross-sectional schematic diagram of transferring a curable material onto a substrate with markings, provided in some embodiments of this application; Figure 7 This is a partial cross-sectional schematic diagram of spraying a curable material onto a substrate with markings, provided in some embodiments of this application. Figure 8 A partial cross-sectional schematic diagram of a terminal structure for curing a curable material by means of light, provided for some embodiments of this application; Figure 9 Partial cross-sectional view of terminal structural components provided in some embodiments of this application Figure 3 ; Figure 10 A partial top view of the housing provided for some embodiments of this application; Figure 11 A flowchart illustrating a method for manufacturing a terminal structure component provided in some embodiments of this application; Figure 12 Partial cross-sectional view of the removal of cured curable material from the marking element provided in some embodiments of this application. Figure 1 ; Figure 13 Partial cross-sectional view of the removal of cured curable material from the marking element provided in some embodiments of this application. Figure 2 ; Figure 14 A partial cross-sectional schematic diagram of a curable material that is laser-engraved and cured along the edge of a marker according to some embodiments of this application; Figure 15 for Figure 14 A magnified view of a portion of point A in the middle.

[0042] The meanings of the various symbols in the attached icons are as follows: 10. Outer casing; 11. Outer shell; 12. Resin layer; 13. Logo / identification parts; 14. Mounting slot; 111. Reinforcing part; 112. Adjustment hole; 20. Terminal structural components; 21. Substrate; 22. Curing layer; 23. Identification element; 24. Anti-bonding coating; 211. First side surface; 212. Second side surface; 213. Substrate body; 214. Paint layer; 215. Adjustment hole; 221. Receiving hole; 231. Inner edge of the sign; 232. Outer edge of the sign; 233. Rounded corners; 30. Curable material transfer layer; 40. Curable material spray coating; 41. Protruding tip; 50. Removed part; 51. Adhesive layer; 60. Nozzle; 70. Laser beam. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings. The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0044] In the description of this application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0045] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.

[0046] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] In this application, "and / or" is merely a way of describing the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0048] It should be noted that, in this application, the words "in one embodiment," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in one embodiment," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "in one embodiment," "exemplarily," and "for example" is intended to present the relevant concepts in a specific manner.

[0049] It should be noted that the technical features of the above embodiments in this application can be combined arbitrarily without conflict. For the sake of brevity, this specification does not describe all possible combinations, but as long as these combinations do not violate the technical spirit of this application, they should all be considered within the scope of this application. Based on the content disclosed in this application, those skilled in the art can reasonably combine, delete, or replace the technical features of the above embodiments according to actual needs, and these modifications and variations all fall within the protection scope of this application.

[0050] It should be noted that before describing the terminal structure, manufacturing method and terminal device provided in the embodiments of this application, the relevant technologies will be described first.

[0051] Please see Figures 1-2 , Figure 1 This is a partial cross-sectional view of the casing 10 of a terminal device in the related art. Figure 1 , Figure 2 This is a partial cross-sectional view of the casing 10 of a terminal device in the related art. Figure 2 Understandably, Figure 1 and Figure 2 The cross-sectional direction is the thickness direction of the outer shell 10.

[0052] A logo identifier 13 is typically provided on the casing 10 of the terminal device. For details, please refer to [link / reference]. Figure 1 The outer shell 10 includes an outer shell body 11 and a resin layer 12 disposed on the outer shell body 11. It can be understood that when manufacturing the outer shell 10, the resin material is first disposed on one side of the outer shell body 11 along the thickness direction, and then the resin material is cured to form the resin layer 12. The mounting groove 14 is machined on the resin layer 12 and the outer shell body 11 by CNC machining. The shape of the mounting groove 14 matches the shape of the LOGO identification part 13. The LOGO identification part 13 is disposed in the mounting groove 14 and is attached to the outer shell body 11 by adhesive.

[0053] Please see Figure 1An adjustment hole 112 is also provided on the outer shell body 11. One end of the adjustment hole 112 is connected to the bottom surface of the mounting groove 14. When the LOGO label 13 is placed in the mounting groove 14, the position of the LOGO label 13 may be off. At this time, the adjustment piece can be inserted into the adjustment hole 112 to finely adjust the position of the LOGO label 13.

[0054] Because CNC machining is required to process grooves on the resin layer 12 and the outer shell 11 when connecting the logo identification part 13, the production efficiency is low and the production cost is high. In addition, the logo identification part 13 is usually irregular in shape, which increases the difficulty of CNC machining and requires high machining accuracy.

[0055] Additionally, please compare. Figure 1 and Figure 2 , Figure 2 A reinforcing part 111 is provided on the side of the inner outer shell 11 that is away from the logo part 13. Figure 1 The outer shell 11 does not have a reinforcing part 111 on the side facing away from the logo 13. Figure 1 As shown, when the reinforcing part 111 is not provided on the side of the outer shell 11 away from the logo part 13, the thickness of the area where the mounting groove 14 is provided on the outer shell 11 will be thin, which will affect the strength of the outer shell 11; when... Figure 2 When a reinforcing part 111 is provided on the side of the outer shell 11 away from the logo identification part 13, the reinforcing part 111 is located inside the terminal device, which will occupy the internal space of the terminal device and is not conducive to the thinning design of the terminal device.

[0056] Based on the above problems, this application provides a terminal structural component, a manufacturing method, and a terminal device. The terminal structural component will be mainly described below with reference to the accompanying drawings.

[0057] Please see Figure 3 , Figure 3 This is a partial cross-sectional schematic diagram of the terminal structure 20 provided in some embodiments of this application. It can be understood that... Figure 3 The cross-sectional direction is the thickness direction of the terminal structural member 20.

[0058] Regarding the terminal structure component 20, it can be understood that the terminal structure component 20 is a housing for the terminal device with the identification component 23. The terminal device may also be referred to as a mobile device, electronic device, mobile terminal, or terminal. Terminal devices include, but are not limited to, cellphones, notebook computers, tablet computers, laptop computers, personal digital assistants, wearable devices, etc.

[0059] Please see Figure 3 The terminal structure 20 provided in this application embodiment includes a substrate 21, a curing layer 22, and an identification element 23.

[0060] As for the substrate 21, it can be understood that the substrate 21 is the rigid support body of the terminal structure 20, and is the basic carrier of the curing layer 22 and the identification component 23. The substrate 21 has a certain strength to protect the components inside the terminal device.

[0061] For the cured layer 22, a curable material on the substrate 21 can be cured (e.g., photocuring or baking) to solidify the material and form the cured layer 22. The cured layer 22 primarily serves a decorative function, but also provides protection. The cured layer 22 is disposed on one side of the substrate 21 along its thickness direction. For details, please refer to [link to documentation]. Figure 3 The substrate 21 includes a first side surface 211 and a second side surface 212 disposed opposite to each other along the thickness direction, and the curing layer 22 is disposed on the first side surface 211.

[0062] The signage component 23 is a separately prefabricated decorative functional part, which may include graphics, Chinese characters, numbers, or letters. The signage component 23 is embedded in the cured layer 22. For details, please refer to [link to documentation]. Figure 3 The cured layer 22 has a receiving hole 221, one end of which extends to the side of the substrate 21 away from the first side surface 211. The shape of the receiving hole 221 matches the shape of the identifier 23, and the identifier 23 is disposed within the receiving hole 221. It is understood that in the terminal structure 20 provided in this embodiment, the identifier 23 is not embedded in the substrate 21, but is only embedded in the cured layer 22.

[0063] Given that the shape of the receiving hole 221 matches the shape of the marking element 23, it can be understood that the shape of the receiving hole 221 is the same as the shape of the marking element 23.

[0064] Regarding the formation of the receiving hole 221 on the cured layer 22, in some examples, the identifier 23 can be first disposed on the first side 211 of the substrate 21, and then the curable material can be disposed on the first side 211 of the substrate 21 and the identifier 23, the curable material on the substrate 21 and the identifier 23 can be cured, and then the cured curable material on the identifier 23 can be removed, the curable material on the substrate 21 can form the cured layer 22, and the receiving hole 221 on the cured layer 22 can be formed at the location of the identifier 23; or, in other examples, the identifier 23 can be first disposed on the first side 211 of the substrate 21, and then the curable material can be disposed on the first side 211 of the substrate 21 (i.e., the curable material is not disposed on the identifier 23), the curable material on the substrate 21 can be cured, the curable material on the substrate 21 can form the cured layer 22, and the receiving hole 221 on the cured layer 22 can be formed at the location of the identifier 23. For example, in some specific implementations, the marker 23 can be first placed on the first side 211 of the substrate 21. Then, a retractable mechanism is used to adsorb an auxiliary component of the same shape as the marker 23 and press it onto the marker 23. This ensures that when a curable material is applied to the substrate 21, the curable material adheres to both the substrate 21 and the auxiliary component. Then, the retractable mechanism is used to lift the auxiliary component, resulting in the presence of curable material on the substrate 21 while the marker 23 is not. It is understandable that this implementation is relatively complex, requires high precision, and has relatively low practical feasibility. Therefore, it is preferable to apply the curable material to both the substrate 21 and the marker 23 simultaneously, and then remove the cured curable material from the marker 23.

[0065] Regarding the formation of the receiving hole 221 on the cured layer 22, some examples above describe first attaching the identifier 23 to the substrate 21 and then setting the curable material. In other examples, the curable material can be set on the substrate 21 first, that is, the cured layer 22 is formed on the substrate 21 first, and then the identifier 23 is set on the receiving hole 221 on the cured layer 22.

[0066] When the curable layer 22 is first formed on the substrate 21, in some examples, a curable material can be transferred onto the substrate 21 by transfer printing. Receiving holes 221 are formed on the curable material transferred onto the substrate 21. The curable material is then cured on the substrate 21 to form the curable layer 22. The marking element 23 is then disposed within the receiving holes 221 on the curable layer 22. Regarding the aforementioned transfer printing, the transfer printing process is generally a printing technique that transfers a pattern or texture to the surface of a product through an intermediate carrier.

[0067] When the curable layer 22 is first formed on the substrate 21, in some other examples, the curable material can be applied to the substrate 21 by spraying, and the area where the identifier 23 is mounted is not sprayed with the curable material. The curable material cured on the substrate 21 forms the curable layer 22, and then the identifier 23 is placed in the receiving hole 221 on the curable layer 22. For example, in some specific implementations, an auxiliary component with the same shape and size as the identifier 23 is adsorbed using a telescopic mechanism and pressed onto the substrate 21. Curable material is applied to the substrate 21 and the auxiliary component, and then the telescopic mechanism is used to lift the auxiliary component, so that the curable material forms the receiving hole 221. The curable material cured on the substrate 21 forms the curable layer 22, and then the identifier 23 is placed in the receiving hole 221 on the curable layer 22.

[0068] When the curable layer 22 is first formed on the substrate 21, in some other examples, the curable material can be set on the substrate 21 by transfer or spraying. The curable material on the substrate 21 is cured, and a receiving hole 221 is machined on the cured curable material by CNC machining. Then, the marking member 23 is set in the receiving hole 221.

[0069] The terminal structural component 20 provided in this application embodiment has a accommodating hole 221 on the cured layer 22 and an identifier 23 disposed in the accommodating hole 221. This eliminates the need to provide a slot on the substrate 21 to cooperate with the identifier 23. Since the cured layer 22 is a cured film layer, the accommodating hole 221 on the cured layer 22 is not limited to CNC machining. Other simpler methods can be used to form the accommodating hole 221 on the cured layer 22, simplifying the manufacturing of the terminal structural component 20. In addition, since there is no need to provide a slot on the substrate 21 to cooperate with the identifier 23, the strength of the substrate 21 will not be affected by the slot. There is also no need to provide a thickened area on the substrate 21 to avoid the slot affecting the strength of the substrate 21. This avoids the thickened area occupying the internal space of the terminal device, which is not conducive to the thinning design of the terminal device.

[0070] In some embodiments, see Figure 3 The other end of the receiving hole 221 is opened to the side where the cured layer 22 is connected to the first side 211, and the marking element 23 is connected to the substrate 21.

[0071] For example, in some specific implementations, the identifier 23 is first connected to the substrate 21, and then the curing layer 22 is provided on the substrate 21. In this way, the other end of the receiving hole 221 can be opened to the side where the curing layer 22 is connected to the first side 211.

[0072] It is worth noting that, in the method of first connecting the marker 23 to the substrate 21 and then setting the curable material for forming the curing layer 22 on the substrate 21, when curing the curable material, it is easy to achieve that the cured layer 22 and the side wall of the marker 23 are connected as one piece along the thickness direction. In this way, not only is it beneficial to improve the strength of the marker 23 connected to the substrate 21, but it can also avoid the gap between the marker 23 and the hole wall of the receiving hole 221.

[0073] In some other implementations, the other end of the receiving hole 221 is opened to the side where the cured layer 22 connects to the first side surface 211. The curable material can be transferred or sprayed onto the substrate 21, and the receiving hole 221 is machined into the cured material using CNC machining. The machined receiving hole 221 connects the side where the cured layer 22 connects to the first side surface 211. However, this implementation requires high precision in CNC machining.

[0074] Regarding the connection of the identification element 23 to the substrate 21, in some embodiments, the identification element 23 may be bonded to the substrate 21. It is understood that the bonding method is simple to operate and does not affect the appearance of the identification element 23 and the terminal structure 20.

[0075] It is worth noting that when the label 23 is pasted onto the substrate 21, the position on the substrate 21 where the label 23 is pasted and the side of the label 23 that is connected to the substrate 21 can be wiped to remove dust and other contaminants from the surface, so as to prevent affecting the stability of the label 23 connected to the substrate 21.

[0076] For the adhesive material, a suitable adhesive can be selected according to the material of the label 23 and the substrate 21 to ensure that the label 23 is stably fixed on the substrate 21. When attaching the label 23 to the substrate 21, the adhesive can be applied or pasted onto the label 23, and then the label 23 can be attached to the substrate 21.

[0077] In some specific implementations, the label 23 is precisely pasted onto the substrate 21. First, a positioning fixture is used to precisely limit and fix the substrate 21. The label 23 can be adsorbed onto a retractable mechanism. The retractable mechanism drives the label 23 to be pressed down at a constant speed to the preset pasting area of ​​the substrate 21. The preset pressing time is maintained so that the label 23 is tightly attached to the substrate 21, completing the automatic pasting operation and achieving precise pasting of the label 23 onto the substrate 21.

[0078] Please see Figure 4 , Figure 4This is a partial cross-sectional schematic diagram of the terminal structure 20 provided in some embodiments of this application. It can be understood that... Figure 4 The cross-sectional direction is the thickness direction of the terminal structural member 20.

[0079] It should be noted that some embodiments described above show that the other end of the receiving hole 221 is opened to the side where the cured layer 22 connects to the first side surface 211. In other embodiments, please refer to [the relevant documentation]. Figure 4 The receiving hole 221 can be configured as a groove structure, that is, the other end of the receiving hole 221 is not opened to the side where the curing layer 22 is connected to the first side 211, and the marking element 23 is connected to the curing layer 22.

[0080] In some specific implementations, the curable material can be transferred onto the substrate 21 by transfer printing, and a receiving hole 221 is formed on the curable material transferred onto the substrate 21. The receiving hole 221 has a groove structure, and the curable material cured on the substrate 21 forms a cured layer 22. Then, the identification element 23 is placed in the receiving hole 221 on the cured layer 22. Alternatively, in some other specific implementations, the curable material can be placed on the substrate 21 by transfer printing or spraying, and the curable material on the substrate 21 is cured. The receiving hole 221 is machined on the cured curable material by CNC machining. The other end of the machined receiving hole 221 is not opened to the side where the cured layer 22 is connected to the first side 211. Then, the identification element 23 is connected to the cured layer 22.

[0081] In some embodiments, the identification element 23 may be attached to the curing layer 22.

[0082] It is worth noting that when the label 23 is pasted onto the curing layer 22, the position on the curing layer 22 where the label 23 is pasted and the side of the label 23 that is connected to the curing layer 22 can be wiped to remove dust and other contaminants from the surface, so as to prevent affecting the stability of the label 23 on the curing layer 22.

[0083] For the adhesive material, a suitable adhesive can be selected based on the materials of the identification element 23 and the cured layer 22 to ensure that the identification element 23 is stably fixed to the cured layer 22. When attaching the identification element 23 to the cured layer 22, the adhesive can be applied or pasted onto the identification element 23, and then the identification element 23 can be attached to the cured layer 22; alternatively, adhesive can be first applied to the receiving holes 221 on the cured layer 22, and then the identification element 23 can be attached to the cured layer 22. In some specific operations, the identification element 23 can be attached to the cured layer 22 manually.

[0084] It is understandable that, in order to accurately position the marker 23 at the corresponding position on the substrate 21, it is necessary to accurately position the receiving hole 221 relative to the substrate 21.

[0085] When a curing layer 22 is first formed on substrate 21 and then the identification element 23 is attached, in some embodiments, please refer to Figure 4 An adjustment hole 215 is provided on the substrate 21. The adjustment hole 215 connects the two sides of the substrate 21 along the thickness direction. That is, the two ends of the adjustment hole 215 are respectively provided on the first side 211 and the second side 212 of the substrate 21. The marking member 23 covers the adjustment hole 215.

[0086] It is understandable that when the marker 23 is placed in the receiving hole 221, the marker 23 may be misaligned. In this case, the adjusting member can be inserted into the adjusting hole 215 to finely adjust the position of the marker 23.

[0087] Please see Figure 4 When one end of the receiving hole 221 is not opened to the side where the curing layer 22 is connected to the first side 211, when the adjusting member is inserted into the adjusting hole 215, the adjusting member can pass through the part of the curing layer 22 located below the marking member 23 so that the adjusting member can contact the marking member 23 and finely adjust the position of the marking member 23.

[0088] The number of adjustment holes 215 on the substrate 21 can be reasonably set according to the shape of the marking element 23, etc.

[0089] Regarding the material of the identification element 23, in some embodiments, the material of the identification element 23 may be a metallic material, or in other embodiments, the material of the identification element 23 may be a non-metallic material.

[0090] When the material of the identification element 23 is a metal material, in some examples, the identification element 23 can be set as a nickel sheet, an aluminum alloy sheet, or a zinc alloy sheet, etc.

[0091] When the material of the identification element 23 is a non-metallic material, in some examples, the identification element 23 can be set to engineering plastic or acrylic material, etc.

[0092] It should be noted that the preferred material for the identification component 23 is metal, which gives the identification component 23 a metallic luster and helps to improve the aesthetics of the terminal structural component 20.

[0093] Additionally, it should be noted that, since the identification element 23 in this embodiment is disposed in the receiving hole 221 of the cured layer 22, compared with the identification element in the related technology which is simultaneously embedded in the resin layer 12 and the outer shell body 11, the thickness of the identification element 23 in this embodiment is relatively thinner. When the material of the identification element 23 is a metal material, there are more choices for the specific material of the identification element 23 to meet certain strength requirements.

[0094] Regarding the material of the curing layer 22, in some embodiments, the material of the curing layer 22 may be a resin material, wherein the resin is an organic polymer that can be liquid, solid, or semi-solid at room temperature and can be cured and shaped by cooling or exposure to light.

[0095] In some examples, the material of the curing layer 22 can be a photocurable resin, wherein the photocurable resin (also known as UV resin) is a liquid acrylic polymer resin containing photosensitive groups. A photoinitiator is added to the system, and a photocrosslinking reaction occurs rapidly under ultraviolet light irradiation, changing from liquid to solid within a few seconds. Alternatively, in other examples, the material of the curing layer 22 can be a thermosetting resin, which relies on high-temperature baking to undergo a chemical reaction and crosslinking to achieve shaping and curing.

[0096] In some examples, the material of the curing layer 22 can be set to surface texture UV resin. Surface texture UV resin is a photocurable acrylic resin used for NIL transfer to replicate various surface textures. NIL stands for NanoimprintLithography. NIL transfer process is a high-precision processing technology that relies on mechanical replication to achieve the transfer of micro and nano patterns.

[0097] Please see Figure 5 , Figure 5 This is a partial cross-sectional schematic diagram of the substrate 21 provided in some embodiments of this application. It can be understood that... Figure 5 The cross-sectional direction is the thickness direction of the substrate 21.

[0098] In some embodiments, see Figure 5 The substrate 21 includes a substrate body 213 and a paint layer 214. The paint layer 214 is disposed on one side of the substrate body 213 along the thickness direction. A second side surface 212 is formed on the side of the substrate body 213 opposite to the paint layer 214, and a first side surface 211 is formed on the side of the paint layer 214 opposite to the substrate body 213.

[0099] Regarding the substrate body 213, the substrate body 213 is the rigid support body of the terminal structure 20. In some examples, the substrate body 213 can be made of metal material, or in other examples, the substrate body 213 can be made of non-metallic material.

[0100] When the substrate body 213 is a non-metallic material, in some examples, the material of the substrate body 213 includes resin and reinforcing materials. The resin can be PA (Polyamide, nylon), PBT (Polybutylene Terephthalate), PPS (Polyphenylene Sulfide), PEEK (Poly(Ether-Ether-Ketone)), or PC (Polycarbonate), etc. The reinforcing material can be glass fiber (GF) or carbon fiber (CF), etc. The role of the reinforcing material is to enhance the strength of the substrate body 213. It is understood that any material added to the resin that can increase strength can be used as a reinforcing material. When the substrate body 213 is a non-metallic material, in other examples, in addition to the resin with added reinforcing materials, the substrate body 213 also includes a transparent plastic material, which can be PC (Polycarbonate) or PMMA (Polymethyl Methacrylate).

[0101] When the substrate body 213 is made of metal, in some examples, the material of the substrate body 213 may be set to aluminum alloy or stainless steel, etc.

[0102] Regarding the paint layer 214, the paint layer 214 serves to mask the base color and provide basic protection. In some examples, the paint layer 214 can be set as PU (Polyurethane) paint or UV paint. PU paint relies on low-temperature baking or room-temperature air drying for curing, while UV paint is a coating that can rapidly cure into a film within seconds under ultraviolet light.

[0103] In some examples, the paint layer 214 may be set to at least one layer, that is, the number of paint layers 214 may be set to one. Alternatively, in other examples, the number of paint layers 214 may be set to more than one, and each paint layer 214 may be set sequentially along the thickness direction of the substrate body 213.

[0104] In some examples, the substrate 21 may also include an indium plating layer. For example, the indium plating layer may be disposed between the substrate body 213 and the paint layer 214. The indium plating layer can be formed by plating indium on the surface of the substrate body 213 using the NCVM (Non-conductive vacuum metallization) process to improve corrosion resistance and appearance.

[0105] It should be noted that the substrate 21 provided in some of the above embodiments includes a substrate body 213 and a paint layer 214. In other embodiments, the substrate 21 may be configured to include only the substrate body 213 and not the paint layer 214, and a curing layer 22 may be provided on the substrate body 213.

[0106] It should be noted that when the identifier 23 is first set on the substrate 21 and then the curable material is set on the substrate 21 and the identifier 23, it is beneficial to improve the strength of the identifier 23 connected to the substrate 21. At the same time, it can also avoid the gap between the identifier 23 and the hole wall of the receiving hole 221. Therefore, the following mainly takes the example of first setting the identifier 23 on the substrate 21 and then setting the curable material on the substrate 21 and the identifier 23 to further describe the terminal structure 20 provided in the embodiments of this application.

[0107] Please see Figure 6 , Figure 6 This is a partial cross-sectional schematic diagram of transferring a curable material onto a substrate 21 provided with an identifier 23, as provided in some embodiments of this application.

[0108] First, the identification element 23 is fixed onto the substrate 21. Then, a curable material is transferred onto the substrate 21 using a transfer method, such as NIL transfer printing. When using NIL transfer printing to transfer the curable material onto the substrate 21, it is inevitable that the curable material will also be transferred onto the identification element 23. Please refer to [link to relevant documentation]. Figure 6 This illustrates a curable material transfer layer 30 formed by curable material transferred onto substrate 21 and identifier 23. The thickness of the curable material on substrate 21 is H1, and the thickness of the curable material on identifier 23 is H2, wherein H1 is greater than H2.

[0109] After the curable material is applied to the substrate 21 and the marking element 23 using the NIL transfer process, the curable material is then cured. If the curable material is a UV-curable resin, it is cured by ultraviolet light irradiation; if it is a thermosetting resin, it is cured by high-temperature drying. Once the curable material has cured, the cured material on the marking element 23 is removed. Please refer to [link to relevant documentation]. Figure 5 Since the thickness H2 of the curable material on the label 23 is less than the thickness H1 of the curable material on the substrate 21, the curable material on the label 23 is more easily cured when the curable material is cured.

[0110] Please see Figure 7 , Figure 7 This is a partial cross-sectional view of a substrate 21 with a marker 23 being sprayed with a curable material, provided for some embodiments of this application.

[0111] First, fix the label 23 onto the substrate 21. Then, spray the curable material onto the substrate 21 and the label 23 using a spraying method. Please refer to [link to relevant documentation]. Figure 7 This illustrates a curable material coating layer 40 formed by spraying curable material onto the substrate 21 and the marking element 23. Please refer to [link / reference]. Figure 7 , Figure 7 The diagram shows that the thickness of the curable material on substrate 21 is H1, and the thickness of the curable material on marker 23 is H3. Since the spraying is uniform, H1 and H3 are basically the same size.

[0112] After the curable material is sprayed onto the substrate 21 and the marking element 23, the curable material is then cured. If the curable material is a UV-curable resin, it is cured by ultraviolet light irradiation; if the curable material is a thermosetting resin, it is cured by high-temperature drying. Once the curable material has cured, the cured material on the marking element 23 is removed.

[0113] Understandably, compared to spraying, the curable material on the sign 23 is thinner when the transfer method is used. Therefore, the curable material on the sign 23 is more likely to harden and become brittle when the curable material is cured, making it easier to peel off the curable material on the sign 23.

[0114] Please see Figure 8 , Figure 8 This is a partial cross-sectional schematic diagram of a terminal structure 20 for curing a curable material using light, as provided in some embodiments of this application. Please refer to... Figure 8 , Figure 8 The arrow in the image indicates ultraviolet light irradiating the curable material.

[0115] To further harden and embrittle the curable material on the sign 23, making it easier to remove the cured material from the sign 23, the following methods can be used: (1) The material of the identification component 23 is metal.

[0116] Please see Figure 8 Because the metal material has a reflective effect, when ultraviolet light shines on the curable material on the sign 23, the ultraviolet light passes through the curable material on the sign 23 and shines on the sign 23. The sign 23 reflects the ultraviolet light, and the reflected ultraviolet light passes through the curable material and is emitted, so that the curable material on the sign 23 is irradiated twice, which is beneficial to the hardening and embrittlement of the curable material on the sign 23.

[0117] (2) Select a substrate 21 with light absorption function.

[0118] Please see Figure 8 When ultraviolet light irradiates the curable material on substrate 21, the ultraviolet light passes through the curable material on substrate 21 and is absorbed by substrate 21 due to its light-absorbing properties. By setting substrate 21 to have a light-absorbing function, compared to using a reflective substrate 21, the curing time for the curable material on substrate 21 is increased. This increased time is beneficial for hardening and embrittlement of the curable material on the marking element 23. For a light-absorbing substrate 21, in some examples, the paint layer 214 on substrate 21 can be set to a dark-colored paint with light-absorbing properties.

[0119] (3) Increase the curing time of the curable material on the curing mark 23 and the substrate 21.

[0120] For the curable material on substrate 21, the UV curing time is within a range, such as T1 to T2, when the degree of curing meets the requirements. Therefore, while ensuring that the degree of curing of the curable material on substrate 21 meets the requirements, the curing time of the marking component 23 and the curable material on substrate 21 can be increased as much as possible, which is beneficial for the curable material on marking component 23 to harden and become brittle.

[0121] (4) Increase the curing time of the curable material on the curing mark 23.

[0122] When curing the curable materials on the substrate 21 and the marking element 23, the curing time of the curable material on the substrate 21 can be set to be less than the curing time of the curable material on the marking element 23. Specifically, the curable materials on the substrate 21 and the marking element 23 can be cured simultaneously. After the curable material on the substrate 21 is cured, the curable material on the marking element 23 is further cured by ultraviolet light irradiation, so that the curing time of the curable material on the substrate 21 is less than the curing time of the curable material on the marking element 23, which is beneficial to the hardening and embrittlement of the curable material on the marking element 23.

[0123] It should be noted that some embodiments described above further harden and embrittle the curable material on the label 23 so as to facilitate the removal of the cured curable material on the label 23. In other embodiments, the bonding force between the label 23 and the curable material can also be minimized so that the cured curable material on the label 23 can be easily removed.

[0124] Please see Figure 9 , Figure 9 This is a partial cross-sectional schematic diagram of a terminal structure 20 provided in some embodiments of this application.

[0125] In some embodiments, see Figure 9An anti-connection coating 24 is provided on the side of the identification element 23 facing away from the substrate 21.

[0126] In some examples, the anti-fingerprint coating 24 can be set as an AF layer (Anti-Fingerprint Coating). Typically, the AF layer is a transparent, ultra-thin fluorinated functional film with a thickness of only 8 to 30 nm. Its main components are perfluoropolyether and fluorosilane. It achieves the lotus leaf effect by relying on extremely low surface energy. Its core function is to be hydrophobic and oleophobic, and to reduce the adhesion of fingerprint oil stains.

[0127] The anti-connection coating 24 on the marking component 23 can be formed by electroplating or spraying.

[0128] When a mark 23 is provided on a substrate 21, and then a curable material is provided on the substrate 21 and the mark 23, the curable material on the mark 23 is located on the anti-connection coating 24. When the curable material on the mark 23 is removed, the curable material cured on the anti-connection coating 24 can be removed.

[0129] In this embodiment, by providing an anti-connection coating 24 on the side of the marker 23 away from the substrate 21, the connection strength between the marker 23 and the cured curable material can be reduced, thereby making it easier to peel off the curable material on the marker 23.

[0130] It should be noted that some embodiments described above describe that the anti-connection coating 24 is provided on the side of the identifier 23 away from the substrate 21. In other embodiments, the side of the identifier 23 away from the substrate 21 may be a smooth surface.

[0131] This can be understood as meaning that it is not necessary to provide an anti-connection coating 24 on the marking element 23. Instead, the side of the marking element 23 facing away from the substrate 21 can be made into a smooth surface. Specifically, the surface roughness of the side of the marking element 23 facing away from the substrate 21 can be reduced to make the side of the marking element 23 facing away from the substrate 21 form a smooth surface.

[0132] In this embodiment, by setting the side of the marker 23 away from the substrate 21 to be a smooth surface, the connection strength between the marker 23 and the cured curable material can be reduced, thereby making it easier to peel the curable material off the marker 23.

[0133] In some embodiments, the thickness of the marker 23 is not greater than the thickness of the cured layer 22.

[0134] In some examples, the thickness of the marker 23 can be set to 0.02mm to 0.05mm, for example, the thickness of the marker 23 can be set to 0.035mm, and the thickness of the cured layer 22 is not less than 0.035mm.

[0135] In this embodiment, the thickness of the marker 23 is set to be no greater than the thickness of the curing layer 22, so that the side of the marker 23 facing away from the substrate 21 does not protrude from the curing layer 22, thereby preventing the marker 23 from easily scratching the user and preventing the marker 23 from easily falling off under the action of external force.

[0136] In some embodiments, see Figure 9 The edge of the marker 23 facing away from the substrate 21 is provided with a rounded corner 233.

[0137] In this embodiment of the application, the edge of the marker 23 is provided with a rounded corner 233 to prevent the edge of the marker 23 from easily scratching the user.

[0138] It should be noted that when the anti-connection coating 24 is provided on the marking component 23, the anti-connection coating 24 is also provided on the arc surface corresponding to the rounded corner 233.

[0139] Please see Figure 10 , Figure 10 This is a partial top view of the terminal structure 20 provided in some embodiments of this application. It should be noted that... Figure 10 The shape of the identifier 23 is represented by simple letters.

[0140] Regarding the edge of the identifier 23, please refer to... Figure 10 The edge of the sign 23 includes an inner edge 231 and an outer edge 232. The outer edge 232 is the edge of the outer contour of the sign 23, and the inner edge 231 is the edge of the inner contour of the sign 23. Both the inner edge 231 and the outer edge 232 are provided with rounded corners 233.

[0141] Please see Figure 11 , Figure 11 This is a flowchart illustrating a method for manufacturing a terminal structure 20 according to some embodiments of this application. The method for manufacturing a terminal structure 20 according to some embodiments of this application is described below with reference to the accompanying drawings.

[0142] This application provides a method for manufacturing a terminal structural component 20, including: The identification element 23 is attached to the substrate 21; A curable material is provided on one side of the substrate 21 where the identification element 23 is connected and on the identification element 23; To perform a curing operation on curable materials; Remove the cured curable material from the label 23.

[0143] To connect the label 23 to the substrate 21, the label 23 can be pasted onto the substrate 21. In some specific operations, the substrate 21 is first precisely positioned and fixed using a positioning fixture. The label 23 can be adsorbed onto the telescopic mechanism. The telescopic mechanism drives the label 23 to be pressed down at a constant speed to the preset pasting area of ​​the substrate 21. The preset pressing time is maintained so that the label 23 is tightly attached to the substrate 21. While completing the automatic pasting operation, the label 23 is accurately pasted onto the substrate 21.

[0144] When a curable material is provided on the side of the substrate 21 connected to the sign 23 and on the sign 23, it is preferable that the thickness of the curable material on the substrate 21 is not less than the thickness of the sign 23. That is, it can be understood that the curable material cured on the substrate 21 forms the curing layer 22 described in the above embodiment. It is preferable that the side of the sign 23 away from the substrate 21 does not protrude from the curing layer 22, so as to prevent the sign 23 from easily scratching the user and to prevent the sign 23 from easily falling off under the action of external force.

[0145] In this embodiment, by defining the connection of the logo 23 to the substrate 21, and then providing a curable material on one side of the substrate 21 where the logo 23 is connected and on the logo 23, the curable material cured on the substrate 21 is integrally connected to the sidewall of the logo 23 along the thickness direction during curing. This not only improves the strength of the logo 23 connected to the substrate 21, but also avoids gaps between the logo 23 and the hole wall of the receiving hole 221. Furthermore, compared to the related technologies where the mounting groove 14 on the resin layer 12 and the outer shell 11 is prone to protrusion of the logo 23 from the resin layer 12 due to errors in precision, the manufacturing method provided in this embodiment, as long as the thickness of the curable material on the substrate 21 is reasonably set, is less likely to result in the logo 23 protruding from the curable material on the substrate 21 on the side away from the substrate 21, resulting in a high product qualification rate. Compared to the related technologies where the mounting groove 14 on the resin layer 12 and the outer shell 11 is prone to connection issues, this method avoids the situation where the logo 23 protrudes from the curable material on the substrate 21 on the side away from the substrate 21. The adhesive on the GO logo 13 and the outer shell 11 is prone to overflow. However, the manufacturing method provided in this application does not have this problem. Compared to the related technologies where the LOGO logo 13 is placed in the mounting groove 14 on the resin layer 12 and the outer shell 11, which is prone to misalignment of the LOGO logo 13, the manufacturing method provided in this application first connects the logo 23 to the substrate 21, which facilitates the precise connection of the logo 23 to the substrate 21. Compared to the related technologies where the LOGO logo 13 is placed in the mounting groove 14 on the resin layer 12 and the outer shell 11, which is prone to unevenness of the LOGO logo 13 (e.g., one end of the LOGO logo 13 may protrude from the resin layer 12 and the other end may be recessed into the resin layer 12), the manufacturing method provided in this application first connects the logo 23 to the substrate 21, which facilitates the flat connection of the logo 23 to the substrate 21, resulting in a visual effect where the logo 23 is completely embedded in the cured surface of the substrate 21 and is at the same height as the surface.

[0146] In some embodiments, a curable material is provided on one side of the substrate 21 where the identification element 23 is connected and on the identification element 23, including: A transfer printing process is used to apply a curable material to the substrate 21 and the marking element 23, wherein the thickness of the curable material on the marking element 23 is less than the thickness of the curable material on the substrate 21.

[0147] In some examples, a NIL transfer process can be used to set the curable material on the substrate 21. Specifically, the identifier 23 is first fixed to the substrate 21, and then the curable material is set on the substrate 21 using the NIL transfer process. When setting the curable material on the substrate 21 using the NIL transfer process, it is inevitable that the curable material will also be set on the identifier 23, and the thickness of the curable material on the identifier 23 is less than the thickness of the curable material on the substrate 21. Then, the curable material is cured. After the curable material has cured, the cured curable material on the identifier 23 is removed. It is understood that using the NIL transfer process reduces the likelihood of oil accumulation in the curable material.

[0148] In this embodiment, a transfer printing process is used to set the curable material on the substrate 21 and the label 23. The curable material on the label 23 is thin. When the curable material is cured, the curable material on the label 23 is easier to harden and become brittle, and thus it is easy to peel off the curable material on the label 23.

[0149] In some embodiments, a curable material is provided on one side of the substrate 21 where the identification element 23 is connected and on the identification element 23, including: Curable materials are applied to the substrate 21 and the marking element 23 by spraying.

[0150] Specifically, the marking element 23 is first fixed on the substrate 21, and then the curable material is sprayed onto the substrate 21 and the marking element 23 by spraying. After the curable material is sprayed onto the substrate 21 and the marking element 23, the curable material is cured. After the curable material is cured, the cured curable material on the marking element 23 is removed.

[0151] In this embodiment of the application, by limiting the curable material to be applied to the substrate 21 and the label 23 by spraying, more options are provided for applying the curable material to the substrate 21 and the label 23.

[0152] In some embodiments, the curing operation of the curable material includes: Curing can be achieved by light curing or baking curing.

[0153] It is understandable that when the curable material is a light-curable material, it needs to be cured by light; when the curable material is a thermosetting material, it needs to be cured by baking.

[0154] In some examples, the curable material can be set to a light-curable resin or a thermosetting resin.

[0155] In this embodiment of the application, by specifying that curing is achieved by light curing or baking curing, it is indicated that the curable material provided in this embodiment of the application is not limited to light-curable materials or thermosetting materials, and appropriate materials can be selected according to actual conditions.

[0156] Please see Figure 12 , Figure 12 This is a partial cross-sectional schematic diagram of the removal of cured curable material on the marker 23 according to some embodiments of this application, wherein, Figure 12 The illustration shows that the curable material is transferred onto the substrate 21, and the thickness of the curable material cured on the marking element 23 is less than the thickness of the curable material cured on the substrate 21.

[0157] In some embodiments, removing the cured curable material from the label 23 includes: The curable material cured on the label 23 is removed by adhesive removal.

[0158] Please see Figure 12 The diagram illustrates a removal member 50 for removing the cured material from the label 23. The removal member 50 is provided with an adhesive layer 51. When it is necessary to remove the cured material from the label 23, the adhesive layer 51 on the removal member 50 is used to adhesively remove it. That is, when the adhesive layer 51 of the removal member 50 is bonded to the cured material on the label 23, the bonding force between the adhesive layer 51 and the cured material on the label 23 is greater than the bonding force between the label 23 and the cured material. Therefore, when the removal member 50 is used to adhesively remove the material, the cured material on the label 23 can be removed.

[0159] It should be noted that the number of times the adhesive can be removed can be adjusted according to the actual situation. For example, in some scenarios, one adhesive removal is sufficient to remove the cured material on the label 23; or, in other scenarios, two or more adhesive removals are required to remove the cured material on the label 23.

[0160] In this embodiment, the curable material on the label 23 is removed by adhesive peeling, which is not only simple to operate, but also facilitates better removal of the curable material on the label 23.

[0161] Please see Figure 13 , Figure 13 This is a partial cross-sectional schematic diagram of the removal of cured curable material on the marker 23 according to some embodiments of this application, wherein, Figure 13 The diagram illustrates that the curable material is applied to the substrate 21 and the marking element 23 by spraying. The thickness of the curable material cured on the marking element 23 is approximately the same as the thickness of the curable material cured on the substrate 21.

[0162] When the curable material is applied to the substrate 21 and the marking element 23 by spraying, please refer to Figure 13 When the curable material cured on the label 23 is removed by adhesive, a protruding tip 41 may be formed on the edge of the curable material cured on the substrate 21 near the edge of the label 23. In order to prevent the protruding tip 41 from scratching the user, in some embodiments, the edge of the curable material cured on the substrate 21 near the edge of the label 23 can be polished to remove the protruding tip 41.

[0163] Please see Figure 14 , Figure 14 This is a partial cross-sectional schematic diagram of a curable material that is laser-etched and cured along the edge of a marker 23, as provided in some embodiments of this application.

[0164] In some embodiments, before adhesive removal, the curable material along the edge of the marker 23 is scanned using laser engraving.

[0165] Laser engraving, also known as laser carving, primarily relies on a focused high-energy laser beam to irradiate the surface of a material. In this embodiment, laser engraving is used to scan the curable material cured along the edge of the marker 23, thereby severing the connection between the curable material cured on the marker 23 and the curable material cured on the substrate 21. Please refer to... Figure 14 , Figure 14 The dashed line roughly indicates the position of the laser beam 70 and the curable material that is cured along the edge of the scanning marker 23 by the laser beam 70.

[0166] It should be noted that when the sign 23 is made of metal, laser engraving can be used to scan the curable material along the edge of the sign 23; when the sign 23 is made of non-metallic material, laser engraving should not be used to scan the curable material along the edge of the sign 23 to avoid high-energy laser beam fusing the sign 23.

[0167] In this embodiment, the edge of the marker 23 is scanned by laser engraving to cut off the curable material cured on the marker 23 and the curable material cured on the substrate 21. This makes it easier to remove the curable material cured on the marker 23 by adhesive, reducing the number of times the adhesive can be removed. It also makes it easier for the curable material cured on the substrate 21 to be flat near the edge of the marker 23 when the curable material cured on the marker 23 is removed by adhesive.

[0168] Understandably, before using adhesive removal, one can first use laser engraving to scan the curable material along the edge of the sign 23; alternatively, one can omit the laser engraving step altogether before using adhesive removal. Specifically, a reasonable choice can be made based on the actual curable material cured on the sign 23.

[0169] Please see Figure 15 , Figure 15 for Figure 14 A magnified view of a portion of point A in the middle.

[0170] It should be noted that when using laser engraving to scan the edge of the marking component 23 and cure the curable material, please refer to [link / reference needed]. Figure 15 The laser beam 70 needs to hit the marking element 23 to prevent the curable material on the substrate 21 from being cut off from the side of the marking element 23 along the thickness direction when the laser beam 70 hits the substrate 21.

[0171] For example, please see Figure 15 A rounded corner 233 is provided on the edge of the marker 23 facing away from the substrate 21, so that the laser beam 70 can be controlled to hit the rounded corner 233 of the marker 23.

[0172] In some embodiments, before the identifier 23 is attached to the substrate 21, an anti-attachment coating 24 is provided on the side of the identifier 23 facing away from the substrate 21.

[0173] In some examples, electroplating or spraying can be used to form an anti-connection coating 24 on the side of the marker 23 facing away from the substrate 21.

[0174] In some examples, the anti-fingerprint coating 24 can be set as an AF layer (Anti-Fingerprint Coating, an anti-fingerprint hydrophobic and oleophobic nano-coating).

[0175] In this embodiment, by providing an anti-connection coating 24 on the side of the label 23 away from the substrate 21, the connection strength between the label 23 and the cured curable material can be reduced, thereby making it easier to peel the curable material off the label 23.

[0176] It should be noted that some embodiments described above describe providing an anti-connection coating 24 on the side of the identifier 23 facing away from the substrate 21. In other embodiments, the side of the identifier 23 facing away from the substrate 21 is processed before the identifier 23 is attached to the substrate 21 to improve the surface smoothness of the side of the identifier 23 facing away from the substrate 21.

[0177] This can be understood as follows: by processing the side of the marking element 23 away from the substrate 21, the surface roughness of the side of the marking element 23 away from the substrate 21 is reduced and the surface smoothness of the side of the marking element 23 away from the substrate 21 is improved, so that a smooth surface is formed on the side of the marking element 23 away from the substrate 21.

[0178] In this embodiment, by processing the side of the marker 23 away from the substrate 21 to improve the surface smoothness of the side of the marker 23 away from the substrate 21, the connection strength between the marker 23 and the cured curable material can be reduced, thereby making it easier to peel off the curable material on the marker 23.

[0179] This application provides a terminal device, including a terminal structure 20 as provided in any of the above embodiments.

[0180] Regarding terminal devices, these include, but are not limited to, cellphones, notebook computers, tablet personal computers, laptop computers, personal digital assistants (PDAs), and wearable devices. When the terminal device is a cellphone, it can be either a foldable or a non-foldable phone.

[0181] In some examples, the terminal structure 20 is the battery cover of the terminal device. Specifically, the terminal structure 20 also includes a display screen, which is disposed opposite to the terminal structure 20 along the thickness direction of the terminal device.

[0182] It is understandable that since the terminal device includes the aforementioned terminal structure 20, it possesses at least all the beneficial effects of the terminal structure 20, which will not be elaborated upon here.

[0183] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A terminal structural component, characterized in that, include: The substrate includes a first side surface and a second side surface disposed opposite to each other along the thickness direction; A curing layer is disposed on the first side surface, and a receiving hole is provided on the curing layer, one end of which is opened to the side of the substrate opposite to the first side surface. An identifier, which matches the shape of the receiving hole, is disposed within the receiving hole.

2. The terminal structural component as described in claim 1, characterized in that, The other end of the receiving hole is opened to the side where the cured layer is connected to the first side, and the identification element is attached to the substrate.

3. The terminal structural component as described in claim 1, characterized in that, The cured layer is integrally connected to the sidewall of the marking component along the thickness direction after curing.

4. The terminal structural component as described in claim 1, characterized in that, The side of the marker that faces away from the substrate has a smooth surface; or, The side of the identification element facing away from the substrate is provided with an anti-connection coating.

5. The terminal structural component as described in claim 1, characterized in that, The substrate includes a substrate body and a paint layer. The paint layer is disposed on one side of the substrate body along the thickness direction, and the side of the substrate body opposite to the paint layer forms a second side surface.

6. The terminal structural component as described in claim 1, characterized in that, The cured layer is a resin material; and / or, The cured layer is transferred onto the substrate; and / or The identification element is made of metal.

7. A method for manufacturing a terminal structural component according to any one of claims 1-6, characterized in that, include: Attach the identification element to the base plate; A curable material is applied to the side of the substrate connected to the marking element and to the marking element; The curable material is then cured. Remove the cured curable material from the marking element.

8. The manufacturing method as described in claim 7, characterized in that, The provision of a curable material on one side of the substrate connected to the marking element and on the marking element includes: A transfer printing process is used to apply a curable material to the substrate and the marking element, wherein the thickness of the curable material on the marking element is less than the thickness of the curable material on the substrate.

9. The manufacturing method as described in claim 7, characterized in that, The provision of a curable material on one side of the substrate connected to the marking element and on the marking element includes: The curable material is applied to the substrate and the marking element by spraying.

10. The manufacturing method as described in claim 7, characterized in that, The curing operation of the curable material includes: Curing can be achieved by light curing or baking curing.

11. The manufacturing method as described in claim 7, characterized in that, The removal of the cured curable material from the marking element includes: The curable material cured on the marking component is removed by adhesive peeling.

12. The manufacturing method as described in claim 11, characterized in that, Before removing the label with the adhesive, the curable material along the edge of the label is scanned using laser engraving.

13. The manufacturing method as described in claim 7, characterized in that, Before attaching the identification element to the substrate, an anti-attachment coating is applied to the side of the identification element facing away from the substrate.

14. The manufacturing method as described in claim 7, characterized in that, Before attaching the marker to the substrate, the side of the marker facing away from the substrate is processed to improve the surface smoothness of the side of the marker facing away from the substrate.

15. A terminal device, characterized in that, Includes the terminal structural component as described in any one of claims 1-6.

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