Display module, encapsulation mold and encapsulation method of display module

Abstract

The application provides a display module, a sealing glue mold and a sealing glue method of the display module. In the display module, the sealing glue structure includes a first sealing glue, a second sealing glue and a third sealing glue located in different position regions, and the first sealing glue, the second sealing glue and the third sealing glue are connected and integrally formed. In this way, the sealing glue distributed in different position regions can be prepared by one process technology. On the one hand, the complexity of the dispensing process can be reduced, the dispensing time can be saved, and the dispensing efficiency can be improved. On the other hand, since the first sealing glue, the second sealing glue and the third sealing glue are completed in the same process technology, the shapes of the three can be accurately controlled, so that the shape of the display module after sealing meets the requirements of subsequent processes.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display module, a sealing mold, and a sealing method for the display module. Background Technology

[0002] In related technologies, to improve the reliability of display modules (such as Micro OLED display modules), adhesive is applied to different locations within the display module. For example, adhesive is applied to the sides of the display panel, the bonding area between the display driver IC (DDIC) and the display panel, and the bonding area between the flexible printed circuit board (FPC) and the display panel. The adhesive layer formed by these applications can isolate water and oxygen, and enhance local strength.

[0003] However, in related technologies, due to the different dispensing locations, multiple different processes are required to dispense the adhesive to different locations, making the entire process complex and difficult to control the shape of the adhesive layer after dispensing. Summary of the Invention

[0004] In order to overcome the technical problems mentioned in the above background, this application provides a display module, a sealing mold, and a sealing method for the display module to solve the above technical problems.

[0005] A first aspect of this application provides a display module, the display module comprising: A display panel having a bonding area; A cover plate is located on the light-emitting side of the display panel, and the orthographic projection of the cover plate on the display panel is outside the bonding area; The display driver chip is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area; A flexible circuit board is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area; The sealing structure includes a first sealant, a second sealant, and a third sealant. The first sealant covers the backlight side of the display panel. The second sealant is located on the side of the display panel and the cover plate and covers the gap between the display panel and the cover plate. The third sealant is disposed in the bonding area and around the display driver chip. The third sealant also covers the portion of the flexible circuit board bonded to the display panel. The first sealant, the second sealant, and the third sealant are connected and integrally formed.

[0006] In one possible implementation, the first sealant, the second sealant, and the third sealant are made of the same material; The materials of the first sealant, the second sealant and the third sealant include UV adhesive.

[0007] In one possible implementation, the flexible circuit board includes a bonding portion and a bending portion connected together, the flexible circuit board being bonded to the display panel via the bonding portion, wherein the thickness of the bonding portion is greater than the thickness of the bending portion; The second sealant covers the bonding portion and the bend portion adjacent to the bonding portion.

[0008] In one possible implementation, the flexible circuit board extends relative to the bonding end of the display panel; The first sealant includes a first sub-sealant located on a first side of the display panel, the first sub-sealant covering the bonding end of the display panel and a portion of the flexible circuit board extending relative to the display panel; Along the direction in which the flexible circuit board extends relative to the display panel, the thickness of the first sub-encapsulant gradually decreases in the direction perpendicular to the plane of the display panel; Preferably, in a direction parallel to the plane of the display panel and away from the cover plate, the edge of the second sealant projected onto the flexible circuit board coincides with the edge of the first sub-sealant projected onto the flexible circuit board.

[0009] In one possible implementation, the first sealant includes a plurality of first through holes that expose the display panel; The thickness of the first sealant is the same at different locations; In a direction perpendicular to the plane of the display panel, the second sealant has a first height relative to the display panel, the cover plate has a second height relative to the display panel, the third sealant has a third height relative to the display panel, and the display driver chip has a fourth height relative to the display panel. The first height and the third height are equal, the first height is less than the second height, and the third height is less than the fourth height. Preferably, the thickness of the first sealant is in the range of 0.2mm-0.4mm, the thickness of the second sealant is in the range of 0.2mm-0.4mm, and the second height is 0.08mm-0.12mm higher than the first height.

[0010] In one possible implementation, the display module further includes an optical film and a heat dissipation film. The optical film is disposed on the side of the cover plate away from the display panel, and the heat dissipation film covers the display driver chip and the flexible circuit board.

[0011] A second aspect of this application also provides a sealing mold for sealing a display module to be sealed. The display module to be sealed includes a display panel, a cover plate, a display driver chip, and a flexible circuit board. The cover plate is located on the light-emitting side of the display panel, and the orthographic projection of the cover plate on the display panel is outside the bonding area. The display driver chip is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area. The flexible circuit board is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area. The sealing mold includes a receiving cavity for accommodating the display module to be sealed, and the bottom of the receiving cavity is provided with a plurality of support columns for supporting the display module to be sealed. When the display module to be sealed is placed in the accommodating cavity, there is a gap between the side of the display module to be sealed and the inner wall of the accommodating cavity, wherein the backlight side of the display panel in the display module to be sealed is in contact with the support column. The first side of the accommodating chamber is provided with a clearance through hole for placing the flexible circuit board.

[0012] In one possible implementation, in a direction perpendicular to the plane containing the bottom of the receiving chamber, the height of the first-side retaining wall is less than the height of the retaining walls on the other sides, and a groove is provided on the top surface of the first-side retaining wall away from the bottom of the receiving chamber. The sealing mold also includes a fixing block, which cooperates with the groove to form the clearance through hole; Preferably, the sealing mold is a semi-transparent sealing mold.

[0013] A third aspect of this application also provides a method for sealing a display module, the method comprising: Provide a sealing mold in any possible implementation of the second aspect; The display module to be sealed is placed in the receiving cavity of the sealing mold, wherein the backlight side of the display panel in the display module to be sealed is in contact with the support column, the flexible circuit board extends from the clearance through hole, and there is a gap between each side of the display module to be sealed and the inner wall of the receiving cavity. Inject glue into the accommodating chamber until the glue reaches a preset height; The adhesive is cured to obtain the sealed display module.

[0014] In one possible implementation, before placing the display module to be encapsulated into the receiving chamber of the encapsulation mold, the method further includes: Inject glue into the accommodating cavity in an amount not exceeding that of the support column; The step of curing the adhesive to obtain the sealed display module includes: The adhesive in the sealing mold is cured by irradiating it with ultraviolet light, resulting in a sealed display module.

[0015] This application provides a display module, a sealing mold, and a sealing method for the display module. In the display module, the sealing structure includes a first sealant, a second sealant, and a third sealant located in different areas. These three sealants are connected and integrally formed. This configuration allows the sealants distributed in different areas to be prepared in a single process. On one hand, it reduces the complexity of the dispensing process, saves dispensing time, and improves dispensing efficiency. On the other hand, since the first, second, and third sealants are completed in the same process, their shapes can be precisely controlled, ensuring that the shape of the sealed display module meets the requirements of subsequent processes. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 One of the top views of the display module provided in this embodiment is shown in the example; Figure 2 Example Figure 1 One of the schematic diagrams of the cross-section of the display module in the AA direction; Figure 3 A bottom view of the display module provided in this embodiment is shown as an example; Figure 4 Example Figure 1 The second schematic diagram of the cross-section of the display module in the AA direction; Figure 5 A second top view of the display module provided in this embodiment is shown; Figure 6 Example Figure 5 The diagram shows a cross-sectional view of the module in the AA direction; Figure 7 One of the structural schematic diagrams of the sealing mold provided in this embodiment is illustrated; Figure 8 This example illustrates the second structural schematic diagram of the sealing mold provided in this embodiment; Figure 9 A flowchart illustrating the encapsulation method for the display module provided in this embodiment is shown. Figures 10a-10c Corresponding to Figure 9 The manufacturing process diagram.

[0018] Icons: 1' - Display module to be encapsulated; 1 - Display module; 11 - Display panel; 10A - Bonding area; 101 - Bonding end side; 12 - Cover plate; 13 - Display driver chip; 14 - Flexible circuit board; 141 - Bonding part; 142 - Bending part; 15 - Encapsulation structure; 151 - First encapsulation; 1510 - First through hole; 1511 - First sub-encapsulation; 152 - Second encapsulation; 153 - Third encapsulation; 16 - Optical film; 17 - Heat dissipation film layer; 2 - Encapsulation mold; 20 - Accommodating chamber; 201 - Avoidance through hole; 21 - Support column; 22 - Retaining wall; 23 - Fixing block. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0023] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0025] To address the technical problems mentioned in the background section, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the solutions of related technologies are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in the embodiments of this application below should be considered contributions made by the inventors during the invention process, and should not be construed as technical content known to those skilled in the art.

[0026] Please refer to Figure 1 , Figure 2 and Figure 3 ,in, Figure 1 A top view of the display module provided in this embodiment is shown as an example. Figure 2 Example Figure 1 The diagram shows a cross-sectional view of the module in the AA direction. Figure 3 A bottom view of the display module provided in this embodiment is shown. In this embodiment, the display module 1 includes a display panel 11, a cover plate 12, a display driver chip 13, a flexible circuit board 14, and an encapsulation structure 15.

[0027] The display panel 11 includes a driving backplane and a light-emitting device layer located on the driving backplane. Exemplarily, the light-emitting device layer includes a plurality of light-emitting devices, which are arranged in an array on the driving backplane. Exemplarily, the light-emitting devices may include Micro OLEDs. The electrodes of the light-emitting devices are bonded to the electrodes on the driving backplane, and the driving backplane drives the light-emitting devices to emit light.

[0028] The display panel 11 has a display area and a non-display area, with the non-display area surrounding the display area. Light-emitting devices are distributed in the display area. By controlling the light-emitting devices at different positions in the display area, the display panel 11 can display different images in the display area. In this embodiment, the display panel 11 also includes a bonding area 10A located in the non-display area.

[0029] Cover plate 12 is located on the light-emitting side of display panel 11. Figure 2 The cover plate 12 covers the area of ​​the display panel 11 excluding the bonding area 10A. In other words, the cover plate 12 covers the display area of ​​the display panel 11 and the non-display area excluding the bonding area. That is, the orthographic projection of the cover plate 12 on the display panel 11 is outside the bonding area 10A. The cover plate 12 will display the bonding end corresponding to the bonding area 10A in the display panel 11. Figure 2 The right end of the display panel 11 is exposed, and the display panel 11 and the cover plate 12 are on the side where the non-bonding end is located. Figure 2 The display panel 11 is flush with the front, rear and left sides of the central display panel 11, and at the bonding end position, the display panel 11 extends relative to the cover plate 12.

[0030] The display driver chip 13 is located on the light-emitting side of the display panel 11. The display driver chip 13 is bonded to the display panel 11 in the bonding area 10A. The display driver chip 13 provides driving voltage signals for at least the light-emitting devices in the display panel 11.

[0031] The flexible circuit board 14 is also located on the light-emitting side of the display panel 11 and is bonded to the display panel 11 in the bonding area 10A. The flexible circuit board 14 can provide control signals to the display panel. For example, in this embodiment, the bonding position of the flexible circuit board 14 and the display panel 11 is closer to the edge of the bonding end of the display panel 11 than the bonding position of the display driver chip 13 and the display panel 11.

[0032] The sealing structure 15 includes a first sealant 151, a second sealant 152, and a third sealant 153. The first sealant 151 covers the backlight side of the display panel 11. Figure 2 (The lower side of the display panel 11). The first sealant 151 can provide support for the display panel 11, thus eliminating the need for the original support film used to support the display panel 11.

[0033] The second sealant 152 is located on the side of the display panel 11 and the cover plate 12 and covers the gap between them. Specifically, the second sealant 152 covers the gap between the display panel 11 and the cover plate 12 on the side where the non-bonding end is located. The second sealant 152 can fix the display panel 11 and the cover plate 12 and seal the gap between them.

[0034] The third sealant 153 is located in the bonding area 10A of the display panel 11 and surrounds the display driver chip 13. The third sealant 153 also covers the portion of the flexible circuit board 14 bonded to the display panel 11. The third sealant 153 protects the display driver chip 13 and can mitigate the risk of the flexible circuit board 14 tearing.

[0035] In this embodiment, the first sealant 151, the second sealant 152, and the third sealant 153 are connected and integrally formed, that is, the first sealant 151, the second sealant 152, and the third sealant 153 can be formed in one process.

[0036] In the above structure, sealants distributed in different locations and performing different functions can be prepared in a single process. On the one hand, this reduces the complexity of the dispensing process, saves dispensing time, and improves dispensing efficiency. On the other hand, since the first sealant 151, the second sealant 152, and the third sealant 153 are completed in the same process, the shapes of the three can be precisely controlled so that the shape of the display module 1 after sealing meets the requirements of subsequent processes.

[0037] Furthermore, in this embodiment, the first sealant 151, the second sealant 152, and the third sealant 153 are made of the same material. In one possible implementation, the materials of the first sealant 151, the second sealant 152, and the third sealant 153 include UV adhesive (i.e., shadowless adhesive). UV adhesive is an adhesive that achieves rapid curing through a polymerization reaction initiated by ultraviolet radiation. It features extremely fast curing speed, environmental friendliness, solvent-free properties, high transparency after curing, and high bonding strength. The curing process of UV adhesive is a low-temperature molding process and will not affect the product performance of the display module.

[0038] In one possible implementation, please refer again. Figure 2 The flexible circuit board 14 includes a bonding portion 141 and a bending portion 142. The flexible circuit board 14 is bonded to the display panel 11 through the bonding portion 141. In order to achieve better bending, the thickness of the bending portion 142 is less than the thickness of the bonding portion 141, that is, the thickness of the bonding portion 141 is greater than the thickness of the bending portion 142.

[0039] In this embodiment, the second sealant 152 covers the bonding portion 141 and the portion of the bent portion 142 adjacent to the bonding portion 141.

[0040] In one possible implementation, the flexible circuit board 14 is bonded to the display panel ( Figure 2 The right end of the display panel 11 extends out. The first sealant 151 includes a first sub-sealant 1511 located at the bonding end of the display panel 11, which covers the bonding end side 101 of the display panel 11 and the portion of the flexible circuit board 14 that extends out relative to the display panel 11.

[0041] In this embodiment, please refer again. Figure 2Along the direction in which the flexible circuit board 14 extends relative to the display panel 11 (X direction in the figure), the thickness of the first sub-encapsulant 1511 gradually decreases in the direction perpendicular to the plane of the display panel 11 (Z direction in the figure). That is, the first sub-encapsulant 1511 is designed with a chamfered structure, which can prevent the first sub-encapsulant 1511 from affecting the bending of the flexible circuit board 14.

[0042] Optionally, in a direction parallel to the plane of the display panel 11 and away from the cover plate 12, the edge of the second sealant 152 projected onto the flexible circuit board 14 coincides with the edge of the first sub-sealant 1511 projected onto the flexible circuit board 14.

[0043] In one possible implementation, please refer to Figure 4 The first sealant 151 may also include a plurality of first through holes 1510 that expose the display panel 11. The first through holes 1510 may correspond to the support columns used to support the display panel 11 when the sealant structure 15 is made. That is, the first sealant 151 is formed in the area outside the support columns, while the first through holes 1510 are formed at the corresponding positions of the support columns because there is no sealant.

[0044] By setting support columns, the thickness of the first sealant 151 formed on the backlight side of the display panel 11 can be made the same at different locations.

[0045] In this embodiment, in the direction perpendicular to the plane where the display panel 11 is located (Z direction in the figure), such as Figure 2 As shown, the second sealant 152 has a first height h1 relative to the display panel 11, the cover plate 12 has a second height h2 relative to the display panel 11, the third sealant 153 has a third height h3 relative to the display panel 11, and the display driver chip 13 has a fourth height h4 relative to the display panel 11. The first height h1 and the third height h3 are equal, that is, when the sealant structure is made by injection molding, the second sealant 152 and the third sealant 153 are at the same height relative to the glue level.

[0046] In this embodiment, the first height h1 is smaller than the second height h2, which can prevent the second sealant 152 from overflowing onto the side of the cover plate 12 away from the display panel 11 and affecting light emission. The third height h3 is smaller than the fourth height h4, which can prevent the third sealant 153 from covering the side of the display driver chip 13 away from the display panel 11 and affecting the heat dissipation of the display driver chip 13.

[0047] Optionally, in this embodiment, the thickness of the first sealant 151 ranges from 0.2mm to 0.4mm, the thickness of the second sealant 152 ranges from 0.2mm to 0.4mm, and the second height h2 is 0.08mm to 0.12mm higher than the first height h1. For example, the thickness of the first sealant 151 may include 0.2mm, 0.25mm, 0.3mm, 0.35mm, or 0.4mm, etc.; the thickness of the second sealant 152 may include 0.2mm, 0.27mm, 0.3mm, 0.34mm, or 0.4mm, etc.; and the second height h2 may be 0.08mm, 0.09mm, 0.1mm, 0.11mm, or 0.12mm higher than the first height h1, etc.

[0048] Further, please refer to Figure 5 and Figure 6 The display module 1 provided in this embodiment further includes an optical film 16 and a heat dissipation film 17. The optical film 16 is disposed on the side of the cover plate 12 away from the display panel 11. The optical film 16 is used to regulate the light emitted from the display panel 11. Exemplarily, the optical film 16 may include a polarizer. The heat dissipation film 17 covers the display driver chip 13 and the flexible circuit board 14. The heat dissipation film 17 is used to scatter the light emitted from the display driver chip 13 and the flexible circuit board 14. Exemplarily, the heat dissipation film 17 includes a graphite layer.

[0049] In this embodiment, since the first sealant 151, the second sealant 152 and the third sealant 153 are completed in the same process, the shape of the three can be precisely controlled. When the heat dissipation film layer 17 is attached, the shape of the second sealant 152 around the display driver chip 13 is controllable, which can reduce the risk of abnormalities such as wrinkles in the heat dissipation film layer 17.

[0050] Based on the same inventive concept, this application also provides a sealing mold, please refer to... Figure 7 and Figure 8 , Figure 7 and Figure 8 This embodiment provides a schematic diagram of the sealing mold structure. The sealing mold 2 is used to seal the display module to be sealed. The display module to be sealed includes a display panel, a cover plate, a display driver chip, and a flexible circuit board. The cover plate is located on the light-emitting side of the display panel, and its orthographic projection on the display panel is outside the bonding area. The display driver chip is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area. The flexible circuit board is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area. In this embodiment, the difference between the display module to be sealed and the display module described in the previous embodiment is that the display module to be sealed does not have a sealing structure. The other film layer structures of the display module to be sealed are exactly the same as those of the display module 1 described in the previous embodiment, and will not be repeated here.

[0051] In this embodiment, the sealing mold 2 includes a receiving chamber 20 for accommodating the display module to be sealed, and a plurality of support columns 21 for supporting the display module to be sealed are provided at the bottom of the receiving chamber 20.

[0052] When the display module to be sealed is placed in the accommodating chamber 20, there is a gap between the side of the display module to be sealed and the inner wall of the accommodating chamber 20, wherein the backlight side of the display panel in the display module to be sealed is in contact with the support column 21.

[0053] The first side of the accommodating chamber 20 is provided with a clearance through hole 201 for placing the flexible circuit board 14.

[0054] In one possible implementation, in a direction perpendicular to the plane where the bottom of the receiving chamber 20 is located (Z direction in the figure), the height of the first side baffle 22 is less than the height of the baffles 22 on the other sides, and a groove is provided on the top surface of the first side baffle 22 away from the bottom of the receiving chamber.

[0055] In this embodiment, the sealing mold 2 also includes a fixing block 23, which cooperates with the groove to form an avoidance through hole 201.

[0056] In this embodiment, when the display module to be encapsulated is placed in the accommodating chamber 20, a portion of the flexible circuit board 14 is placed in the groove, and then the fixing block 23 is engaged with the groove so that the flexible circuit board 14 passes through the formed clearance through hole 201.

[0057] In order to allow ultraviolet light to pass through the sealing mold 2 to cure the UV adhesive in the accommodating chamber 20, the sealing mold 2 is a semi-transparent sealing mold. Specifically, the sealing mold 2 is made of a semi-transparent material, such as acrylic resin.

[0058] Based on the same inventive concept, this application also provides a method for sealing a display module. Please refer to... Figure 9 Figure 10A Figure 10b and Figure 10c , Figure 9 A flowchart illustrating the encapsulation method for a display module provided in an embodiment of this application is shown in Figure 10A. Figure 10b and Figure 10c Example Figure 9 The corresponding process diagram is shown below. Figure 9 Figure 10A Figure 10b and Figure 10c This article provides a detailed introduction to the encapsulation methods for display modules.

[0059] Step S11, provide a sealing mold 2.

[0060] The sealing mold 2 described in the foregoing embodiments is provided.

[0061] Step S12: Place the display module 1' to be sealed into the receiving chamber 20 of the sealing mold 2.

[0062] In this step, the backlight side of the display panel 11 in the display module 1' to be encapsulated contacts the support column 21, the flexible circuit board 14 extends from the clearance through hole 201, and there are gaps between each side of the display module 1' to be encapsulated and the inner wall of the accommodating chamber 20.

[0063] Step S13: Inject glue into the receiving chamber 20 until the glue reaches the preset height.

[0064] For example, the height of the injected glue can be flush with the top surface of the sealing mold 2, that is, the receiving chamber 20 of the sealing mold 2 is filled with glue.

[0065] Step S14: Curing the adhesive to obtain the sealed display module 1.

[0066] The above method allows for the preparation of sealants with different functions in different locations of the display module 1' to be sealed through a single process. On the one hand, it reduces the complexity of the dispensing process, saves dispensing time, and improves dispensing efficiency. On the other hand, it allows for precise control of the shapes of the three components, so that the shape of the display module 1 after sealing meets the requirements of subsequent processes.

[0067] In one possible implementation, glue, not exceeding the amount of the support column 21, can be injected into the accommodating chamber 20 before step S12. The remaining glue can then be injected in step S13.

[0068] In another possible implementation, the glue may be injected only in step S13.

[0069] In this embodiment, glue can be injected into the receiving chamber 20 simultaneously from multiple edges of the sealing mold 2 to reduce the time required for glue injection.

[0070] In one possible implementation, step S14 can be achieved in the following way.

[0071] By irradiating the adhesive in the sealing mold 2 with ultraviolet light, the adhesive in the accommodating chamber 20 is cured, resulting in the sealed display module 1.

[0072] In summary, this application provides a display module, a sealing mold, and a sealing method for the display module. In the display module, the sealing structure includes a first sealant, a second sealant, and a third sealant located in different areas, which are connected and integrally formed. This configuration allows the sealants distributed in different areas to be prepared in a single process. On the one hand, it reduces the complexity of the dispensing process, saves dispensing time, and improves dispensing efficiency. On the other hand, since the first, second, and third sealants are completed in the same process, their shapes can be precisely controlled, ensuring that the shape of the sealed display module meets the requirements of subsequent processes.

[0073] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized in that, The display module includes: A display panel having a bonding area; A cover plate is located on the light-emitting side of the display panel, and the orthographic projection of the cover plate on the display panel is outside the bonding area; The display driver chip is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area; A flexible circuit board is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area; The sealing structure includes a first sealant, a second sealant, and a third sealant. The first sealant covers the backlight side of the display panel. The second sealant is located on the side of the display panel and the cover plate and covers the gap between the display panel and the cover plate. The third sealant is disposed in the bonding area and around the display driver chip. The third sealant also covers the portion of the flexible circuit board bonded to the display panel. The first sealant, the second sealant, and the third sealant are connected and integrally formed.

2. The display module as described in claim 1, characterized in that, The first sealant, the second sealant, and the third sealant are made of the same material; The materials of the first sealant, the second sealant and the third sealant include UV adhesive.

3. The display module as described in claim 1, characterized in that, The flexible circuit board includes a bonding portion and a bending portion connected together. The flexible circuit board is bonded to the display panel through the bonding portion, wherein the thickness of the bonding portion is greater than the thickness of the bending portion. The second sealant covers the bonding portion and the bend portion adjacent to the bonding portion.

4. The display module as described in claim 3, characterized in that, The flexible circuit board extends relative to the bonding end of the display panel; The first encapsulation includes a first sub-encapsulation located at the bonding end of the display panel, the first sub-encapsulation covering the side of the bonding end of the display panel and the portion of the flexible circuit board extending relative to the display panel; Along the direction in which the flexible circuit board extends relative to the display panel, the thickness of the first sub-encapsulant gradually decreases in the direction perpendicular to the plane of the display panel; Preferably, in a direction parallel to the plane of the display panel and away from the cover plate, the edge of the second sealant projected onto the flexible circuit board coincides with the edge of the first sub-sealant projected onto the flexible circuit board.

5. The display module as described in any one of claims 1-4, characterized in that, The first sealant includes a plurality of first through holes that expose the display panel; The thickness of the first sealant is the same at different locations; In a direction perpendicular to the plane of the display panel, the second sealant has a first height relative to the display panel, the cover plate has a second height relative to the display panel, the third sealant has a third height relative to the display panel, and the display driver chip has a fourth height relative to the display panel. The first height and the third height are equal, the first height is less than the second height, and the third height is less than the fourth height. Preferably, the thickness of the first sealant is in the range of 0.2mm-0.4mm, the thickness of the second sealant is in the range of 0.2mm-0.4mm, and the second height is 0.08mm-0.12mm higher than the first height.

6. The display module as described in claim 5, characterized in that, The display module also includes an optical film and a heat dissipation film. The optical film is disposed on the side of the cover plate away from the display panel, and the heat dissipation film covers the display driver chip and the flexible circuit board.

7. A sealing mold, characterized in that, This is used to encapsulate a display module to be encapsulated. The display module includes a display panel, a cover plate, a display driver chip, and a flexible circuit board. The cover plate is located on the light-emitting side of the display panel, and its orthographic projection on the display panel is outside the bonding area. The display driver chip is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area. The flexible circuit board is located on the light-emitting side of the display panel and is bonded to the display panel in the bonding area. The sealing mold includes a receiving cavity for accommodating the display module to be sealed, and the bottom of the receiving cavity is provided with a plurality of support columns for supporting the display module to be sealed. When the display module to be sealed is placed in the accommodating cavity, there is a gap between the side of the display module to be sealed and the inner wall of the accommodating cavity, wherein the backlight side of the display panel in the display module to be sealed is in contact with the support column. The first side of the accommodating chamber is provided with a clearance through hole for placing the flexible circuit board.

8. The sealing mold as described in claim 7, characterized in that, In a direction perpendicular to the plane containing the bottom of the receiving chamber, the height of the first side retaining wall is less than the height of the retaining walls on the other sides, and a groove is provided on the top surface of the first side retaining wall away from the bottom of the receiving chamber. The sealing mold also includes a fixing block, which cooperates with the groove to form the clearance through hole; Preferably, the sealing mold is a semi-transparent sealing mold.

9. A method for sealing a display module, characterized in that, The method includes: Provide a sealing mold as described in claim 7 or 8; The display module to be sealed is placed in the receiving cavity of the sealing mold, wherein the backlight side of the display panel in the display module to be sealed is in contact with the support column, the flexible circuit board extends from the clearance through hole, and there is a gap between each side of the display module to be sealed and the inner wall of the receiving cavity. Inject glue into the accommodating chamber until the glue reaches a preset height; The adhesive is cured to obtain the sealed display module.

10. The sealing method as described in claim 9, characterized in that, Before placing the display module to be sealed into the receiving chamber of the sealing mold, the method further includes: Inject glue into the accommodating cavity in an amount not exceeding that of the support column; The step of curing the adhesive to obtain the sealed display module includes: The adhesive in the sealing mold is cured by irradiating it with ultraviolet light, resulting in a sealed display module.

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