A high heat dissipating semiconductor package apparatus and method

Abstract

The application discloses a high-heat-dissipation semiconductor packaging equipment and method, relates to the packaging technical field, and comprises a packaging equipment, a sealing assembly is arranged on the top of the packaging equipment, a driving structure is arranged on the packaging equipment, the driving structure comprises two mounting frames two and two mounting frames three, four loading structures are fixedly arranged on the mounting frame two, a discharging structure is arranged between the two mounting frames three, the discharging structure obtains the packaged workpieces from the loading structures and then conveys the packaged workpieces to a cooling platform, only the bottom surface of the packaged workpieces bears the force in the process, the force on the heating and packaging position of the packaged workpieces is avoided, the packaging effect is improved, and the common situation that the hot-processed workpieces are transferred through a sliding groove and a material pipe in the semiconductor post-packaging process is changed, the situations that the packaged workpieces jump, turn over and are scratched at the corners are avoided, and the quality problems such as micro-cracks, broken corners and internal lead deformation caused by falling impact are avoided.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, specifically to a high-heat-dissipation semiconductor packaging device and method. Background Technology

[0002] In the semiconductor component manufacturing process, the packaging stage is a key process to ensure stable chip performance, achieve electrical connection and provide physical protection. During chip manufacturing, the produced chips need to be bonded, and after bonding, they are encapsulated by a molding machine to protect the outside of the chip.

[0003] In the semiconductor back-end packaging process, it is common practice to transfer and unload materials through chutes, tubes or conveyors. The unloading method using the idea of ​​"free fall + guide plate buffer" is prone to chip impact. In addition, the outer molding compound (epoxy resin) has high elasticity, and the impact of falling may cause micro-cracks, chipping, and deformation of internal leads, affecting the reliability of the process.

[0004] For example, an existing patent document (publication number CN121693239A) discloses a semiconductor component packaging device, including a frame, a molding mechanism mounted on the frame, a feeding mechanism mounted on the frame, and a discharging mechanism mounted on the frame. The cooperation between the molding mechanism and the feeding mechanism facilitates the batch molding of chips, and the rotation of the feeding mechanism enables non-stop loading and unloading operations, improving efficiency. The installation of the discharging mechanism allows the discharging mechanism to slide against the feeding mechanism after the chip molding is completed, by rotating the feeding mechanism at a certain angle.

[0005] Taking the aforementioned packaging equipment as an example, during the operation of the unloading mechanism in the packaging equipment, the encapsulated chip (semiconductor workpiece) falls directly into the collection mechanism through the unloading trough. Although a guide plate, a hopper, and other structures are set up to buffer the chip, the chip will still collide with the guide plate and the wall of the feeding trough, which may result in chip jumping, flipping, or edge damage. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor packaging device and method with high heat dissipation to solve the problems raised in the prior art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a high heat dissipation semiconductor packaging device and method, comprising a packaging device, a sealing component mounted on the top of the packaging device, a driving structure mounted on the packaging device, the driving structure comprising a mounting frame two and two mounting frames three, four material carrying structures fixedly passing through the mounting frame two, a material unloading structure installed between the two mounting frames three, and a cooling platform fixedly mounted on the rear side of the material unloading structure.

[0008] Preferably, the sealing assembly includes a sealing cover, an air pump, a dust collector, and two distribution boxes. The sealing cover is fixedly installed on the top of the sealing equipment, and a human-machine interface device is fixedly installed on the outside of the sealing cover. A storage box is provided through one side of the sealing cover, and the air pump, dust collector, and two distribution boxes are all fixedly installed on the top of the sealing cover.

[0009] Preferably, a first air guide bend is fixedly installed between the air inlet of the dust collector and the left-side distribution box; multiple second air guide bends are fixedly connected between the left-side distribution box and the packaging equipment; one end of the second air guide bend is connected to the bottom right side of the inner cavity of the sealing cover; a connecting pipe is fixedly connected between the air outlet of the dust collector and the air inlet of the first suction pump; a first solenoid valve is fixedly connected to the outside of the connecting pipe; the air outlet of the first suction pump is fixedly connected to the right-side distribution box; and multiple third air guide bends are fixedly connected between the right-side distribution box and the top of the sealing cover.

[0010] Preferably, mounting bracket 1 is fixedly installed inside mounting bracket 2, and a drive shaft is fixedly installed inside mounting bracket 1. The drive shaft rotatably passes through the packaging equipment. An electromagnet 1 is sleeved on the outside of the drive shaft. The electromagnet 1 is fixedly embedded in the top of the inner cavity of the packaging equipment. Both mounting brackets 3 are fixedly installed at the bottom of the inner cavity of the packaging equipment. A drive motor is fixedly connected between the two mounting brackets 3. The output end of the drive motor is fixedly connected to the bottom end of the drive shaft.

[0011] Preferably, the material-carrying structure includes a support frame 1 fixedly mounted on the mounting frame 2, the support frame 1 having multiple material-carrying slots 1 on its top, multiple spring telescopic rods fixedly mounted on the outer side of the support frame 1, and a support frame 2 fixedly connected between the piston ends of the multiple spring telescopic rods, the support frame 2 having multiple material-carrying slots 2 on its top.

[0012] Preferably, the second support frame is slidably installed inside the first support frame, the second support frame has a groove at its bottom, a metal plate is placed inside the groove, and the outer wall of the metal plate is fixedly connected to the second support frame.

[0013] Preferably, the feeding structure includes a first fixed frame, a second fixed frame, a third fixed frame, a second hydraulic cylinder, a manifold, a second vacuum pump, and two second electromagnets. The first fixed frame and the second fixed frame are respectively sleeved on the outside of the two third mounting frames. Two fourth fixed frames are fixedly connected between the first fixed frame and the second fixed frame. A telescopic rod is fixedly inserted through the first fixed frame. A first hydraulic cylinder is fixedly connected to one side of the second fixed frame. The piston end of the second telescopic rod and the piston end of the first hydraulic cylinder are both fixedly connected to the third fixed frame. The second hydraulic cylinder is fixedly installed at the bottom of the inner cavity of the packaging equipment. The piston end of the second hydraulic cylinder is fixedly connected to the first fixed frame.

[0014] Preferably, the top of the fixed frame three is fixedly connected to multiple hydraulic telescopic rods, the piston end of the hydraulic telescopic rod is fixedly connected to a fixed frame five, a hydraulic sensor is fixedly installed on the outside of the hydraulic telescopic rod, telescopic rod three is provided on both sides of the hydraulic telescopic rod, the outer shell of the telescopic rod three is fixedly connected to the fixed frame three, the piston end of the telescopic rod three is fixedly connected to the adjacent fixed frame five, two fixed frames six are fixedly connected to the top of the fixed frame five, a fixed frame seven is fixedly connected between the two fixed frames six, a negative pressure suction cup is fixedly inserted on the fixed frame seven, a feeding port is opened on the top of the packaging equipment, the top end of the electromagnet two extends into the feeding port, the outer wall of the electromagnet two is fixedly connected to the packaging equipment, the manifold is fixedly installed on the top of the inner cavity of the packaging equipment, a flexible hose is fixedly connected between the manifold and the multiple negative pressure suction cups, a fixed frame eight is fixedly connected between the vacuum pump two and the packaging equipment, the air inlet end of the vacuum pump two is fixedly connected to the manifold, a solenoid valve two is fixedly installed on the air outlet end of the vacuum pump two, and a pressure sensor is fixedly installed on the outside of the manifold.

[0015] Preferably, the cooling platform includes a horizontal plate, which is fixedly installed on the rear side of the packaging equipment. Multiple material loading slots are provided on the top of the horizontal plate. Limiting plates are provided on both sides of the bottom of each material loading slot. Pneumatic cylinders are provided on both sides of the bottom of each horizontal plate. Two mounting brackets are provided on one side of each pneumatic cylinder. The outer wall of the pneumatic cylinder and the mounting brackets are fixedly connected to the horizontal plate. Telescopic rods are fixedly threaded through the mounting brackets. Mounting brackets are fixedly connected between the piston end of the pneumatic cylinder and the piston ends of the two telescopic rods on the same side. The limiting plates are fixedly connected to the mounting brackets on the same side. A discharge port is provided on the rear side of the packaging equipment, and the cooling platform is located on the top rear side of the discharge port.

[0016] Semiconductor packaging methods:

[0017] Step 1: After inserting the storage box into the sealing cover, control the sealing components through the human-machine interface to complete the processing environment control.

[0018] Step 2: The drive structure controls the positions of the four material-carrying structures, which sequentially cycle through the robotic arm loading process, the workpiece surface cleaning process, and the heating and packaging process.

[0019] Step 3: After the packaged workpiece is supported by the material carrier structure and stops at the top of the unloading port, the unloading operation is carried out to complete the unloading preparation work;

[0020] Step 4: The unloading structure creates a negative pressure state inside multiple negative pressure suction cups, and the encapsulated workpiece moves down into the second material loading tank.

[0021] Step 5: The material feeding structure works to push the support frame 2 horizontally backward, and the material loading trough 2 is offset from the material loading trough 1. At this time, the material feeding port is sealed by the material loading structure and the drive structure to ensure the sealing state inside the sealing cover.

[0022] Step Six: The unloading structure moves multiple negative pressure suction cups downwards, and the encapsulated workpiece is completely separated from the loading structure;

[0023] Step 7: The unloading structure and cooling platform work together to complete the unloading process;

[0024] Step 8: The unloading structure returns to its initial state, and the workpiece stops at the top of the unloading port after the next loading structure supports multiple packages.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. When this application is used, the unloading structure picks up the packaged workpiece from the loading structure and then transports it to the cooling platform. During this process, only the bottom surface of the packaged workpiece does not bear the force of the processing position, avoiding the reduction of the packaging effect caused by the heat of the packaged workpiece and the force of the packaging position. It also changes the common semiconductor back-end packaging process, which uses chutes and tubes to transfer the heat-processed workpiece. It changes the unloading method of free fall + guide plate buffer, avoiding the jumping, flipping, and edge damage of the packaged workpiece. It avoids the quality problems such as micro-cracks, chipped corners, and deformation of internal leads that may be caused by falling impact, and fundamentally avoids physical contact and collision.

[0027] 2. When using this application, if the encapsulated workpiece leaves the material tank 1 after packaging, and the encapsulated workpiece experiences adhesive leakage or deformation during the heating and packaging process, the friction between the encapsulated workpiece and the support frame 1 will increase significantly. The negative pressure suction cup will require a significantly increased pulling force to move the encapsulated workpiece downwards, causing the hydraulic telescopic rod to extend under force. The hydraulic pressure inside the hydraulic telescopic rod will increase, and the hydraulic pressure value detected by the hydraulic sensor will increase significantly. The human-machine interface device receiving feedback from the hydraulic sensor will mark the encapsulated workpiece corresponding to the hydraulic sensor as a questionable workpiece. Since the unloading structure transports the encapsulated workpiece to a preset position on the cooling platform, the human-machine interface device will remind the staff or robot that the questionable workpiece will be sent into the corresponding material tank 3 on the cooling platform. The staff or robot will promptly remove the questionable workpiece for separate processing, achieving the effect of simultaneous processing and defective product sorting. This avoids deformed defective workpieces scratching good semiconductor workpieces during subsequent transportation, processing, and packaging processes, reducing economic losses caused by defective products. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the present invention;

[0029] Figure 2This is a schematic diagram of the separation structure of the packaging device and the sealing cover of the present invention;

[0030] Figure 3 This is a schematic diagram of the connection structure between the driving structure and the material-carrying structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the cooling platform of the present invention;

[0032] Figure 5 This is a bottom view of the cooling platform of the present invention;

[0033] Figure 6 This is a schematic diagram of the material feeding structure of the present invention;

[0034] Figure 7 This is a partial structural schematic diagram of the packaging device of the present invention;

[0035] Figure 8 This is a schematic diagram of the structure of the fixing frame four of the present invention;

[0036] Figure 9 This is a schematic diagram of the structure of the fixing frame three of the present invention;

[0037] Figure 10 This is a schematic diagram of the structure of the fixing frame five of the present invention;

[0038] Figure 11 This is a schematic diagram of the combiner box of the present invention;

[0039] Figure 12 This is a schematic diagram of the structure of the mounting bracket 2 of the present invention;

[0040] Figure 13 This is a schematic diagram of the structure of the support frame of the present invention.

[0041] Figure 14 This is a schematic diagram of the structure of the fixing frame six of the present invention.

[0042] The diagram is labeled as follows: 1. Packaging equipment; 2. Sealing cover; 3. Human-machine interface device; 4. Storage box; 5. Drive structure; 51. Drive shaft; 52. Mounting bracket one; 53. Mounting bracket two; 54. Drive motor; 55. Mounting bracket three; 56. Electromagnet one; 6. Material carrying structure; 61. Support bracket one; 62. Material carrying trough one; 63. Spring telescopic rod; 64. Support bracket two; 65. Groove; 66. Metal plate; 67. Material carrying trough two; 7. Discharge port; 8. Cooling platform; 81. Horizontal plate; 82. Material carrying trough three; 83. Pneumatic cylinder; 84. Mounting bracket four; 85. Telescopic rod one; 86. Mounting bracket five; 87. Limiting plate; 9. Unloading structure; 91. Fixing bracket one; 92. Telescopic rod two; 93. Fixing frame two; 94. Hydraulic cylinder one; 95. Fixing frame three; 96. Hydraulic cylinder two; 97. Fixing frame four; 98. Fixing frame five; 99. Telescopic rod three; 910. Hydraulic telescopic rod; 911. Hydraulic sensor; 912. Fixing frame six; 913. Fixing frame seven; 914. Negative pressure suction cup; 915. Hoses; 916. Manifold box; 917. Air pressure sensor; 918. Air pump two; 919. Fixing frame eight; 920. Solenoid valve two; 921. Electromagnet two; 10. Air pump one; 11. Solenoid valve one; 12. Dust collector; 13. Air guide bend one; 14. Diverter box; 15. Air guide bend two; 16. Air guide bend three; 17. Connecting pipe; 18. Discharge port. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] Example: Figures 1-14 As shown, the present invention provides a high heat dissipation semiconductor packaging device, including a packaging device 1. A sealing component is installed on the top of the packaging device 1. A driving structure 5 is installed on the packaging device 1. The driving structure 5 includes a second mounting bracket 53 and two third mounting brackets 55. Four material carrying structures 6 are fixedly inserted on the second mounting bracket 53. A material unloading structure 9 is installed between the two third mounting brackets 55. A cooling platform 8 is fixedly installed on the rear side of the material unloading structure 9.

[0045] Specifically, such as Figure 1 and Figure 2In the sealing assembly, the sealing cover 2 is fixedly installed on the top of the packaging equipment 1. The human-machine interaction device 3 is fixedly installed on the outside of the sealing cover 2 for the operator to operate. A storage box 4 is provided on one side of the sealing cover 2. Multiple workpieces are stacked and stored inside the storage box 4. After the storage box 4 is inserted into the sealing cover 2, the sealing cover 2 is in a good sealing state. The air pump 10, the dust collector 12 and the two diversion boxes 14 are all fixedly installed on the top of the sealing cover 2.

[0046] A first air guide bend 13 is fixedly installed between the air inlet of the dust collector 12 and the left-side distribution box 14. Multiple second air guide bends 15 are fixedly connected between the left-side distribution box 14 and the sealing device 1. One end of the second air guide bend 15 is connected to the bottom right side of the inner cavity of the sealing cover 2. Therefore, the gas at the bottom right side of the inner cavity of the sealing cover 2 is connected to the air inlet of the dust collector 12 through multiple second air guide bends 15, the left-side distribution box 14 and the first air guide bend 13. A connecting pipe 17 is fixedly connected between the air outlet of the dust collector 12 and the air inlet of the first air pump 10. The air outlet of the first air pump 10 is fixedly connected to the right-side distribution box 14. Multiple third air guide bends 16 are fixedly connected between the right-side distribution box 14 and the top of the sealing cover 2. The air outlet of the dust collector 12 is connected to the top of the inner cavity of the sealing cover 2 through the connecting pipe 17, the first air pump 10, the right-side distribution box 14 and the multiple third air guide bends 16.

[0047] Therefore, after the storage box 4 is inserted into the sealing cover 2, the sealing cover 2 is in a good sealing state. Then, the sealing assembly is controlled by the human-machine interface device 3. The solenoid valve 11 in the sealing assembly is opened for a period of time. The inert gas supply system connected to the solenoid valve 11 supplies inert gas to the inside of the sealing cover 2 through the solenoid valve 11, the connecting pipe 17, the air pump 10, the right side diversion box 14 and multiple air guide bends 16. After the solenoid valve 11 stops working and closes, the processing environment control work is completed.

[0048] During the process of sealing the workpiece by the sealing equipment 1, the air pump 10 in the sealing assembly is operated. The air pump 10 draws inert gas from multiple positions at the bottom right side of the inner cavity of the sealing cover 2 through the connecting pipe 17, dust collector 12, air guide bend 13, left side distribution box 14 and multiple air guide bends 15. After being filtered and purified by the dust collector 12, the inert gas is transported by the air pump 10 through the right side distribution box 14 and multiple air guide bends 16 to the upper right side of the inner cavity of the sealing cover 2. At this time, the sealing assembly operates to make the inert gas circulate inside the sealing cover 2.

[0049] Specifically, such as Figure 2 , Figure 3 and Figure 7The first mounting bracket 52, which is fixedly installed inside the second mounting bracket 53, has a drive shaft 51 fixedly installed inside. The drive shaft 51 rotates through the packaging equipment 1. When the drive shaft 51 rotates, the second mounting bracket 53 rotates. Both third mounting brackets 55 are fixedly installed at the bottom of the inner cavity of the packaging equipment 1. A drive motor 54 is fixedly connected between the two third mounting brackets 55. The output end of the drive motor 54 is fixedly connected to the bottom end of the drive shaft 51 to control the operation of the drive motor 54. The drive motor 54 drives the second mounting bracket 53 to rotate through the drive shaft 51 and the first mounting bracket 52. The four material-carrying structures 6 installed on the second mounting bracket 53 rotate.

[0050] An electromagnet 56, sleeved on the outside of the drive shaft 51, is fixedly embedded in the top of the inner cavity of the packaging device 1. The electromagnet 56 is in contact with the drive shaft 51. When the drive motor 54 drives the mounting bracket 53 to rotate a preset angle and stop working, the electromagnet 56 works to magnetically attract and fix the iron drive shaft 51, thus braking the drive shaft 51 and the mounting bracket 53.

[0051] Therefore, the human-computer interaction device 3 controls the drive structure 5 to work, which can transport the four material-carrying structures 6 to the corresponding positions and then brake them, so that the material-carrying structures 6 can stay stably in the preset positions.

[0052] Specifically, such as Figure 3 , Figure 12 , Figure 13 and Figure 14 In the material-carrying structure 6, the drive shaft 51 is fixedly mounted on the mounting frame 53. The top of the support frame 61 has multiple material-carrying grooves 62, which are used to carry workpieces. One material-carrying structure 6 can transport multiple workpieces at one time. The piston ends of multiple spring telescopic rods 63 fixedly mounted on the outside of the support frame 61 are fixedly connected to the support frame 64. The top of the support frame 64 has multiple material-carrying grooves 67, and the material-carrying grooves 62 and 67 correspond one-to-one.

[0053] Support frame 2 64 is slidably installed inside support frame 1 61. A metal plate 66 is installed inside the groove 65 at the bottom of support frame 2 64. The outer wall of the metal plate 66 is fixedly connected to support frame 2 64. The metal plate 66 is made of iron.

[0054] The spring telescopic rod 63 applies a force away from the transmission shaft 51 to the groove 65 in real time. Without any other external force, the material loading groove 67 opened by the second support frame 64 remains offset from the material loading groove 62 opened by the first support frame 61. The bottom of the material loading groove 62 is blocked by the second support frame 64, and the workpiece can be placed inside the material loading groove 62. The material loading structure 6 is in the feeding state at this time.

[0055] When the second support frame 64 moves toward the drive shaft 51 under external force, the second support frame 64 moves inside the first support frame 61. When the second loading trough 67 is aligned with the first loading trough 62, the second support frame 64 blocks the first support frame 61 and cannot move. At this time, the metal plate 66 contacts the two electromagnets 921 in the unloading structure 9. The iron metal plate 66 is fixed by the working electromagnets 921 through magnetic attraction. The position of the second support frame 64 is restricted, and the second loading trough 67 and the first loading trough 62 remain aligned. At this time, the loading structure 6 is in the unloading state.

[0056] Specifically, such as Figure 4 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 In the feeding structure 9, fixed frame 1 91 and fixed frame 2 93 are respectively sleeved on the outside of two mounting frames 3 55. Two fixed frames 4 97 are fixedly connected between fixed frame 1 91 and fixed frame 2 93. Under the action of the two fixed frames 4 97, fixed frame 1 91 and fixed frame 2 93 move synchronously. Under the support and limitation of the two mounting frames 3 55, fixed frame 1 91 and fixed frame 2 93 move up and down synchronously. A telescopic rod 2 92 is fixedly inserted on fixed frame 1 91. A hydraulic cylinder 1 94 is fixedly connected to one side of fixed frame 2 93. The piston end of telescopic rod 2 92 and the piston end of hydraulic cylinder 1 94 are both fixedly connected to fixed frame 3 95. Telescopic rod 2 92, hydraulic cylinder 1 94 and fixed frame 3 95 move up and down synchronously. Hydraulic cylinder 2 96 is fixedly installed at the bottom of the inner cavity of the packaging equipment 1. The piston end of hydraulic cylinder 2 96 is fixedly connected to fixed frame 1 91. Controlling the operation of hydraulic cylinder 2 96 can drive telescopic rod 2 92 and hydraulic cylinder 1 94 to move up and down, and fixed frame 3 95 to move up and down synchronously.

[0057] Furthermore, the packaging equipment 1 has a discharge port 7 on the rear side. The hydraulic cylinder 94 is controlled to work. Under the support of the hydraulic cylinder 94 and the telescopic rod 92, the fixed frame 95 moves back and forth. The fixed frame 95 can enter or leave the packaging equipment 1 through the discharge port 7.

[0058] Multiple hydraulic telescopic rods 910 are fixedly connected to the top of the fixed frame 3 95. The piston end of the hydraulic telescopic rod 910 is fixedly connected to the fixed frame 5 98. A hydraulic sensor 911 is fixedly installed on the outside of the hydraulic telescopic rod 910 to detect the internal hydraulic pressure. Telescopic rods 3 99 are provided on both sides of the hydraulic telescopic rod 910. The outer shell of the telescopic rod 3 99 is fixedly connected to the fixed frame 3 95. The piston end of the telescopic rod 3 99 is fixedly connected to the adjacent fixed frame 5 98. The two telescopic rods 3 99 support and limit the fixed frame 5 98, allowing the fixed frame 5 98 to move up and down. The fixed frame 5 98 can move up and down on the top of the fixed frame 3 95.

[0059] A fixed frame 913 is fixedly connected between two fixed frames 912 fixedly connected to the top of the fixed frame 5 98. The fixed frame 913 matches the material loading trough 2 67. The fixed frame 913 applies the force of the fixed frame 3 95 moving back and forth to the support frame 2 64. A negative pressure suction cup 914 is fixedly inserted on the fixed frame 913. The negative pressure suction cup 914 is used to adsorb and fix the bottom of the workpiece.

[0060] Therefore, the hydraulic cylinder 94 and hydraulic cylinder 96 in the feeding structure 9 are controlled to work, and the negative pressure suction cup 914 is controlled to move up and down and back and forth.

[0061] A feeding port 18 is provided on the top of the packaging equipment 1. The top of the electromagnet 2 921 extends into the feeding port 18. The outer wall of the electromagnet 2 921 is fixedly connected to the packaging equipment 1. The position of the electromagnet 2 921 is fixed. The manifold box 916 is fixedly installed on the top of the inner cavity of the packaging equipment 1. The manifold box 916 and multiple negative pressure suction cups 914 are all fixedly connected by hoses 915. The hoses 915 can deform to a certain extent and have sufficient margin. The hoses 915 do not affect the movement of the negative pressure suction cups 914 within a preset range. The vacuum pump 2 918 is fixedly connected to the packaging equipment 1 by a fixing bracket 8 919. The air inlet of the vacuum pump 2 918 is fixedly connected to the manifold box 916. The air outlet of the vacuum pump 2 918 is fixedly installed with a solenoid valve 2 920. The air pressure sensor 917 is fixedly installed on the outside of the manifold box 916 to detect the air pressure value inside the manifold box 916.

[0062] Therefore, when the air pump 918 in the feeding structure 9 is activated, the air pressure inside the manifold 916 decreases. The manifold 916 is connected to the inside of the negative pressure suction cup 914 through the hose 915, and a negative pressure is formed inside the negative pressure suction cup 914. After the air pressure value detected by the air pressure sensor 917 reaches the preset value, the human-machine interface device 3, which receives feedback from the air pressure sensor 917, controls the solenoid valve 920 to close and stops the air pump 918 from working, so that the negative pressure inside the negative pressure suction cup 914 remains negative.

[0063] After the control solenoid valve 920 is opened, the internal pressure of the negative pressure suction cup 914 is released.

[0064] Specifically, such as Figure 3 , Figure 4 and Figure 5In the cooling platform 8, the horizontal plate 81 is fixedly installed on the rear side of the packaging equipment 1. The top of the horizontal plate 81 is provided with multiple material loading slots 82, which are divided into front and rear rows. Limiting plates 87 are provided on both sides of the bottom of the material loading slots 82. Pneumatic cylinders 83 are provided on both sides of the bottom of the horizontal plate 81. Two mounting brackets 84 are provided on one side of the pneumatic cylinder 83. The outer wall of the pneumatic cylinder 83 and the mounting brackets 84 are fixedly connected to the horizontal plate 81. Telescopic rods 85 are fixedly inserted through the mounting brackets 84. Mounting brackets 86 are fixedly connected between the piston end of the pneumatic cylinder 83 on the same side and the piston ends of the two telescopic rods 85. The pneumatic cylinder 83 is controlled to work, and the mounting brackets 86 move back and forth.

[0065] The limiting plate 87 is fixedly connected to the mounting bracket 86 on the same side. The limiting plate 87 moves back and forth. The cooling platform 8 is located at the top rear of the discharge port 7. The negative pressure suction cup 914 can move to the bottom of the horizontal plate 81.

[0066] After the multiple negative pressure suction cups 914 holding the workpiece move to the bottom of the multiple front loading slots 82, the negative pressure suction cups 914 correspond one-to-one with the front loading slots 82. Then, the unloading structure 9 is controlled to work, causing the negative pressure suction cups 914 to move upward. After the negative pressure suction cups 914 transport the workpiece into the loading slots 82, the fixing frame 7 913 is a certain distance away from the bottom of the horizontal plate 81. The front pneumatic cylinder 83 is controlled to work, and the front limiting plate 87 moves to the bottom of the front loading slots 82. The bottom of the front loading slots 82 is supported by the two limiting plates 87. Then, the unloading structure 9 is controlled to work, causing the pressure inside the negative pressure suction cups 914 to be released. After the unloading structure 9 works, the negative pressure suction cups 914 move downward, and the workpiece is supported by the limiting plate 87 and remains inside the loading slots 82, completing the function of transporting the workpiece into the multiple front loading slots 82. The same principle applies to transporting the workpiece into the multiple rear loading slots 82.

[0067] Therefore, the feeding structure 9 works in conjunction with the cooling platform 8 to complete the feeding operation.

[0068] In summary, a semiconductor packaging device consists of a packaging unit 1, a sealing assembly, a driving structure 5, four material carrier structures 6, a material unloading structure 9, and a cooling platform 8. The semiconductor packaging method provided by the semiconductor packaging device is as follows:

[0069] Example 1:

[0070] Step 1: After inserting the storage box 4 into the sealing cover 2, the sealing cover 2 is in a good sealing state. Then, the sealing component is controlled by the human-machine interaction device 3 to complete the processing environment control. Due to the cooperation of the mounting bracket 2 53, the four support brackets 1 61 and the four support brackets 2 64, the discharge port 18 is blocked. Even when the unloading structure 9 unloads the packaged workpiece conveyed by the loading structure 6, the discharge port 18 is still blocked and cannot be vented. For details, please see Step 3.

[0071] Therefore, the encapsulation of the workpiece is carried out in a high-concentration inert gas environment, which ensures that the encapsulation is carried out in a low-oxygen and dry environment. This avoids the oxidation and interconnection of thin metal structures in the workpiece due to high temperature during the encapsulation process, avoids bubbles caused by moisture, and improves the yield rate.

[0072] Step Two: The drive structure 5 controls the positions of the four material-carrying structures 6. The material-carrying structures 6 sequentially cycle through the robotic arm loading process, the workpiece surface cleaning process, and the heating and sealing process (this is the functional application of the sealing equipment 1 itself; for details, please refer to the patent document with application publication number CN121693239A). During this process, the sealing component works to circulate the inert gas inside the sealing cover 2. Multiple air guide bends 15 are positioned on one side of the workpiece surface cleaning structure to draw air from inside the sealing cover 2. The multiple air guide bends 15 extract the dust and debris generated during the workpiece surface cleaning, and the dust collector 12 traps the dust and debris. While controlling the movement of the inert gas, the sealing component controls the environment of the workpiece sealing process, and at the same time, it also achieves the effects of heat dissipation and dust and debris collection inside the sealing cover 2, ensuring the economic value of the sealing component application.

[0073] Step 3: After the workpiece bearing the packaged material in the material carrier structure 6 stops at the top of the unloading port 18, the unloading operation is carried out. The unloading structure 9 operates so that multiple negative pressure suction cups 914 are inserted into the interior of multiple material carrier slots 67 respectively. The outer wall of the fixing frame 913 is in contact with the inner wall of the material carrier slot 67. At this time, the fixing frame 913 and the negative pressure suction cups 914 seal the interior of the material carrier slot 67. The fixing frame 913 contacts the support frame 64. Then the unloading structure 9 operates to control the state of the material carrier structure 6, so that the material carrier structure 6 is in the unloading state. The material carrier slot 67 and the material carrier slot 62 are kept aligned, and the unloading preparation work is completed. Under the action of the fixing frame 913 and the negative pressure suction cups 914, the material carrier slot 67 still cannot be connected to the interior of the packaging equipment 1, and the unloading port 18 is still blocked and cannot be depressurized.

[0074] Step 4: The unloading structure 9 operates to put multiple negative pressure suction cups 914 into a negative pressure state. After the negative pressure suction cups 914 adsorb and fix the bottom of the sealed workpiece, the unloading structure 9 operates to move the multiple negative pressure suction cups 914 downward. The sealed workpiece moves downward into the material loading groove 2 67. Due to the size of the material loading groove 2 67 and the installation position of the fixing frame 7 913, the fixing frame 7 913 is still inside the material loading groove 2 67 supporting the support frame 2 64. Therefore, the reset force applied by the spring telescopic rod 63 to the support frame 2 64 will not act on the workpiece.

[0075] Step 5: The operation of the unloading structure 9 causes multiple fixed frames 7 913 to push the support frame 2 64 to move horizontally backward, and the material loading trough 2 67 is offset from the material loading trough 1 62. At this time, the unloading port 18 is sealed by the material loading structure 6 and the drive structure 5 to ensure the sealing state inside the sealing cover 2.

[0076] Step Six: The unloading structure 9 operates to move multiple negative pressure suction cups 914 downwards, and the encapsulated workpiece is completely separated from the loading structure 6.

[0077] Step 7: The unloading structure 9 and the cooling platform 8 work together to complete the unloading operation. The cooling platform 8 can support two batches of packaged workpieces at the same time, providing sufficient operation time for workers or robots to collect the packaged workpieces.

[0078] Step 8: The unloading structure 9 returns to its initial state, and after the next loading structure 6 supports multiple packages, the workpiece stops at the top of the unloading port 18.

[0079] In summary, during the use of semiconductor packaging equipment, the unloading structure 9, the carrier structure 6, and the cooling platform 8 work together. The unloading structure 9 picks up the packaged workpiece from the carrier structure 6 and transports it to the cooling platform 8. During this process, only the bottom surface of the packaged workpiece does not bear the force of the processing position, avoiding the reduction of packaging effect caused by the heat of the packaged workpiece and the force on the packaging position. It also changes the common semiconductor back-end packaging process, which uses chutes and tubes to transfer the heat-processed workpiece. It changes the unloading method of free fall + guide plate buffer, avoiding the jumping, flipping, and edge damage of the packaged workpiece. It avoids quality problems such as micro-cracks, chipped corners, and internal lead deformation that may be caused by falling impact. It fundamentally avoids physical contact and collision, ensuring the long-term reliability of semiconductor packaging.

[0080] Example 2:

[0081] In step four of the above embodiment one: during the process of the packaged workpiece leaving the material tank 62, if the packaged workpiece experiences glue leakage or deformation during the heating and packaging process, the friction between the packaged workpiece and the support frame 61 will increase significantly. The negative pressure suction cup 914 will require a significantly increased pulling force to move the packaged workpiece downwards. Furthermore, the force on the negative pressure suction cup 914 will act on the corresponding fixed frame 98 through the fixed frame 913 and the two fixed frames 912. The fixed frame 98 is connected to the fixed frame 95 via the hydraulic telescopic rod 910. At this time, the friction between the packaged workpiece and the support frame 61 acts on the negative pressure suction cup 914, increasing the force required for the negative pressure suction cup 914 to move downwards, and thus increasing the force on the hydraulic telescopic rod 910. As the hydraulic telescopic rod 910 extends, the internal hydraulic pressure increases, and the hydraulic pressure value detected by the hydraulic sensor 911 increases significantly. The human-machine interface device 3, which receives feedback from the hydraulic sensor 911, marks the packaged workpiece corresponding to the hydraulic sensor 911 as a questionable workpiece. Since the unloading structure 9 transports the packaged workpiece to a preset position on the cooling platform 8, the human-machine interface device 3 reminds the staff or robot that the questionable workpiece will be sent into the corresponding loading trough 82 on the cooling platform 8. The staff or robot promptly removes the questionable workpiece for separate processing, achieving the effect of simultaneous processing and defective product sorting. This avoids deformed defective workpieces scratching good semiconductor workpieces during subsequent transportation, processing, and packaging processes, reducing economic losses caused by defective products.

[0082] After step seven of the above embodiment one is completed, the following step eight is performed: the unloading structure 9 controls the state of the loading structure 6, so that the loading structure 6 is in the unloading state, and the loading groove two 67 and the loading groove one 62 are kept aligned. Then the unloading structure 9 works to make the fixing frame seven 913 move inside the loading groove one 62. The fixing frame seven 913 cleans the inner wall of the loading groove one 62 to ensure the smoothness of the inner wall of the loading groove one 62. The unloading structure 9 cleans and maintains the loading structure 6, reducing the impact of defective products on the use of the loading structure 6.

[0083] Step 9: The unloading structure 9 operates to move multiple negative pressure suction cups 914 downwards, and controls the negative pressure suction cups 914 and the fixing frame 7 913 to leave the inside of the packaging equipment 1, so that the fixing frame 7 913 swings back and forth on the outside of the packaging equipment 1, shaking the debris on the fixing frame 7 913 to the outside of the packaging equipment 1.

[0084] Step 10: The unloading structure 9 returns to its initial state, and after the next loading structure 6 delivers multiple packaged workpieces, they stop at the top of the unloading port 18.

[0085] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high heat dissipation semiconductor packaging device, comprising packaging equipment (1), characterized in that: The top of the packaging device (1) is equipped with a sealing component. The packaging device (1) is equipped with a drive structure (5). The drive structure (5) includes a second mounting bracket (53) and two third mounting brackets (55). Four material-carrying structures (6) are fixedly inserted on the second mounting bracket (53). A material-discharging structure (9) is installed between the two third mounting brackets (55). A cooling platform (8) is fixedly installed on the rear side of the material-discharging structure (9).

2. The high heat dissipation semiconductor packaging device according to claim 1, characterized in that: The sealing assembly includes a sealing cover (2), an air pump (10), a dust collector (12), and two distribution boxes (14). The sealing cover (2) is fixedly installed on the top of the sealing equipment (1). A human-machine interaction device (3) is fixedly installed on the outside of the sealing cover (2). A storage box (4) is provided on one side of the sealing cover (2). The air pump (10), the dust collector (12), and the two distribution boxes (14) are all fixedly installed on the top of the sealing cover (2).

3. The high heat dissipation semiconductor packaging device according to claim 2, characterized in that: A first air guide bend (13) is fixedly installed between the air inlet of the dust collector (12) and the left-side distribution box (14). Multiple second air guide bends (15) are fixedly connected between the left-side distribution box (14) and the packaging device (1). One end of the second air guide bend (15) is connected to the bottom right side of the inner cavity of the sealing cover (2). A connecting pipe (17) is fixedly connected between the air outlet of the dust collector (12) and the air inlet of the first air pump (10). A solenoid valve (11) is fixedly connected to the outside of the connecting pipe (17). The air outlet of the first air pump (10) is fixedly connected to the right-side distribution box (14). Multiple third air guide bends (16) are fixedly connected between the right-side distribution box (14) and the top of the sealing cover (2).

4. The high heat dissipation semiconductor packaging device according to claim 1, characterized in that: The mounting bracket 2 (53) has a mounting bracket 1 (52) fixedly installed inside. The mounting bracket 1 (52) has a drive shaft (51) fixedly installed inside. The drive shaft (51) rotates through the packaging equipment (1). An electromagnet 1 (56) is sleeved on the outside of the drive shaft (51). The electromagnet 1 (56) is fixedly embedded in the top of the inner cavity of the packaging equipment (1). The two mounting brackets 3 (55) are fixedly installed at the bottom of the inner cavity of the packaging equipment (1). A drive motor (54) is fixedly connected between the two mounting brackets 3 (55). The output end of the drive motor (54) is fixedly connected to the bottom end of the drive shaft (51).

5. The high heat dissipation semiconductor packaging device according to claim 1, characterized in that: The material-carrying structure (6) includes a support frame (61) fixedly inserted on the mounting frame (53). The top of the support frame (61) has multiple material-carrying slots (62). Multiple spring telescopic rods (63) are fixedly inserted on the outside of the support frame (61). The piston ends of the multiple spring telescopic rods (63) are fixedly connected to the support frame (64). The top of the support frame (64) has multiple material-carrying slots (67).

6. The high heat dissipation semiconductor packaging device according to claim 5, characterized in that: The second support frame (64) is slidably installed inside the first support frame (61). The bottom of the second support frame (64) has a groove (65), and a metal plate (66) is provided inside the groove (65). The outer wall of the metal plate (66) is fixedly connected to the second support frame (64).

7. The high heat dissipation semiconductor packaging device according to claim 1, characterized in that: The feeding structure (9) includes a first fixed frame (91), a second fixed frame (93), a third fixed frame (95), a second hydraulic cylinder (96), a manifold (916), a second vacuum pump (918), and two second electromagnets (921). The first fixed frame (91) and the second fixed frame (93) are respectively sleeved on the outside of the two third mounting frames (55). Two fourth fixed frames (97) are fixedly connected between the first fixed frame (91) and the second fixed frame (93). A second telescopic rod (92) is fixedly inserted on the first fixed frame (91). A first hydraulic cylinder (94) is fixedly connected to one side of the second fixed frame (93). The piston end of the second telescopic rod (92) and the piston end of the first hydraulic cylinder (94) are both fixedly connected to the third fixed frame (95). The second hydraulic cylinder (96) is fixedly installed at the bottom of the inner cavity of the packaging equipment (1). The piston end of the second hydraulic cylinder (96) is fixedly connected to the first fixed frame (91).

8. A high heat dissipation semiconductor packaging device according to claim 7, characterized in that: Multiple hydraulic telescopic rods (910) are fixedly connected to the top of the fixed frame three (95). A fixed frame five (98) is fixedly connected to the piston end of each hydraulic telescopic rod (910). A hydraulic sensor (911) is fixedly installed on the outside of each hydraulic telescopic rod (910). Telescopic rod three (99) are provided on both sides of each hydraulic telescopic rod (910). The outer shell of each telescopic rod three (99) is fixedly connected to the fixed frame three (95). The piston end of each telescopic rod three (99) is fixedly connected to the adjacent fixed frame five (98). Two fixed frames six (912) are fixedly connected to the top of each fixed frame five (98). A fixed frame seven (913) is fixedly connected between the two fixed frames six (912). A negative pressure suction cup (914) is fixedly inserted through the fixed frame seven (913). The packaging equipment (1) has a feeding port (18) on the top. The top of the electromagnet (921) extends into the feeding port (18). The outer wall of the electromagnet (921) is fixedly connected to the packaging equipment (1). The manifold (916) is fixedly installed on the top of the inner cavity of the packaging equipment (1). The manifold (916) and multiple negative pressure suction cups (914) are all fixedly connected by hoses (915). The vacuum pump (918) is fixedly connected to the packaging equipment (1) by a fixing bracket (919). The air inlet of the vacuum pump (918) is fixedly connected to the manifold (916). The air outlet of the vacuum pump (918) is fixedly installed with a solenoid valve (920). A pressure sensor (917) is fixedly installed on the outside of the manifold (916).

9. A high heat dissipation semiconductor packaging device according to claim 1, characterized in that: The cooling platform (8) includes a horizontal plate (81), which is fixedly installed on the rear side of the packaging equipment (1). The top of the horizontal plate (81) is provided with multiple material loading slots (82). Limiting plates (87) are provided on both sides of the bottom of the material loading slots (82). Pneumatic cylinders (83) are provided on both sides of the bottom of the horizontal plate (81). Two mounting brackets (84) are provided on one side of the pneumatic cylinder (83). The outer wall of the pneumatic cylinder (83) and the mounting brackets (84) are fixedly connected to the horizontal plate (81). A telescopic rod (85) is fixedly passed through the mounting bracket (84). A mounting bracket (86) is fixedly connected between the piston end of the pneumatic cylinder (83) on the same side and the piston end of the two telescopic rods (85). The limiting plate (87) is fixedly connected to the mounting bracket (86) on the same side. A discharge port (7) is provided on the rear side of the packaging equipment (1). The cooling platform (8) is located on the top of the rear side of the discharge port (7).

10. A semiconductor packaging method, applicable to a high heat dissipation semiconductor packaging device as described in any one of claims 1-9, characterized in that: Step 1: After inserting the storage box (4) into the sealing cover (2), control the sealing assembly through the human-machine interaction device (3) to complete the processing environment control work; Step 2: The drive structure (5) controls the position of the four material carrier structures (6), and the material carrier structures (6) sequentially cycle through the robotic arm loading process, the workpiece surface cleaning process, and the heating and packaging process; Step 3: After the workpiece is packaged and held by the material carrier structure (6) and stops at the top of the unloading port (18), the unloading work is carried out to complete the unloading preparation work; Step 4: The unloading structure (9) operates to put multiple negative pressure suction cups (914) into a negative pressure state, and after encapsulation, the workpiece moves down into the material loading tank (67); Step 5: The operation of the feeding structure (9) causes multiple fixed frames 7 (913) to push the support frame 2 (64) to move horizontally backward, and the material loading trough 2 (67) is offset from the material loading trough 1 (62). At this time, the feeding port (18) is sealed by the material loading structure (6) and the driving structure (5) to ensure the sealing state inside the sealing cover (2). Step 6: The unloading structure (9) works to move multiple negative pressure suction cups (914) downwards, and the encapsulated workpiece is completely separated from the loading structure (6). Step 7: The unloading structure (9) and the cooling platform (8) work together to complete the unloading operation; Step 8: The unloading structure (9) returns to its initial state, and the next loading structure (6) supports multiple encapsulated workpieces and stops at the top of the unloading port (18).

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