A high-heat-dissipation semiconductor package socket and a manufacturing method thereof
By using a double-layer metal structure semiconductor packaging socket, the airtightness of iron-based materials and the high thermal conductivity of copper-based materials are utilized, combined with glass insulators and insulating material filling, to solve the problems of insufficient heat dissipation and airtightness of TO packaging sockets, thus achieving efficient heat dissipation and improved reliability.
Patent Information
- Application Number
- CN202611077796.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-20
- Publication Date
- 2026-08-25
AI Technical Summary
Traditional TO-package sockets have poor heat dissipation capabilities, which cannot meet the heat dissipation requirements of high-power laser devices, and existing improvement solutions are insufficient in terms of airtightness and reliability.
The semiconductor packaging socket adopts a double-layer metal structure. The iron-based material serves as the upper layer to provide airtightness and support, while the copper-based material serves as the lower layer for heat conduction. They are brazed together with silver-copper solder, combined with glass insulators and insulating material filling to ensure sealing and heat dissipation efficiency.
It achieves a balance between efficient heat dissipation and airtightness, extending the lifespan of devices, improving packaging reliability and production efficiency, and reducing costs.
Smart Images
Figure CN122641345A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic device packaging technology, specifically to a high heat dissipation semiconductor packaging socket and its preparation method. Background Technology
[0002] Traditional TO-package sockets mostly use a single metal material, which is simple in structure and low in cost, but has poor heat dissipation capacity. For example, the thermal conductivity of SPCC material is 45-50.2 W / (m×k). With the increase in laser power and the miniaturization of package size, the heat dissipation performance of the original structure cannot meet the requirements, especially when applied to high-power laser devices. Poor heat dissipation can easily lead to heat accumulation, causing device performance degradation or failure.
[0003] There are two existing approaches to improving heat dissipation. One approach is to add an oxygen-free copper heat dissipation transition block to the iron-based tube socket. However, due to size limitations, the improvement in heat dissipation is limited, with the thermal conductivity of TU1 material being 380-394 W / (m×k). The other approach is to directly seal the pins on the copper-based tube socket, which significantly improves heat dissipation. However, the current process is not mature, and the hermeticity cannot be guaranteed for long-term use, affecting the reliability and lifespan of the device. This approach is mostly used in non-hermetic applications. Summary of the Invention
[0004] To address the issue that existing TO package sockets cannot simultaneously meet high heat dissipation requirements and hermeticity, this invention proposes a high heat dissipation semiconductor package socket, comprising a metal socket, a metal heat sink, and PIN pins. The metal socket has a double-layer structure, with an upper layer of iron-based metal and a lower layer of copper-based metal. The upper and lower layers are brazed together with silver-copper solder to form the entire metal socket. The iron-based metal is provided with countersunk holes that match the metal heat sink, and the metal heat sink passes through the countersunk holes and is integrally formed with the copper-based metal.
[0005] Furthermore, the diameter of the metal tube seat is between 3.5mm and 16.0mm.
[0006] Furthermore, for iron-based metals, 10# steel or SPCC should be selected.
[0007] Furthermore, the copper-based metals selected are oxygen-free copper, tungsten-copper alloys, or copper-chromium alloys.
[0008] Furthermore, the thickness of the iron-based metal is 0.5mm-5.0mm.
[0009] Furthermore, the thickness of the copper-based metal is 0.5mm-9.0mm.
[0010] Furthermore, the countersink that matches the metal heat sink is surrounded by steps, with the depth of the steps accounting for 1 / 3 to 2 / 3 of the thickness of the iron-based metal.
[0011] Furthermore, when fixing the PIN pins, the iron-based metal layer uses glass as a filler, and the copper-based metal layer uses insulating material as a filler.
[0012] This invention also proposes a method for fabricating a high-heat-dissipation semiconductor package socket, which specifically includes the following steps:
[0013] The PIN pin is fixed in the through hole of the iron-based metal by high-temperature sintering. The gap between the through hole of the iron-based metal and the PIN pin is filled with glass insulator to complete the initial sealing.
[0014] The copper-based metal is passed through a countersunk hole in the iron-based metal and then brazed together at high temperature using silver-copper solder.
[0015] Insulating material is filled into the copper-based metal through-holes to enhance sealing performance and PIN pull-out force.
[0016] This invention proposes a high-heat-dissipation semiconductor packaging socket that utilizes a lower copper-based material for direct heat conduction, combined with a heat sink to quickly dissipate heat generated by blue light devices, preventing thermal damage. The upper iron-based material provides a dense barrier to prevent moisture and contaminants from entering, extending device lifespan. Furthermore, the recessed design ensures precise positioning of the glass insulator and pins, reducing stress concentration and improving packaging reliability. The copper-based material's through-holes are filled with plastic structural components, epoxy resin, and other materials to enhance sealing performance and lead pull-out force, meeting the demands of more demanding environments. In summary, this invention's socket is easy to manufacture and integrate, reducing production costs. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of a high heat dissipation semiconductor packaging socket structure according to the present invention;
[0018] Figure 2 This is a schematic diagram of a cross-section of a high heat dissipation semiconductor packaging socket according to the present invention;
[0019] Figure 3 This is one embodiment of a copper-based metal through-hole in a high-heat-dissipation semiconductor packaging socket according to the present invention;
[0020] Figure 4 This is another embodiment of the copper-based metal through-hole in a high heat dissipation semiconductor package socket according to the present invention;
[0021] Among them: 1. Copper-based metals; 2. Iron-based metals; 3. Metal heat sinks; 4. Glass insulators; 5. Insulating materials; 6. Submersible grooves; 7. Pins. Detailed Implementation
[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0023] This invention proposes a high heat dissipation semiconductor packaging socket, including a metal socket, a metal heat sink, and PIN pins. The metal socket has a double-layer structure, with an upper layer of iron-based metal and a lower layer of copper-based metal. The upper and lower layers are brazed together with silver-copper solder to form the metal socket as a whole. The iron-based metal is provided with through holes that match the metal heat sink, and the metal heat sink is integrally formed with the copper-based metal through the through holes.
[0024] like Figure 1 The present invention discloses a high heat dissipation semiconductor packaging socket, comprising a metal socket, a metal heat sink, and PIN pins. The socket adopts a double-layer metal structure: the lower layer is copper-based metal and the upper layer is iron-based metal. The lower copper-based metal serves as a chip positioning and heat conduction channel, while the upper iron-based metal forms an airtight structure with glass and PIN pins at high temperature to ensure the airtightness of the product. The upper and lower layers are brazed together with silver-copper solder to form a whole, and insulating material is filled in the wall of the metal heat sink and the countersunk hole between the PIN pin and the glass insulator.
[0025] As an alternative implementation, the insulating material can be a plastic structural component or a flow-curing sealant such as epoxy resin, which serves to fix the lead wire and prevent lead wire deformation and glass damage during insertion and removal, thereby enhancing the product's mechanical strength and airtight stability.
[0026] In this embodiment, the metal base is composed of a lower copper-based material and an upper iron-based material through welding. The copper-based material serves as a heat dissipation channel between the chip and the external environment, utilizing its high thermal conductivity to quickly conduct heat. The iron-based material provides rigid support and sealing protection, achieving excellent airtightness through the mature sealing process of the iron-based material.
[0027] In this embodiment, the iron-based material surrounds the copper-based material, and a stepped design is incorporated. The steps serve the following functions: positioning the oxygen-free copper, providing space for solder accumulation to prevent solder overflow during brazing and maintain airtightness, and acting as a buffer zone for solder to climb upwards, preventing any impact on the flatness of the mounting area. A small gap is maintained between the inner wall of the sink and the metal heatsink. After the metal heatsink passes through the countersink, silver-copper solder is filled into the sink to completely seal the gap between the heatsink and the metal mounting base.
[0028] like Figure 2The iron-based metal has through holes for the PIN pins to pass through. The gap between the PIN pins and the iron-based metal is filled with glass insulators. The glass seal is only sealed to the iron-based metal, and is sintered and sealed with the PIN pins within the pre-set sealing holes in the iron-based metal to ensure airtightness. Similarly, to effectively avoid the PIN pins and facilitate brazing with the upper iron-based material to form a whole, the copper-based material also has through-hole structures. These through-hole structures match the through-hole structures on the iron-based metal, aiming to facilitate the passage of the PIN pins. It can also be used as... Figure 2 The diameter is slightly larger than the through-hole structure set on the iron-based metal to leave space for filling plastic structural parts, epoxy resin and other materials, thereby enhancing the sealing performance and lead wire pull-out force.
[0029] As an optional implementation, such as Figure 3 The through-holes in the copper-based metal and the through-holes in the iron-based metal are coaxially arranged, with the copper-based through-hole having a slightly larger diameter than the iron-based through-hole; as another optional implementation, such as Figure 4 Based on the aforementioned embodiment, the through holes set on the copper-based metal connect the through holes corresponding to the two PIN pins to form a through hole structure consisting of two semi-circular shapes and two straight lines.
[0030] As an optional implementation, the upper material of the tube socket body in this application is a material with low thermal conductivity, generally an iron-based material, such as 10# steel (the execution standards are GB / T699-1999 and GB / T711-2017, and the corresponding international grades include Japanese S10C, American 1010, German CK10, etc.) and SPCC (i.e., cold-rolled carbon steel as defined in Japanese Industrial Standard (JIS G 3141)). The lower material is a copper-based material with high thermal conductivity, including oxygen-free copper, tungsten copper alloy, copper-chromium alloy, etc. The upper and lower layers pass through each other coaxially, and the heat of the chip can be dissipated through the side walls and bottom of the material by the high thermal conductivity material.
[0031] As an optional implementation, the thickness of the iron base ranges from 0.5mm to 5.0mm to avoid deformation of the seal due to excessive thinness and impaired heat dissipation due to excessive thickness; the thickness of the copper base ranges from 0.5mm to 9.0mm to meet both basic heat dissipation and high-power chip heat dissipation requirements.
[0032] As an optional implementation, the overall outer diameter of the metal tube seat of the present invention is between 3.5mm and 16.0mm. Specifically, for example, the outer diameter of TO56 is 5.6mm, the outer diameter of TO5 is 5.0mm, the outer diameter of TO8 is 8.0mm, and the outer diameter of TO9 is 9.0mm.
[0033] In this embodiment, the pin structure can be round or flat. The flat head structure has a flat surface, which increases the bonding area. It is set inside one end of the lead body to facilitate bonding more wires. The entire pin passes vertically through the tube body and is exposed at both the top and bottom of the body. It is then insulated and sintered with the body.
[0034] The insulating filler material of this invention is not limited to any material; it can be a plastic structural component or a flow-curing sealant such as epoxy resin. It serves to fix the lead wire, preventing lead wire deformation and glass damage caused by plugging and unplugging, thereby ensuring the performance requirements in more stringent environments.
[0035] As an optional implementation, the through hole matching the metal heat sink is provided with steps around it. The steps are located on the upper end face of the upper iron base and are connected to the copper base. The depth accounts for 1 / 3 to 2 / 3 of the total thickness of the iron base metal. This is mainly to facilitate solder positioning and prevent solder overflow from affecting the flatness of the patch surface.
[0036] This invention also provides a fabrication process for a high-heat-dissipation semiconductor packaging socket, specifically including the following steps:
[0037] 1. First, the PIN pin is fixed in the through hole of the iron-based metal by high-temperature sintering. The gap between the through hole of the iron-based metal and the PIN pin is filled with glass insulator to complete the initial sealing.
[0038] 2. Next, the copper-based metal is passed through the countersunk holes set on the iron-based metal and then brazed together at high temperature with silver-copper solder to achieve high thermal conductivity;
[0039] 3. Finally, fill the copper-based metal through holes with plastic structural parts or epoxy resin and other materials to enhance the sealing performance and PIN pull-out force.
[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A high-heat-dissipation semiconductor package socket, comprising a metal socket, a metal heat sink, and PIN pins, characterized in that, The metal tube base has a double-layer structure, with an upper layer of iron-based metal and a lower layer of copper-based metal. The upper and lower layers are brazed together with silver-copper solder to form a whole metal tube base. The iron-based metal is provided with countersunk holes that match the metal heat sink. The metal heat sink passes through the countersunk holes and is integrally formed with the copper-based metal.
2. The high heat dissipation semiconductor packaging socket according to claim 1, characterized in that, The diameter of the metal tube seat is between 3.5mm and 16.0mm.
3. The high heat dissipation semiconductor packaging socket according to claim 1, characterized in that, For iron-based metals, use 10# steel or SPCC.
4. The high heat dissipation semiconductor packaging socket according to claim 1, characterized in that, For copper-based metals, oxygen-free copper, tungsten-copper alloys, or copper-chromium alloys are selected.
5. A high heat dissipation semiconductor package socket according to claim 1, characterized in that, The thickness of iron-based metals ranges from 0.5mm to 5.0mm.
6. The high heat dissipation semiconductor packaging socket according to claim 1, characterized in that, The thickness of copper-based metals ranges from 0.5mm to 9.0mm.
7. The high heat dissipation semiconductor packaging socket according to claim 1, characterized in that, The through-hole that matches the metal heat sink is surrounded by steps, with the depth of the steps being 1 / 3 to 2 / 3 of the thickness of the iron-based metal.
8. A high-heat-dissipation semiconductor package socket according to claim 1, characterized in that, When fixing the PIN pins, glass insulators are used as fillers for the iron-based metal layer, and insulating materials are used as fillers for the copper-based metal layer.
9. A method for fabricating a high-heat-dissipation semiconductor package socket, characterized in that, The method for preparing a high heat dissipation semiconductor package socket according to any one of claims 1 to 8 specifically includes the following steps: The PIN pin is fixed in the through hole of the iron-based metal by high-temperature sintering. The gap between the through hole of the iron-based metal and the PIN pin is filled with glass insulator to complete the initial sealing. The copper-based metal is passed through a countersunk hole in the iron-based metal and then brazed together at high temperature using silver-copper solder. Insulating material is filled into the copper-based metal through-holes to enhance sealing performance and PIN pull-out force.